Pressure head structure and electronic device test system

Abstract

The utility model relates to a pressure head structure and an electronic device test system. The pressure head structure comprises a first temperature control part and a second temperature control part. The first temperature control part is provided with a first temperature control surface, an air flow channel for circulating air is formed in the first temperature control part, and an air outlet hole is formed in the first temperature control surface and is communicated with the air flow channel. The second temperature control part is provided with a second temperature control surface, a first mounting position for mounting the temperature adjusting part is arranged on the second temperature control part, and the first mounting position is in heat conduction connection with the second temperature control surface. The first temperature control face and the second temperature control face are located at the same end of the pressing head structure in the height direction. In practical application, the first temperature control surface and the second temperature control surface are arranged facing the temperature control area. According to the technical scheme, independent temperature control can be carried out on the temperature control areas where different chips of the same electronic device are located, different temperature control modes can be adapted to the temperature control areas with different heating degrees, and the temperature control cost is effectively reduced.

Description

Technical Field

[0001] The present application relates to the technical field of electronic device testing, and in particular to a pressure head structure and an electronic device testing system. Background Art

[0002] During the testing process of electronic devices such as chips, integrated circuits or other electronic devices, a temperature control device capable of controlling the temperature of the electronic devices is required to keep the electronic devices at a preset temperature during the testing process. The temperature control device generally includes a temperature control structure capable of adjusting the temperature, and a pressure head structure that directly acts on the electronic device. The temperature control structure can be arranged on the pressure head structure, and the temperature of the electronic device is controlled through the heat conduction of the pressure head.

[0003] With the continuous integration of chip functions and the increasing size of chips, high-power devices often have multiple chip heat sources, each with different power consumption and working time. The pressure head structure usually has only one temperature control point. When testing high-power devices, it is often necessary to use multiple pressure head structures to control the temperature of each chip heat source separately, which is costly. Utility Model Content

[0004] Based on this, when testing high-power devices, it is necessary to use multiple pressure head structures to independently control the temperature of each chip heat source, which leads to high temperature control costs. A pressure head structure and an electronic device testing system are provided.

[0005] In a first aspect, the present application provides a pressure head structure, the pressure head structure comprising:

[0006] A first temperature control portion, comprising a first temperature control surface, wherein an air flow channel for circulating gas is formed in the first temperature control portion, and an air outlet is provided on the first temperature control surface, wherein the air outlet is connected to the air flow channel;

[0007] A second temperature control portion having a second temperature control surface, wherein a first mounting position for mounting a temperature regulating element is provided on the second temperature control portion, and the first mounting position is thermally connected to the second temperature control surface;

[0008] Wherein, the first temperature control surface and the second temperature control surface are located at the same end in the height direction of the pressure head structure.

[0009] In some embodiments, in the height direction of the pressure head structure, the second temperature control surface is protruded compared to the first temperature control surface.

[0010] In some embodiments, the first temperature control portion has an air leakage channel, which is connected to the atmosphere and runs through an edge area of ​​the first temperature control surface adjacent to another temperature control portion.

[0011] In some embodiments, the first temperature control portion has a first outer peripheral surface disposed opposite to another adjacent temperature control portion;

[0012] The air leakage channel includes an air leakage groove and a notch recessed in the first outer peripheral surface, the air leakage groove opens toward another adjacent temperature control part, and at least one end in its extension direction passes through the outer surface of the first temperature control part outside the range of the first temperature control surface; the notch passes through the edge area of ​​the first temperature control surface and is connected to the air leakage groove.

[0013] In some embodiments, the air flow channel includes a confluence section and at least one air inlet section formed in the first temperature control portion; the air inlet section is used to connect to an external air supply source; in the height direction of the pressure head structure, the confluence section is arranged and connected between the air outlet and all the air inlet sections.

[0014] In some embodiments, a plurality of the first temperature control parts are arranged around the periphery of the second temperature control part.

[0015] In some embodiments, the second temperature control portion includes a crimping body and a substrate, the crimping body and the first temperature control portion are arranged on the same side of the substrate, the substrate is provided with the first mounting position, and the crimping body has the second temperature control surface;

[0016] The first temperature control part is thermally connected to the substrate, and / or a thermal insulation gap is formed between the first temperature control part and the crimping body.

