Method of manufacturing a window and electronic device comprising a window

Abstract

This application discloses a method for manufacturing a window and an electronic device including the window. The method for manufacturing a window includes: placing a substrate in a guide film that houses the substrate and is provided with an opening defined to extend through the guide film and overlap with a portion of the substrate in a plan view; providing a first solution comprising light-blocking particles and a polymer resin to an edge portion of an interior space of the guide film, wherein the interior space is divided into a central portion overlapping the opening in a plan view and an edge portion located outside the central portion; providing a second solution comprising the polymer resin to the central portion; placing a magnet to overlap with the edge portion in a plan view, such that the light-blocking particles are moved by means of the magnet; and using ultraviolet light to cure the light-blocking particles and the polymer resin to form a black matrix and a coating.

Description

[0001] This application claims priority to and all benefits derived therefrom of Korean Patent Application No. 10-2025-0001102, filed on January 3, 2025, the entire contents of which are incorporated herein by reference. Technical Field

[0002] This disclosure relates to a foldable window, a method of manufacturing the window, and an electronic device including the window. More specifically, this disclosure relates to a method of manufacturing a window capable of forming a black matrix and coating using a single curing process, the window itself, and an electronic device including the window. Background Technology

[0003] Various types of electronic devices are being used to provide image information, and recently, electronic devices including flexible display panels that can be folded or bent have been developed. Unlike rigid electronic devices, flexible electronic devices can be folded, rolled, or bent into various shapes, making them easy to carry regardless of the size of the screen displaying the image.

[0004] Flexible electronic devices require a window to protect the display panel without interfering with folding or bending operations. Summary of the Invention

[0005] This disclosure provides a method for manufacturing a window, which is designed to avoid expansion and void formation during the printing process after the formation of a black matrix and the coating of resin.

[0006] This disclosure provides an electronic device including a window designed to prevent expansion and void formation during the printing process after the formation of a black matrix and the coating of resin.

[0007] Embodiments of the present invention provide a method for manufacturing a window, the window including a folded region, a first non-folded region adjacent to one side of the folded region, and a second non-folded region adjacent to the other side of the folded region, and including a substrate, a coating disposed beneath the substrate, and a black matrix. The method includes: placing the substrate in a guide film that houses the substrate and is provided with an opening defined to extend through the guide film and overlap with a portion of the substrate in a plan view; providing a first solution comprising light-blocking particles and a polymer resin to an edge portion of an interior space of the guide film, wherein the interior space is divided into a central portion overlapping the opening in a plan view and an edge portion located outside the central portion; providing a second solution comprising the polymer resin to the central portion; placing a magnet to overlap with the edge portion in a plan view, such that the light-blocking particles are moved by means of the magnet; and using ultraviolet light to cure the light-blocking particles and the polymer resin to form a black matrix and a coating.

[0008] The coating may include a first surface adjacent to the substrate and a second surface opposite to the first surface, and a portion of the first surface has a raised shape facing the substrate.

[0009] The substrate may include: a first portion overlapping a first non-folded region; a second portion overlapping a second non-folded region; and a third portion overlapping a folded region and having a thickness smaller than the thickness of each of the first portion and the second portion, and the third portion having curvature.

[0010] The method may further include: partially cutting the edge portion using a laser beam; flipping the substrate and coating; and removing the guide film.

[0011] Light-blocking particles can have ferromagnetic and light-blocking properties.

[0012] Light-blocking particles can be formed by coating a first material with light-blocking properties onto a first portion that is ferromagnetic.

[0013] Light-blocking particles may include Fe, Co, Ni, Mn, Fe2O3, or Fe3O4.

[0014] The guiding film may include a transparent material that transmits ultraviolet light.

[0015] Placing the magnet in a manner that overlaps with the edge portion may include: placing the magnet below the guide film so that the light-blocking particles contact the substrate.

[0016] Placing the magnet in a manner that overlaps with the edge portion may include: placing the magnet on the guide film so that the light-blocking particles are separated from the substrate and come into contact with the guide film.

[0017] Placing the magnet to overlap with the edge portion may include placing the magnet on the side surface of the guide film so that light-blocking particles are arranged on the side surface of the substrate.

[0018] The cured light-blocking particles and polymer resin can simultaneously form a black matrix and a coating.

[0019] Embodiments of the present invention provide an electronic device comprising: a window including a folded region, a first non-folded region adjacent to one side of the folded region, and a second non-folded region adjacent to the other side of the folded region; a display module disposed below the window; and a housing for accommodating the display module. The window includes a substrate, a coating disposed below the substrate, and a black matrix. The substrate has a recessed shape in the folded region, the coating has a raised shape in the folded region, the substrate is spaced apart from the display module, the coating is disposed between the substrate and the display module, and the black matrix has ferromagnetic and light-blocking properties.

[0020] The electronic device may further include: an adhesive layer disposed below the window, and a display module disposed below the adhesive layer.

[0021] The black matrix can include multiple light-blocking particles.

[0022] Each of the light-blocking particles may include: a first portion having ferromagnetic properties; and a first material coated on the first portion and having light-blocking properties.

[0023] Each of the light-blocking particles may include Fe, Co, Ni, Mn, Fe2O3, or Fe3O4.

[0024] The black matrix can be placed between the substrate and the coating.

[0025] The black matrix can be placed between the coating and the adhesive layer.

[0026] The black matrix can be disposed adjacent to the side surface of the substrate and the side surface of the coating, and the black matrix can be disposed without overlapping with the display module in the plan view.

[0027] According to the method for manufacturing the window, a black matrix and coating are simultaneously formed by using ultraviolet-cured light-blocking particles and polymer resin. Therefore, the manufacturing process for forming the window is effectively simplified.

[0028] According to electronic devices including windows, since the light-blocking particles in the edge portion move by means of magnets, expansion and voids can be effectively prevented after the black matrix is ​​formed and the resin is coated. Attached Figure Description

[0029] Figure 1 This is a block diagram illustrating an electronic device according to an embodiment of the present disclosure;

[0030] Figure 2 This is a view illustrating an electronic device according to an embodiment of the present disclosure;

[0031] Figure 3A This is a perspective view showing an electronic device according to an embodiment of the present disclosure;

[0032] Figure 3B This is a perspective view showing an electronic device according to an embodiment of the present disclosure;

[0033] Figure 3C This is a plan view illustrating an electronic device according to an embodiment of the present disclosure;

[0034] Figure 3D This is a perspective view showing an electronic device according to an embodiment of the present disclosure;

[0035] Figure 4A This is a perspective view showing an electronic device according to an embodiment of the present disclosure;

[0036] Figure 4B This is a perspective view showing an electronic device according to an embodiment of the present disclosure;

[0037] Figure 4C This is a perspective view showing an electronic device according to an embodiment of the present disclosure;

[0038] Figure 5 This is an exploded perspective view showing an electronic device according to an embodiment of the present disclosure;

[0039] Figure 6A It is along Figure 5 A cross-sectional view taken from line I-I';

[0040] Figure 6B This is a cross-sectional view showing a portion of a display module according to an embodiment of the present disclosure;

[0041] Figure 7 This is a flowchart illustrating a method for manufacturing a window according to an embodiment of the present disclosure;

[0042] Figure 8A This is a view showing the process of a manufacturing window according to an embodiment of the present disclosure;

[0043] Figure 8B This is a view showing the process of a manufacturing window according to an embodiment of the present disclosure;

[0044] Figure 8C This is a view showing the process of a manufacturing window according to an embodiment of the present disclosure;

[0045] Figure 8D This is a view showing the process of a manufacturing window according to an embodiment of the present disclosure;

