Computing device
By designing the relative positions of fan components and circuit boards in computing devices, and using the design of multiple air outlets and air guides, the safety hazards of fan components are solved, achieving higher safety and heat dissipation efficiency.
Patent Information
- Application Number
- CN202323392183.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2023-12-12
- Publication Date
- 2025-03-11
- Estimated Expiration
- 2033-12-12
AI Technical Summary
The fan components in existing computing devices pose safety risks, and users may be injured due to accidental contact.
A computing device is designed with a fan assembly located in the air duct and a circuit board located in the downwind direction, which dissipates heat through the air duct formed by the air inlet and the air outlet. At the same time, multiple air outlets and air guides are used to improve heat dissipation efficiency and safety.
It effectively improves the overall safety of computing devices, avoids the risk of users being injured by mistakenly touching fan components, and improves the heat dissipation efficiency and the overall structural compactness of the equipment.
Smart Images

Figure CN222600133U_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the technical field of electronic equipment, and in particular to a computing device. Background Art
[0002] In the related art, a fan assembly is usually arranged outside the housing of an electronic device such as a computing device to form an air duct for air to flow through, thereby removing the heat generated by the working components inside the electronic device. However, the fan assembly arranged in this way has a safety hazard, and the user is prone to the risk of injury if he accidentally touches the fan assembly. Utility Model Content
[0003] The embodiments of the present application provide a computing device to solve or alleviate one or more technical problems in the prior art.
[0004] As one aspect of an embodiment of the present application, the embodiment of the present application provides a computing device, including: a shell, a duct with an air inlet and an air outlet is defined in the shell; a circuit board is arranged in the air duct; a fan assembly is arranged in the air duct, and along the wind direction in the air duct, the fan assembly is located in the upwind direction and the circuit board is located in the downwind direction; the fan assembly includes at least one fan module, and the axial direction of the fan module is parallel to the wind direction in the air duct.
[0005] In one embodiment, there are multiple air outlets; wherein the extension direction of the multiple air outlets is the same; or, the multiple air outlets are divided into a first air outlet group and a second air outlet group, and the extension direction of the air outlets in the first air outlet group is different from the extension direction of the air outlets in the second air outlet group.
[0006] In one embodiment, the computing device further includes: an air inlet guide, which is arranged on a side of the fan assembly facing away from the circuit board, and the air inlet is arranged on the air inlet guide; an air outlet guide, which is arranged on a side of the circuit board facing away from the fan assembly, and the air outlet is arranged on the air outlet guide.
[0007] In one embodiment, a first magnetic component is provided on the shell, and a second magnetic component is provided on the air inlet guide member and / or the air outlet guide member, and the first magnetic component is magnetically connected to the second magnetic component.
[0008] In one embodiment, the computing device further includes: a control bracket connected to the housing; and a control module connected to the control bracket.
[0009] In one embodiment, the control bracket includes a first connecting plate and a second connecting plate connected to each other, the first connecting plate and the second connecting plate form an angle, the control module is connected to the first connecting plate, and the second connecting plate is connected to the shell.
[0010] In one embodiment, the computing device further includes a display component connected to the second connection board.
[0011] In one embodiment, a switch controller and a display switching controller are disposed on the control bracket, wherein the switch controller corresponds to a first button portion disposed on the shell, and the display switching controller corresponds to a second button portion disposed on the shell.
[0012] In one embodiment, the fan assembly further includes a fan bracket, the fan module is disposed on the fan bracket, and the fan bracket is connected to the housing.
[0013] In one embodiment, a vibration absorbing pad is disposed at the bottom of the fan bracket.
[0014] In one embodiment, the fan bracket includes: a mounting back, to which the fan module is connected; a mounting bottom, which is arranged at the bottom of the fan module; and two mounting sides, which are respectively located at two ends of the mounting bottom.
[0015] In one embodiment, the computing device further includes: a control module electrically connected to the fan assembly and the circuit board, wherein the control module is connected to one of the two mounting sides.
[0016] In one embodiment, the mounting bottom includes a bottom plate and a flange connected to the bottom plate, the flange is arranged close to the circuit board, and the flange is located between the bottom plate and the bottom plate of the housing.
[0017] In one embodiment, the installation bottom defines a wiring groove, and the wiring groove is formed by a portion of the installation bottom being recessed toward the bottom plate of the housing.
[0018] In one embodiment, the computing device also includes: a first air duct member and a second air duct member connected to the fan bracket, the first air duct member and the second air duct member are respectively located on both sides of the fan module in the radial direction; the bottom of the first air duct member and / or the second air duct member is bonded to the bottom plate of the shell through a flexible adhesive.
[0019] In one embodiment, a filter device is provided between the fan assembly and the air inlet.
[0020] In one embodiment, at least one fan mounting hole is formed on the housing; at least one fan module is arranged in one-to-one correspondence with the at least one fan mounting hole, and each fan module is connected to the housing.
[0021] In one embodiment, the computing device further includes: a third air duct member and a fourth air duct member, the third air duct member and the fourth air duct member are respectively located on both sides of the fan module in the radial direction; the third air duct member and / or the fourth air duct member are connected to the top plate of the shell.
[0022] In one embodiment, the computing device further includes: a fifth air duct member and a sixth air duct member, the fifth air duct member and the sixth air duct member are respectively located on both sides of the fan module in the radial direction; the fifth air duct member and / or the sixth air duct member are connected to the bottom plate of the shell.
[0023] In one embodiment, the housing further includes a mounting position, in which a display assembly is mounted.
[0024] In one embodiment, the computing device further includes a pressure plate, which is fixedly connected to the housing, and the display assembly is pressed between the pressure plate and the inner wall of the housing.
[0025] In one embodiment, a mounting groove is provided on the housing, and a light emitting element and / or a light guiding element is provided in the mounting groove.
[0026] In one embodiment, the circuit board includes a first surface and a second surface that are arranged opposite to each other, and a plurality of heat-generating components are arranged in an array on the first surface.
[0027] In one embodiment, the areas of the plurality of heat-generating components are equal, and / or the device types of the plurality of heat-generating components are the same.
[0028] In one embodiment, the computing device further includes a heat sink, and the heat sink is disposed on the first surface and / or the second surface.
[0029] In one embodiment, the radiator includes a liquid cooling tube and a plurality of heat dissipating fins arranged at intervals, the extension direction of each heat dissipating fin is the same as the wind direction in the air duct, and the liquid cooling tube is passed through the plurality of heat dissipating fins along the arrangement direction of the plurality of heat dissipating fins.
[0030] In one embodiment, a top plate of the housing is provided with a reinforcing rib, the reinforcing rib is located between the fan assembly and the circuit board, and the reinforcing rib covers a portion of a side surface of the radiator.
[0031] In one embodiment, the heat sink includes a first heat sink and a second heat sink, the first heat sink is arranged on the first surface, and the second heat sink is arranged on the second surface; along the arrangement direction of the plurality of heat sink fins, the size of the second heat sink is larger than the size of the first heat sink.
