Wafer transmission device and wafer measurement system

Abstract

The utility model belongs to the field of equipment design for producing, processing and manufacturing semiconductors, and particularly relates to a wafer transmission device and a wafer measurement system. A wafer transmission device comprises a shell assembly, a driving assembly and a transmission assembly. The shell assembly comprises an outer shell internally provided with a sealed cavity. The transmission assembly comprises a rotating shaft, the rotating shaft extends into the sealing cavity and is connected with a horizontally-arranged propeller, and a first platform and a second platform are arranged at the two ends of the propeller correspondingly. The driving assembly is connected to the rotating shaft and can drive the rotating shaft to rotate along the axis so as to drive the propeller to enable the wafer to perform position transmission between the first platform and the second platform. The transmission device can adapt to wafers of different sizes and types. By adjusting the shape and the size of the propeller and the distance between the platforms, the device can easily adapt to wafers of different specifications, and the universality and the flexibility of the device are improved.

Description

Technical Field

[0001] The utility model belongs to the field of equipment design for producing and processing semiconductors, and in particular relates to a wafer transmission device and a wafer measurement system. Background Art

[0002] In the semiconductor manufacturing industry, the transfer and transfer of wafers between different processes is a crucial link. Especially in the field of detection and measurement, wafers need to be frequently transferred between the atmospheric environment and the vacuum environment, which places extremely high demands on the efficiency and accuracy of the transfer process. However, there are currently a series of problems that need to be solved in the process of transferring wafers between the atmosphere and the vacuum.

[0003] First of all, the existing transfer technology mostly adopts the bottom seal form, which has the problem of low efficiency. In addition, during the wafer transfer process, any tiny particles may adhere to the wafer surface, resulting in a decline in product quality or even scrapping. Especially during the transition between the atmosphere and the vacuum environment, the risk of contamination is significantly increased. Furthermore, due to the fragility of the wafer itself, as well as the mechanical shock and vibration that may be suffered during the transfer process, the wafer is easily damaged. This not only increases production costs, but may also affect the stability of the entire production line. Finally, during the transfer process, the position state of the wafer may change, resulting in the inability to accurately dock the subsequent processes. Especially in the wafer alignment device in the EFEM (equipment front end module), due to the long tolerance size chain after multiple wafer transfers, there is a problem of precision deviation, which further aggravates the risk of unsatisfactory position state.

[0004] Based on this, this proposal is proposed. Utility Model Content

[0005] In response to the above-mentioned technical problems, the purpose of this application is to provide a wafer transfer device and a wafer measurement system, which can improve the transfer efficiency and accuracy through structural innovation and process optimization, reduce the risk of contamination and damage, and thus ensure the stable development of the semiconductor manufacturing industry and the continuous improvement of product quality.

[0006] Therefore, in the first aspect of the present application, a wafer transfer device is first provided, including a shell assembly, a drive assembly and a transmission assembly; the shell assembly includes an outer shell with a sealed cavity inside; the transmission assembly includes a rotating shaft, which extends into the sealed cavity and is connected to a horizontally arranged propeller, and a first platform and a second platform are respectively arranged at both ends of the propeller; the drive assembly is connected to the rotating shaft, and can drive the rotating shaft to rotate along the axis to drive the propeller to transfer the position of the wafer between the first platform and the second platform.

[0007] In a further scheme of the present application, the shell assembly also includes a transition valve and an opening valve; the transition valve is arranged inside the sealed cavity and divides the sealed cavity into a main chamber and a buffer chamber, the first platform is located in the main chamber, and the second platform is located in the buffer chamber; the opening valve is arranged at the outer shell and is connected to the buffer chamber.

[0008] In a further embodiment of the present application, the transmission assembly includes a rotary servo motor and a linear drive mechanism; the rotary servo motor is connected to the rotating shaft to drive the rotating shaft to rotate; the linear drive mechanism is connected to the rotating shaft to drive the rotating shaft and the rotary servo motor to rise and fall.

[0009] In a further embodiment of the present application, the linear drive mechanism includes a linear guide rail, a moving structure and a driving motor; the moving structure is connected to the linear guide rail; the moving structure is connected to the rotating shaft, and the driving motor can drive the moving structure to rise and fall along the linear guide rail to drive the rotating shaft to rise and fall.