[0046] Figure 8E This is a view showing the process of a manufacturing window according to an embodiment of the present disclosure;

[0047] Figure 8F This is a view showing the process of a manufacturing window according to an embodiment of the present disclosure;

[0048] Figure 8G This is a view showing the process of a manufacturing window according to an embodiment of the present disclosure;

[0049] Figure 8H This is a view showing the process of a manufacturing window according to an embodiment of the present disclosure;

[0050] Figure 9A This is a view showing the process of a manufacturing window according to an embodiment of the present disclosure;

[0051] Figure 9B This is a view showing the process of a manufacturing window according to an embodiment of the present disclosure;

[0052] Figure 10 This is a cross-sectional view showing a portion of an electronic device according to an embodiment of the present disclosure;

[0053] Figure 11A This is a view showing the process of a manufacturing window according to an embodiment of the present disclosure;

[0054] Figure 11B This is a view illustrating the process of a manufacturing window according to an embodiment of the present disclosure; and

[0055] Figure 12 This is a cross-sectional view showing a portion of an electronic device according to an embodiment of the present disclosure. Detailed Implementation

[0056] In this disclosure, it will be understood that when an element (or region, layer or portion) is referred to as being "on" another element or layer, "connected to" or "attached to" another element or layer, the element may be directly on, directly connected to or attached to the other element or layer, or there may be intervening elements or layers.

[0057] The same reference numerals always refer to the same elements. In the drawings, the thickness, scale, and dimensions of the parts may be exaggerated for effective description of the technical content. As used herein, the term "and / or" includes any and all combinations of one or more of the listed related items.

[0058] It will be understood that although the terms “first,” “second,” etc., may be used herein to describe various elements, these elements should not be limited by these terms. These terms are used only to distinguish one element from another. Thus, the first element discussed below may be referred to as the second element without departing from the teachings of this disclosure. By way of example, the first component, the first part, the first zone, the first layer, and the first portion may be referred to as the second component, the second part, the second zone, the second layer, and the second portion, respectively, without departing from the scope of this disclosure, and vice versa. As used herein, the singular forms “a” and “the (described)” are intended to include the plural forms as well, unless the context clearly indicates otherwise.

[0059] For ease of description, spatially related terms such as “below,” “under,” “above,” and “up” may be used in this document to describe the relationship between one element or feature and another element(s) as shown in the figure.

[0060] It will be further understood that, when used in this specification, the terms “comprising” and / or “including” indicate the presence of the described features, integers, steps, operations, elements and / or components, but do not exclude the presence or addition of one or more other features, integers, steps, operations, elements, components and / or groups thereof.

[0061] Unless otherwise specified, all terms used herein, including technical and scientific terms, shall have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure pertains. It will be further understood that terms (such as those defined in common dictionaries) shall be interpreted as having meanings consistent with their meanings in the context of the relevant art and shall not be interpreted in an idealized or overly formal sense, unless expressly so defined herein.

[0062] In the following description, embodiments of the present disclosure will be described with reference to the accompanying drawings.

[0063] Figure 1 This is a block diagram of an electronic device according to an embodiment of the present disclosure. (See reference...) Figure 1 The electronic device 10 may include a display module 11, a processor 12, a memory 13, and a power module 14.

[0064] The processor 12 may include at least one of a central processing unit (CPU), an application processor (AP), a graphics processing unit (GPU), a communication processor (CP), an image signal processor (ISP), and a controller.

[0065] The memory 13 can store the data information required for the operation of the processor 12 or the display module 11. When the processor 12 executes the application stored in the memory 13, image data signals and / or input control signals can be sent to the display module 11, and the display module 11 can process the received signals to output image information through the display screen.

[0066] The power module 14 may include a power supply module such as a power adapter or battery device, and a power conversion module that converts the power supplied by the power supply module to generate the power required for the operation of the electronic device 10.

[0067] At least one of the components of electronic device 10 may be included in the display device according to the embodiment. Furthermore, among the independent modules functionally included in a single module, some modules may be included in the display device, while others may be provided separately from the display device. As an example, the display device may include a display module 11, and the processor 12, memory 13, and power module 14 may be provided as separate devices within electronic device 10 and may not be included in the display device.

[0068] Figure 2 This is a view illustrating an electronic device according to an embodiment of the present disclosure.

[0069] refer to Figure 2 Various electronic devices that utilize the display device according to the embodiments may include electronic devices for displaying images, such as smartphones 10_1a, tablet PCs 10_1b, laptop computers 10_1c, televisions 10_1d, desktop monitors 10_1e, etc.; wearable electronic devices including display modules, such as smart glasses 10_2a, head-mounted displays 10_2b, smartwatches 10_2c, etc.; or in-vehicle electronic devices 10_3 including display modules, such as dashboards, center consoles, central information displays (CID) mounted on dashboards, in-vehicle mirror displays, etc.

[0070] In the following description, embodiments of the display device and electronic device including the display device will be described with reference to the accompanying drawings.

[0071] Figure 3A This is a perspective view showing an electronic device EA in an unfolded state according to an embodiment of the present disclosure.

[0072] refer to Figure 3A An electronic device EA can be a device activated in response to an electrical signal. As examples, an electronic device EA can be a smartphone, tablet computer, car navigation unit, gaming unit, or wearable device; however, it should not be limited to or restricted by these limitations. Figure 3A In the image, a smartphone is shown as a representative example of an electronic device (EA).

[0073] An electronic device EA may include a first display surface FS defined by a first direction DR1 and a second direction DR2 intersecting the first direction DR1. The electronic device EA may provide an image IM to a user via the first display surface FS. The electronic device EA may display the image IM towards a third direction DR3 via the first display surface FS, which is substantially parallel to each of the first direction DR1 and the second direction DR2. The image IM may include video and still images.

[0074] In this disclosure, the first direction DR1 may be perpendicular to the second direction DR2, and the third direction DR3 may be a normal direction relative to the plane defined by the first direction DR1 and the second direction DR2. The thickness direction of the electronic device EA may be substantially parallel to the third direction DR3. The thickness direction of the electronic device EA may be given the same reference numerals as the third direction DR3. The front surface (or upper surface) and the rear surface (or lower surface) may be opposite to each other on the third direction DR3, and the normal direction of each of the front surface (or upper surface) and the rear surface (or lower surface) may be substantially parallel to the third direction DR3. The front surface (or upper surface) may indicate the surface adjacent to the first display surface FS, and the rear surface (or lower surface) may indicate the surface spaced apart from the first display surface FS. Furthermore, the rear surface (or lower surface) may indicate the surface closer to the second display surface RS, which will be described later. A section refers to a flat surface parallel to the thickness direction DR3, and a plane refers to a flat surface perpendicular to the thickness direction DR3. A plane refers to a flat surface defined by the first direction DR1 and the second direction DR2.

[0075] In this disclosure, the directions indicated by the first direction DR1, the second direction DR2, and the third direction DR3 can be related to each other and can be changed to other directions.

[0076] An electronic device (EA) can sense external inputs applied from outside its exterior. External inputs can include various forms of input provided from outside the electronic device (EA). For example, external inputs can include those applied near the electronic device (EA) or at a selected distance from it (e.g., hovering), and contact made by a part of the body (e.g., a user's hand). Furthermore, external inputs can be provided in the form of force, pressure, temperature, light, etc.

[0077] An electronic device EA may include a first display surface FS and a second display surface RS. The first display surface FS may include a first active region F-AA, a first peripheral region F-NAA, and a sub-region MH. The second display surface RS may be defined as a surface opposite to at least a portion of the first display surface FS. That is, the second display surface RS may be defined as a portion of the rear surface of the electronic device EA.