[0032] In one embodiment, the second heat sink is connected to the housing via fasteners.
[0033] In one embodiment, the second heat sink is used to support the weight of the circuit board and the first heat sink.
[0034] In one embodiment, the top of the air inlet, the top of the air outlet, and the top of the radiator are flush with each other, and the bottom of the air inlet, the bottom of the air outlet, and the bottom of the radiator are flush with each other.
[0035] In one embodiment, the air outlet is connected to a heat recovery system.
[0036] The embodiment of the present application adopts the above technical solution to improve the overall safety of the computing device and avoid the risk of injury due to the user accidentally touching the fan assembly.
[0037] The above summary is for illustrative purposes only and is not intended to be limiting in any way. In addition to the illustrative aspects, embodiments and features described above, further aspects, embodiments and features of the present application will be readily apparent by reference to the accompanying drawings and the following detailed description. BRIEF DESCRIPTION OF THE DRAWINGS
[0038] In the accompanying drawings, unless otherwise specified, the same reference numerals throughout the multiple drawings represent the same or similar parts or elements. These drawings are not necessarily drawn to scale. It should be understood that these drawings only depict some embodiments disclosed in the present application and should not be regarded as limiting the scope of the present application.
[0039] Figure 1 and Figure 2 A schematic diagram showing a three-dimensional structure of a computing device according to an embodiment of the present application is shown;
[0040] Figure 3 and Figure 4 An exploded diagram of a computing device according to an embodiment of the present application is shown;
[0041] Figure 5-Figure 7 A schematic diagram showing a partial structure of a computing device according to an embodiment of the present application is shown;
[0042] Figure 8 A top view of a computing device according to an embodiment of the present application is shown;
[0043] Fig. 9 Shown along Figure 8 Sectional view along line AA;
[0044] Fig.10 A front view of a computing device according to another embodiment of the present application is shown;
[0045] Fig.11A A rear view of a computing device according to another embodiment of the present application is shown;
[0046] Fig. 11B A schematic diagram showing the air outlet effect according to an embodiment of the present application is shown;
[0047] Fig.12 A top view of a computing device according to another embodiment of the present application is shown;
[0048] Fig.13 A bottom view showing a computing device according to another embodiment of the present application;
[0049] Fig.14A side view showing a computing device according to another embodiment of the present application;
[0050] Fig.15 An exploded diagram of a computing device according to another embodiment of the present application is shown;
[0051] Fig.16 A schematic diagram showing a control bracket of a computing device according to another embodiment of the present application;
[0052] Figure 17-Figure 22 A partial schematic diagram of a housing of a computing device according to another embodiment of the present application is shown.
[0053] Description of reference numerals:
[0054] 10: Computing equipment;
[0055] 100: housing; 110: air inlet; 120: air outlet; 130: fan mounting hole; 140: first magnetic member; 150: mounting hole; 160: screen cover; 171: first button portion; 172: second button portion; 180: pressure plate; 190: mounting slot; 191: luminous member; 10a: reinforcing rib; 10b: data interface; 210: circuit board; 211: heating element; 220: radiator; 221: liquid cooling tube; 222: cooling fin; 300: fan assembly; 310: fan module; 320: fan bracket; 321: mounting back; 322: mounting bottom; 3221: Bottom plate; 3222: flange; 3223: wiring groove; 323: installation side; 324: vibration absorbing pad; 330: filtering device; 400: control module; 510: air duct member; 511: flexible adhesive member; 520: second air duct member; 530: third air duct member; 540: fourth air duct member; 550: fifth air duct member; 560: sixth air duct member; 610: air inlet guide member; 611: second magnetic member; 620: air outlet guide member; 700: control bracket; 710: first connecting plate; 720: second connecting plate; 721: display component; 730: switch controller; 740: display switching controller. DETAILED DESCRIPTION
[0056] In the following, only some exemplary embodiments are briefly described. As those skilled in the art will appreciate, the described embodiments may be modified in various ways without departing from the spirit or scope of the present application. Therefore, the drawings and descriptions are considered to be exemplary and non-restrictive in nature.
[0057] Combine the following Figure 1-Figure 22 A computing device according to an embodiment of the present application is described.
[0058] Figure 1 and Figure 2A schematic diagram of a three-dimensional structure of a computing device 10 according to an embodiment of the present application is shown; Figure 3 and Figure 4 FIG. 1 shows an exploded view of a computing device 10 according to an embodiment of the present application. Figure 1-Figure 4 As shown, the computing device 10 according to the embodiment of the present application includes a housing 100 , a circuit board 210 , and a fan assembly 300 .
[0059] The housing 100 defines an air duct having an air inlet 110 and an air outlet 120. The circuit board 210 and the fan assembly 300 are both disposed in the air duct. The fan assembly 300 includes at least one fan module 310, and the axial direction of the fan module 310 is parallel to the wind direction in the air duct. Along the wind direction in the air duct, the fan assembly 300 is located in the upwind direction, and the circuit board 210 is located in the downwind direction.
[0060] It should be noted that “along the wind direction in the air duct, the fan assembly 300 is located in the upwind direction, and the circuit board 210 is located in the downwind direction” means that along the wind direction in the air duct, the fan assembly 300 is located in the upwind direction relative to the circuit board 210, and the circuit board 210 is located in the downwind direction relative to the fan assembly 300. In other words, when the wind flows in the air duct, the wind passes through the fan assembly 300 first and then passes through the circuit board 210.
[0061] Among them, "upwind direction" and "downwind direction" should be understood in a broad sense in this application, and "up" and "down" do not refer to "up" and "down" in physical orientation, but refer to the relative position relationship in the wind direction in the air duct. For example: in the air duct, if the wind flows from left to right, then the left side of the air duct can be described as the upwind direction, and the right side of the air duct is the downwind direction. At this time, "the fan assembly 300 is located in the upwind direction, and the circuit board 210 is located in the downwind direction" means that the fan assembly 300 is located on the left side of the circuit board 210, and the circuit board 210 is located on the right side of the fan assembly 300. If the wind flows from bottom to top, then the lower side of the air duct can be described as the upwind direction, and the upper side of the air duct is the downwind direction. At this time, "the fan assembly 300 is located in the upwind direction, and the circuit board 210 is located in the downwind direction" means that the fan assembly 300 is located on the lower side of the circuit board 210, and the circuit board 210 is located on the upper side of the fan assembly 300.
[0062] Since the fan assembly 300 is located in the upwind direction and the circuit board 210 is located in the downwind direction, the fan assembly 300 is a blowing type. When the fan assembly 300 is running, the external cold air enters the air duct from the air inlet 110, and then flows through the fan assembly 300 and the circuit board 210 in sequence, generates heat exchange with the circuit board 210, and takes away the heat generated during the operation of the circuit board 210. Finally, the hot air flowing through the circuit board 210 flows out from the air outlet 120.
