Wafer film cutting mechanism

Abstract

The utility model discloses a wafer film cutting mechanism which comprises a carrying unit, a rotating unit, a radial adjusting assembly, an angle adjusting assembly and a film cutting knife, the carrying unit is used for carrying the whole film cutting knife to the position above a wafer to be subjected to film cutting, and the rotating unit is used for driving the film cutting knife to rotate so as to cut off a film at the round edge of the wafer. The radial adjusting assembly is used for changing the film cutting radius of the film cutting knife, and the angle adjusting assembly is used for rotating the film cutting knife by a preset angle and cooperating with the carrying unit to cut off a film on the straight edge of the wafer. According to the wafer film cutting mechanism, the mode that the carrying unit is matched with the radial adjusting assembly and the angle adjusting assembly is adopted, the films on the round edge and the straight edge of the wafer are cut, the design is ingenious, implementation is easy, the cutting radius and angle can be automatically adjusted, the film cutting position does not need to be frequently adjusted, the film cutting efficiency is remarkably improved, and the production cost is reduced. And the fast-paced production requirement is met.

Description

Technical Field

[0001] The utility model belongs to the technical field of semiconductor manufacturing, and in particular relates to a wafer film cutting mechanism. Background Art

[0002] Wafer refers to the silicon wafer used to make silicon semiconductor circuits. Its original material is silicon. High-purity polycrystalline silicon is dissolved and doped with silicon crystal seeds, and then slowly pulled out to form cylindrical single crystal silicon. After grinding, polishing, and slicing, the silicon crystal rod forms a silicon wafer, that is, a wafer. After the semiconductor wafer is filmed, a specific film cutting mechanism is needed to cut the film on the filmed wafer so that the wafer surface is covered with a contoured film.

[0003] At present, the film cutting direction and angle of the existing film cutting mechanism are fixed. When cutting wafers with straight edges, the rear focus film cutting position needs to be adjusted frequently. Obviously, the existing film cutting mechanism is not convenient to adjust, which greatly affects the film cutting efficiency and cannot meet the fast-paced production requirements. Utility Model Content

[0004] The utility model aims to provide a wafer film cutting mechanism to solve the problem of inconvenient adjustment of conventional film cutting mechanisms in the prior art.

[0005] To achieve this purpose, the utility model adopts the following technical solutions:

[0006] A wafer film cutting mechanism comprises a three-axis transport mechanism and an adjustment film cutting device, wherein the driving end of the three-axis transport mechanism is connected to the adjustment film cutting device, wherein:

[0007] The three-axis transport mechanism includes a transport unit and a rotation unit, the transport unit includes an X-axis drive component, a Y-axis drive component and a Z-axis drive component, the X-axis drive component includes an X-axis drive module and an X-axis movable seat, the X-axis movable seat can be assembled on the X-axis drive module for reciprocating movement along the X-axis, the Y-axis drive component is installed on the X-axis movable seat, the Y-axis drive component includes a Y-axis drive module and a Y-axis movable seat, the Y-axis movable seat can be assembled on the Y-axis drive module for reciprocating movement along the Y-axis, the Z-axis drive component is installed on the Y-axis movable seat, the Z-axis drive component includes a Z-axis drive module and a Z-axis movable seat, the Z-axis movable seat can be assembled on the Z-axis drive module for reciprocating movement along the Z-axis, the rotation unit is fixedly installed on the Z-axis movable seat, the driving end of the rotation unit is connected to the adjustment film cutting device, and the rotation unit is configured to drive the adjustment film cutting device to rotate,

[0008] The adjustable film cutting device includes a radial adjustment component, an angle adjustment component and a film cutting knife. The fixed end of the angle adjustment component is installed on the radial adjustment component, and the driving end of the angle adjustment component is connected to the film cutting knife. The radial adjustment component is configured to adjust the film cutting radius of the film cutting knife before film cutting, and the angle adjustment component is configured to adjust the film cutting knife to a preset film cutting angle.

[0009] Furthermore, the X-axis driving module includes an X-axis driving member, an X-axis guide rail and a fixed frame, the X-axis guide rail is laid on the fixed frame and extends along the X direction, the driving end of the X-axis driving member is connected to the X-axis moving seat, and the X-axis driving member drives the X-axis moving seat to reciprocate along the X-axis guide rail.

