Wafer correction device and semiconductor equipment

Abstract

The utility model provides a wafer correction device and semiconductor equipment. The wafer correction device comprises at least three groups of correction assemblies which are arranged around a bearing platform in the semiconductor equipment at intervals; each correcting assembly comprises an inductor, an adjusting plate and an adjuster; the inductor and the adjusting plate are arranged at one end of the adjuster, and the other end of the adjuster is connected with the semiconductor device. The sensor is used for detecting the position of the wafer on the bearing table; and the adjuster is used for moving the adjusting plate in different directions so as to correct the position of the wafer on the bearing table. According to the technical scheme, the deviation position of the wafer is determined by utilizing the inductor, and the position of the wafer on the bearing table is corrected by moving the adjusting plate in different directions through the adjuster, so that the wafer is safely and accurately corrected on the premise of not opening a machine table door, and the risks that the wafer and the machine table are polluted and the wafer slides off are avoided.

Description

Technical Field

[0001] The utility model relates to the field of semiconductor equipment, in particular to a wafer correction device and semiconductor equipment. Background Art

[0002] In the semiconductor manufacturing process, wafer handling and transfer are extremely important links, which involve multiple precision steps and complex equipment. In these processes, the use of chucks is particularly critical. It fixes the wafer through vacuum adsorption to ensure the stability and accuracy of the wafer during various processing operations in the machine. However, although the adsorption function of the chuck provides great convenience for wafer handling, it still faces some challenges in practical applications.

[0003] First, due to product characteristics and the machine's own hardware problems, stage errors occasionally occur. In this case, the position of the wafer may shift, and before opening the chamber of the machine, the specific position of the wafer cannot be directly confirmed. Therefore, this not only increases the difficulty and risk of returning the wafer, but may also cause damage to the wafer and the machine itself.

[0004] Secondly, when the wafer deviates from the chuck in the machine, the traditional method is to open the cavity of the machine and then manually remove the wafer. However, on the one hand, the traditional method may cause the wafer and the machine to be contaminated, affecting the quality of the product and the life of the machine; on the other hand, manual operation also has the risk of the wafer slipping, posing a threat to the safety of the operator.

[0005] Therefore, there is an urgent need for a wafer correction device and a semiconductor device to improve the above problems. Utility Model Content

[0006] The purpose of the utility model is to provide a wafer correction device and semiconductor equipment, which can realize safe and accurate correction of the wafer without opening the machine door, thereby avoiding contamination of the wafer and the machine, and the risk of the wafer slipping.

[0007] In a first aspect, the utility model provides a wafer correction device for use in a semiconductor device, comprising at least three groups of correction components spaced around a carrier platform in the semiconductor device;

[0008] Each of the correction components includes a sensor, an adjustment plate and an adjuster;

[0009] The sensor and the regulating plate are both arranged on one end of the regulator, and the other end of the regulator is connected to the semiconductor device;

[0010] The sensor is used to detect the position of the wafer on the carrier;

[0011] The adjuster is used to move the adjustment plate in different directions to correct the position of the wafer on the carrier.

[0012] The beneficial effects of the utility model are as follows: at least three groups of correction components are arranged at intervals around the carrier platform in the semiconductor device; each of the correction components includes a sensor, an adjustment plate and an adjuster; the sensor and the adjustment plate are arranged on one end of the adjuster, and the other end of the adjuster is connected to the semiconductor device; the sensor is used to detect the position of the wafer on the carrier platform; the adjuster is used to move the adjustment plate in different directions to correct the position of the wafer on the carrier platform. The offset position of the wafer is determined by the sensor, and the adjustment plate is moved in different directions by the adjuster to correct the position of the wafer on the carrier platform, so that the wafer can be safely and accurately corrected without opening the machine door, thereby avoiding contamination of the wafer and the machine platform, as well as the risk of the wafer slipping.

[0013] Optionally, the regulator includes a vertical adjustment rod and a horizontal adjustment rod;

[0014] The sensor and the adjustment plate are both arranged on the top of the vertical adjustment rod;

[0015] The bottom of the vertical adjustment rod is connected to one end of the horizontal adjustment rod away from the supporting platform, and the other end of the horizontal adjustment rod close to the supporting platform is connected to the semiconductor device;

[0016] The vertical adjustment rod is used to move the adjustment plate in the vertical direction;

[0017] The horizontal adjustment rod is used to adjust the distance between the vertical adjustment rod and the bearing platform in the horizontal direction to move the adjustment plate;

[0018] The vertical adjustment rod and the horizontal adjustment rod cooperate with each other to move the adjustment plate to correct the position of the wafer on the carrier. The beneficial effect is that by directly setting the sensor and the adjustment plate on the top of the vertical adjustment rod, the entire correction device occupies less space in the machine cavity. When the sensor senses that the wafer position is offset, the vertical adjustment rod and the horizontal adjustment rod cooperate with each other to move the adjustment plate, so as to use the side of the adjustment plate to push the wafer to the center of the carrier, so that the center of the wafer is aligned with the center of the carrier, thereby achieving wafer correction.

