A two-component addition type silicone pouring sealant with excellent comprehensive performance and a preparation method and application thereof

Abstract

The application belongs to the technical field of pouring sealant, and particularly relates to a two-component addition type organic silicon pouring sealant with excellent comprehensive performance, a preparation method and application. The organic silicon pouring sealant provided by the application, on one hand, uses four kinds of particle size heat-conducting fillers, improves the mass ratio and type, significantly enhances the heat-conducting performance of the organic silicon pouring sealant and reduces the viscosity; on the other hand, uses a silane coupling agent with double reactive groups to modify the heat-conducting filler, forms a more stable 'double anchoring' structure in the organic silicon pouring sealant; and on the other hand, uses a latent type silicon hydrogen addition reaction catalyst, improves the stability of room temperature storage, and realizes slow release in the silicon hydrogen addition reaction process; so that through the improvement of the heat-conducting filler, the silane coupling agent and the catalyst and the like, the comprehensive performance of the organic silicon pouring sealant is significantly improved, the packaging of various high-power electronic components can be met, and the technical problem of low comprehensive performance of the organic silicon pouring sealant in the prior art is solved.

Description

Technical Field

[0001] This application belongs to the field of potting compound technology, and particularly relates to a two-component addition-type silicone potting compound with excellent comprehensive performance, its preparation method and application. Background Technology

[0002] Two-component addition-type silicone potting compounds are widely used as encapsulation materials for electronic components due to their excellent electrical insulation and stress buffering properties. However, with the rapid development of 800V high-voltage platforms for new energy vehicles, AI servers, and photovoltaic energy storage industries, the power density of electronic components is constantly increasing, which puts forward higher requirements for the thermal conductivity, processability, and long-term reliability of encapsulation materials, requiring silicone potting compounds to have excellent comprehensive performance.

[0003] Currently, two-component addition-type silicone potting compounds have low intrinsic thermal conductivity, typically requiring the addition of large amounts of thermally conductive fillers to achieve better thermal conductivity. However, with high filler content, the viscosity of the silicone potting compound increases dramatically, making it difficult to meet the requirements of automated dispensing processes. Furthermore, air bubbles cannot escape during thick-layer potting, leading to internal defects in the cured silicone potting compound. On the other hand, the thermally conductive filler has poor compatibility with the silicone potting compound matrix, and conventional silane coupling agents generally have limited modification effects, resulting in weak interfacial adhesion. After thermal cycling, the interfacial shear strength decays rapidly, easily leading to interfacial delamination, and the reliability of the encapsulation fails to meet automotive-grade requirements. Additionally, the B component of current silicone potting compounds usually contains hydrogen-containing silicone oil and catalysts, which slowly react at room temperature, easily forming cross-linking gels and exhibiting poor storage stability, making it difficult to meet the construction requirements for later mixing and curing with the A component. Therefore, it is necessary to improve the formulation of current two-component addition-type silicone potting compounds to provide silicone potting compounds with superior overall performance. Summary of the Invention

[0004] In view of this, this application provides a two-component addition-type silicone potting compound with excellent comprehensive performance, its preparation method and application, to solve the technical problem of low comprehensive performance of silicone potting compounds in the prior art.

[0005] The first aspect of this application provides a two-component addition-type silicone potting compound with excellent comprehensive performance, which is composed of component A and component B.

[0006] Component A of the adhesive includes: vinyl silicone oil, hydrosilylation inhibitor, thixotropic agent, and thermally conductive filler modified with silane coupling agent;

[0007] Component B of the adhesive includes: hydrogen-containing silicone oil, a latent hydrosilylation catalyst, a viscosity modifier, and a thermally conductive filler modified with a silane coupling agent.

[0008] The silane coupling agent is selected from silane coupling agents with two reactive groups, and one reactive group of the silane coupling agent can react with the thermally conductive filler, and the other reactive group can react with the silicone oil.

[0009] The thermally conductive filler is selected from four types of thermally conductive fillers with particle sizes D50 of 10~20μm, 1~3μm, 0.2~0.5μm and 50~80nm, respectively, and their number average molecular weight is 1500~2500.

[0010] Preferably, one of the reactive groups in the silane coupling agent is selected from epoxy groups, and the other reactive group is selected from vinyl or amino groups.

[0011] Preferably, the thermally conductive filler is selected from at least one of spherical alumina, hexagonal boron nitride, and nanodiamond.

[0012] Preferably, the mass ratio of the four types of thermally conductive fillers with particle sizes D50 of 10~20μm, 1~3μm, 0.2~0.5μm and 50~80nm is 60:25:10:5.

[0013] Preferably, the latent hydrosilylation reaction catalyst is selected from latent platinum-based catalysts. .

[0014] Preferably, the vinyl silicone oil is selected from methyl vinyl polysiloxane, with a viscosity of 1000~5000 mPa·s at 25°C and a vinyl content of 0.15%~0.35% by mass, while the hydrogen-containing silicone oil has a viscosity of 100~500 mPa·s at 25°C and a hydrogen content of 0.15%~0.45% by mass.

[0015] The hydrosilylation reaction inhibitor is selected from alkynyl alcohol hydrosilylation inhibitors and / or maleic acid hydrosilylation inhibitors;

[0016] The thixotropic agent is selected from hydrophobic fumed silica and / or nano-calcium carbonate, with a specific surface area of ​​150~300 m². 2 / g.

[0017] The viscosity modifier is selected from polydimethyl silicone oil and / or hydroxyl silicone oil, with a viscosity of 50~100 mPa·s at 25°C.

[0018] Preferably, by weight, the A component adhesive comprises: 100 parts by weight of vinyl silicone oil, 0.05 to 0.15 parts by weight of hydrosilylation inhibitor, 2 to 5 parts by weight of thixotropic agent, and 350 to 450 parts by weight of thermally conductive filler modified with silane coupling agent.

[0019] The B component adhesive comprises: 100 parts by weight of hydrogen-containing silicone oil, 0.3 to 0.8 parts by weight of latent hydrosilylation reaction catalyst, 1 to 3 parts by weight of viscosity modifier, and 350 to 450 parts by weight of silane coupling agent modified thermally conductive filler.

[0020] Preferably, the mass ratio of component A adhesive to component B adhesive is 1:1.

[0021] The second aspect of this application provides a method for preparing a two-component addition-type silicone potting compound with excellent comprehensive performance, which can prepare the two-component addition-type silicone potting compound with excellent comprehensive performance as described in the first aspect, including the following steps:

[0022] Preparation steps of silane coupling agent modified thermally conductive filler:

[0023] Vinyltrimethoxysilane or γ-aminopropyltriethoxysilane, together with γ-glycidoxypropyltrimethoxysilane, are added to an organic solvent and subjected to reflux condensation to obtain a silane coupling agent with two reactive groups.