[0017] In some embodiments, along the height direction of the pressure head structure, the orthographic projection of the first mounting position intersects with the orthographic projection of the crimping body and the orthographic projection of the first temperature control portion; and / or,

[0018] The first temperature control part is detachably connected to the substrate.

[0019] In some embodiments, a second installation position is provided in the first temperature control portion and / or the second temperature control portion, and the second installation position is used to install a temperature sensor.

[0020] In the second aspect, the present application provides an electronic device testing system, including a loading device, a testing device, a receiving device and a conveying device, the testing device having a material table and a temperature control device, the material table being used to support the electronic devices to be tested, the temperature control device being used to crimp and temperature-control the electronic devices to be tested on the material table, the conveying device being used to transfer the electronic devices to be tested provided by the loading device to the material table, and being used to transfer the electronic devices after testing on the material table to the receiving device for recovery, and the temperature control device comprising the pressure head structure described in any of the above embodiments.

[0021] In the above-mentioned pressure head structure and electronic device testing system, the second temperature control unit controls the temperature of the temperature control area by conducting the heat / cold of the temperature regulating component, which can be used to control the temperature of the temperature control area where the chip with higher heat power in the electronic device is located, and the temperature control effect is good. The first temperature control unit controls the temperature of the temperature control area by supplying air, which can be used to control the temperature of the temperature control area where the chip with lower heat power in the electronic device is located.

[0022] In this way, through the first temperature control unit and the second temperature control unit, not only can the temperature control areas where different chips of the same electronic device are located be independently controlled, but also different temperature control methods can be adapted to temperature control areas with different heat levels. Compared with the high-cost temperature control method of using temperature regulating components to control the temperature of all temperature control areas, the combination of air supply temperature control and temperature regulating component temperature control can further reduce the temperature control cost. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Various other advantages and benefits will become apparent to those of ordinary skill in the art by reading the detailed description of the preferred embodiments below. The accompanying drawings are only for the purpose of illustrating the preferred embodiments and are not to be considered as limiting the present application. Moreover, the same reference numerals are used throughout the drawings to represent the same components. In the drawings:

[0024] Figure 1 This is a schematic diagram of the structure of the temperature control device of some embodiments of the present application.

[0025] Figure 2 Schematic top view of the pressure head structure of some embodiments of the present application.

[0026] Figure 3 for Figure 2 A bottom view schematic diagram of the pressure head structure shown.

[0027] Figure 6 for Figure 2 A schematic structural diagram of the first temperature control part of the pressure head structure shown.

[0028] Figure 7 for Figure 6 Schematic diagram of the internal structure of the first temperature control unit.

[0029] Figure 4 for Figure 2 A front view schematic diagram of the pressure head structure is shown.

[0030] Figure 5 for Figure 4 Enlarged view of point A in the middle.

[0031] Figure 8 for Figure 2 The exploded schematic diagram of the pressure head structure and the temperature regulating component after assembly is shown.

[0032] Fig. 9 Schematic diagram of temperature control application of the pressure head structure in some embodiments of the present application.

[0033] Fig.10 Schematic diagram of temperature control application of the pressure head structure in some embodiments of the present application.

[0034] The reference numerals in the specific implementation manner are as follows:

[0035] 1000, temperature control device; 100, pressure head structure; Z, height direction; 1, electronic device; 10, first temperature control part; 11, first temperature control surface; 12, air flow channel; 12a, confluence section; 12b, air inlet section; 13, air outlet; 14, air discharge channel; 14a, air discharge groove; 14b, notch; M, first outer peripheral surface; C, card slot; f, thermal insulation gap; 20, second temperature control part; 21, second temperature control surface; 22, first installation position; 23, crimping body; 24, substrate; 25, second installation position; 200, temperature regulating component; 300, temperature sensor; 400, adapter plate. DETAILED DESCRIPTION

[0036] In order to make the above-mentioned purposes, features and advantages of the present application more obvious and easy to understand, the specific implementation methods of the present application are described in detail below in conjunction with the accompanying drawings. In the following description, many specific details are set forth to facilitate a full understanding of the present application. However, the present application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without violating the connotation of the present application, so the present application is not limited by the specific embodiments disclosed below.

