Heat dissipation mechanism of vehicle-mounted power supply, vehicle-mounted power supply and vehicle

Abstract

The utility model relates to a heat dissipation mechanism of a vehicle-mounted power supply, the vehicle-mounted power supply and a vehicle. The heat dissipation mechanism comprises a liquid cooling piece and a condenser. The liquid cooling member is in heat conduction connection with a power device of the vehicle-mounted power supply. And the condenser is communicated with the liquid cooling piece so as to jointly form a circulating flow path for a cooling medium to circulate. According to the technical scheme, the condenser is integrated in the heat dissipation structure of the vehicle-mounted power supply, independent control over heat dissipation of the vehicle-mounted power supply can be achieved, the whole vehicle-mounted cooling system does not need to be started synchronously when heat dissipation is conducted on the vehicle-mounted power supply, energy consumption can be reduced, the problems such as pipeline arrangement between the vehicle-mounted cooling system and the like do not need to be considered, and the vehicle-mounted power supply cooling efficiency is improved. The arrangement of the whole vehicle can be simplified. Furthermore, the vehicle provided with the vehicle-mounted power supply can also have good driving safety.

Description

Technical Field

[0001] The present disclosure relates to the technical field of power supplies, and in particular to a heat dissipation mechanism of an on-vehicle power supply, an on-vehicle power supply and a vehicle. Background Art

[0002] As the range of new energy vehicles increases, the power of power batteries increases, which makes users have higher requirements for charging efficiency and time. The existing on-board power supply AC charging is generally 3.3kW or 6.6kW, which can no longer meet the requirements of ordinary users for fast charging of cars. For new energy vehicles with a range of more than 500km, 11kW, 22kw or even 40kW on-board power supplies are generally used. In this case, the heat dissipation demand for power devices in the on-board power supply (such as a switch tube module composed of multiple switch tubes) increases.

[0003] In the related art, power devices are usually attached to the inner wall of the vehicle power supply box, and then an external vehicle cooling system is used to dissipate the heat of the power devices. In this way, the vehicle power supply needs to be connected to the vehicle cooling system for cooling, which increases the difficulty of arranging the cooling system of the entire vehicle, is not conducive to the individual control of the heat dissipation of the vehicle power supply, and has high energy consumption. Utility Model Content

[0004] The purpose of the present disclosure is to provide a heat dissipation mechanism for a vehicle-mounted power supply, a vehicle-mounted power supply and a vehicle, which do not need to be connected to a vehicle-mounted cooling system, can achieve independent control of the heat dissipation of the vehicle-mounted power supply, and can simplify the overall vehicle layout and reduce energy consumption, so as to at least partially solve the above technical problems.

[0005] In order to achieve the above-mentioned purpose, according to the first aspect of the present disclosure, a heat dissipation mechanism of an on-board power supply is provided. The heat dissipation mechanism comprises: a liquid cooling member, the liquid cooling member is used for heat-conducting connection with a power device of the on-board power supply; and a condenser, which is connected to the liquid cooling member to form a circulation flow path for the circulation of a cooling medium.

[0006] Optionally, the liquid cooling element has a heat-conducting surface, and the heat-conducting surface is used for heat-conducting connection to a power device of the vehicle power supply.

[0007] Optionally, the heat conducting surface is located on at least one side of the liquid cooling component.

[0008] Optionally, the liquid cooling element and the condenser are connected via a pipeline.

[0009] Optionally, a pump may be selectively arranged on the pipeline.

[0010] Optionally, heat dissipation fins are provided on at least one wall surface of the condenser.

[0011] Optionally, at least one fan is provided on the condenser.

[0012] Optionally, a fan and heat dissipation fins are provided on the condenser, the heat dissipation fins are arranged circumferentially around the fan, and the heat dissipation fins form a flow channel extending away from the fan.

[0013] Optionally, the flow channel extends in a curved shape.

[0014] Optionally, the flow channel includes a main flow channel section and a branch flow channel section, the branch flow channel section is connected to an end of the main flow channel section away from the fan, and the branch flow channel sections are multiple and arranged side by side.

