Atomization device

Abstract

The utility model provides an atomization device which is used for solving the technical problem that pins need to be bent when a heating element is assembled. The atomization device comprises a supporting base, an atomization assembly and a circuit board. The supporting seat comprises a base and a stand column which are connected with each other, the atomization assembly comprises a heating piece with a pin, the atomization assembly is sleeved on the stand column, the circuit board is installed on one side, far away from the stand column, of the base, and the circuit board is provided with a connecting hole for the pin to penetrate through. The stand column is provided with a wire passing channel, the wire passing channel penetrates through the supporting base in the extending direction of the stand column, the connecting holes are located in the extending direction of the wire passing channel, and the pins penetrate through the wire passing channel and are inserted into the connecting holes so that the pins can be electrically connected with the circuit board. According to the invention, the pins of the heating element can directly pass through the wire passing channel and are inserted into the connecting holes, so that the pins do not need to be folded into the mounting holes. The wire passing channel is arranged on the stand column, so that the problem of pin deformation caused by contact between the pins and the stand column before the pins penetrate into the wire passing channel can be avoided.

Description

Technical Field

[0001] The present application relates to the technical field of aerosol atomization, and in particular to an atomization device. Background Art

[0002] The electronic atomization device can heat the aerosol matrix through the heating element to generate an aerosol. In the assembly process of the existing heating element, it is necessary to first fold the pins of the heating element into the preset mounting holes, and then insert the ejector pins soldered on the printed circuit board (PCB) into the mounting holes and abut against the pins to achieve electrical connection. This assembly method is not only easy to cause the heating network of the heating element to deform when the pins are bent, thereby affecting the atomization effect and reducing the service life of the electronic atomization device, but also requires preset ejector pins on the circuit components, resulting in an increase in the cost of the electronic atomization device. Utility Model Content

[0003] The present application provides an atomization device, aiming to solve the technical problems mentioned in the background technology.

[0004] In one embodiment of the present application, an atomization device is provided, comprising:

[0005] A support base, comprising a base and a column connected thereto;

[0006] an atomizing assembly, comprising a heating element having pins, wherein the atomizing assembly is sleeved on the column; and

[0007] A circuit board is mounted on a side of the base away from the column, and the circuit board has a connection hole, and the connection hole is used for the pin to pass through;

[0008] Among them, a wire passing channel is provided on the column, and the wire passing channel passes through the support seat along the extension direction of the column. The connecting hole is located in the extension direction of the wire passing channel. The pin passes through the wire passing channel and is inserted into the connecting hole to electrically connect the pin to the circuit board.

[0009] In one embodiment, the wire passage is configured as a wire hole;

[0010] The wire hole has a first end and a second end, the first end is far away from the base, the second end is close to the circuit board, and the opening area of ​​the first end is larger than the opening area of ​​the second end.

[0011] In one embodiment, the opening area of ​​the second end is smaller than or equal to the opening area of ​​the connecting hole.

[0012] In one embodiment, the heating element has a plurality of pins;

[0013] The column is provided with a plurality of wire-passing channels, and the plurality of wire-passing channels are used for allowing the plurality of pins to pass through in a one-to-one correspondence.

[0014] In one embodiment, the atomization assembly further includes a bracket and a liquid guide connected thereto;

[0015] The bracket is sleeved on the column, the liquid-conducting body has an air flow channel arranged along the extension direction of the column, the heating element is located in the air flow channel and contacts with a side of the liquid-conducting body away from the bracket, and the pin is provided with a limiting portion, and the limiting portion abuts between the liquid-conducting body and the column.

[0016] In one embodiment, the limiting portion includes a first bending portion and a second bending portion, the first bending portion is used to abut against the liquid-conducting body, and the second bending portion is used to abut against the column;

[0017] The first bending portion is bent toward the outside of the liquid-conducting body along the extension direction of the column, and the bending direction of the second bending portion is opposite to the bending direction of the first bending portion, so that the pin after the second bending portion is bent is arranged along the extension direction of the column.

[0018] In one embodiment, a mounting groove is provided on a side of the base away from the column;

[0019] The circuit board is installed in the installation groove in a limited position along a direction perpendicular to the extension of the column.

[0020] In one embodiment, the base is connected to a stopper;

[0021] The stopper is arranged on a side of the circuit board away from the column, and the stopper is used to support the circuit board.

