Circuit board surface mount device

Abstract

This application discloses a circuit board (PCB) mounting apparatus, relating to the field of electronic manufacturing technology. The PCB mounting apparatus includes a conveying mechanism, a transfer mechanism, and a dust-removing mounting mechanism. The conveying mechanism includes a conveyor and at least two support members. The conveyor is used to move the support members to sequentially transfer the at least two support members to a first preset position. The transfer mechanism is used to move the PCB upwards to a second preset position detached from the support members. The dust-removing mounting mechanism is used to sequentially remove dust from the PCB and mount components onto it. The PCB mounting apparatus of this application, by conveying the PCB to the first preset position via the conveying mechanism, and then transferring the PCB to the second preset position via the transfer mechanism, and then sequentially performing dust removal and component mounting at the second preset position via the dust-removing mounting mechanism, allows the PCB to continuously complete dust removal and mounting at the second preset position, thereby achieving the technical effect of improving mounting efficiency.

Description

Technical Field

[0001] This application relates to the field of electronic manufacturing technology, and in particular to circuit board mounting equipment. Background Technology

[0002] PCB mounting equipment is used to mount components onto circuit boards and is widely used in the production of printed circuit boards. In related technologies, the solder joints on the circuit board need to be pre-treated before component mounting. Solder joint pre-treatment is typically done manually or using separate dust removal equipment, separating the pre-treatment from the mounting process. Therefore, the circuit board is first moved to the dust removal position by a first transfer mechanism, and then moved to the mounting position by a second transfer mechanism. Each transfer requires repositioning of the circuit board, resulting in low mounting efficiency. Summary of the Invention

[0003] This application provides a circuit board mounting apparatus to at least solve the problem of low circuit board mounting efficiency in related technologies.

[0004] This application provides a circuit board surface mount device, comprising:

[0005] A conveying mechanism, comprising a conveying component and at least two supporting components, wherein the at least two supporting components are disposed on the conveying component, the supporting components are used to support circuit boards, and the conveying component is used to drive the supporting components to move, so as to sequentially move the at least two supporting components to a first preset position.

[0006] A transfer mechanism is used to move the circuit board at the first preset position upward to a second preset position detached from the support member;

[0007] A dust removal and component mounting mechanism is used to sequentially remove dust and mount components on the circuit board at the second preset position.

[0008] The circuit board mounting device provided in this application transfers the circuit board to a first preset position via a conveying mechanism, and then the transfer mechanism transfers the circuit board from the first preset position to a second preset position. The dust removal and mounting mechanism, which integrates dust removal components and mounting components, sequentially performs dust removal on the solder joints of the circuit board and mounts components at the second preset position. This allows the circuit board to continuously complete dust removal and mounting at the second preset position, eliminating the need for transfer between the dust removal station and the mounting station. This solves the technical problem of low mounting efficiency caused by the separation of dust removal and mounting processes in related technologies, thereby achieving the technical effect of improving the mounting efficiency of circuit boards. Attached Figure Description

[0009] To more clearly illustrate the embodiments of this application, the accompanying drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0010] Figure 1 This is a schematic diagram of the structure of a circuit board mounting device provided in an embodiment of this application;

[0011] Figure 2 for Figure 1 A schematic diagram of the circuit board surface mount device after the dust removal surface mount mechanism is concealed;

[0012] Figure 3 for Figure 1 A structural schematic diagram of the conveyor frame, frame body, and dust removal patch mechanism in the assembled state;

[0013] Figure 4 for Figure 1 A partial structural diagram of the conveyor mechanism;

[0014] Figure 5 for Figure 1 A schematic diagram of the second driving component, the first transmission gear, and the second transmission gear in their assembled state;

[0015] Figure 6 for Figure 1 Structural diagram of the middle support component;

[0016] Figure 7 for Figure 6 A structural diagram of the central support component behind the concealed frame;

[0017] Figure 8 for Figure 2 A schematic diagram of the switching mechanism;

[0018] Figure 9 for Figure 1 Schematic diagram of the transfer mechanism;

[0019] Figure 10 for Figure 1 Schematic diagram of the dust removal patch mechanism;

[0020] Figure 11 for Figure 10 A schematic diagram of the structure of the mounting bracket.

[0021] The above figures include the following reference numerals:

[0022] 100-Conveying mechanism; 110-Conveying component; 120-Supporting component; 121-Frame; 1211-Side plate; 1212-End plate; 1213-Connecting block; 122-Supporting body; 1221-Bottom plate; 1222-Top plate; 1223-Supporting groove; 123-Guide rod; 1231-Limiting block; 124-Elastic component; 125-First rack; 1251-First external rack; 1252-First internal rack; 126-First gear; 127-Connecting component; 130-Conveying frame; 131-Trough; 132-Inner boss; 133-Outer boss; 134-Opening; 140-Pulley; 150-Second driving component; 160-First transmission gear; 170-Second transmission gear;

[0023] 200 - Transfer mechanism; 210 - Transfer component; 211 - Positioning slot; 220 - Third drive component; 230 - Protective block;

[0024] 300 - Dust removal patch assembly; 310 - Mounting base; 311 - Groove; 320 - Fourth drive component; 321 - Mounting plate; 330 - Dust removal component; 340 - Mounting component;

[0025] 400 - Switching mechanism; 410 - First driving component; 420 - Adjusting component; 421 - First adjusting component; 422 - Second adjusting component; 430 - Transmission component; 431 - Second rack; 4311 - Second external rack; 4312 - Second internal rack; 432 - Second gear; 440 - Mounting bracket; 450 - Fixing bracket; 451 - First plate; 452 - Second plate; 453 - Third plate; 460 - Guide component; 461 - Limiting protrusion; 470 - Sliding component;

[0026] 500 - Frame; 510 - Vertical pole. Detailed Implementation

[0027] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of this application.

[0028] It should be noted that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential," etc., indicating orientation or positional relationships based on the orientation or positional relationships shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application. The terms "installed," "connected," and "linked" should be interpreted broadly, for example, they can be fixed connections, detachable connections, or integral connections; they can be mechanical connections or electrical connections; they can be direct connections or indirect connections through an intermediate medium; they can be internal connections between two elements. The terms "parallel," "perpendicular," and "equal" include the described situation and situations similar to the described situation, the range of which is within an acceptable deviation range, wherein the acceptable deviation range is determined by those skilled in the art taking into account the measurement under discussion and the error associated with the measurement of a particular quantity (i.e., the limitations of the measurement system). For example, "parallel" includes absolute parallelism and approximate parallelism, where an acceptable deviation range for approximate parallelism can be, for example, within 5°; "perpendicular" includes absolute perpendicularity and approximate perpendicularity, where an acceptable deviation range for approximate perpendicularity can also be, for example, within 5°. "Equal" includes absolute equality and approximate equality, where an acceptable deviation range for approximate equality can be, for example, a difference between the two equal items being less than or equal to 5% of either one. Those skilled in the art will understand the specific meaning of the above terms in this application based on the specific circumstances.

[0029] To enable those skilled in the art to better understand the present application, the present application will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0030] PCB surface mount technology (SMT) systems are used in the electronics manufacturing industry to automate the placement of PCB components. During PCB placement, the cleanliness of the solder joints directly affects the soldering quality and the stability of the PCB. Impurities such as solder dross, dust, and metal shavings adhering to the solder joint surface can cause problems like cold solder joints and poor soldering, and in severe cases, can lead to electrical performance failure of the PCB. Therefore, dust removal treatment of the solder joints before placement is crucial.

[0031] In related technologies, solder joints on circuit boards need to be dusted before components are mounted. However, the dust removal process for solder joints is usually done manually or with dust removal equipment separate from the mounting device, separating dust removal from the mounting process. The circuit board needs to undergo solder joint pretreatment at the dust removal location before being transferred to the mounting location for component mounting. This adds an extra transfer step between different processes, and the circuit board needs to be repositioned after transfer, resulting in low mounting efficiency.

[0032] Based on this, this application proposes a circuit board mounting device to solve the technical problem of low mounting efficiency caused by the separation of dust removal and mounting processes in related technologies.

[0033] like Figure 1 and Figure 2 As shown, the circuit board mounting device of this application includes a conveying mechanism 100, a transfer mechanism 200, and a dust removal mounting mechanism 300.

[0034] The conveying mechanism 100 includes a conveying component 110 and at least two supporting components 120. The at least two supporting components 120 are disposed on the conveying component 110 and are used to support circuit boards. The conveying component 110 drives the supporting components 120 to move, sequentially transferring the at least two supporting components 120 to a first preset position. The transfer mechanism 200 is used to move the circuit board at the first preset position upwards to a second preset position detached from the supporting components 120. The dust removal and component mounting mechanism 300 is used to sequentially remove dust and mount components on the circuit board at the second preset position.