[0019] Optionally, the adjuster includes a support rod, a vertical adjustment rod and a horizontal adjustment rod;

[0020] The sensor and the adjustment plate are both arranged on the top of the support rod;

[0021] The bottom of the support rod is connected to one end of the horizontal adjustment rod away from the carrying platform, and the other end of the horizontal adjustment rod close to the carrying platform is connected to the semiconductor device through the vertical adjustment rod;

[0022] The vertical adjustment rod is used to adjust the distance between the horizontal adjustment rod and the bearing platform in the vertical direction to move the adjustment plate;

[0023] The horizontal adjustment rod is used to adjust the distance between the support rod and the bearing platform in the horizontal direction to move the adjustment plate;

[0024] The vertical adjustment rod, the horizontal adjustment rod and the support rod cooperate with each other to move the adjustment plate to correct the position of the wafer on the carrier. The beneficial effect is that by adding the support rod and arranging the sensor and the adjustment plate on the support rod, the stability is high. When the sensor senses that the position of the wafer is offset, the vertical adjustment rod, the horizontal adjustment rod and the support rod cooperate with each other to move the adjustment plate, so as to use the side of the adjustment plate to push the wafer to the center of the carrier, so that the center of the wafer is aligned with the center of the carrier, thereby realizing wafer correction.

[0025] Optionally, the regulator further comprises a plurality of air flow channels disposed in the vertical adjustment rod;

[0026] One end of the airflow channel is connected to the upper surface of the adjustment plate, and the other end is connected to an external vacuum device;

[0027] The vacuum device is used to generate suction through the airflow channel to adsorb the wafer on the upper surface of the adjustment plate, so as to cooperate with the adjuster to correct the position of the wafer on the carrier. Its beneficial effect is that, through the plurality of airflow channels set in the vertical adjustment rod, for wafers with an offset less than the set value, the side of the adjustment plate is used to push the wafer to the center of the carrier, so that the center of the wafer is aligned with the center of the carrier, thereby achieving wafer correction, and for wafers with an offset greater than the set value, the upper surface of the adjustment plate is used to adsorb the wafer, and then push the wafer to the center of the carrier, so that the center of the wafer is aligned with the center of the carrier, thereby achieving wafer correction, which can avoid pushing the wafer to move too long, causing the wafer to fall, and reduces the friction between the wafer and the carrier, preventing the back of the wafer from being scratched.

[0028] Optionally, the regulator further comprises a plurality of air flow channels disposed in the support rod;

[0029] One end of the airflow channel is connected to the upper surface of the adjustment plate, and the other end is connected to an external vacuum device;

[0030] The vacuum device is used to generate suction through the airflow channel to adsorb the wafer on the upper surface of the adjustment plate, so as to cooperate with the adjuster to correct the position of the wafer on the carrier. Its beneficial effect is that through the multiple airflow channels set in the support rod, it is easy to process and has high stability. For wafers with an offset less than the set value, the side of the adjustment plate is used to push the wafer to the center of the carrier, so that the center of the wafer is aligned with the center of the carrier, thereby achieving wafer correction. For wafers with an offset greater than the set value, the upper surface of the adjustment plate is used to adsorb the wafer and then push the wafer to the center of the carrier, so that the center of the wafer is aligned with the center of the carrier, thereby achieving wafer correction. It can avoid pushing the wafer to move too long, which may cause the wafer to fall, and reduce the friction between the wafer and the carrier, preventing the back of the wafer from being scratched.

[0031] Optionally, the vertical adjustment rod and the horizontal adjustment rod are pneumatic push-pull rods or electric telescopic rods; and / or the vertical adjustment rod and the horizontal adjustment rod are made of metal material with fluorine coating on the surface. The beneficial effect is that by setting the vertical adjustment rod and the horizontal adjustment rod as pneumatic push-pull rods, the working efficiency is high and energy-saving and environmentally friendly, while the electric telescopic rod is used, the stability is high; and by using the vertical adjustment rod and the horizontal adjustment rod made of metal material with fluorine coating on the surface, not only can the damage to the wafer be reduced, but also it is more durable and relatively cheaper than Teflon material.