[0063] Exemplarily, the fan module 310 may be an axial flow fan, and the circuit board 210 may be located at one end of the fan module 310 in the axial direction. When the fan module 310 is working, the fan module 310 pushes air to flow in the direction from the air inlet 110 to the air outlet 120, so that cold air can flow through the circuit board 210 to achieve heat dissipation of the circuit board 210.
[0064] The air outlet 120 may be connected to a heat recovery system. Thus, while realizing the computing function of the computing device 10, the computing device 10 may be used as a heater, and the hot air output from the air outlet 120 may be reused, thereby improving energy efficiency, reducing carbon emissions, and lowering energy costs.
[0065] For example, the air outlet 120 can be connected to the indoor space or the vehicle interior space through a heat recovery system, so that the hot air output from the air outlet 120 can be used to increase the indoor or vehicle air temperature to achieve a heating function. Compared with the method of using an electric heater for heating, it can save electricity, improve resource utilization efficiency, and reduce negative impacts on the environment. Optionally, the computing device can be a small device, so that it can be placed on a desktop, which is convenient for users to heat in office scenarios.
[0066] It should be noted that the "heat recovery system" in this application should be understood in a broad sense, referring to a system for recovering heat energy. For example, when the air outlet 120 is directly connected to the indoor space to use the hot air output from the air outlet 120 for heating, the heat recovery system is the house.
[0067] According to the computing device 10 of the embodiment of the present application, the heat generated by the circuit board 210 during operation can be used to achieve the purpose of heating, thereby saving electricity and improving resource utilization efficiency. In addition, by making the circuit board 210 and the fan assembly 300 both located in the air duct, the internal structure of the computing device 10 is made more compact, the space utilization rate in the housing 100 is improved, and the shape of the computing device 10 is made more regular. At the same time, the overall safety of the computing device 10 can be improved, avoiding the risk of injury caused by the user accidentally touching the fan assembly 300.
[0068] Figure 5-Figure 7 FIG. 1 is a schematic diagram showing a partial structure of a computing device 10 according to an embodiment of the present application. In one implementation, Figure 3-Figure 7 As shown, the fan assembly 300 may further include a fan bracket 320, the fan module 310 is disposed on the fan bracket 320, and the fan bracket 320 is connected to the housing 100. For example, Figure 4-Figure 73 shows three fan modules 310, which are arranged at intervals in the length direction of the housing 100. The fan modules 310 and the circuit board 210 are arranged in the width direction of the housing 100. The radial direction of each fan module 310 is parallel to the length direction of the housing 100, and the axial direction of each fan module 310 is parallel to the width direction of the housing 100. Optionally, a vibration absorbing pad 324 may be provided at the bottom of the fan bracket 320 to absorb vibrations generated during the operation of the fan module 310.
[0069] In this embodiment, the fan module 310 can be installed on the housing 100 through the fan bracket 320, so that the installation accuracy requirement of the fan module 310 can be reduced, and the arrangement position of the fan module 310 can be more flexible.
[0070] Figure 3-Figure 7 Three fan modules 310 are shown for illustrative purposes, but after reading the technical solution of the present application, ordinary technicians can obviously understand that the solution can be applied to the technical solution of other numbers of fan modules 310, which also falls within the scope of protection of the present application.
[0071] In one embodiment, referring to Figure 3-Figure 7 The fan bracket 320 may include a mounting back 321, a mounting bottom 322 and two mounting side portions 323. The fan module 310 is connected to the mounting back 321. The mounting bottom 322 is disposed at the bottom of the fan module 310. The two mounting side portions 323 are respectively located at two ends of the mounting bottom 322.
[0072] Exemplarily, the housing 100 may include a top plate and a bottom plate that are arranged opposite to each other, two first side plates that are arranged opposite to each other, and two second side plates that are arranged opposite to each other. The top plate, the first side plate and the second side plate may constitute the overall structure of the upper shell. The second side plate is located in the axial direction of the fan assembly 300, wherein the air inlet 110 is arranged at one of the two second side plates, and the air outlet 120 is arranged at the other of the two second side plates. The mounting back 321 may be connected to the second side plate provided with the air inlet 110 by fasteners, and the mounting side portion 323 may be connected to the bottom plate by fasteners. Among them, the vibration absorbing pad 324 may be arranged at the bottom of the mounting side portion 323 to absorb the vibration generated during the operation of the fan module 310.
[0073] In this embodiment, by making the fan bracket 320 include a mounting back portion 321 , a mounting bottom portion 322 and two mounting side portions 323 , the structure of the fan bracket 320 is more stable and reliable, thereby improving the installation stability of the fan module 310 .
[0074] Figure 8 A top view of a computing device 10 according to an embodiment of the present application is shown; Fig. 9 Shown along Figure 8 In one embodiment, the combination Figure 3-Figure 9 The mounting bottom 322 may include a bottom plate 3221 and a flange 3222 connected to the bottom plate 3221, the flange 3222 being arranged close to the circuit board 210, and being located between the bottom plate 3221 and the bottom plate of the housing 100. With such an arrangement, the flange 3222 may be located in the gap between the bottom plate 3221 and the bottom plate of the housing 100, playing an effective blocking role, preventing air leakage caused by the air passing through the gap between the bottom plate 3221 and the bottom plate of the housing 100, thereby avoiding the formation of an air short circuit, ensuring that after the air flows in from the air inlet 110, it can flow through the fan and the circuit board 210 in sequence, and finally flow out from the air outlet 120.
[0075] In one embodiment, reference Figure 3-Figure 9 , the installation bottom 322 defines a wiring groove 3223, and the wiring groove 3223 is formed by a part of the installation bottom 322 being recessed toward the bottom plate of the housing 100. Exemplarily, in the case where there are multiple fan modules 310, the wiring groove 3223 extends in the arrangement direction of the multiple fan modules 310. The bottom of the wiring groove 3223 can be in contact with the bottom plate of the housing 100. Therefore, the wiring groove 3223 set in this way is conducive to the arrangement of the fan wiring, so that the fan wiring can be installed in the wiring groove 3223; on the other hand, it can block the gap between the installation bottom 322 and the bottom plate of the housing 100, so as to prevent air leakage caused by the wind passing through the gap between the installation bottom 322 and the bottom plate of the housing 100, thereby avoiding the formation of air short circuit, ensuring that after the wind flows in from the air inlet 110, it can flow through the fan and the circuit board 210 in sequence, and finally flow out from the air outlet 120.
[0076] In one embodiment, the computing device 10 may further include a control module 400 , which is electrically connected to both the fan assembly 300 and the circuit board 210 . The control module 400 may be connected to one of the two mounting sides 323 .
[0077] Exemplarily, the control module 400 may include a fan interface, which is connected to the fan module 310, so that the control board can control the operation of the fan module 310. The circuit board 210 may be provided with a first signal socket, and the control module 400 may include a second signal socket, which is connected to the second signal socket, so that the control module 400 can control the operation of the circuit board 210.
