Laser processing apparatus and laser annealing apparatus
By combining the aperture mechanism with manual and automatic adjustment mechanisms, the problem of insufficient flexibility in beam shape adjustment in existing wafer laser annealing equipment is solved, achieving matching of beam shape with the wafer annealing area, and improving the applicability of the equipment and the stability of the annealing process.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- 成都莱普科技股份有限公司
- Filing Date
- 2026-05-25
- Publication Date
- 2026-06-23
AI Technical Summary
In existing wafer laser annealing equipment, the flexibility of adjusting the fixed beam shape is limited, making it difficult to adapt to different wafer designs. Furthermore, changing the mask or recalibrating the optical system requires downtime, affecting the consistency and stability of the annealing process.
By employing an aperture mechanism combined with manual and automatic adjustment mechanisms, the shape and size of the beam are adjusted through the shaping port to achieve matching for different strip annealing areas, reducing uneven energy distribution. Furthermore, the high-precision automatic adjustment mechanism maintains stability during process switching.
This improved the matching degree between the beam shape and the wafer annealing area, reduced equipment downtime and repeated alignment errors, and ensured the continuity and stability of the laser annealing process.
Smart Images
Figure CN122270059A_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of wafer processing technology, specifically to laser processing equipment and laser annealing equipment. Background Technology
[0002] In semiconductor manufacturing, laser annealing is a commonly used process for localized heating of wafers, widely applied in processes such as ion implantation activation, stress conditioning, and thin film performance improvement. Compared to traditional overall heating methods, laser annealing offers advantages such as controllable heating area, smaller heat-affected zone, and shorter processing time, meeting the precision requirements of advanced processes for localized heat treatment.
[0003] In practical applications, wafer surfaces are often not limited to processing areas of regular, uniform size. Especially in logic chips, power devices, or heterogeneous integration processes, the areas to be annealed on the wafer typically present as stripes or localized regions of varying lengths, widths, and orientations. To ensure consistent annealing results, the laser beam must match the shape and size of these striped regions during scanning to avoid problems such as localized overheating, insufficient heating, or uneven energy distribution.
[0004] In existing wafer laser annealing equipment, the laser beam shape is typically shaped using fixed optical elements, such as fixed-size apertures, masks, or projection optical systems. While the basic beam shape can be determined during the equipment design phase, in actual production, when the size or proportion of the strip-shaped region on the customer's wafer changes, it is often necessary to replace the mask or readjust the optical system to adapt to the new process requirements.
[0005] The above methods have certain limitations in engineering applications:
[0006] On the one hand, the flexibility of adjusting the fixed beam shape is limited, making it difficult to quickly adapt to different wafer designs on the same equipment; on the other hand, changing the mask or recalibrating the optical system usually requires downtime, which not only increases process changeover time but also easily introduces repeated alignment errors, thereby affecting the consistency and stability of the annealing process. Summary of the Invention
[0007] This application provides a laser processing apparatus and a laser annealing device to improve the problem in the prior art that fixed optical elements cannot adapt the shape and size of the laser beam to different strip annealing areas.
[0008] This application provides a laser processing apparatus, including:
[0009] An aperture mechanism is formed with a shaping aperture for passing a light beam and defining the shape of the light beam;
[0010] A manual adjustment mechanism, connected to the aperture mechanism, is used to adjust the position and size of the shaping opening;
[0011] An automatic adjustment mechanism, connected to the aperture mechanism, is used to adjust the position and size of the shaping opening, and the adjustment accuracy of the automatic adjustment mechanism is higher than that of the manual adjustment mechanism.
[0012] In some embodiments of this application, the aperture mechanism includes four aperture components, wherein two of the aperture components are arranged opposite to each other along a first direction to form a first aperture group, and the other two aperture components are arranged opposite to each other along a second direction to form a second aperture group. The first direction is perpendicular to the second direction, and the plane defined by the first direction and the second direction is perpendicular to the incident direction of the light beam incident on the shaping port.
