Temperature control device and laser

Abstract

The utility model belongs to the technical field of lasers, and discloses a temperature control device and a laser. The temperature control device comprises a bearing seat, a heat conduction piece, a temperature sensor, a cover body and a semiconductor temperature control piece, a containing groove is formed in the bearing seat, the heat conduction piece is arranged in the containing groove, the temperature sensor is arranged on the heat conduction piece, the cover body covers an upper opening of the containing groove, and the semiconductor temperature control piece is arranged in the containing groove. A containing space used for containing a part to be cooled is formed between the cover body and the heat conduction part, the semiconductor temperature control part is arranged between the bearing seat and the heat conduction part and adjusts refrigerating or heating power according to temperature signals transmitted by the temperature sensor, and the bearing seat and the cover body can also play a role in heat preservation, so that heat loss of the containing groove is reduced, and heat dissipation efficiency is improved. Therefore, the accommodating space is always kept within the preset temperature range. The utility model also provides a laser, which enables an optical device to be in an accommodating space with small temperature fluctuation by applying the temperature control device, thereby ensuring the optical performance of the laser to be stable.

Description

Technical Field

[0001] The utility model relates to the technical field of lasers, in particular to a temperature control device and a laser. Background Art

[0002] Lasers are widely used in industry, medicine, scientific research, and military fields. Since the optical devices and optical fibers inside the laser have poor thermal stability, they are easily deformed when heated and may even be damaged when the temperature is too high. Therefore, temperature changes can easily lead to unstable output power and laser frequency of the laser, affecting the working performance of the laser.

[0003] Therefore, it is urgent to provide a temperature control device and a laser to solve the above problems. Utility Model Content

[0004] The first object of the utility model is to provide a temperature control device, which can dissipate heat and keep heat of a heat dissipation component to be dissipated, and reduce the temperature fluctuation of the heat dissipation component to be dissipated.

[0005] The second object of the utility model is to provide a laser, which can improve the stability of the working performance of the laser by applying the above-mentioned temperature control device.

[0006] To achieve this purpose, the utility model adopts the following technical solutions:

[0007] A temperature control device, comprising:

[0008] A bearing seat, wherein a receiving groove is provided in the bearing seat;

[0009] A heat conducting member and a temperature sensor, wherein the heat conducting member is arranged in the containing groove, the temperature sensor is arranged on the heat conducting member, and the temperature sensor is used to detect the temperature of the heat conducting member;

[0010] A cover body, which covers the upper opening of the accommodating groove, and an accommodating space for accommodating the heat dissipating element is formed between the cover body and the heat conducting element;

[0011] The semiconductor temperature control component is arranged between the supporting seat and the heat conducting component, and the semiconductor temperature control component is communicatively connected with the temperature sensor.

[0012] Furthermore, a through installation opening is provided at the bottom of the accommodating groove, and the semiconductor temperature control unit is installed in the installation opening.

[0013] Furthermore, it also includes a heat dissipation base, which is used to support the supporting seat, and the heat dissipation base is in contact with a side of the semiconductor temperature control unit away from the heat conducting member.

[0014] Furthermore, a boss is provided on the heat dissipation base, and the boss is used to be inserted into the mounting opening and contact the semiconductor temperature control unit.

[0015] Furthermore, a heat dissipation structure is provided on a side of the heat dissipation base away from the supporting seat.

[0016] Furthermore, a heat conducting layer is provided on at least one side of the semiconductor temperature control unit.

[0017] Furthermore, the number of the semiconductor temperature control components is at least two.

[0018] Furthermore, the bearing seat is sealingly connected to the cover body.

[0019] Furthermore, the semiconductor temperature control unit also includes a control circuit, and a wiring groove is provided at the bottom of the accommodating groove to accommodate the control circuit.

[0020] A laser comprises an optical device and the temperature control device in any one of the above solutions, wherein the optical device is carried in the accommodating space of the temperature control device.

[0021] Beneficial effects of the utility model:

[0022] The utility model provides a temperature control device, including a bearing seat, a heat-conducting member, a temperature sensor, a cover body and a semiconductor temperature control unit, wherein a receiving groove is arranged in the bearing seat, the heat-conducting member is arranged in the receiving groove, a temperature sensor is arranged on the heat-conducting member, and the temperature sensor is used to detect the temperature of the heat-conducting member, the cover body is arranged to cover the upper opening of the receiving groove, and a receiving space for receiving the heat-dissipating member to be radiated is formed between the cover body and the heat-conducting member, the semiconductor temperature control unit is arranged between the bearing seat and the heat-conducting member, and the semiconductor temperature control unit is connected to the temperature sensor in communication, when the temperature sensor detects that the temperature of the heat-conducting member exceeds a preset temperature range, the semiconductor temperature control unit starts to work, thereby reducing or increasing the temperature of the heat-conducting member, when the temperature sensor detects that the temperature of the heat-conducting member reaches a preset value, the semiconductor temperature control unit stops working, and in addition, the bearing seat and the cover body can also play a role in heat preservation, thereby reducing the heat loss of the receiving groove. The above-mentioned arrangement enables the receiving space to always maintain a preset temperature, and its temperature fluctuation is small, which is conducive to maintaining the stable performance of the heat-dissipating member to be radiated.

