Sensor device

Abstract

The utility model relates to the technical field of semiconductor luminescence, and discloses a sensor device, which comprises a substrate and at least two optical chips arranged on the substrate. And at least two light-transmitting glue layers are tightly bonded on the optical chip. Fence parts are arranged between the light-transmitting glue layers covering the adjacent optical chips and around the light-transmitting glue layers, and the bottoms of the fence parts are connected with the substrate. The light-transmitting glue layer sequentially comprises a first light-transmitting glue layer and a second light-transmitting glue layer in the direction away from the optical chip. The side face of the first light-transmitting glue layer is arranged to be a reflecting face used for reflecting edge large-angle light. According to the utility model, through the arrangement of the plurality of light-transmitting glue layers and the reflecting surfaces, the light energy utilization rate and brightness are improved, the high precision of the sensor device is further realized, and the overall structure is simple and reasonable.

Description

Technical Field

[0001] The utility model belongs to the technical field of semiconductor light emitting, and in particular relates to a sensor device. Background Art

[0002] A sensor device is a device that can detect light signals and convert them into electrical signals. Working principle: The sensor device is a collection of at least two or two groups of optical chips that emit and receive light. The light-emitting chip emits a light beam, which passes through the optical system to illuminate the object to be measured. The light beam reflected or absorbed by the object passes through the optical system to illuminate the photosensitive area of ​​the photosensitive chip. The sensor device converts the light signal into an electrical signal, which is finally processed by the signal processing circuit and output. In order to prevent the emitted light and the received light from interfering with each other, a light-absorbing structure made of opaque material is usually used to isolate them. The existing sensor devices are as follows:

[0003] Prior art 1, reference Figure 5 , the substrate 1 is provided with two optical chips 2, and a light-transmitting adhesive layer 3 is covered on the top of the optical chips 2. A blocking portion 4 is provided between the light-transmitting adhesive layers 3 covering the adjacent optical chips 2 and around the light-transmitting adhesive layers 3, and the bottom surface of the blocking portion 4 is connected to the substrate 1. The blocking portion 4 is formed on the substrate 1 and around the light-transmitting adhesive layer 3 by dispensing, injection molding or molding. Therefore, the blocking portion 4 is tightly connected to the light-transmitting adhesive layer 3.

[0004] Prior art 2, refer to Figure 6 The main difference from the prior art 1 is the way the enclosure 4 is formed on the substrate 1. The enclosure 4 is preformed first, and then the formed enclosure 4 is pasted on the substrate 1, so there is a space margin for assembly between the enclosure 4 and the light-transmitting adhesive layer 3. The other structures are the same as the prior art 1.

[0005] The sensor devices of the prior art 1 and 2 have the following problems: 1. Only one light-transmitting adhesive layer 3 is provided, and the optical adjustment capability is limited; 2. The outgoing light at a large angle at the edge far from the optical axis is absorbed by the enclosure 4, and the light energy utilization rate is low. The sensor device has poor overall light control effect, low accuracy, and insensitive response.

[0006] Based on the above, the problem to be solved at present is: to provide a sensor device with high light energy utilization rate, good light control effect, high precision and sensitive response. Utility Model Content

[0007] The utility model aims to provide a sensor device, aiming to solve the problems of low light energy utilization, poor light control effect, low accuracy and insensitive response of the sensor device in the prior art.

[0008] The utility model is implemented as follows: a sensor device comprises: a substrate and at least two optical chips arranged on the substrate; at least two layers of transparent adhesive layers are tightly attached to the optical chips; a blocking portion is provided between the transparent adhesive layers covered on adjacent optical chips and around the transparent adhesive layers, and the bottom of the blocking portion is connected to the substrate;

[0009] The light-transmitting adhesive layer includes a first light-transmitting adhesive layer and a second light-transmitting adhesive layer in sequence along a direction away from the optical chip; the side surface of the first light-transmitting adhesive layer is configured as a reflection surface for reflecting edge large-angle light.

[0010] Furthermore, a high-reflective adhesive layer is also provided on the substrate; the high-reflective adhesive layer covers the side surfaces of the optical chip and the reflective surface; and the first light-transmitting adhesive layer covers the high-reflective adhesive layer.

[0011] Furthermore, the light-transmitting adhesive layer also includes a third light-transmitting adhesive layer, the third light-transmitting adhesive layer is tightly attached to a side of the second light-transmitting adhesive layer away from the first light-transmitting adhesive layer, and the enclosure portion extends upward and surrounds the third light-transmitting adhesive layer.

[0012] Furthermore, the light-transmitting adhesive layer is not higher than the enclosure portion.

