High-temperature and high-humidity reverse bias test recovery device for semiconductor device

Abstract

The utility model discloses a high temperature and high humidity reverse bias test recovery device for a semiconductor device, which comprises a base, an experiment box fixedly arranged at the upper end of the base, a sealing assembly arranged at the front end of the experiment box and used for improving the sealing performance of the experiment box, and a temperature control assembly arranged at the front end of the experiment box, the heat dissipation assembly comprises a through groove formed in the left side of the experiment box, a groove is formed in the left side of the experiment box, a rotating plate is rotatably connected into the groove, a sliding groove is formed in the right side of the experiment box, a baffle is slidably connected into the sliding groove, and a limiting groove is formed in the right side of the sliding groove; the right side of the baffle is rotationally connected with a fixing block. The high-temperature and high-humidity reverse bias test recovery device for the semiconductor device disclosed by the utility model has the effects of improving the heat dissipation rate of the experiment box, facilitating the rapid proceeding of the next experiment, sucking out the moisture in the experiment box, and preventing the moisture from being condensed into water to damage the semiconductor device.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor detection, in particular to a high-temperature and high-humidity reverse bias test recovery device for semiconductor devices. Background Art

[0002] Semiconductors refer to materials with electrical conductivity between conductors and insulators at room temperature; semiconductors have been widely used in integrated circuits, consumer electronics, communication systems, photovoltaic power generation, lighting applications, high-power power conversion, etc. Common semiconductor materials include silicon, germanium, gallium arsenide, etc., which need to undergo high-temperature and high-humidity reverse bias tests before being put into use. High-temperature and high-humidity reverse bias tests are an important means of controlling the quality of semiconductor devices.

[0003] The patent document with application number CN201922343782.X discloses a high-temperature and high-humidity reverse bias life tester for preventing scalding, comprising an observation window, a protective door, a sealing cover, a ventilating tube, a high-temperature heater, a water outlet, a sealed cabin steel frame, a slide rail, a clamp, a control console, an electric water heater, a water outlet, a support plate, a pallet and a base. The electric water heater is fixedly installed at the corners of the top surface of the support plate, and the bottom side wall of the electric water heater is sealed and connected with a water outlet pipe. The sealed cabin steel frame is fixedly installed on the surface side of the support plate, and the high-temperature heater is fixedly installed on the top of the sealed cabin steel frame. An axial flow fan is fixedly installed at the bottom of the high-temperature heater, and a water outlet nozzle is fixedly installed in the middle of the high-temperature heater. The beneficial effects of the utility model are as follows: the high-temperature environment is isolated by the sealed cabin steel frame combined with glass to prevent scalding of users, and the clamp and electric telescopic rod are provided to facilitate automatic mechanical clamping of objects to be inspected and prevent them from falling.

[0004] Compared with the high temperature and high humidity reverse bias life tester in the above documents, the cooling effect is poor and takes a long time through the ventilation pipe, which is not conducive to improving work efficiency. In addition, the internal moisture will condense as the temperature decreases, which can easily damage the semiconductor devices. Utility Model Content

[0005] The utility model discloses a high-temperature and high-humidity reverse bias test recovery device for semiconductor devices, aiming to solve the technical problems that the cooling effect is poor, a long time is required, which is not conducive to improving work efficiency, and the internal moisture condenses as the temperature decreases, which easily causes damage to the semiconductor devices.

[0006] In order to achieve the above purpose, the utility model adopts the following technical solutions:

[0007] A high-temperature and high-humidity reverse bias test recovery device for semiconductor devices, comprising a base, with an experimental box fixedly installed on the upper end of the base, and also comprising: a sealing component: the sealing component is arranged at the front end of the experimental box, and the sealing component is used to improve the sealing of the experimental box; a heat dissipation component: the heat dissipation component includes a through slot opened on the left side of the experimental box, a groove is opened inside the left side of the experimental box, a rotating plate is rotatably connected inside the groove, a slide slot is opened on the right side of the experimental box, a baffle is slidably connected inside the slide slot, a limiting slot is opened on the right side of the slide slot, a fixed block is rotatably connected to the right side of the baffle, a fixed table is fixedly installed on the right side of the experimental box at the lower end of the fixed block, a fan is arranged on the right side of the baffle on the right side of the experimental box, a ventilation slot is opened on the right side of the experimental box on the left side of the fan, a filter is arranged inside the through slot, an air outlet is opened on the rotating plate, and a knob is fixedly installed on the left side of the rotating plate.