[0015] Optionally, the heat dissipation fins include a plurality of first fins arranged in sequence around the circumference of the fan, at least one second fin is arranged between two adjacent first fins, the total flow channel section is located between two adjacent first fins and between one end of the first fin close to the fan and one end of the second fin close to the fan, and the at least one second fin is used to separate two adjacent first fins into a plurality of branch flow channel sections.

[0016] Optionally, a heat pipe is provided on the heat conducting surface, and the heat pipe is used for heat exchange with the power device.

[0017] Optionally, an inwardly concave groove is provided on the heat conducting surface, and the heat pipe is at least partially located in the groove.

[0018] Optionally, a first heat-conducting adhesive is provided between the heat pipe and the heat-conducting surface.

[0019] Optionally, there are multiple heat pipes and they are arranged side by side.

[0020] According to a second aspect of the present disclosure, a vehicle-mounted power supply is provided, which includes a power device and the heat dissipation mechanism described above.

[0021] Optionally, a second thermally conductive adhesive is provided between the power device and the liquid cooling component.

[0022] According to a third aspect of the present disclosure, a vehicle is provided, which includes the above-mentioned on-board power supply.

[0023] Through the above technical solution, i.e. the heat dissipation mechanism of the vehicle-mounted power supply, the vehicle-mounted power supply and the vehicle, the condenser is integrated into the heat dissipation structure of the vehicle-mounted power supply, and independent control of the heat dissipation of the vehicle-mounted power supply can be achieved. When dissipating the heat of the vehicle-mounted power supply, there is no need to synchronously start the entire vehicle-mounted cooling system, so as to reduce energy consumption, and there is no need to consider the pipeline layout between the vehicle-mounted cooling system and other issues, so as to simplify the layout of the entire vehicle. In the technical solution provided by the present disclosure, it is only necessary to thermally connect the power device to the liquid cooling part, and a circulating flow path for the circulation of the cooling medium can be formed between the liquid cooling part and the condenser, so as to achieve effective heat dissipation of the power device. Furthermore, a vehicle equipped with the vehicle-mounted power supply can also have good driving safety.

[0024] Other features and advantages of the present disclosure will be described in detail in the following detailed description. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] The accompanying drawings are used to provide a further understanding of the present disclosure and constitute a part of the specification. Together with the following specific embodiments, they are used to explain the present disclosure but do not constitute a limitation of the present disclosure. In the accompanying drawings:

[0026] Figure 1 is an exploded schematic diagram of a vehicle-mounted power supply provided according to an embodiment of the present disclosure;

[0027] Figure 2 is a schematic diagram of a first use state of a vehicle-mounted power supply provided according to an embodiment of the present disclosure;

[0028] Figure 3 3 is a schematic diagram of a second usage state of the vehicle power supply provided according to an embodiment of the present disclosure.

[0029] Description of Reference Numerals

[0030] 100. On-board power supply; 1. Heat dissipation mechanism; 11. Liquid cooling element; 111. Heat-conducting surface; 111a. Groove; 12. Condenser; 121. First wall; 122. Second wall; 13. Pipeline; 131. First pipeline; 132. Second pipeline; 14. Heat dissipation fin; 141. First fin; 142. Second fin; 15. Fan; 16. Flow channel; 161. Main flow channel section; 162. Branch flow channel section; 17. Heat pipe; 2. Power device. DETAILED DESCRIPTION

[0031] The specific implementation of the present disclosure is described in detail below in conjunction with the accompanying drawings. It should be understood that the specific implementation described herein is only used to illustrate and explain the present disclosure, and is not used to limit the present disclosure.

[0032] In the present disclosure, unless otherwise stated, the directional words used, such as "inside" and "outside", refer to the outline of the corresponding parts themselves. In addition, the terms "first" and "second" used in the present disclosure are to distinguish one element from another element and do not have order and importance. When the following description refers to the drawings, unless otherwise indicated, the same numbers in different drawings represent the same or similar elements.