[0024] Four types of thermally conductive fillers with particle sizes D50 of 10~20μm, 1~3μm, 0.2~0.5μm and 50~80nm were mixed and dispersed with a silane coupling agent with dual reactive groups to obtain a silane coupling agent modified thermally conductive filler.

[0025] Preparation steps of latent hydrosilylation reaction catalysts:

[0026] Chloroplatinic acid and etynylcyclohexanol were added to an organic solvent and heated and stirred to obtain a latent hydrosilylation reaction catalyst.

[0027] Preparation steps of component A and component B adhesive:

[0028] Vinyl silicone oil, hydrosilylation inhibitor, thixotropic agent and silane coupling agent modified thermally conductive filler were vacuum dispersed to obtain component A adhesive;

[0029] The B-component adhesive was obtained by vacuum dispersion of hydrogen-containing silicone oil, latent hydrosilylation catalyst, viscosity modifier, and silane coupling agent modified thermally conductive filler.

[0030] Preferably, in the preparation step of the silane coupling agent modified thermally conductive filler, the temperature of the condensation reflux reaction is 100~140℃ and the time is 4~8h;

[0031] The stirring and dispersion treatment is carried out at a stirring speed of 1000~1500 rpm, a temperature of 75~85℃, and a time of 1.5~2.5h.

[0032] Preferably, in the preparation step of the silane coupling agent modified thermally conductive filler, the sum of the masses of the four particle size thermally conductive fillers and the mass ratio of the silane coupling agent with dual reactive groups is 100:0.8~1.2.

[0033] Preferably, in the preparation step of the latent hydrosilylation reaction catalyst, the heating and stirring reaction temperature is 40~60℃ and the time is 1~3h.

[0034] Preferably, in the preparation step of the latent hydrosilylation reaction catalyst, the molar ratio of platinum atoms in the chloroplatinic acid to the ethynylcyclohexanol is 1:2~5.

[0035] Preferably, in the preparation steps of component A and component B adhesive, the vacuum dispersion treatment is carried out at a vacuum degree not greater than -0.095 MPa, the dispersion speed is 800~1500 rpm, and the time is 2~4 h.

[0036] The third aspect of this application provides the application of a two-component addition-type silicone potting compound with excellent comprehensive performance as described in the first aspect in the encapsulation of electronic components for new energy vehicles' 800V high-voltage platforms, AI servers, or photovoltaic energy storage.

[0037] Preferably, the electronic components are selected from IGBT power modules, new energy vehicle motor controllers, photovoltaic inverters, or energy storage converters.

[0038] Preferably, the thickness of the encapsulating potting compound is 2-5 cm.

[0039] Preferably, the curing temperature of the encapsulating potting compound is 80~100℃, and the curing time is 0.5~2h.

[0040] Compared with the prior art, the two-component addition-type silicone potting compound with excellent comprehensive performance provided in this application has at least the following beneficial effects:

[0041] 1. This application provides a two-component addition-type silicone potting compound with excellent comprehensive performance. For thermally conductive fillers, on the one hand, the theoretical bulk density is improved by using a progressive filling and mass ratio of four thermally conductive fillers with different particle sizes. On the other hand, the thermal conductivity of the silicone potting compound is significantly improved and the viscosity is reduced by using a specific high thermal conductivity filler, nanodiamond. This reduces the generation of air bubbles during construction, and the silicone potting compound has fewer internal structural defects after curing, thus improving the comprehensive performance of the silicone potting compound.

[0042] 2. This application provides a two-component addition-type silicone potting compound with excellent comprehensive performance. For silane coupling agents, the thermally conductive filler is modified by a silane coupling agent with dual reactive groups. By utilizing the mechanism that one reactive group of the silane coupling agent can react with the thermally conductive filler and the other reactive group can react with silicone oil, a more stable "dual anchoring" structure is formed in the silicone potting compound, thereby improving the comprehensive performance of the silicone potting compound.

[0043] 3. This application provides a two-component addition-type silicone potting compound with excellent comprehensive performance. For hydrosilylation reaction catalysts, it improves the stability of room temperature storage by using a latent hydrosilylation reaction catalyst, and allows the hydrosilylation reaction to proceed at higher temperatures. The slow-release function prolongs the potting operation time, improves the construction process performance, and enhances the overall performance of the silicone potting compound.

[0044] 4. This application provides a two-component addition-type silicone potting compound with excellent comprehensive performance. By adjusting the amount of four thermally conductive fillers with different particle sizes and silane coupling agents with dual reactive groups, the comprehensive performance of the silicone potting compound is further improved. Attached Figure Description

[0045] To more clearly illustrate the technical solutions in the specific embodiments of this application or the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this application. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0046] Figure 1 This is a schematic flowchart illustrating a method for preparing a two-component addition-type silicone potting compound with excellent comprehensive performance, as provided in Embodiment 1 of this application. Detailed Implementation

[0047] This application provides a two-component addition-type silicone potting compound with excellent comprehensive performance, its preparation method, and its application, which solves the technical problem of low comprehensive performance of silicone potting compounds in the prior art.

[0048] The technical solutions of this application will now be clearly and completely described with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this application. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0049] Example 1

[0050] This embodiment provides a method for preparing a two-component addition-type silicone potting compound with excellent comprehensive performance, the process flow diagram of which is shown below. Figure 1 As shown, the preparation steps include those for the silane coupling agent-modified thermally conductive filler, the preparation steps for the latent hydrosilylation reaction catalyst, and the preparation steps for component A and component B adhesives.

[0051] The preparation steps of silane coupling agent modified thermally conductive filler include:

[0052] Under nitrogen protection, 80g of vinyltrimethoxysilane (VTMS, industrial grade), 80g of γ-glycidoxypropyltrimethoxysilane (GPTMS, industrial grade), and 160g of xylene were added to a three-necked flask equipped with a reflux condenser; the temperature was raised to 110℃ and 0.5g of azobisisobutyronitrile was added, and the reaction was carried out for 6 hours; after the reaction was completed, xylene was removed by vacuum distillation, and a colorless to light yellow viscous liquid was obtained, which is a silane coupling agent with two reactive groups; gel permeation chromatography showed that the number average molecular weight Mn of the silane coupling agent with two reactive groups was 1950, and the molecular weight distribution was 1.8.

