Wafer soldering equipment for solar photovoltaic panel
By designing a wafer soldering equipment including a hydraulic cylinder, an electric conductor and an adjustable positioning device, the existing equipment has solved the problem of welding multiple tin wires and adapting to wafers of different specifications, and achieved flexible tin wire positioning and efficient welding process.
Patent Information
- Application Number
- CN202420967546.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-05-07
- Publication Date
- 2025-03-11
- Estimated Expiration
- 2034-05-07
AI Technical Summary
When the chip soldering equipment of existing solar photovoltaic panels is soldered at the same time, it is difficult to adjust the distance between the tin lines, and it is difficult to adapt to chip soldering of different specifications.
A soldering device including a base plate, a processing table, a work frame, a guide column, a guide plate, a heater, a hydraulic cylinder and an adjustable positioning device are designed. The positioning and adjustment of the tin wire can be achieved through the expansion and contraction of the hydraulic cylinder and the movement of the electric guide block; the adjustable positioning device can be used to adapt to wafers of different specifications.
It realizes flexible adjustment of the distance between multiple tin wires, improves soldering efficiency, and can adapt to wafer welding of different specifications, improving the flexibility and efficiency of equipment use.
Smart Images

Figure CN222588350U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of soldering equipment, in particular to a chip soldering equipment for a solar photovoltaic panel. Background Art
[0002] Photovoltaic panel wafer is a semiconductor material, mainly made of semiconductor materials such as silicon and gallium arsenic. Among them, silicon is the most commonly used material, mainly used in solar photovoltaic panels. In the wafer processing process of solar photovoltaic panels, soldering work needs to be performed, such as patent application number CN201611153207.8, an automatic soldering machine, including a feeding device, a solar photovoltaic module junction box adsorption device, a bracket for supporting the adsorption device, and an operating platform for soldering, wherein the feeding device includes: two columns with guide rails, a plurality of horizontal support plates located in the guide rails, and a solar photovoltaic module junction box placement plate arranged on the horizontal support plate; the adsorption device includes: a negative pressure adsorption plate for adsorbing the solar photovoltaic module junction box, a negative pressure generating device, and a pull rod connecting the negative pressure adsorption plate and the bracket; the negative pressure adsorption plate has a number of small holes, and the negative pressure generating device connects the several small holes through a pipeline. The present invention can adjust the size of the negative pressure adsorption plate according to the size of the junction box to be welded, and solder; the rotating horizontal support plate can drive the junction box with solder to move upward to achieve automatic feeding. The whole process of automatic soldering is realized, and the processing speed is improved. When several solder wires are soldered at the same time, it is difficult to position and adjust the distance between the several solder wires, and it is not easy to solder chips of different specifications. Utility Model Content
[0003] The main purpose of the utility model is to provide a chip soldering device for solar photovoltaic panels, which can effectively solve the problem in the background technology that when several tin wires are soldered at the same time, it is difficult to position and adjust the distance between the several tin wires and it is not easy to solder chips of different specifications.
[0004] To achieve the above-mentioned purpose, the technical solution adopted by the utility model is: a wafer soldering device for a solar photovoltaic panel, comprising a bottom plate, a processing table is fixedly installed on one side of the upper surface of the bottom plate, a workbench is fixedly installed on the other side of the upper surface of the bottom plate, a plurality of guide columns are fixedly installed on the upper surface of the processing table at equal intervals, a guide plate is slidably installed in the middle of the plurality of guide columns, a heater is fixedly installed on the lower surface of the guide plate, a first hydraulic cylinder is fixedly installed on the lower surface of the first top plate, the output end of the first hydraulic cylinder is arranged on the upper surface of the guide plate, an adjustable positioning device is arranged on the upper surface of the workbench, electric guide rails are installed on both sides of the upper surface of the workbench, electric guide blocks are installed in the middle of the two electric guide rails, a support plate is installed between the upper surfaces of the two electric guide blocks, a servo motor is fixedly installed on one side of the support plate, a flip plate is installed on the output end of the servo motor, a first mounting column is fixedly installed on the upper surface of the flip plate, a first pressing plate is slidably installed in the middle of the first mounting column, a second top plate is fixedly installed on the top of the first mounting column, a second hydraulic cylinder is fixedly installed on the upper surface of the second top plate, and the output end of the second hydraulic cylinder is arranged on the upper surface of the first pressing plate.
[0005] Preferably, a positioning plate is fixedly mounted on the upper surface of the work frame, a second mounting column is fixedly mounted on the upper surface of the positioning plate, and a third top plate is fixedly mounted on the top end of the second mounting column.