[0010] In a further scheme of the present application, a support structure is connected between the linear guide rails, and a driving motor is fixed on the support structure; the moving structure includes a lifting block and a connecting arm, the lifting block is horizontally arranged and slidably connected to the linear guide rail so that it can be lifted and lowered along the linear guide rail, one end of the connecting arm is connected to the lifting block, and the other end extends toward one side of the rotating shaft and is connected to the rotating shaft.

[0011] In a further solution of the present application, the driving motor is fixed on the outer shell; the moving structure includes a lifting block, which is slidably connected to the linear guide rail and connected to the rotating shaft. The driving motor is connected to the lifting block and can make the lifting block rise and fall along the linear guide rail.

[0012] In a further solution of the present application, at least one position sensor is provided on the linear guide rail for detecting a position signal of the moving structure.

[0013] In a further solution of the present application, a bellows sealing ring is provided between the connecting arm and the outer shell, or between the lifting block and the outer shell.

[0014] In a further solution of the present application, a magnetic fluid sealing ring is provided at the connection between the connecting arm and the rotating shaft; or at the connection between the lifting block and the rotating shaft.

[0015] In a further solution of the present application, a wafer presence sensor is disposed on the inner wall of the outer shell, and the wafer presence sensor is used to detect whether there is a wafer on the first platform and / or the second platform.

[0016] In a further solution of the present application, both the first platform and the second platform are provided with a ejector mechanism, which includes a plurality of ejectors that can pass through and protrude relative to the first platform and the second platform, so as to support the wafer or place the wafer on the first platform and the second platform.

[0017] In a second aspect of the present application, a wafer measurement system is further provided, comprising a plurality of wafer measurement devices and the above wafer transfer device, wherein the wafer is transferred between different wafer measurement devices via the wafer transfer device.

[0018] In summary, based on a wafer transmission device provided by the present application, the drive assembly drives the shaft to rotate along the axis, and the propeller can drive the wafer to achieve fast and smooth position transmission between the first platform and the second platform. This design reduces the pauses and delays of the wafer during the transfer process and improves the overall production efficiency. And the use of propellers as a transmission mechanism for horizontal rotation reduces the mechanical shock and vibration that the wafer may be subjected to during the transfer process compared to traditional robotic arms or clamps. This helps to reduce the breakage rate of the wafer during the transfer process and improve the product yield. And the transmission device can adapt to wafers of different sizes and types. By adjusting the shape, size and spacing of the propeller and the platform, it can easily adapt to wafers of different specifications, improving the versatility and flexibility of the equipment.

[0019] The housing assembly provides a sealed cavity that can maintain a vacuum environment. The propeller transfer is carried out inside the sealed cavity, providing a stable working environment for the wafer. It can effectively prevent external contaminants from entering the wafer transfer area, ensuring that the wafer is free from contamination during the transfer process. Keep the wafer surface clean and stable, thereby improving product quality and reliability.

[0020] Other features and advantages of this practical embodiment will be described in the subsequent specific implementation section. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the specific implementation methods of the present application or the technical solutions in the prior art, the drawings required for use in the specific implementation methods or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some implementation methods of the present application. For those skilled in the art, other drawings can be obtained based on these drawings without paying any creative work.

[0022] Figure 1 A schematic diagram of the structure of a wafer transmission device provided by a general inventive concept of the utility model;

[0023] Figure 2 A schematic diagram of the structure of a wafer transfer device in one form provided by an embodiment of the utility model;

[0024] Figure 3 A schematic diagram of the structure of the ejector mechanism and the first platform / second platform in the wafer transfer device provided by an embodiment of the utility model;

[0025] Figure 4A schematic diagram of the structure of another form of the wafer transfer device provided by the practical embodiment;

[0026] Figure 5 A simple schematic diagram of a wafer measurement system provided by an embodiment of the present invention.