[0013] Both the manual adjustment mechanism and the automatic adjustment mechanism are connected to the four aperture assemblies to adjust the size of the shaping opening defined by the four aperture assemblies. The four aperture assemblies are used to adjust the shape of the shaping opening.
[0014] In some embodiments of this application, the aperture assembly includes:
[0015] An aperture fixing seat is connected to the automatic adjustment mechanism and has an aperture mounting slot.
[0016] An aperture driver is disposed on the aperture mounting base, and the driving end of the aperture driver extends into the aperture mounting slot;
[0017] A rotating shaft is disposed in the aperture fixing seat and extends into the aperture mounting groove, and the axial direction of the rotating shaft is perpendicular to the driving direction of the aperture driver.
[0018] An aperture is disposed in the aperture mounting slot and rotatably connected to the rotating shaft, so that the aperture can rotate on its own axis with the rotating shaft as the rotation axis.
[0019] Wherein, along a direction perpendicular to the axial direction and the driving direction, the driving end of the aperture driver is spaced apart on one side of the rotating shaft and close to the edge of the aperture.
[0020] In some embodiments of this application, the aperture assembly further includes a return spring, which is disposed within the aperture mounting base and extends along the driving direction of the aperture driver, so that the return spring is connected to the aperture;
[0021] The reset spring and the drive end of the aperture driver are parallel and located on the same side of the aperture. The reset spring and the aperture driver are arranged opposite each other in a direction perpendicular to the axial direction and the drive direction, so that the rotating shaft is located between the reset spring and the aperture driver.
[0022] In some embodiments of this application, the end surface of the drive end of the aperture driver is spherical or planar.
[0023] In some embodiments of this application, the aperture is made of glass and the surface of the aperture is covered with a reflective film.
[0024] In some embodiments of this application, the automatic adjustment mechanism includes four first automatic adjustment components and four second automatic adjustment components;
[0025] Wherein, two of the first automatic adjustment components are respectively connected to two of the aperture components in the first aperture group to drive the two aperture components in the first aperture group to move towards or away from each other along the first direction; and the other two of the first automatic adjustment components are respectively connected to two of the aperture components in the second aperture group to drive the two aperture components in the second aperture group to move towards or away from each other along the second direction.
[0026] Two second automatic adjustment components are respectively connected to two aperture components in the first aperture group to drive the two aperture components in the first aperture group to move along the axial direction of the light beam. The other two second automatic adjustment components are respectively connected to two aperture components in the second aperture group to drive the two aperture components in the second aperture group to move along the axial direction of the light beam.
[0027] In some embodiments of this application, the manual adjustment mechanism includes two manual adjustment components. One of the manual adjustment components is connected to the first aperture group and is used to adjust the position of the first aperture group in the first direction, the second direction, and the axial direction of the light beam. The other manual adjustment component is connected to the second aperture group and is used to adjust the position of the second aperture group in the first direction, the second direction, and the axial direction of the light beam.
[0028] In some embodiments of this application, the laser processing apparatus further includes a locking mechanism, which is connected to the adjusting end of the automatic adjusting mechanism and is used to lock and fix the adjusting end of the automatic adjusting mechanism.
[0029] Secondly, embodiments of this application provide a laser annealing apparatus, including the laser processing apparatus as described in the first aspect.
