Multi-layer high-density circuit board

Abstract

The utility model relates to the technical field of circuit boards, and discloses a multilayer high-density circuit board, which comprises a mounting plate and a main body, a mounting mechanism is arranged on the upper surface of the mounting plate, the mounting mechanism comprises a stand column, a T-shaped connecting block, an abutting block and an abutting column, and the bottom of the stand column is fixedly connected with the upper surface of the mounting plate. According to the multi-layer high-density circuit board, the main body is clamped on the left side of the stand column, the abutting block can be pulled and the abutting plate can be driven to move rightwards before the main body is stabilized, then the main body can be placed on the left side of the stand column, and after the main body is clamped and further stabilized, the abutting block can be loosened, so that the main body is prevented from being damaged. Through the abutting spring fixedly installed between the abutting column and the abutting plate and the springback effect of the telescopic rod, the problem of how to stably install and use the main body is effectively solved, the effect of being more stable and convenient during installation can be achieved, overall use in practice is facilitated, and the use efficiency in practice is also facilitated to be improved.

Description

Technical Field

[0001] The utility model relates to the technical field of circuit boards, in particular to a multi-layer high-density circuit board. Background Art

[0002] Circuit board PCB is the abbreviation of printed circuit board. Usually, a conductive pattern made of printed circuits, printed components or a combination of the two on an insulating material according to a predetermined design is called a printed circuit, and a conductive pattern that provides electrical connection between components on an insulating substrate is called a printed circuit. In this way, the finished board of a printed circuit or printed circuit is called a printed wiring board, also known as a printed board or printed circuit board.

[0003] According to a multi-layer high-density circuit board with application number CN202220852298.9, this solution solves the problem of how to improve the multi-sided heat dissipation performance of the multi-layer circuit board so that the multi-layer circuit board can be used more stably.

[0004] However, the following problems still exist in actual use:

[0005] (1) When the circuit board is integrated and installed, the use of the pushing rod, the limit pressure block and the pushing spring will cause the overall installation effect to be poor, and it cannot be installed more efficiently and stably, which will reduce the overall use effect in practice and is not conducive to its efficient use in practice.

[0006] (2) When cooling the circuit board, heat sinks and heat sinks are used, but the actual heat dissipation effect is poor. The circuit board generates high heat during use, which reduces its overall service life.

[0007] For this reason, the utility model launches a multi-layer high-density circuit board. Utility Model Content

[0008] In view of the deficiencies in the prior art, the utility model provides a multi-layer high-density circuit board, which has the advantages of convenient installation and efficient heat dissipation, and solves the problems raised in the background technology.

[0009] The utility model provides the following technical solution: a multi-layer high-density circuit board, comprising a mounting plate and a main body, the upper surface of the mounting plate is provided with a mounting mechanism, the mounting mechanism comprises a column, a T-shaped connecting block, an abutment block and an abutment column, the bottom of the column is fixedly connected to the upper surface of the mounting plate, the left side of the T-shaped connecting block abuts against the right side of the column, the left side of the abutment block abuts against the right side of the T-shaped connecting block, and one end of the abutment column is fixedly connected to the left side of the abutment block.

[0010] Preferably, a heat dissipation mechanism is provided at the bottom of the main body, and the heat dissipation mechanism includes a first heat dissipation metal sheet, a second heat dissipation metal sheet and a cross plate, the upper surface of the first heat dissipation metal sheet abuts against the lower surface of the main body, the upper surface of the second heat dissipation metal sheet abuts against the lower surface of the main body, and both sides of the second heat dissipation metal sheet are clamped with the inside of the first heat dissipation metal sheet, the upper surface of the cross plate abuts against the lower surface of the first heat dissipation metal sheet, and the upper surface of the cross plate abuts against the lower surface of the T-shaped connecting block.

[0011] Preferably, an abutment spring is fixedly installed on one end of the abutment column, a telescopic rod is fixedly installed on one end of the abutment column, an abutment plate is fixedly installed on one end of the abutment spring, and the right side of the abutment plate is fixedly connected to one end of the telescopic rod, and the left side of the abutment plate abuts against the right side of the main body.

[0012] Preferably, the internal thread of the T-shaped connecting block is connected with a fixing bolt, and the outer surface of the fixing bolt is connected with the internal thread of the column.

[0013] Preferably, mounting grooves are provided around the inside of the mounting plate, and a heat dissipation groove is provided inside the mounting plate.

[0014] Preferably, the internal thread of the horizontal plate is connected to a first fixing screw, and the outer surface of the first fixing screw is connected to the internal thread of the T-shaped connecting block, the internal thread of the horizontal plate is connected to a second fixing screw, and the outer surface of the second fixing screw is connected to the internal thread of the first heat dissipation metal plate.