[0078] The first effective area F-AA can be activated in response to an electrical signal. The image IM can be displayed through the first effective area F-AA, and various external inputs can be sensed through the first effective area F-AA.

[0079] The first peripheral region F-NAA can be defined as being adjacent to the first effective region F-AA. The first peripheral region F-NAA can have a lower light transmittance than the first effective region F-AA. The first peripheral region F-NAA can have a selected color. The first peripheral region F-NAA can surround the first effective region F-AA. Accordingly, the first effective region F-AA can have a shape substantially defined by the first peripheral region F-NAA; however, this is merely an example. The first peripheral region F-NAA can be defined as being adjacent only to one side of the first effective region F-AA, or it can be omitted.

[0080] External objects can be detected through sub-regions MH of display surfaces FS and RS, or sound signals (such as speech) can be provided to the outside through sub-regions MH of display surfaces FS and RS. Light signals such as visible light or infrared light can travel through sub-regions MH.

[0081] Various electronic modules (ELM) (reference) Figure 5 ) can be set in a sub-region MH. For example, the electronic module ELM (reference) Figure 5 The electronic device EA may include at least one of a camera, a speaker, an optical sensor, and a thermal sensor. The electronic device EA may include an electronic module ELM (see reference) that uses visible light passing through a sub-region MH to take a photograph of an external object or uses infrared light to determine if an external object is approaching. Figure 5 In addition, the electronic module ELM (reference) Figure 5 It may include multiple components; however, it should not be limited to a particular embodiment.

[0082] The subregion MH can be confined within the first effective region F-AA; however, this is merely an example. As an example, the subregion MH can be surrounded by the first outer region F-NAA, or it can be surrounded by both the first effective region F-AA and the first outer region F-NAA. Figure 3A A subregion MH is shown; however, multiple subregions MH can be provided.

[0083] An electronic device EA (and its components or layers, such as a window WM) may include at least one folded region FA and a plurality of non-folded regions NFA1 and NFA2 extending from the folded region FA. As an example, a first non-folded region NFA1, a folded region FA, and a second non-folded region NFA2 may be defined along a second direction DR2. The second non-folded region NFA2 may be spaced apart from the first non-folded region NFA1 in the second direction DR2, and the folded region FA may be disposed between the first non-folded region NFA1 and the second non-folded region NFA2. For example, the first non-folded region NFA1 may be disposed adjacent to one side of the folded region FA in the second direction DR2, and the second non-folded region NFA2 may be disposed adjacent to the other side of the folded region FA in the second direction DR2.

[0084] Figure 3A The diagram shows a structure in which an electronic device EA includes a folded region FA as a representative example; however, this disclosure should not be limited to or construed as such, and the electronic device EA may include multiple folded regions defined therein. As an example, the electronic device may include two or more folded regions and three or more non-folded regions, arranged such that the folded regions are situated between the non-folded regions.

[0085] Figure 3B This is a perspective view illustrating the folding operation of an electronic device EA according to an embodiment of the present disclosure. Figure 3C This is a plan view showing an electronic device EA in a folded state according to an embodiment of the present disclosure. Figure 3D This is a perspective view illustrating the folding operation of an electronic device EA according to an embodiment of the present disclosure. As used herein, the plan view is a view taken in the thickness direction (third direction DR3) of the window WM.

[0086] refer to Figure 3B The electronic device EA can be folded relative to a first folding axis FX1 extending in a first direction DR1. When the electronic device EA is folded, the folding region FA can have a selected curvature and radius of curvature. The electronic device EA can be folded inward (inward folding) relative to the first folding axis FX1 such that the first non-folding region NFA1 faces the second non-folding region NFA2 and the first display surface FS is not exposed to the outside.

[0087] Figure 3C This is a plan view showing the electronic device EA being folded inwards. (Reference) Figure 3CWhen the electronic device EA is folded inward, the user can see a second display surface RS. In this case, the second display surface RS may include a second active area R-AA through which an image is displayed. The second active area R-AA can be activated in response to an electrical signal. Images can be displayed through the second active area R-AA, and various external inputs can be sensed through the second active area R-AA.

[0088] The second peripheral region R-NAA can be defined as adjacent to the second effective region R-AA. The second peripheral region R-NAA may have a lower light transmittance than the second effective region R-AA. The second peripheral region R-NAA may have a selected color. The second peripheral region R-NAA may surround the second effective region R-AA. Although not shown in the figure, the electronic device EA may further include a sub-region in the second display surface RS in which an electronic module comprising various components is disposed.

[0089] refer to Figure 3D The electronic device EA can be folded relative to a second folding axis FX2 extending in the first direction DR1. The electronic device EA can be folded outward (outward folding) relative to the second folding axis FX2 so that the first display surface FS is exposed to the outside. The electronic device EA can be configured to repeat the inward folding operation or the outward folding operation from the unfolding operation; however, this disclosure should not be limited to or restricted by this.

[0090] Figures 3A to 3D An electronic device EA folded relative to a folding axis FX1 or FX2 is shown as a representative example; however, the number of folding axes and the number of non-folded areas should not be particularly limited. As an example, the electronic device EA may be folded relative to multiple folding axes such that a portion of the first display surface FS faces a portion of the second display surface RS. Furthermore, in the above embodiment, the first folding axis FX1 and the second folding axis FX2 are shown as parallel to the long side of the electronic device EA; however, this disclosure should not be limited to or construed as such. According to an embodiment, the first folding axis FX1 and the second folding axis FX2 may be substantially parallel to the short side of the electronic device EA.

[0091] In the electronic device EA, the first non-folded region NFA1 and the second non-folded region NFA2 can be defined as including, for example... Figure 3A The regions shown are display surfaces FS and RS, which are parallel to the planes defined by the first direction DR1 and the second direction DR2 in the unfolded state, and the folded region FA can be defined as the region located between the first non-folded region NFA1 and the second non-folded region NFA2. The folded region FA may include a curved portion having a selected curvature in the folded state.

[0092] Figures 4A to 4CThis is a perspective view showing an electronic device EA-a according to an embodiment of the present disclosure. Figure 4A This is a perspective view showing the electronic device EA-a in its unfolded state. Figure 4B and Figure 4C This is a perspective view showing the folding operation of the electronic device EA-a. Figure 4B It is shown Figure 4A A perspective view of the inward folding operation of the electronic device EA-a. Figure 4C It is shown Figure 4A A perspective view of the outward folding operation of the electronic device EA-a.

[0093] The electronic device EA-a can be folded relative to a third folding axis FX3 extending in a direction substantially parallel to the first direction DR1. (Reference) Figure 4B and Figure 4C The direction in which the third folding axis FX3 extends can be substantially parallel to the direction in which the short side of the electronic device EA-a extends.

[0094] The electronic device EA-a may include a folded region FA-a, a first non-folded region NFA1-a adjacent to one side of the folded region FA-a, and a second non-folded region NFA2-a adjacent to the other side of the folded region FA-a. The first non-folded region NFA1-a may be spaced apart from the second non-folded region NFA2-a, and the folded region FA-a may be located between the first non-folded region NFA1-a and the second non-folded region NFA2-a.

[0095] The folding region FA-a can be the region folded relative to the third folding axis FX3. When the electronic device EA-a is folded, the folding region FA-a can have a selected curvature and radius of curvature. The electronic device EA-a can be folded inward (inward folding) so that the first non-folding region NFA1-a faces the second non-folding region NFA2-a and the display surface FS-a is not exposed to the outside.

[0096] refer to Figure 4A When the electronic device EA-a is in the unfolded state, the user can see the display surface FS-a. (Refer to reference...) Figures 3A to 3D Similar to the description, the display surface FS-a of the electronic device EA-a may include an effective area F-AAa, a peripheral area F-NAAa, and a sub-area MH-a. The image IM can be displayed through the effective area F-AAa, and various external inputs can be sensed through the effective area F-AAa.