[0032] Optionally, the adjustment plate is an arc-shaped adjustment plate, and a surface of the arc-shaped adjustment plate facing the wafer on the supporting platform is a concave surface;

[0033] The curvature of the concave surface matches the curvature of the wafer. The beneficial effect is that by setting the adjustment plate as an arc-shaped adjustment plate, and the side of the arc-shaped adjustment plate facing the wafer on the carrier is a concave surface; the curvature of the concave surface matches the curvature of the wafer, when the wafer is pushed by the side of the arc-shaped adjustment plate, the stability of the adjustment plate controlling the wafer can be improved.

[0034] Optionally, the upper surface of the adjustment plate is an annular surface, and the inner diameter of the annular surface is 145-155mm, and / or the outer diameter of the annular surface is 155-165mm. The beneficial effect is that by setting the upper surface of the adjustment plate to be an annular surface, and the inner diameter of the annular surface is 145-155mm, and / or the outer diameter of the annular surface is 155-165mm, it is possible to ensure that after the upper surface of the adjustment plate adsorbs the wafer, the force on the wafer is uniform, thereby improving the stability of the adjustment plate's control over the wafer and reducing the risk of the wafer falling.

[0035] Optionally, at least three groups of correction components are evenly distributed around the carrier platform. The beneficial effect is that by arranging all the correction components evenly distributed around the carrier platform, it is possible to ensure that when the wafer is offset at different angles, it can be quickly corrected, thereby improving the correction efficiency.

[0036] In a second aspect, the utility model further provides a semiconductor device, comprising a wafer correction device of any possible combination of the above-mentioned first aspect.

[0037] For the beneficial effects of the second aspect, reference may be made to the description of the first aspect. BRIEF DESCRIPTION OF THE DRAWINGS

[0038] Figure 1 A top view of a wafer correction device provided by an embodiment of the utility model;

[0039] Figure 2 A front view of a wafer correction device provided by an embodiment of the utility model;

[0040] Figure 3 A front view of another wafer correction device provided by an embodiment of the utility model;

[0041] Figure 4 A schematic diagram of the three-dimensional structure of a wafer correction device provided by an embodiment of the utility model;

[0042] Figures 5 to 8 A schematic diagram of a wafer correction principle provided by an embodiment of the utility model;

[0043] Figures 9 to 11 Another schematic diagram of wafer correction principle provided by an embodiment of the utility model;

[0044] Fig.12 A schematic diagram of the internal structure of a semiconductor device provided in an embodiment of the utility model.

[0045] Description of reference numerals:

[0046] 1. Correction component; 2. Carrying platform; 3. Wafer;

[0047] 11. Sensor; 12. Adjustment plate; 13. Regulator;

[0048] 131. Vertical adjustment rod; 132. Support rod; 133. Horizontal adjustment rod; 134. Air flow channel. DETAILED DESCRIPTION

[0049] In order to make the purpose, technical solution and advantages of the utility model clearer, the technical solution in the embodiment of the utility model will be clearly and completely described below in conjunction with the drawings of the utility model. Obviously, the described embodiment is a part of the embodiment of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the utility model. Unless otherwise defined, the technical terms or scientific terms used herein should be understood by people with general skills in the field to which the utility model belongs. "Including" and similar words used in this article mean that the elements or objects appearing before the word include the elements or objects listed after the word and their equivalents, without excluding other elements or objects.