[0013] Compared with the prior art, the sensor device provided by the utility model has the following beneficial effects:

[0014] The sensor devices of the prior art 1 and 2 are only provided with a layer of light-transmitting adhesive layer 3 for encapsulating the optical chip 2, and the optical adjustment capability is limited, and the light control effect is not good. The optical chip 2 of the sensor device of the utility model is covered with multiple layers of light-transmitting adhesive layers 3, and the refractive index of the multiple layers of light-transmitting adhesive layers 3 is different, and the principle of refraction at the interface is used to optically shape the incident light / outgoing light to achieve the expected optical effect, with good light control effect and easy optical design.

[0015] In order to further improve the utilization rate of light energy, a reflective surface 311 is provided on the side of the first light-transmitting adhesive layer 31, which is used to reflect the outgoing light with a large angle at the edge away from the optical axis to the direction close to the optical axis, and emit it from the front of the optical chip 2 or enter the photosensitive area of ​​the optical chip 2, thereby reducing the absorption of edge light by the enclosure 4, and the light energy utilization rate is high, and the brightness is greatly improved, further improving the accuracy and reaction speed of sensor device detection. By providing a high-reflective adhesive layer 5, the light with a large angle at the edge is fully reflected to the central area of ​​the optical axis of the optical chip 2, cutting off the refracted light, thereby reducing the design difficulty and manufacturing accuracy of the reflective surface 311, further improving the utilization rate of light energy, improving the brightness, and the edge contour of the light spot is clear and the cut-off performance is good. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1It is a schematic diagram of the cross-sectional structure of the sensor device provided by the utility model;

[0017] Figure 2 It is a schematic cross-sectional structure diagram of the first embodiment of the sensor device provided by the utility model;

[0018] Figure 3 It is a cross-sectional structural schematic diagram of the second embodiment of the sensor device provided by the utility model;

[0019] Figure 4 It is a cross-sectional structural schematic diagram of the third embodiment of the sensor device provided by the utility model;

[0020] Figure 5 It is a schematic diagram of the cross-sectional structure of a sensor device of prior art 1;

[0021] Figure 6 It is a schematic diagram of the cross-sectional structure of a sensor device of the second prior art;

[0022] In the figure: 1-substrate; 2-optical chip; 3-light-transmitting adhesive layer; 31-first light-transmitting adhesive layer; 311-reflecting surface; 32-second light-transmitting adhesive layer; 33-third light-transmitting adhesive layer; 4-enclosing portion; 5-highly reflective adhesive layer. DETAILED DESCRIPTION

[0023] In order to make the purpose, technical solution and advantages of the utility model more clear, the utility model is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the utility model and are not used to limit the utility model.

[0024] The implementation of the present utility model is described in detail below in conjunction with specific embodiments.

[0025] The same or similar numbers in the drawings of this embodiment correspond to the same or similar parts; in the description of the present utility model, it should be understood that if the terms "upper", "lower", "left", "right" and the like indicate directions or positional relationships based on the directions or positional relationships shown in the drawings, it is only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific direction, be constructed and operated in a specific direction. Therefore, the terms describing the positional relationship in the drawings are only used for illustrative purposes and cannot be understood as limitations on this patent. For ordinary technicians in this field, the specific meanings of the above terms can be understood according to specific circumstances.

[0026] Reference Figure 1-4 As shown, it is a preferred embodiment provided by the utility model.

[0027] A sensor device includes a substrate 1, an optical chip 2, a light-transmitting adhesive layer 3 and a blocking portion 4, referring to Figure 1 . The optical chip 2 includes at least two and is arranged on the substrate 1. At least two layers of transparent adhesive layers 3 are sequentially covered on the optical chip 2, and the transparent adhesive layers 3 are used to encapsulate the optical chip 2 and optically shape the optical chip 2. The transparent adhesive layer 3 includes a first transparent adhesive layer 31 and a second transparent adhesive layer 32 in a direction away from the optical chip 2. Preferably, the refractive index of the second transparent adhesive layer 32 is greater than the refractive index of the first transparent adhesive layer 31. By utilizing the principle of refraction of light when propagating at the interface of the first transparent adhesive layer 31 and the second transparent adhesive layer 32 with different refractive indices, the light is controlled to achieve a preset optical effect, thereby improving the accuracy and response speed of the sensor device. The optical chip 2 includes a light-emitting chip for emitting light and a photosensitive chip for receiving light. The transparent adhesive layer 3 covering the light-emitting chip and the photosensitive chip is used to optically adjust the emitted light and the received light, respectively.