[0030] Therefore, this embodiment of the application, by setting an aperture mechanism with a shaping aperture and cooperating with manual and automatic adjustment mechanisms to adjust the position and size of the shaping aperture, allows the beam shape to be changed according to actual processing requirements. This ensures that during wafer laser annealing, the beam shape and size can match the strip-shaped annealing areas of different lengths, widths, or orientations on the wafer, reducing uneven energy distribution caused by a fixed beam shape. Furthermore, by simultaneously setting a manual adjustment mechanism and a more precise automatic adjustment mechanism, the manual adjustment mechanism can be used to adjust the position and size of the shaping aperture over a wide range during equipment debugging, process switching, or initial alignment. During actual annealing, the automatic adjustment mechanism can be used for fine adjustment of the shaping aperture, improving the applicability of the equipment under different process conditions while ensuring adjustment accuracy. Moreover, by allowing adjustable control of the position and size of the shaping aperture, beam shape adjustment can be completed without replacing the aperture or reconfiguring the optical shaping components when the wafer design or annealing area size changes. This helps reduce equipment downtime and the resulting repeated alignment errors, ensuring the continuity and stability of the laser annealing process. Attached Figure Description
[0031] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0032] Figure 1 This is a schematic diagram of the structure of a laser processing apparatus provided in an embodiment of this application;
[0033] Figure 2 for Figure 1 A schematic diagram of the structure in which the aperture mechanism and the automatic adjustment mechanism work together;
[0034] Figure 3 for Figure 2 A schematic diagram of the aperture assembly in the diagram;
[0035] Figure 4 for Figure 3 An explosion diagram;
[0036] Figure 5 for Figure 1 A schematic diagram of the automatic adjustment mechanism in the diagram;
[0037] Figure 6 for Figure 1 A schematic diagram of the manual adjustment mechanism.
[0038] Explanation of reference numerals in the attached figures:
[0039] 1. Aperture mechanism; 11. Shaping port; 12. Aperture assembly; 121. Aperture fixing seat; 122. Aperture driver; 123. Rotating shaft; 124. Aperture; 125. Return spring; 2. Manual adjustment mechanism; 21. Manual adjustment component; 3. Automatic adjustment mechanism; 31. First automatic adjustment component; 32. Second automatic adjustment component; 4. Locking mechanism; X, first direction; Y, second direction. Detailed Implementation
[0040] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.
[0041] In the description of this application, it should be understood that the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or specifying the number of technical features indicated. Therefore, features defined with "first" and "second" may explicitly or implicitly include one or more features. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.
[0042] Please see Figures 1 to 6 The embodiments of this application provide a laser processing apparatus, including: an aperture mechanism 1, a manual adjustment mechanism 2, and an automatic adjustment mechanism 3.
[0043] The aperture mechanism 1 has a shaping port 11, which is used to allow the light beam to pass through and define the shape of the light beam. The manual adjustment mechanism 2 is connected to the aperture mechanism 1 and is used to adjust the position and size of the shaping port 11. The automatic adjustment mechanism 3 is connected to the aperture mechanism 1 and is used to adjust the position and size of the shaping port 11. The adjustment accuracy of the automatic adjustment mechanism 3 is higher than that of the manual adjustment mechanism 2.
[0044] The technical solution provided in this application, by setting an aperture mechanism 1 with a shaping aperture 11, and cooperating with a manual adjustment mechanism 2 and an automatic adjustment mechanism 3 to adjust the position and size of the shaping aperture 11, allows the beam shape to be changed according to actual processing requirements. Thus, during wafer laser annealing, the beam shape and size can be matched with strip-shaped annealing areas of different lengths, widths, or orientations on the wafer, reducing the problem of uneven energy distribution caused by a fixed beam shape. Furthermore, by simultaneously setting a manual adjustment mechanism 2 and a more precise automatic adjustment mechanism 3, during equipment debugging, process switching, or initial alignment stages, the beam shape and size can be adjusted using a manual adjustment mechanism 2. The dynamic adjustment mechanism 2 completes a wide range of position and size adjustments to the shaping aperture 11. In the actual annealing process, the automatic adjustment mechanism 3 can finely adjust the shaping aperture 11, which helps to improve the applicability of the equipment under different process conditions while ensuring adjustment accuracy. Furthermore, by adjusting the position and size of the shaping aperture 11, the beam shape can be adjusted without replacing the aperture 124 or reconfiguring the optical shaping components when the wafer design or annealing area size changes. This helps to reduce equipment downtime and the resulting repeated alignment errors, ensuring the continuity and stability of the laser annealing process.