[0006] Preferably, a second pressing plate is slidably mounted on the middle of the second mounting column, and a cutting knife is fixedly mounted on the lower surface of the second pressing plate.
[0007] Preferably, a third hydraulic cylinder is fixedly mounted on the upper surface of the third top plate, and an output end of the third hydraulic cylinder is arranged on the upper surface of the second pressure plate.
[0008] Preferably, the adjustable positioning device comprises two clamping plates, and the two clamping plates are respectively fixedly mounted on both sides of the upper surface of the working frame.
[0009] Preferably, a screw is fixedly installed between the two clamping plates, a plurality of screw sleeves are sleeved and installed in the middle of the screw, and a sliding column is fixedly installed between the two clamping plates.
[0010] Preferably, a slide groove is provided on the side of each screw sleeve, and a sliding block is slidably installed inside the slide groove.
[0011] Preferably, a limiting column is fixedly mounted on the upper surface of the sliding block, the limiting column is slidably mounted in the middle of the sliding column, and a through tube is fixedly mounted on the upper end of the limiting column.
[0012] Compared with the prior art, the utility model has the following beneficial effects:
[0013] (1) The staff rotates the screw sleeve to move the screw sleeve in the middle of the screw rod, so that the distance between the several tubes can be adjusted. At this time, the tin wire is passed through the middle of the tube, so that the distance between the several tin wires is the same as the distance between the several tubes. In this way, this device can arbitrarily position the positions of the several tin wires and can arbitrarily adjust the distance between the several tin wires. The several tin wires can be set on the surface of several solar photovoltaic panels of different specifications. The soldering efficiency of this device is improved.
[0014] (2) The output end of the second hydraulic cylinder is extended and retracted to move the first pressure plate downward, and the top end of the tin wire is fixedly set between the first pressure plate and the surface of the flip plate to position the top end of the tin wire. At this time, the electric guide block is moved in the middle of the electric guide rail, and the tin wire can be driven to move forward. When the tin wire is pulled a suitable distance, the output end of the third hydraulic cylinder is extended and retracted to move the second pressure plate downward, so that the cutting knife moves downward to cut the tin wire. BRIEF DESCRIPTION OF THE DRAWINGS
[0015] Figure 1 This is a schematic structural diagram of a wafer soldering device for a solar photovoltaic panel according to the utility model;
[0016] Figure 2 It is a side view structural schematic diagram of a wafer soldering device for a solar photovoltaic panel according to the utility model;
[0017] Figure 3 This is a schematic diagram of the enlarged structure of position A of a wafer soldering device for a solar photovoltaic panel according to the utility model;
[0018] Figure 4 This is a schematic diagram of the enlarged structure of position B of a wafer soldering device for a solar photovoltaic panel according to the utility model.
[0019] In the figure: 1, bottom plate; 2, processing table; 3, guide plate; 4, heater; 5, guide column; 6, first top plate; 7, first hydraulic cylinder; 8, work frame; 9, adjustable positioning; 901, clamping plate; 902, screw; 903, screw sleeve; 904, slide groove; 905, slider; 906, limit column; 907, slide column; 908, tube; 10, positioning plate; 11, electric guide rail; 12, electric guide block; 13, second hydraulic cylinder; 14, third hydraulic cylinder; 15, support plate; 16, servo motor; 17, flip plate; 18, first mounting column; 19, second top plate; 20, first pressure plate; 21, third top plate; 22, second mounting column; 23, cutting knife; 24, second pressure plate. DETAILED DESCRIPTION
[0020] The following will be combined with the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.
[0021] like Figure 1 , 2 As shown in , 4, a wafer soldering device for a solar photovoltaic panel comprises a bottom plate 1, a processing table 2 is fixedly installed on one side of the upper surface of the bottom plate 1, a work frame 8 is fixedly installed on the other side of the upper surface of the bottom plate 1, a plurality of guide columns 5 are fixedly installed on the upper surface of the processing table 2 at equal intervals, a guide plate 3 is slidably installed in the middle of the plurality of guide columns 5, a heater 4 is fixedly installed on the lower surface of the guide plate 3, a first hydraulic cylinder 7 is fixedly installed on the lower surface of the first top plate 6, an output end of the first hydraulic cylinder 7 is arranged on the upper surface of the guide plate 3, an adjustable positioning device 9 is arranged on the upper surface of the work frame 8, and electric positioning devices are installed on both sides of the upper surface of the work frame 8. Guide rail 11, an electric guide block 12 is installed in the middle of the two electric guide rails 11, a support plate 15 is installed between the upper surfaces of the two electric guide blocks 12, a servo motor 16 is fixedly installed on one side of the support plate 15, a flip plate 17 is installed at the output end of the servo motor 16, a first mounting column 18 is fixedly installed on the upper surface of the flip plate 17, a first pressure plate 20 is slidably installed in the middle of the first mounting column 18, a second top plate 19 is fixedly installed on the top of the first mounting column 18, a second hydraulic cylinder 13 is fixedly installed on the upper surface of the second top plate 19, and the output end of the second hydraulic cylinder 13 is arranged on the upper surface of the first pressure plate 20.