[0023] The utility model also provides a laser, comprising an optical device and the above-mentioned temperature control device, the optical device is carried in a containing space of the temperature control device, the temperature fluctuation of the containing space is small, which is conducive to the optical device to maintain stable optical performance. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 It is a structural schematic diagram of the temperature control device provided by the utility model;

[0025] Figure 2It is an exploded diagram of the temperature control device provided by the utility model;

[0026] Figure 3 It is a structural schematic diagram of the bearing seat provided by the utility model;

[0027] Figure 4 This is the structural intention of the heat conducting member provided by the utility model;

[0028] Figure 5 It is a structural schematic diagram of the semiconductor temperature control unit provided by the utility model;

[0029] Figure 6 It is a structural schematic diagram of the heat dissipation base provided by the utility model.

[0030] In the figure:

[0031] 1. Bearing seat; 11. Accommodation groove; 12. Installation opening; 13. Wiring groove; 14. Sealing groove;

[0032] 2. Heat conducting member; 21. Mounting slot; 22. Fixing hole;

[0033] 3. Cover body;

[0034] 4. Semiconductor temperature control unit; 41. Control circuit;

[0035] 5. heat dissipation base; 51. boss; 52. heat dissipation structure. DETAILED DESCRIPTION

[0036] The present invention is further described in detail below in conjunction with the accompanying drawings and embodiments. It is to be understood that the specific embodiments described herein are only used to explain the present invention, rather than to limit the present invention. It should also be noted that, for ease of description, only the parts related to the present invention, rather than all structures, are shown in the accompanying drawings.

[0037] In the description of the present invention, unless otherwise clearly specified and limited, the terms "connected", "connected", and "fixed" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0038] In the present utility model, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0039] In the description of this embodiment, the terms "upper", "lower", "right", etc., are based on the directions or positions shown in the drawings, and are only for the convenience of description and simplified operation, rather than indicating or implying that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore cannot be understood as a limitation of the present invention. In addition, the terms "first" and "second" are only used to distinguish in the description and have no special meaning.

[0040] like Figure 1 to Figure 3 As shown, the temperature control device provided in this embodiment includes a bearing seat 1, a heat conductive member 2, a temperature sensor, a cover body 3 and a semiconductor temperature control unit 4. A receiving groove 11 is provided in the bearing seat 1, the heat conductive member 2 is provided in the receiving groove 11, a temperature sensor is provided on the heat conductive member 2, and the temperature sensor is used to detect the temperature of the heat conductive member 2. The cover body 3 is provided to cover the upper opening of the receiving groove 11, and a receiving space for accommodating the heat member to be cooled is formed between the cover body 3 and the heat conductive member 2. The semiconductor temperature control unit 4 is provided between the bearing seat 1 and the heat conductive member 2, and the semiconductor temperature control unit 4 is communicatively connected with the temperature sensor. When the temperature sensor detects that the temperature of the heat conductive member 2 exceeds a preset temperature range, the semiconductor temperature control unit 4 starts to cool, thereby reducing the temperature of the heat conductive member 2. When the temperature sensor detects that the temperature of the heat conductive member 2 reaches a preset value, the semiconductor temperature control unit 4 stops cooling. In addition, the bearing seat 1 and the cover body 3 can also play a role of heat preservation, thereby reducing the heat loss of the receiving groove 11. In other embodiments, when the temperature sensor detects that the temperature of the heat-conducting member 2 is lower than a preset temperature range, the semiconductor temperature control unit 4 may also start heating, thereby increasing the temperature of the heat-conducting member 2. When the temperature sensor detects that the temperature of the heat-conducting member 2 reaches a predetermined value, the semiconductor temperature control unit 4 stops heating. The above arrangement allows the accommodating space to always maintain a preset temperature, with a small temperature fluctuation, which is conducive to maintaining the performance of the heat-dissipating member to be cooled stable.