[0053] Four types of thermally conductive fillers with different particle sizes were used: 600g of spherical alumina (D50=15μm, purity≥99.5%, specific surface area1.2m²). 2 / g), 250g hexagonal boron nitride (D50=2μm, purity≥99%, oxygen content≤1.2wt%), 100g spherical alumina (D50=0.3μm, purity≥99.9%, specific surface area12m²), 2 / g), 50g nanodiamond (D50=65nm, purity ≥99.5%, specific surface area 90m²) 2 / g) is added to a high-speed mixer; the temperature is raised to 80℃ and 12g of silane coupling agent with dual reactive groups is sprayed in, and dispersed at 1200rpm for 2 hours; after the reaction is completed, the silane coupling agent modified thermally conductive filler is discharged and set aside for later use.

[0054] The preparation steps of a latent hydrosilylation reaction catalyst include:

[0055] 1.0 g of chloroplatinic acid (analytical grade) was dissolved in 10 g of isopropanol, and 2.5 g of ethynylcyclohexanol (industrial grade, molar ratio Pt: ethynol ≈ 1: 4) was added; the mixture was heated to 50 °C and stirred for 2 hours; after the reaction was completed, isopropanol was removed by vacuum distillation to obtain a reddish-brown viscous liquid, which is a latent hydrosilylation reaction catalyst.

[0056] The preparation steps for component A and component B adhesive include:

[0057] 100g of methyl vinyl polysiloxane (viscosity 2000mPa·s, vinyl content 0.25wt%), 400g of silane coupling agent modified thermally conductive filler, 0.1g of ethynylcyclohexanol (industrial grade), and 3g of hydrophobic fumed silica (specific surface area 200m²) were added. 2 Add (g) to a planetary mixer; disperse at -0.098MPa and 1200rpm for 3 hours until the fineness is ≤15μm, then discharge to obtain component A gel.

[0058] 100g of hydrogen-containing polysiloxane (viscosity 200mPa·s, hydrogen content 0.3wt%), 400g of silane coupling agent modified thermally conductive filler, 0.6g of latent hydrosilylation reaction catalyst, and 2g of polydimethyl silicone oil (viscosity 50mPa·s) were added to a planetary mixer; dispersed at -0.098MPa and 1200rpm for 3 hours until the fineness was ≤15μm, and then discharged to obtain component B adhesive.

[0059] Example 2

[0060] To investigate the effect of different amounts of thermally conductive filler on the performance of silicone potting compound, this embodiment provides a method for preparing a two-component addition-type silicone potting compound with excellent comprehensive performance, including the preparation steps of silane coupling agent modified thermally conductive filler, the preparation steps of latent hydrosilylation reaction catalyst, and the preparation steps of component A and component B adhesive.

[0061] The preparation steps of silane coupling agent modified thermally conductive filler include:

[0062] Under nitrogen protection, 80g of vinyltrimethoxysilane (VTMS, industrial grade), 80g of γ-glycidoxypropyltrimethoxysilane (GPTMS, industrial grade), and 160g of xylene were added to a three-necked flask equipped with a reflux condenser; the temperature was raised to 110℃ and 0.5g of azobisisobutyronitrile was added, and the reaction was carried out for 6 hours; after the reaction was completed, xylene was removed by vacuum distillation, and a colorless to light yellow viscous liquid was obtained, which is a silane coupling agent with two reactive groups; gel permeation chromatography showed that the number average molecular weight Mn of the silane coupling agent with two reactive groups was 1950, and the molecular weight distribution was 1.8.

[0063] Four types of thermally conductive fillers with different particle sizes were used: 600g of spherical alumina (D50=15μm, purity≥99.5%, specific surface area1.2m²). 2 / g), 250g hexagonal boron nitride (D50=2μm, purity≥99%, oxygen content≤1.2wt%), 100g spherical alumina (D50=0.3μm, purity≥99.9%, specific surface area12m²), 2 / g), 50g nanodiamond (D50=65nm, purity ≥99.5%, specific surface area 90m²) 2 / g) is added to a high-speed mixer; the temperature is raised to 80℃ and 12g of silane coupling agent with dual reactive groups is sprayed in, and dispersed at 1200rpm for 2 hours; after the reaction is completed, the silane coupling agent modified thermally conductive filler is discharged and set aside for later use.

[0064] The preparation steps of a latent hydrosilylation reaction catalyst include:

[0065] 1.0 g of chloroplatinic acid (analytical grade) was dissolved in 10 g of isopropanol, and 2.5 g of ethynylcyclohexanol (industrial grade, molar ratio Pt: ethynol ≈ 1: 4) was added; the mixture was heated to 50 °C and stirred for 2 hours; after the reaction was completed, isopropanol was removed by vacuum distillation to obtain a reddish-brown viscous liquid, which is a latent hydrosilylation reaction catalyst.

[0066] The preparation steps for component A and component B adhesive include:

[0067] 100g of methyl vinyl polysiloxane (viscosity 2000mPa·s, vinyl content 0.25wt%), 350g of silane coupling agent modified thermally conductive filler, 0.1g of ethynylcyclohexanol (industrial grade), and 3g of hydrophobic fumed silica (specific surface area 200m²) were added. 2 Add (g) to a planetary mixer; disperse at -0.098MPa and 1200rpm for 3 hours until the fineness is ≤15μm, then discharge to obtain component A gel.

[0068] 100g of hydrogen-containing polysiloxane (viscosity 200mPa·s, hydrogen content 0.3wt%), 350g of silane coupling agent modified thermally conductive filler, 0.6g of latent hydrosilylation reaction catalyst, and 2g of polydimethyl silicone oil (viscosity 50mPa·s) were added to a planetary mixer; the mixture was dispersed at -0.098MPa and 1200rpm for 3 hours until the fineness was ≤15μm, and then discharged to obtain component B adhesive.

[0069] Example 3

[0070] To investigate the effect of different amounts of thermally conductive filler on the performance of silicone potting compound, this embodiment provides a method for preparing a two-component addition-type silicone potting compound with excellent comprehensive performance, including the preparation steps of silane coupling agent modified thermally conductive filler, the preparation steps of latent hydrosilylation reaction catalyst, and the preparation steps of component A and component B adhesive.