[0015] Compared with the prior art, the utility model has the following beneficial effects:

[0016] 1. This kind of multi-layer high-density circuit board, through the use of the installation mechanism, when this kind of multi-layer high-density circuit board is in use, when the main body is stably installed, the main body is first clamped on the left side of the column, before the main body is stabilized, the abutment block can be pulled to drive the abutment plate to move right, and then the main body can be placed on the left side of the column. After the main body is clamped, it can be further stabilized by loosening the abutment block. Through the fixed installation of the abutment spring between the abutment column and the abutment plate and the rebound effect of the telescopic rod, the main body can be stably abutted again to ensure the stability of the main body when in use, effectively solving the problem of how to stably install and use the main body, and achieving a more stable and convenient effect during installation, which is beneficial to the overall use in practice and also conducive to improving its actual use efficiency.

[0017] 2. This kind of multi-layer high-density circuit board, through the use of the heat dissipation mechanism, when this kind of multi-layer high-density circuit board is in use, when the main body is in use to dissipate heat, first, the two sides inside the horizontal plate are threadedly connected with the first fixing screw and the second fixing screw respectively, and the position of the first heat dissipation metal sheet and the second heat dissipation metal sheet is stabilized, and then when the main body is in use to dissipate heat, it can be more efficient, effectively solve the problem of how to dissipate heat when the main body is in use, can achieve a more efficient effect in heat dissipation, and can avoid the effect of reducing the service life of the main body due to high temperature, and can be promoted and used in practice. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0019] Figure 2 For this utility model Figure 1 Schematic diagram of the structure viewed from above;

[0020] Figure 3 For this utility model Figure 1 Schematic diagram of the installation mechanism structure;

[0021] Figure 4 For this utility model Figure 1 Schematic diagram of the heat dissipation mechanism structure.

[0022] In the figure: 1. mounting plate; 2. column; 3. mounting groove; 4. main body; 5. T-shaped connecting block; 6. fixing bolt; 7. abutment block; 8. abutment column; 9. abutment spring; 10. telescopic rod; 11. abutment plate; 12. heat dissipation groove; 13. first heat dissipation metal sheet; 14. second heat dissipation metal sheet; 15. heat dissipation mechanism; 16. horizontal plate; 17. first fixing screw; 18. second fixing screw; 19. mounting mechanism. DETAILED DESCRIPTION

[0023] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0024] See also Figure 3A multi-layer high-density circuit board includes a mounting plate 1 and a main body 4. A mounting mechanism 19 is provided on the upper surface of the mounting plate 1. The mounting mechanism 19 includes a column 2, a T-shaped connecting block 5, an abutting block 7 and an abutting column 8. The bottom of the column 2 is fixedly connected to the upper surface of the mounting plate 1. The left side of the T-shaped connecting block 5 abuts against the right side of the column 2. The left side of the abutting block 7 abuts against the right side of the T-shaped connecting block 5. One end of the abutting column 8 is fixedly connected to the left side of the abutting block 7. An abutting spring is fixedly installed on one end of the abutting column 8. 9, a telescopic rod 10 is fixedly installed at one end of the abutment column 8, an abutment plate 11 is fixedly installed at one end of the abutment spring 9, and the right side of the abutment plate 11 is fixedly connected to one end of the telescopic rod 10, and the left side of the abutment plate 11 abuts against the right side of the main body 4. Through the use of the column 2, the T-shaped connecting block 5, the abutment block 7 and the abutment column 8 as well as the abutment spring 9 and the telescopic rod 10, a more stable and convenient effect can be achieved during installation, which is beneficial to the actual use of the whole and also beneficial to improving its actual use efficiency.

[0025] See also Figure 4 A heat dissipation mechanism 15 is provided at the bottom of the main body 4, and the heat dissipation mechanism 15 includes a first heat dissipation metal sheet 13, a second heat dissipation metal sheet 14 and a transverse plate 16. The upper surface of the first heat dissipation metal sheet 13 abuts against the lower surface of the main body 4, the upper surface of the second heat dissipation metal sheet 14 abuts against the lower surface of the main body 4, and both sides of the second heat dissipation metal sheet 14 are clamped with the inside of the first heat dissipation metal sheet 13, the upper surface of the transverse plate 16 abuts against the lower surface of the first heat dissipation metal sheet 13, and the upper surface of the transverse plate 16 abuts against the lower surface of the T-shaped connecting block 5, and the transverse plate 16 The internal thread of the first fixing screw 17 is connected, and the outer surface of the first fixing screw 17 is connected to the internal thread of the T-shaped connecting block 5, the internal thread of the cross plate 16 is connected to the second fixing screw 18, and the outer surface of the second fixing screw 18 is connected to the internal thread of the first heat dissipation metal sheet 13. By using the first heat dissipation metal sheet 13, the second heat dissipation metal sheet 14 and the cross plate 16, a more efficient effect in heat dissipation can be achieved, and the effect of reducing the service life of the main body 4 due to high temperature can be avoided, and it can be promoted and used in practice.