[0050] In view of the problems existing in the existing technology, such as Figure 1 , Figure 2 , Figures 4 to 8 As shown, the utility model provides a wafer correction device for semiconductor equipment, including at least three groups of correction components 1 arranged at intervals around a carrier 2 in the semiconductor equipment; each of the correction components 1 includes a sensor 11, an adjustment plate 12 and a regulator 13; the sensor 11 and the adjustment plate 12 are both arranged (such as by a fixed connection method such as welding or integral molding, or by a detachable connection method such as threading or snapping) on ​​one end of the regulator 13, and the other end of the regulator 13 is connected to the semiconductor equipment (such as a fixed connection or a detachable connection, and the other end of the regulator 13 can also be arranged to be rotatable with the semiconductor equipment, so that when not corrected, the entire correction device is stored, thereby reducing the space occupied by the cavity); the sensor 11 (such as a magnetic position sensor, a photoelectric position sensor or an ultrasonic position sensor, etc.) is used to detect the position of the wafer 3 on the carrier 2; the regulator 13 is used to move the adjustment plate 12 in different directions to correct the position of the wafer 3 on the carrier 2. In some embodiments, Figure 2As shown, the regulator 13 includes a vertical adjustment rod 131 and a horizontal adjustment rod 133; the sensor 11 and the adjustment plate 12 are both arranged on the top of the vertical adjustment rod 131; the bottom of the vertical adjustment rod 131 is connected to the end of the horizontal adjustment rod 133 away from the carrier 2, and the other end of the horizontal adjustment rod 133 close to the carrier 2 is connected to the semiconductor device (the horizontal adjustment rod 133 can be fixedly connected or detachably connected to the bottom of the carrier 2, and can also be fixedly connected or detachably connected to the inner surface of the cavity of the semiconductor device); the vertical adjustment rod 131 is used to move the adjustment plate 12 in the vertical direction; the horizontal adjustment rod 133 is used to adjust the distance between the vertical adjustment rod 131 and the carrier 2 in the horizontal direction to move the adjustment plate 12; the vertical adjustment rod 131 and the horizontal adjustment rod 133 cooperate with each other to move the adjustment plate 12 to correct the position of the wafer 3 on the carrier 2. When the offset of the wafer 3 on the carrier 2 is less than the set threshold, as shown in FIG. Figure 5-8 As shown, the working process of the correction device of the utility model is as follows: Figure 5 As shown, the horizontal adjustment rod 133 is first controlled to extend, so that the sensor 11 and the adjustment plate 12 disposed on the top of the vertical adjustment rod 131 gradually move away from the carrier 2 until the sensor 11 stops sensing the wafer 3; Figure 6 As shown, the vertical adjustment rod 131 is controlled to rise, so that the plane where the wafer 3 is located is located within the side area of ​​the adjustment plate 12; Figure 7 As shown, the horizontal adjustment rod 133 is controlled to shorten. During this process, the adjustment plate 12 gradually approaches the carrier 2 as the horizontal adjustment rod 133 shortens, and pushes the offset wafer 3 toward the carrier 2, so that the center of the wafer 3 is aligned with the center of the carrier 2, thereby achieving the correction of the wafer 3; Figure 8 As shown, the adjustment plate 12 is controlled to return to the original position. It should be understood that both the vertical adjustment rod 131 and the horizontal adjustment rod 133 can be provided in plurality according to actual needs. In addition, the existing chuck (i.e., the carrier 2) does not have a pin structure for correcting the position of the wafer 3, which makes it more difficult to correct the wafer 3 that has shifted on the chuck, and also increases the threat to the cleanliness of the inside of the machine. The correction device provided by the utility model can be designed as a lift pin (usually refers to a device for lifting the wafer 3 placed on the surface of the carrier 2) to achieve safe and accurate correction of the wafer, thereby avoiding contamination of the wafer and the machine, as well as the risk of the wafer slipping.

[0051] It is worth noting that the larger the threshold is set, the longer the distance that wafer 3 is pushed to move during the actual correction process, which will not only increase the probability of wafer 3 falling, but also easily cause scratches on the back of wafer 3 due to the friction between wafer 3 and carrier 2. Therefore, the threshold value is usually set to be less than or equal to 10mm. In addition, in actual applications, it is also necessary to consider that the entire correction device occupies the internal space of the semiconductor device. Therefore, the telescopic range of the horizontal adjustment rod 133 should not be too long. In this case, when the offset of wafer 3 is greater than 10mm, Figures 5 to 8 The correction process shown is prone to the problem of wafer 3 falling, scratching, or excessive size. To address this problem, in other embodiments, the regulator 13 is provided to include a plurality of airflow channels 134 provided in the vertical adjustment rod 131; one end of the airflow channel 134 is connected to the upper surface of the adjustment plate 12, and the other end is connected to an external vacuum device through a PV hose; the vacuum device is used to generate suction through the airflow channel 134 to adsorb the wafer 3 on the upper surface of the adjustment plate 12, so as to cooperate with the regulator 13 to correct the position of the wafer 3 on the carrier 2. When the offset of the wafer 3 on the carrier 2 is greater than the set threshold, as shown in FIG. Figure 9-10 As shown, the working process of the correction device of the utility model is as follows: Fig. 9 As shown, the horizontal adjustment rod 133 is first controlled to extend, so that the sensor 11 and the adjustment plate 12 disposed on the top of the vertical adjustment rod 131 gradually move away from the carrier 2 until the sensor 11 stops sensing the wafer 3; Fig.10 As shown, after the horizontal adjustment rod 133 is controlled to shorten inward by a certain distance (such as 10 mm), the vacuum device is started to generate suction through the air flow channel 134 to adsorb the wafer 3 on the upper surface of the adjustment plate 12, and the vertical adjustment rod 131 is controlled to rise, thereby pushing the wafer 3 up; Fig.11 As shown, after the horizontal adjustment rod 133 is controlled to shorten a certain distance, the vertical adjustment rod 131 is controlled to descend, so that the wafer 3 is placed on the carrier 2 again. At this time, the wafer 3 usually still has a certain deviation and needs to be further corrected. Since the deviation is less than 10mm, it can be used Figure 5-8 Correction process as shown.