[0097] refer to Figure 4BWhen the electronic device EA-a is folded inward, the user can see the rear surface RS-a. As an example, the rear surface RS-a can serve as a second display surface through which images are displayed. Furthermore, the rear surface RS-a may include sub-regions in which electronic modules comprising various components are disposed.

[0098] refer to Figure 4C The electronic device EA-a can be folded outward relative to the third folding axis FX3 (outward folding) so that the portion of the rear surface RS-a that overlaps with the first non-folded region NFA1-a faces the other portion of the rear surface RS-a that overlaps with the second non-folded region NFA2-a.

[0099] Figure 5 This illustrates an embodiment according to the present disclosure. Figure 3A An exploded perspective view of the electronic device EA. The following description of the electronic device EA can be applied equivalently. Figures 4A to 4C The electronic device EA-a shown is shown in the image.

[0100] refer to Figure 5 The electronic device EA may include an electronic module ELM and a display device DD. Furthermore, the electronic device EA may further include a housing HAU. The display device DD may include a display module DM and a window WM disposed on the display module DM. A module area DM-MH may be defined by the display device DD, and the electronic module ELM may be configured to correspond to the module area DM-MH.

[0101] Image IM (reference) generated by display module DM Figure 3A This can be provided to the user through a window (WM). The window (WM) can be relative to at least one collapsible axis FX1 or FX2 (see reference). Figure 3B and Figure 3D () was folded.

[0102] The display device DD may further include an upper adhesive layer AP-R. The upper adhesive layer AP-R may be disposed between the display module DM and the window WM. The display module DM can be connected to the window WM through the upper adhesive layer AP-R. The upper adhesive layer AP-R may include a pressure-sensitive adhesive (PSA) film, an optically clear adhesive (OCA) film, or an optically clear adhesive resin (OCR) layer.

[0103] The display module DM can display images in response to electrical signals. The display module DM can send or receive information about external inputs. A display area DM-DA and a non-display area DM-NDA can be defined within the display module DM. Furthermore, the module area DM-MH can be defined to extend through the display module DM.

[0104] The display area DM-DA can be defined as the area through which the image provided by the display module DM is emitted. The display area DM-DA of the display module DM can be compared with the first effective area F-AA (reference). Figure 3A At least a part of it corresponds to.

[0105] The driving circuitry or driving lines used to drive the display area DM-DA can be arranged within the non-display area DM-NDA. The non-display area DM-NDA can be defined as being adjacent to the display area DM-DA. As an example, the non-display area DM-NDA can surround the display area DM-DA; however, this is merely an example. According to embodiments, the non-display area DM-NDA can be defined in various shapes and should not be particularly limited.

[0106] Module area DM-MH can be with Figure 3A The sub-region MH shown corresponds to this. Optical signals can be applied through the module region DM-MH. The module region DM-MH can be defined within the display region DM-DA; however, this disclosure should not be particularly limited.

[0107] An electronic module (ELM) can be configured to correspond to a module area DM-MH. The ELM can be an electronic component that outputs or receives optical signals. As an example, the ELM may include a camera module and / or a proximity sensor. The camera module can capture images of external objects via the module area DM-MH. However, this disclosure should not be limited to or construed as such, and the ELM may further include internal and / or external modules. Internal modules may include sensor modules, antenna modules, and audio output modules. External modules may include optical modules and communication modules.

[0108] The display module DM may include a foldable display unit FP-D and non-foldable display units NFP1-D and NFP2-D. The foldable display unit FP-D may be connected to the folding area FA (see reference). Figure 3A Correspondingly, the non-folding display units NFP1-D and NFP2-D can correspond to the non-folding areas NFA1 and NFA2 (see reference). Figure 3A Corresponding to ).

[0109] The housing HAU may comprise a material with relatively high rigidity. As an example, the housing HAU may comprise multiple frames and / or plates comprising glass, plastic, or metal materials. The housing HAU provides a housing space. The display module DM can be housed within this housing space and protected from external impacts.

[0110] Figure 6A It is along Figure 5 The cross-sectional view taken from line I-I'. Figure 6AThis is a cross-sectional view showing the electronic device EA. For ease of explanation, Figure 6A The outer shell HAU is omitted (see reference). Figure 5 ).

[0111] refer to Figure 6A The electronic device EA may further include a lower module LM, a lower adhesive layer AP-D, and a lower protective film DF. The lower module LM, lower adhesive layer AP-D, and lower protective film DF may be disposed between the display device DD and the housing HAU (see reference). Figure 5 )between.

[0112] The lower module LM can be located below the display module DM. The lower module LM may include a support plate MP and a lower support component BSM. Figure 6A The construction of the lower module LM shown is an example, and the combination of components included in the lower module LM of the electronic device EA can vary depending on the size, shape, or operating characteristics of the electronic device EA.

[0113] The support plate MP may comprise a metallic or polymeric material. As an example, the support plate MP may comprise stainless steel, aluminum, or an alloy thereof. Multiple openings OP-MP may be defined through the support plate MP. The support plate MP may include openings OP-MP through a defined opening pattern OP-PT. The opening pattern OP-PT may be formed in the folded region FA.

[0114] The lower support member (BSM) may include a support member (SPM) and a filler portion (SAP). The support member (SPM) may largely overlap with the display module (DM) in a plan view. The filler portion (SAP) may be located outside the support member (SPM) and may overlap with the outer portion of the display module (DM) in a plan view.

[0115] The support member SPM may include at least one of the support layer SP, the padding layer CP, the shielding layer EMP, and the interlayer adhesive layer ILP. Figure 6A The construction of the support member SPM shown is merely an example, and this disclosure should not be limited to... Figure 6A The structure shown is illustrated. As an example, one or more of the support layer SP, padding layer CP, shielding layer EMP, and interlayer adhesive layer ILP can be omitted, and the stacking order of the support layer SP, padding layer CP, shielding layer EMP, and interlayer adhesive layer ILP can be determined from the following parameters: Figure 6A The stacking order can be changed, or other components can be added.

[0116] The support layer SP may comprise a metallic or polymeric material. The support layer SP may be disposed beneath the support plate MP. As an example, the support layer SP may be a thin metal substrate. The support layer SP may include a first sub-support layer SP1 and a second sub-support layer SP2 spaced apart from the first sub-support layer SP1 in a second direction DR2. The first sub-support layer SP1 and the second sub-support layer SP2 may be positioned relative to folding axes FX1 and FX2 (see reference). Figure 3B and Figure 3D The corresponding parts are spaced apart from each other. Since the support layer SP includes a first sub-support layer SP1 and a second sub-support layer SP2 that are spaced apart from each other in the folding region FA, the folding characteristics of the electronic device EA can be improved.

[0117] The padding layer CP can be disposed below the support layer SP. The padding layer CP can prevent the support plate MP from being subjected to external impacts and external forces, and from undergoing plastic deformation. The padding layer CP can improve the impact resistance of electronic devices EA. The padding layer CP can include sponge, foam, or elastomers such as urethane resin. In addition, the padding layer CP can include at least one of acrylic polymers, urethane polymers, silicone polymers, and imide polymers; however, it should not be limited to or restricted by these.

[0118] The padding layer CP may include a first sub-padding layer CP1 and a second sub-padding layer CP2 spaced apart from the first sub-padding layer CP1 in a second direction DR2. The first sub-padding layer CP1 and the second sub-padding layer CP2 may be aligned with folding axes FX1 and FX2 (see reference). Figure 3B and Figure 3D The corresponding regions are spaced apart from each other. Since the pad CP includes a first sub-pad CP1 and a second sub-pad CP2 spaced apart from each other in the folding region FA, the folding characteristics of the electronic device EA can be improved.