[0027] Description of reference numerals:

[0028] 100. Wafer transfer device;

[0029] 10. Shell assembly; 11. Outer shell; 12. Sealing cavity; 13. Transition valve; 14. Opening valve;

[0030] 20. Transmission assembly; 21. Rotating shaft; 22. Propeller; 221. Avoidance;

[0031] 30. Platform component; 31. First platform; 32. Second platform;

[0032] 40. drive assembly; 41. rotary servo motor; 42. linear drive mechanism; 421. linear guide rail; 422. moving structure; 4221. lifting block; 4222. connecting arm; 423. drive motor; 424. supporting structure;

[0033] 60. Position sensor; 61. Upper sensor; 62. Lower sensor;

[0034] 70. Bellows sealing ring;

[0035] 80. Magnetic fluid sealing ring;

[0036] 90. Wafer in-position sensor;

[0037] 200. Wafer measurement system; 201. Wafer measurement device. DETAILED DESCRIPTION

[0038] In order to make the above and other features and advantages of the present application more clear, the present application is further described below in conjunction with the accompanying drawings. It should be understood that the specific embodiments given herein are for the purpose of explaining to those skilled in the art and are only exemplary and not restrictive.

[0039] In the following description, many specific details are set forth to provide a thorough understanding of the present application. However, it is apparent to those skilled in the art that specific details need not be adopted to practice the present application. In other cases, well-known steps or operations are not described in detail to avoid blurring the present application.

[0040] In order to make the above and other features and advantages of the present invention more clear, the present invention is further described below in conjunction with the accompanying drawings. It should be understood that the specific embodiments given herein are for the purpose of explaining to those skilled in the art and are only exemplary and not restrictive.

[0041] In the following description, it should be understood that the terms "center", "lateral", "length", "width", "up", "down", "vertical", "horizontal", "inside", "outside", "axial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0042] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In the description of this utility model, the meaning of "plurality" is at least two groups, such as two groups, three, etc., unless otherwise clearly and specifically defined.

[0043] like Figure 1 First, a wafer transfer device 100 is provided, specifically, a device for transferring wafers in a semiconductor manufacturing process. The wafer transfer device 100 includes: a housing component 10, a transmission component 20, a platform component 30, and a drive component 40;

[0044] The housing assembly 10 includes an outer housing 11, inside of which is a sealed cavity 12, which ensures that the wafer will not be contaminated by the external environment during the transfer process, and the sealed cavity 12 maintains a vacuum environment to effectively reduce surface contamination of the wafer during the transfer process.

[0045] The transmission assembly 20 is connected to the outer shell 11 and includes a rotating shaft 21 . The rotating shaft 21 extends into the sealed cavity 12 and is connected to a horizontally arranged propeller 22 in the sealed cavity 12 .

[0046] The platform assembly 30 includes a first platform 31 and a second platform 32 , and the propeller 22 can transfer the wafer from the first platform 31 to the second platform 32 , or vice versa.

[0047] The drive assembly 40 is connected to the rotating shaft 21 and can provide mechanical energy to drive the rotating shaft 21 to rotate along its axis. When the drive assembly 40 is in the working state, the rotating shaft 21 and the propeller 22 rotate together, thereby realizing the position transmission of the wafer between the two platforms (i.e., the first platform 31 and the second platform 32).

[0048] Based on the wafer transfer device 100 provided by the general inventive concept of the embodiment of the utility model, the drive assembly 40 drives the rotating shaft 21 to rotate along the axis, and the propeller 22 can drive the wafer to achieve fast and smooth position transmission between the first platform 31 and the second platform 32. This design reduces the pause and delay of the wafer during the transfer process and improves the overall production efficiency. And the propeller 22 is used as a transmission mechanism and rotates in a horizontal manner, which reduces the mechanical shock and vibration that the wafer may be subjected to during the transfer process compared to traditional mechanical arms or clamps. This helps to reduce the breakage rate of the wafer during the transfer process and improve the product yield. And the wafer transfer device 100 can adapt to wafers of different sizes and types. By adjusting the shape, size and spacing of the propeller and the platform, it can easily adapt to wafers of different specifications, improving the versatility and flexibility of the equipment.

[0049] The housing assembly 10 provides a sealed chamber 12 capable of maintaining a vacuum environment. The propeller 22 is transferred inside the sealed chamber 12, providing a stable working environment for the wafer. It can effectively prevent external contaminants from entering the wafer transfer area, ensuring that the wafer is free from contamination during the transfer process. The wafer surface is kept clean and stable, thereby improving the quality and reliability of the product.