[0033] According to the first aspect of the present disclosure, Figure 1 As shown, a heat dissipation mechanism 1 of a vehicle-mounted power supply 100 is provided. The heat dissipation mechanism 1 may include a liquid cooling member and a condenser 12. The liquid cooling member is used for heat-conducting connection with a power device 2 of the vehicle-mounted power supply 100. The condenser 12 is connected to the liquid cooling member to form a circulation flow path for the circulation of the cooling medium.

[0034] In the technical solution provided by the present disclosure, the condenser 12 is integrated into the heat dissipation structure of the vehicle-mounted power supply 100, and the heat dissipation of the vehicle-mounted power supply 100 can be independently controlled. When the vehicle-mounted power supply 100 is cooled, there is no need to start the entire vehicle-mounted cooling system synchronously, so as to reduce energy consumption, and there is no need to consider the arrangement of pipes between the vehicle-mounted cooling system and other issues, so as to simplify the arrangement of the entire vehicle. In the technical solution provided by the present disclosure, it is only necessary to connect the power device 2 to the liquid cooling part 11 by thermal conduction, and a circulating flow path for the circulation of the cooling medium can be formed between the liquid cooling part 11 and the condenser 12, so as to achieve effective heat dissipation of the power device 2.

[0035] In order to enable those skilled in the art to better understand the technical solution of the present application, the heat dissipation process of the heat dissipation mechanism 1 is described in detail herein:

[0036] A liquid cooling channel may be formed inside the liquid cooling element 111. Accordingly, a condensation channel may be formed inside the condenser 12. The liquid cooling element 11 and the condenser 12 are interconnected, that is, the liquid cooling channel and the condensation channel are interconnected to form a circulation channel for the circulation of the cooling medium. The power device 2 is connected to the liquid cooling element 11, so that when the power device 2 is in operation, the heat generated by the temperature increase can be directly transferred to the liquid cooling element 11. The liquid cooling element 11 can absorb the heat generated by the power device 2 through the cooling medium circulating inside the liquid cooling channel. The cooling medium after absorbing heat can further flow into the condensation channel of the condenser 12 for condensation and heat release. The cooling medium after heat release can flow back to the liquid cooling element 11 again to absorb heat from the power device 2, so as to circulate and finally achieve the purpose of heat dissipation of the power device 2. It should be noted here that the working principle of the condenser 12 is the prior art. Here, in order to ensure the simplicity of the text, the working principle of the condenser 12 will not be repeated.

[0037] Optionally, the cooling medium mentioned above can be cooling water. Of course, those skilled in the art can also choose other suitable cooling media, which is not limited here. Here, cooling water is selected as the cooling medium to take advantage of its low cost and reliable cooling.

[0038] In some embodiments, the liquid cooling element 11 mentioned above can be, for example, a liquid cooling plate. Of course, the liquid cooling element 11 can also be constructed as other structural forms such as a liquid cooling tube, which is not limited here, and those skilled in the art can make design adjustments according to actual conditions. Here, the liquid cooling element 11 is constructed as a liquid cooling plate, that is, a plate-like shape, in order to facilitate assembly with other components such as the condenser 12 and the power device 2. During assembly, if Figure 1 As shown, the liquid cooling element 11 and the condenser 12 can be arranged side by side in the height direction of the vehicle. The side-by-side arrangement can reduce the structural dimensions of the heat dissipation mechanism 1 or the vehicle-mounted power supply 100 in the horizontal direction when installed on the vehicle, which is conducive to the rational arrangement of the structure of the heat dissipation mechanism 1. Of course, the liquid cooling element 11 and the condenser 12 are also spaced in the height direction of the vehicle and staggered in the horizontal direction, or the liquid cooling element 11 and the condenser 12 can also be arranged in the same horizontal plane, which is not limited here, and those skilled in the art can make adjustments according to actual needs.