[0045] In some embodiments, please also refer to Figures 1 to 4 The aperture mechanism 1 includes four aperture assemblies 12, wherein two aperture assemblies 12 are arranged opposite each other along a first direction X to form a first aperture group, and the other two aperture assemblies 12 are arranged opposite each other along a second direction Y to form a second aperture group. The first direction X and the second direction Y are perpendicular, and the plane defined by the first direction X and the second direction Y is perpendicular to the incident direction of the light beam into the shaping aperture 11. The manual adjustment mechanism 2 and the automatic adjustment mechanism 3 are both connected to the four aperture assemblies 12 to adjust the size of the shaping aperture 11 defined by the four aperture assemblies 12. The four aperture assemblies 12 are used to adjust the shape of the shaping aperture 11.
[0046] In detail, the first and second aperture groups define the boundaries of the light beam in two mutually perpendicular directions, and the four aperture components 12 together form a shaping aperture 11 for the light beam to pass through. By changing the distance between the relatively arranged aperture components 12, the size of the shaping aperture 11 can be adjusted in the plane, thereby forming beam cross-sectional shapes with different side lengths or different length-to-width ratios. In this embodiment, both the manual adjustment mechanism 2 and the automatic adjustment mechanism 3 are connected to the four aperture components 12. The manual adjustment mechanism 2 allows for manual adjustment of the positions of the four aperture components 12 to achieve initial positioning and size setting of the shaping aperture 11; based on this, the automatic adjustment mechanism 3 further adjusts the positions of the four aperture components 12 to achieve higher precision control of the size and position of the shaping aperture 11. Since the four aperture components 12 respectively participate in defining the four boundaries of the shaping aperture 11, the aperture components 12 can move in pairs towards or away from each other during adjustment to change the size of the shaping aperture 11 in the first direction X or the second direction Y. Alternatively, they can be adjusted in combination to achieve positional adjustment of the shaping aperture 11 within the plane, thereby maintaining the shaping aperture 11 at a preset position relative to the beam incident direction. Compared to aperture structures that can only be adjusted in one direction or have a fixed shape, this embodiment's technical solution is advantageous in the wafer laser annealing process, allowing for targeted matching of the beam shape based on the dimensional differences in width and length directions of different strip-shaped annealing regions, reducing problems such as insufficient beam coverage or excessive energy irradiation.
[0047] Further, please see Figure 3 and Figure 4 The aperture assembly 12 includes an aperture mounting base 121, an aperture driver 122, a rotating shaft 123, and an aperture 124. The aperture mounting base 121 is connected to the automatic adjustment mechanism 3 and has an aperture mounting slot. The aperture driver 122 is mounted on the aperture mounting base 121, and its driving end extends into the aperture mounting slot. The rotating shaft 123 is mounted on the aperture mounting base 121 and extends into the aperture mounting slot, with its axial direction perpendicular to the driving direction of the aperture driver 122. The aperture 124 is mounted in the aperture mounting slot and rotatably connected to the rotating shaft 123, allowing the aperture 124 to rotate on its own axis with the rotating shaft 123 as its rotation axis. The driving end of the aperture driver 122 is spaced apart on one side of the rotating shaft 123 and close to the edge of the aperture 124 along a direction perpendicular to both the axial and driving directions.