[0041] Specifically, the semiconductor temperature control unit 4 is a semiconductor refrigerator. When current is passed through the semiconductor refrigerator, one side of the semiconductor refrigerator is a heating surface, and the other side is a cooling surface. The heating surface and the cooling surface can be switched by switching the current direction. Further, the semiconductor temperature control unit 4 is a common temperature control device in the prior art, and the temperature control accuracy can reach 0.01 degrees. Many semiconductor temperature control units 4 of companies such as Ferrotec and Laird can meet the temperature control requirements of the heat conducting member 2 in this embodiment, so the specific model of the semiconductor temperature control unit 4 and its temperature control principle are not limited here.

[0042] In order to reduce the heat transfer of the heat conducting member 2, the supporting seat 1 is made of a material with low thermal conductivity, which may be but is not limited to plastic or ceramic.

[0043] In this embodiment, a through installation opening 12 is provided at the bottom of the accommodating groove 11, and the semiconductor temperature control unit 4 is installed in the installation opening 12, so that the heat of the heating surface of the semiconductor temperature control unit 4 can be dissipated through the installation opening 12, and at the same time, the heat conductive component 2 can be fitted with the supporting seat 1, thereby compressing the space between the heat conductive component 2 and the supporting seat 1, avoiding excess gas from transferring heat, and improving the heat transfer efficiency.

[0044] like Figure 4 As shown, the heat conductor 2 is provided with a mounting groove 21, and the temperature sensor is embedded in the mounting groove 21 to facilitate measuring the temperature of the heat conductor 2. Specifically, the temperature sensor is bonded to the mounting groove 21 by heat-conductive silicone, which can fix the temperature sensor and facilitate the temperature sensor to detect the temperature of the heat conductor 2. In this embodiment, the temperature control device includes two temperature sensors, which can more accurately detect the temperature of the heat conductor 2 to ensure that the heat distribution on the heat conductor 2 is balanced and prevent the temperature of some parts of the heat conductor 2 from being too high or too low, causing damage to the heat dissipation component to be cooled; in addition, when one of the temperature sensors fails, the other temperature sensor can continue to work to ensure the normal use of the temperature control device. This embodiment does not limit the specific number of temperature sensors, and the operator can adjust it according to actual conditions. For example, the specific number of temperature sensors can also be one, three, four, five, or even more.

[0045] Optionally, the heat conducting member 2 is further provided with a fixing hole 22 for fixing the heat dissipation member to be cooled, so as to prevent the heat dissipation member from shifting in the accommodating space and causing friction or collision with each other, thereby ensuring the safety of the heat dissipation member to be cooled.

[0046] like Figure 3 and Figure 5 As shown, since the semiconductor temperature control unit 4 also includes a control circuit 41, a wiring groove 13 is also provided at the bottom of the accommodating groove 11 to accommodate the control circuit 41. Correspondingly, a wiring hole connected to the wiring groove 13 is also provided on the side wall of the accommodating groove 11, and the control circuit 41 passes through the wiring hole to connect to the external power supply.

[0047] like Figure 1-2 as well as Figure 6 As shown, the heat dissipation device provided in this embodiment also includes a heat dissipation base 5, which is used to support the support seat 1, and the heat dissipation base 5 is in contact with a side of the semiconductor temperature control unit 4 away from the heat conducting member 2, and the heat of the heating surface of the semiconductor temperature control unit 4 is transferred to the heat dissipation base 5 to achieve rapid heat dissipation. Optionally, the heat dissipation base 5 is made of a material with a high thermal conductivity, including but not limited to aluminum, copper or steel.

[0048] In order to improve the thermal insulation performance of the supporting base 1, the groove wall thickness of the accommodating groove 11 is relatively large, so a boss 51 is provided on the heat dissipation base 5, and the boss 51 is used to be inserted into the mounting opening 12 and contact with the semiconductor temperature control unit 4, so that the semiconductor temperature control unit 4 is clamped between the boss 51 and the heat conducting member 2, thereby increasing the contact area between the semiconductor temperature control unit 4 and the boss 51 and the heat conducting member 2, which is beneficial to improving the heat transfer efficiency.

[0049] Furthermore, a heat dissipation structure 52 is provided on one side of the heat dissipation base 5 away from the supporting base 1, and the heat dissipation structure 52 is used to increase the surface area of ​​the heat dissipation base 5 and improve the heat dissipation efficiency. Specifically, the heat dissipation structure 52 is a plurality of parallel and spaced heat dissipation fins arranged on one side of the heat dissipation base 5 away from the supporting base 1, with a large heat dissipation area and a good heat dissipation effect.