[0052] In other embodiments, Figure 3As shown, the regulator 13 includes a support rod 132, a vertical adjustment rod 131 and a horizontal adjustment rod 133; the sensor 11 and the adjustment plate 12 are both arranged on the top of the support rod 132; the bottom of the support rod 132 is connected to the end of the horizontal adjustment rod 133 away from the carrier 2, and the other end of the horizontal adjustment rod 133 close to the carrier 2 is connected to the semiconductor device through the vertical adjustment rod 131 (the vertical adjustment rod 131 can be fixedly connected or detachably connected to the bottom of the carrier 2, and can also be connected to the semiconductor device). The inner surface of the cavity of the conductor device is fixedly connected or detachably connected); the vertical adjustment rod 131 is used to adjust the distance between the horizontal adjustment rod 133 and the carrier 2 in the vertical direction to move the adjustment plate 12; the horizontal adjustment rod 133 is used to adjust the distance between the support rod 132 and the carrier 2 in the horizontal direction to move the adjustment plate 12; the vertical adjustment rod 131, the horizontal adjustment rod 133 and the support rod 132 cooperate with each other to move the adjustment plate 12 to correct the position of the wafer 3 on the carrier 2, using Figure 5-8 In some other specific embodiments, the regulator 13 further includes a plurality of airflow channels 134 disposed in the support rod 132; one end of the airflow channel 134 is connected to the upper surface of the regulating plate 12, and the other end is connected to an external vacuum device through a PV hose; the vacuum device is used to generate suction through the airflow channel 134 to adsorb the wafer 3 on the upper surface of the regulating plate 12, so as to cooperate with the regulator 13 to correct the position of the wafer 3 on the carrier 2, using Figure 9-11 The working process is shown.

[0053] In some specific embodiments, the vertical adjustment rod 131 and the horizontal adjustment rod 133 are pneumatic push-pull rods or electric telescopic rods. Among them, setting the vertical adjustment rod 131 and the horizontal adjustment rod 133 as pneumatic push-pull rods has high working efficiency and is energy-saving and environmentally friendly, while using electric telescopic rods has high stability.

[0054] In other specific embodiments, in order to reduce damage to the wafer 3 and reduce the cost of the correction device, the vertical adjustment rod 131 and the horizontal adjustment rod 133 are made of a metal material with fluorine on the surface.

[0055] In some embodiments, Figure 1 As shown, in order to improve the stability of the adjustment plate 12 when pushing the wafer 3 to move, the adjustment plate 12 is an arc-shaped adjustment plate 12, and the side of the arc-shaped adjustment plate 12 facing the wafer 3 on the support platform 2 is a concave surface; the curvature of the concave surface is adapted to the curvature of the wafer 3.

[0056] In some embodiments, Figure 1As shown, in order to ensure the uniformity of the force applied to the wafer 3 after the upper surface of the adjustment plate 12 adsorbs the wafer 3, thereby improving the stability of the adjustment plate 12 controlling the wafer 3 and reducing the risk of the wafer 3 falling, the upper surface of the adjustment plate 12 is set to be an annular surface, and the inner diameter of the annular surface is 145-155mm, and / or the outer diameter of the annular surface is 155-165mm.

[0057] In some embodiments, Fig.12 As shown, in order to improve the correction efficiency and ensure that the wafer 3 can be quickly corrected when it is offset at different angles, at least three groups of correction components 1 are evenly distributed around the carrier 2.