[0035] The circuit board mounting device provided in this application uses a conveying mechanism 100 to transport the circuit board to a first preset position, and then a transfer mechanism 200 to transport the circuit board from the first preset position to a second preset position. The dust removal and mounting mechanism 300, which integrates dust removal components and mounting components, sequentially performs dust removal on the solder joints of the circuit board and mounts components at the second preset position. This allows the circuit board to continuously complete dust removal and mounting at the second preset position, eliminating the need for transfer between the dust removal station and the mounting station. This solves the technical problem of low mounting efficiency caused by the separation of dust removal and mounting processes in related technologies, thereby achieving the technical effect of improving the mounting efficiency of circuit boards.

[0036] It should be noted that, in this embodiment, the first preset position is specifically the handover position of the circuit board between the conveying mechanism 100 and the transfer mechanism 200. At the first preset position, the circuit board is still supported by the support member 120 and positioned in the support groove 1223, waiting for the transfer mechanism 200 to lift the circuit board, or waiting for the circuit board to be mounted and then received and sent out by the support member 120.

[0037] The second preset position is the circuit board mounting and dust removal position, located above the first preset position. In the second preset position, the circuit board is supported by the transfer member 210 of the transfer mechanism 200 described below, and is completely detached from the support member 120. The dust removal and mounting mechanism 300 performs solder joint dust removal and component mounting on the circuit board in the second preset position.

[0038] This application moves the circuit board from a first preset position to a second preset position, allowing the circuit board to be separated from the conveyor mechanism 100 during processing. This helps prevent the conveyor mechanism 100 from interfering with dust removal and mounting operations, while also enabling dust removal and mounting to be completed continuously in the same position without the need to transfer between different workstations. In specific implementation, the arrangement of the first and second preset positions can be determined according to usage requirements.

[0039] The design concept of the circuit board mounting device in this application is to integrate the conveying, positioning, solder joint dust removal and component mounting of the circuit board into the same device through the cooperation of the conveying mechanism 100, the transfer mechanism 200 and the dust removal mounting mechanism 300. This allows the circuit board to complete solder joint dust removal and component mounting sequentially at the same station (second preset position) without the need for transfer between the dust removal station and the mounting station, and thus also eliminates the need for multiple positioning of the circuit board.

[0040] The conveying mechanism 100 is used to continuously feed and orderly transport circuit boards, the transfer mechanism 200 is used to switch the position of the circuit board from the conveying station to the processing station, and the dust removal and placement mechanism 300 is used to integrate dust removal and placement functions at the same station. The conveying mechanism 100, the transfer mechanism 200, and the dust removal and placement mechanism 300 cooperate sequentially in time and connect in space, so that the conveying, positioning, solder joint dust removal, and component placement of circuit boards can be completed continuously. This solves the problem in related technologies where the dust removal process and the placement process are separated, requiring transfer between different stations or equipment, thereby improving the placement efficiency of circuit boards.

[0041] The conveying mechanism 100 employs a combination structure of a conveying component 110 and at least two supporting components 120. The supporting components 120 are mounted on the conveying component 110, giving them dual functions of bearing and conveying. They serve as both the foundation for the circuit board and the moving carrier during the conveying process. The conveying component 110 drives the supporting components 120 to move cyclically along a predetermined path, and the at least two supporting components 120 sequentially and continuously move the circuit board from the feeding end to the first preset position, thereby achieving continuous feeding of the circuit board.

[0042] In one possible implementation, such as Figure 1 , Figure 2 and Figure 3As shown, the conveying mechanism 100 also includes a conveying frame 130, two pulleys 140 and a second driving member 150. The two pulleys 140 are rotatably mounted on the conveying frame 130. The conveying member 110 is a synchronous belt mounted on the two pulleys 140. The second driving member 150 is used to drive one of the pulleys 140 to rotate. One end of the support member 120 is connected to the synchronous belt, and the other end of the support member 120 is supported on the conveying frame 130.

[0043] With this configuration, when the second drive unit 150 drives the pulley 140 to rotate, the synchronous belt circulates between the two pulleys 140, driving the support member 120 to move along the conveyor frame 130. One end of the support member 120 is connected to the synchronous belt to obtain driving force, while the other end of the support member 120 is supported on the conveyor frame 130 to maintain balance. This ensures that the support member 120 remains horizontal during movement, guaranteeing the reliable positioning of the circuit boards supported on it. Through the cooperation of the two pulleys 140 and the synchronous belt, the support member 120 can continuously circulate along the conveyor frame 130, enabling continuous feeding of circuit boards and providing a continuous and stable material supply for subsequent positioning, dust removal, and mounting processes.

[0044] The synchronous belt is a flexible transmission component 430. Its main function is to transmit motion and power, and it does not have rigid support capabilities. If the support component 120 relies entirely on the synchronous belt for suspension and movement, it will sag due to gravity when supporting the circuit board, causing the circuit board to tilt or even slip off the support component 120, making stable transmission impossible.

[0045] Based on this, in this embodiment, there are multiple support members 120. One end of each support member 120 is connected to a synchronous belt to obtain driving force and moves synchronously with the synchronous belt along the conveying direction. The other end of the support member 120 is directly supported on the conveyor frame 130, and the rigid support of the conveyor frame 130 counteracts the weight of the support member 120 and the circuit board. During movement, the support member 120 forms a force state with one end suspended and driven, and the other end sliding and supported. The synchronous belt provides horizontal driving force, and the conveyor frame 130 provides vertical support force. The combined force of the two keeps the support member 120 horizontal at all times. Therefore, the circuit board maintains a stable posture during the conveying process and will not have displacement errors due to tilting, providing the necessary positional accuracy basis for moving the circuit board from the first preset position to the second preset position.

[0046] In addition, the driving force of the synchronous belt on the support 120 and the supporting force of the conveyor frame 130 on the support 120 mean that the synchronous belt does not need to bear the weight of the support 120 and the circuit board, which reduces the tension requirement of the synchronous belt, reduces the wear rate of the synchronous belt, and helps to extend the service life and maintenance cycle of the equipment.

[0047] As one structural example of the conveying mechanism 100, such as Figure 2 , Figure 3 and Figure 4 As shown, the conveyor frame 130 serves as the mounting carrier, and the support member 120 is plate-shaped. The conveyor frame 130 has a trough 131 extending circumferentially. The trough 131 provides an inner boss 132 located inside the trough 131 and an outer boss 133 located outside the trough 131. Two pulleys 140 are spaced apart on the inner boss 132, and a timing belt is wound around the outside of the two pulleys 140. The trough 131 is located outside the timing belt. One end of the support member 120 facing the timing belt is connected to the timing belt, and the other end of the support member 120 is supported on the outer boss 133.

[0048] As described above, the trough 131 on the conveyor frame 130 structurally divides the conveyor frame 130 into two functional areas: an inner boss 132 and an outer boss 133. The inner boss 132 is used to mount the two pulleys 140 and support the cyclical operation of the synchronous belt, ensuring stable and reliable belt movement. The outer boss 133 provides support for the free end of the support member 120, maintaining its balance as it moves with the synchronous belt. The synchronous belt is located inside the trough 131, and the support end of the support member 120 is located outside the trough 131. These two components are spatially located on opposite sides of the trough 131, without interfering with each other. This arrangement helps reduce friction or collision between the synchronous belt and the support end of the support member 120 during cyclical movement, ensuring smooth transmission and structural compactness.

[0049] like Figure 2 , Figure 4 and Figure 5 As shown, to facilitate the transmission of the rotational driving force of the second driving member 150 to one of the pulleys 140, in this embodiment, the second driving member 150 is located inside the synchronous belt and close to one of the pulleys 140. The power output end of the second driving member 150 is provided with a first transmission gear 160, and the top of the pulley 140 adjacent to the first transmission gear 160 is provided with a second transmission gear 170, which meshes with the first transmission gear 160. When the second driving member 150 is started, it can drive the corresponding pulley 140 to rotate through the meshing of the first transmission gear 160 and the second transmission gear 170, thereby driving the synchronous belt drive and realizing the movement of the support member 120, causing multiple support members 120 to move sequentially to a first preset position.

[0050] In the above structure, by placing the second drive component 150 inside the synchronous belt, it is beneficial to make full use of the space inside the synchronous belt and reduce the overall volume of the device. At the same time, the second drive component 150 is positioned close to the pulley 140, shortening the power transmission path and reducing energy loss during transmission. The direct meshing transmission between the first transmission gear 160 and the second transmission gear 170 results in a simple gear transmission structure with high reliability, which helps to reduce the manufacturing cost and maintenance difficulty of the equipment.