[0022] In one embodiment, the stopper is provided in plurality;

[0023] A plurality of the stoppers are arranged along the corners of the circuit board so that the corners of the circuit board can be supported on the plurality of the stoppers.

[0024] In one embodiment, a sealing film is provided in the wire passage;

[0025] The pin passes through the wire passage and penetrates the sealing film.

[0026] According to the atomizer device in the above embodiment, when assembling the atomizer device, since the support seat has a wire-passing channel, the circuit board has a connecting hole, and the connecting hole is located in the extension direction of the wire-passing channel, the pin of the heating element can directly pass through the wire-passing channel and be inserted into the connecting hole, so that there is no need to fold the pin into the corresponding mounting hole, which not only simplifies the assembly process of the atomizer device and improves the assembly efficiency of the atomizer device, but also avoids the problem of deformation of the heating element caused by bending of the pin. After the pin is inserted into the connecting hole, the assembly of the atomizer device can be completed by welding the pin on the circuit board, so there is no need to preset the ejector pin on the circuit board, saving the manufacturing cost of the atomizer device.

[0027] On this basis, the column can play a role in connecting and positioning the installation of the atomizer assembly. The wire-passing channel is set on the column so that the pin can directly pass through the wire-passing channel from the end of the column away from the base, thereby avoiding the problem that the wire-passing channel is only set on the base, which causes the pin to deform due to contact with the column before passing through the wire-passing channel. In addition, setting the wire-passing channel on the column also extends the length of the wire-passing channel, thereby extending the guiding path of the wire-passing channel to the pin, which is conducive to ensuring that the pin can be smoothly inserted into the connection hole.

[0028] When the support base and the shell are sealed to form a liquid storage tank, the wire-passing channel is arranged on the column, and the opening of the wire-passing channel is also located on the column. Since the atomizing assembly is sleeved on the column, the outer wall of the column can be sealed to the atomizing assembly, so that the barrier distance between the opening of the wire-passing channel and the aerosol matrix is ​​increased, thereby avoiding the problem that the aerosol matrix is ​​easy to flow into the circuit board from the opening of the wire-passing channel when the opening of the wire-passing channel is arranged on the base, thereby improving the service life of the atomizing device. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Figure 1 This is a schematic cross-sectional view of an atomization device in one embodiment of the present application;

[0030] Figure 2 for Figure 1 A schematic diagram of the exploded structure of the atomizing device in the atomizing device;

[0031] Figure 3 for Figure 1 A schematic diagram of the cross-sectional structure of the atomizing device in the atomizing device;

[0032] Figure 4 for Figure 3 A schematic cross-sectional view of an embodiment of a support seat in an atomization device;

[0033] Figure 5 for Figure 3 A schematic cross-sectional view of another embodiment of a support seat in an atomizing device;

[0034] Figure 6 for Figure 3 A schematic diagram of the three-dimensional structure of another embodiment of a support base in an atomizing device;

[0035] Figure 7 for Figure 3 A schematic diagram of the three-dimensional structure of the heating element in the atomization device;

[0036] Figure 8 for Figure 3 Schematic diagram of the three-dimensional structure of the support base in the atomization device from another perspective.

[0037] in:

[0038] 1-atomizing device; 10-support seat; 11-base; 111-mounting groove; 112-stopper; 12-column; 120-wire passage; 121-first end; 122-second end; 123-sealing film; 20-atomizing assembly; 21-heating element; 210-pin; 211-limiting part; 211a-first bending part; 211b-second bending part; 22-bracket; 23-liquid guide; 230-air flow channel; 30-circuit board; 31-connecting hole; 40-power supply assembly; 50-housing. Specific embodiments

[0039] The present application is further described in detail below by specific embodiments in conjunction with the accompanying drawings. Wherein similar elements in different embodiments adopt associated similar element numbers. In the following embodiments, many detailed descriptions are for making the present application better understood. However, those skilled in the art can effortlessly recognize that some features can be omitted in different situations, or can be replaced by other elements, materials, methods. In some cases, some operations related to the present application are not shown or described in the specification, and this is to avoid the core part of the present application being overwhelmed by too much description, and for those skilled in the art, it is not necessary to describe these related operations in detail, and they can fully understand the related operations according to the description in the specification and the general technical knowledge in the art.