[0048] In detail, the aperture mounting base 121 is connected to the automatic adjustment mechanism 3 and has an aperture mounting slot thereon, which is used to accommodate the aperture 124 and define its installation position. An aperture driver 122 is disposed on the aperture mounting base 121, and its driving end extends into the aperture mounting slot in a predetermined direction to apply a driving force to the aperture 124. A rotating shaft 123 is disposed on the aperture mounting base 121 and extends into the aperture mounting slot; the axial direction of the rotating shaft 123 is perpendicular to the driving direction of the aperture driver 122. The aperture 124 is rotatably connected to the aperture mounting base 121 with the rotating shaft 123 as the fulcrum, thereby allowing the aperture 124 to rotate around the rotating shaft 123. Viewed along a direction perpendicular to the axial direction of the rotating shaft 123 and the driving direction of the aperture driver 122, the driving end of the aperture driver 122 is spaced apart on one side of the rotating shaft 123 and close to the edge of the aperture 124. When the driving end of the aperture driver 122 applies a thrust to the aperture 124, the aperture 124 rotates under the support of the rotating shaft 123, thereby changing the blocking position of the aperture 124 relative to the light beam. In this embodiment, by providing a rotating shaft 123 rotatably connected to the aperture 124 within the aperture fixing seat 121, and by utilizing the driving end of the aperture driver 122 to apply force to the aperture 124 at a position offset from the rotating shaft 123, the aperture 124 can achieve rotational adjustment around the rotating shaft 123. Structurally, this converts the linear displacement of the driver into the rotational displacement of the aperture 124. Simultaneously, because the driving end is positioned close to the edge of the aperture 124, the blocking position of the aperture 124 can be changed with a small driving displacement, which is beneficial for improving the sensitivity and controllability of the boundary adjustment of the shaping aperture 11. In addition, by setting the axial direction of the rotating shaft 123 to be perpendicular to the driving direction, unnecessary translational degrees of freedom of the aperture 124 can be avoided during the adjustment process, which helps to maintain the repeatability and stability of the aperture 124 position adjustment, making it suitable for wafer laser annealing scenarios with high requirements for beam boundary position.
[0049] It should be noted that the aperture driver 122 can be a piezoelectric inertial driver, which utilizes the servo motor in the piezoelectric inertial driver to achieve precise driving.
[0050] Further, please see Figure 4The aperture assembly 12 also includes a return spring 125, which is disposed within the aperture fixing seat 121 and extends along the driving direction of the aperture driver 122, so that the return spring 125 is connected to the aperture 124. The return spring 125 and the driving end of the aperture driver 122 are parallel and located on the same side of the aperture 124. The return spring 125 and the aperture driver 122 are arranged opposite each other in a direction perpendicular to the axial direction and the driving direction, so that the rotating shaft 123 is located between the return spring 125 and the aperture driver 122. When the driving end of the aperture driver 122 applies a thrust to the aperture 124, causing the aperture 124 to rotate around the rotating shaft 123, the return spring 125 simultaneously generates a corresponding elastic deformation and provides an elastic force to the aperture 124 opposite to the direction of the driving force. This ensures that the aperture 124 is always in a state of combined action of driving force and elastic restoring force during adjustment, which helps improve the stability of the aperture 124's rotation. Furthermore, since the reset spring 125 and the aperture driver 122 are spatially opposite each other and the rotating shaft 123 is used as the intermediate fulcrum, the aperture 124 can maintain stable force in different adjustment positions, which is structurally beneficial to suppress the position displacement of the aperture 124 caused by vibration, return gap or small displacement fluctuation of the driver.
[0051] In addition, the reset spring 125 can provide a restoring effect on the aperture 124 after the driver releases the driving force, so that the aperture 124 can be stably reset when the adjustment stops, which is beneficial to improving the repeatability and stability of the boundary position adjustment of the shaping port 11.
[0052] In some embodiments, the end surface of the drive end of the aperture driver 122 is spherical or planar, which helps to reduce the pressure applied by the drive end of the aperture driver 122 to the aperture surface and helps to protect the end of the drive end and the surface of the aperture 124.
[0053] In some embodiments, the aperture 124 is made of glass and its surface is covered with a reflective film, which can be a total internal reflection film. Using glass as the substrate material, the aperture 124 reflects rather than absorbs the laser beam incident on its edge region by forming a reflective film layer on its surface. Compared to metal apertures, the glass aperture 124 has better optical uniformity and thermal stability, making it suitable for use as a beam shaping element in laser optical paths. The reflective film on the surface of the aperture 124 reflects the laser energy blocked by the aperture 124, thereby reducing the deposition of laser energy within the aperture 124 body. This allows the aperture 124 to reflect blocked laser energy during laser beam shaping, reducing the thermal load on the aperture 124 body and minimizing thermal deformation or performance changes caused by energy absorption during long-term laser annealing processes. This helps maintain the stability of the shaping aperture 11 boundary position and ensures the consistency of the beam shape during continuous processing.