[0010] Furthermore, the Y-axis driving module includes a Y-axis driving member and a Y-axis guide rail, the Y-axis guide rail is laid on the X-axis moving seat and extends along the Y direction, the driving end of the Y-axis driving member is connected to the Y-axis moving seat, and the Y-axis driving member drives the Y-axis moving seat to reciprocate along the Y-axis guide rail.

[0011] Furthermore, the Z-axis driving module includes a Z-axis driving component and a Z-axis guide rail, the Z-axis guide rail is laid on the Y-axis moving seat along the height direction, the driving end of the Z-axis driving component is connected to the Z-axis moving seat, and the Z-axis driving component drives the Z-axis moving seat to reciprocate along the Z-axis guide rail.

[0012] Furthermore, the rotating unit includes a rotating drive member and a rotating member, the fixed end of the rotating drive member is installed on the Z-axis movable seat, the driving end of the rotating drive member is connected to the rotating member, the rotating drive member drives the rotating member to rotate to drive the radial adjustment assembly to rotate, and cooperates with the film cutting knife to cut off the film at the circular edge of the wafer.

[0013] Furthermore, the radial adjustment assembly includes a radial driving member and a radial adjusting member, the radial driving member is fixedly mounted on the rotating member, the driving end of the radial driving member is connected to the radial adjusting member, and the radial driving member drives the radial adjusting member to move radially along the rotating member to adjust the film cutting radius of the film cutting knife.

[0014] Furthermore, the angle adjustment assembly includes an angle driving member, a fixed end of the angle driving member is mounted on the radial adjustment member, a driving end of the angle driving member is connected to the film cutting knife, and the angle driving member is configured to drive the film cutting knife to rotate to a preset angle and cooperate with the conveying unit to cut off the film at the straight edge of the wafer.

[0015] Compared with the prior art, the beneficial effects of the wafer film cutting mechanism are as follows: the film on the wafer is cut by adopting a three-axis transport mechanism in cooperation with the film cutting device, the three-axis transport mechanism transports the film cutting device to a specified position, the rotating unit drives the film cutting knife to rotate, and cuts the film at the round edge of the wafer, after the cutting is completed, the angle adjustment component adjusts the film cutting knife to a preset film cutting angle, and cooperates with the transport unit to cut off the film at the straight edge of the wafer. It is not only cleverly designed and easy to implement, but also can automatically adjust the cutting radius and angle, without the need to frequently adjust the film cutting position, which significantly improves the film cutting efficiency and meets the fast-paced production requirements. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate and understand the technical solutions in the embodiments of the present invention, the following briefly introduces the background technology of the present invention and the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the contents of the embodiments of the present invention and these drawings without paying any creative work.

[0017] Figure 1 It is a schematic diagram of the structure of an existing wafer;

[0018] Figure 2 It is a three-dimensional structural schematic diagram of a wafer film cutting mechanism provided by an embodiment of the utility model;

[0019] Figure 3 It is a front view schematic diagram of a wafer film cutting mechanism provided by an embodiment of the utility model;

[0020] Figure 4 It is a side view schematic diagram of a wafer film cutting mechanism provided by an embodiment of the utility model;

[0021] Figure 5 It is a top view schematic diagram of a wafer film cutting mechanism provided by an embodiment of the utility model. DETAILED DESCRIPTION

[0022] The technical solution of the utility model is further explained below with reference to the accompanying drawings and through specific implementation methods.

[0023] In order to facilitate the understanding of the utility model, the utility model will be described more comprehensively with reference to the relevant drawings. The preferred embodiments of the utility model are given in the drawings. However, the utility model can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the utility model more thoroughly understood. It should be noted that when a component is referred to as "fixed to" another component, it can be directly on another component or there can also be a central component. When a component is considered to be "connected" to another component, it can be directly connected to another component or there may be a central component at the same time. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are only for illustrative purposes and are not intended to be the only implementation method. Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those generally understood by technicians in the technical field of the utility model. The terms used in the specification of the utility model herein are only for the purpose of describing specific embodiments and are not intended to limit the utility model. The term "and / or" used herein includes any and all combinations of one or more related listed items.