[0040] In addition, the features, operations or characteristics described in the specification can be combined in any appropriate manner to form various embodiments, and the operation steps involved in each embodiment can also be replaced or adjusted in order in a manner that is obvious to those skilled in the art. Therefore, the specification and drawings are only for the purpose of clearly describing a certain embodiment, and do not mean that the composition and / or order are necessary.

[0041] The serial numbers of the components in this document, such as "first", "second", etc., are only used to distinguish the objects described and do not have any order or technical meaning. The "connection" and "coupling" mentioned in this application, unless otherwise specified, include direct and indirect connections (couplings).

[0042] The present application provides an atomization device 1, such as Figures 1 to 3 As shown, the atomizer device 1 may include a support seat 10, an atomizer assembly 20 and a circuit board 30. The support seat 10 may include a base 11 and a column 12 connected to each other, the atomizer assembly 20 may include a heating element 21 having a pin 210, the atomizer assembly 20 is sleeved on the column 12, the circuit board 30 may be installed on the side of the base 11 away from the column 12, and the circuit board 30 may have a connecting hole 31, and the connecting hole 31 is used for the pin 210 to pass through. Among them, a wire-passing channel 120 is provided on the column 12, and the wire-passing channel 120 passes through the support seat 10 along the extension direction of the column 12, and the connecting hole 31 is located in the extension direction of the wire-passing channel 120, and the pin 210 passes through the wire-passing channel 120 and is inserted into the connecting hole 31, so that the pin 210 is electrically connected to the circuit board 30.

[0043] In this way, when assembling the atomizer 1, since the support base 10 has the wire passage 120, the circuit board 30 has the connection hole 31, and the connection hole 31 is located in the extension direction of the wire passage 120, the pin 210 of the heating element 21 can directly pass through the wire passage 120 and be inserted into the connection hole 31, so that there is no need to fold the pin 210 into the corresponding mounting hole, which not only simplifies the assembly process of the atomizer 1 and improves the assembly efficiency of the atomizer 1, but also avoids the problem of deformation of the heating element 21 caused by bending of the pin 210. After the pin 210 is inserted into the connection hole 31, the assembly of the atomizer 1 can be completed by welding the pin 210 to the circuit board 30, so there is no need to preset a pin on the circuit board 30, saving the manufacturing cost of the atomizer 1.

[0044] On this basis, the column 12 can play a role in connecting and positioning the installation of the atomizer assembly 20. The wire-passing channel 120 is arranged on the column 12, so that the pin 210 can directly pass through the wire-passing channel 120 from the end of the column 12 away from the base 11, thereby avoiding the problem that the wire-passing channel 120 is only arranged on the base 11, which causes the pin 210 to be deformed due to contact with the column 12 before passing through the wire-passing channel 120. In addition, the wire-passing channel 120 is arranged on the column 12, and the length of the wire-passing channel 120 is also extended, thereby extending the guiding path of the wire-passing channel 120 to the pin 210, which is conducive to ensuring that the pin 210 can be smoothly inserted into the connection hole 31 while improving the assembly stability.

[0045] In some embodiments, the support base 10 can be made of materials such as silicone or rubber. When the support base 10 is installed in the housing 50, the support base 10 can be sealed and connected to the housing 50 to form a liquid storage tank, so that the liquid storage tank can be used to store aerosol matrix. Of course, in other embodiments, the support base 10 can also be made of plastic material, so that the support base 10 is connected to the housing 50 to support the atomization assembly 20. This application does not impose any special restrictions on the specific material and use of the support base 10.

[0046] When the support base 10 and the housing 50 are sealed to form a liquid storage tank, the wire passage 120 is arranged on the column 12, and the opening of the wire passage 120 is also located on the column 12. Since the atomizer assembly 20 is sleeved on the column 12, the outer wall of the column 12 can be sealed to the atomizer assembly 20, so that the barrier distance between the opening of the wire passage 120 and the aerosol matrix is ​​increased, thereby avoiding the problem that the aerosol matrix is ​​easy to flow into the circuit board 30 from the opening of the wire passage 120 when the opening of the wire passage 120 is arranged on the base 11, thereby improving the service life of the atomizer device 1.