[0071] The preparation steps of silane coupling agent modified thermally conductive filler include:

[0072] Under nitrogen protection, 80g of vinyltrimethoxysilane (VTMS, industrial grade), 80g of γ-glycidoxypropyltrimethoxysilane (GPTMS, industrial grade), and 160g of xylene were added to a three-necked flask equipped with a reflux condenser; the temperature was raised to 110℃ and 0.5g of azobisisobutyronitrile was added, and the reaction was carried out for 6 hours; after the reaction was completed, xylene was removed by vacuum distillation, and a colorless to light yellow viscous liquid was obtained, which is a silane coupling agent with two reactive groups; gel permeation chromatography showed that the number average molecular weight Mn of the silane coupling agent with two reactive groups was 1950, and the molecular weight distribution was 1.8.

[0073] Four types of thermally conductive fillers with different particle sizes were used: 600g of spherical alumina (D50=15μm, purity≥99.5%, specific surface area1.2m²). 2 / g), 250g hexagonal boron nitride (D50=2μm, purity≥99%, oxygen content≤1.2wt%), 100g spherical alumina (D50=0.3μm, purity≥99.9%, specific surface area12m²), 2 / g), 50g nanodiamond (D50=65nm, purity ≥99.5%, specific surface area 90m²) 2 / g) is added to a high-speed mixer; the temperature is raised to 80℃ and 12g of silane coupling agent with dual reactive groups is sprayed in, and dispersed at 1200rpm for 2 hours; after the reaction is completed, the silane coupling agent modified thermally conductive filler is discharged and set aside for later use.

[0074] The preparation steps of a latent hydrosilylation reaction catalyst include:

[0075] 1.0 g of chloroplatinic acid (analytical grade) was dissolved in 10 g of isopropanol, and 2.5 g of ethynylcyclohexanol (industrial grade, molar ratio Pt: ethynol ≈ 1: 4) was added; the mixture was heated to 50 °C and stirred for 2 hours; after the reaction was completed, isopropanol was removed by vacuum distillation to obtain a reddish-brown viscous liquid, which is a latent hydrosilylation reaction catalyst.

[0076] The preparation steps for component A and component B adhesive include:

[0077] 100g of methyl vinyl polysiloxane (viscosity 2000mPa·s, vinyl content 0.25wt%), 450g of silane coupling agent modified thermally conductive filler, 0.1g of ethynylcyclohexanol (industrial grade), and 3g of hydrophobic fumed silica (specific surface area 200m²) were added. 2 Add (g) to a planetary mixer; disperse at -0.098MPa and 1200rpm for 3 hours until the fineness is ≤15μm, then discharge to obtain component A gel.

[0078] 100g of hydrogen-containing polysiloxane (viscosity 200mPa·s, hydrogen content 0.3wt%), 450g of silane coupling agent modified thermally conductive filler, 0.6g of latent hydrosilylation reaction catalyst, and 2g of polydimethyl silicone oil (viscosity 50mPa·s) were added to a planetary mixer; the mixture was dispersed at -0.098MPa and 1200rpm for 3 hours until the fineness was ≤15μm, and then discharged to obtain component B adhesive.

[0079] Example 4

[0080] To investigate the effect of different amounts of silane coupling agent on the performance of silicone potting compound, this embodiment provides a method for preparing a two-component addition-type silicone potting compound with excellent comprehensive performance, including the preparation steps of silane coupling agent modified thermally conductive filler, the preparation steps of latent hydrosilylation reaction catalyst, and the preparation steps of component A and component B adhesive.

[0081] The preparation steps of silane coupling agent modified thermally conductive filler include:

[0082] Under nitrogen protection, 80g of vinyltrimethoxysilane (VTMS, industrial grade), 80g of γ-glycidoxypropyltrimethoxysilane (GPTMS, industrial grade), and 160g of xylene were added to a three-necked flask equipped with a reflux condenser; the temperature was raised to 110℃ and 0.5g of azobisisobutyronitrile was added, and the reaction was carried out for 6 hours; after the reaction was completed, xylene was removed by vacuum distillation, and a colorless to light yellow viscous liquid was obtained, which is a silane coupling agent with two reactive groups; gel permeation chromatography showed that the number average molecular weight Mn of the silane coupling agent with two reactive groups was 1950, and the molecular weight distribution was 1.8.

[0083] Four types of thermally conductive fillers with different particle sizes were used: 600g of spherical alumina (D50=15μm, purity≥99.5%, specific surface area1.2m²). 2 / g), 250g hexagonal boron nitride (D50=2μm, purity≥99%, oxygen content≤1.2wt%), 100g spherical alumina (D50=0.3μm, purity≥99.9%, specific surface area12m²), 2 / g), 50g nanodiamond (D50=65nm, purity ≥99.5%, specific surface area 90m²) 2 / g) is added to a high-speed mixer; the temperature is raised to 80℃ and 9.6g of silane coupling agent with dual reactive groups is sprayed in, and dispersed at 1200rpm for 2 hours; after the reaction is completed, the silane coupling agent modified thermally conductive filler is discharged and set aside for later use.

[0084] The preparation steps of a latent hydrosilylation reaction catalyst include:

[0085] 1.0 g of chloroplatinic acid (analytical grade) was dissolved in 10 g of isopropanol, and 2.5 g of ethynylcyclohexanol (industrial grade, molar ratio Pt: ethynol ≈ 1: 4) was added; the mixture was heated to 50 °C and stirred for 2 hours; after the reaction was completed, isopropanol was removed by vacuum distillation to obtain a reddish-brown viscous liquid, which is a latent hydrosilylation reaction catalyst.

[0086] The preparation steps for component A and component B adhesive include:

[0087] 100g of methyl vinyl polysiloxane (viscosity 2000mPa·s, vinyl content 0.25wt%), 400g of silane coupling agent modified thermally conductive filler, 0.1g of ethynylcyclohexanol (industrial grade), and 3g of hydrophobic fumed silica (specific surface area 200m²) were added. 2 Add (g) to a planetary mixer; disperse at -0.098MPa and 1200rpm for 3 hours until the fineness is ≤15μm, then discharge to obtain component A gel.

[0088] 100g of hydrogen-containing polysiloxane (viscosity 200mPa·s, hydrogen content 0.3wt%), 400g of silane coupling agent modified thermally conductive filler, 0.6g of latent hydrosilylation reaction catalyst, and 2g of polydimethyl silicone oil (viscosity 50mPa·s) were added to a planetary mixer; dispersed at -0.098MPa and 1200rpm for 3 hours until the fineness was ≤15μm, and then discharged to obtain component B adhesive.

[0089] Example 5

[0090] To investigate the effect of different amounts of silane coupling agent on the performance of silicone potting compound, this embodiment provides a method for preparing a two-component addition-type silicone potting compound with excellent comprehensive performance, including the preparation steps of silane coupling agent modified thermally conductive filler, the preparation steps of latent hydrosilylation reaction catalyst, and the preparation steps of component A and component B adhesive.

