A MEMS structure and a MEMS sensor for optimizing anchor design

Abstract

The application discloses a MEMS structure and a MEMS sensor for optimizing anchor point design, comprising a structure anchor point, an elastic beam group, a movable mass block, a differential capacitor group, a Cap layer and a Sub layer; wherein the structure anchor point comprises three groups of sensitive structure anchor points and lead anchor points corresponding to the three groups of sensitive structure anchor points, the sensitive structure anchor points are connected with the lead anchor points through the elastic beam group; the first group and the third group of sensitive structure anchor points are connected with the movable mass block through the differential capacitor group respectively, and the second group of sensitive structure anchor points is connected with the movable mass block through the elastic beam group; the sensitive structure anchor points are anchored with the Cap layer and are not anchored with the Sub layer, the lead anchor points are anchored with the Cap layer and the Sub layer. The application suspends the MEMS movable structure, effectively blocks the direct transmission path of the packaging stress to the MEMS anchor point, and makes the stress need to be transmitted through a more tortuous path, so that the transmission distance is significantly increased, and the stress acting on the MEMS anchor point is greatly attenuated.

Description

Technical Field

[0001] This invention relates to MEMS sensors, specifically a MEMS structure and MEMS sensor with optimized anchor point design. Background Technology

[0002] MEMS sensors operate based on the unique effects of their sensitive materials. Their fabrication process combines advanced IC microelectronics processing and MEMS micromachining manufacturing techniques. Through micromachining of materials, stable structural devices (such as single or composite structures like beams, membranes, and interdigitates) capable of sensing various parameters like pressure, temperature, magnetic fields, and acceleration are created, enabling the perception, testing, and conversion of various relevant parameters. Examples include pressure sensors based on the piezoresistive effect of semiconductor silicon, micro-accelerometers based on the piezoelectric effect of quartz, and micro-displacement sensors based on the stretching effect of magnetostrictive materials.

[0003] In MEMS inertial sensors, zero-bias temperature drift is a key indicator affecting their performance reliability in high-precision navigation, positioning, and motion control applications. The root of this problem lies in the mismatch of coefficients of thermal expansion (CTE) among various materials within the sensor module. During temperature changes, the inconsistent expansion and contraction of these materials leads to internal thermal stress, causing unexpected deformation of the sensitive structure. This ultimately results in zero-point signal shift and its nonlinear drift with temperature, significantly reducing the sensor's accuracy and stability. This is a critical technical bottleneck restricting its application in high-precision fields such as inertial navigation and precision industrial control.

[0004] Currently, the process cross-section of most MEMS inertial devices is as follows: Figure 1 As shown, from bottom to top, the structure mainly consists of a MEMS substrate (Sub layer), a structural layer, and a MEMS cap (Cap layer). Other thin film layers serve as intermediate dielectric layers and metal interconnect layers to achieve structural bonding, electrical lead-out, and insulation isolation. In this architecture, the MEMS substrate acts as a mechanical support carrier; the MEMS structural layer is fixed to the substrate through bonding processes and contains movable sensing elements formed by micromachining processes, such as suspended mass blocks, elastic beams, and comb-like structures; the MEMS cap is bonded to the MEMS structural layer, forming an airtight cavity, thereby providing the necessary vacuum-sealed environment and external mechanical protection for the sensing structure.

[0005] However, in applications requiring high precision and stability, the aforementioned structure is susceptible to thermal stress caused by temperature changes. Specifically, for example... Figure 1As shown by the red arrow, stress is generated from the packaging substrate, transmitted vertically to the MEMS substrate via a short path, and further transmitted to the structural anchor point, causing additional stress-induced strain (displacement) in the sensitive mass block. This causes the zero point of the MEMS sensor to drift with temperature, making it difficult to meet the performance requirements of long-term stability and temperature reliability for this type of application. Summary of the Invention

[0006] To address the shortcomings of the prior art, this invention provides a MEMS structure and MEMS sensor with optimized anchor point design. This invention suspends the movable MEMS structure, effectively blocking the direct transmission path of packaging stress to the MEMS anchor point. The stress needs to be transmitted through a more tortuous path, significantly increasing the transmission distance and resulting in a substantial reduction in the stress ultimately acting on the MEMS anchor point.