[0026] See also Figure 1 and Figure 2 The internal thread of the T-shaped connecting block 5 is connected with a fixing bolt 6, and the outer surface of the fixing bolt 6 is connected with the internal thread of the column 2. The mounting plate 1 is provided with mounting grooves 3 all around to facilitate a more stable installation and use of the whole. The mounting plate 1 is provided with a heat dissipation groove 12 inside, which can be used for further heat dissipation when the main body 4 is in use.

[0027] Working principle: during use, when installing the main body 4, the T-shaped connecting block 5 is installed on the right side of the column 2 through the action of the fixing bolt 6, and then the main body 4 can be clamped on the left side of the column 2. Before stabilizing the main body 4, the abutment block 7 can be pulled to drive the abutment plate 11 to move rightward, and then the main body 4 can be placed on the left side of the column 2. After the main body 4 is clamped, when it is further stabilized, the abutment block 7 can be loosened, and the abutment spring 9 fixedly installed between the abutment column 8 and the abutment plate 11 and the rebound effect of the telescopic rod 10 can be used to stably abut the main body 4 again.

[0028] When the main body 4 is used for heat dissipation, the first heat dissipation metal sheet 13 and the second heat dissipation metal sheet 14 are placed on the lower surface of the main body 4. After placement, the upper surface of the cross plate 16 can be abutted against the bottom of the first heat dissipation metal sheet 13 and the bottom of the T-shaped connecting block 5. After abutment, the two sides inside the cross plate 16 can be threadedly connected with the first fixing screw 17 and the second fixing screw 18 respectively to stabilize the position of the first heat dissipation metal sheet 13 and the second heat dissipation metal sheet 14, so that when the main body 4 is used to dissipate heat, it can be more efficient, and when the main body 4 is in use, the heat can be efficiently removed through the action of the heat dissipation groove 12.

[0029] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.

[0030] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A multi-layer high-density circuit board, characterized in that: The invention comprises a mounting plate (1) and a main body (4); the upper surface of the mounting plate (1) is provided with a mounting mechanism (19); the mounting mechanism (19) comprises a column (2), a T-shaped connecting block (5), an abutting block (7) and an abutting column (8); the bottom of the column (2) is fixedly connected to the upper surface of the mounting plate (1); the left side of the T-shaped connecting block (5) abuts against the right side of the column (2); the left side of the abutting block (7) abuts against the right side of the T-shaped connecting block (5); and one end of the abutting column (8) is fixedly connected to the left side of the abutting block (7).

2. A multi-layer high-density circuit board according to claim 1, characterized in that: A heat dissipation mechanism (15) is provided at the bottom of the main body (4), and the heat dissipation mechanism (15) comprises a first heat dissipation metal sheet (13), a second heat dissipation metal sheet (14) and a transverse plate (16); the upper surface of the first heat dissipation metal sheet (13) abuts against the lower surface of the main body (4), the upper surface of the second heat dissipation metal sheet (14) abuts against the lower surface of the main body (4), and both sides of the second heat dissipation metal sheet (14) are clamped with the inside of the first heat dissipation metal sheet (13); the upper surface of the transverse plate (16) abuts against the lower surface of the first heat dissipation metal sheet (13), and the upper surface of the transverse plate (16) abuts against the lower surface of the T-shaped connecting block (5).

3. A multi-layer high-density circuit board according to claim 1, characterized in that: An abutment spring (9) is fixedly mounted on one end of the abutment column (8), a telescopic rod (10) is fixedly mounted on one end of the abutment column (8), an abutment plate (11) is fixedly mounted on one end of the abutment spring (9), and the right side of the abutment plate (11) is fixedly connected to one end of the telescopic rod (10), and the left side of the abutment plate (11) abuts against the right side of the main body (4).

4. A multi-layer high-density circuit board according to claim 1, characterized in that: The internal thread of the T-shaped connection block (5) is connected to a fixing bolt (6), and the outer surface of the fixing bolt (6) is connected to the internal thread of the column (2).

5. The multi-layer high-density circuit board according to claim 1, characterized in that: The mounting plate (1) is provided with mounting grooves (3) on all four sides thereof, and the mounting plate (1) is provided with a heat dissipation groove (12) therein.

6. A multi-layer high-density circuit board according to claim 2, characterized in that: The internal thread of the transverse plate (16) is connected to a first fixing screw (17), and the outer surface of the first fixing screw (17) is connected to the internal thread of the T-shaped connecting block (5); the internal thread of the transverse plate (16) is connected to a second fixing screw (18), and the outer surface of the second fixing screw (18) is connected to the internal thread of the first heat dissipation metal plate (13).

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