[0091] The preparation steps of silane coupling agent modified thermally conductive filler include:

[0092] Under nitrogen protection, 80g of vinyltrimethoxysilane (VTMS, industrial grade), 80g of γ-glycidoxypropyltrimethoxysilane (GPTMS, industrial grade), and 160g of xylene were added to a three-necked flask equipped with a reflux condenser; the temperature was raised to 110℃ and 0.5g of azobisisobutyronitrile was added, and the reaction was carried out for 6 hours; after the reaction was completed, xylene was removed by vacuum distillation, and a colorless to light yellow viscous liquid was obtained, which is a silane coupling agent with two reactive groups; gel permeation chromatography showed that the number average molecular weight Mn of the silane coupling agent with two reactive groups was 1950, and the molecular weight distribution was 1.8.

[0093] Four types of thermally conductive fillers with different particle sizes were used: 600g of spherical alumina (D50=15μm, purity≥99.5%, specific surface area1.2m²). 2 / g), 250g hexagonal boron nitride (D50=2μm, purity≥99%, oxygen content≤1.2wt%), 100g spherical alumina (D50=0.3μm, purity≥99.9%, specific surface area12m²), 2 / g), 50g nanodiamond (D50=65nm, purity ≥99.5%, specific surface area 90m²) 2 / g) is added to a high-speed mixer; the temperature is raised to 80℃ and 14.4g of silane coupling agent with dual reactive groups is sprayed in, and dispersed at 1200rpm for 2 hours; after the reaction is completed, the silane coupling agent modified thermally conductive filler is discharged and set aside for later use.

[0094] The preparation steps of a latent hydrosilylation reaction catalyst include:

[0095] 1.0 g of chloroplatinic acid (analytical grade) was dissolved in 10 g of isopropanol, and 2.5 g of ethynylcyclohexanol (industrial grade, molar ratio Pt: ethynol ≈ 1: 4) was added; the mixture was heated to 50 °C and stirred for 2 hours; after the reaction was completed, isopropanol was removed by vacuum distillation to obtain a reddish-brown viscous liquid, which is a latent hydrosilylation reaction catalyst.

[0096] The preparation steps for component A and component B adhesive include:

[0097] 100g of methyl vinyl polysiloxane (viscosity 2000mPa·s, vinyl content 0.25wt%), 400g of silane coupling agent modified thermally conductive filler, 0.1g of ethynylcyclohexanol (industrial grade), and 3g of hydrophobic fumed silica (specific surface area 200m²) were added. 2 Add (g) to a planetary mixer; disperse at -0.098MPa and 1200rpm for 3 hours until the fineness is ≤15μm, then discharge to obtain component A gel.

[0098] 100g of hydrogen-containing polysiloxane (viscosity 200mPa·s, hydrogen content 0.3wt%), 400g of silane coupling agent modified thermally conductive filler, 0.6g of latent hydrosilylation reaction catalyst, and 2g of polydimethyl silicone oil (viscosity 50mPa·s) were added to a planetary mixer; dispersed at -0.098MPa and 1200rpm for 3 hours until the fineness was ≤15μm, and then discharged to obtain component B adhesive.

[0099] Comparative Example 1

[0100] To investigate the effect of thermally conductive fillers of different particle sizes on the performance of silicone potting compounds, this comparative example provides a method for preparing a two-component addition-type silicone potting compound, including the preparation steps of silane coupling agent modified thermally conductive fillers, the preparation steps of latent hydrosilylation reaction catalysts, and the preparation steps of component A and component B.

[0101] The preparation steps of silane coupling agent modified thermally conductive filler include:

[0102] Under nitrogen protection, 80g of vinyltrimethoxysilane (VTMS, industrial grade), 80g of γ-glycidoxypropyltrimethoxysilane (GPTMS, industrial grade), and 160g of xylene were added to a three-necked flask equipped with a reflux condenser; the temperature was raised to 110℃ and 0.5g of azobisisobutyronitrile was added, and the reaction was carried out for 6 hours; after the reaction was completed, xylene was removed by vacuum distillation, and a colorless to light yellow viscous liquid was obtained, which is a silane coupling agent with two reactive groups; gel permeation chromatography showed that the number average molecular weight Mn of the silane coupling agent with two reactive groups was 1950, and the molecular weight distribution was 1.8.

[0103] Two types of alumina thermally conductive fillers with different particle sizes were used: 800g of spherical alumina (D50=15μm, purity≥99.5%, specific surface area1.2m²). 2 / g), 200g spherical alumina (D50=0.3μm, purity≥99.9%, specific surface area12m²), 2 / g) is added to a high-speed mixer; the temperature is raised to 80℃ and 12g of silane coupling agent with dual reactive groups is sprayed in, and dispersed at 1200rpm for 2 hours; after the reaction is completed, the silane coupling agent modified thermally conductive filler is discharged and set aside for later use.

[0104] The preparation steps of a latent hydrosilylation reaction catalyst include:

[0105] 1.0 g of chloroplatinic acid (analytical grade) was dissolved in 10 g of isopropanol, and 2.5 g of ethynylcyclohexanol (industrial grade, molar ratio Pt: ethynol ≈ 1: 4) was added; the mixture was heated to 50 °C and stirred for 2 hours; after the reaction was completed, isopropanol was removed by vacuum distillation to obtain a reddish-brown viscous liquid, which is a latent hydrosilylation reaction catalyst.

[0106] The preparation steps for component A and component B adhesive include:

[0107] 100g of methyl vinyl polysiloxane (viscosity 2000mPa·s, vinyl content 0.25wt%), 400g of silane coupling agent modified thermally conductive filler, 0.1g of ethynylcyclohexanol (industrial grade), and 3g of hydrophobic fumed silica (specific surface area 200m²) were added. 2Add (g) to a planetary mixer; disperse at -0.098MPa and 1200rpm for 3 hours until the fineness is ≤15μm, then discharge to obtain component A gel.

[0108] 100g of hydrogen-containing polysiloxane (viscosity 200mPa·s, hydrogen content 0.3wt%), 400g of silane coupling agent modified thermally conductive filler, 0.6g of latent hydrosilylation reaction catalyst, and 2g of polydimethyl silicone oil (viscosity 50mPa·s) were added to a planetary mixer; dispersed at -0.098MPa and 1200rpm for 3 hours until the fineness was ≤15μm, and then discharged to obtain component B adhesive.