[0007] To achieve the above technical objectives, the present invention adopts the following technical solution: a MEMS structure with optimized anchor point design, including structural anchor points, elastic beam groups, movable mass blocks, differential capacitor groups, Cap layers, and Sub layers; The structural anchor points include three sets of sensitive structural anchor points and corresponding lead wire anchor points, and the sensitive structural anchor points and the lead wire anchor points are connected by the elastic beam group. The differential capacitor groups are respectively set between the sensitive structural anchor points of the first and third groups and the movable mass block, and the sensitive structural anchor points of the second group are connected to the movable mass block through the elastic beam group; The sensitive structure anchor point is anchored to the Cap layer but not to the Sub layer, while the lead wire anchor point is anchored to the Cap layer and to the Sub layer.

[0008] The elastic beam group includes a folded elastic beam, a swinging elastic beam, and a folded beam. The sensitive structure anchor point and the lead wire anchor point are connected through the folded elastic beam. The second group of sensitive structure anchor points are connected to the movable mass block through the swinging elastic beam and the folded beam.

[0009] The folding elastic beam has a square wave structure; the end of the swinging elastic beam is provided with a first connection point, the movable mass block is provided with a second connection point, the free end of the second connection point is connected to the folding beam, and the other end of the folding beam is connected to the first connection point. The swinging elastic beam has a swing arm structure, and the folding beam has a square wave structure.

[0010] The Cap layer is provided with a main platform, and the at least three sets of sensitive structural anchor points are all anchored to the main platform.

[0011] The Cap layer is provided with Cap sub-units, the number of which is the same as the number of lead wire anchors, and one lead wire anchor is anchored to one Cap sub-unit.

[0012] The Sub layer is provided with Sub sub-units, the number of which is the same as the number of lead wire anchors, and one lead wire anchor is anchored to one Sub sub-unit; the Cap sub-unit corresponds one-to-one with the Sub sub-unit.

[0013] The differential capacitor bank is a comb electrode or a flat plate electrode.

[0014] Each set of sensitive structure anchor points includes two symmetrically arranged movable side anchor points, with a lead wire anchor point located in the middle of the two symmetrically arranged movable side anchor points, and the lead wire anchor point is located at the center of the MEMS structure.

[0015] Each group of sensitive structure anchors includes one sensitive structure anchor, which is located at the center of the MEMS structure. The sensitive structure anchors of the first and third groups are each connected to one lead anchor. The two lead anchors are centrally symmetrical about the sensitive structure anchor of the second group. The sensitive structure anchor of the second group is connected to two lead anchors, which are also centrally symmetrical about the sensitive structure anchor of the second group.

[0016] A MEMS sensor includes a MEMS structure with an optimized anchor point design.

[0017] In summary, the present invention has achieved the following technical effects: This invention optimizes the MEMS structure design by differentiating the structural anchor points into sensitive structure anchor points and lead wire anchor points. The sensitive structure anchor points connected to the MEMS structure are anchored to the Cap, thereby making the MEMS sensitive structure suspended in the cavity of the MEMS chip. This effectively blocks the direct transmission of external stress to the sensitive area, significantly reduces the impact of thermomechanical stress on device performance, and thus improves the zero-bias stability and temperature reliability of the sensor. This invention has good compatibility with existing MEMS process platforms. It can be realized simply by optimizing the MEMS structure design based on the existing process. There is no need to introduce complex or additional process modules, which has high feasibility and industrialization capability. Compared with existing solutions, this invention is expected to significantly improve stress under the same packaging design. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of the structure of existing MEMS inertial devices; Figure 2This is a front view of a MEMS structure with optimized anchor point design provided in Embodiment 1; Figure 3 yes Figure 2 Top view of the structure within the dashed line section; Figure 4 This is a schematic diagram comparing the widths of a swing-type elastic beam and a folding beam; Figure 5 This is a schematic diagram showing the position between the second set of sensitive structural anchor points and the mass block; Figure 6 This is a schematic diagram showing the locations of the first and third groups of sensitive structural anchor points; Figure 7 yes Figure 3 A cross-sectional schematic diagram of the bonding layer completed in the AA direction; Figure 8 yes Figure 3 A cross-sectional schematic diagram of the bonding layer completed in the middle BB direction; Figure 9 yes Figure 2 Schematic diagram of structural stress transfer path; Figure 10 This is a partial top view of a MEMS structure with optimized anchor point design provided in Embodiment 2; Figure 11 It is the MEMS structure of the planar electrode corresponding to Example 1. Detailed Implementation

[0019] The present invention will be further described in detail below with reference to the accompanying drawings.