[0047] In addition, if Figure 1 As shown, the atomizing device 1 may also include a power supply component 40 and a shell 50, wherein the power supply component 40 is installed in the shell 50 and is electrically connected to the circuit board 30. For example, the power supply component 40 may include a battery, which may be used to provide power for the normal operation of the atomizing device 1, so that the atomizing device 1 can heat the aerosol matrix to generate an aerosol. The power supply component 40 may also include electronic devices such as a charging interface that can be used for charging, and the present application does not impose any special restrictions on the specific structure of the power supply component 40. The shell 50 may be set to a structural shape such as a rod or a column, and the present application does not impose any special restrictions on the specific shape of the shell 50.

[0048] Among them, Figure 2 and Figure 3 As shown, the column 12 of the support seat 10 can extend along the direction of the aa axis. For the convenience of description, the following embodiments will take the direction of the aa axis as the extension direction of the column 12. In addition, in the drawings of the following embodiments, the hollow parts such as channels, holes, grooves, openings, etc. will be marked with arrow-marked lines, and the remaining parts will be marked with arrow-free marking lines. For example, the marking lines shown in the wire channel 120 and the connecting hole 31 will not be repeated below.

[0049] In some embodiments, Figure 2 and Figure 4As shown, the wire passage 120 can be configured as a wire hole, which has a first end 121 and a second end 122. The first end 121 is far away from the base 11, and the second end 122 is close to the circuit board 30. The opening area of ​​the first end 121 is larger than the opening area of ​​the second end 122.

[0050] When the opening area of ​​the first end 121 is larger than the opening area of ​​the second end 122, the pin 210 of the heating element 21 can be inserted into the wire hole more conveniently and quickly, thereby improving the assembly efficiency of the atomization device 1. Figure 4 As shown, the opening area of ​​the wire hole can be gradually reduced from the first end 121 to the second end 122. Figure 5 As shown, the opening area of ​​the wire hole can be the same along the direction of the aa axis, but an expansion opening is provided at the first end 121 of the wire hole so that the pin 210 can be quickly inserted into the wire hole. The wire hole can be set to a circular hole, a waist-shaped hole or a rectangular hole, etc., and the present application does not impose any special restrictions on the specific shape of the wire hole.

[0051] In addition, in some other embodiments, Figure 6 As shown, the wire-passing channel 120 can also be configured as a wire-passing groove structure. That is, a notch can be set on the side wall of the column 12 along the direction of the aa axis, so that the notch is connected to the wire-passing channel 120 to form a wire-passing groove. In this way, the pin 210 of the heating element 21 can also be inserted into the wire-passing channel 120 by snapping into the wire-passing groove. The notch can be set on the outer wall of the column 12, or on the inner wall of the column 12. In summary, the present application does not impose any special restrictions on the specific structure of the wire-passing channel 120.

[0052] On this basis, if Figure 4 and Figure 5 As shown, the opening area of ​​the second end 122 is smaller than or equal to the opening area of ​​the connecting hole 31 .

[0053] When the opening area of ​​the second end 122 is less than or equal to the opening area of ​​the connecting hole 31, the pin 210 can be smoothly inserted into the connecting hole 31 from the second end 122 under the guidance of the wire passage 120, thereby avoiding the problem that when the opening area of ​​the second end 122 is larger than the opening area of ​​the connecting hole 31, the pin 210 cannot be inserted into the connecting hole 31 due to interference with the board surface of the circuit board 30.

[0054] In more embodiments, Figure 2 As shown, the heat generating element 21 may have a plurality of pins 210 , and a plurality of wire-passing channels 120 may be provided on the column 12 , and the plurality of wire-passing channels 120 may be used for allowing the plurality of pins 210 to pass through in a one-to-one correspondence.

[0055] The heating element 21 can be a heating net or a heating wire, and can be a single net structure or a double net structure. The structural form of the heating element 21 is not particularly limited here. Depending on the shape of the heating element 21, two or more pins 210 can be set on the heating element 21, and multiple pins 210 can be arranged at intervals along the circumference of the aa axis. Each pin 210 is inserted into a plurality of wire channels 120 on the column 12 in a one-to-one manner, so that the wire channels 120 can also serve as a barrier to adjacent pins 210, thereby avoiding the short circuit problem caused by the pins 210 between the base 11 and the atomization assembly 20 touching each other due to their excessive length. The present application does not impose any special restrictions on the specific number of pins 210 and wire channels 120.