[0050] A specific embodiment is provided below:

[0051] like Figure 2 The shell assembly 10 also includes a transition valve 13 and an opening valve 14; the transition valve 13 is arranged inside the sealed cavity 12 and divides the sealed cavity 12 into a main chamber 121 and a buffer chamber 122, the first platform 31 is located in the main chamber 121, and the second platform 32 is located in the buffer chamber 122; the opening valve 14 is arranged at the outer shell 11 and is connected to the buffer chamber 122.

[0052] Specifically, the transition valve 13 is arranged inside the sealed chamber 12, which divides the sealed chamber 12 into two independent spaces: the main chamber 121 and the buffer chamber 122. This design allows the main chamber and the buffer chamber to remain isolated when necessary, or to be connected when necessary. The first platform 31 is located in the main chamber 121, and the second platform 32 is located in the buffer chamber 122. Such a layout allows the wafer to be transferred between the two platforms and ensures that the wafer is always in a suitable environment during the transfer process; the environmental parameters (such as vacuum degree, temperature, etc.) of the main chamber 121 and the buffer chamber 122 can be independently controlled to meet the environmental requirements under different process steps.

[0053] Those skilled in the art will appreciate that the transition valve 13 needs to reserve an opening as an avoidance area for the movement of the propeller 22 to avoid interfering with the movement path of the propeller 22. At the same time, considering the sealing and functional integrity of the sealing cavity 12, appropriate sealing measures may be adopted between the opening and the propeller 22, such as magnetic fluid sealing.

[0054] The opening valve 14 can be opened or closed as needed to achieve a controllable connection between the buffer chamber 122 and the external environment. This controllability allows the buffer chamber to interact with the external environment when necessary, such as performing maintenance on the buffer chamber 122 or depressurizing the buffer chamber 122. When the opening valve 14 is tightly closed, the sealing of the buffer chamber 122 can be ensured to maintain a specific environment in the buffer chamber, thereby ensuring the stability and safety of the wafer during the transfer process.

[0055] Furthermore, both the first platform 31 and the second platform 32 are provided with an ejector mechanism 50 . The ejector mechanism 50 includes a plurality of ejector pins (also called pins) that can protrude relative to the first platform 31 and the second platform 32 . The ejector pins are used to support the wafer.

[0056] It can be understood that the first platform 31 and the second platform 32 are platforms (which may be called wafer chucks) for positioning and constraining wafers. Optionally, mechanical adsorption may be used to fix the wafers on the first platform 31 and the second platform 32 .

[0057] The ejector mechanism 50 is configured to allow it to be lifted and displaced relative to the propeller 22, so as to realize the wafer being transferred from the propeller 22 to the first platform 31 or the second platform 32, and returning from the platform to the propeller 22. Specifically: when the propeller 22 carries the wafer to move above the ejector mechanism 50, and the relative position of the propeller 22 is below the highest point of the ejector mechanism 50, the ejector pins of the ejector mechanism 50 begin to protrude from the surface of the first platform 31 or the second platform 32. Due to the protrusion of the ejector pins, the wafer is supported by the ejector pins, thereby being lifted from the propeller 22 and transferred to the platform. Conversely, when the wafer needs to be transferred from the platform back to the propeller 22, the ejector pins of the ejector mechanism 50 begin to retract until their highest point is lower than the height of the propeller 22. As the ejector pins retract, the wafer loses the support of the ejector pins and falls back onto the propeller 22.

[0058] In an optional manner, only the ejector pins of the ejector pin mechanism 50 can be raised and lowered. When the wafer needs to be transferred from the propeller 22 to the platform, the ejector pins protrude to support the wafer; when the wafer needs to be returned from the platform to the propeller, the ejector pins retract to release the wafer.

[0059] In another optional manner, only the propeller 22 is raised and lowered, while the ejector pins of the ejector pin mechanism 50 remain fixed. By adjusting the height of the propeller 22, the wafer can be transferred between the propeller 22 and the platform. This solution is suitable for the scenario where the propeller 22 can be easily raised and lowered, while the platform position is relatively fixed.

