Double-sided heat dissipation packaging structure

Abstract

The utility model discloses a double-sided heat dissipation packaging structure, which comprises a frame body, a chip, a plastic package body and an arch-shaped aluminum strip, the frame body is provided with a base island, two opposite sides of the base island are provided with a plurality of first pins and second pins, the chip is attached to the upper surface of the base island, the base island is provided with a first heat dissipation plane exposed out of the lower surface of the plastic package body, and the arch-shaped aluminum strip is provided with a second heat dissipation plane exposed out of the lower surface of the plastic package body. The first heat dissipation plane is flush with the lower surface of the plastic package body, the arched aluminum strip is provided with an arched part, a first connecting part and a second connecting part, the first connecting part and the second connecting part are arranged at the two ends of the arched part, the first connecting part is connected with the upper surface of the chip, and the second connecting part is connected with the upper surface of the second pin. The heat dissipation flat plate is provided with a second heat dissipation plane exposed out of the upper surface of the plastic package body, the second heat dissipation plane is flush with the upper surface of the plastic package body, the double-face heat dissipation structure is adopted, the heat dissipation capacity of the product is higher, and the performance of the product is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of chip packaging, in particular to a double-sided heat dissipation packaging structure. Background Art

[0002] Power devices consume large amounts of electrical power when working, requiring the product to have a certain heat dissipation capability, that is, to be able to conduct the heat generated by the internal chip to the outside of the device during operation to avoid chip overheating and burns, or causing deformation of the frame substrate and delamination, which affects the reliability of the product.

[0003] At present, conventional high-power MOSFET chip packaging mostly uses large-sized aluminum tape for connection to enable the passage of large current. During plastic sealing, the aluminum tape is completely buried in the plastic sealing material. Due to the poor thermal conductivity of the plastic sealing material, the chip can only pass through, resulting in low heat dissipation capacity of the product, affecting product performance. Utility Model Content

[0004] The utility model aims at solving the deficiencies in the prior art and provides a double-sided heat dissipation packaging structure, which can adopt a double-sided heat dissipation structure to increase the heat dissipation capacity of the product and improve product performance.

[0005] In order to achieve the above purpose, the utility model adopts the following technical solutions:

[0006] A double-sided heat dissipation packaging structure comprises a frame body, a chip, a plastic package body, and an arched aluminum strip, wherein the frame body has a base island, a plurality of first pins are arranged on one side of the base island, and a plurality of second pins are arranged on the other side of the base island, the chip is attached to the upper surface of the base island, the base island has a first heat dissipation plane exposed from the lower surface of the plastic package body, the first heat dissipation plane is flush with the lower surface of the plastic package body, the arched aluminum strip has an arched portion and a first connecting portion and a second connecting portion arranged at both ends of the arched portion, the arched portion is arched upward, the first connecting portion is connected to the upper surface of the chip, and the second connecting portion is connected to the upper surface of the second pin, during plastic packaging, the arched portion is pressed downward by a mold, so that the arched portion is plastically deformed to form a heat dissipation plate, the heat dissipation plate has a second heat dissipation plane exposed from the upper surface of the plastic package body, and the second heat dissipation plane is flush with the upper surface of the plastic package body.

[0007] By providing an arched aluminum strip consisting of an arched portion, a first connecting portion and a second connecting portion, since the arched aluminum strip is a soft metal, during plastic packaging, the arched portion is pressed downward by the mold, which causes the arched portion to be plastically deformed to form a heat dissipation plate. During the plastic packaging process, the heat dissipation plate and the inner top wall of the mold cavity are kept in a fitted state, so that after plastic packaging, the heat dissipation plate will form a second heat dissipation plane exposed on the upper surface of the plastic packaging body, and a first heat dissipation plane exposed on the lower surface of the plastic packaging body in conjunction with the base island, and finally form a packaging structure with double-sided heat dissipation, so that the product has a higher heat dissipation capacity and improves product performance; in addition, the arched portion absorbs the pressing force of the mold when plastic deformation occurs, which can reduce the pressure on the chip, avoid crushing the chip, and play a protective role.

[0008] As a preferred solution, the second heat dissipation plane is a rectangular heat dissipation plane.

[0009] As a preferred solution, the length L of the rectangular heat dissipation plane is 1.5 mm-2.5 mm, and the width K of the rectangular heat dissipation plane is 1.0 mm-2.0 mm.

[0010] As a preferred solution, the first pin is integrally formed with the base island, and the second pin is spaced apart from the base island.

[0011] As a preferred solution, the thickness of the arched aluminum strip is 0.1 mm-0.2 mm.