[0028] The enclosure 4 is provided on the substrate 1, and surrounds the light-transmitting adhesive layers 3 covering the adjacent optical chips 2, and the surrounding areas of the light-transmitting adhesive layers 3. The enclosure 4 can be provided with a light-absorbing portion made of a light-absorbing material to prevent light interference from the adjacent optical chips 2. Of course, the enclosure 4 can also be provided with a non-light-absorbing portion made of a non-light-absorbing material as needed, and as long as it has the structure of the present utility model, it is within the concept of the present utility model. The enclosure 4 is formed on the substrate 1, and process one can be adopted: step 1, fixing the optical chip 2 on the substrate 1; step 2, forming a light-transmitting adhesive layer 3 on the optical chip 2, and the light-transmitting adhesive layers 3 covering the adjacent optical chips 2 and the surrounding areas of the optical adhesive layer 3 are separated by grooves, and the bottom of the groove is the exposed substrate 1; step 3, inserting the pre-formed enclosure 4 matching the groove into the groove, and pasting the bottom of the enclosure 4 to the bottom of the groove, refer to Figure 2 Therefore, there is a space margin for assembly between the enclosure 4 and the second light-transmitting adhesive layer 32, that is, the enclosure 4 covers the second light-transmitting adhesive layer 32 at intervals. Process 2 can also be used: Steps 1 and 2 are the same as the above process 1, except that step 3 forms the enclosure 4 in and above the groove by dispensing or molding, referring to Figure 1 The enclosing portion 4 is tightly fitted to the second light-transmitting adhesive layer 32 .

[0029] The first light-transmitting adhesive layer 31 is formed on the upper surface of the optical chip 2 by dispensing, flowing naturally or by molding; the first light-transmitting adhesive layer 31 can also cover the upper surface and side surfaces of the optical chip 2. The second light-transmitting adhesive layer 32 covers the first light-transmitting adhesive layer 31 and the optical chip 2.

[0030] In order to improve the utilization rate of light energy and enhance the brightness, the side of the first light-transmitting adhesive layer 31 is set as a reflective surface 311 for reflecting edge large-angle light. The reflective surface 311 is a plane or curved surface in the shape of an inverted cone, that is, the side of the first light-transmitting adhesive layer 31 is set as a plane or curved surface at a certain angle to the upper surface of the optical chip 2. The above-mentioned setting increases the incident angle, and the edge large-angle light is incident on the reflective surface 311, which satisfies the incident angle greater than or equal to the critical angle, and total reflection is easy to occur. After total reflection, the light propagates in the direction close to the optical axis, and finally emerges from the front of the optical chip 2 or is incident on the photosensitive area of ​​the optical chip 2. This setting utilizes the edge large-angle light that is not easily utilized (absorbed by the enclosure 4) on the surrounding edges, improves the utilization rate of light energy, and improves the overall brightness. At the same time, the setting of the first reflective surface 311 can reduce the light output angle range, which is easy for optical design.

[0031] The side of the reflective surface 311 and the optical chip 2 is surrounded by a high-reflective adhesive layer 5, which covers a portion of the upper surface of the substrate 1. Figure 3 , 4 The second light-transmitting adhesive layer 32 covers the first light-transmitting adhesive layer 31 and the high-reflecting adhesive layer 5. The high-reflecting adhesive layer 5 can ensure that light incident on the interface between the first light-transmitting adhesive layer 31 and the high-reflecting adhesive layer 5 is fully reflected, cuts off the refracted light, improves the utilization rate of light energy, and improves the brightness; at the same time, reduces the design difficulty and manufacturing accuracy of the reflective surface 311. The utility model improves the utilization rate of light energy and brightness by setting multiple layers of light-transmitting adhesive layers 3 and reflective surfaces 311, thereby achieving high precision of the sensor device, and the overall structure is simple and reasonable.

[0032] The optical interface of the second light-transmitting adhesive layer 32 away from the first light-transmitting adhesive layer 31 can be set to a plane or a curved surface to achieve a preset optical angle range, brightness and spot shape. The second light-transmitting adhesive layer 32 is formed in the following ways: Method 1: dispensing or molding on the first light-transmitting adhesive layer 31, and then curing to form; Method 2: pre-forming the second light-transmitting adhesive layer 32, and then bonding the second light-transmitting adhesive layer 32 to the upper surface of the first light-transmitting adhesive layer 31 or the upper surface and side surface of the first light-transmitting adhesive layer 31.

[0033] In a further optimized solution, the light-transmitting adhesive layer 3 also includes a third light-transmitting adhesive layer 33. The third light-transmitting adhesive layer 33 is tightly fitted to the side of the second light-transmitting adhesive layer 32 away from the first light-transmitting adhesive layer 31. The third light-transmitting adhesive layer 33 can be formed by dispensing or molding, or it can be pre-formed and then bonded to the second light-transmitting adhesive layer 32. The enclosure 4 extends in a direction away from the substrate 1 and surrounds the third light-transmitting adhesive layer 33. The three-layer tightly fitted lens has a better light control effect in specific application scenarios. Preferably, the highest point of the outermost light-transmitting adhesive layer 3 is not higher than the enclosure 4, so that the enclosure 4 plays a role in preventing light interference.