[0119] The shielding layer EMP can be an electromagnetic shielding layer or a heat dissipation layer. Furthermore, the shielding layer EMP can also function as an adhesive layer.

[0120] Interlaminar adhesive layer (ILP) can attach the support plate (MP) to the support member (SPM). ILP can be provided as an adhesive resin layer or adhesive tape. Figure 6A The interlayer adhesive layer (ILP) is shown in relation to the folded axes FX1 and FX2 (reference). Figure 3B and Figure 3D The structure is divided into two spaced-apart sections in the corresponding region; however, this disclosure should not be limited to or restricted by this. The interlayer adhesive layer (ILP) can be provided as a single layer, not in conjunction with the folding axes FX1 and FX2 (see reference). Figure 3B and Figure 3D The corresponding area is divided into multiple parts.

[0121] The filler SAP can be located outside the support layer SP and the padding layer CP. The filler SAP can also be located between the support plate MP and the housing HAU (see reference). Figure 5 The SAP filling portion can be filled between the support plate MP and the housing HAU (reference). Figure 5 It can be placed in the space between the two, and the support plate MP can be fixed.

[0122] The lower protective film DF can be disposed between the display module DM and the support plate MP. The lower protective film DF can be disposed below the display module DM and can protect the rear surface of the display module DM. The lower protective film DF can overlap the entire display module DM. The lower protective film DF can include a polymer material. As an example, the lower protective film DF can be a polyimide film or a polyethylene terephthalate film; however, this is only an example, and the lower protective film DF should not be limited to or restricted by these.

[0123] The lower adhesive layer AP-D can be disposed between the support plate MP and the lower protective film DF. The support plate MP and the lower protective film DF can be connected to each other through the lower adhesive layer AP-D. The lower adhesive layer AP-D may include a pressure-sensitive adhesive (PSA) film, an optically clear adhesive (OCA) film, or an optically clear adhesive resin (OCR) layer; however, this disclosure should not be limited to or construed as such. According to an embodiment, the lower adhesive layer AP-D may be omitted.

[0124] The display module DM may include a display panel DP and an input sensing unit TP disposed on the display panel DP. The display panel DP can substantially generate an image. The display panel DP can be positioned relative to folding axes FX1 and FX2 (see reference). Figure 3B and Figure 3D () was folded.

[0125] The input sensing unit TP can sense external input, convert the sensed external input into an input signal, and provide the input signal to the display panel DP. As an example, the input sensing unit TP can be a touch sensing unit that senses touch events. The input sensing unit TP can sense direct touches by a user, indirect touches by a user, direct touches by an object, or indirect touches by an object.

[0126] The input sensing unit TP can sense at least one of the location and intensity (pressure) of an externally applied touch event. The input sensing unit TP can have various structures or may include various materials, and it should not be particularly limited. As an example, the input sensing unit TP can sense external input capacitively. The display panel DP can receive input signals from the input sensing unit TP and can generate an image corresponding to the input signals.

[0127] The window WM may include a substrate HTG, a coating CA disposed below the substrate HTG, and a black matrix BM disposed below the substrate HTG.

[0128] The substrate HTG may include an optically transparent insulating material. The substrate HTG may include a glass material.

[0129] The upper surface of the substrate HTG can be flat. Correspondingly, the uppermost surface of the display device DD can also be flat. The image IM generated by the display module DM (reference) Figure 3A It can be provided to the user through the WM window.

[0130] According to this disclosure, the upper surface of the substrate HTG can be flat. The display device DD can have improved surface quality. Higher quality images (IM) can be provided to the user (see reference). Figure 3A Correspondingly, this can improve the display quality of electronic devices (EA).

[0131] The substrate HTG may include a first portion P1 overlapping a first non-folded region NFA1, a second portion P2 overlapping a second non-folded region NFA2, and a third portion P3 overlapping a folded region FA and having a thickness smaller than that of the first portion P1 and the second portion P2. The lower surface of the third portion P3 may have a selected curvature. The substrate HTG may have a recessed shape in the folded region FA facing the upper surface of the substrate HTG in a third direction DR3.

[0132] The folded groove FH can be defined in the lower surface of the third portion P3. The folded groove FH can be formed by removing a portion of the third portion P3 from this lower surface. Figure 6A In the illustration, the folded groove FH is shown as having a shape corresponding to a portion of a semicircle; however, the shape of the folded groove FH according to this disclosure should not be limited to or restricted by this. As an example, the folded groove FH may have a shape corresponding to a portion of a trapezoid.

[0133] The third part P3 can have a thickness smaller than the thickness of the first part P1 and the thickness of the second part P2.

[0134] According to this disclosure, since the thickness of the third portion P3 is less than the thickness of each of the first portion P1 and the second portion P2, the window WM can be easily folded within the folding region FA when the electronic device EA is folded. Since the thickness of the first portion P1 and the second portion P2 is greater than the thickness of the third portion P3, the first portion P1 and the second portion P2 can have greater rigidity than the third portion P3. Accordingly, the reliability of the electronic device EA can be improved.

[0135] The coating CA can be disposed below the substrate HTG. The coating CA may include a first surface S1 adjacent to the substrate HTG and a second surface S2 spaced apart from the substrate HTG, with the first surface S1 disposed between the substrate HTG and the second surface S2. A portion of the first surface S1 may have a protruding shape facing the substrate HTG on a third-direction DR3. This protruding shape of the portion of the first surface S1 may be a complementary shape to the recessed shape of the substrate HTG. Accordingly, this portion of the first surface S1 may be disposed within the folded groove FH. The second surface S2 may be in direct contact with the upper adhesive layer AP-R.

[0136] The coating CA can include acrylic resin, epoxy resin, silicone resin, urethane resin, urethane acrylic resin, hybrid sol-gel, and siloxane resin. Windows WM with the above structures can achieve improved impact resistance through the CA coating while maintaining the optical and design characteristics of the substrate HTG.

[0137] The black matrix BM can be disposed between the substrate HTG and the coating CA. In a planar view, the black matrix BM can be adjacent to the non-display area DM-NDA (reference). Figure 5 (Overlap). The black matrix BM can include light-blocking materials. The black matrix BM can absorb light incident on it from the outside.

[0138] Figure 6B This is a cross-sectional view showing a portion of a display module DM according to an embodiment of the present disclosure.

[0139] refer to Figure 6B The display module DM may include a display panel DP and an input sensing unit TP disposed on the display panel DP. The display panel DP may have a structure that substantially generates an image.

[0140] The display panel (DP) may include a substrate layer (BS), a circuit layer (DP-CL), a display element layer (DP-EL), and a packaging layer (TFE) stacked sequentially. Figure 6B The structure shown is different; separate components can be further set between two adjacent layers in the base layer BS, circuit layer DP-CL, display element layer DP-EL, and encapsulation layer TFE.

[0141] The substrate layer BS can provide a substrate surface on which the circuit layer DP-CL is disposed. The substrate layer BS can be a flexible substrate that is bendable, foldable, or rollable. The substrate layer BS can be a glass substrate, a metal substrate, or a polymer substrate; however, it should not be limited to or restricted by these. According to an embodiment, the substrate layer BS can be an inorganic layer, an organic layer, or a composite material layer.