[0060] In a preferred embodiment, both the ejector pin and the propeller 22 of the ejector pin mechanism 50 can be raised and lowered; that is, both the ejector pin and the propeller 22 of the ejector pin mechanism 50 can be raised and lowered independently. This design provides greater flexibility and adaptability, and the height of the ejector pin and the propeller can be adjusted according to specific needs to achieve accurate transfer of wafers between different positions.

[0061] like Figure 3 In order to avoid structural interference between the propeller 22 and the ejector pin of the ejector pin mechanism 50 during the rotation process, the propeller 22 may be structurally optimized, such as Figure 3 The end of the propeller 22 is designed to have a structure with an avoidance opening 221, so that the propeller 22 can avoid the ejector pin of the ejector pin mechanism 50 when rotating, thereby preventing collision and interference between the two. Not only does it ensure the smooth transfer of the wafer, but it also improves the stability and reliability of the entire transmission device. Of course, the design of the avoidance opening 221 can also be adjusted and optimized according to specific needs. For example, the size and position of the avoidance opening 221 can be determined according to the ejector pin layout and size of the ejector pin mechanism 50 to ensure that the ejector pin can be completely avoided during the rotation of the propeller 22. At the same time, it is also necessary to consider the impact of the avoidance opening 221 on the overall structure and performance of the propeller 22 to ensure that it can meet the requirements of wafer transfer. The illustration is only an exemplary role and does not serve to limit the structure of the propeller 22.

[0062] Continue reading Figure 2 In one form of a driving assembly 40, the driving assembly 40 includes a rotary servo motor 41 and a linear driving mechanism 42; the rotary servo motor 41 is connected to the rotating shaft 21 to drive the rotating shaft 21 to rotate; the linear driving mechanism is also connected to the rotating shaft 21 to drive the rotating shaft 21 and the rotary servo motor 41 to rise and fall synchronously.

[0063] It can be understood that by combining the rotary servo motor 41 and the linear drive mechanism 42, dual driving of the rotating shaft 21 is achieved: on the one hand, the rotary servo motor 41 is connected to the rotating shaft 21, and is responsible for driving the rotating shaft 21 to rotate to meet the rotation requirements of the propeller 22 during the wafer transfer process; on the other hand, the linear drive mechanism 42 is also connected to the rotating shaft 21, and its function is to drive the rotating shaft 21 and the rotary servo motor 41 connected thereto to perform lifting and lowering movements, thereby realizing the motion control of the propeller 22 in the vertical direction.

[0064] In a further embodiment of the present application, the linear drive mechanism 42 includes a linear guide rail 421, a moving structure 422 and a driving motor 423; the moving structure 422 is connected to the linear guide rail 421; the moving structure 422 is connected to the rotating shaft 21, and the driving motor 423 can drive the moving structure 422 to rise and fall along the linear guide rail 421 to drive the rotating shaft 21 to rise and fall.

[0065] Specifically, the linear guide 421 is connected to the outer shell 11 to provide a stable lifting path to ensure the stability and accuracy of the mobile structure 422 during the lifting process. The mobile structure 422 is connected to the linear guide 421 and is also connected to the rotating shaft 21, so that the lifting action of the mobile structure 422 can be directly transmitted to the rotating shaft 21 to achieve the lifting of the rotating shaft 21. The drive motor 423 is the power source of the linear drive mechanism 42. It generates a rotational force and converts the rotational motion into a linear motion through an appropriate conversion mechanism (such as a lead screw, gears, etc.), thereby driving the mobile structure 422 to rise and fall along the linear guide 421. The drive motor 423 can accurately control the lifting speed and position of the mobile structure 422, and therefore can also achieve accurate control of the lifting and lowering of the rotating shaft 21.

[0066] based on Figure 2 In one installation form, a support structure 424 is connected between the linear guide rails 421, and a drive motor 423 is fixed on the support structure 424; the moving structure 422 includes a lifting block 4221 and a connecting arm 4222, the lifting block 4221 is horizontally arranged and slidably connected to the linear guide rail 421 so that it can be lifted and lowered along the linear guide rail 421, one end of the connecting arm 4222 is connected to the lifting block 4221, and the other end extends toward one side of the rotating shaft 21 and is connected to the rotating shaft 21.