[0020] This specific embodiment is merely an explanation of the present invention and is not intended to limit the invention. After reading this specification, those skilled in the art can make modifications to this embodiment without contributing any inventive step, but such modifications are protected by patent law as long as they are within the scope of the claims of the present invention.

[0021] In the description of this invention, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0022] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this invention, "a plurality of" means two or more, unless otherwise explicitly specified.

[0023] In this invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0024] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "over," and "on top" of the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0025] Example: A MEMS structure with optimized anchor point design includes a structural anchor point 1, an elastic beam group 2, a movable mass block 3, a differential capacitor group 4, a Cap layer, and a Sub layer. The Cap layer (Capacitor) is the upper layer of the MEMS structure, the Sub layer (Substrate) is the lower layer of the MEMS structure, and the movable mass block 3 is a structural layer located between the Cap layer and the Sub layer.

[0026] This invention places the anchor point supporting the movable MEMS structure on the top surface (Cap) of the chip. Within the package, the movable MEMS structure is suspended, avoiding direct stress transmission to the MEMS structure and reducing the stress sensitivity of the MEMS structure.

[0027] The structural anchor point 1 includes three sets of sensitive structural anchor points 11 and corresponding lead wire anchor points 12 for the three sets of sensitive structural anchor points 11. The sensitive structural anchor points 11 and the lead wire anchor points 12 are connected by an elastic beam group 2. Differential capacitor groups 4 are respectively set between the first and third sets of sensitive structural anchor points 11 and the movable mass block 3. The second set of sensitive structural anchor points 11 is connected to the movable mass block 3 through the elastic beam group 2.

[0028] The elastic beam group 2 includes a folded elastic beam 21, a swinging elastic beam 22, and a folded beam 23. The sensitive structural anchor point 11 and the lead wire anchor point 12 are connected through the folded elastic beam 21. The second group of sensitive structural anchor points 11 are connected to the movable mass block 3 through the swinging elastic beam 22 and the folded beam 23.

[0029] This invention designs elastic beam structures with different structures and functions, which can be adapted to the connection between anchor points. This invention is used for the connection between sensitive structural anchor point 11 and lead wire anchor point 12, and is also adapted to the connection between anchor point and mass block. This invention is used for the connection between sensitive structural anchor point 11 and movable mass block 3.

[0030] Furthermore, the folded elastic beam 21 is a square wave structure (also known as a serpentine structure); specifically, it can be a square wave structure with a duty cycle of 50%, 75%, or 25%. In this embodiment, it is a square wave structure with a duty cycle of 50%, which can effectively release the stress of the lead wire anchor point 12 while maintaining low stiffness between anchor points, reduce the stress transmitted to the sensitive structure anchor point 11, and thus optimize the sensor performance.

[0031] The end of the swing elastic beam 22 is provided with a first connection point 221, and the movable mass block 3 is provided with a second connection point 31. The free end of the second connection point 31 is connected to the folding beam 23, and the other end of the folding beam 23 is connected to the first connection point 221. The swing elastic beam 22 is a swing arm structure, and the folding beam 23 is a square wave structure.

[0032] The folding beam 23 can be a square wave structure with a duty cycle of 50%, 75%, or 25%. In this embodiment, it is a square wave structure with a duty cycle of 50%, which can maintain a low stiffness between the anchor point and the mass block, release the stress at the mass block, and reduce the stress transmitted to the sensitive structure anchor point 11.

[0033] Furthermore, such as Figure 4 As shown, the width L2 of the folded beam 23 in the front-to-back direction is larger than that of the width L1 of the swing elastic beam 22, which can greatly hinder the transmission of stress from the mass block to the sensitive structure anchor point 11.

[0034] To better illustrate the structure of the three sets of sensitive structural anchor points 11, this application displays the first and third sets separately. Figure 5This is a schematic diagram showing the position of the second set of sensitive structural anchor points 11 relative to the mass block. Figure 6 This is a schematic diagram showing the positions of the first and third groups of sensitive structural anchor points 11.