[0142] The circuit layer DP-CL can be disposed on the substrate layer BS. The circuit layer DP-CL may include an insulating layer, semiconductor patterns, conductive patterns, and signal lines. The display element layer DP-EL can be disposed on the circuit layer DP-CL. The display element layer DP-EL may include a light-emitting element (not shown). As an example, the light-emitting element may include organic light-emitting materials, inorganic light-emitting materials, organic-inorganic light-emitting materials, quantum dots, or quantum rods. As an example, the light-emitting element may include micron-LEDs or nano-LEDs.

[0143] A TFE (Transmission Equipment) encapsulation layer can be disposed on the display element layer (DP-EL). The TFE encapsulation layer protects the DP-EL from moisture, oxygen, and foreign matter such as dust particles. The TFE encapsulation layer may include at least one inorganic layer. As an example, the TFE encapsulation layer may include inorganic layers, organic layers, and inorganic layers stacked sequentially.

[0144] The input sensing element TP can be disposed on the display panel DP. The input sensing element TP can be directly disposed on the encapsulation layer TFE; however, this disclosure should not be limited to or restricted by this. According to an embodiment, an adhesive member can be disposed between the input sensing element TP and the display panel DP.

[0145] In this disclosure, the statement "a component is directly disposed on / provided on / formed on another component" means that no third component is disposed between the one component and the other component. For example, when a component is "directly disposed on / provided on / formed on" another component, it means that the one component and the other component are "in contact" with each other.

[0146] The input sensing unit TP can sense external input, convert the sensed external input into an input signal, and provide the input signal to the display panel DP. As an example, the input sensing unit TP can be a touch sensing unit that senses touch events. The input sensing unit TP can sense direct touches by a user, indirect touches by a user, direct touches by an object, or indirect touches by an object.

[0147] The input sensing unit TP can sense at least one of the location and intensity (pressure) of an externally applied touch event. The input sensing unit TP can have various structures or may comprise various materials, and it should not be particularly limited. As an example, the input sensing unit TP can sense external input capacitively. The display panel DP can receive input signals from the input sensing unit TP and can generate an image corresponding to the input signals.

[0148] Figure 7 This is a flowchart illustrating a method for manufacturing a window according to an embodiment of the present disclosure. Figures 8A to 8HThis is a schematic view illustrating the process of a manufacturing window according to an embodiment of the present disclosure. Figures 8A to 8H In the figures, the same reference numerals indicate the same as... Figure 6A The components in the text are the same as those in the text, and therefore, detailed descriptions of the same components will be omitted. Figures 8A to 8G , Figure 9A , Figure 9B , Figure 11A and Figure 11B It is relative to Figure 6A The inverted image.

[0149] Windows Mobile (WM) can be referenced Figure 7 as well as Figures 8A to 8H The method described is for creating windows.

[0150] A method for manufacturing a window may include: placing a substrate HTG in a guide film GF that houses the substrate HTG and is provided with an opening OP, the opening OP being defined to extend through the guide film GF to overlap a portion of the substrate HTG in a plan view (step S100); providing a first solution PR1 containing light-blocking particles BL and polymeric resin PRS to an edge portion EG of an internal space IS of the guide film GF, wherein the internal space IS is divided into a central portion CT overlapping the opening OP in a plan view and an edge portion EG located outside the central portion CT (step S200); providing a second solution PR2 containing polymeric resin PRS to the central portion CT (step S300); placing a magnet MG to overlap the edge portion EG in a plan view, such that the light-blocking particles BL can be moved by means of the magnet MG (step S400); and curing the light-blocking particles BL and polymeric resin PRS using ultraviolet light to form a black matrix BM and a coating CA (step S500). The method for manufacturing a window may further include: partially cutting the edge portion EG using a laser beam; flipping the substrate HTG and the coating CA; and removing the guide film GF.

[0151] refer to Figure 6A , Figure 7 and Figure 8A The substrate HTG can be placed in the guide film GF (step S100).

[0152] The guide film GF can accommodate the substrate HTG. The opening OP can be defined to extend through the upper portion of the guide film GF.

[0153] The internal space IS can be defined within the guide film GF. The edge portion EG surrounding the substrate HTG in the plan view and the central portion CT overlapping the opening OP in the plan view can be defined within the internal space IS.

[0154] The guiding film GF can include a transparent material that transmits ultraviolet light. The guiding film GF can transmit light with a wavelength of approximately 365 nanometers (nm). The guiding film GF can include polyethylene terephthalate (PET) and polycarbonate (PC).

[0155] The substrate HTG can be disposed in the internal space IS such that the folded groove FH faces the opening OP. The substrate HTG can be coupled to the guide film GF.

[0156] The first part P1 can have a first thickness t1. The second part P2 can have a second thickness t2. The third part P3 can have a third thickness t3.

[0157] The first thickness t1 and the second thickness t2 can be the same as each other. The third thickness t3 can be less than each of the first thickness t1 and the second thickness t2.

[0158] According to this disclosure, since the third thickness t3 is less than each of the first thickness t1 and the second thickness t2, the window WM can be easily folded in the folding region FA when the electronic device EA is folded. Since the first thickness t1 and the second thickness t2 are greater than the third thickness t3, the first portion P1 and the second portion P2 can have greater rigidity than the third portion P3. Therefore, the reliability of the electronic device EA can be improved.

[0159] refer to Figure 7 and Figure 8B A first solution PR1, containing light-blocking particles BL and polymer resin PRS, can be provided to the edge portion EG (step S200). The first solution PR1 can be provided through nozzle NZ.

[0160] Light-blocking particles BL can possess both ferromagnetic and light-blocking properties. The light-blocking particles BL can include Fe, Co, Ni, Mn, Fe2O3, or Fe3O4. The light-blocking particles BL can be formed by coating a first material with light-blocking properties onto a first portion possessing ferromagnetic properties. As an example, since iron (Fe) does not possess light-blocking properties, the light-blocking particles BL can be formed by coating iron (Fe) with the first material. However, this is merely an example, and according to another embodiment, the light-blocking particles BL can inherently possess both light-blocking properties and ferromagnetism. As an example, manganese (Mn) can inherently possess both light-blocking properties and ferromagnetism.

[0161] Light-blocking particles (BL) can be placed in the edge portion (EG).

[0162] Polymer resin PRS can include at least one of urethane acrylate resins, epoxy resins, and silicone resins. Polymer resin PRS can also be a photocurable material that is cured by light.

[0163] refer to Figure 7 and Figure 8C A second solution PR2 containing polymer resin PRS can be provided to the central portion CT (step S300). The second solution PR2 can be provided through nozzle NZ. The polymer resin PRS can include at least one of urethane acrylate resin, epoxy resin, and silicone resin.

[0164] First solution PR1 (reference) Figure 8B The first solution PR1 and the second solution PR2 can each contain the same polymer resin PRS. That is, compared to the second solution PR2, the first solution PR1 (refer to...) Figure 8B It may further include light-blocking particles BL.

[0165] refer to Figure 7 and Figure 8D The magnet MG can be placed to overlap with the edge portion EG in the plan view, and the light-blocking particle BL can be moved by means of the magnet MG (step S400).

[0166] The magnet MG can be placed below the guide film GF. In a planar view, the magnet MG can be positioned relative to the edge portion EG (reference). Figure 8C The magnet MG can be spaced apart from the guide film GF on the third-direction DR3.

[0167] Magnet MG can apply a magnetic force to the first solution PR1. Magnet MG can change the direction of the magnetic force to move the light-blocking particles BL to the desired position. Black matrix BM (reference) Figure 8F This can be formed by moving light-blocking particles (BL). This will be described later.

[0168] Magnets MG can include solenoid devices made by winding copper wire around an electrically insulating and magnetically non-magnetic cylindrical tube, flat standard magnets or axial standard magnets, or electromagnets including a yoke with an iron core, coils and a cooling system, etc.