[0037] In the description of the present application, it should be understood that terms such as “center”, “longitudinal”, “lateral”, “length”, “width”, “thickness”, “up”, “down”, “front”, “back”, “left”, “right”, “vertical”, “horizontal”, “top”, “bottom”, “inside”, “outside”, “clockwise”, “counterclockwise”, “axial”, “radial”, “circumferential”, etc., indicating orientations or positional relationships, if any, are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0038] In addition, if present, the terms "first" and "second" are used for descriptive purposes only and are not to be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of the features. In the description of this application, "plurality" means at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0039] In this application, unless otherwise clearly specified and limited, if any, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0040] In the present application, if it appears, unless otherwise clearly specified and limited, a first feature “above” or “below” a second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, a first feature “above”, “above” and “above” a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature “below”, “below” and “below” a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0041] It should be noted that, if present, when an element is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or there may be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. The terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used herein are for illustrative purposes only and are not intended to be the only implementation method.

[0042] In the embodiment of the present application, when testing high-power devices, due to the presence of a large number of chips, it is necessary to use multiple pressure head structures to independently control the temperature of the heating area where each chip is located, resulting in the problem of high temperature control cost, and a pressure head structure is proposed. The pressure head structure has multiple temperature control parts, some of which are first temperature control parts, and some of which are second temperature control parts. The first temperature control part can deliver hot air / cold air to part of the temperature-controlled area of ​​the electronic device, and the second temperature control part can conduct heat to contact part of the temperature-controlled area of ​​the electronic device. In actual application, the first temperature control part and the second temperature control part of the same pressure head structure can independently control the temperature of different temperature control areas of the same electronic device, which can reduce the temperature control cost, and the first temperature control part adopts the air supply temperature control method, which is more economical and can further reduce the temperature control cost.

[0043] The pressure head structure proposed in the embodiment of the present application can be applied to a temperature control device. The electronic device can include, but is not limited to, multiple chips, and the temperature control device can be used to independently control the temperature of the heat source of each chip. The embodiment of the present application also provides a temperature control device. Figure 1 and Figure 8 In some embodiments, the temperature control device 1000 includes a pressure head structure 100 and a temperature regulating component 200. The temperature regulating component 200 is arranged on the second temperature control part 20 of the pressure head structure 100, and the second temperature control part 20 can transfer the heat of the temperature regulating component 200 to the corresponding temperature controlled area of ​​the electronic device 1. Among them, the temperature regulating component 200 can be a heating component and / or a cooling component, and the heating component is not limited to a ceramic temperature regulating component 200, a metal temperature regulating component 200, etc. The heating method can be electromagnetic heating, resistance heating, infrared heating, etc., and the cooling component can be a semiconductor cooling component, a liquid cooling component, etc. In addition, the temperature control device 1000 may also include a temperature sensor 300, and the temperature sensor 300 is used to detect the temperature of the pressure head structure 100, so as to facilitate the regulation of the temperature of the temperature regulating component 200 and the air supply volume / air supply temperature of the first temperature control part 10. In a further embodiment, refer to Figure 1 The temperature control device 1000 also includes an adapter plate 400, and the pressure head structure 100 is installed on the adapter plate 400. The adapter plate 400 can be used to connect the pressure head structure 100 with other structures.

[0044] The pressure head structure 100 in the embodiment of the present application is described in detail below.

[0045] Reference Figures 2 to 5 , the pressure head structure 100 provided in some embodiments of the present application includes a first temperature control part 10 and a second temperature control part 20. The first temperature control part 10 has a first temperature control surface 11, and an air flow channel 12 for circulating gas is formed in the first temperature control part 10. The first temperature control surface 11 is provided with an air outlet 13, and the air outlet 13 is connected to the air flow channel 12. The second temperature control part 20 has a second temperature control surface 21, and the second temperature control part 20 is provided with a first mounting position 22 for mounting a temperature regulating component 200, and the first mounting position 22 is thermally connected to the second temperature control surface 21. Among them, the first temperature control surface 11 and the second temperature control surface 21 are located at the same end in the height direction Z of the pressure head structure 100. In actual application, the first temperature control surface 11 and the second temperature control surface 21 are arranged facing the temperature control area of ​​the electronic device 1.

[0046] The height direction Z of the pressure head structure 100 corresponds to its downward pressing direction, and the downward pressing direction is the direction in which the pressure head structure 100 presses down the electronic device 1. The first temperature control surface 11 of the first temperature control part 10 and the second temperature control surface 21 of the second temperature control part 20 are located at the same end of the pressure head structure 100 in the height direction Z, so that the first temperature control surface 11 and the second temperature control surface 21 can control the temperature of different temperature control areas of the same electronic device 1. It should be noted that the first temperature control surface 11 and the second temperature control surface 21 are independent of each other and are not directly connected. When the electronic device 1 has multiple chips, each temperature control area can correspond to the area where a chip is located.