[0078] In this embodiment, by providing the above-mentioned control module 400, the control module 400 can control the operation of the circuit board 210 and the fan assembly 300, thereby ensuring the heat dissipation effect while realizing the computing function, and improving the reliability and long-term stability of the computing device 10. In addition, by connecting the control module 400 to one of the two mounting side portions 323, the arrangement of the control module 400 is more reasonable, so that the distance between the control module 400 and the fan assembly 300 and the circuit board 210 is closer, and the wiring between the control module 400 and the fan assembly 300 and between the control module 400 and the circuit board 210 is convenient.
[0079] In one embodiment, Figure 3-Figure 7 As shown, the computing device 10 may further include a first duct member 510 and a second duct member 520 connected to the fan bracket 320, and the first duct member 510 and the second duct member 520 are respectively located on both sides of the fan module 310 in the radial direction. The bottom of the first duct member 510 and / or the second duct member 520 is bonded to the bottom plate of the housing 100 by a flexible adhesive member 511. That is to say, the bottom of the first duct member 510 may be bonded to the bottom plate of the shell 100 through the flexible adhesive 511, and the bottom of the second duct member 520 may not be bonded to the bottom plate of the shell 100 through the flexible adhesive 511; or, the bottom of the second duct member 520 may be bonded to the bottom plate of the shell 100 through the flexible adhesive 511, and the bottom of the first duct member 510 may not be bonded to the bottom plate of the shell 100 through the flexible adhesive 511; it is also possible that the bottom of the first duct member 510 and the bottom of the second duct member 520 are both bonded to the bottom plate of the shell 100 through the flexible adhesive 511.
[0080] For example, in Figure 4-Figure 7 In the example of , the first duct member 510 and the second duct member 520 are arranged opposite to each other in the arrangement direction of the plurality of fan modules 310. The first duct member 510 can be connected to one of the two mounting side portions 323 by a fastener such as a bolt, and the second duct member 520 can be connected to the other of the two mounting side portions 323 by a fastener such as a bolt. The bottoms of the first duct member 510 and the second duct member 520 can be provided with a flexible adhesive member 511, so as to achieve the bonding of the first duct member 510 and the housing 100 and the bonding of the second duct member 520 and the housing 100.
[0081] In this embodiment, by setting up the first air duct member 510 and the second air duct member 520, the first air duct member 510 and the second air duct member 520 can be used to guide the airflow so that the wind flowing in from the air inlet 110 can flow from the fan module 310 to the circuit board 210, avoiding air leakage and wind cross-flow, and improving the heat dissipation effect of the circuit board 210.
[0082] In one embodiment, a filter device 330 may be provided between the fan assembly 300 and the air inlet 110. Exemplarily, the filter device 330 may include a filter screen and filter cotton, and the filter cotton is provided between the filter screen and the fan module 310. The filter screen may be fixedly connected to the fan bracket 320 by a fastener such as a screw. After the filter cotton has been used for a period of time, it may be replaced according to the degree of dirtiness of the filter cotton.
[0083] In this embodiment, by providing the above-mentioned filter device 330, after the external wind flows into the air inlet 110 under the action of the fan module 310, it can first flow through the filter device 330, and after being filtered by the filter device 330, it flows through the fan module 310 and the circuit board 210 in sequence, and finally flows out from the air outlet 120, which can ensure the cleanliness of the wind output from the air outlet 120. In addition, it can prevent external dust and other impurities from entering the fan module 310 and affecting the normal operation of the fan module 310, thereby improving the operating reliability of the fan module 310 and extending the service life of the fan module 310.
[0084] In one embodiment, at least one fan mounting hole 130 may be formed on the housing 100; at least one fan module 310 is arranged in one-to-one correspondence with at least one fan mounting hole 130, and each fan module 310 is connected to the housing 100. The difference from the above embodiment is that, Fig.17 As shown, the fan module 310 of the computing device 10 is directly connected to the housing 100 without using a fan bracket, so the structure is simpler and easy to install.
[0085] In one embodiment, Fig.15 and Fig.17 As shown, the computing device 10 may further include a third duct member 530 and a fourth duct member 540, which are respectively located on both sides of the fan module 310 in the radial direction; the third duct member 530 and / or the fourth duct member 540 are connected to the top plate of the housing 100. Exemplarily, the third duct member 530 and the fourth duct member 540 are relatively arranged in the arrangement direction of the plurality of fan modules 310. For example, the third duct member 530 and the fourth duct member 540 may be relatively arranged in the length direction of the housing 100. The third duct member 530 and the fourth duct member 540 may be integrally formed with the top plate of the housing 100. Fig.15 Three fan modules 310 are shown in FIG. 3 , and all of the three fan modules 310 are located between the third duct member 530 and the fourth duct member 540 .
[0086] In this embodiment, by providing the third duct member 530 and the fourth duct member 540, the third duct member 530 and the fourth duct member 540 can be used to guide the airflow, so that the air flowing in from the air inlet 110 can flow from the fan module 310 to the circuit board 210, thereby avoiding air leakage and cross-flow, and improving the heat dissipation effect on the circuit board 210. In addition, the third duct member 530 and the fourth duct member 540 can be directly connected to the top plate of the housing 100, thereby reducing the installation process of the computing device 10 and making the assembly and disassembly of the computing device 10 more convenient.
[0087] In one embodiment, Fig.15 and Fig.19 As shown, the computing device 10 may further include a fifth duct member 550 and a sixth duct member 560, which are respectively located on both sides of the fan module 310 in the radial direction; the fifth duct member 550 and / or the sixth duct member 560 are connected to the bottom plate of the housing 100. Exemplarily, the fifth duct member 550 and the sixth duct member 560 are relatively arranged in the arrangement direction of the plurality of fan modules 310. For example, the fifth duct member 550 and the sixth duct member 560 may be relatively arranged in the length direction of the housing 100. The fifth duct member 550 and the sixth duct member 560 may be integrally formed with the bottom plate of the housing 100. Fig.15 Three fan modules 310 are shown in FIG. 3 , and all three fan modules 310 are located between the fifth duct member 550 and the sixth duct member 560 .
[0088] In this embodiment, by providing the fifth duct member 550 and the sixth duct member 560, the fifth duct member 550 and the sixth duct member 560 can also be used to guide the airflow, so that the air flowing in from the air inlet 110 can flow from the fan module 310 to the circuit board 210, thereby avoiding air leakage and cross-flow, and improving the heat dissipation effect on the circuit board 210. In addition, the fifth duct member 550 and the sixth duct member 560 can be directly connected to the bottom plate of the housing 100, thereby also reducing the installation process of the computing device 10, making the assembly and disassembly of the computing device 10 more convenient.
[0089] In one embodiment, there may be multiple air outlets 120. The multiple air outlets 120 may extend in the same direction (eg, Figure 2 Alternatively, the plurality of air outlets 120 may be divided into a first air outlet group and a second air outlet group, and the extension direction of the air outlets 120 in the first air outlet group is different from the extension direction of the air outlets 120 in the second air outlet group (eg Fig. 11B shown).