[0169] The magnet MG can apply a magnetic field in a direction parallel to the third direction DR3. Multiple light-blocking particles BL can be provided. The ferromagnetic light-blocking particles BL can move in the direction DRa by means of the magnetic field, and the concentration of the light-blocking particles BL in the first solution PR1 can increase along the third direction DR3. In this case, since the polymer resin PRS is not ferromagnetic, the polymer resin PRS is unaffected by the magnetic field.

[0170] refer to Figure 8D A concentration gradient can be formed in the first solution PR1. That is, the concentration of the light-blocking particles BL can increase along the third direction DR3.

[0171] The light-blocking particles BL can be arranged in the plan view with the edge portion EG (reference). Figure 8C )overlapping.

[0172] refer to Figure 8E In the edge portion EG (reference) Figure 8C In one region of the substrate HTG, light-blocking particles BL can be disposed between the substrate HTG and the polymer resin PRS. Disposed in the edge portion EG (reference). Figure 8C The light-blocking particles BL in this area can cover the substrate HTG. Arranged in the edge portion EG (reference) Figure 8C The light-blocking particles BL in one of the regions can come into contact with the substrate HTG.

[0173] In the edge portion EG (reference) Figure 8C In another region of the membrane, light-blocking particles BL can be arranged between the guiding film GF and the polymer resin PRS.

[0174] refer to Figure 7 and Figure 8F Light-blocking particles (BL) and polymer resin (PRS) can be cured to form a black matrix (BM).

[0175] When the magnet MG is placed below the guiding film GF, the direction of the magnetic field can be the third direction DR3, and the light-blocking particles BL with ferromagnetism can move in the direction DRa (reference). Figure 8D Move on the first solution PR1 and the edge portion EG in the plan view (reference). Figure 8C When there is no substrate HTG between the overlapping magnets MG, the light-blocking particles BL can move in the first solution PR1 in the direction DRa (refer to...). Figure 8D It can move on the surface and can be arranged in the same plane as the lower surface of the substrate HTG.

[0176] refer to Figure 7 , Figure 8E and Figure 8F The light-blocking particles BL and polymer resin PRS can be cured by ultraviolet light (UV) to form a black matrix BM and a coating CA (step S500).

[0177] Polymer resin PRS can be a light-curable material that is cured by light. After the light-blocking particles BL are moved by a magnetic field, the curing process can be performed by irradiating them with ultraviolet light (UV). Therefore, the light-blocking particles BL can be placed at a desired location by changing the direction of the magnetic force, and the black matrix BM can be formed through the curing process.

[0178] Unlike this disclosure, where a black matrix and coating are formed by printing and curing a black matrix followed by coating and curing a polymer resin, a two-stage curing process is required. However, according to this disclosure, the light-blocking particles BL and the polymer resin PRS can be cured by ultraviolet light (UV) to simultaneously form the black matrix BM and the coating CA. Accordingly, the window manufacturing process can be effectively simplified.

[0179] Furthermore, according to this disclosure, a black matrix BM and a coating CA can be formed simultaneously using UV-curable light-blocking particles BL and polymer resin PRS. Therefore, expansion and voids that may occur when the black matrix BM is formed before the coating CA can be prevented or eliminated. Expansion may occur when the black matrix stretches or sags due to gravity, and voids may occur during coating formation due to step differences within the black matrix. According to this disclosure, delamination of the black matrix BM can be prevented. Accordingly, the method for manufacturing windows and the window WM (see reference) can be improved. Figure 6A The reliability of ).

[0180] refer to Figure 7 and Figure 8G The edge portion EG can be partially cut using laser cutting technology (see reference). Figure 8C ).exist Figure 8G In the example shown, a laser beam LZ is irradiated along the side of the substrate HTG onto the third-direction DR3, but according to embodiments of this disclosure, the edge portion EG is laser-cut (see reference). Figure 8C The cutting range should not be limited to or restricted by this. As an example, in a plan view, the laser beam LZ can irradiate the area where the black matrix BM is disposed between the coating CA and the substrate HTG on the third-direction DR3.

[0181] refer to Figure 7 and Figure 8H The method for manufacturing a window according to this disclosure may further include: flipping the substrate HTG and coating CA; and removing the guide film GF.

[0182] In the flipping of the substrate HTG and the coating CA, the substrate HTG can be placed on the coating CA, and the black matrix BM can be placed on the third-direction DR3 between the substrate HTG and the coating CA. Figure 8H The positions of the substrate HTG and the coating CA are shown. Figure 8G The example shown is a window WM that has been inverted compared to a window WM. The window WM can be attached to the display module DM (see reference). Figure 6A Top adhesive layer AP-R (reference) Figure 6A This can be set in the window WM and the display module DM (see reference). Figure 6A )between.

[0183] Unlike this disclosure, when a protective layer is present on the upper surface of the substrate, a black matrix can be formed using a micro-dry decoration process (MDD). However, according to this disclosure, the upper surface of the substrate HTG can be flat without a separate protective layer. This can improve the surface quality of the display device DD. It can provide users with high-quality image IM (referencing...) Figure 3A ).

[0184] Furthermore, unlike this disclosure, when a black matrix is ​​formed via a micro-dry decoration process (MDD), the substrate may be damaged, and when a black matrix is ​​formed via other printing processes, swelling or voids may occur. However, according to the manufacturing window method of this disclosure, a first solution PR1 (see reference PR1) can be used. Figure 8B ) and the second solution PR2 (reference) Figure 8C Simultaneously forming the black matrix BM and coating CA eliminates the need for the processes described above. Consequently, the method of window manufacturing can be effectively simplified. Expansion or void phenomena can be effectively prevented. Therefore, the method of window manufacturing and the reliability of the window WM can be improved.

[0185] Figure 9A This is a view illustrating the process of a manufacturing window according to an embodiment of the present disclosure. Figure 9A In the figures, the same reference numerals indicate the same as... Figure 8D The components in the text are the same as those in the text, and therefore, detailed descriptions of the same components will be omitted.

[0186] refer to Figure 9A A magnet MG can be placed on the guide film GF. In this case, the direction of the magnetic field can be opposite to the third direction DR3. A light-blocking particle BL with ferromagnetism can move in the direction of movement DRb. The light-blocking particle BL can be spaced apart from the substrate HTG and can be in contact with the guide film GF.

[0187] Figure 9B This is a view illustrating the process of a manufacturing window according to an embodiment of the present disclosure. Figure 9B In the figures, the same reference numerals indicate the same as... Figure 8F The components in the text are the same as those in the text, and therefore, detailed descriptions of the same components will be omitted.

[0188] refer to Figure 9A and Figure 9B The light-blocking particles BL and polymer resin PRS can be cured by ultraviolet light (UV) to form a black matrix BM1 and a coating CA.

[0189] The black substrate BM1 can be disposed on the coating CA. The black substrate BM1 can be spaced apart from the substrate HTG, and the coating CA can be disposed between the black substrate BM1 and the substrate HTG.

[0190] Then, the window WM1 can be partially cut by laser cutting, and can be manufactured by flipping the substrate HTG and coating CA and removing the guide film GF.

[0191] Figure 10 This is a cross-sectional view showing a portion of an electronic device according to an embodiment of the present disclosure. Figure 10 In the middle, there will be no repetition with the reference. Figure 6A The descriptions are the same, and the focus will be on explaining the differences.

[0192] refer to Figure 10 The electronic device EA1 may include a window WM1, an upper adhesive layer AP-R, and a display module DM. The upper adhesive layer AP-R may be disposed between the window WM1 and the display module DM.