[0051] It should be noted that the transmission method between the first transmission gear 160 and the second transmission gear 170 is not limited to the direct meshing implementation described above. In other possible implementations, one or more intermediate transmission gears may be provided between the first transmission gear 160 and the second transmission gear 170, depending on the transmission distance and spatial layout requirements, so that the first transmission gear 160 can achieve indirect transmission with the second transmission gear 170 through the intermediate transmission gears. As long as the driving force of the second driving member 150 can be transmitted to the pulley 140, the technical effect of this application can also be achieved.

[0052] It is understood that the conveyor 110 is not limited to the synchronous belt structure in the above embodiments. In other possible embodiments, the conveyor 110 may also adopt a chain, conveyor belt or other conveying structure with continuous conveying function, as long as it can meet the usage requirements of continuous conveying of multiple support components 120 along a predetermined path, the technical effect of this application can also be achieved.

[0053] Furthermore, those skilled in the art should understand that the gear transmission structure between the second drive member 150 and the pulley 140 in the above embodiments is merely illustrative. In other possible embodiments, the second drive member 150 may also be connected to the pulley 140 via other transmission methods such as worm gear transmission or belt transmission, as long as the rotational driving force of the second drive member 150 can be transmitted to the pulley 140 and drive the synchronous belt to run. The specific structural form can be adaptively adjusted according to actual usage requirements.

[0054] In one possible implementation, such as Figure 6 As shown, the support member 120 includes a frame 121 and two support bodies 122. The two support bodies 122 are disposed opposite to each other on both sides of the frame 121. A support groove 1223 is defined between the two support bodies 122 and the frame 121. The support groove 1223 is used to support the circuit board. At least one support body 122 is movably disposed on the frame 121 so that the support body 122 can switch between a support state for the circuit board and a detached state for releasing the support of the circuit board.

[0055] As described above, the support component 120 adopts a structure consisting of a frame 121 and two support bodies 122. The two support bodies 122 and the frame 121 together define a support groove 1223. The support groove 1223 serves as the bearing space for the circuit board. During the process of the circuit board being moved with the support component 120, the groove wall of the support groove 1223 can limit and constrain the circuit board, restricting its horizontal movement and keeping its position stable during transport.

[0056] At least one support 122 is movably disposed on the frame 121, allowing the relative position between the two supports 122 to change, thus enabling the support 120 to have two switchable operating states. In the supporting state, the circuit board is stably supported within the support groove 1223, ensuring the stability of the circuit board's posture during transport. In the detached state, the distance between the two supports 122 increases, allowing the circuit board to detach from the support groove 1223. The transfer mechanism 200 can then lift the circuit board from the support groove 1223 and transfer it to a second preset position for processing.

[0057] By switching between a supporting state and a detached state, the support component 120 ensures the stability of the circuit board during the transmission process and provides space for subsequent positioning, cleaning and mounting processes, which helps to avoid interference between the support component 120 and the operation of the transfer mechanism 200 or the dust removal and mounting mechanism 300.

[0058] One structural example of the support member 120 is as follows: Figure 6 and Figure 7 As shown, the frame 121 has side plates 1211 disposed opposite to each other and end plates 1212 respectively connected between the same ends of the two side plates 1211. The two end plates 1212 respectively form the two ends of the frame 121, with one end plate 1212 facing the timing belt and the other end plate 1212 facing the outer protrusion 133. The frame 121 has a first vertical direction and a second vertical direction. The first direction is parallel to the extending direction of the side plate 1211 at a first preset position, and is also the moving direction of the support 122 at the first preset position. The second direction is parallel to the extending direction of the end plate 1212.

[0059] like Figure 6 As shown, connecting blocks 1213 are connected to the outer sides of the two end plates 1212 respectively. The connecting blocks 1213 are L-shaped. One connecting block 1213 is connected to the synchronous belt, and the other connecting block 1213 is supported on the outer boss 133. The structure of the connecting block 1213 is simple and easy to arrange and implement.

[0060] Two supports 122 are spaced apart along a first direction on the inner side of two end plates 1212, specifically the side of the end plate 1212 facing the circuit board. The support groove 1223 is defined between the two supports 122 and the two side plates 1211.

[0061] like Figure 6 and Figure 7 As shown, the support 122 includes a base plate 1221 and a top plate 1222. The top plate 1222 is vertically connected to the upper surface of the base plate 1221, making the support 122 shaped like a "⊥". The upper surface of the base plate 1221 is lower than the upper surface of the side plate 1211. The portion of the base plate 1221 located inside the top plate 1222 supports the lower surface of the circuit board. The top plate 1222 abuts against the side of the circuit board to limit its displacement in a first direction. The two end plates 1212 abut against the side of the circuit board to limit its displacement in a second direction.

[0062] In this embodiment, the top surface of the base plate 1221 provides vertical support for the circuit board, ensuring its stability under gravity. The portion of the base plate 1221 located inside the top plate 1222 serves as the bearing surface of the circuit board, contacting its lower surface to prevent it from falling downwards within the support groove 1223. The top plate 1222 forms a barrier on the side of the circuit board, abutting against its side and restricting displacement along the first direction. Simultaneously, the two end plates 1212 abut against their corresponding sides of the circuit board, further restricting displacement along the second direction.

[0063] In addition, through the coordinated cooperation of the base plate 1221, the top plate 1222 and the end plate 1212, the circuit board can simultaneously obtain vertical support and horizontal orthogonal positioning within the support groove 1223, ensuring that the circuit board remains in the predetermined position within the support groove 1223 during the transfer process. This helps to ensure the positional consistency of the circuit board when it is transferred to the first preset position, providing a reliable positioning basis for the subsequent transfer mechanism 200 to transfer the circuit board.

[0064] In one possible implementation, such as Figure 6 and Figure 7 As shown, both supports 122 are movably mounted on the frame 121. The support member 120 also includes a first rack 125 and a first gear 126. The first racks 125 are respectively mounted on the supports 122 and extend along the direction of movement of the supports 122. The first gear 126 is rotatably mounted on the frame 121 and is located between the two first racks 125 on the two supports 122. The first gear 126 meshes with both first racks 125 so that when one support 122 is driven to move, it drives the other support 122 to move synchronously in the opposite direction.

[0065] With this configuration, both supports 122 can move relative to the frame 121, allowing the two supports 122 to move simultaneously when the support member 120 switches between the supporting state and the detached state, without the need for separate drives. This simplifies the structure of the drive system and improves the efficiency of state switching.

[0066] The meshing of the first gear 126 with the two first racks 125 ensures that the two supports 122 maintain synchronous and opposite movements during movement. The first gear 126 is rotatably mounted on the frame 121, and the two first racks 125 are respectively mounted on the two supports 122, with the two first racks 125 located on both sides of the first gear 126 and meshing with it.

[0067] When the first rack 125 on one side moves along the first direction, the linear motion of the first rack 125 drives the first gear 126 to rotate through meshing. Since the two first racks 125 are located on opposite sides of the first gear 126, the same rotation direction of the first gear 126 will drive the first racks 125 on both sides to move in opposite directions. The two first racks 125 on both sides move away from each other along the first direction, thereby realizing the synchronous reverse movement of the two supports 122.

[0068] Since the two first racks 125 mesh with the same first gear 126, the rotational speed and rotational angle of the first gear 126 are simultaneously transmitted to the two first racks 125, so that the moving speed of the two supports 122 is always equal, which helps to ensure the synchronicity of the movement of the two supports 122.

[0069] Therefore, the circuit board is always in the center of the support groove 1223 when the support 120 is in the switching state. This helps to reduce the offset or tilting of the circuit board caused by the asynchronous movement of the two supports 122, and ensures the consistency of the circuit board's position in the detached state. This provides a reliable positioning basis for the transfer mechanism 200 to lift the circuit board.

[0070] As a structural example, such as Figure 7 As shown, for ease of distinction, the first rack 125 located inside the first gear 126 is referred to as the first internal rack 1252, and the first rack 125 located outside the first gear 126 is referred to as the first external rack 1251. The first internal rack 1252 is located inside the first external rack 1251. Both the first internal rack 1252 and the first external rack 1251 extend along a first direction, and the first internal rack 1252 and the first external rack 1251 are arranged at intervals in a second direction. The first gear 126 is located within the space formed between the first internal rack 1252 and the first external rack 1251.

[0071] When the two supports 122 are driven by an external force to switch from a supported state to a disengaged state, the first internal rack 1252 and the first external rack 1251 move synchronously in a direction away from each other. Synchronization between the first internal rack 1252 and the first external rack 1251 is achieved through the first gear 126. When the support 122 with the first internal rack 1252 is driven by an external force to switch from a supported state to a disengaged state, the first internal rack 1252 moves in a direction away from the first external rack 1251, thereby driving the first gear 126 to rotate. The rotation of the first gear 126 then drives the first external rack 1251 to move synchronously in a direction away from the first internal rack 1252. Therefore, the cooperation of the first internal rack 1252 and the first external rack 1251 with the first gear 126 enables the two supports 122 to move synchronously in a direction away from each other.