[0056] The above embodiment is a detailed description of the specific structure of the wire passage 120 on the column 12. In order to enable the heating element 21 to be assembled in place, the following embodiment will describe the pins 210 of the heating element 21 in detail. Figure 2 and Figure 3 As shown, the atomizer assembly 20 may further include a bracket 22 and a liquid-conducting liquid 23 connected to each other. The bracket 22 can be sleeved on the column 12. The liquid-conducting liquid 23 has an air flow channel 230 arranged along the extension direction of the column 12. The heating element 21 is located in the air flow channel 230 and contacts the side of the liquid-conducting liquid 23 away from the bracket 22. The pin 210 may be provided with a limiting portion 211, and the limiting portion 211 abuts between the liquid-conducting liquid 23 and the column 12.

[0057] Thus, the column 12 can connect and position the bracket 22, and the bracket 22 can provide a position for installing the liquid-conducting liquid 23. The liquid-conducting liquid 23 can be used to absorb the aerosol matrix. The material of the liquid-conducting liquid 23 can be cotton. The heating element 21 can heat the aerosol matrix absorbed by the liquid-conducting liquid 23 and atomize it to produce aerosol, and the aerosol can be discharged through the airflow channel 230. Among them, the limiting portion 211 set on the pin 210 can abut between the liquid-conducting liquid 23 and the column 12, so that the limiting portion 211 can limit the depth of the heating element 21 inserted into the liquid-conducting liquid 23 and the depth of the pin 210 inserted into the column 12, thereby ensuring that the heating element 21 and the pin 210 can be installed in place, so as to avoid the problem of dry burning or carbonization caused by the heating element 21 in the liquid-conducting liquid 23 due to improper installation, or the problem of poor contact with the circuit board 30 caused by improper installation of the pin 210.

[0058] Specifically, if Figure 3 and Figure 7As shown, the limiting portion 211 may include a first bending portion 211a and a second bending portion 211b. The first bending portion 211a can be used to abut against the liquid guide 23, and the second bending portion 211b can be used to abut against the column 12. The first bending portion 211a can be bent toward the outside of the liquid guide 23 along the extension direction (aa axis direction) of the column 12, and the bending direction of the second bending portion 211b can be opposite to the bending direction of the first bending portion 211a, so that the pin 210 after the second bending portion 211b is bent can be set along the extension direction of the column 12.

[0059] In this way, the pin 210 can limit the depth of the heating element 21 inserted into the liquid-conducting body 23 through the first bending portion 211a, and the pin 210 can limit the depth of the pin 210 inserted into the column 12 through the second bending portion 211b, so that the heating element 21 and the pin 210 can be installed in place. Among them, the first bending portion 211a and the second bending portion 211b can be preset before the heating element 21 is assembled. When assembling the heating element 21, it is only necessary to insert the heating element 21 into the liquid-conducting body 23 and the column 12, and there is no need to bend the heating element 21 during the assembly process, thereby improving the efficiency of assembling the heating element 21. Of course, in other embodiments, the limiting portion 211 can also be set to a limiting baffle structure connected to the pin 210, and the present application does not impose any special restrictions on the specific structure of the limiting portion 211.

[0060] The above embodiment is a detailed description of the specific structure of the pin 210 of the heating element 21. In order to better assemble the circuit board 30, the following embodiment will describe the specific structure of the base 11 in detail. Figure 2 and Figure 8 As shown, a mounting groove 111 may be provided on one side of the base 11 away from the column 12 , and the circuit board 30 may be installed in the mounting groove 111 in a limited manner along a direction perpendicular to the extension of the column 12 .

[0061] In this way, the circuit board 30 can be installed on the support base 10, and the mounting groove 111 can limit and fix the circuit board 30, so that the connecting hole 31 on the circuit board 30 can be set along the extension direction of the wire channel 120, and then the pin 210 of the heating element 21 can be smoothly inserted into the connecting hole 31.

[0062] Among them, Figure 8 As shown, the base 11 may be connected to a stopper 112 , and the stopper 112 is disposed on a side of the circuit board 30 away from the column 12 . The stopper 112 may be used to support the circuit board 30 .

[0063] When the circuit board 30 is installed in the installation groove 111, the stopper 112 can support the circuit board 30, thereby preventing the circuit board 30 from being offset along the aa axis direction, and ensuring that the connection hole 31 on the circuit board 30 is arranged along the extension direction of the wire passage 120. The stopper 112 can be integrally formed with the base 11, or connected to the base 11 by bonding, snapping, etc., and the present application does not impose any special restrictions on the connection method between the stopper 112 and the base 11.