[0090] For example, in Figure 2 In the embodiment, the plurality of air outlets 120 are all extended vertically. The direction of the wind output from the air outlet 120 may be perpendicular to the second side plate of the housing 100. Fig. 11BIn the embodiment, the plurality of air outlets 120 in the first air outlet group extend in the same direction, and the plurality of air outlets 120 in the second air outlet group extend in the same direction. Fig. 11B In (a), the multiple air outlets 120 in the first air outlet group are all inclined to the left relative to the vertical line, and the multiple air outlets 120 in the second air outlet group are all inclined to the right relative to the vertical line. The direction of the wind output from the multiple air outlets 120 in the first air outlet group is inclined to the right from top to bottom, and the direction of the wind output from the multiple air outlets 120 in the second air outlet group is inclined to the left from top to bottom.
[0091] exist Fig. 11B In (b), the extension direction of the plurality of air outlets 120 in the first air outlet group is inclined to the right relative to the vertical line, and the extension direction of the plurality of air outlets 120 in the second air outlet group is inclined to the left relative to the vertical line. The direction of the wind output by the plurality of air outlets 120 in the first air outlet group is inclined to the right from bottom to top, and the direction of the wind output by the plurality of air outlets 120 in the second air outlet group is inclined to the left from bottom to top.
[0092] exist Fig. 11B In (c), the extension direction of the plurality of air outlets 120 in the first air outlet group is inclined to the right relative to the vertical line, and the extension direction of the plurality of air outlets 120 in the second air outlet group is inclined to the left relative to the vertical line. The direction of the wind output by the plurality of air outlets 120 in the first air outlet group is inclined to the left from top to bottom, and the direction of the wind output by the plurality of air outlets 120 in the second air outlet group is inclined to the right from top to bottom.
[0093] exist Fig. 11B In (d), the multiple air outlets 120 in the first air outlet group are all inclined to the left relative to the vertical line, and the multiple air outlets 120 in the second air outlet group are all inclined to the right relative to the vertical line. The direction of the wind output from the multiple air outlets 120 in the first air outlet group can be inclined to the left from bottom to top, and the direction of the wind output from the multiple air outlets 120 in the second air outlet group can be inclined to the right from bottom to top.
[0094] In this embodiment, different air outlet effects can be achieved by changing the extension direction of the air outlet 120, effectively improving the user experience. The user can change the extension direction of the air outlet 120 by manually flipping the structural member where the air outlet 120 is located (such as flipping left and right, flipping up and down, or flipping inside and outside, etc.); the extension direction of the air outlet 120 can also be changed by replacing the structural member where the air outlet 120 is located, and this application does not limit this.
[0095] In one embodiment, Fig.10 , Fig.11A and Fig.15As shown, the computing device 10 may further include an air inlet guide 610 and an air outlet guide 620. The air inlet guide 610 is disposed on the side of the fan assembly 300 away from the circuit board 210, and the air inlet 110 is disposed on the air inlet guide 610. The air outlet guide 620 is disposed on the side of the circuit board 210 away from the fan assembly 300, and the air outlet 120 is disposed on the air outlet guide 620. Thus, the structural member where the air outlet 120 is located is the air outlet guide 620, and the air outlet guide 620 can be independently disposed relative to the housing 100. The direction of the air outlet 120 can be changed by manually flipping the air outlet guide 620 or replacing a different air outlet guide 620, so as to achieve different air outlet modes, with a simple structure and convenient operation.
[0096] In one embodiment, referring to Fig.15 The housing 100 may be provided with a first magnetic member 140, the air inlet guide member 610 and / or the air outlet guide member 620 may be provided with a second magnetic member 611, and the first magnetic member 140 is magnetically connected to the second magnetic member 611. Thus, the connection method between the housing 100 and the air inlet guide member 610 and / or the housing 100 and the air outlet guide member 620 is simple, and installation and disassembly are more convenient and quick, and no tools are required, which greatly improves the installation and disassembly efficiency of the air inlet guide member 610 and / or the air outlet guide member 620.
[0097] In one embodiment, Fig.15 and Fig.16 As shown, the computing device 10 may further include a control bracket 700 and a control module 400 . The control bracket 700 is connected to the housing 100 . The control module 400 is connected to the control bracket 700 .
[0098] The control bracket 700 may include a first connecting plate 710 and a second connecting plate 720 connected to each other, the first connecting plate 710 and the second connecting plate 720 form an angle, the control module 400 is connected to the first connecting plate 710, and the second connecting plate 720 is connected to the housing 100. Fig.15 and Fig.16 , the second connecting plate 720 can be connected to the top plate of the shell 100.
[0099] Exemplarily, the computing device 10 may further include a data interface 10b. The data interface 10b may be disposed on the bottom plate of the housing 100. The data interface 10b is electrically connected to the control module 400. Optionally, the data interface 10b may be a Type-C interface, but is not limited thereto.
[0100] In this embodiment, the control module 400 can be installed on the housing 100 through the control bracket 700, so that the installation accuracy requirement of the control module 400 can be reduced and the arrangement position of the control module 400 can be more flexible.
[0101] In one embodiment, the computing device 10 may further include a display component 721, which is connected to the second connection plate 720. Exemplarily, the display component 721 may be connected to the side of the second connection plate 720 that is away from the control module 400. The display component 721 may have a display side and a non-display side. The display side is used to display image information or text information. The display side of the display component 721 may be arranged facing away from the circuit board 210, and the non-display side of the display component 721 may be arranged toward the circuit board 210. Among them, the housing 100 may be provided with a mounting hole 150, and the display component 721 mounted on the second connection plate 720 may be exposed through the mounting hole 150, so that the user can observe the image information or text information displayed on the display component 721. For example, the display component 721 may be used to cyclically display Internet Protocol (IP) information, inlet temperature, outlet temperature, computing power, power consumption and other information. Optionally, a transparent screen cover 160 may be provided at the mounting hole 150 to protect the display component 721. The mounting hole 150 may be provided on the top plate of the housing 100 , but is not limited thereto.
[0102] In this embodiment, by providing the display component 721, the user can observe from the outside the information displayed by the display component 721. In addition, the display component 721 and the control module 400 can be installed on the same control bracket 700, thereby reducing the number of overall components of the computing device 10 and improving the installation and disassembly efficiency of the computing device 10.
[0103] Of course, the present application is not limited thereto, and in one embodiment, the housing 100 further includes a mounting position, in which a display assembly 721 is mounted. The difference from the above embodiment is that the display assembly 721 in this embodiment can be directly mounted on the mounting position on the housing 100, rather than on the second connecting plate 720.
[0104] In one example, combining Fig.21 and Fig. 22 The mounting position may be a through mounting hole 150, through which the display assembly 721 is exposed, so that the user can observe the image information or text information displayed on the display assembly 721 from the outside. For example, the mounting hole 150 may penetrate the top plate of the housing 100 along the wall thickness direction of the housing 100. At least a portion of the display assembly 721 is located in the air duct.