[0072] In addition, such as Figure 7 As shown, each base plate 1221 is equipped with a connector 127, which has a crossbar and two side bars connected to both ends of the crossbar. The crossbar extends along a second direction, and the side bars extend along a first direction. The crossbar is connected to the outer side of the base plate 1221, which is located between the two side bars. Each side bar is connected to a first rack 125. Two first internal racks 1252 are connected to one connector 127, and two first external racks 1251 are connected to the other connector 127. There are also two first gears 126. This arrangement allows the two sets of first internal racks 1252, first external racks 1251, and first gears 126 to cooperate and achieve a transmission connection on both sides of the frame 121, which helps to improve the stability of the two supports 122 during synchronous movement.

[0073] In one possible implementation, such as Figure 6 and Figure 7 As shown, both supports 122 are movably mounted on the frame 121. The support member 120 also includes a guide rod 123 and an elastic member 124. The guide rod 123 is respectively mounted on each support 122 and extends along the moving direction of the support 122. The guide rod 123 is slidably mounted on the frame 121. The elastic member 124 is located between the frame 121 and the support 122. The elastic member 124 is used to apply an elastic force to the corresponding support 122 to drive the support 122 to the supporting state.

[0074] With this configuration, the sliding direction of the guide rod 123 is consistent with the moving direction of the support body 122, thus limiting the movement trajectory of the support body 122 to a predetermined path. The guide rod 123 can guide and limit the movement of the support body 122. When the support body 122 is driven by an external force to switch from a supporting state to a detached state, the guide rod 123 moves together with the support body 122 and slides within the frame 121. It will not deviate or veer due to uneven force, which helps to ensure the movement stability of the two support bodies 122 during the state switching process.

[0075] like Figure 7 As shown, the elastic element 124 is disposed between the frame 121 and the support body 122. When the support body 122 is in the supporting state, the elastic element 124 is in a natural state or a pre-compressed state. When an external force drives the support body 122 to switch to the disengaged state, the support body 122 moves and compresses the elastic element 124, causing the elastic element 124 to accumulate elastic potential energy. When the external force is removed, the elastic element 124 releases the accumulated elastic potential energy and applies an elastic force to the support body 122 to reset the support body 122 to the supporting state, which is beneficial for achieving the automatic reset of the support body 122.

[0076] As a structural example, such as Figure 6 and Figure 7 As shown, guide rod 123 is located outside top plate 1222. One end of guide rod 123 is connected to top plate 1222, and the other end of guide rod 123 passes through the corresponding end plate 1212 and extends to the outside of end plate 1212. To further improve the stability of the guide, two guide rods 123 are provided on one end plate 1212 at intervals. To prevent guide rod 123 from detaching from end plate 1212, a limiting block 1231 is also provided at the end of guide rod 123 extending out of end plate 1212, and end plate 1212 is located between top plate 1222 and limiting block 1231.

[0077] The limiting block 1231 is located at the end of the guide rod 123 extending out of the end plate 1212. When the support body 122 is reset to the supporting state under the drive of the elastic member 124, the limiting block 1231 abuts against the outer side of the end plate 1212, which can limit the extreme extension position of the guide rod 123, thereby limiting the reset endpoint position of the support body 122 and preventing the support body 122 from over-resetting, causing the two support bodies 122 to collide or be damaged.

[0078] The elastic element 124 is specifically a spring. The elastic element 124 is sleeved on the guide rod 123. The elastic element 124 is located between the end plate 1212 and the top plate 1222. One end of the elastic element 124 abuts against the end plate 1212, and the other end of the elastic element 124 abuts against the top plate 1222.

[0079] The elastic element 124 is sleeved on the guide rod 123 and located between the end plate 1212 and the top plate 1222. The guide rod 123 simultaneously undertakes the dual functions of guidance and spring installation and positioning. There is no need to set up an independent installation structure for the elastic element 124, making the overall structure more compact.

[0080] In one possible implementation, such as Figure 1 , Figure 2 and Figure 8 As shown, the circuit board mounting device in this embodiment of the application further includes a switching mechanism 400, which is used to drive at least one support 122 located at a second preset position to move, so that the support 122 switches from a supporting state to a disengaged state.

[0081] With this configuration, after the transfer mechanism 200 moves the circuit board to the second preset position, the switching mechanism 400 drives the support 122 to switch from a supporting state to a detached state, allowing the circuit board to complete the transition from the transfer state to the processing state at the second preset position. After the switching mechanism 400 is activated, the circuit board detaches from the support slot 1223 and remains at the second preset position to await subsequent dust removal and surface mount operations.

[0082] The switching mechanism 400 is positioned after the transfer mechanism 200 and before the dust removal and placement mechanism 300. The sequential coordination of these three mechanisms forms a complete work cycle of transfer, switching, and processing. After the transfer mechanism 200 moves the circuit board to the second preset position, the switching mechanism 400 drives the support 122 to open, ensuring that the support 122 no longer interferes with the circuit board. The dust removal and placement mechanism 300 then performs dust removal and placement on the circuit board located at the second preset position. The switching mechanism 400 allows the support 122 to actively move aside, preventing it from interfering with the circuit board or the dust removal and placement mechanism 300 during dust removal and placement, ensuring the orderly connection of each process and thus improving placement efficiency.

[0083] In one possible implementation, the switching mechanism 400 includes a first driving member 410 and at least one adjusting member 420. The at least one adjusting member 420 is located between two supports 122 at a second preset position. The first driving member 410 is used to drive the adjusting member 420 to move so as to switch the corresponding support 122 from the supporting state to the disengaged state.

[0084] In this configuration, the first driving member 410 provides a power source for the switching mechanism 400, and the adjusting member 420, as a power transmission component, transmits the driving force of the first driving member 410 to the support body 122. The adjusting member 420 is located between the two supports 122. When the first driving member 410 drives the adjusting member 420 to move, the adjusting member 420 directly abuts against the corresponding support body 122 and pushes the support body 122 outward, thereby increasing the distance between the two supports 122 and switching the support body 122 from the supporting state to the disengaged state.

[0085] In the switching mechanism 400, the first driving component 410 and the adjusting component 420 have clearly defined functions. The first driving component 410 is responsible for generating driving force, while the adjusting component 420 is responsible for transmitting the driving force to the support body 122. The layout of the adjusting component 420 between the two supports 122 allows it to act directly on the supports 122 without the need for additional transmission components. This results in a short driving force transmission path and a compact structure. Simultaneously, through the direct contact and pushing of the adjusting component 420 against the supports 122, the switching mechanism 400 can precisely control the timing and stroke of the support body 122 switching to the disengaged state after the transfer mechanism 200 has moved the circuit board to the second preset position. This ensures precise coordination between the state switching of the support body 122 and the transfer action of the transfer mechanism 200, guaranteeing the orderly connection between each process.

[0086] As a structural example of the switching mechanism 400, such as Figure 8 As shown, the switching mechanism 400 is mounted on the inner boss 132 of the conveyor frame 130. The adjusting member 420 is located inside the support body 122 of the support member 120 at the first preset position, and is located above the circuit board. The adjusting member 420 is located at the first preset position and extends along the second direction. This arrangement helps to ensure that the adjusting member 420 does not affect the conveying of the support member 120, and also helps to increase the force applied by the adjusting member 420 to the support body 122, thereby driving the support body 122 to move.

[0087] By setting the adjusting member 420 to the first preset position, when the supporting member 120 moves along the predetermined path to the first preset position under the drive of the conveying mechanism 100, the adjusting member 420 is ensured to be located between the two supporting bodies 122 of the supporting member 120, and forms a spatial correspondence with the corresponding supporting body 122, so as to facilitate abutment and cooperation with the supporting body 122 at the first preset position.

[0088] The arrangement of the adjusting member 420 above the circuit board ensures that it will not interfere with the circuit board or occupy the bearing space of the support groove 1223 during the movement of the support member 120 with the synchronous belt, thus guaranteeing that the normal conveying function of the support member 120 under the support of the circuit board is not affected. Simultaneously, the adjusting member 420 is located between the two supports 122 and extends along the second direction. When the adjusting member 420 moves under the drive of the first drive member 410, it can directly apply force to the supports 122 between the two supports 122. This improves the efficiency and accuracy of the switching mechanism 400 in applying force to the supports 122, ensuring that the supports 122 can reliably switch from the supporting state to the disengaged state at the second preset position.