[0058] Based on the above wafer correction device, Fig.12 As shown, the utility model also provides a semiconductor device, including three groups of correction components 1 (the number of correction components 1 can be adjusted according to actual needs) arranged at intervals around a carrier platform 2 in the semiconductor device, and the three groups of correction components 1 cooperate with each other to correct wafers 3 that are offset in different directions. Preferably, the three groups of correction components 1 are arranged around the center of the carrier platform 2 and evenly distributed around the carrier platform 2 to improve the correction efficiency.

[0059] Although the embodiments of the present invention are described in detail above, it is obvious to those skilled in the art that various modifications and variations can be made to these embodiments. However, it should be understood that such modifications and variations are within the scope and spirit of the present invention as described in the claims. Moreover, the present invention described herein may have other embodiments and may be implemented or realized in a variety of ways.

Claims

1. A wafer correction device for semiconductor equipment, characterized in that: The device comprises at least three sets of correction components spaced around a carrier in a semiconductor device; Each of the correction components includes a sensor, an adjustment plate and an adjuster; The sensor and the regulating plate are both arranged on one end of the regulator, and the other end of the regulator is connected to the semiconductor device; The sensor is used to detect the position of the wafer on the carrier; The adjuster is used to move the adjustment plate in different directions to correct the position of the wafer on the carrier.

2. The device according to claim 1, characterized in that The regulator includes a vertical adjustment rod and a horizontal adjustment rod; The sensor and the adjustment plate are both arranged on the top of the vertical adjustment rod; The bottom of the vertical adjustment rod is connected to one end of the horizontal adjustment rod away from the supporting platform, and the other end of the horizontal adjustment rod close to the supporting platform is connected to the semiconductor device; The vertical adjustment rod is used to move the adjustment plate in the vertical direction; The horizontal adjustment rod is used to adjust the distance between the vertical adjustment rod and the bearing platform in the horizontal direction to move the adjustment plate; The vertical adjustment rod and the horizontal adjustment rod cooperate with each other to move the adjustment plate to correct the position of the wafer on the carrier.

3. The device according to claim 1, characterized in that The regulator includes a support rod, a vertical adjustment rod and a horizontal adjustment rod; The sensor and the adjustment plate are both arranged on the top of the support rod; The bottom of the support rod is connected to one end of the horizontal adjustment rod away from the carrying platform, and the other end of the horizontal adjustment rod close to the carrying platform is connected to the semiconductor device through the vertical adjustment rod; The vertical adjustment rod is used to adjust the distance between the horizontal adjustment rod and the bearing platform in the vertical direction to move the adjustment plate; The horizontal adjustment rod is used to adjust the distance between the support rod and the bearing platform in the horizontal direction to move the adjustment plate; The vertical adjustment rod, the horizontal adjustment rod and the support rod cooperate with each other to move the adjustment plate to correct the position of the wafer on the carrier.

4. The device according to claim 2, characterized in that The regulator also includes a plurality of air flow channels disposed in the vertical adjustment rod; One end of the airflow channel is connected to the upper surface of the adjustment plate, and the other end is connected to an external vacuum device; The vacuum device is used to generate suction through the air flow channel to adsorb the wafer on the upper surface of the adjustment plate, so as to cooperate with the adjuster to correct the position of the wafer on the carrier.

5. The device according to claim 3, characterized in that The regulator also includes a plurality of air flow channels disposed within the support rod; One end of the airflow channel is connected to the upper surface of the adjustment plate, and the other end is connected to an external vacuum device; The vacuum device is used to generate suction through the air flow channel to adsorb the wafer on the upper surface of the adjustment plate, so as to cooperate with the adjuster to correct the position of the wafer on the carrier.

6. The device according to claim 2 or 3, characterized in that: The vertical adjustment rod and the horizontal adjustment rod are pneumatic push-pull rods or electric telescopic rods; and / or the vertical adjustment rod and the horizontal adjustment rod are made of metal material with fluorine coating on the surface.

7. The device according to claim 1, characterized in that The adjustment plate is an arc-shaped adjustment plate, and a side of the arc-shaped adjustment plate facing the wafer on the supporting platform is a concave surface; The curvature of the concave surface matches the curvature of the wafer.

8. The device according to claim 4, characterized in that The upper surface of the adjustment plate is an annular surface, and the inner diameter of the annular surface is 145-155 mm, and / or the outer diameter of the annular surface is 155-165 mm.

9. The device according to claim 1, characterized in that At least three groups of correction components are evenly distributed around the supporting platform.

10. A semiconductor device, characterized in that: It comprises a wafer correction device as described in any one of claims 1 to 9.

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