[0047] An air flow channel 12 is formed in the first temperature control portion 10, and an air outlet 13 is provided on the first temperature control surface 11 thereof, and the air outlet 13 is connected to the air flow channel 12. In actual application, high-temperature or low-temperature gas is sent into the air flow channel 12, and then flows out of the first temperature control surface 11 through the air flow channel 12 and the air outlet 13. When the gas flows out of the first temperature control surface 11, its own heat can be transferred to the heating area or the heat of the temperature control area can be taken away, so as to achieve temperature regulation of the corresponding temperature control area.

[0048] The second temperature control part 20 is provided with a first mounting position 22, which may be a mounting groove or a mounting surface. One or more first mounting positions 22 may be provided on the second temperature control part 20. A structure for fixing the temperature control component 200, such as a threaded hole, a pin hole, etc., may be provided on the first mounting position 22. The first mounting position 22 is used to install the temperature control component 200. As mentioned above, the temperature control component 200 may be a heating component or a cooling component, or a combination of the two. The heat or cold of the temperature control component 200 is transferred to the second temperature control surface 21 through the first mounting position 22. The second temperature control surface 21 contacts the temperature control area of ​​the chip, and transfers the heat or cold of the temperature control component 200 to the temperature control area, thereby achieving temperature regulation of the corresponding temperature control area.

[0049] There are many ways to construct the first temperature control part 10. For example, the first temperature control part 10 is obtained by machining an air flow channel 12 and an air outlet 13 inside a solid structure. For another example, the first temperature control part 10 is obtained by setting a pipeline as an air flow channel 12 in a hollow shell, and opening an air outlet 13 on the surface of the first temperature control surface 11. Usually, the second temperature control part 20 is made of a material with good thermal conductivity, such as metal, ceramic and the like. Among them, the first temperature control part 10 and the second temperature control part 20 can be arranged integrally or separately. The first temperature control surface 11 and the second temperature control surface 21 are usually but not limited to planes, and can be specifically designed according to the contour adaptability of the temperature control area.

[0050] In the above-mentioned pressure head structure 100, the second temperature control part 20 controls the temperature of the temperature control area by conducting the heat / cold of the temperature regulating component 200, which can be used to control the temperature of the temperature control area where the chip with higher heat power in the electronic device 1 is located, and the temperature control effect is good. The first temperature control part 10 controls the temperature of the temperature control area by supplying air, which can be used to control the temperature of the temperature control area where the chip with lower heat power in the electronic device 1 is located.

[0051] In this way, through the first temperature control unit 10 and the second temperature control unit 20, not only can the temperature control areas where different chips of the same electronic device 1 are located be independently temperature controlled, but also different temperature control methods can be adapted to temperature control areas with different heat levels. Compared with the high-cost temperature control method of using the temperature regulating component 200 to control the temperature of all temperature control areas, the combination of air supply temperature control and temperature control by the temperature regulating component 200 can further reduce the temperature control cost.

[0052] In some embodiments, reference Figure 7 In the height direction Z of the pressure head structure 100, the second temperature control surface 21 is arranged to protrude compared to the first temperature control surface 11. That is, in the height direction Z of the pressure head structure 100, the second temperature control surface 21 is arranged higher than the first temperature control surface 11, and the two may have a misalignment distance of t in the height direction Z.

[0053] In actual application, the second temperature control surface 21 is in contact with the corresponding temperature control area surface to effectively conduct heat and effectively control the temperature of the temperature control area. A certain exhaust gap can exist between the first temperature control surface 11 and the corresponding temperature control area, so that the gas discharged from the air outlet 13 on the first temperature control surface 11 can flow through the exhaust gap and diffuse to the entire corresponding temperature control area, and can be discharged to the outside through the exhaust gap to take away the heat of the temperature control area, so that the exhaust of the air outlet 13 is smoother.

[0054] In some embodiments, the first temperature control portion 10 has an air leakage channel 14 , which is connected to the atmosphere and passes through an edge area of ​​the first temperature control surface 11 adjacent to another temperature control portion.