[0054] In some embodiments, see Figure 1 and Figure 5 The automatic adjustment mechanism 3 includes four first automatic adjustment components 31 and four second automatic adjustment components 32. Two of the first automatic adjustment components 31 are connected to two aperture components 12 in the first aperture group, respectively, to drive the two aperture components 12 in the first aperture group to move towards or away from each other along the first direction X. The other two first automatic adjustment components 31 are connected to two aperture components 12 in the second aperture group, respectively, to drive the two aperture components 12 in the second aperture group to move towards or away from each other along the second direction Y. By configuring the four first automatic adjustment components 31, the dimensions of the shaping opening 11 in the first direction X and the second direction Y can be adjusted.
[0055] Two second automatic adjustment components 32 are respectively connected to two aperture components 12 in the first aperture group to drive the two aperture components 12 in the first aperture group to move along the axial direction of the beam. Two other second automatic adjustment components 32 are respectively connected to two aperture components 12 in the second aperture group to drive the two aperture components 12 in the second aperture group to move along the axial direction of the beam. By adjusting the position of each aperture component 12 in the axial direction of the beam, the effective position of the aperture component 12 relative to the beam changes, thereby further adjusting the beam shaping effect.
[0056] Specifically, by dividing the automatic adjustment mechanism 3 into a first automatic adjustment component 31 for lateral dimension adjustment and a second automatic adjustment component 32 for axial position adjustment, the movement of the aperture assembly 12 in different adjustment directions is made independent, which helps to reduce mutual interference during multi-directional linkage adjustment. By driving the paired aperture assemblies 12 towards or away from each other using the first automatic adjustment component 31, the opening size of the shaping aperture 11 in the first direction X and the second direction Y can be finely adjusted, allowing the shape and size of the beam in the plane to adapt to strip annealing regions of different widths and lengths. Simultaneously, by adjusting the position of the aperture assembly 12 in the beam axial direction using the second automatic adjustment component 32, the relative positional relationship between the aperture and the beam can be changed. This helps to compensate for and optimize the beam shaping effect without changing the planar dimensions of the shaping aperture 11, thereby improving the stability of the beam shape during laser annealing.
[0057] It should be noted that the first automatic adjustment component 31 can employ an electrically controlled micro-translation stage. Such micro-translation stages typically use a servo motor or stepper motor as the drive source and are guided by crossed roller guides to achieve linear drive in a specific direction. The second automatic adjustment component 32 can employ a piezoelectric screw. A piezoelectric screw is a micro-displacement actuator that combines a piezoelectric actuation element with a screw-like mechanical structure. While maintaining the mechanical rigidity and self-locking characteristics of the screw structure, it achieves continuous and controllable displacement adjustment from the nanometer to the micrometer level. By utilizing piezoelectric screws, precise adjustment of the aperture component 12 in the beam axis direction can be achieved.
[0058] The second automatic adjustment component 32 has an adjustment displacement accuracy of 0.5µm, meaning the adjustment error will not exceed 0.5µm, and a repeatability accuracy of 0.1µm, meaning the repeatability error will not exceed 0.1µm.
[0059] In some embodiments, see Figure 1 and Figure 6 The manual adjustment mechanism 2 includes two manual adjustment components 21. One component is connected to the first aperture group and is used to adjust the position of the first aperture group in the first direction (X), the second direction (Y), and the axial direction of the beam. The other component is connected to the second aperture group and is used to adjust the position of the second aperture group in the first direction (X), the second direction (Y), and the axial direction of the beam. By using the two manual adjustment components 21, both the first and second aperture groups can be manually adjusted in three mutually perpendicular directions.
[0060] In practical applications, the positions of the first and second aperture groups can be independently adjusted by operating the two manual adjustment components 21, thereby achieving initial alignment of the shaping port 11 in the plane and in the beam axis direction. This manual adjustment method is mainly used during equipment installation, commissioning, or process switching stages to complete the basic positioning of the aperture mechanism 1 before automatic adjustment.