[0067] Among them, the support structure 424 provides a solid fixed foundation for the drive motor 423. This design ensures that the drive motor 423 can output power stably during operation, reducing the risk of performance degradation or failure caused by vibration or shaking. The lifting block 4221 is horizontally arranged and slidably connected to the linear guide 421, and can perform precise lifting and lowering motion along the trajectory of the linear guide 421, which can be achieved through mechanisms such as balls and sliders, ensuring the stability and accuracy of the lifting block 4221 during the lifting process. One end of the connecting arm 4222 is connected to the lifting block 4221, and the other end extends to one side of the rotating shaft 21 and connects to the rotating shaft 21. The lifting and lowering motion of the lifting block 4221 can be directly transmitted to the rotating shaft 21, realizing the lifting and lowering of the rotating shaft 21. The linear guide 421 is firmly connected by the support structure 424, and the structural stability of the entire linear drive mechanism 42 is significantly enhanced. The sliding connection between the lifting block 4221 and the linearly arranged linear guide 421 ensures the accuracy of the lifting and lowering motion, so that the rotating shaft 21 can be accurately lifted and lowered to a predetermined position. This high-precision control helps improve the accuracy of wafer transmission and reduces the position deviation of the wafer during the transfer process.

[0068] like Figure 4 ,like Figure 2 In another installation form, the driving motor 423 is fixed on the outer shell 11; the moving structure 422 includes a lifting block 4221, which is slidably connected to the linear guide rail 421 and connected to the rotating shaft 21, and the driving motor 423 is connected to the lifting block 4221 and can make the lifting block 4221 rise and fall along the linear guide rail 421.

[0069] By directly fixing the drive motor 423 to the outer shell 11, the intermediate connectors are reduced to save hardware costs. At the same time, the drive motor 423 is fixed to the outer shell 11, which makes it easier to operate when maintaining and replacing the motor. There is no need to disassemble additional supporting structures or connectors, which reduces the complexity and cost of maintenance. At the same time, the outer shell 11 itself serves as a solid foundation, which can provide better support stability for the drive motor 423, thereby further improving the control accuracy.

[0070] Continue reading Figure 2 and Figure 4 At least one position sensor 60 is provided at the linear guide rail 421 to detect the position signal of the moving structure 422, so as to detect the position of the moving structure 422 on the linear guide rail 421 in real time and accurately. By collecting these position signals, the control system can accurately know the current position of the lifting block 4221 or the connecting arm 4222, thereby realizing precise control of the lifting and lowering movement of the rotating shaft 21. Such precise control is crucial to ensure the accuracy and stability of wafer transmission.

[0071] Furthermore, the position sensor 60 can also form a feedback mechanism. When the mobile structure 422 encounters deviations during the lifting process, the position sensor 60 can quickly sense and feedback this information to the control system. The control system makes corresponding adjustments based on the feedback signal to correct the deviation or optimize the motion trajectory to ensure the accuracy of the lifting motion.

[0072] Continue reading Figure 2 and Figure 4 In a specific solution, the position sensor 60 includes an upper sensor 61 and a lower sensor 62, which are used to measure the position information of the moving structure 422 at the extreme position and provide a control signal when the stroke is in place to achieve accurate up and down position control.

[0073] Specifically, when the mobile structure 422 reaches the preset limit position, the sensor will immediately sense it and send a corresponding signal.

[0074] Secondly, the control signals provided by these sensors when the stroke is in place are the key to achieving accurate position control. When the upper sensor 61 or the lower sensor 62 is triggered, they will send a signal to the control system to indicate that the mobile structure 422 has reached the limit position. After receiving these signals, the control system will immediately take corresponding actions, such as stopping the operation of the drive motor 423, adjusting the output speed or direction, etc., to ensure that the mobile structure 422 can accurately stay in the predetermined position, thereby improving the accuracy and stability of the wafer transmission; in addition, it can also enhance the safety and reliability of the equipment. By setting the upper sensor 61 and the lower sensor 62, it is possible to prevent the mobile structure 422 from exceeding the predetermined range or colliding with other accidents, thereby ensuring the safety of the process.

[0075] In a further embodiment of the present application, specifically, Figure 2 In the embodiment, the bellows seal ring 70 is arranged between the connecting arm 4222 and the outer shell 11. When the connecting arm 4222 drives the rotating shaft 21 to move up and down, the bellows seal ring 70 can be stretched and deformed with the movement of the connecting arm 4222, and the sealing of the connection is always maintained. Figure 4 In the embodiment, the bellows seal ring 70 is arranged between the lifting block 4221 and the outer shell 11, playing a similar role.