[0089] In one possible implementation, such as Figure 6 and Figure 8 As shown, both supports 122 are movably mounted on the frame 121. The switching mechanism 400 includes two adjusting members 420, which are respectively located between the two supports 122 at a second preset position. The switching mechanism 400 also includes a transmission member 430, which is located between the two adjusting members 420. The first driving member 410 drives one adjusting member 420 to move, and the transmission member 430 drives the other adjusting member 420 to move synchronously in the opposite direction, thereby pushing the two supports 122 to switch from a supported state to a disengaged state.

[0090] The switching mechanism 400 employs two adjusting members 420, each corresponding to one of the two supporting bodies 122. A first driving member 410 drives the two adjusting members 420 to move synchronously in opposite directions via a transmission member 430, causing both adjusting members 420 to simultaneously push the two supporting bodies 122 from the inside out. Compared to a solution with only one adjusting member 420, the two adjusting members 420 pushing the two supporting bodies 122 respectively result in a more balanced force distribution on the two supporting bodies 122, which improves the smoothness of the movement of the supporting bodies 122 during state switching.

[0091] The transmission component 430 is positioned between the two adjusting components 420, creating a mechanical linkage between their movements. When one adjusting component 420 moves along a first direction under the drive of the first driving component 410, the other adjusting component 420 moves synchronously in the opposite direction via the transmission component 430. The two adjusting components 420 always move towards or away from each other at the same speed, ensuring the synchronicity of the two supports 122 during state switching. When the two adjusting components 420 move away from each other along the first direction under the drive of the first driving component 410, the transmission component 430 helps ensure the synchronicity of their movements.

[0092] As a structural example of the switching mechanism 400, such as Figure 8As shown, a mounting bracket 440 is provided on the conveyor frame 130. A first driving member 410 is a cylinder mounted on the mounting bracket 440. The power output end of the first driving member 410 is connected to a fixed bracket 450, and the first driving member 410 can drive the fixed bracket 450 to move along a first direction. One adjusting member 420 is connected to the fixed bracket 450, and another adjusting member 420 is slidably mounted on the mounting bracket 440 along the first direction. For ease of description, the adjusting member 420 connected to the fixed bracket 450 is referred to as the first adjusting member 421, and the other adjusting member 422 is referred to as the second adjusting member 422. Figure 8 Only a portion of the structure of the mounting bracket 440 is shown in the diagram.

[0093] The first adjusting member 421 and the second adjusting member 422 are arranged at a distance in the second direction, and the first adjusting member 421 and the second adjusting member 422 can move away from or closer to each other in the first direction. The transmission member 430 is used to realize the transmission between the first adjusting member 421 and the second adjusting member 422, so that the two can move synchronously in opposite directions.

[0094] Specifically, such as Figure 8 As shown, the fixing frame 450 includes a first plate 451, a second plate 452, and a third plate 453. The second plate 452 is horizontally arranged, the first plate 451 is vertically arranged on the upper surface of the second plate 452 near the end of the first driving member 410, and the third plate 453 is vertically arranged on the lower surface of the second plate 452 away from the end of the first driving member 410. The power output end of the first driving member 410 is specifically connected to the first plate 451, and a first adjusting member 421 is located at the bottom of the third plate 453. The first adjusting member 421 is rod-shaped.

[0095] Sliding members 470 extending along a first direction are provided on both sides of the fixing frame 450. Parts of the two sliding members 470 are slidably disposed in the slide grooves of the mounting frame 440, while the other parts are located outside the mounting frame 440. The ends of the two sliding members 470 away from the mounting frame 440 are connected by a second adjusting member 422. This arrangement allows the second adjusting member 422 to move relative to the mounting frame 440 along the first direction via the sliding members 470.

[0096] In addition, such as Figure 8As shown, two guide members 460 are spaced apart on the mounting bracket 440, extending along a first direction and passing through the first plate 451 of the fixing bracket 450. When the first driving member 410 drives the fixing bracket 450 to move relative to the mounting bracket 440, the guide members 460 restrict the direction of movement of the fixing bracket 450, allowing it to move only along the first direction, thereby improving the stability of the fixing bracket 450 during movement. A radially protruding limiting protrusion 461 is provided at the end of the guide member 460 extending beyond the first plate 451. When the first plate 451 abuts against the limiting protrusion 461, the fixing bracket 450 cannot continue to move, thus ensuring the reliability of the fixing bracket 450's movement.

[0097] The first adjusting member 421 is directly connected to the fixed frame 450, and the second adjusting member 422 is slidably connected to the mounting frame 440 via the sliding member 470. When the first driving member 410 drives the fixed frame 450 to move, the fixed frame 450 directly drives the first adjusting member 421 to move. At the same time, the movement of the fixed frame 450 is transmitted to the second adjusting member 422 through the transmission member 430, so that the two adjusting members 420 move synchronously in opposite directions. The method of using the fixed frame 450 to directly drive one adjusting member 420 and the transmission member 430 to synchronously drive the other adjusting member 420 achieves the synchronous reverse movement of two adjusting members 420 with only one driving member, which is beneficial to the simplification of the structure of the switching mechanism 400.

[0098] In one possible implementation, such as Figure 8 As shown, the transmission component 430 includes a second rack 431 and a second gear 432. Each adjusting component 420 is provided with a second rack 431. The second rack 431 extends along the moving direction of the support body 122. The second gear 432 is located between the two second racks 431 on the two adjusting components 420. The second gear 432 meshes with both second racks 431 so that when one adjusting component 420 moves, it drives the other adjusting component 420 to move in the opposite direction.

[0099] The second racks 431 are respectively disposed on the two adjusting members 420 and extend along the moving direction of the support body 122. The second gear 432 is located between the two second racks 431 and meshes with both second racks 431, forming a transmission structure in which the second gear 432 is located in the middle and the two second racks 431 are located on both sides. When the first driving member 410 drives one of the first adjusting members 421 to move in the first direction, the second racks 431 on the first adjusting member 421 move accordingly and drive the second gear 432 to rotate. The second gear 432 then drives the second racks 431 on the second adjusting member 422 to move in the opposite direction, thereby causing the other adjusting member 420 to move synchronously in the opposite direction.

[0100] For ease of distinction, the second rack 431 provided on the first adjusting member 421 is referred to as the second inner rack 4312, and the second rack 431 provided on the second adjusting member 422 is referred to as the second outer rack 4311. In terms of specific structure, as follows... Figure 8 As shown, the second internal rack 4312 is respectively disposed on opposite sides of the second plate 452 in the fixed frame 450, and the second external rack 4311 is respectively connected to the two sliding members 470. The second external rack 4311 and the corresponding second internal rack 4312 are spaced apart along the second direction, and the second gear 432 is rotatably disposed on the mounting frame 440. The second gear 432 is located between the adjacent second external rack 4311 and the second internal rack 4312, and both the second external rack 4311 and the second internal rack 4312 mesh with the second gear 432.

[0101] When the first driving member 410 drives the fixed frame 450 to move toward the first driving member 410, it also drives the second internal rack 4312 to move in the direction close to the first driving member 410, thereby driving the second gear 432 to rotate. The second gear 432 drives the second external rack 4311 to move synchronously in the direction away from the first driving member 410. The distance between the first adjusting member 421 and the second adjusting member 422 increases, thereby driving the corresponding support body 122 to move in the direction away from each other, thus causing the support body 122 to switch from the supporting state to the detached state.

[0102] In this embodiment, the second internal rack 4312 is disposed on opposite sides of the second plate 452 in the fixed frame 450. The second internal rack 4312 moves together with the fixed frame 450, and the fixed frame 450 directly drives the first adjusting member 421. The second external rack 4311 is connected to the sliding member 470. The second external rack 4311 moves together with the sliding member 470, and the sliding member 470 drives the second adjusting member 422. The second internal rack 4312 and the second external rack 4311 are spaced apart along the second direction. The second gear 432 is located between them and meshes with both. When the first driving member 410 drives the fixed frame 450 to move, the fixed frame 450 directly drives the first adjusting member 421 and the second internal rack 4312 to move synchronously. At the same time, the second internal rack 4312 drives the second external rack 4311 to move in the opposite direction through the second gear 432. The second external rack 4311 drives the second adjusting member 422 to move in the opposite direction synchronously through the sliding member 470. This increases the distance between the two adjusting members 420 and pushes the two supports 122 to move outward synchronously, realizing the switch from the supporting state to the disengaged state.

[0103] In one possible implementation, such as Figure 3 and Figure 9As shown, the transfer mechanism 200 includes a transfer member 210 and a third drive member 220. The transfer member 210 is used to support the circuit board. The third drive member 220 is connected to the transfer member 210 and is used to drive the transfer member 210 to move up and down so as to transfer the circuit board from a first preset position to a second preset position.

[0104] Through the above technical solution, the transfer member 210 serves as the direct support component for the circuit board. After the circuit board is transferred to the first preset position by the support member 120, the third driving member 220 drives the transfer member 210 to rise. The top of the transfer member 210 contacts the lower surface of the circuit board and lifts the circuit board upward, so that the circuit board gradually rises from the first preset position to the second preset position.