[0055] Among them, another temperature control part adjacent to the first temperature control part 10 can be the second temperature control part 20 or another first temperature control part 10. Between the first temperature control part 10 and another adjacent temperature control part, the edge area adjacent to the first temperature control surface 11 and the other temperature control part is blocked by the other temperature control part, which is prone to poor exhaust, resulting in gas congestion in the edge area of ​​the first temperature control surface 11 and unable to be discharged in time, poor gas fluidity, and poor temperature control effect.

[0056] At this time, a gas leakage channel 14 is provided on the first temperature control part 10, and one end of the gas leakage channel 14 passes through the edge area. The gas reaching the edge area can be discharged to the atmosphere through the gas leakage channel 14, which improves the gas flowability and further improves the temperature control effect of the first temperature control part 10.

[0057] It can be understood that the air leakage channel 14 and the air flow channel 12 are independently provided.

[0058] The air leakage channel 14 may be an air leakage hole, one end of which passes through the edge area of ​​the first temperature control surface 11, and the other end of which passes through other surfaces of the first temperature control portion 10. The air leakage channel 14 may also be provided in the following manner.

[0059] In some embodiments, please refer to Figure 6 and Figure 7 The first temperature control portion 10 has a first outer peripheral surface M disposed opposite to another adjacent temperature control portion, and the air leakage channel 14 includes an air leakage groove 14a and a notch 14b recessed in the first outer peripheral surface M. The air leakage groove 14a opens toward another adjacent temperature control portion, and at least one end thereof in the extension direction penetrates the outer surface of the first temperature control portion 10 outside the range of the first temperature control surface 11. The notch 14b penetrates the edge area of ​​the first temperature control surface 11 and communicates with the air leakage groove 14a.

[0060] The outer surface of the first temperature control portion 10 outside the first temperature control surface 11 includes the side surface, top surface, etc. of the first temperature control portion 10. The air relief groove 14a is a groove structure recessed in the first outer peripheral surface M, and one or both ends of the groove structure in the extension direction thereof penetrate the first temperature control portion 10. Usually, the air relief groove 14a penetrates the side surface of the first temperature control portion 10.

[0061] The notch 14b refers to a space structure formed by a recess on the first outer peripheral surface M below the gas relief groove 14a. One end of the notch 14b passes through the above-mentioned edge area of ​​the first temperature control surface 11, and the other end is connected to the gas relief groove 14a. In actual application, the gas discharged through the gas outlet 13 on the first temperature control surface 11 is discharged to the atmosphere through the notch 14b and the gas relief groove 14a.

[0062] At this time, the air leakage channel 14 is disposed on the first outer peripheral surface M in a recessed manner, so as to facilitate the processing of the air leakage channel 14 .

[0063] Specifically, the concave bottom wall of the notch 14b is protruding relative to the bottom wall of the air release groove 14a, so that the edge area cut off by the notch 14b is smaller, which can increase the residence time of the gas between the first temperature control surface 11 and the temperature control area to a certain extent, thereby improving the heat exchange efficiency of the gas.

[0064] In some embodiments, reference Figure 5 , and combined with Figure 4The air flow channel 12 includes a converging section 12a and at least one air inlet section 12b formed in the first temperature control portion 10. The air inlet section 12b is used to connect to an external air supply source. In the height direction Z of the pressure head structure 100, the converging section 12a is arranged and connected between the air outlet 13 and all the air inlet sections 12b.

[0065] An air inlet interface may be provided on the surface of the first temperature control part 10 outside the first temperature control surface 11, the air inlet interface is connected to the air inlet section 12b, and a pipeline connected to an external air supply source may be installed on the air inlet interface. The external air supply source is a device / component / equipment for providing gas to the first temperature control part 10, which may be, but is not limited to, an air compressor. In actual application, the air supply system of the electronic device test system itself may be used as an air supply source to supply air to the first temperature control part 10.

[0066] Multiple air inlet sections 12b can be configured, and each air inlet section 12b can be connected to an external pipeline through an air inlet interface. In practical applications, the air supply volume of the first temperature control unit 10 can be controlled by controlling the number of air inlet sections 12b connected to the gas. The more air inlet sections 12b connected to the gas, the greater the air supply volume and the greater the temperature control intensity.