[0109] Comparative Example 2

[0110] To investigate the effect of thermally conductive fillers of different particle sizes on the performance of silicone potting compounds, this comparative example provides a method for preparing a two-component addition-type silicone potting compound, including the preparation steps of silane coupling agent modified thermally conductive fillers, the preparation steps of latent hydrosilylation reaction catalysts, and the preparation steps of component A and component B.

[0111] The preparation steps of silane coupling agent modified thermally conductive filler include:

[0112] Under nitrogen protection, 80g of vinyltrimethoxysilane (VTMS, industrial grade), 80g of γ-glycidoxypropyltrimethoxysilane (GPTMS, industrial grade), and 160g of xylene were added to a three-necked flask equipped with a reflux condenser; the temperature was raised to 110℃ and 0.5g of azobisisobutyronitrile was added, and the reaction was carried out for 6 hours; after the reaction was completed, xylene was removed by vacuum distillation, and a colorless to light yellow viscous liquid was obtained, which is a silane coupling agent with two reactive groups; gel permeation chromatography showed that the number average molecular weight Mn of the silane coupling agent with two reactive groups was 1950, and the molecular weight distribution was 1.8.

[0113] Three types of thermally conductive fillers with different particle sizes were used: 600g of spherical alumina (D50=15μm, purity≥99.5%, specific surface area1.2m²). 2 / g), 250g hexagonal boron nitride (D50=2μm, purity≥99%, oxygen content≤1.2wt%), 150g spherical alumina (D50=0.3μm, purity≥99.9%, specific surface area 12m²), 2 / g) is added to a high-speed mixer; the temperature is raised to 80℃ and 12g of silane coupling agent with dual reactive groups is sprayed in, and dispersed at 1200rpm for 2 hours; after the reaction is completed, the silane coupling agent modified thermally conductive filler is discharged and set aside for later use.

[0114] The preparation steps of a latent hydrosilylation reaction catalyst include:

[0115] 1.0 g of chloroplatinic acid (analytical grade) was dissolved in 10 g of isopropanol, and 2.5 g of ethynylcyclohexanol (industrial grade, molar ratio Pt: ethynol ≈ 1: 4) was added; the mixture was heated to 50 °C and stirred for 2 hours; after the reaction was completed, isopropanol was removed by vacuum distillation to obtain a reddish-brown viscous liquid, which is a latent hydrosilylation reaction catalyst.

[0116] The preparation steps for component A and component B adhesive include:

[0117] 100g of methyl vinyl polysiloxane (viscosity 2000mPa·s, vinyl content 0.25wt%), 400g of silane coupling agent modified thermally conductive filler, 0.1g of ethynylcyclohexanol (industrial grade), and 3g of hydrophobic fumed silica (specific surface area 200m²) were added. 2 Add (g) to a planetary mixer; disperse at -0.098MPa and 1200rpm for 3 hours until the fineness is ≤15μm, then discharge to obtain component A gel.

[0118] 100g of hydrogen-containing polysiloxane (viscosity 200mPa·s, hydrogen content 0.3wt%), 400g of silane coupling agent modified thermally conductive filler, 0.6g of latent hydrosilylation reaction catalyst, and 2g of polydimethyl silicone oil (viscosity 50mPa·s) were added to a planetary mixer; dispersed at -0.098MPa and 1200rpm for 3 hours until the fineness was ≤15μm, and then discharged to obtain component B adhesive.

[0119] Comparative Example 3

[0120] To investigate the effects of different silane coupling agents on the properties of silicone potting compounds, this comparative example provides a method for preparing a two-component addition-type silicone potting compound, including the preparation steps of a silane coupling agent-modified thermally conductive filler, a latent hydrosilylation reaction catalyst, and the preparation steps of component A and component B.

[0121] The preparation steps of silane coupling agent modified thermally conductive filler include:

[0122] Four types of thermally conductive fillers with different particle sizes were used: 600g of spherical alumina (D50=15μm, purity≥99.5%, specific surface area1.2m²). 2 / g), 250g hexagonal boron nitride (D50=2μm, purity≥99%, oxygen content≤1.2wt%), 100g spherical alumina (D50=0.3μm, purity≥99.9%, specific surface area12m²), 2 / g), 50g nanodiamond (D50=65nm, purity ≥99.5%, specific surface area 90m²) 2 / g) is added to a high-speed mixer; the temperature is raised to 80℃ and 12g of γ-aminopropyltriethoxysilane (KH550) is sprayed in, and dispersed at 1200rpm for 2 hours; after the reaction is completed, the silane coupling agent modified thermally conductive filler is discharged and set aside for later use.

[0123] The preparation steps of a latent hydrosilylation reaction catalyst include:

[0124] 1.0 g of chloroplatinic acid (analytical grade) was dissolved in 10 g of isopropanol, and 2.5 g of ethynylcyclohexanol (industrial grade, molar ratio Pt: ethynol ≈ 1: 4) was added; the mixture was heated to 50 °C and stirred for 2 hours; after the reaction was completed, isopropanol was removed by vacuum distillation to obtain a reddish-brown viscous liquid, which is a latent hydrosilylation reaction catalyst.

[0125] The preparation steps for component A and component B adhesive include:

[0126] 100g of methyl vinyl polysiloxane (viscosity 2000mPa·s, vinyl content 0.25wt%), 400g of silane coupling agent modified thermally conductive filler, 0.1g of ethynylcyclohexanol (industrial grade), and 3g of hydrophobic fumed silica (specific surface area 200m²) were added. 2 Add (g) to a planetary mixer; disperse at -0.098MPa and 1200rpm for 3 hours until the fineness is ≤15μm, then discharge to obtain component A gel.

[0127] 100g of hydrogen-containing polysiloxane (viscosity 200mPa·s, hydrogen content 0.3wt%), 400g of silane coupling agent modified thermally conductive filler, 0.6g of latent hydrosilylation reaction catalyst, and 2g of polydimethyl silicone oil (viscosity 50mPa·s) were added to a planetary mixer; dispersed at -0.098MPa and 1200rpm for 3 hours until the fineness was ≤15μm, and then discharged to obtain component B adhesive.

[0128] Comparative Example 4

[0129] To investigate the effects of different hydrosilylation catalysts on the properties of organosilicon potting compounds, this comparative example provides a method for preparing a two-component addition-type organosilicon potting compound, including the preparation steps of a silane coupling agent-modified thermally conductive filler and the preparation steps of component A and component B.