[0105] In another example, the mounting position may also be a mounting groove, and the display assembly 721 is located in the mounting groove. In this case, the user can also observe the image information or text information displayed on the display assembly 721 from the outside. For example, the mounting groove may be formed by a portion of the housing 100 being recessed inward. The display assembly 721 may be located outside the air duct.
[0106] In one embodiment, the computing device 10 may further include a pressure plate 180, the pressure plate 180 is fixedly connected to the housing 100, and the display assembly 721 is pressed between the pressure plate 180 and the inner wall of the housing 100. Fig.21 and Fig. 22 In the example of , the pressure plate 180 can be formed into a runway-shaped structure. The computing device 10 may include a third fastener. During installation, the third fastener can be passed through the pressure plate 180 and fixedly connected to the top plate of the housing 100. Further, there can be two third fasteners, and the two third fasteners can be respectively located at both ends of the pressure plate 180. In this embodiment, through the above arrangement, while ensuring that the user can observe the information displayed by the display component 721 from the outside, the structural stability and reliability of the display component 721 can also be ensured.
[0107] In one embodiment, the control bracket 700 may be provided with a switch controller 730 and a display switching controller 740, wherein the switch controller 730 corresponds to the first button portion 171 provided on the housing 100, and the display switching controller 740 corresponds to the second button portion 172 provided on the housing 100. Fig.15 and Fig.16 In the example of , the switch controller 730 and the display switching controller 740 can be arranged on the second connection board 720, and the switch controller 730 and the display switching controller 740 can be located on the side of the second connection board away from the control module 400. Among them, the switch controller 730 can control the start and stop of the computing device 10, and the display switching controller 740 can switch the display information on the display component 721. When the user presses the first button part 171, the switch controller 730 is triggered, so that the computing device 10 can be turned on when the computing device 10 is turned off, and the computing device 10 can be turned off when the computing device 10 is turned on. When the user presses the second button part 172, the display switching controller 740 is triggered, and the IP information, air inlet temperature, air outlet temperature, computing power, power consumption and other information displayed on the display component 721 can be switched, and the light can also be controlled.
[0108] In one embodiment, in combination Fig.15 The housing 100 may be provided with a mounting groove 190, and a light emitting member 191 (such as Figure 4 As shown) and / or a light guide (not shown). For example, when a light emitting member 191 is disposed in the mounting groove 190, the light emitting member 191 can be installed and fixed at the air outlet 120. The light emitting member 191 can be a light strip; when a light guide is disposed in the mounting groove 190, the light guide can be a light guide bar, but is not limited thereto.
[0109] Therefore, by setting the light-emitting element 191 and / or the light-guiding element, the light-emitting element 191 can display different colors according to different air outlet temperatures, which is more intuitive; the light-guiding element can be used to guide and distribute light so that the light can reach the desired position, thereby improving the display effect.
[0110] In one embodiment, the circuit board 210 includes a first surface and a second surface arranged opposite to each other, and a heat generating component 211 is arranged on the first surface to realize the computing function of the computing device. Exemplarily, a plurality of heat generating components 211 can be arranged in an array. The areas of the plurality of heat generating components 211 can be equal, and / or the device types of the plurality of heat generating components 211 can be the same, so as to facilitate the arrangement of the heat generating components 211 on the circuit board 210. For example, the plurality of heat generating components 211 can all be chips.
[0111] In one embodiment, the computing device 10 may further include a heat sink 220. The heat sink 220 is disposed on the first surface and / or the second surface. In other words, the heat sink 220 may be disposed on the first surface of the circuit board 210, and the heat sink 220 may not be disposed on the second surface of the circuit board 210; or the heat sink 220 may be disposed on the second surface of the circuit board 210, and the heat sink 220 may not be disposed on the first surface of the circuit board 210; or the heat sink 220 may be disposed on both the first surface and the second surface of the circuit board 210.
[0112] In this way, the heat generated by the heat generating components 211 on the circuit board 210 during operation can be transferred to the heat sink 220. When the fan assembly 300 is in operation, external cold air can flow from the air inlet 110 into the air duct and then flow through the heat sink 220, thereby taking away the heat on the heat sink 220, effectively reducing the temperature of the circuit board 210 and achieving normal operation of the heat generating components 211.
[0113] Exemplarily, when the number of the heat sink 220 is one, the heat sink 220 can be arranged on the first surface of the circuit board 210, or on the second surface of the circuit board 210. When the number of the heat sink 220 is multiple, the multiple heat sinks 220 can be arranged on the first surface of the circuit board 210; or, the multiple heat sinks 220 can be arranged on the second surface of the circuit board 210; or, a part of the multiple heat sinks 220 can be arranged on the first surface of the circuit board 210, and another part of the multiple heat sinks 220 can be arranged on the second surface of the circuit board 210. When the heat sink 220 is arranged on the first surface of the circuit board 210, the heat sink 220 can be in direct contact with the heat generating component 211, or can be in indirect contact with the heat generating component 211 through a heat conducting material (such as silicone grease). A riveted nut column can be arranged on the bottom plate of the housing 100, and the heat sink 220 can be fixedly connected to the riveted nut column by a fastener such as a bolt, so as to realize the installation of the heat sink 220.
[0114] In one embodiment, the radiator 220 may include a liquid cooling tube 221 and a plurality of heat dissipating fins 222 arranged at intervals, wherein the extension direction of each heat dissipating fin 222 is the same as the wind direction in the air duct, and the liquid cooling tube 221 is provided through the plurality of heat dissipating fins 222 along the arrangement direction of the plurality of heat dissipating fins 222. In the description of this application, "plurality" means two or more.
[0115] Exemplarily, the heat dissipation fins 222 may be perpendicular to the first surface and the second surface of the circuit board 210. A heat dissipation channel may be defined between two adjacent heat dissipation fins 222. Since the extension direction of each heat dissipation fin 222 is the same as the wind direction in the air duct, the extension direction of the heat dissipation channel is the same as the wind direction in the air duct. A coolant such as water is provided in the liquid cooling tube 221. The heat generated during the operation of the heat generating component 211 may be conducted to the heat dissipation fins 222. Since the liquid cooling tube 221 is provided through a plurality of heat dissipation fins 222, the heat dissipation fins 222 may conduct part of the heat to the coolant in the liquid cooling tube 221, thereby exchanging heat with the coolant. When the fan assembly 300 is working, the external cold air may flow into the air duct from the air inlet 110, and then flow through the heat dissipation channel, thereby realizing heat exchange with the radiator 220, reducing the temperature of the radiator 220 and the circuit board 210, and realizing the normal operation of the heat generating component 211. The hot air after heat exchange may flow out from the air outlet 120 under the action of the fan assembly 300.