[0039] In some embodiments, the liquid cooling element 11 has a heat conducting surface 111. The heat conducting surface 111 is used to conduct heat to the power device 2 of the vehicle power supply 100. The setting of the heat conducting surface 111 can make the power device 2 and the liquid cooling element 11 fit well over a large area, which provides a suitable installation position for the power device 2 and achieves the purpose of effective heat dissipation.

[0040] In some embodiments, Figure 2 As shown, the heat-conducting surface 111 can be located on at least one side of the liquid cooling element 11, that is, the heat-conducting surface 111 can be arranged on one or more sides of the liquid cooling element 11 to be thermally connected to the power device 2. For example, the heat-conducting surface 111 can be located on the side of the liquid cooling element 11 away from the condenser 12. Such an arrangement can prevent the heat released by the condenser 12 from affecting the heat dissipation of the power device 2. Among them, the power device 2 can be detachably connected to the liquid cooling element 11 by fasteners such as bolts. Compared with the related art of using an elastic pressing sheet to squeeze the power device 2 onto the box of the vehicle power supply 100, the reliability of the installation of the power device 2 can be ensured, and the problem of reduced elastic force due to fatigue factors or high temperature factors such as the elastic pressing sheet can be avoided, and the installation can be simplified.

[0041] In some embodiments, Figure 2 and Figure 3As shown, the liquid cooling element 11 and the condenser 12 can be connected through a pipeline 13. As an illustration, the pipeline 13 may include a first pipeline 131 and a second pipeline 132. The first pipeline 131 is used to transport the cooling medium that has absorbed heat in the liquid cooling channel 16 of the liquid cooling element 11 to the condensing channel 16 of the condenser 12. Correspondingly, the second pipeline 132 is used to transport the cooling medium that has condensed in the condensing channel 16 of the condenser 12 to the liquid cooling channel 16 of the liquid cooling element 11. Furthermore, in order to achieve effective circulation of the cooling medium, a pump may be optionally arranged on the pipeline 13. It can be understood that a pump may or may not be arranged on the pipeline 13. Here, the cooling medium is taken as cooling water as an example and two exemplary usage scenarios are divided for specific description:

[0042] Case 1: If Figure 2 As shown, the condenser 12 is arranged above the liquid cooling unit 11. After absorbing the heat of the power device 2, the cooling water in the liquid cooling channel of the liquid cooling unit 11 is vaporized into steam, which can be transported to the condensation channel of the condenser 12 by the first pipeline 131, condensed and liquefied into cooling water, which can flow back to the liquid cooling channel of the liquid cooling unit 11 through the second pipeline 132 by its own gravity, and circulate in this way. This method only requires the phase change of the cooling medium to achieve circulation, and does not require the use of external power such as a pump.

[0043] Case 2: The liquid cooling element 11 is arranged above the condenser 12 (such as Figure 3 The cooling water in the liquid cooling channel of the liquid cooling component 11 is vaporized into steam after absorbing the heat of the power device 2. The steam can be transported to the condensing channel of the condenser 12 by the first pipeline 131, and condensed into cooling water. Here, a pump (not shown in the figure) needs to be arranged in the second pipeline 132. The pump is used to pump the liquefied cooling water back to the liquid cooling channel of the liquid cooling component 11 through the second pipeline 132 for circulation. The pump is a prior art, and the working principle of the pump will not be described here.

[0044] In some embodiments, Figure 2 As shown, heat dissipation fins 14 are provided on at least one wall surface of the condenser 12. The heat dissipation fins 14 can increase the heat dissipation area, so that the condenser 12 can quickly transfer heat to the surrounding air through the heat dissipation fins 14, and finally achieve the purpose of heat dissipation of the power device 2. For example, heat dissipation fins 14 are provided on the first wall surface 121 of the condenser 12 away from the liquid cooling element 11. The arrangement scheme of arranging the heat dissipation fins 14 on the first wall surface can take into account the arrangement cost of the heat dissipation fins 14 and the heat dissipation effect of the heat dissipation fins 14, and further improve the economic practicality of the heat dissipation mechanism 1. It is also worth noting here that, if Figure 1As shown, a corresponding connection structure may be provided on the second wall surface 122 of the condenser 12 close to the liquid cooling element 11, and the connection structure is used to realize the connection between the liquid cooling element 11 and the condenser 12, so as to improve the structural stability of the heat dissipation mechanism 1. For example, the connection structure may be a connecting rod, a connecting frame, etc., which is not limited here, and those skilled in the art may make design adjustments according to actual needs.