[0035] Among them, such as Figure 5 As shown, the second set of sensitive structural anchor points 11 and lead wire anchor points 12 are connected by a folded elastic beam 21, and the sensitive structural anchor points 11 are connected to the movable mass block 3 by a swinging elastic beam 22 and a folded beam 23. The second set of sensitive structural anchor points 11 is located at the center of the entire structure, maintaining symmetry and good balance.

[0036] like Figure 6 As shown, the first and third groups are centrally symmetrical. The sensitive structure anchor points 11 and lead wire anchor points 12 in these two groups are connected by a folded elastic beam 21. The sensitive structure anchor points 11 are directly equipped with a fixing structure 42, combined with... Figure 5 The inner wall of the movable mass block 3 is also provided with a movable structure 41. The movable structure 41 and the fixed structure 42 are combined to form a differential capacitor group 4, forming a differential capacitor to realize electromechanical conversion and realize the detection of acceleration signal.

[0037] To further reduce stress transmission, the present invention also provides that: the sensitive structure anchor point 11 is anchored to the Cap layer but not to the Sub layer; the lead wire anchor point 12 is anchored to the Cap layer and to the Sub layer; and the electrical signal is led out through the anchor point between the lead wire and the Sub layer.

[0038] In this invention, the sensitive structure anchor point 11 is unaffected by substrate stress, while the lead anchor point 12 is affected by substrate stress, but this stress is not transmitted to the MEMS structure. Therefore, the stress effect on the MEMS structure is greatly reduced, effectively reducing zero-point temperature drift.

[0039] Specifically, the Cap layer is equipped with a main platform 5, and at least three sets of sensitive structural anchor points 11 are anchored to the main platform 5.

[0040] The Cap layer is provided with Cap sub-units 6, and the number of Cap sub-units 6 is the same as the number of lead wire anchor points 12. One lead wire anchor point 12 is anchored to one Cap sub-unit 6.

[0041] The Sub layer is provided with Sub sub-units 7, the number of which is the same as the number of lead wire anchors 12, and one lead wire anchor 12 is anchored to one Sub sub-unit 7; Cap sub-units 6 correspond one-to-one with Sub sub-units 7.

[0042] This invention anchors the sensitive structure anchor points 11 to the same main body, so that the response to the force will be synchronized, thereby reducing temperature drift. Each lead anchor point 12 is provided with a Cap sub-body and a Sub sub-body, so that the influence of stress will be asynchronous, thereby reducing the influence of the Sub layer on the Cap layer, and reducing the influence of temperature changes on the output zero position.

[0043] The connection between the sensitive structural anchor point 11 and the main body is a bonding ring anchor, and the connection between the lead anchor point 12 and a Cap sub-sub ...

[0044] In this invention, the differential capacitor group 4 is a comb electrode or a flat plate electrode.

[0045] Example 1: Figure 2 This is a front view of a MEMS structure with optimized anchor point design provided in Embodiment 1. Figure 3 yes Figure 2 Top view of the structure within the dashed line section. Figure 4 This is a schematic diagram comparing the widths of the swing-type elastic beam 22 and the folding beam 23. Figure 5 This is a schematic diagram showing the position of the second set of sensitive structural anchor points 11 relative to the mass block. Figure 6 This is a schematic diagram showing the locations of the first and third groups of sensitive structural anchor points 11. Figure 7 yes Figure 3 A cross-sectional schematic diagram of the bonding layer completed in the AA direction. Figure 8 yes Figure 3 A cross-sectional schematic diagram of the bonding layer in the middle BB direction.

[0046] like Figure 3 As shown, for structural symmetry, each set of sensitive structure anchor points 11 includes two symmetrically arranged movable side anchor points 111, and a lead wire anchor point 12 is arranged in the middle of the two symmetrically arranged movable side anchor points 111. The lead wire anchor point 12 is located at the center of the MEMS structure.

[0047] In this embodiment, there are three sets of sensitive structure anchor points 11, including three lead anchor points 12 and six movable side anchor points 111. The three lead anchor points 12 are arranged on the center line of the MEMS structure and are symmetrically and spaced apart. The six movable side anchor points 111 are symmetrical in each group and are further symmetrical with the second group of lead anchor points 12 (the middle lead anchor point 12).