[0130] The preparation steps of silane coupling agent modified thermally conductive filler include:

[0131] Under nitrogen protection, 80g of vinyltrimethoxysilane (VTMS, industrial grade), 80g of γ-glycidoxypropyltrimethoxysilane (GPTMS, industrial grade), and 160g of xylene were added to a three-necked flask equipped with a reflux condenser; the temperature was raised to 110℃ and 0.5g of azobisisobutyronitrile was added, and the reaction was carried out for 6 hours; after the reaction was completed, xylene was removed by vacuum distillation, and a colorless to light yellow viscous liquid was obtained, which is a silane coupling agent with two reactive groups; gel permeation chromatography showed that the number average molecular weight Mn of the silane coupling agent with two reactive groups was 1950, and the molecular weight distribution was 1.8.

[0132] Four types of thermally conductive fillers with different particle sizes were used: 600g of spherical alumina (D50=15μm, purity≥99.5%, specific surface area1.2m²). 2 / g), 250g hexagonal boron nitride (D50=2μm, purity≥99%, oxygen content≤1.2wt%), 100g spherical alumina (D50=0.3μm, purity≥99.9%, specific surface area12m²), 2 / g), 50g nanodiamond (D50=65nm, purity ≥99.5%, specific surface area 90m²) 2 / g) is added to a high-speed mixer; the temperature is raised to 80℃ and 12g of silane coupling agent with dual reactive groups is sprayed in, and dispersed at 1200rpm for 2 hours; after the reaction is completed, the silane coupling agent modified thermally conductive filler is discharged and set aside for later use.

[0133] The preparation steps of a latent hydrosilylation reaction catalyst include:

[0134] 1.0 g of chloroplatinic acid (analytical grade) was dissolved in 10 g of isopropanol, and 2.5 g of ethynylcyclohexanol (industrial grade, molar ratio Pt: ethynol ≈ 1: 4) was added; the mixture was heated to 50 °C and stirred for 2 hours; after the reaction was completed, isopropanol was removed by vacuum distillation to obtain a reddish-brown viscous liquid, which is a latent hydrosilylation reaction catalyst.

[0135] The preparation steps for component A and component B adhesive include:

[0136] 100g of methyl vinyl polysiloxane (viscosity 2000mPa·s, vinyl content 0.25wt%), 400g of silane coupling agent modified thermally conductive filler, 0.1g of ethynylcyclohexanol (industrial grade), and 3g of hydrophobic fumed silica (specific surface area 200m²) were added. 2 Add (g) to a planetary mixer; disperse at -0.098MPa and 1200rpm for 3 hours until the fineness is ≤15μm, then discharge to obtain component A gel.

[0137] 100g of hydrogen-containing polysiloxane (viscosity 200mPa·s, hydrogen content 0.3wt%), 400g of thermally conductive filler modified with silane coupling agent, and 0.6g of... Add (Karstedt catalyst) and 2g of polydimethyl silicone oil (viscosity 50mPa·s) to a planetary mixer; disperse at 1200rpm for 3 hours under vacuum of -0.098MPa until the fineness is ≤15μm, then discharge to obtain component B adhesive.

[0138] Experimental Example 1

[0139] This experiment tested the performance of the silicone potting compounds provided in Examples 1-5 and Comparative Examples 1-4. The results of the performance tests are shown in Table 1.

[0140] The performance testing process includes:

[0141] First, mix component A and component B of the silicone potting compound provided in Examples 1-5 and Comparative Examples 1-4 at a mass ratio of 1:1, degas under vacuum for 5 minutes, pour into a 2cm thick mold, and cure at 80℃ for 2 hours.

[0142] Then conduct performance testing according to the following performance testing methods:

[0143] Thermal conductivity: ASTM D5470, hot end 80°C, pressure 30psi;

[0144] Mixed viscosity: Brookfield rotational viscometer, 25°C, according to... Measurement;

[0145] Tensile strength and elongation at break: determined according to GB / T 528;

[0146] Flame retardant rating: UL94;

[0147] Pot life (operable time): The time required for the viscosity to increase to twice the initial value from the start of mixing components A and B at 25°C;

[0148] Surface drying time: 25℃, measured by the finger touch method, the time required for the surface to become non-sticky.

[0149] Thick-layer curing: Pour a 2cm thick mold, cure at 80℃ for 2 hours, and observe the cross-section for air bubbles;

[0150] Thermal cycling reliability: 500 cycles ( (Each is kept at a temperature of 15 min), and the interfacial shear strength retention rate with the copper plate is determined according to GB / T7124;

[0151] Storage stability of component B adhesive: When stored in a sealed container at 25°C, the time required for the viscosity to increase to twice the initial value was measured.

[0152] As shown in Table 1, the performance test results indicate that, using the same amount of thermally conductive filler, the silicone potting compounds provided in Comparative Example 1 and Comparative Example 2, using two or three particle sizes of alumina thermally conductive filler, have thermal conductivity ranging from 1.78 to 2.05 W / (m·K). In contrast, the silicone potting compound provided in Example 1 of this application has a thermal conductivity of 2.25 W / (m·K). This is because the silicone potting compound provided in this application includes four particle sizes of thermally conductive filler. The micron-sized alumina in the thermally conductive filler forms a thermally conductive framework, the submicron-sized boron nitride fills the micron-sized gaps, the submicron-sized alumina further fills the gaps, and nanodiamond fills the nano-sized voids. Furthermore, the mass ratio of the four particle sizes of thermally conductive filler is 60:25:1. The improved technique of progressively filling four types of thermally conductive fillers with varying particle sizes (0:5) and their mass ratios achieves a theoretical bulk density of over 94%. Simultaneously, the nanodiamonds used possess a thermal conductivity exceeding 2000 W / (m·K), significantly enhancing thermal conductivity with minimal quantity. This improvement in theoretical bulk density and filler type (using fillers with high thermal conductivity) significantly enhances the thermal conductivity of the silicone potting compound. Furthermore, the high bulk density (over 94%) of the silicone potting compound provided in Example 1 reduces inter-filler friction and viscosity, meeting the requirements for automated dispensing. After curing, a 2cm thick silicone potting compound sample showed no air bubbles in the cross-section, minimizing internal defects and improving mechanical properties. It ensures the reliability of the package during the cycle and is suitable for packaging various high-power electronic components.

