SIP packaging structure applied in blood glucose meter and production process thereof

Abstract

The application relates to a SIP packaging structure applied to a blood glucose meter and a production process, and relates to the field of blood glucose meters.The SIP packaging structure comprises a multilayer wiring substrate and a packaging body, the multilayer wiring substrate is provided with a mounting area for mounting functional chips and interconnection lines for realizing electrical connection of the chips; the functional chips comprise an MCU chip U2, a storage chip U1, a Bluetooth chip U3, an NFC chip U4 and a power supply chip Q; the MCU chip U2, the storage chip U1, the Bluetooth chip U3, the NFC chip U4 and the power supply chip Q are integrally mounted on the multilayer wiring substrate; a crystal oscillator is further arranged on the multilayer wiring substrate and used for providing a clock signal for the MCU chip U2; the multilayer wiring substrate and the chips mounted thereon are formed into the packaging body through injection molding packaging. The application has the effects of reducing the internal circuit volume of the blood glucose meter, protecting the chips as a whole through the packaging body, improving the water tightness and air tightness of the device, and enhancing the reliability of the equipment.

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