[0048] Two swing-type elastic beams 22 are symmetrically arranged with respect to the center line of the MEMS structure, and two folded beams 23 are also symmetrically arranged with respect to the center line of the MEMS structure.

[0049] In this embodiment, the six folded elastic beams 21 are symmetrical about the centerline of the MEMS structure.

[0050] In summary, the MEMS structure in this embodiment is a symmetrical structure. A symmetrical structure allows environmentally induced common-mode interference (such as temperature changes, packaging stress, and external vibrations) to produce effects of equal magnitude and the same direction on the symmetrical branches. The interference signals can be subtracted and canceled out, while the actual sensing signals (such as acceleration and angular velocity) are in opposite directions on the symmetrical branches and are thus amplified. This significantly improves the signal-to-noise ratio and measurement accuracy. Furthermore, the symmetrical design results in a more uniform stress distribution, etching rate, and material properties on the silicon wafer, reducing manufacturing deviations. Simultaneously, it helps to clearly separate the device's operating modes from parasitic modes, simplifying mechanical design.

[0051] Combination Figure 7 and Figure 8 In this embodiment, the six movable side anchor points 111 are divided into left and right parts. The three movable side anchor points 111 on the left side are anchored to the same main body 5, and the three movable side anchor points 111 on the right side are also anchored to the same main body 5. The three lead wire anchor points 12 each correspond to a Cap sub-base 6 and a Sub sub-base 7. The Cap sub-base 6 and the Sub sub-base 7 are aligned in the vertical direction to form a good and stable support.

[0052] Figure 9 yes Figure 2 The diagram illustrates the stress transmission path, with red arrows indicating the stress transmission route. This invention significantly improves the stress transmission path by anchoring the MEMS sensitive structure anchor point to the Cap. Stress from the packaging substrate must travel through a significantly extended transmission path to reach the sensitive structure anchor point 11 (sensitive structure region). This extended path effectively attenuates the stress value, thereby greatly reducing its impact on the sensitive area. Thanks to this structural optimization, the device can maintain excellent zero-position stability within its operating temperature range.

[0053] In this embodiment, the differential capacitor group 4 uses a comb electrode.

[0054] Example 2: Unlike Embodiment 1, this embodiment places the lead anchor point 12 at the center of the MEMS structure and the sensitive structure anchor point 11 on both sides: Figure 10 This is a partial top view of a MEMS structure with optimized anchor point design provided in Embodiment 2, corresponding to Embodiment 1. Figure 3 .

[0055] Each group of sensitive structure anchors 11 includes one sensitive structure anchor 11, which is located at the center of the MEMS structure. The first and third groups of sensitive structure anchors 11 are each connected to a lead anchor 12. The two lead anchors 12 are centrally symmetrical about the sensitive structure anchor 11 of the second group. The sensitive structure anchor 11 of the second group is connected to two lead anchors 12, which are also centrally symmetrical about the sensitive structure anchor 11 of the second group.

[0056] The sensitive structural anchor point 11 and the lead wire anchor point 12 are connected by a folded elastic beam 21, just like in Example 1.

[0057] In this embodiment, the length of the folded elastic beam 21 is greater than that in Embodiment 1, thereby increasing the distance between the lead anchor point 12 and the sensitive structure anchor point 11, reducing the influence of the substrate-lead anchor point, and further improving the stress effect.

[0058] The left and right sides of the second set of sensitive structure anchor points 11 are connected to the movable mass block 3 by swing elastic beams 22 and folding beams 23. Differential capacitor groups 4 are set between the first and third sets of sensitive structure anchor points 11 and the movable mass block 3, and the electrode structures of the two sets are centrally symmetrical with respect to the second set of sensitive structure anchor points 11.

[0059] The four lead anchor points 12 are symmetrical about the center line of the MEMS structure.

[0060] In this embodiment, the differential capacitor group 4 uses a comb electrode.

[0061] Example 3: In this embodiment, the differential capacitor bank 4 adopts a planar electrode structure. Figure 11 It is the MEMS structure of the planar electrode corresponding to Example 1.