[0153] Meanwhile, the performance test results shown in Table 1 also indicate that the silicone potting compound provided in Comparative Example 3, which uses conventional γ-aminopropyltriethoxysilane (KH550) modified thermally conductive filler, performs well in... After 500 cycles, the interfacial shear strength retention rate was only 72%, significantly lower than that of the silicone potting compound modified with a silane coupling agent using dual reactive groups in the examples and comparative examples. This is because when a silane coupling agent with dual reactive groups is used to modify the thermally conductive filler, one reactive group of the silane coupling agent can react with the thermally conductive filler, and the other reactive group can react with the silicone oil, thus forming a more stable "dual anchoring" structure in the silicone potting compound, significantly improving the interfacial shear strength retention rate. At the same time, compared with γ-aminopropyltriethoxysilane (KH550) which has only one reactive group, the "dual anchoring" structure formed by the silane coupling agent with dual reactive groups can significantly enhance the compatibility between the thermally conductive filler and the silicone potting compound, resulting in a lower viscosity that meets the requirements of automated dispensing. After curing, the cross-section of the 2cm thick silicone potting compound sample showed no bubbles, and internal defects were difficult to generate, thus improving the mechanical properties.

[0154] Furthermore, the performance test results shown in Table 1 also indicate that the silicone potting compound provided in Comparative Example 4, which uses conventional γ-aminopropyltriethoxysilane (KH550) modified thermally conductive filler, exhibits significantly lower storage stability of its component B compared to the silicone potting compounds in the examples and comparative examples that use latent hydrosilylation catalysts. Component B tends to increase in viscosity during storage, and after mixing components A and B, the viscosity increases rapidly within 15 minutes, with the surface drying quickly. This suggests that the potting operation time is relatively short when encapsulating various high-power electronic components. In contrast, the silicone potting compound provided in the examples, by using a latent hydrosilylation catalyst, exhibits inertness to the hydrosilylation reaction during room temperature storage. However, as the temperature rises, ethynylcyclohexanol gradually dissociates, releasing catalytically active platinum species to catalyze the hydrosilylation reaction of silicone oil. This sustained-release function extends the potting operation time, improving the construction process performance.

[0155] Table 1: Performance Test Results of Silicone Encapsulants

[0156]

[0157] The above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application.

Claims

1. A two-component addition-type silicone potting compound with excellent comprehensive performance, characterized in that, It consists of component A adhesive and component B adhesive; Component A of the adhesive includes: vinyl silicone oil, hydrosilylation inhibitor, thixotropic agent, and thermally conductive filler modified with silane coupling agent; Component B of the adhesive includes: hydrogen-containing silicone oil, a latent hydrosilylation catalyst, a viscosity modifier, and a thermally conductive filler modified with a silane coupling agent. The silane coupling agent is selected from silane coupling agents with two reactive groups, and one reactive group of the silane coupling agent can react with the thermally conductive filler, and the other reactive group can react with the silicone oil. The thermally conductive filler is selected from particles with D50 of 10~20μm, 1~3μm, 0.2~0.5μm, and... Four types of thermally conductive fillers with particle sizes ranging from 50 to 80 nm.

2. The two-component addition-type silicone potting compound with excellent comprehensive performance according to claim 1, characterized in that, One of the reactive groups in the silane coupling agent is selected from epoxy groups, and the other reactive group is selected from vinyl or amino groups.

3. The two-component addition-type silicone potting compound with excellent comprehensive performance according to claim 1, characterized in that, The thermally conductive filler is selected from at least one of spherical alumina, hexagonal boron nitride, and nano diamond.

4. The two-component addition-type silicone potting compound with excellent comprehensive performance according to claim 1, characterized in that, The thermally conductive filler comprises four types of fillers with particle sizes D50 of 10~20μm, 1~3μm, 0.2~0.5μm, and 50~80nm, with a mass ratio of 60:25:10:

5.

5. The two-component addition-type silicone potting compound with excellent comprehensive performance according to claim 1, characterized in that, The latent hydrosilylation reaction catalyst is selected from latent platinum-based catalysts. .

6. The two-component addition-type silicone potting compound with excellent comprehensive performance according to claim 1, characterized in that, Based on parts by weight, the A component adhesive comprises: 100 parts by weight of vinyl silicone oil, 0.05 to 0.15 parts by weight of hydrosilylation inhibitor, 2 to 5 parts by weight of thixotropic agent, and 350 to 450 parts by weight of thermally conductive filler modified with silane coupling agent. The B component adhesive comprises: 100 parts by weight of hydrogen-containing silicone oil, 0.3 to 0.8 parts by weight of latent hydrosilylation reaction catalyst, 1 to 3 parts by weight of viscosity modifier, and 350 to 450 parts by weight of silane coupling agent modified thermally conductive filler.

7. A method for preparing a two-component addition-type silicone potting compound with excellent comprehensive performance, characterized in that, A two-component addition-type silicone potting compound with excellent comprehensive properties as described in any one of claims 1-6 can be prepared by the following steps: Vinyltrimethoxysilane or γ-aminopropyltriethoxysilane, together with γ-glycidoxypropyltrimethoxysilane, are added to an organic solvent and subjected to reflux condensation to obtain a silane coupling agent with two reactive groups. Four types of thermally conductive fillers with particle sizes D50 of 10~20μm, 1~3μm, 0.2~0.5μm and 50~80nm were mixed and dispersed with a silane coupling agent with dual reactive groups to obtain a silane coupling agent modified thermally conductive filler. Chloroplatinic acid and etynylcyclohexanol were added to an organic solvent and heated and stirred to obtain a latent hydrosilylation reaction catalyst. Vinyl silicone oil, hydrosilylation inhibitor, thixotropic agent and silane coupling agent modified thermally conductive filler were vacuum dispersed to obtain component A adhesive; The B-component adhesive was obtained by vacuum dispersion of hydrogen-containing silicone oil, latent hydrosilylation catalyst, viscosity modifier, and silane coupling agent modified thermally conductive filler.

8. The method for preparing a two-component addition-type silicone potting compound with excellent comprehensive performance according to claim 7, characterized in that, The condensation reflux reaction is carried out at a temperature of 100~140℃ for 4~8 hours. The stirring and dispersion treatment is carried out at a stirring speed of 1000~1500 rpm, a temperature of 75~85℃, and a time of 1.5~2.5h.

9. The method for preparing a two-component addition-type silicone potting compound with excellent comprehensive performance according to claim 7, characterized in that, The heating and stirring reaction is carried out at a temperature of 40-60°C for 1-3 hours.

10. A two-component addition polymer with excellent overall performance as described in any one of claims 1-6 Applications of silicone potting compounds in the packaging of electronic components for new energy vehicles' 800V high-voltage platforms, AI servers, or photovoltaic energy storage.

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