[0193] Window WM1 may include substrate HTG, coating CA, and black matrix BM1. Black matrix BM1 may be in direct contact with the upper adhesive layer AP-R.

[0194] and Figure 6A The window shown is WM (reference). Figure 6A )compared to, Figure 10 The window WM1 shown differs in the placement of the black substrate BM1. The black substrate BM1 can be positioned between the coating CA and the upper adhesive layer AP-R.

[0195] Figure 11A This is a view illustrating the process of a manufacturing window according to an embodiment of the present disclosure. Figure 11A In the figures, the same reference numerals indicate the same as... Figure 8D The components in the text are the same as those in the text, and therefore, detailed descriptions of the same components will be omitted.

[0196] refer to Figure 11A When the magnet MG is placed on the side surface of the guide film GF, the direction of the magnetic field can be the second direction DR2, or it can be opposite to the second direction DR2. The ferromagnetic light-blocking particles BL can move in the first moving direction DRc or the second moving direction DRd. The light-blocking particles BL can be placed on the side surface of the substrate HTG and the side surface of the coating CA.

[0197] Figure 11B This is a view illustrating the process of a manufacturing window according to an embodiment of the present disclosure. Figure 11B In the figures, the same reference numerals indicate the same as... Figure 8FThe components in the text are the same as those in the text, and therefore, detailed descriptions of the same components will be omitted.

[0198] refer to Figure 11A and Figure 11B The light-blocking particles BL and polymer resin PRS can be cured by ultraviolet light (UV) to form a black matrix BM2 and a coating CA.

[0199] In the plan view and the central part of the CT (reference) Figure 8C The sum of the first thickness t1 of the overlapping substrate HTG and the thickness t4 of the coating CA can be substantially the same as the thickness of the black matrix BM2. In this disclosure, the term "substantially the same" means both the case where the physical measurements are exactly the same and the case where the difference falls within the allowable range of process error (e.g., 10%).

[0200] The black matrix BM2 can be disposed adjacent to the side surface of the substrate HTG and the side surface of the coating CA. In a plan view, the black matrix BM2 may not overlap with the substrate HTG.

[0201] Then, the window WM2 can be partially cut by laser cutting, and can be manufactured by flipping the substrate HTG and coating CA and removing the guide film GF.

[0202] Figure 12 This is a cross-sectional view showing a portion of an electronic device according to an embodiment of the present disclosure. Figure 12 In the middle, there will be no repetition with the reference. Figure 6A The descriptions are the same, and the focus will be on explaining the differences.

[0203] refer to Figure 12 The electronic device EA2 may include a window WM2, an upper adhesive layer AP-R, and a display module DM. The upper adhesive layer AP-R may be disposed between the window WM2 and the display module DM.

[0204] The window WM2 may include a substrate HTG, a coating CA, and a black matrix BM2. The black matrix BM2 may be disposed on the side surface of each of the substrate HTG and the coating CA.

[0205] and Figure 6A The window shown is WM (reference). Figure 6A )compared to, Figure 12 The window WM2 shown varies in the placement of the black substrate BM2. The black substrate BM2 can be positioned adjacent to the side surface of each of the substrate HTG and the coating CA. In the plan view, the black substrate BM2 may not overlap with the display module DM.

[0206] Although embodiments of this disclosure have been described, it is to be understood that this disclosure should not be limited to these embodiments, but rather that various changes and modifications can be made by those skilled in the art within the spirit and scope of the claimed disclosure.

[0207] Therefore, the subject matter disclosed herein should not be limited to any single embodiment described herein, and the scope of the invention should be determined by the claims.

Claims

1. A method of manufacturing a window, the window including a folded region, a first non-folded region adjacent to one side of the folded region, and a second non-folded region adjacent to the opposite side of the folded region, and the window including a substrate, a coating disposed under the substrate, and a black matrix, the method comprising: The substrate is placed in a guide film that contains the substrate and is provided with an opening, the opening being defined to extend through the guide film to overlap with a portion of the substrate in a plan view; A first solution comprising light-blocking particles and a polymer resin is provided to the edge portion of the interior space of the guide film, wherein the interior space is divided into a central portion that overlaps with the opening in the plan view and the edge portion located outside the central portion; A second solution containing the polymer resin is provided to the central portion; The magnet is positioned to overlap with the edge portion in the plan view, so that the light-blocking particles can move by means of the magnet; as well as The light-blocking particles and the polymer resin are cured using ultraviolet light to form the black matrix and the coating.

2. The method of claim 1, wherein, The coating includes a first surface adjacent to the substrate and a second surface opposite to the first surface, and a portion of the first surface has a raised shape facing the substrate.

3. The method of claim 1, wherein, The substrate includes: The first part overlaps with the first non-folded region; The second part overlaps with the second non-folded region; and The third part overlaps with the folded region and has a thickness smaller than that of the first part and the second part, and the third part has curvature.

4. The method according to claim 1, further comprising: The edge portion is partially cut using a laser beam; Flip the substrate and the coating; as well as Remove the guiding membrane.

5. The method of claim 1, wherein, The light-blocking particles have ferromagnetic and light-blocking properties.

6. The method of claim 1, wherein, The light-blocking particles are formed by coating a first material with light-blocking properties onto a first portion having ferromagnetic properties.

7. The method of claim 1, wherein, The light-blocking particles include Fe, Co, Ni, Mn, Fe2O3, or Fe3O4.

8. The method of claim 1, wherein, The guiding film comprises a transparent material that transmits the ultraviolet light.

9. The method of any one of claims 1 to 8, wherein, Placing the magnet to overlap with the edge portion includes: The magnet is placed below the guiding film so that the light-blocking particles come into contact with the substrate.

10. The method of any one of claims 1 to 8, wherein, Placing the magnet to overlap with the edge portion includes: The magnet is placed on the guiding film so that the light-blocking particles are separated from the substrate and come into contact with the guiding film.

11. The method of any one of claims 1 to 8, wherein, Placing the magnet to overlap with the edge portion includes: The magnet is placed on the side surface of the guiding film so that the light-blocking particles are arranged on the side surface of the substrate.

12. The method of any one of claims 1 to 8, wherein, Curing the light-blocking particles and the polymer resin includes simultaneously forming the black matrix and the coating.

13. An electronic device, comprising: The window includes a folded area, a first non-folded area adjacent to one side of the folded area, and a second non-folded area adjacent to the opposite side of the folded area. The display module is located below the window; as well as The outer casing houses the display module. The window includes a substrate, a coating disposed beneath the substrate, and a black matrix. The substrate has a recessed shape in the folded region, the coating has a raised shape in the folded region, the substrate is spaced apart from the display module, the coating is disposed between the substrate and the display module, and the black matrix has ferromagnetic and light-blocking properties.

14. The electronic device of claim 13, further comprising: An adhesive layer is disposed below the window. The display module is located below the adhesive layer.

15. The electronic device according to claim 13, wherein, The black matrix comprises multiple light-blocking particles.

16. The electronic device according to claim 15, wherein, Each of the light-blocking particles includes: The first part has the aforementioned ferromagnetism; and A first material is coated on the first portion and has the light-blocking properties.

17. The electronic device according to claim 15, wherein, Each of the light-blocking particles comprises Fe, Co, Ni, Mn, Fe2O3, or Fe3O4.

18. The electronic device according to any one of claims 13 to 17, wherein, The black matrix is ​​disposed between the substrate and the coating.

19. The electronic device according to claim 14, wherein, The black matrix is ​​disposed between the coating and the adhesive layer.

20. The electronic device according to any one of claims 13 to 17, wherein, The black matrix is ​​disposed adjacent to the side surface of the substrate and the side surface of the coating, and the black matrix does not overlap with the display module in a plan view.

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