[0076] It can be understood that the bellows sealing ring 70 has excellent elasticity and sealing performance, and can effectively prevent external substances from entering during the movement of the moving structure 422; at the same time, the bellows sealing ring 70 also has certain wear resistance and corrosion resistance, and can maintain a stable sealing effect in harsh working environments.

[0077] Furthermore, if Figure 2 The connection between the connecting arm 4222 and the rotating shaft 21; or Figure 4A magnetic fluid sealing ring 80 is provided at the connection between the middle lifting block 4221 and the rotating shaft 21 .

[0078] It can be understood that the friction and wear generated by the magnetic fluid sealing ring 80 during the sealing process are extremely small, and the magnetic fluid is controlled in the sealing gap to form a stable sealing layer. This method has extremely high sealing performance and reliability, and can effectively prevent external contaminants from entering the sealing cavity 12.

[0079] Specifically, the magnetic fluid sealing ring 80 can form a continuous and uniform sealing layer. This sealing layer has good self-repairing ability, and can quickly restore the sealing performance even if there is slight wear or scratches. In addition, the magnetic fluid sealing ring 80 has the characteristics of low friction and low wear, so as not to affect the rotation and lifting of the rotating shaft 21.

[0080] Furthermore, the outer shell 11 is provided with a wafer presence sensor 90 , and the wafer presence sensor 90 is used to detect whether there is a wafer on the first platform 31 and / or the second platform 32 .

[0081] Specifically, the wafer presence sensor 90 can be installed on the inner wall of the outer shell 11, and can detect the path of the wafer. The wafer presence sensor 90 can be a photoelectric sensor, an ultrasonic sensor, etc., which can be selected according to specific application scenarios and needs.

[0082] When the wafer in-position sensor 90 is working, it sends out a detection signal and receives a reflected or transmitted signal. When there is a wafer on the first platform 31 and / or the second platform 32, the wafer in-position sensor 90 will receive the corresponding signal change, thereby determining the presence of the wafer. Once the wafer is detected to be in position, the sensor will send a signal to the control system to control the wafer transfer device 100 to perform corresponding operations accordingly, such as starting the transmission assembly 20, adjusting the vacuum of the sealed chamber 12, etc.

[0083] Furthermore, those skilled in the art should understand that if all or part of the sub-modules involved in the various products of the wafer transfer device 100 provided in the present practical embodiment are combined and replaced by fusion, simple change, mutual conversion, etc., such as the components are placed and moved; for example, combined with a measuring device to form an integrated wafer measurement system, or the products it constitutes are set as one; or designed to be detachable; all the combined components can form equipment / devices / systems with specific functions, using such equipment / devices / systems to replace the corresponding components of the present utility also falls within the protection scope of the present utility.

[0084] like Figure 5Therefore, the embodiment of the utility model also provides a wafer measurement system 200, including multiple wafer measurement devices 201 and the above-mentioned wafer transmission device 100, through which the wafer transmission device 100 is used to transfer wafers between different wafer measurement devices 201. The wafer measurement system 200 makes full use of the accuracy and stability of the wafer transmission device 100, and combines multiple wafer measurement devices 201 to achieve rapid and accurate transfer of wafers between different measurement devices. This design not only improves the efficiency and accuracy of wafer measurement, but also adapts to the changes in different measurement requirements, making the entire measurement process more flexible and efficient. Specifically, the wafer transmission device 100 transmits wafers between different wafer measurement devices 201. According to the above, since the wafer transmission device 100 has high-precision positioning and transmission capabilities, and can keep the wafer in a vacuum environment all the time, it can ensure the stability and accuracy of the wafer during the transmission process, and avoid measurement errors caused by improper transmission.

[0085] At the same time, the multiple wafer measurement devices 201 in the wafer measurement system 200 can be configured according to different measurement requirements. These measurement devices may include equipment for measuring critical dimensions of wafers, instruments for detecting wafer surface morphology and defects, etc. By sequentially transferring the wafer to each measurement device through the wafer transfer device 100, comprehensive and accurate measurement of multiple parameters of the wafer can be achieved.