[0008] In this solution, the heat dissipation component is used to dissipate heat inside the experimental box after the experiment is completed, thereby increasing the heat dissipation speed of the experimental box, preventing workers from being burned when taking semiconductors, and facilitating the removal of semiconductor devices as quickly as possible to facilitate the next round of experiments. At the same time, the heat dissipation component will bring out the moisture in the experimental box to prevent the moisture in the experimental box from condensing into water and causing damage to the semiconductor devices.

[0009] In a preferred solution, the sealing assembly includes a door rotatably connected to the front end of the experimental box, an observation window is arranged inside the door, a clamping block is fixedly installed at the front end of the right side of the experimental box, a fixing frame is fixedly installed at the rear end of the door, a sealing gasket is sleeved on the outside of the fixing frame, a clamping groove is opened on the right side of the front end of the door, a clamping strip is fixedly installed in the clamping groove, a clamping piece is slidably connected inside the clamping block, a tension spring is arranged between the clamping piece and the clamping block, a limit strip is fixedly installed inside the experimental box, a support plate is overlapped on the upper end of the limit strip, an installation groove is opened on the upper end of the support plate, and an empty groove is opened on the upper end of the support plate between the installation grooves.

[0010] The sealing degree of the test box is improved by setting a sealing component, which facilitates the maintenance of high humidity and high temperature inside the test box and facilitates the testing of semiconductor devices. When the box door is closed, the card connector is inserted into the card slot, and the tension spring gives the card connector a backward force to make the box door fit more tightly, thereby improving the sealing of the test box. The installation slot on the pallet can be used to install several aging boards, which is convenient for simultaneous testing of multiple groups of semiconductor devices. At the same time, the empty slots on the pallet improve the uniformity and rate of heating.

[0011] In a preferred solution, the through groove matches the inner diameter of the air port.

[0012] As can be seen from the above, a high-temperature and high-humidity reverse bias test recovery device for semiconductor devices includes a base, a test box is fixedly installed on the upper end of the base, and also includes: a sealing component: the sealing component is arranged at the front end of the test box, and the sealing component is used to improve the sealing of the test box; a heat dissipation component: the heat dissipation component includes a through slot opened on the left side of the test box, a groove is opened inside the left side of the test box, a rotating plate is rotatably connected inside the groove, a slide slot is opened on the right side of the test box, a baffle is slidably connected inside the slide slot, a limiting slot is opened on the right side of the slide slot, a fixed block is rotatably connected to the right side of the baffle, a fixed table is fixedly installed on the right side of the test box at the lower end of the fixed block, a fan is arranged on the right side of the baffle on the right side of the test box, a ventilation slot is opened on the right side of the fan on the left side of the test box, a filter is arranged inside the through slot, an air outlet is opened on the rotating plate, and a knob is fixedly installed on the left side of the rotating plate. The high temperature and high humidity reverse bias test recovery device for semiconductor devices provided by the utility model has the effect of increasing the heat dissipation rate of the test box, facilitating the rapid conduct of the next experiment, and at the same time absorbing the moisture in the test box to prevent the moisture from condensing into water and causing damage to the semiconductor devices. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 The utility model is a schematic diagram of the overall structure of a high-temperature and high-humidity reverse bias test recovery device for semiconductor devices.

[0014] Figure 2 The utility model is a schematic diagram of the right side cross-sectional structure of an experimental box for a high-temperature and high-humidity reverse bias test recovery device for semiconductor devices.

[0015] Figure 3 The utility model provides a schematic diagram of a top-view cross-sectional structure of an experimental box for a high-temperature and high-humidity reverse bias test recovery device for semiconductor devices.

[0016] Figure 4 The utility model is a schematic diagram of the cross-sectional structure of a box door and a clamping block of a high-temperature and high-humidity reverse bias test recovery device for semiconductor devices.

[0017] Figure 5 The utility model is a schematic diagram of the rear cross-sectional structure of an experimental box for a high-temperature and high-humidity reverse bias test recovery device for semiconductor devices.

[0018] In the attached figure: 1. base; 2. test box; 3. box door; 4. observation window; 5. snap-in block; 6. fixing frame; 7. sealing gasket; 8. limit strip; 9. support plate; 10. through slot; 11. groove; 12. rotating plate; 13. slide slot; 14. baffle; 15. limit slot; 16. fixing block; 17. fixing table; 18. installation slot; 19. empty slot; 20. snap-in slot; 21. snap-in strip; 22. snap-in piece; 23. tension spring; 24. fan; 25. ventilation slot; 26. filter; 27. air outlet; 28. knob. DETAILED DESCRIPTION

[0019] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all of the embodiments.

[0020] In the description of the present invention, it should be understood that the terms "upper", "lower", "front", "back", "left", "right", "top", "bottom", "inside", "outside", etc., indicating directions or positional relationships, are based on the directions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore should not be understood as a limitation on the present invention.