[0105] The transfer mechanism 200 moves the circuit board from a first preset position to a second preset position, changing the vertical position of the circuit board and switching it from a conveying state in contact with the support 120 to a processing state separated from the support 120. At the second preset position, the circuit board is completely detached from the support 120, and the support 120 no longer provides support or restriction for the circuit board. The circuit board is independently positioned below the dust removal and mounting mechanism 300. The transfer mechanism 200 ensures that the positioning and processing of the circuit board no longer depend on the support groove 1223 of the support 120, which helps to avoid interference from the conveying mechanism 100 during dust removal and mounting processes.

[0106] In terms of specific structure, such as Figure 3 and Figure 9 As shown, an opening 134 is provided on the conveyor frame 130, and the opening 134 is located below the support member 120 at the first preset position. The transfer member 210 is located below the opening 134 in the initial state.

[0107] When the support member 120 moves the circuit board to the first preset position, the circuit board corresponds vertically to the position of the opening 134. At this time, the third driving member 220 drives the transfer member 210 to move upward. After the transfer member 210 passes through the opening 134, it contacts the lower surface of the circuit board in the support groove 1223 and lifts the circuit board upward. The opening 134 provides a clearance passage for the rise of the transfer member 210, allowing the transfer member 210 to pass through the bottom of the conveyor frame 130 and enter the interior of the support groove 1223. This helps to avoid interference with the conveyor frame 130 or the support member 120, thereby enabling the transfer mechanism 200 and the conveying mechanism 100 to achieve a spatially non-interfering layout.

[0108] With the above structure, the conveying mechanism 100 and the transfer mechanism 200 are arranged in a layered manner in space. The conveying mechanism 100 is located above the conveyor frame 130, and the transfer mechanism 200 is located at the bottom of the conveyor frame 130. The two mechanisms are vertically separated, operate independently, and do not interfere with each other. At the same time, the transfer component 210 of the transfer mechanism 200 is moved to the space where the conveying mechanism 100 is located through the opening 134, which improves the space utilization and the compactness of the overall layout.

[0109] In terms of specific structure, such as Figure 9 As shown, the third driving component 220 is a cylinder located at the top of the conveyor frame 130. The power output end of the third driving component 220 is connected to the transfer component 210, thereby driving the transfer component 210 to rise and fall. The cross-sectional area of ​​the transfer component 210 is smaller than that of the circuit board. The upper surface of the transfer component 210 is provided with a positioning groove 211. The bottom edge of the circuit board, which is detached from the support component 120, is embedded in the positioning groove 211, which limits the circuit board in the horizontal direction. In the positioned state, the lower surface of the circuit board is in contact with the bottom wall of the positioning groove 211, and the four edges of the circuit board protrude from the outer edge of the transfer component 210. The circuit board positioned on the transfer component 210 moves upward with the transfer component 210 to the second preset position. Here, the cross-sectional area of ​​the transfer component 210 is smaller than that of the circuit board, resulting in a simple structure and easy processing and forming.

[0110] In one possible implementation, such as Figure 1 , Figure 10 and Figure 11 As shown, the dust removal and placement mechanism 300 includes a placement base 310, a fourth drive unit 320, a dust removal component 330, and a placement component 340. Both the dust removal component 330 and the placement component 340 are mounted on the placement base 310. The dust removal component 330 is used for dust removal from the circuit board, and the placement component 340 is used for placing components onto the circuit board. The fourth drive unit 320 drives the placement base 310 to rise and fall. When the placement base 310 moves to a second preset position, a cavity is formed between the placement base 310 and the transfer mechanism 200, and the circuit board is located within the cavity. The dust removal component 330 and the placement component 340 are then activated sequentially.

[0111] Through the above technical solution, the dust removal component 330 and the mounting component 340 are integrated on the same mounting base 310. The mounting base 310 is driven to rise and fall by the fourth driving component 320, so that the mounting base 310 sequentially completes dust removal and mounting at the second preset position, without the need to transfer the circuit board between different workstations. When the mounting base 310 moves to the second preset position, the mounting base 310 and the transfer mechanism 200 form a cavity. The cavity provides a relatively enclosed working space for the dust removal component 330, allowing the airflow generated by the dust removal component 330 on the circuit board surface to be concentrated on the solder joint area, reducing the diffusion of impurities into the surrounding environment. At the same time, the cavity can also effectively prevent dust or debris from the external environment from falling back onto the circuit board surface during the dust removal and mounting process.

[0112] After the mounting bracket 310 descends to the second preset position, the dust removal component 330 is activated first to remove dust, debris, and other impurities from the solder joints of the circuit board. After dust removal, the mounting component 340 is activated to mount the components onto the cleaned solder joints. The dust removal and mounting processes are completed sequentially at the second preset position. Compared with related technologies, this embodiment eliminates the waiting time for circuit board transfer and secondary positioning, reducing the connection points between processes and effectively improving mounting efficiency. Furthermore, since dust removal and mounting are completed at the same station, the positional accuracy of the circuit board at the second preset position remains consistent throughout the process, preventing secondary positioning errors due to station transitions and ensuring component mounting accuracy.

[0113] like Figure 10 As shown, the circuit board mounting device of this application embodiment also includes a frame 500, which is frame-shaped. A conveyor frame 130 is disposed on the frame 500, and a portion of the timing belt passes through the frame 500. The dust removal mounting mechanism 300 is specifically disposed on the frame 500 and is located above the support member 120 at the first preset position.

[0114] An exemplary structure of the dust removal patch mechanism 300 is as follows: Figure 1 , Figure 10 and Figure 11 As shown, the fourth driving component 320 is located at the top of the frame 500. The fourth driving component 320 is a cylinder, and its power output end is connected to the mounting plate 321. The mounting base 310 is specifically installed in the middle of the lower surface of the mounting plate 321. The fourth driving component 320 drives the mounting base 310 to rise and fall through the mounting plate 321. To further improve the stability of the mounting base 310 during movement, multiple vertical rods 510 are provided inside the frame 500, each passing through the mounting plate 321. When the mounting plate 321 rises and falls, the multiple vertical rods 510 cooperate to guide the mounting plate 321, giving it better stability during the rising and falling process.

[0115] like Figure 11 As shown, the mounting base 310 has a groove 311 facing the transfer member 210. When the mounting base 310 and the transfer member 210 are engaged, it is beneficial to form a cavity between them.

[0116] In the above structure, the frame 500 is frame-shaped, the conveyor frame 130 is mounted on the frame 500 and partially located within the frame 500, and the dust removal patch assembly 300 is mounted on the frame 500 and located above the support member 120, so that the conveyor mechanism 100 and the dust removal patch assembly 300 form a layered layout on the frame 500. The conveyor mechanism 100 is located in the lower region of the frame 500, and the dust removal patch assembly 300 is located in the upper region of the frame 500. The two are vertically separated and do not interfere with each other. The mounting base 310 has a groove 311 facing the transfer member 210. When the mounting base 310 and the transfer member 210 of the transfer mechanism 200 are engaged, the circuit board and part of the transfer member 210 enter the groove 311, which helps to form a cavity.

[0117] In this embodiment, the dust removal component 330 is a suction nozzle, which is mounted on the mounting base 310. The suction port of the suction nozzle is located within the groove 311. The suction nozzle is connected to an external negative pressure device (such as a vacuum pump) via a pipeline. When the mounting base 310 moves to the second preset position, the negative pressure device is activated, generating negative pressure at the suction port of the suction nozzle. This negative pressure draws dust, debris, and other impurities from the surface of the circuit board solder joints into the suction nozzle and discharges them through the pipeline to a collection device. Through negative pressure adsorption, impurities are promptly removed from the solder joint surface and collected, preventing impurities from spreading inside the equipment or falling back onto the circuit board surface.

[0118] After the fourth driving component 320 drives the placement bracket 310 to descend to the second preset position, the dust removal component 330 starts to remove dust from the solder joint area of ​​the circuit board. After the dust removal is completed, the dust removal component 330 stops working, and the placement component 340 then starts to perform placement.

[0119] As an example, the placement component 340 includes a nozzle disposed within the placement base 310 and connected to a vacuum generator. The nozzle is used to contact and attract components. The vacuum generator generates negative pressure and transmits this negative pressure to the nozzle through a conduit. Additionally, the placement base 310 is provided with a drive unit for moving the nozzle up and down; this drive unit may specifically be a cylinder or similar component capable of outputting linear driving force.