[0034] Embodiment 1: The sensor device includes a substrate 1, an optical chip 2, a light-transmitting adhesive layer 3 and a blocking portion 4, referring to Figure 2 . There are two optical chips 2, which are arranged on the substrate 1. Two layers of light-transmitting adhesive layers 3 are sequentially covered on the optical chip 2. The light-transmitting adhesive layer 3 includes a first light-transmitting adhesive layer 31 and a second light-transmitting adhesive layer 32 in sequence along the direction away from the optical chip 2. The first light-transmitting adhesive layer 31 only covers the upper surface of the optical chip 2. A reflective surface 311 is arranged on the side of the first light-transmitting adhesive layer 31, and the upper surface is arranged as a plane. The first light-transmitting adhesive layer 31 and the outer side of the optical chip 2 are tightly covered with a second light-transmitting adhesive layer 32. The upper surface of the second light-transmitting adhesive layer 32 is provided with a convex curved surface. The enclosure 4 is arranged on the substrate and surrounds the light-transmitting adhesive layers 3 covering adjacent optical chips 2, as well as the four sides of the light-transmitting adhesive layers 3. The enclosure 4 covers the four sides of the second light-transmitting adhesive layer 32 at intervals. The light-transmitting adhesive layer 3 is not higher than the enclosure 4.

[0035] Embodiment 2: The sensor device comprises a substrate 1, an optical chip 2, a light-transmitting adhesive layer 3 and a blocking portion 4, referring to Figure 3 . The optical chips 2 include two and are arranged on the substrate 1. The optical chips 2 are sequentially covered with two layers of light-transmitting adhesive layers 3. The light-transmitting adhesive layers 3 sequentially include a first light-transmitting adhesive layer 31 and a second light-transmitting adhesive layer 32 in a direction away from the optical chip 2. The first light-transmitting adhesive layer 31 only covers the upper surface of the optical chip 2. A reflective surface 311 is arranged on the side of the first light-transmitting adhesive layer 31, and the upper surface is arranged as a plane. The first light-transmitting adhesive layer 31 and the side of the optical chip 2 are tightly covered with a high-reflective adhesive layer 5, and the bottom surface of the high-reflective adhesive layer 5 covers part of the substrate 1. The upper surface of the second light-transmitting adhesive layer 32 is arranged as a convex surface. The enclosure 4 is arranged on the substrate and surrounds the light-transmitting adhesive layers 3 covering adjacent optical chips 2, as well as the four sides of the light-transmitting adhesive layers 3. The enclosure 4 is connected to the four sides of the second light-transmitting adhesive layer 32. The light-transmitting adhesive layer 3 is not higher than the enclosure 4.

[0036] Example 3: Reference Figure 4 The main difference from the second embodiment is that the upper surface of the second light-transmitting adhesive layer 32 is set as a plane. The upper surface of the second light-transmitting adhesive layer 32 is closely attached to the third light-transmitting adhesive layer 33, and the upper surface of the third light-transmitting adhesive layer 33 is set as a convex surface. Other settings are the same as those of the second embodiment.

[0037] This does not limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A sensor device, characterized in that: include: A substrate (1) and at least two optical chips (2) arranged on the substrate (1); at least two layers of light-transmitting adhesive layers (3) are tightly attached to the optical chips (2); a blocking portion (4) is provided between the light-transmitting adhesive layers (3) covering adjacent optical chips (2) and around the light-transmitting adhesive layers (3); the bottom of the blocking portion (4) is connected to the substrate (1); The light-transmitting adhesive layer (3) comprises, in sequence, a first light-transmitting adhesive layer (31) and a second light-transmitting adhesive layer (32) in a direction away from the optical chip (2); a side surface of the first light-transmitting adhesive layer (31) is arranged as a reflecting surface (311) for reflecting edge large-angle light.

2. The sensor device according to claim 1, characterized in that A high-reflective adhesive layer (5) is also provided on the substrate (1); the high-reflective adhesive layer (5) covers the side surface of the optical chip (2) and the reflective surface (311); and the second light-transmitting adhesive layer (32) covers the high-reflective adhesive layer (5).

3. The sensor device according to any one of claims 1 to 2, characterized in that: The light-transmitting adhesive layer (3) further comprises a third light-transmitting adhesive layer (33), wherein the third light-transmitting adhesive layer (33) is tightly attached to a side of the second light-transmitting adhesive layer (32) away from the first light-transmitting adhesive layer (31), and the enclosure portion (4) extends upward and surrounds the third light-transmitting adhesive layer (33) on all sides.

4. The sensor device according to claim 1, characterized in that The light-transmitting adhesive layer (3) is not higher than the enclosure portion (4).

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