[0021] The high-temperature and high-humidity reverse bias test recovery device for semiconductor devices disclosed in the utility model is mainly used to solve the problem that the cooling effect is poor, a long time is required, which is not conducive to improving work efficiency, and the internal moisture will condense as the temperature decreases, which may easily cause damage to the semiconductor devices.

[0022] Reference Figure 1 , Figure 2 , Figure 3 and Figure 5, a high-temperature and high-humidity reverse bias test recovery device for semiconductor devices, includes a base 1, an experimental box 2 is fixedly installed on the upper end of the base 1, and also includes: a sealing component: the sealing component is arranged at the front end of the experimental box 2, and the sealing component is used to improve the sealing of the experimental box 2; a heat dissipation component: the heat dissipation component includes a through slot 10 opened on the left side of the experimental box 2, a groove 11 is opened inside the left side of the experimental box 2, a rotating plate 12 is rotatably connected inside the groove 11, a slide slot 13 is opened on the right side of the experimental box 2, a baffle 14 is slidably connected inside the slide slot 13, a limiting groove 15 is opened on the right side of the slide slot 13, a fixed block 16 is rotatably connected on the right side of the baffle 14, a fixed platform 17 is fixedly installed on the right side of the experimental box 2 at the lower end of the fixed block 16, a fan 24 is arranged on the right side of the baffle 14 on the right side of the experimental box 2, a ventilation slot 25 is opened on the right side of the experimental box 2 on the left side of the fan 24, a filter screen 26 is arranged inside the through slot 10, an air outlet 27 is opened on the rotating plate 12, and a knob 28 is fixedly installed on the left side of the rotating plate 12.

[0023] In this solution, after the semiconductor device experiment is completed, the fixed block 16 is rotated upward to disengage the fixed block 16 from the limit of the fixed platform 17, and then the fixed block 16 is slid in the limit groove 15 to release the baffle 14 from blocking the ventilation groove 25, and then the knob 28 is turned to make the air outlet 27 on the rotating plate 12 coincide with the through groove 10, and then the fan 24 is started. The fan 24 sucks out the hot and humid air in the experimental box 2 to increase the heat dissipation speed inside the experimental box 2, and at the same time prevents the moisture in the experimental box 2 from condensing into water and causing damage to the semiconductor device. The filter net 26 inside the through groove 10 intercepts impurities and dust in the external air to prevent dust accumulation inside the experimental box 2 from affecting the experimental effect.

[0024] Reference Figure 2 and Figure 4 In a preferred embodiment, the sealing assembly includes a door 3 rotatably connected to the front end of the experimental box 2, an observation window 4 is arranged inside the door 3, a clamping block 5 is fixedly installed at the front end of the right side of the experimental box 2, a fixing frame 6 is fixedly installed at the rear end of the door 3, a sealing gasket 7 is sleeved on the outside of the fixing frame 6, a clamping slot 20 is opened on the right side of the front end of the door 3, a clamping strip 21 is fixedly installed in the clamping slot 20, a clamping piece 22 is slidably connected to the inside of the clamping block 5, and a tension spring 23 is arranged between the clamping piece 22 and the clamping block 5.

[0025] Specifically, when the door 3 is closed, the fixed frame 6 will be embedded in the experimental box 2, and the fixed frame 6 will cooperate with the sealing gasket 7 to improve the tightness of the door 3 and the experimental box 2, and pull the clip 22 to slide in the clip block 5, and the tension spring 23 will also stretch accordingly. The clip 22 is aligned with the slot 20, and the clip 22 is released. The tension spring 23 resets and drives the clip 22 to be inserted into the slot 20. The clip strip 21 in the slot 20 prevents the clip 22 from moving. At the same time, the force provided by the tension spring 23 will make the door 3 close to the experimental box 2, thereby improving the sealing of the experimental box 2. The observation window 4 on the door 3 is convenient for observing the internal semiconductor devices.

[0026] Reference Figure 2 and Figure 3 In a preferred embodiment, a limit strip 8 is fixedly installed inside the experimental box 2, and a support plate 9 is overlapped on the upper end of the limit strip 8. A mounting groove 18 is opened on the upper end of the support plate 9, and an empty groove 19 is opened between the mounting grooves 18 on the upper end of the support plate 9.

[0027] Specifically, before the experiment, the semiconductor devices are installed on the aging board, and then the aging board is embedded in the installation groove 18 on the pallet 9, the pallet 9 is placed on the limit bar 8, and the pallet 9 is pushed into the experimental box 2 to facilitate the simultaneous detection of multiple groups of semiconductor devices. At the same time, the empty grooves 19 on the pallet 9 improve the uniformity and rate of heating.