[0022] like Figure 1 , 2 As shown in , 4, a positioning plate 10 is fixedly installed on the upper surface of the working frame 8, and a second mounting column 22 is fixedly installed on the upper surface of the positioning plate 10, and a third top plate 21 is fixedly installed on the top of the second mounting column 22, and a second pressing plate 24 is slidably installed in the middle of the second mounting column 22, and a cutting knife 23 is fixedly installed on the lower surface of the second pressing plate 24, and a third hydraulic cylinder 14 is fixedly installed on the upper surface of the third top plate 21, and the output end of the third hydraulic cylinder 14 is arranged on the upper surface of the second pressing plate 24, and the top end of the tin wire is fixedly arranged between the first pressing plate 20 and the surface of the flip plate 17, so as to position the top end of the tin wire, and at this time, the electric guide block 12 is moved in the middle of the electric guide rail 11, and at this time, the tin wire can be driven to move forward, and when the tin wire is pulled a suitable distance, the output end of the third hydraulic cylinder 14 is extended and retracted to make the second pressing plate 24 move downward, and the cutting knife 23 moves downward to cut the tin wire.
[0023] like Figure 2 , 3 As shown in 4, the adjustable positioning 9 includes two card plates 901, and the two card plates 901 are fixedly mounted on both sides of the upper surface of the working frame 8, a screw rod 902 is fixedly mounted between the two card plates 901, and a plurality of screw sleeves 903 are sleeved and mounted in the middle of the screw 902, and a slide column 907 is fixedly mounted between the two card plates 901, and a slide groove 904 is provided on the side of each screw sleeve 903, and a slider 905 is slidably mounted inside the slide groove 904, and a limit column 906 is fixedly mounted on the upper surface of the slider 905, and the limit column 906 is slidably mounted on In the middle of the sliding column 907, the upper end of the limit column 906 is fixedly installed with a through-tube 908. The staff rotates the screw sleeve 903 to move the screw sleeve 903 in the middle of the screw rod 902, so that the distance between several through-tubes 908 can be adjusted. At this time, the tin wire is passed through the middle of the through-tube 908 to make the distance between several tin wires the same as the distance between several through-tubes 908. In this way, this device can arbitrarily position the positions of several tin wires, and can arbitrarily adjust the distance between several tin wires, so that several tin wires can be set on the upper surface of several solar photovoltaic panels of different specifications. The soldering efficiency of this device is improved.
[0024] The working principle of this solar photovoltaic panel wafer soldering equipment:
[0025] When in use, first place the wafers that need soldering equidistantly on the upper surface of the processing table 2. At this time, the top of the tin wire is equidistantly passed through the middle of the plurality of threading tubes 908, and then passed through the lower surface of the cutting knife 23, so that the top of the tin wire is set on the surface of the flip plate 17. At this time, the output end of the second hydraulic cylinder 13 is extended and retracted to make the first pressing plate 20 move downward, and the top of the tin wire is fixedly set between the first pressing plate 20 and the surface of the flip plate 17, so as to position the top of the tin wire. At this time, the electric guide block 12 is moved in the middle of the electric guide rail 11, and the tin wire can be driven to move forward. When the tin wire is pulled a suitable distance, the output end of the third hydraulic cylinder 14 is extended and retracted to make the second pressing plate 24 move downward, so that the cutting knife 23 moves downward to cut the tin wire. At this time, the flip plate 17 is driven to rotate by the output end of the servo motor 16, so that the cut end of the tin wire can be flipped to the front. At this time, the electric guide block 12 is moved in the middle of the electric guide rail 11 to move the tin wire forward. The tin wire is moved to the surface of the wafer, and the first pressing plate 20 is separated from the surface of the flip plate 17. At this time, the output end of the first hydraulic cylinder 7 is extended and retracted, and the guide plate 3 can be driven to move downward, and the heater 4 can be driven to move downward, so that the heater 4 moves downward and presses on the upper surface of the wafer and the tin wire. The tin wire is soldered to the surface of the wafer by the heat emitted by the heater 4, so as to perform soldering work. When the distance between several tin wires needs to be adjusted, when soldering wafers of different specifications, the staff rotates the screw sleeve 903 to move the screw sleeve 903 in the middle of the screw rod 902, so that the distance between several threading tubes 908 can be adjusted. At this time, the tin wire is passed through the middle of the threading tube 908, so that the distance between several tin wires is the same as the distance between several threading tubes 908. This device can arbitrarily position the positions between several tin wires, and can arbitrarily adjust the distance between several tin wires, so that several tin wires can be set on the upper surface of several wafers of different specifications. The soldering efficiency of this device is improved.