[0120] Before the placement unit 340 is activated, the nozzle has already picked up the components to be placed. After the dust removal unit 330 completes the dust removal operation on the circuit board solder joints, the placement unit 340 is activated. The vacuum generator operates, generating negative pressure at the suction orifice of the nozzle, causing the components to be attracted to the end of the nozzle. When the placement base 310 is in the second preset position, the vacuum generator stops operating or switches to a vacuum breaking state, the negative pressure at the suction orifice of the nozzle disappears or decreases, and the components are detached from the nozzle under the action of gravity and placed on the solder joints of the circuit board, completing the placement on the circuit board.

[0121] In this embodiment, both the dust removal component 330 and the mounting component 340 are disposed on the mounting base 310, with the dust removal component 330 starting before the mounting component 340. After the dust removal component 330 completes the dust removal operation on the circuit board solder joints, the mounting component 340 then starts to mount the components onto the dust-removed solder joints.

[0122] With the above configuration, the dust removal component 330 and the mounting component 340 share the same mounting base 310 and the fourth drive component 320, eliminating the need for separate drive mechanisms for the dust removal component 330 and the mounting component 340. This simplifies the equipment structure and reduces manufacturing costs. Furthermore, dust removal and mounting are performed sequentially at the second preset position, eliminating the need for the circuit board to be transferred between different workstations during the dust removal and mounting process. This avoids secondary positioning errors caused by workstation transitions and helps ensure the mounting accuracy of components.

[0123] In addition, the dust removal component 330 is activated before the mounting component 340, ensuring that the solder joints are clean before mounting. This avoids impurities being trapped between the components and the solder joints, which can lead to poor soldering or contact problems, thereby improving mounting quality and the electrical reliability of the circuit board.

[0124] In addition, such as Figure 9 As shown, two protective blocks 230 are also provided on the outer side of the transfer component 210. The two protective blocks 230 can abut against the mounting base 310 in the second preset position, restricting the downward displacement of the mounting base 310, and playing a role in positioning and protection.

[0125] In one possible implementation, to facilitate the picking up of components by the dust removal and placement mechanism 300, the circuit board placement device of this application embodiment further includes a component conveying mechanism. The component conveying mechanism has the function of extending into and removing from the frame 500. When the component conveying mechanism extends into the frame 500, it can convey the component from the feeding area to a third preset position located between a first preset position and a second preset position, and it can remove the component from the frame 500 to move it away from the third preset position.

[0126] When the mounting base 310 needs to pick up a component, the component conveying mechanism conveys the component to the third preset position. Driven by the fourth driving member 320, the mounting base 310 moves downwards, causing the mounting component 340 to move downwards and extend beyond the mounting base 310 to pick up the component located at the third preset position. After picking up the component, the mounting component 340 returns to its original position, the mounting base 310 returns to its original position, and the component conveying mechanism moves out of the frame 500 and away from the third preset position.

[0127] Through the above technical solution, the placement stand 310 can pick up components at the third preset position inside the frame 500 without moving to the feeding area. The component conveying mechanism directly transports the components to below the placement stand 310, shortening the travel distance of the placement stand 310, reducing the equipment's requirement for horizontal movement space, and improving picking efficiency. Simultaneously, after completing the feeding, the component conveying mechanism can move out of the frame 500 and away from the third preset position, providing an unobstructed working space for the placement stand 310 to descend to the second preset position for dust removal and placement operations.

[0128] For example, in one possible implementation, the component conveying mechanism is a robotic arm. The robotic arm can be mounted on one side of the frame 500, and includes a robotic arm, grippers or nozzles, and a drive mechanism. One end of the robotic arm is connected to the drive mechanism, and the grippers or nozzles are located at the free end of the robotic arm. The drive mechanism is used to drive the robotic arm to move between the feeding area and a third preset position.

[0129] The robotic arm is used to pick up components from the feeding area and transfer them to a third preset position. Specifically, when the placement mount 310 needs to pick up a component, the robotic arm's drive mechanism drives the robotic arm to move to the feeding area. The grippers or nozzles, under the action of the drive mechanism, grip or suction the component. Then, the robotic arm carries the component to the third preset position inside the frame 500, placing the component in the third preset position or holding it at the end of the grippers / nozzles to await pickup by the placement mount 310. After the placement mount 340 completes the pickup of the component, the robotic arm moves out of the frame 500 and resets.

[0130] Through the above technical solution, the robotic arm has high flexibility and freedom, and can adaptively adjust according to the position of the feeding area and the placement posture of the components. It is suitable for picking up and transferring components of various shapes and sizes, and is especially suitable for feeding irregularly shaped or large-sized components. At the same time, after completing the feeding, the robotic arm can be completely removed from the frame 500 without interfering with the subsequent dust removal and patching mechanism 300.

[0131] It should be noted that the gripper and the suction nozzle can be set individually or simultaneously to allow for switching between different types of components. For example, for components with flat surfaces (such as chips and resistors), the suction nozzle can be used for adsorption and pickup; for components with irregular shapes or special structures, the gripper can be used for clamping and pickup. The drive mechanism can be any of a servo motor, pneumatic cylinder, or hydraulic cylinder, as long as it meets the requirement of driving the robotic arm to move between the feeding area and the third preset position.

[0132] In one possible implementation, a control panel is fixedly mounted on one side of the frame 500. All driving components are electrically connected to the control panel, and the dust removal component 330 and the mounting component 340 are also electrically connected to the control panel. The control panel is used to control the timing and operating parameters of the conveying mechanism 100, the transfer mechanism 200, the switching mechanism 400, and the dust removal mounting mechanism 300.

[0133] The control panel, as the core of the PCB placement device, can control the start, stop, sequence of actions, and stroke of each drive component according to a preset program. This ensures that the conveying mechanism 100, transfer mechanism 200, switching mechanism 400, and dust removal placement mechanism 300 operate sequentially according to a predetermined timeline, achieving automated control of the PCB from conveying, positioning, and switching to dust removal and placement. Simultaneously, the control panel can adjust the operating parameters of each drive component (such as transfer stroke, lifting speed, and dust removal time) according to different PCB specifications, enabling the equipment to adapt to PCBs of different sizes and process requirements, thus improving the equipment's versatility and automation level.

[0134] The circuit board mounting device of this application embodiment, through the coordinated operation of the conveying mechanism 100, the transfer mechanism 200, the switching mechanism 400 and the dust removal mounting mechanism 300, realizes continuous automated operation of circuit board conveying, positioning, repositioning, solder joint dust removal and component mounting in the same device. The whole process does not require manual intervention or the setting of independent cleaning equipment, saving separate cleaning procedures, reducing equipment investment costs and labor costs, and improving the continuity and automation of the circuit board mounting production line.

[0135] The conveying mechanism 100 achieves precise transmission and transportation of the circuit board through the cooperation of the synchronous belt and the support member 120. The support member 120 positions and constrains the circuit board through the support groove 1223 formed between the frame 121 and the two support bodies 122, ensuring the positional stability of the circuit board during the conveying process. The transfer mechanism 200 moves the circuit board from the first preset position to the second preset position, so that the circuit board is completely separated from the support member 120 during processing and obtains an independent positioning state. This avoids positional deviations caused by the shaking of the support member 120 or the vibration during conveying, and provides a precise positioning basis for subsequent dust removal and mounting.

[0136] The switching mechanism 400 simultaneously pushes the two supports 122 to open via two adjusting components 420. This provides space for the lifting of the circuit board and the operation of the dust removal and mounting mechanism 300. After processing, the mechanism can be stably reset via the elastic component 124 to receive the mounted circuit board. This ensures seamless connection between the various processes of circuit board conveying, positioning, processing and unloading, avoiding efficiency losses caused by poor connection between processes in related technologies, and effectively improving the overall production efficiency of circuit board mounting.

[0137] The dust removal and placement mechanism 300 integrates the dust removal component 330 and the placement component 340 on the same placement base 310, and completes the solder joint dust removal and component placement sequentially at the same station. This eliminates the need to transfer the circuit board between different stations during the dust removal and placement process, avoiding secondary positioning errors caused by station changes. It ensures accurate alignment between the dust removal component 330 and the circuit board solder joints, guaranteeing the thoroughness of solder joint dust removal and effectively preventing scratches to the solder joints during the dust removal process. This helps reduce problems such as cold solder joints and false solder joints.

[0138] When the circuit board mounting device in this embodiment is used, such as Figure 1 As shown, the circuit board to be mounted is placed in the support groove 1223 of the support member 120. Then, the second drive member 150 is activated, which drives the pulley 140 to rotate through the meshing of the first transmission gear 160 and the second transmission gear 170. The synchronous belt moves cyclically between the two pulleys 140, moving the circuit board from the feeding end to the first preset position in sequence.

[0139] When the support 120 moves the circuit board to the first preset position, the timing belt stops moving to ensure the reliability of the support 120's position at the first preset position. Then, the third drive 220 is activated to drive the transfer member 210 to move upward. After passing through the opening 134 on the conveyor frame 130, the transfer member 210 enters the support groove 1223 to support the circuit board.