[0045] In some embodiments, Figure 2 As shown, at least one fan 15 is provided on the condenser 12. The fan 15 can speed up the air flow rate near the condenser wall, and then can quickly take away the heat of the condenser 12 through the air, and finally achieve the purpose of heat dissipation of the power device 2.

[0046] In some embodiments, a fan 15 and heat dissipation fins 14 are provided on the condenser 12. Optionally, the fan 15 and the heat dissipation fins 14 are both provided on the first wall surface 121 of the condenser 12. The heat dissipation fins 14 are arranged circumferentially around the fan 15. The heat dissipation fins 14 are formed with a flow channel 16 extending away from the fan 15. The provision of the fan 15 further improves the heat dissipation efficiency of the heat dissipation fins 14. The fan 15 can accelerate the flow rate of the air flowing through the flow channel 16 formed by the heat dissipation fins 14, thereby enabling the air to quickly take away the heat on the heat dissipation fins 14, quickly reduce the temperature of the heat dissipation fins 14, and finally achieve the purpose of heat dissipation of the power device 2.

[0047] In some embodiments, Figure 2 As shown, the flow channel 16 extends in a curved shape. Compared with a straight flow channel 16, the curved flow channel 16 can make the entire path of the flow channel 16 longer. Furthermore, the air flowing through the flow channel 16 can prolong the time in the flow channel 16, taking away more heat from the heat sink fins 14, so as to achieve the purpose of cooling the heat sink fins 14. Specifically, the flow channel 16 can extend along any suitable curve, for example, referring to Figure 2 As shown, the flow channel 16 can extend along an arc curve, or along an S-shaped or L-shaped curve, etc., which is not limited here, and those skilled in the art can design it according to actual conditions.

[0048] In some embodiments, Figure 2As shown, the flow channel 16 includes a main flow channel section 161 and a branch flow channel section 162. The branch flow channel section 162 is connected to the end of the main flow channel section 161 away from the fan 15. The number of branch flow channel sections 162 is multiple and arranged side by side. It should be understood here that the flow channel 16 is divided into the main flow channel section 161 and the branch flow channel section 162 because it is necessary to balance the problem of reduced heat dissipation efficiency caused by the gradual decrease in the flow velocity of the fan 15 from the center to the distal end. Specifically, when the fan 15 is working, the flow velocity of the air in the main flow channel section 161 close to the fan 15 is fast enough, but as the air gradually flows along the flow channel 16 to the end away from the fan 15, the flow velocity of the air is gradually reduced. Then, the branch flow channel section 162 is added at the end away from the fan 15, which can increase the heat dissipation area to compensate for the problem of reduced heat dissipation efficiency caused by the reduction in air flow velocity.

[0049] As an illustration, Figure 2 As shown, the addition of branch flow channel sections 162 can be achieved through this embodiment. Specifically, the heat dissipation fins 14 may include a plurality of first fins 141 arranged in sequence around the circumference of the fan 15. At least one second fin 142 is provided between two adjacent first fins 141. The total flow channel section 161 is located between two adjacent first fins 141 and between one end of the first fin 141 close to the fan 15 and one end of the second fin 142 close to the fan 15. At least one second fin 142 is used to separate two adjacent first fins 141 into a plurality of branch flow channel sections 162. The addition of branch flow channel sections 162 is achieved by adding second fins 142, which is reliable, effective and low-cost.