[0064] In more embodiments, Figure 8 As shown, a plurality of stoppers 112 may be provided, and the plurality of stoppers 112 may be provided along the corners of the circuit board 30 , so that the corners of the circuit board 30 can be supported on the plurality of stoppers 112 .

[0065] For example, four stoppers 112 may be respectively disposed at the four corners of the circuit board 30, thereby supporting the four corners of the circuit board 30. Of course, multiple stoppers 112 may also be disposed along the edge of the circuit board 30, so that the board edge of the circuit board 30 can be supported on multiple stoppers 112, and the present application does not impose any special restrictions on the specific position and number of the stoppers 112.

[0066] In addition, if Figure 3 As shown, a sealing film 123 may be further provided in the wire-passing channel 120 , and the pin 210 may pass through the wire-passing channel 120 and penetrate the sealing film 123 .

[0067] When the pin 210 passes through the wire passage 120, the pin 210 penetrates the sealing film 123. The sealing film 123 can wrap the pin 210 to prevent the aerosol matrix from flowing from the wire passage 120 into the circuit board 30. On the other hand, the sealing film 123 can play a certain orientation role on the pin 210, so that the pin 210 can be smoothly inserted into the connection hole 31 on the circuit board 30.

[0068] The above specific examples are used to illustrate the present invention, which are only used to help understand the present invention and are not intended to limit the present invention. For those skilled in the art of the present invention, some simple deductions, deformations or substitutions can be made based on the idea of ​​the present invention.

Claims

1. An atomizing device, characterized in that: include: A support base, comprising a base and a column connected thereto; An atomizing assembly, comprising a heating element with pins, wherein the atomizing assembly is sleeved on the column; as well as, A circuit board is mounted on a side of the base away from the column, and the circuit board has a connection hole, and the connection hole is used for the pin to pass through; Among them, a wire passing channel is provided on the column, and the wire passing channel passes through the support seat along the extension direction of the column. The connecting hole is located in the extension direction of the wire passing channel. The pin passes through the wire passing channel and is inserted into the connecting hole to electrically connect the pin to the circuit board.

2. The atomizing device according to claim 1, characterized in that The wire-passing channel is configured as a wire-passing hole; The wire hole has a first end and a second end, the first end is far away from the base, the second end is close to the circuit board, and the opening area of ​​the first end is larger than the opening area of ​​the second end.

3. The atomizing device according to claim 2, characterized in that The opening area of ​​the second end is smaller than or equal to the opening area of ​​the connecting hole.

4. The atomizing device according to claim 1, characterized in that: The heating element has a plurality of pins; The column is provided with a plurality of wire-passing channels, and the plurality of wire-passing channels are used for allowing the plurality of pins to pass through in a one-to-one correspondence.

5. The atomizing device according to claim 1, characterized in that: The atomization assembly also includes a bracket and a liquid guide connected thereto; The bracket is sleeved on the column, the liquid-conducting body has an air flow channel arranged along the extension direction of the column, the heating element is located in the air flow channel and contacts with a side of the liquid-conducting body away from the bracket, and the pin is provided with a limiting portion, and the limiting portion abuts between the liquid-conducting body and the column.

6. The atomizing device according to claim 5, characterized in that: The limiting portion includes a first bending portion and a second bending portion, the first bending portion is used to abut against the liquid-conducting body, and the second bending portion is used to abut against the column; The first bending portion is bent toward the outside of the liquid-conducting body along the extension direction of the column, and the bending direction of the second bending portion is opposite to the bending direction of the first bending portion, so that the pin after the second bending portion is bent is arranged along the extension direction of the column.

7. The atomizing device according to any one of claims 1 to 6, characterized in that A mounting groove is provided on one side of the base away from the column; The circuit board is installed in the installation groove in a limited position along a direction perpendicular to the extension of the column.

8. The atomizing device according to claim 7, characterized in that: The base is connected with a stopper; The stopper is arranged on a side of the circuit board away from the column, and the stopper is used to support the circuit board.

9. The atomizing device according to claim 8, characterized in that: The stopper is provided in plurality; A plurality of the stoppers are arranged along the corners of the circuit board so that the corners of the circuit board can be supported on the plurality of the stoppers.

10. The atomizing device according to any one of claims 1 to 6, characterized in that: A sealing film is provided in the wire passage; The pin passes through the wire passage and penetrates the sealing film.

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