[0140] Next, the first driving member 410 is activated, driving the fixed frame 450 to move along the first direction. The fixed frame 450 drives the first adjusting member 421 to move. At the same time, the second internal rack 4312 on the fixed frame 450 drives the second external rack 4311 to move in the opposite direction through the second gear 432, so that the second adjusting member 422 moves synchronously with the sliding member 470 in the opposite direction. The first adjusting member 421 and the second adjusting member 422 push the two supports 122 from the inside, so that the two supports 122 overcome the elastic force of the elastic member 124 and move in a direction away from each other, increasing the distance between the two supports 122. The support member 120 switches from the supporting state to the disengaged state. At this time, the elastic member 124 is compressed and stores elastic potential energy. While the support member 122 opens, the third driving member 220 continues to drive the transfer member 210 to move upward, lifting the circuit board upward, so that the circuit board gradually rises from the first preset position to the second preset position. During this process, the circuit board gradually detaches from the support groove 1223 and eventually completely detaches from the support body 122.

[0141] After the circuit board is transferred to the second preset position, the dust removal and placement mechanism 300 is activated. Prior to this, the dust removal and placement mechanism 300 has moved to the feeding area, and the nozzle of the placement component 340 picks up the component to be placed from the feeder. The dust removal and placement mechanism 300 then returns to above the second preset position. Next, the fourth drive component 320 is activated, driving the mounting plate 321 to move downwards along the vertical rod 510, and the placement base 310 descends with the mounting plate 321. When the placement base 310 moves to the second preset position, it engages with the transfer component 210 of the transfer mechanism 200 to form a cavity.

[0142] Subsequently, the dust removal unit 330 is activated to clean the solder joints of the circuit board inside the cavity, removing dust, debris, and other impurities from the surface of the solder joints. After dust removal, the mounting unit 340 is driven downwards to release and pre-place the components onto the cleaned solder joints, completing the pre-mounting and fixing of the components. It should be noted that this mounting is a pre-fixation; the components are temporarily fixed to the circuit board surface by the adhesiveness of the solder paste, and the soldering is not yet complete. The final soldering process will be completed later using equipment such as reflow soldering.

[0143] After mounting is completed, the fourth drive unit 320 reverses its direction, causing the mounting plate 321 to lift and reset the mounting base 310. The third drive unit 220 drives the transfer member 210 downward, causing the circuit board to fall back between the two supports 122. When the lower surface of the circuit board descends to the height corresponding to the upper surface of the bottom plate 1221 of the support 122, the transfer member 210 stops descending. Subsequently, the force of the first drive unit 410 is released, the elastic member 124 releases its elastic potential energy, and pushes the two supports 122 to move closer to each other. The bottom plates 1221 of the two supports 122 support the lower surface of the circuit board from below, transferring the weight of the circuit board from the transfer member 210 to the supports 122. Afterward, the third drive unit 220 continues to drive the transfer member 210 downward, causing the transfer member 210 to exit from the bottom of the circuit board and reset below the conveyor frame 130, and the support member 120 switches back to the supporting state.

[0144] Then, the second drive unit 150 drives the synchronous belt to continue moving, transferring the completed circuit board from the first preset position to the discharge end, completing one work cycle. By repeating the above steps, continuous automated placement of multiple circuit boards can be achieved.

[0145] The circuit board mounting device provided in this application has been described in detail above. Specific examples have been used to illustrate the principles and implementation methods of this application. The descriptions of the embodiments above are only for the purpose of helping to understand the method and core ideas of this application. It should be noted that those skilled in the art can make several improvements and modifications to this application without departing from the principles of this application, and these improvements and modifications also fall within the protection scope of this application.

Claims

1. A circuit board taping device characterized by comprising: include: The conveying mechanism (100) includes a conveying component (110) and at least two supporting components (120). The at least two supporting components (120) are disposed on the conveying component (110). The supporting components (120) are used to support the circuit board. The conveying component (110) is used to drive the supporting components (120) to move so as to sequentially transfer the at least two supporting components (120) to a first preset position. A transfer mechanism (200) is used to move the circuit board at the first preset position upward to a second preset position away from the support member (120); The dust removal and mounting mechanism (300) is used to sequentially remove dust and mount components on the circuit board at the second preset position.

2. The circuit board paster according to claim 1, wherein The support member (120) includes a frame (121) and two supports (122). The two supports (122) are disposed opposite to each other on both sides of the frame (121). A support groove (1223) is defined between the two supports (122) and the frame (121). The support groove (1223) is used to support the circuit board. At least one support (122) is movably disposed on the frame (121) so that the support (122) can switch between a supporting state of supporting the circuit board and a detached state of releasing the support of the circuit board.

3. The circuit board mounting device according to claim 2, characterized in that, Both of the supports (122) are movably disposed on the frame (121). The support member (120) further includes a first rack (125) and a first gear (126). The first rack (125) is disposed on the support (122) and extends along the moving direction of the support (122). The first gear (126) is rotatably mounted on the frame (121). The first gear (126) is located between the two first racks (125) on the two supports (122). The first gear (126) meshes with both first racks (125) so that when one support (122) is driven to move, it drives the other support (122) to move synchronously in the opposite direction.

4. The circuit board mounting device according to claim 2, characterized in that, Both of the supports (122) are movably disposed on the frame (121). The support member (120) further includes a guide rod (123) and an elastic member (124). The guide rod (123) is disposed on each of the supports (122). The guide rod (123) extends along the moving direction of the support (122) and is slidably disposed on the frame (121). The elastic member (124) is disposed between the frame (121) and the support (122). The elastic member (124) is used to apply an elastic force to the corresponding support (122) to drive the support (122) to move to the supported state.

5. The circuit board mounting device according to claim 2, characterized in that, It also includes a switching mechanism (400) for driving at least one of the supports (122) located at the second preset position to move, so that the supports (122) are switched from the supported state to the disengaged state.

6. The circuit board mounting apparatus according to claim 5, characterized in that, The switching mechanism (400) includes a first driving member (410) and at least one adjusting member (420). At least one adjusting member (420) is located between two supports (122) at the second preset position. The first driving member (410) is used to drive the adjusting member (420) to move so as to switch the corresponding support (122) from the supporting state to the disengaged state.

7. The circuit board mounting apparatus according to claim 6, characterized in that, Both of the supports (122) are movably mounted on the frame (121), and the switching mechanism (400) includes two adjusting members (420), which are respectively located between the two supports (122) at the second preset position; The switching mechanism (400) further includes a transmission component (430), which is disposed between the two adjusting components (420). The first driving component (410) drives one of the adjusting components (420) to move, and drives the other adjusting component (420) to move synchronously in the opposite direction through the transmission component (430), so as to push the two supports (122) to switch from the supporting state to the disengaged state.

8. The circuit board mounting apparatus according to claim 7, characterized in that, The transmission component (430) includes a second rack (431) and a second gear (432). Each of the adjusting components (420) is provided with a second rack (431). The second rack (431) extends along the moving direction of the support body (122). The second gear (432) is located between the two second racks (431) on the two adjusting components (420). The second gear (432) meshes with both second racks (431) so that when one adjusting component (420) moves, it drives the other adjusting component (420) to move in the opposite direction.

9. The circuit board mounting apparatus according to any one of claims 1 to 8, characterized in that, The conveying mechanism (100) further includes a conveying frame (130), two pulleys (140), and a second drive member (150). The two pulleys (140) are rotatably mounted on the conveying frame (130). The conveying member (110) is a synchronous belt mounted on the two pulleys (140). The second drive member (150) is used to drive one of the pulleys (140) to rotate. One end of the support member (120) is connected to the synchronous belt, and the other end of the support member (120) is supported on the conveying frame (130).

10. The circuit board mounting apparatus according to any one of claims 1 to 8, characterized in that, The transfer mechanism (200) includes a transfer member (210) and a third drive member (220). The transfer member (210) is used to support the circuit board. The third drive member (220) is connected to the transfer member (210) and is used to drive the transfer member (210) to move up and down to transfer the circuit board from the first preset position to the second preset position. And / or, the dust removal and mounting mechanism (300) includes a mounting base (310), a fourth drive (320), a dust removal component (330), and a mounting component (340). The dust removal component (330) and the mounting component (340) are both disposed on the mounting base (310). The dust removal component (330) is used for dust removal from the circuit board, and the mounting component (340) is used for mounting components onto the circuit board. The fourth driving component (320) is used to drive the mounting base (310) to rise and fall. When the mounting base (310) moves to the second preset position, the mounting base (310) and the transfer mechanism (200) form a cavity, the circuit board is located in the cavity, and the dust removal component (330) and the mounting component (340) are activated in sequence.

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