[0061] In some embodiments, see Figure 1 The laser processing apparatus also includes a locking mechanism 4, which is connected to the adjusting end of the automatic adjustment mechanism 3 and used to lock and fix the adjusting end of the automatic adjustment mechanism 3. The locking mechanism 4 can be a fixed-position locking block, which is fixed to the adjusting end of the automatic adjustment mechanism 3 using bolts, screws, nuts, or other connecting parts. After the automatic adjustment mechanism 3 completes the position adjustment of the aperture assembly 12, it applies a constraint force to the corresponding adjusting end, ensuring that the automatic adjustment mechanism 3 maintains its current adjustment position in the locked state. In actual use, after the size and position of the forming port 11 are adjusted to meet the requirements of the wafer laser annealing process, the locking mechanism 4 can lock the adjusting end of the automatic adjustment mechanism 3, ensuring that the aperture assembly 12 remains stable during subsequent processing, thereby avoiding positional changes caused by equipment vibration, thermal changes, or driver return clearance.
[0062] Embodiments of this application also provide a laser annealing apparatus, including a laser source, a stage for supporting and moving a wafer, and a laser processing apparatus as described in any of the foregoing embodiments. The laser processing apparatus is disposed between the laser source and the wafer.
[0063] The laser processing device is positioned along the laser beam path to shape the laser beam emitted from the laser source, forming a beam cross-section of a preset shape and size before reaching the wafer surface. The laser beam, shaped by the laser processing device, irradiates the wafer surface, and under the relative motion of the stage, performs laser annealing on the target area on the wafer.
[0064] In this embodiment, by adjusting the aperture mechanism 1 in the laser processing device, the shape and size of the laser beam can be matched with the strip annealing areas of different shapes and sizes on the wafer, thereby completing laser annealing operations under different annealing process conditions without changing the laser source or other optical components.
[0065] The basic concepts have been described above. Obviously, for those skilled in the art, the detailed disclosure above is merely illustrative and does not constitute a limitation of this application. Although not explicitly stated herein, those skilled in the art may make various modifications, improvements, and corrections to this application. Such modifications, improvements, and corrections are suggested in this application, and therefore remain within the spirit and scope of the exemplary embodiments of this application.
[0066] Furthermore, this application uses specific terms to describe embodiments of the application. For example, "an embodiment," "one embodiment," and / or "some embodiments" refer to a particular feature, structure, or characteristic associated with at least one embodiment of the application. Therefore, it should be emphasized and noted that "an embodiment," "one embodiment," or "an alternative embodiment" mentioned twice or more in different locations in this specification do not necessarily refer to the same embodiment. In addition, certain features, structures, or characteristics in one or more embodiments of the application can be appropriately combined.
[0067] Similarly, it should be noted that, in order to simplify the description of the present application and thus aid in the understanding of one or more embodiments, the foregoing description of the embodiments of the present application sometimes combines multiple features into a single embodiment, drawing, or description thereof. However, this disclosure method does not imply that the subject matter of the present application requires more features than those mentioned in the claims. In fact, the embodiments contain fewer features than all the features of the single embodiments disclosed above.
[0068] For each patent, patent application, patent application publication, and other material such as articles, books, specifications, publications, and documents referenced in this application, the entire contents of that patent application are incorporated herein by reference, except for historical application documents that are inconsistent with or conflict with the content of this application, and documents that limit the broadest scope of the claims of this application (currently or subsequently appended to this application). It should be noted that if there are any inconsistencies or conflicts between the descriptions, definitions, and / or terminology used in the supplementary materials of this application and the content of this application, the descriptions, definitions, and / or terminology used in this application shall prevail.
[0069] The above are merely preferred embodiments of this application and are not intended to limit this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.