[0067] The confluence section 12a is connected between the gas outlet 13 and the gas inlet section 12b, and the gas entering the gas inlet section 12b is discharged through the gas outlet 13 after confluence in the confluence section 12a. In the height direction Z of the pressure head structure 100, the confluence section 12a can be arranged between the gas outlet 13 and all the gas inlet sections 12b, that is, the confluence section 12a is arranged above the gas outlet 13, and the gas inlet section 12b is arranged above the confluence section 12a. The gas flow path is short, which can improve the gas energy utilization rate and improve the temperature control effect of the first temperature control part 10.

[0068] Regarding the structural features of the air outlet 13, in some examples, such as Figures 3 to 5 As shown, the air outlet 13 extends in a strip shape along the first temperature control surface 11. In this case, the air outlet 13 has a wider coverage area and is easy to process. The extension direction of the air outlet 13 can be a straight line direction, a curved line direction, etc. In another example (not shown), the air outlet 13 can be in a circular hole shape, and multiple air outlets 13 can be arranged along the first temperature control surface 11.

[0069] In some embodiments, a plurality of first temperature control parts 10 are arranged around the outer periphery of the second temperature control part 20. Figure 2 and Figure 3In the illustrated embodiment, two first temperature control parts 10 are arranged on opposite sides of a second temperature control part 20. In actual application, the first temperature control part 10 is suitable for controlling the temperature of a temperature control area with low heating power, and the second temperature control part 20 is suitable for controlling the temperature of a temperature control area with high heating power. In this case, multiple first temperature control parts 10 are arranged on the periphery of the second temperature control part 20, which can be adapted to an electronic device 1 in which multiple secondary heating areas surround a main heating area.

[0070] In some embodiments, see Figure 8 The second temperature control part 20 includes a crimping body 23 and a substrate 24. The crimping body 23 and the first temperature control part 10 are arranged on the same side of the substrate 24. The substrate 24 is provided with a first mounting position 22. The crimping body 23 has a second temperature control surface 21. The first temperature control part 10 is thermally insulated from the substrate 24, and / or a thermal insulation gap f is formed between the first temperature control part 10 and the crimping body 23.

[0071] Generally, the thickness direction of the substrate 24 corresponds to the height direction Z of the pressure head structure 100, and the crimping body 23 and the first temperature control part 10 are arranged on the same side in the thickness direction of the substrate 24. The first mounting position 22 is arranged on one side in the thickness direction of the substrate 24. Specifically, the first mounting position 22 can be a mounting groove recessed on the substrate 24.

[0072] The substrate 24 and the crimping body 23 can be integrally formed or separately provided, and both are heat-conductive. The heat / cold of the temperature regulating element 200 acts on the temperature control area of ​​the electronic device 1 through the substrate 24 and the crimping body 23 .

[0073] The first temperature control part 10 is connected to the substrate 24, so that the first temperature control part 10 and the second temperature control part 20 can be assembled and connected through the substrate 24. Specifically, the first temperature control part 10 is thermally insulated from the substrate 24, and a thermal insulation structure such as a thermal insulation pad is provided between the two, or the first temperature control part 10 is formed of a thermal insulation material, so that the heat / cold amount of the temperature regulating component 200 will not be transferred to the first temperature control part 10.

[0074] The first temperature control portion 10 is spaced from the crimping body 23 to form a heat-insulating gap f, thereby reducing the temperature effect of the crimping body 23 on the first temperature control portion 10 .

[0075] In this way, the influence of the temperature regulating element 200 on the temperature of the gas in the first temperature control part 10 can be reduced, thereby improving the temperature control accuracy of the gas.

[0076] In some embodiments, reference Figure 2 Along the height direction Z of the pressure head structure 100 , the orthographic projection of the first mounting position 22 intersects with the orthographic projection of the crimping body 23 and the orthographic projection of the first temperature control portion 10 .

[0077] That is, the orthographic projection of the first installation position 22 covers at least part of the orthographic projection of the crimping body 23 and at least part of the orthographic projection of the first temperature control portion 10. Generally, the orthographic projection of the first installation position 22 covers the entire range of the orthographic projection of the crimping body 23.

[0078] At this time, the first installation position 22 has a larger arrangement range and can accommodate a temperature control component 200 with a larger installation area. The heat / cold of the temperature control component 200 can be transferred outward through the first installation position 22 with a larger area, so that the thermal conductivity efficiency of the second temperature control part 20 is high.