[0062] Example 4: A MEMS sensor includes a MEMS structure with an optimized anchor point design.

[0063] MEMS sensors can include MEMS accelerometers, MEMS gyroscopes, MEMS vibration sensors, optical MEMS, RF MEMS, etc.

[0064] The above description is merely a preferred embodiment of the present invention and is not intended to limit the present invention in any way. Any simple modifications, equivalent changes, and alterations made to the above embodiments based on the technical essence of the present invention shall fall within the scope of the technical solution of the present invention.

Claims

1. A MEMS structure with optimized anchor point design, characterized in that: Includes structural anchor points (1), elastic beam groups (2), movable mass blocks (3), differential capacitor groups (4), Cap layer, and Sub layer; The structural anchor points include three sets of sensitive structural anchor points (11) and lead wire anchor points (12) corresponding to the three sets of sensitive structural anchor points (11). The sensitive structural anchor points (11) and the lead wire anchor points (12) are connected by the elastic beam group (2). The first and third groups of sensitive structural anchor points (11) are respectively provided with differential capacitor groups (4) between them and the movable mass block (3). The second group of sensitive structural anchor points (11) is connected to the movable mass block (3) through the elastic beam group (2). The sensitive structure anchor point (11) is anchored to the Cap layer but not to the Sub layer, and the lead anchor point (12) is anchored to the Cap layer and to the Sub layer.

2. The MEMS structure with optimized anchor point design according to claim 1, characterized in that: The elastic beam group (2) includes a folded elastic beam (21), a swing elastic beam (22), and a folded beam (23). The sensitive structure anchor point (11) and the lead wire anchor point (12) are connected through the folded elastic beam (21). The second group of sensitive structure anchor points (11) are connected to the movable mass block (3) through the swing elastic beam (22) and the folded beam (23).

3. The MEMS structure with optimized anchor point design according to claim 2, characterized in that: The folded elastic beam (21) has a square wave structure; the end of the swinging elastic beam (22) is provided with a first connection point (221), the movable mass block (3) is provided with a second connection point (31), the free end of the second connection point (31) is connected to the folded beam (23), and the other end of the folded beam (23) is connected to the first connection point (221). The swinging elastic beam (22) has a swing arm structure, and the folded beam (23) has a square wave structure.

4. The MEMS structure with optimized anchor point design according to claim 1, characterized in that: The Cap layer is provided with a main platform (5), and the at least three sets of sensitive structural anchor points (11) are all anchored to the main platform (5).

5. A MEMS structure with optimized anchor point design according to claim 1, characterized in that: The Cap layer is provided with Cap sub-units (6), the number of which is the same as the number of lead anchors (12), and one lead anchor (12) is anchored to one Cap sub-unit (6).

6. A MEMS structure with optimized anchor point design according to claim 5, characterized in that: The Sub layer is provided with Sub sub-units (7), the number of Sub sub-units (7) is the same as the number of lead anchors (12), and one lead anchor (12) is anchored to one Sub sub-unit (7); the Cap sub-unit (6) corresponds one-to-one with the Sub sub-units (7).

7. A MEMS structure with optimized anchor point design according to claim 1, characterized in that: The differential capacitor bank (4) is a comb electrode or a flat plate electrode.

8. A MEMS structure with optimized anchor point design according to any one of claims 1-7, characterized in that: Each set of the sensitive structure anchor points (11) includes two symmetrically arranged movable side anchor points (111), and a lead wire anchor point (12) is arranged in the middle of the two symmetrically arranged movable side anchor points (111), and the lead wire anchor point (12) is located at the center of the MEMS structure.

9. A MEMS structure with optimized anchor point design according to any one of claims 1-7, characterized in that: Each group of sensitive structure anchors (11) includes one sensitive structure anchor (11), which is located at the center of the MEMS structure. The first group and the third group of sensitive structure anchors (11) are each connected to one lead anchor (12). The two lead anchors (12) are centrally symmetrical with the sensitive structure anchor (11) of the second group as the center. The sensitive structure anchor (11) of the second group is connected to two lead anchors (12), which are also centrally symmetrical with the sensitive structure anchor (11) of the second group as the center.

10. A MEMS sensor, characterized in that: This includes a MEMS structure with an optimized anchor point design as described in any one of claims 1-9.

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