[0050] In order to further improve the heat transfer efficiency between the semiconductor temperature control unit 4 and the heat conducting member 2, a heat conducting layer is provided on the side of the semiconductor temperature control unit 4 close to the heat conducting member 2. Optionally, a heat conducting layer is also provided on the side of the semiconductor temperature control unit 4 close to the boss 51 to improve the heat transfer efficiency between the semiconductor temperature control unit 4 and the heat dissipation base 5. Optionally, the heat conducting layer is made of a silicone material with a high thermal conductivity.

[0051] Optionally, the number of semiconductor temperature control components 4 is at least two, and the number of semiconductor temperature control components 4 can be adaptively selected according to the size of the heat conductor 2, such as three, four, six, etc., so as to meet the cooling or heating requirements of the heat conductor 2 and reduce the temperature fluctuation of the accommodation space. In this embodiment, the number of semiconductor temperature control components 4 is two, and the contact area with the heat conductor 2 is sufficient, which is conducive to making the overall temperature distribution of the heat conductor 2 consistent. Accordingly, the boss 51 provided on the heat dissipation base 5 is provided in a one-to-one correspondence with the semiconductor temperature control components 4.

[0052] In order to improve the heat preservation effect of the temperature control device, the bearing seat 1 is sealed with the cover body 3 to prevent gas exchange inside and outside the accommodating space and reduce heat transfer. Optionally, a sealing groove 14 is provided on the side of the bearing seat 1 that contacts the cover body 3, and a sealing strip is provided in the sealing groove 14. When the cover body 3 is covered on the bearing seat 1, the sealing strip can fill the gap between the cover body 3 and the bearing seat 1 to achieve sealing.

[0053] This embodiment also provides a laser, including an optical device and the above-mentioned temperature control device, the optical device is carried in the accommodation space of the temperature control device, the temperature fluctuation of the accommodation space is small, which is conducive to the optical device to maintain stable optical performance. Further, an opening is opened on the side of the supporting seat 1, and the connecting wire of the optical device passes through the opening to connect with the external device.

[0054] Obviously, the above embodiments of the present invention are merely examples for the purpose of clearly illustrating the present invention, and are not intended to limit the implementation methods of the present invention. For those skilled in the art, various obvious changes, readjustments and substitutions can be made without departing from the scope of protection of the present invention. It is not necessary and impossible to list all implementation methods here. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention shall be included in the scope of protection of the claims of the present invention.

Claims

1. A temperature control device, characterized in that: include: A bearing seat (1), wherein a receiving groove (11) is provided in the bearing seat (1); A heat conducting member (2) and a temperature sensor, wherein the heat conducting member (2) is arranged in the containing groove (11), the temperature sensor is arranged on the heat conducting member (2), and the temperature sensor is used to detect the temperature of the heat conducting member (2); A cover body (3) is arranged to cover the upper opening of the accommodating groove (11), and an accommodating space for accommodating the heat element to be dissipated is formed between the cover body (3) and the heat conducting element (2); A semiconductor temperature control unit (4) is arranged between the support seat (1) and the heat conducting member (2), and the semiconductor temperature control unit (4) is communicatively connected to the temperature sensor.

2. The temperature control device according to claim 1, characterized in that: The bottom of the accommodating groove (11) is provided with a through installation opening (12), and the semiconductor temperature control unit (4) is installed in the installation opening (12).

3. The temperature control device according to claim 2, characterized in that: It also comprises a heat dissipation base (5), the heat dissipation base (5) is used to support the support seat (1), and the heat dissipation base (5) is in contact with a side of the semiconductor temperature control unit (4) away from the heat conducting element (2).

4. The temperature control device according to claim 3, characterized in that: The heat dissipation base (5) is provided with a boss (51), and the boss (51) is used to be inserted into the installation opening (12) and to be in contact with the semiconductor temperature control unit (4).

5. The temperature control device according to claim 3, characterized in that: A heat dissipation structure (52) is provided on a side of the heat dissipation base (5) away from the supporting seat (1).

6. The temperature control device according to claim 1, characterized in that: At least one side of the semiconductor temperature control unit (4) is provided with a heat conducting layer.

7. The temperature control device according to claim 1, characterized in that: The number of the semiconductor temperature control units (4) is at least two.

8. The temperature control device according to any one of claims 1 to 7, characterized in that: The bearing seat (1) is sealedly connected to the cover body (3).

9. The temperature control device according to any one of claims 1 to 7, characterized in that: The semiconductor temperature control unit (4) further comprises a control circuit (41), and a wiring groove (13) is provided at the bottom of the accommodating groove (11) to accommodate the control circuit (41).

10. A laser, characterized in that: The invention comprises an optical device and the temperature control device according to any one of claims 1 to 9, wherein the optical device is carried in a containing space of the temperature control device.

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