[0050] In some embodiments, Figure 1 As shown, a heat pipe 17 may be provided on the heat conducting surface 111. The heat pipe 17 is used for heat exchange with the power device 2. The heat pipe 17 has good thermal conductivity, and the arrangement of the heat pipe 17 can transfer the heat of the power component to the liquid cooling element 11 more quickly and evenly.

[0051] It should be understood here that the heat pipe 17 is a prior art. To ensure the simplicity of the text, its working principle will not be described in detail. However, it is worth noting that, usually, one end of the heat pipe 17 is the evaporation end and the other end is the condensation end. When one end of the heat pipe 17 is heated, the liquid in the capillary tube is rapidly vaporized, and the steam flows to the other end under the power of heat diffusion, and condenses at the cold end to release heat. The liquid then flows back to the evaporation end along the porous material by capillary action, and the cycle continues until the temperatures at both ends of the heat pipe 17 are equal (at this time, the steam heat diffusion stops). This cycle is carried out quickly, and heat can be conducted continuously. Therefore, preferably, a plurality of heat pipes 17 can be arranged on the heat conducting surface 111, and the plurality of heat pipes 17 are arranged side by side. The evaporation end and the condensation end between two adjacent heat pipes 17 are arranged in an alternating manner. Such an arrangement can achieve a more balanced transfer of heat. Of course, it is understandable that in other embodiments, among the multiple heat pipes 17, the two evaporation ends of any two adjacent heat pipes 17 can be located on the same side, and the two condensation ends are located on the other side. There is no limitation here, and technicians in this field can arrange it according to actual needs.

[0052] In some embodiments, a concave groove 111a is provided on the heat conducting surface 111, and the heat pipe 17 is at least partially located in the groove 111a. The provision of the groove 111a can increase the contact area between the heat pipe 17 and the liquid cooling element 11, further improving the heat conduction effect of the heat pipe 17.

[0053] In some embodiments, a first thermally conductive adhesive is provided between the heat pipe 17 and the heat-conducting surface 111. Specifically, the first thermally conductive adhesive can be coated on the surface of the groove 111a on the heat-conducting surface 111 to form a first thermally conductive adhesive layer. Furthermore, the first thermally conductive adhesive can fix the heat pipe 17 in the groove 111a of the heat-conducting surface 111 on the one hand, and can improve the heat conduction effect on the other hand, so that the heat pipe 17 can better transfer heat to the liquid cooling part 11. Optionally, the first thermally conductive adhesive can be selected from epoxy thermally conductive adhesive, thermally conductive silicone gel, etc., which is not limited here, and those skilled in the art can make a selection according to actual needs.

[0054] According to the second aspect of the present disclosure, a vehicle-mounted power supply 100 is provided. The vehicle-mounted power supply 100 may include a power device 2 and the above-mentioned heat dissipation mechanism 1. Optionally, the power device 2 may be a switch tube module composed of a plurality of switch tubes. Of course, it will be understood by those skilled in the art that the power device 2 may also be other devices, which are not limited here and can be reasonably adjusted according to actual conditions. During assembly, the power device 2 may be installed on the heat conducting surface 111 of the liquid cooling part 11 in the heat dissipation mechanism 1. The power device 2 may be connected to the heat conducting surface 111 by bolting. Of course, the power device 2 may also be connected by other connection methods such as welding and bonding, which are not limited here and can be selected by those skilled in the art according to actual needs. In this embodiment, the vehicle-mounted power supply 100 assembled by the heat dissipation mechanism 1 and the power device 2 provided above is suitable for automated production and has a simple assembly process.

[0055] In some embodiments, a second thermally conductive adhesive is provided between the power device 2 and the liquid cooling element 11. The provision of the second thermally conductive adhesive can improve the heat transfer effect between the power device 2 and the heat conductive surface 111, thereby enabling the heat of the power device 2 to be better transferred to the liquid cooling element 11. Optionally, the second thermally conductive adhesive can be selected from epoxy thermally conductive adhesive, thermally conductive silicone gel, etc., which is not limited here, and those skilled in the art can select according to actual needs.