Claims
1. A laser processing apparatus, characterized in that, include: An aperture mechanism is formed with a shaping aperture for passing a light beam and defining the shape of the light beam; A manual adjustment mechanism, connected to the aperture mechanism, is used to adjust the position and size of the shaping opening; An automatic adjustment mechanism, connected to the aperture mechanism, is used to adjust the position and size of the shaping opening, and the adjustment accuracy of the automatic adjustment mechanism is higher than that of the manual adjustment mechanism.
2. The laser processing apparatus according to claim 1, characterized in that, The aperture mechanism includes four aperture components, wherein two of the aperture components are arranged opposite each other along a first direction to form a first aperture group, and the other two aperture components are arranged opposite each other along a second direction to form a second aperture group. The first direction is perpendicular to the second direction, and the plane defined by the first direction and the second direction is perpendicular to the incident direction of the light beam incident on the shaping port. Both the manual adjustment mechanism and the automatic adjustment mechanism are connected to the four aperture assemblies to adjust the size of the shaping opening defined by the four aperture assemblies. The four aperture assemblies are used to adjust the shape of the shaping opening.
3. The laser processing apparatus according to claim 2, characterized in that, The aperture assembly includes: An aperture fixing seat is connected to the automatic adjustment mechanism and has an aperture mounting slot. An aperture driver is disposed on the aperture mounting base, and the driving end of the aperture driver extends into the aperture mounting slot; A rotating shaft is disposed in the aperture fixing seat and extends into the aperture mounting groove, and the axial direction of the rotating shaft is perpendicular to the driving direction of the aperture driver. An aperture is disposed in the aperture mounting slot and rotatably connected to the rotating shaft, so that the aperture can rotate on its own axis with the rotating shaft as the rotation axis. Wherein, along a direction perpendicular to the axial direction and the driving direction, the driving end of the aperture driver is spaced apart on one side of the rotating shaft and close to the edge of the aperture.
4. The laser processing apparatus according to claim 3, characterized in that, The aperture assembly also includes a return spring, which is disposed in the aperture mounting base and extends along the driving direction of the aperture driver, so that the return spring is connected to the aperture. The reset spring and the drive end of the aperture driver are parallel and located on the same side of the aperture. The reset spring and the aperture driver are arranged opposite each other in a direction perpendicular to the axial direction and the drive direction, so that the rotating shaft is located between the reset spring and the aperture driver.
5. The laser processing apparatus according to claim 3, characterized in that, The end surface of the drive end of the aperture driver is spherical or planar.
6. The laser processing apparatus according to claim 3, characterized in that, The aperture is made of glass and its surface is covered with a reflective film.
7. The laser processing apparatus according to claim 2, characterized in that, The automatic adjustment mechanism includes four first automatic adjustment components and four second automatic adjustment components; Wherein, two of the first automatic adjustment components are respectively connected to two of the aperture components in the first aperture group to drive the two aperture components in the first aperture group to move towards or away from each other along the first direction; and the other two of the first automatic adjustment components are respectively connected to two of the aperture components in the second aperture group to drive the two aperture components in the second aperture group to move towards or away from each other along the second direction. Two second automatic adjustment components are respectively connected to two aperture components in the first aperture group to drive the two aperture components in the first aperture group to move along the axial direction of the light beam. The other two second automatic adjustment components are respectively connected to two aperture components in the second aperture group to drive the two aperture components in the second aperture group to move along the axial direction of the light beam.
8. The laser processing apparatus according to claim 2, characterized in that, The manual adjustment mechanism includes two manual adjustment components. One of the manual adjustment components is connected to the first aperture group and is used to adjust the position of the first aperture group in the first direction, the second direction, and the axial direction of the beam. The other manual adjustment component is connected to the second aperture group and is used to adjust the position of the second aperture group in the first direction, the second direction, and the axial direction of the beam.
9. The laser processing apparatus according to claim 1, characterized in that, The laser processing device further includes a locking mechanism, which is connected to the adjusting end of the automatic adjusting mechanism and is used to lock and fix the adjusting end of the automatic adjusting mechanism.
10. A laser annealing apparatus, characterized in that, Includes the laser processing apparatus as described in any one of claims 1 to 9.