[0079] In some embodiments, reference Figure 8 The first temperature control part 10 is detachably connected to the substrate 24. Specifically, a card slot C can be provided on one of the substrate 24 and the first temperature control part 10, and the other can be connected to the card slot C. In this way, the assembly and disassembly of the pressure head structure 100 is convenient.

[0080] In some embodiments, a second mounting position 25 is provided in the first temperature control portion 10 and / or the second temperature control portion 20, and the second mounting position 25 is used to install a temperature sensor 300. It is possible that a second mounting position 25 is provided in both the first temperature control portion 10 and the second temperature control portion 20. In this way, each temperature control portion can independently collect the actual temperature by installing the temperature sensor 300 in its second mounting position 25, which helps to accurately control the temperature control temperature of each temperature control portion.

[0081] In one embodiment of the present application, see Figures 3 to 7 The pressure head structure 100 includes a second temperature control part 20 and two first temperature control parts 10, and the two first temperature control parts 10 are arranged on both sides of the second temperature control part 20. Each first temperature control part 10 has an air flow channel 12 and an air outlet 13 connected to the air flow channel 12, and the air outlet 13 passes through the first temperature control surface 11 of the first temperature control part 10. The second temperature control part 20 has a first installation position 22 for installing the temperature regulating member 200, and its second temperature control surface 21 is protruding relative to the first temperature control surface 11. The first temperature control part 10 has a first outer peripheral surface M facing the second temperature control part 20 and spaced from the second temperature control part 20, and the first outer peripheral surface M is provided with an air leakage channel 14, which passes through the first temperature control surface 11 and is connected to the atmosphere. The first temperature control part 10 is thermally insulated and connected to the second temperature control part 20. The first installation position 22 covers at least part of the first temperature control part 10 in the orthographic projection along the height direction Z of the pressure head structure 100.

[0082] Combination Fig. 9 and Fig.10It is understood (the arrow in the figure indicates the direction of air flow). In actual application, the second temperature control part 20 of the pressure head structure 100 can be in contact with the main temperature control area of ​​the electronic device 1, and its first temperature control part 10 can be arranged relative to the secondary temperature control area of ​​the electronic device 1, and an exhaust gap is formed between the first temperature control surface 11 of the first temperature control part 10 and the secondary temperature control area. After the gas enters the air flow channel 12 in the first temperature control part 10, it flows out through the air outlet 13 and diffuses in the exhaust gap to exchange heat with the secondary temperature control area. Part of the gas flows directly to the atmosphere after flowing out of the exhaust gap, and part of the gas flows to the atmosphere through the exhaust channel 14 after flowing out of the exhaust gap.

[0083] The embodiment of the present application also provides an electronic device testing system, which includes a loading device, a testing device, a receiving device and a conveying device. The testing device has a material table and a temperature control device 1000. The material table is used to support the electronic devices to be tested. The temperature control device 1000 is used to crimp the electronic devices to be tested on the temperature-controlled material table. The conveying device is used to transfer the electronic devices to be tested provided by the loading device to the material table, and to transfer the tested electronic devices on the material table to the receiving device for recovery. The temperature control device 1000 includes a temperature regulating component 200 and the pressure head structure 100 of the above embodiment.

[0084] The loading device is used to load the electronic devices to be tested onto itself, and the loading device may include a loading conveyor belt, a loading receiving platform, etc. The collecting device is used to recycle the electronic devices after testing, and the collecting device may include a recycling box, a recycling tray, a recycling belt, etc. The conveying device is used to realize the transfer of electronic devices between the loading device and the test station, and between the test station and the recycling device. The conveying device may include a manipulator, etc.

[0085] The electronic device testing system can be used to perform performance tests on electronic devices 1 such as chips, etc. Regarding the test type and corresponding structure of the test device, those skilled in the art can design or select conventional solutions according to actual needs. For example, the test device can be a pressure test device, a current and voltage test device, etc.

[0086] In some embodiments, the electronic device testing system further includes an air supply system, and the air flow channel 12 of the first temperature control part 10 of the temperature control device 1000 is connected to the air supply system. That is, the air supply system of the electronic device testing system is used to supply air to the air flow channel 12 of the first temperature control part 10. For example, the air supply system may include an air supply source, a circulation pipeline, a control valve, etc. The air supply source delivers gas to the air flow channel 12 through the circulation pipeline, and the control valve may be arranged on the circulation pipeline to control the gas flow rate, speed, etc. In a further embodiment, the temperature control device 1000 further includes a temperature regulating component 200, which is arranged at the first installation position 22 of the second temperature control part 20.