[0026] The above embodiments of the present invention are merely examples for clearly illustrating the present invention, and are not limitations on the implementation methods of the present invention. For ordinary technicians in the relevant field, other different forms of changes or modifications can be made based on the above description. It is impossible to list all the implementation methods here. All obvious changes or modifications derived from the technical solution of the present invention are still within the scope of protection of the present invention.
Claims
1. A wafer soldering device for a solar photovoltaic panel, comprising a base plate (1), characterized in that: A processing table (2) is fixedly mounted on one side of the upper surface of the bottom plate (1), and a working frame (8) is fixedly mounted on the other side of the upper surface of the bottom plate (1). A plurality of guide columns (5) are fixedly mounted on the upper surface of the processing table (2) at equal intervals, and a guide plate (3) is slidably mounted in the middle of the plurality of guide columns (5). A heater (4) is fixedly mounted on the lower surface of the guide plate (3). A first hydraulic cylinder (7) is fixedly mounted on the lower surface of the first top plate (6), and an output end of the first hydraulic cylinder (7) is arranged on the upper surface of the guide plate (3). An adjustable positioning positioner (9) is arranged on the upper surface of the working frame (8). Electric guide rails (11) are mounted on both sides of the upper surface of the working frame (8), and the two electric guide rails ( 11) are both equipped with electric guide blocks (12) in the middle, a support plate (15) is installed between the upper surfaces of the two electric guide blocks (12), a servo motor (16) is fixedly installed on one side of the support plate (15), a flip plate (17) is installed on the output end of the servo motor (16), a first mounting column (18) is fixedly installed on the upper surface of the flip plate (17), a first pressure plate (20) is slidably installed in the middle of the first mounting column (18), a second top plate (19) is fixedly installed on the top of the first mounting column (18), a second hydraulic cylinder (13) is fixedly installed on the upper surface of the second top plate (19), and the output end of the second hydraulic cylinder (13) is arranged on the upper surface of the first pressure plate (20).
2. The wafer soldering equipment for solar photovoltaic panels according to claim 1, characterized in that: A positioning plate (10) is fixedly mounted on the upper surface of the working frame (8), a second mounting column (22) is fixedly mounted on the upper surface of the positioning plate (10), and a third top plate (21) is fixedly mounted on the top of the second mounting column (22).
3. The wafer soldering equipment for solar photovoltaic panels according to claim 2, characterized in that: A second pressing plate (24) is slidably mounted on the middle of the second mounting column (22), and a cutting knife (23) is fixedly mounted on the lower surface of the second pressing plate (24).
4. The wafer soldering equipment for solar photovoltaic panels according to claim 3, characterized in that: A third hydraulic cylinder (14) is fixedly mounted on the upper surface of the third top plate (21), and an output end of the third hydraulic cylinder (14) is arranged on the upper surface of the second pressing plate (24).
5. The wafer soldering equipment for solar photovoltaic panels according to claim 1, characterized in that: The adjustable positioning device (9) comprises two clamping plates (901), and the two clamping plates (901) are respectively fixedly mounted on two sides of the upper surface of the working frame (8).
6. The wafer soldering equipment for solar photovoltaic panels according to claim 5, characterized in that: A screw rod (902) is fixedly installed between the two clamping plates (901), a plurality of screw sleeves (903) are sleeved and installed in the middle of the screw rod (902), and a sliding column (907) is fixedly installed between the two clamping plates (901).
7. The wafer soldering equipment for solar photovoltaic panels according to claim 6, characterized in that; A sliding groove (904) is provided on the side of each screw sleeve (903), and a sliding block (905) is slidably installed inside the sliding groove (904).
8. The wafer soldering equipment for solar photovoltaic panels according to claim 7, characterized in that: A limiting column (906) is fixedly mounted on the upper surface of the sliding block (905), the limiting column (906) is slidably mounted on the middle of the sliding column (907), and a through tube (908) is fixedly mounted on the upper end of the limiting column (906).
Citation Information
Patent Citations
Automatic soldering machine
CN106624254A