[0116] In this embodiment, since the extension direction of the heat dissipation fins 222 is the same as the wind direction in the air duct, the cold air can better remove the heat when passing through the heat dissipation fins 222, effectively improving the heat dissipation efficiency. In addition, by providing the liquid cooling tube 221, the coolant in the liquid cooling tube 221 has good thermal conductivity, can absorb and transfer heat more quickly, and further improve the heat dissipation efficiency.
[0117] In an example, by detecting the air temperature at the air outlet, the air temperature 1 cm away from the air outlet, the air temperature 2 cm away from the air outlet, the air speed at the air outlet, the air speed 1 cm away from the air outlet, and the air speed 2 cm away from the air outlet, it can be finally concluded that: when the spacing between adjacent heat dissipation fins is 6 mm, there are three fan modules, and the speed of the fan module is 4000 rpm, when the air inlet temperature of the computing device is 20°C, the average air outlet temperature is 39.6°C, the average temperature of heat-generating components such as chips is 63.57°C, and the air outlet of the computing device is relatively uniform.
[0118] In one embodiment, the radiator 220 may include a first radiator and a second radiator, the first radiator is disposed on the first surface, and the second radiator is disposed on the second surface, wherein along the arrangement direction of the plurality of heat dissipation fins 222, the size of the second radiator 220 is larger than the size of the first radiator.
[0119] For example, during installation, the control module 400 can be first connected to the fan assembly 300 by fasteners such as screws, and then the heat sink 220 can be connected to the bottom plate of the housing 100 by fasteners such as screws, and the fan assembly 300 can be connected to the bottom plate of the housing 100 by fasteners such as screws. Finally, the overall structure of the upper shell is installed by fasteners such as screws.
[0120] Alternatively, the light emitting member 191, the light guide member and the fan module 310 can first be installed on the housing 100; wherein the fan module 310 can be fixed to the housing 100 by countersunk tapping screws, the light emitting member 191 can be pasted to the housing 100, and the light guide member can be fixed to the housing 100 by countersunk tapping screws. Then install the button part 170, and install the foam at the mounting hole 150. The foam can be pasted to the housing 100, and the button part 170 can be hot-melted to the housing 100 by an electric soldering iron. Then use screws to install the display assembly 721 on the second connecting plate 720, and install the control module 400 on the first connecting plate 710. Then connect the second connecting plate 720 to the top plate of the housing 100. Then install the heat sink 220 and the power board on the bottom plate of the housing 100 in turn. Then glue the first magnetic member 140 to the housing 100 and glue the screen cover 160 to the mounting hole 150. Then, the second magnetic attraction member 611, such as a magnet, the inlet air guide member 610 and the outlet air guide member 620 are sequentially installed, and the bottom plate of the housing 100 is installed. Finally, the foot pad is pasted on the bottom plate of the housing 100 to complete the assembly of the whole machine.
[0121] In this embodiment, by providing the above-mentioned first heat sink and second heat sink, the heat on the first surface of the circuit board 210 can be effectively transferred to the first heat sink, and the heat on the second surface of the circuit board 210 can be effectively transferred to the second heat sink. In the process of wind blowing from the air inlet 110 of the air duct to the air outlet 120, the heat of the first heat sink and the second heat sink can be effectively taken away, thereby achieving effective heat dissipation of the circuit board 210. In addition, since a functional module with a relatively large height (such as a sensor, etc.) is usually provided on the first surface of the circuit board 210, by making the size of the second heat sink larger than the size of the first heat sink, the first heat sink with a smaller size can play an effective avoidance role, which is beneficial to the overall installation of the computing device 10; at the same time, the second heat sink with a larger size has a better heat dissipation effect, thereby effectively reducing the temperature of the heat-generating component 211, ensuring the normal operation of the heat-generating component 211, and extending the service life.
[0122] In one embodiment, the second radiator can be connected to the housing 100 by fasteners. In this way, the second radiator can be used to support the weight of the circuit board 210 and the first radiator. Since the size of the second radiator is larger than that of the first radiator, the second radiator has a larger supporting area, which helps to disperse the weight of the circuit board 210 and the first heat sink, achieves uniform distribution of loads, reduces the risk of single-point concentration, and helps to improve the load-bearing capacity and vibration resistance of the entire computing device 10. Moreover, since the second radiator is usually made of solid metal or other high-strength materials, it can provide better structural stability when used as a supporting structure. In addition, the second radiator used as a supporting structure can effectively reduce the stress of the circuit board 210 when it is subjected to mechanical shock or vibration, reduce its force burden, and thus extend the service life of the circuit board 210.
[0123] In one embodiment, the top of the air inlet 110, the top of the air outlet 120, and the top of the radiator 220 are flush, and the bottom of the air inlet 110, the bottom of the air outlet 120, and the bottom of the radiator 220 are flush. In this way, it is ensured that the wind from the air inlet 11 to the air outlet 120 can flow through the radiator 220, achieving effective heat dissipation of the circuit board 210, and at the same time, the risk of wind flowing to the gap between the radiator 220 and the shell can be reduced, avoiding air leakage and cross-flow.
[0124] It should be noted that in the above scheme, flush refers to the situation with obvious height difference, for example, the height difference between the two surfaces is more than 2 cm. The flush here can be understood as: the top of the air inlet 110, the top of the air outlet 120, and the top of the radiator 220 are in the same plane or have a certain deviation distance, but the visual effect is almost flush, and the bottom of the air inlet 110, the bottom of the air outlet 120, and the bottom of the radiator 220 are in the same plane or have a certain deviation distance, but the visual effect is almost flush; those skilled in the art can understand that the air inlet 110, the air outlet 120, and the radiator 220 in the above scheme may not be strictly flush due to screws, protective layer structure, reinforcement structure or paint, but as long as they are basically flush, they all belong to the protection scope defined by "flush with each other" in this application.
[0125] In one embodiment, reference Figure 3 , Figure 4 , Fig.21 and Fig. 22The top plate of the housing 100 may be provided with a reinforcing rib 10a, which is located between the fan assembly 300 and the circuit board 210, and covers a portion of the side of the radiator 220. Thus, the reinforcing rib 10a provided in this way can improve the structural rigidity of the housing 100 on the one hand, and prevent the wind from passing through the gap between the radiator 220 and the top plate of the housing 100 on the other hand, so as to ensure that the wind can flow through the radiator 220.
[0126] Other components of the computing device 10 in the above embodiment may adopt various technical solutions known to ordinary technicians in the field now and in the future, and will not be described in detail here.
[0127] In the description of this specification, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.
[0128] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features.
[0129] In this application, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection, an electrical connection, or a communication; it can be a direct connection, or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.
[0130] In the present application, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is lower in level than the second feature.
[0131] The disclosure above provides many different embodiments or examples to realize the different structures of the present application. In order to simplify the disclosure of the present application, the parts and settings of specific examples are described above. Of course, they are only examples, and the purpose is not to limit the present application. In addition, the present application can repeat reference numerals and / or reference letters in different examples, and this repetition is for the purpose of simplification and clarity, which itself does not indicate the relationship between the various embodiments and / or settings discussed.