[0012] Compared with the prior art, the utility model has obvious advantages and beneficial effects. Specifically, by providing an arched aluminum strip consisting of an arched portion, a first connecting portion and a second connecting portion, since the arched aluminum strip is a soft metal, during plastic packaging, the arched portion is pressed downward by the mold, which causes the arched portion to be plastically deformed to form a heat dissipation plate. During the plastic packaging process, the heat dissipation plate and the inner top wall of the mold cavity are kept in a fitted state, so that after the plastic packaging, the heat dissipation plate will form a second heat dissipation plane exposed on the upper surface of the plastic packaging body, and a first heat dissipation plane exposed on the lower surface of the plastic packaging body in conjunction with the base island, finally forming a packaging structure with double-sided heat dissipation, so that the product has a higher heat dissipation capacity and improves product performance; in addition, the arched portion absorbs the pressing force of the mold when plastic deformation occurs, which can reduce the pressure on the chip, avoid crushing the chip, and play a protective role.

[0013] In order to more clearly explain the structural features, technical means and specific purposes and functions achieved by the present invention, the present invention is further described in detail below in conjunction with the accompanying drawings and specific embodiments: BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 It is a cross-sectional schematic diagram of an embodiment of the utility model;

[0015] Figure 2It is a schematic diagram of the internal top view of an embodiment of the utility model;

[0016] Figure 3 It is a schematic diagram of an external top view of an embodiment of the utility model;

[0017] Figure 4 This is a schematic diagram of an un-molded state of an embodiment of the utility model;

[0018] Figure 5 It is a schematic diagram of the mold closing state of an embodiment of the utility model.

[0019] Description of the accompanying drawings:

[0020] 10-frame body; 101-base island; 102-first pin; 103-second pin; 104-third pin; 105-first heat dissipation plane; 11-chip; 12-plastic package; 20-arched aluminum strip; 21-arched part; 211-heat dissipation plate; 212-second heat dissipation plane; 22-first connecting part; 23-second connecting part; 30-lower mold; 31-upper mold; 32-cavity; 33-inner top wall. DETAILED DESCRIPTION

[0021] In the description of the present invention, it should be noted that the terms "center", "up", "down", "left", "right", "vertical", "horizontal", "inside", "outside", etc. indicate directions or positional relationships based on the directions or positional relationships shown in the accompanying drawings. They are only for the convenience of describing the utility model and simplifying the description, and do not indicate or imply that the position or element referred to must have a specific direction, be constructed and operated in a specific direction. Therefore, they cannot be understood as limitations on the present invention.

[0022] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installation", "connection" and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to the specific circumstances.

[0023] like Figure 1-5As shown, the utility model discloses a double-sided heat dissipation packaging structure, including a frame body 10, a chip 11, a plastic package body 12, and an arched aluminum strip 20. The frame body 10 has a base island 101, and one side of the base island 101 is provided with a plurality of first pins 102, and the other side of the base island 101 is provided with a plurality of second pins 103 and a third pin 104. The third pin 104 is electrically connected to the chip 11 through a metal wire. Specifically, the number of the first pins 102 is four, the number of the second pins 103 is three, the first pins 102 and the base island 101 are integrally formed, and the second pins 103 are spaced apart from the base island 101. The chip 11 is attached to the upper surface of the base island 101, and the base island 101 has a first heat dissipation plane 105 exposed on the lower surface of the plastic package body 12, and the first heat dissipation plane 105 is flush with the lower surface of the plastic package body 12.

[0024] The arched aluminum strip 20 has an arched portion 21 and a first connecting portion 22 and a second connecting portion 23 arranged at both ends of the arched portion 21. The arched portion 21 is arched upward, the first connecting portion 22 is connected to the upper surface of the chip 11, and the second connecting portion 23 is connected to the upper surface of the second pin 103. During plastic packaging, the arched portion 21 is pressed downward by the mold, so that the arched portion 21 is plastically deformed to form a heat dissipation plate 211. The heat dissipation plate 211 has a second heat dissipation plane 212 exposed on the upper surface of the plastic packaging body 12, and the second heat dissipation plane 212 is flush with the upper surface of the plastic packaging body 12.

[0025] The second heat dissipation plane 212 is a rectangular heat dissipation plane, the length L of the rectangular heat dissipation plane is 1.5 mm-2.5 mm, the width K of the rectangular heat dissipation plane is 1.0 mm-2.0 mm, preferably the length L is 2.0 mm, and the width K is 1.5 mm.