[0087] The electronic device testing system includes all the advantageous effects of the above-mentioned embodiments.

[0088] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0089] The above-mentioned embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the present application. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the present application shall be subject to the attached claims.

Claims

1. A pressure head structure (100), characterized in that: The pressure head structure (100) comprises: A first temperature control portion (10) having a first temperature control surface (11), an air flow channel (12) for circulating gas being formed in the first temperature control portion (10), an air outlet hole (13) being provided on the first temperature control surface (11), and the air outlet hole (13) being in communication with the air flow channel (12); A second temperature control portion (20) having a second temperature control surface (21), wherein the second temperature control portion (20) is provided with a first mounting position (22) for mounting a temperature regulating element (200), and the first mounting position (22) is thermally connected to the second temperature control surface (21); The first temperature control surface (11) and the second temperature control surface (21) are located at the same end of the pressure head structure (100) in the height direction (Z).

2. The pressure head structure (100) according to claim 1, characterized in that: In the height direction (Z) of the pressure head structure (100), the second temperature control surface (21) is arranged to protrude relative to the first temperature control surface (11).

3. The pressure head structure (100) according to claim 1, characterized in that: The first temperature control portion (10) has an air leakage channel (14), the air leakage channel (14) is connected to the atmosphere and passes through an edge area of ​​the first temperature control surface (11) adjacent to another temperature control portion.

4. The pressure head structure (100) according to claim 3, characterized in that: The first temperature control portion (10) has a first outer peripheral surface (M) arranged opposite to another adjacent temperature control portion; The air release channel (14) comprises an air release groove (14a) and a notch (14b) recessed in the first outer peripheral surface (M); the air release groove (14a) opens toward another adjacent temperature control portion, and at least one end thereof in its extension direction passes through the outer surface of the first temperature control portion (10) outside the range of the first temperature control surface (11); The notch (14b) passes through the edge region of the first temperature control surface (11) and is connected to the air release groove (14a).

5. The pressure head structure (100) according to claim 1, characterized in that: The air flow channel (12) comprises a confluence section (12a) and at least one air inlet section (12b) formed in the first temperature control portion (10); the air inlet section (12b) is used to connect to an external air supply source; in the height direction (Z) of the pressure head structure (100), the confluence section (12a) is arranged and connected between the air outlet (13) and all the air inlet sections (12b).

6. The pressure head structure (100) according to claim 1, characterized in that: A plurality of the first temperature control parts (10) are arranged around the outer periphery of the second temperature control part (20).

7. The pressure head structure (100) according to any one of claims 1 to 6, characterized in that: The second temperature control part (20) comprises a crimping body (23) and a substrate (24); the crimping body (23) and the first temperature control part (10) are arranged on the same side of the substrate (24); the substrate (24) is provided with the first mounting position (22); and the crimping body (23) has the second temperature control surface (21); The first temperature control part (10) is thermally connected to the substrate (24), and / or a thermal insulation gap (f) is formed between the first temperature control part (10) and the crimping body (23).

8. The pressure head structure (100) according to claim 7, characterized in that: Along the height direction (Z) of the pressure head structure (100), the orthographic projection of the first mounting position (22) intersects with the orthographic projection of the crimping body (23) and the orthographic projection of the first temperature control portion (10); and / or, The first temperature control portion (10) is detachably connected to the base plate (24).

9. The pressure head structure (100) according to any one of claims 1 to 6, characterized in that: A second installation position (25) is provided in the first temperature control portion (10) and / or the second temperature control portion (20), and the second installation position (25) is used to install a temperature sensor (300).

10. An electronic device testing system, comprising a loading device, a testing device, a receiving device and a conveying device, wherein the testing device has a material table and a temperature control device (1000), wherein the material table is used to support the electronic device to be tested, the temperature control device is used to crimp and control the temperature of the electronic device to be tested on the material table, and the conveying device is used to transfer the electronic device to be tested provided by the loading device to the material table, and to transfer the tested electronic device on the material table to the receiving device for recovery, characterized in that: The temperature control device (1000) comprises the pressure head structure (100) according to any one of claims 1 to 9.

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