[0028] Working principle: After the semiconductor device experiment is completed, the fixed block 16 is rotated upward to make the fixed block 16 disengage from the limit of the fixed platform 17, and then the fixed block 16 is slid in the limit groove 15, thereby driving the baffle 14 to slide, so that the baffle 14 releases the shielding of the ventilation groove 25, and then the knob 28 is turned to drive the rotating plate 12 in the groove 11 to rotate, so that the air outlet 27 on the rotating plate 12 coincides with the through groove 10, and then the fan 24 is started. The fan 24 sucks out the hot and humid air in the experimental box 2, and the filter net 26 inside the through groove 10 intercepts impurities and dust in the external air to prevent dust accumulation inside the experimental box 2 from affecting the experimental effect. Before the experimental box 2 works, turn the knob 28 drives the rotating plate 12 to rotate, driving the rotating plate 12 to cover the through groove 10 to prevent the humid and hot air inside the experimental box 2 from escaping, and at the same time pulls the fixed block 16, thereby driving the baffle 14 to cover the ventilation slot 25, and rotates the fixed block 16 downward, and inserts the fixed block 16 into the fixed platform 17 to improve the stability of the baffle 14. The setting of the heat dissipation component is not only convenient for improving the heat dissipation speed of the experimental box 2 and preventing the staff from being scalded when taking the semiconductor, but also convenient for taking out the semiconductor device as soon as possible to facilitate the next round of experiments. At the same time, the heat dissipation component will take out the moisture in the experimental box 2 to prevent the moisture in the experimental box 2 from condensing into water and causing damage to the semiconductor device.

[0029] The above is only a preferred specific implementation of the utility model, but the protection scope of the utility model is not limited to this. The replacement can be a replacement of part of the structure, device, method step, or a complete technical solution. Equivalent replacement or change based on the technical solution of the utility model and its utility model concept should be included in the protection scope of the utility model.

Claims

1. A high temperature and high humidity reverse bias test recovery device for semiconductor devices, comprising a base (1), wherein an experimental box (2) is fixedly mounted on the upper end of the base (1), characterized in that: Also includes: Sealing component: the sealing component is arranged at the front end of the experimental box (2), and the sealing component is used to improve the sealing performance of the experimental box (2); Heat dissipation component: The heat dissipation component comprises a through slot (10) opened on the left side of the experimental box (2), a groove (11) is opened inside the left side of the experimental box (2), a rotating plate (12) is rotatably connected inside the groove (11), a slide slot (13) is opened on the right side of the experimental box (2), a baffle (14) is slidably connected inside the slide slot (13), a limiting slot (15) is opened on the right side of the slide slot (13), a fixed block (16) is rotatably connected on the right side of the baffle (14), a fixed table (17) is fixedly installed at the lower end of the fixed block (16) on the right side of the experimental box (2), a fan (24) is arranged on the right side of the baffle (14), a ventilation slot (25) is opened on the right side of the experimental box (2) and the left side of the fan (24), a filter screen (26) is arranged inside the through slot (10), an air outlet (27) is opened on the rotating plate (12), and a knob (28) is fixedly installed on the left side of the rotating plate (12).

2. The high temperature and high humidity reverse bias test recovery device for semiconductor devices according to claim 1, characterized in that: The sealing assembly comprises a box door (3) rotatably connected to the front end of the experimental box (2), and an observation window (4) is arranged inside the box door (3).

3. The high temperature and high humidity reverse bias test recovery device for semiconductor devices according to claim 2, characterized in that: A clamping block (5) is fixedly mounted on the front right side of the experimental box (2), and a fixing frame (6) is fixedly mounted on the rear end of the box door (3).

4. The high temperature and high humidity reverse bias test recovery device for semiconductor devices according to claim 3, characterized in that: A sealing gasket (7) is sleeved on the outside of the fixing frame (6), a slot (20) is provided on the right side of the front end of the box door (3), a clamping strip (21) is fixedly installed in the slot (20), a clamping piece (22) is slidably connected inside the clamping block (5), and a tension spring (23) is provided between the clamping piece (22) and the clamping block (5).

5. The high temperature and high humidity reverse bias test recovery device for semiconductor devices according to claim 1, characterized in that: A limit strip (8) is fixedly installed inside the experimental box (2), and a support plate (9) is overlapped on the upper end of the limit strip (8).

6. The high temperature and high humidity reverse bias test recovery device for semiconductor devices according to claim 5, characterized in that: The upper end of the support plate (9) is provided with a mounting groove (18), and the upper end of the support plate (9) is provided with an empty groove (19) between the mounting grooves (18).

7. The high temperature and high humidity reverse bias test recovery device for semiconductor devices according to claim 1, characterized in that: The through groove (10) matches the inner diameter of the air port (27).

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