[0056] According to a third aspect of the present disclosure, a vehicle is provided. The vehicle includes the above-mentioned vehicle-mounted power supply. In this embodiment, the vehicle equipped with the vehicle-mounted power supply can have good driving safety.

[0057] The preferred embodiments of the present disclosure are described in detail above in conjunction with the accompanying drawings; however, the present disclosure is not limited to the specific details in the above embodiments. Within the technical concept of the present disclosure, a variety of simple modifications can be made to the technical solution of the present disclosure, and these simple modifications all fall within the protection scope of the present disclosure.

[0058] It should also be noted that the various specific technical features described in the above specific embodiments can be combined in any suitable manner without contradiction. In order to avoid unnecessary repetition, the present disclosure will not further describe various possible combinations.

[0059] In addition, various embodiments of the present disclosure may be arbitrarily combined, and as long as they do not violate the concept of the present disclosure, they should also be regarded as the contents disclosed by the present disclosure.

Claims

1. A heat dissipation mechanism for a vehicle-mounted power supply, characterized in that: include: Liquid cooling parts, used for thermal connection with the power devices of the vehicle power supply; and The condenser is communicated with the liquid cooling element to form a circulation flow path for the cooling medium to flow.

2. The heat dissipation mechanism according to claim 1, characterized in that: The liquid cooling element has a heat conducting surface, and the heat conducting surface is used for heat conducting connection to a power device of the vehicle-mounted power supply.

3. The heat dissipation mechanism according to claim 2, characterized in that: The heat conducting surface is located on at least one side of the liquid cooling component.

4. The heat dissipation mechanism according to claim 1, characterized in that: The liquid cooling element and the condenser are connected via a pipeline.

5. The heat dissipation mechanism according to claim 4, characterized in that: A pump may be optionally arranged on the pipeline.

6. The heat dissipation mechanism according to claim 1, characterized in that: At least one wall surface of the condenser is provided with heat dissipation fins.

7. The heat dissipation mechanism according to claim 1, characterized in that: At least one fan is arranged on the condenser.

8. The heat dissipation mechanism according to claim 1, characterized in that: The condenser is provided with a fan and heat dissipation fins. The heat dissipation fins are arranged around the circumference of the fan, and the heat dissipation fins are formed with flow channels extending away from the fan.

9. The heat dissipation mechanism according to claim 8, characterized in that: The flow channel extends in a curved shape.

10. The heat dissipation mechanism according to claim 8, characterized in that: The flow channel includes a main flow channel section and a branch flow channel section. The branch flow channel section is connected to an end of the main flow channel section away from the fan. There are multiple branch flow channel sections, which are arranged side by side.

11. The heat dissipation mechanism according to claim 10, characterized in that: The heat dissipation fins include a plurality of first fins arranged in sequence around the circumference of the fan, at least one second fin is provided between two adjacent first fins, the total flow channel section is located between two adjacent first fins and between one end of the first fin close to the fan and one end of the second fin close to the fan, and the at least one second fin is used to separate two adjacent first fins into a plurality of branch flow channel sections.

12. The heat dissipation mechanism according to claim 2, characterized in that: A heat pipe is arranged on the heat conducting surface, and the heat pipe is used for heat exchange with the power device.

13. The heat dissipation mechanism according to claim 12, characterized in that: The heat conducting surface is provided with an inwardly concave groove, and the heat pipe is at least partially located in the groove.

14. The heat dissipation mechanism according to claim 12, characterized in that: A first heat-conducting adhesive is arranged between the heat pipe and the heat-conducting surface.

15. The heat dissipation mechanism according to claim 12, characterized in that: The heat pipes are multiple and arranged side by side.

16. A vehicle-mounted power supply, characterized in that: The invention comprises a power device and the heat dissipation mechanism described in any one of claims 1 to 15.

17. The vehicle-mounted power supply according to claim 16, characterized in that: A second heat-conducting adhesive is arranged between the power device and the liquid cooling component.

18. A vehicle, characterized in that: The vehicle-mounted power supply comprises any one of claims 16-17.

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