[0026] The thickness of the arched aluminum strip 20 is 0.1mm-0.2mm, and preferably the thickness of the arched aluminum strip 20 is 0.15mm. By adopting the arched aluminum strip 20 with a thickness of 0.1mm-0.2mm, the softness and strength of the arched aluminum strip 20 are optimized, thereby ensuring that the arched portion 211 is easy to produce plastic deformation, and the heat dissipation plate 211 can also keep a close fit with the mold.

[0027] The packaging process of the utility model is as follows: first, the chip 11 is attached to the base island 101 of the frame body 10; then, the first connection portion 22 of the arched aluminum strip 20 is connected to the upper surface of the chip 11, and the second connection portion 23 is connected to the upper surface of the second pin 103; next, the frame body 10 containing the chip 11 and the arched aluminum strip 20 is placed on the upper surface of the lower mold 30, at this time, the lower surface of the base island 101 is attached to the upper surface of the lower mold 30, and the arched portion 21 on the arched aluminum strip 20 is in an arc shape; then, the upper mold 31 is molded with the lower mold 30, and the inner top wall 33 of the cavity 32 of the upper mold 31 presses the arched portion 21 downward, so that the arched portion 21 is generated Plastic deformation forms a heat dissipation plate 211, and the heat dissipation plate 211 fits the inner top wall 33 of the upper cavity 32; finally, plastic is injected for plastic sealing to expose the second heat dissipation plane 212 on the heat dissipation plate 211 to the upper surface of the plastic sealing body 12, and the first heat dissipation plane 105 on the base island 101 to the lower surface of the plastic sealing body 12. It should be pointed out that the distance B between the upper surface of the arch 21 and the lower surface of the base island 101 is greater than the height A of the cavity 32, and the difference between B and A is 100um-300um. The setting of this difference allows the heat dissipation plate 211 to be pressed against the arch 21 when the upper mold 31 and the lower mold 30 are closed.

[0028] In summary, the utility model provides an arched aluminum strip 20 consisting of an arched portion 21, a first connecting portion 22 and a second connecting portion 23. Since the arched aluminum strip 20 is a soft metal, during plastic packaging, the arched portion 21 is pressed downward by the mold, which causes the arched portion 21 to be plastically deformed to form a heat dissipation plate 211. During the plastic packaging process, the heat dissipation plate 211 is in contact with the inner top wall 33 of the mold cavity 32, so that after plastic packaging, the heat dissipation plate 211 will form a second heat dissipation plane 212 exposed on the upper surface of the plastic packaging body 12, and a first heat dissipation plane 105 exposed on the lower surface of the plastic packaging body 12 in cooperation with the base island 101, and finally form a packaging structure with double-sided heat dissipation, so that the product has a higher heat dissipation capacity and improves product performance; in addition, the arched portion 21 absorbs the pressing force of the mold when plastic deformation occurs, which can reduce the pressure on the chip 11, avoid crushing the chip 11, and play a protective role.

[0029] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Therefore, any modification, equivalent replacement, improvement, etc. made to the above embodiment based on the technical practice of the present invention still falls within the scope of the technical solution of the present invention.

Claims

1. A double-sided heat dissipation packaging structure, comprising a frame body, a chip, a plastic package, and an arched aluminum strip, wherein the frame body has a base island, a plurality of first pins are provided on one side of the base island, and a plurality of second pins are provided on the other side of the base island, wherein the chip is attached to the upper surface of the base island, and the base island has a first heat dissipation plane exposed on the lower surface of the plastic package, wherein the first heat dissipation plane is flush with the lower surface of the plastic package, and wherein: The arched aluminum strip comprises an arched portion and a first connecting portion and a second connecting portion arranged at both ends of the arched portion, the arched portion arches upward, the first connecting portion is connected to the upper surface of the chip, and the second connecting portion is connected to the upper surface of the second pin. During plastic packaging, the arched portion is pressed downward by a mold so that the arched portion is plastically deformed to form a heat dissipation plate, and the heat dissipation plate has a second heat dissipation plane exposed on the upper surface of the plastic packaging body, and the second heat dissipation plane is flush with the upper surface of the plastic packaging body.

2. The double-sided heat dissipation packaging structure according to claim 1, characterized in that: The second heat dissipation plane is a rectangular heat dissipation plane.

3. The double-sided heat dissipation packaging structure according to claim 2, characterized in that: The length L of the rectangular heat dissipation plane is 1.5 mm-2.5 mm, and the width K of the rectangular heat dissipation plane is 1.0 mm-2.0 mm.

4. The double-sided heat dissipation packaging structure according to claim 1, characterized in that: The first pin is integrally formed with the base island, and the second pin is spaced apart from the base island.

5. The double-sided heat dissipation packaging structure according to any one of claims 1 to 4, characterized in that: The thickness of the arched aluminum strip is 0.1 mm-0.2 mm.

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