A micro-powder filling and microcrystalline fitting composite production line

The micro-powder filling and microcrystalline bonding composite production line, equipped with multiple robotic arms and a vortex dust removal device, has solved the problems of powder overflow and dust generation, achieving high-precision powder filling and microcrystalline bonding, and improving equipment stability and product quality.

CN122355080APending Publication Date: 2026-07-10XIAMEN YOUXIN TECHNOLOGY CO LTD
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Patent Information

Application Number
CN202610449636.7
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2026-04-07
Publication Date
2026-07-10

AI Technical Summary

Technical Problem

In the existing technology, during the micro-powder filling and microcrystalline bonding process of cylindrical workpieces, powder overflow and dust problems lead to a decrease in operational accuracy, affecting the stability of equipment operation and product quality.

Method used

The micro-powder filling and microcrystalline bonding composite production line adopts multiple robotic arms and a dedicated dust removal device, including a primary vibration powder feeding device, a primary pressing device, and a secondary vibration powder feeding and pressing device. Combined with a vortex dust removal device and elastic connectors, it achieves efficient dust removal and precise powder feeding.

Benefits of technology

It significantly improves the accuracy of powder filling and the cleanliness of the equipment, avoids powder overflow and accumulation, improves the parallelism and bonding quality of the products, and solves the problems of powder shedding and cross-contamination in traditional methods.

✦ Generated by Eureka AI based on patent content.

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Abstract

The application provides a micro-powder filling and micro-crystal fitting composite production line, which comprises a plurality of mechanical arms and wafer fitting equipment, a primary vibration powder supply device and a primary pressing device, and a powder secondary vibration powder supply pressing device; the mechanical arms are arranged between the primary vibration powder supply device and the primary pressing device, between the primary pressing device and the wafer fitting equipment, between the wafer fitting equipment and the secondary vibration powder supply device, and between the secondary vibration powder supply device and the secondary pressing device to link the feeding and discharging; the primary vibration powder supply device is provided with a first dust removal device, the primary pressing device is also provided with a first pressing dust removal mechanism, the powder secondary adding device is provided with a secondary dust removal mechanism, and the powder secondary pressing device is provided with a second pressing dust removal mechanism, so that surface dust removal can be performed in time after the powder is added and after the powder is pressed, and the overflowed powder can be avoided from being brought into the next station; and the relay operation of the plurality of mechanical arms replaces the traditional flow channel transmission.
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