[0132] The above is only a specific implementation of the present application, but the protection scope of the present application is not limited thereto. Any technician familiar with the technical field can easily think of various changes or substitutions within the technical scope disclosed in the present application, which should be included in the protection scope of the present application. Therefore, the protection scope of the present application should be based on the protection scope of the claims.
Claims
1. A computing device, characterized in that: include: A housing, wherein an air duct having an air inlet and an air outlet is defined in the housing; A circuit board is arranged in the air duct; The fan assembly is arranged in the air duct, and along the wind direction in the air duct, the fan assembly is located in the upwind direction, and the circuit board is located in the downwind direction; the fan assembly includes at least one fan module, and the axial direction of the fan module is parallel to the wind direction in the air duct.
2. The computing device according to claim 1, wherein: There are multiple air outlets; wherein, the extension direction of the multiple air outlets is the same; or, the multiple air outlets are divided into a first air outlet group and a second air outlet group, and the extension direction of the air outlets in the first air outlet group is different from the extension direction of the air outlets in the second air outlet group.
3. The computing device according to claim 1, wherein: Also includes: An air inlet guide is arranged on a side of the fan assembly away from the circuit board, and the air inlet is arranged on the air inlet guide; The air outlet guide is arranged on a side of the circuit board away from the fan assembly, and the air outlet is arranged on the air outlet guide.
4. The computing device according to claim 3, characterized in that The shell is provided with a first magnetic attraction member, the air inlet guide member and / or the air outlet guide member is provided with a second magnetic attraction member, and the first magnetic attraction member is magnetically connected to the second magnetic attraction member.
5. The computing device according to claim 1, wherein: Also includes: A control bracket connected to the housing; A control module is connected to the control bracket.
6. The computing device according to claim 5, characterized in that The control bracket includes a first connecting plate and a second connecting plate connected to each other, wherein the first connecting plate and the second connecting plate form an angle, the control module is connected to the first connecting plate, and the second connecting plate is connected to the housing.
7. The computing device according to claim 6, characterized in that The computing device further includes a display component connected to the second connecting board.
8. The computing device according to claim 5, characterized in that The control bracket is provided with a switch controller and a display switching controller, wherein the switch controller corresponds to a first button portion provided on the shell, and the display switching controller corresponds to a second button portion provided on the shell.
9. The computing device according to claim 1, wherein: The fan assembly further comprises a fan bracket, the fan module is arranged on the fan bracket, and the fan bracket is connected to the housing.
10. The computing device according to claim 9, characterized in that A vibration absorbing pad is arranged at the bottom of the fan bracket.
11. The computing device according to claim 9, characterized in that The fan bracket comprises: A mounting back, the fan module being connected to the mounting back; An installation bottom is arranged at the bottom of the fan module; The two mounting side parts are respectively located at two ends of the mounting bottom.
12. The computing device according to claim 11, characterized in that Also includes: A control module is electrically connected to the fan assembly and the circuit board, and the control module is connected to one of the two mounting side portions.
13. The computing device according to claim 11, characterized in that The mounting bottom comprises a bottom plate and a flange connected to the bottom plate, the flange is arranged close to the circuit board, and the flange is located between the bottom plate and the bottom plate of the shell.
14. The computing device according to claim 11, characterized in that The installation bottom defines a wiring groove, and the wiring groove is formed by a portion of the installation bottom being recessed toward the bottom plate of the housing.
15. The computing device according to claim 9, characterized in that Also includes: A first air duct member and a second air duct member connected to the fan bracket, wherein the first air duct member and the second air duct member are respectively located on two sides of the fan module in a radial direction; The bottom of the first air duct member and / or the second air duct member is bonded to the bottom plate of the housing through a flexible adhesive member.
16. The computing device according to claim 1, wherein: A filtering device is arranged between the fan assembly and the air inlet.
17. The computing device according to claim 1, wherein: At least one fan installation hole is formed on the shell; the at least one fan module is arranged in a one-to-one correspondence with the at least one fan installation hole, and each of the fan modules is connected to the shell.
18. The computing device according to claim 17, characterized in that Also includes: A third air duct member and a fourth air duct member, wherein the third air duct member and the fourth air duct member are respectively located on two sides of the fan module in the radial direction; The third air duct member and / or the fourth air duct member are connected to the top plate of the housing.
19. The computing device according to claim 17, wherein: Also includes: A fifth air duct member and a sixth air duct member, wherein the fifth air duct member and the sixth air duct member are respectively located on both sides of the fan module in the radial direction; the fifth air duct member and / or the sixth air duct member are connected to the bottom plate of the shell.
20. The computing device of claim 1, wherein: The housing also includes a mounting position in which a display assembly is mounted.
21. The computing device of claim 20, wherein: The computing device further comprises a pressing plate, wherein the pressing plate is fixedly connected to the shell, and the display assembly is pressed between the pressing plate and the inner wall of the shell.
22. The computing device of claim 1, wherein: The housing is provided with a mounting groove, and a light emitting element and / or a light guiding element is arranged in the mounting groove.
23. The computing device of claim 1, wherein: The circuit board comprises a first surface and a second surface which are arranged opposite to each other, and a plurality of heat generating components are arranged in an array on the first surface.
24. The computing device of claim 23, wherein: The areas of the multiple heat-generating components are equal, and / or the device types of the multiple heat-generating components are the same.
25. The computing device of claim 23, wherein: The computing device further includes a heat sink disposed on the first surface and / or the second surface.
26. The computing device of claim 25, wherein: The radiator includes a liquid cooling tube and a plurality of heat dissipating fins arranged at intervals, the extension direction of each of the heat dissipating fins is the same as the wind direction in the air duct, and the liquid cooling tube is passed through the plurality of heat dissipating fins along the arrangement direction of the plurality of heat dissipating fins.
27. The computing device of claim 25, wherein: The top plate of the shell is provided with reinforcing ribs, the reinforcing ribs are located between the fan assembly and the circuit board, and the reinforcing ribs cover a part of the side surface of the radiator.
28. The computing device of claim 25, wherein: The heat sink includes a first heat sink and a second heat sink, wherein the first heat sink is disposed on a first surface and the second heat sink is disposed on a second surface; along an arrangement direction of a plurality of heat sink fins, a size of the second heat sink is larger than a size of the first heat sink.
29. The computing device of claim 28, wherein: The second heat sink is connected to the housing via fasteners.
30. The computing device of claim 29, wherein: The second heat sink is used to support the weight of the circuit board and the first heat sink.
31. The computing device of claim 25, wherein: The top of the air inlet, the top of the air outlet, and the top of the radiator are flush with each other, and the bottom of the air inlet, the bottom of the air outlet, and the bottom of the radiator are flush with each other.
32. The computing device according to any one of claims 1 to 31, characterized in that The air outlet is communicated with a heat recovery system.