[0086] The various technical features described above can be combined arbitrarily. Although all possible combinations of these technical features are not described, any combination of these technical features should be considered to be covered by this specification as long as there is no contradiction in such combination.

[0087] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit it. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still adjust the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein with equivalents. However, these adjustments or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A wafer transfer device, characterized in that: It includes a housing assembly, a transmission assembly, a platform assembly and a drive assembly; The housing assembly includes an outer housing with a sealed cavity inside; The transmission assembly includes a rotating shaft, which extends into the sealed cavity and is connected to a horizontally arranged propeller; A platform assembly, comprising a first platform and a second platform, wherein the first platform and the second platform are located in the sealed cavity and are respectively arranged at two ends of the propeller; The driving assembly is connected to the rotating shaft, and can drive the rotating shaft to rotate along the axis, so as to drive the propeller to carry the wafer to perform position transmission between the first platform and the second platform.

2. The wafer transfer device according to claim 1, characterized in that: The housing assembly also includes a transition valve and an opening valve; The transition valve is arranged inside the sealed cavity and divides the sealed cavity into a main chamber and a buffer chamber, the first platform is arranged in the main chamber and located on a side of the propeller away from the wafer, and the second platform is located in the buffer chamber and located on a side of the propeller away from the wafer; The opening valve is arranged at the outer shell and communicated with the buffer chamber.

3. The wafer transfer device according to claim 1, characterized in that: The driving assembly is configured to be able to drive the rotating shaft to rotate along the axis and to lift and lower along the axial direction; Wherein, the driving assembly includes a rotary servo motor and a linear driving mechanism; the rotary servo motor is connected to the rotating shaft to drive the rotating shaft to rotate; the linear driving mechanism is connected to the rotating shaft to drive the rotating shaft and the rotary servo motor to rise and fall.

4. The wafer transfer device according to claim 3, characterized in that: The linear drive mechanism includes a linear guide rail, a moving structure and a drive motor; The moving structure is connected to the linear guide rail; The moving structure is connected to the rotating shaft, and the driving motor can drive the moving structure to move up and down along the linear guide rail to drive the rotating shaft to move up and down.

5. The wafer transfer device according to claim 4, characterized in that: A support structure is connected between the linear guide rails, and the drive motor is fixed on the support structure; The movable structure includes a lifting block and a connecting arm. The lifting block is horizontally arranged and slidably connected to the linear guide rail so as to be able to be lifted and lowered along the linear guide rail. One end of the connecting arm is connected to the lifting block, and the other end extends toward one side of the rotating shaft and is connected to the rotating shaft.

6. The wafer transfer device according to claim 5, characterized in that: The driving motor is fixed on the outer shell; The moving structure comprises a linear guide rail and a lifting block, the lifting block is slidably connected to the linear guide rail and connected to the rotating shaft, and the driving motor is connected to the lifting block and can make the lifting block rise and fall along the linear guide rail.

7. The wafer transfer device according to claim 4, characterized in that: At least one position sensor is arranged on the linear guide rail to detect the position signal of the moving structure.

8. The wafer transfer device according to claim 5 or 6, characterized in that: A bellows sealing ring is provided between the connecting arm and the outer shell, or between the lifting block and the outer shell.

9. The wafer transfer device according to claim 5 or 6, characterized in that: A magnetic fluid sealing ring is provided at the connection point between the connecting arm and the rotating shaft; or at the connection point between the lifting block and the rotating shaft.

10. The wafer transfer device according to any one of claims 1 to 7, characterized in that: A wafer presence sensor is arranged on the inner wall of the outer shell, and the wafer presence sensor is used to detect whether there is a wafer on the first platform and / or the second platform.

11. The wafer transfer device according to any one of claims 1 to 7, characterized in that: The first platform and the second platform are both provided with an ejector pin mechanism, and the ejector pin mechanism includes a plurality of ejector pins that can protrude relative to the first platform and the second platform, and the ejector pins are used to support wafers.

12. A wafer measurement system, characterized in that: The invention comprises a plurality of wafer measurement devices and the wafer transfer device according to any one of claims 1 to 11, and wafers are transferred between different wafer measurement devices through the wafer transfer device.

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