[0024] See also Figure 1 As shown, the incoming wafer 1 is in the form of a circle with straight edges 11, such as Figures 2 to 5 As shown, in this embodiment, a wafer film cutting mechanism includes a three-axis transport mechanism and an adjustment film cutting device 2, wherein the driving end of the three-axis transport mechanism is connected to the adjustment film cutting device 2, wherein the three-axis transport mechanism includes a transport unit 3 and a rotation unit 4, the transport unit 3 includes an X-axis drive component, a Y-axis drive component and a Z-axis drive component, the X-axis drive component includes an X-axis drive module 30 and an X-axis moving seat 31, the X-axis moving seat 31 can be reciprocated along the X-axis and assembled on the X-axis drive module 30, the Y-axis drive component is installed on the X-axis moving seat 31, the Y-axis drive component includes a Y-axis drive module 32 and a Y-axis moving seat 33, the Y-axis moving seat 33 can be reciprocated along the Y-axis and assembled on the Y-axis drive module 32, the Z-axis drive component is installed on the Y-axis moving seat 3 3, the Z-axis driving assembly includes a Z-axis driving module 34 and a Z-axis moving seat 35, the Z-axis moving seat 35 can be assembled on the Z-axis driving module 34 so as to be reciprocatingly movable along the Z-axis, the rotating unit 4 is fixedly mounted on the Z-axis moving seat 35, the driving end of the rotating unit 4 is connected to the adjustment film cutting device 2, the rotating unit 4 is configured to drive the adjustment film cutting device 2 to rotate, the adjustment film cutting device 2 includes a radial adjustment assembly 20, an angle adjustment assembly and a film cutting knife 21, the fixed end of the angle adjustment assembly is mounted on the radial adjustment assembly 20, the driving end of the angle adjustment assembly is connected to the film cutting knife 21, the radial adjustment assembly 20 is configured to adjust the film cutting radius of the film cutting knife 21 before film cutting, and the angle adjustment assembly is configured to adjust the film cutting knife 21 to a preset film cutting angle.

[0025] It can be seen that the film on the wafer is cut by adopting a three-axis transport mechanism in cooperation with the adjustment film cutting device 2. The three-axis transport mechanism transports the adjustment film cutting device 2 to the specified position, and the rotating unit 4 drives the film cutting knife 21 to rotate to cut the film at the circular edge 10 on the wafer. After the cutting is completed, the angle adjustment component adjusts the film cutting knife 21 to the preset film cutting angle, and cooperates with the transport unit 3 to remove the film at the straight edge 11 of the wafer. Not only is the design ingenious and easy to implement, but it can also automatically adjust the cutting radius and angle, without the need to frequently adjust the film cutting position, which significantly improves the film cutting efficiency and meets the fast-paced production requirements.

[0026] As an embodiment, the X-axis driving module 30 includes an X-axis driving member 300, an X-axis guide rail 301 and a fixed frame 302. The X-axis guide rail 301 is laid on the fixed frame 302 and extends along the X direction. The driving end of the X-axis driving member 300 is connected to the X-axis moving seat 31. The X-axis driving member 300 drives the X-axis moving seat 31 to reciprocate along the X-axis guide rail 301.

[0027] As an embodiment, the Y-axis driving module 32 includes a Y-axis driving member 320 and a Y-axis guide rail 321. The Y-axis guide rail 321 is laid on the X-axis moving seat 31 and extends along the Y direction. The driving end of the Y-axis driving member 320 is connected to the Y-axis moving seat 33. The Y-axis driving member 320 drives the Y-axis moving seat 33 to reciprocate along the Y-axis guide rail 321.

[0028] As an embodiment, the Z-axis driving module 34 includes a Z-axis driving component 340 and a Z-axis guide rail 341. The Z-axis guide rail 341 is laid on the Y-axis moving seat 33 along the height direction. The driving end of the Z-axis driving component 340 is connected to the Z-axis moving seat 35. The Z-axis driving component 340 drives the Z-axis moving seat 35 to reciprocate along the Z-axis guide rail 341.

[0029] As an embodiment, the rotating unit 4 includes a rotating drive member 40 and a rotating member 41. The fixed end of the rotating drive member 40 is installed on the Z-axis movable seat 35, and the driving end of the rotating drive member 40 is connected to the rotating member 41. The rotating drive member 40 drives the rotating member 41 to rotate to drive the radial adjustment assembly 20 to rotate, and cooperates with the film cutting knife 21 to cut off the film at the circular edge 10 of the wafer.

[0030] As an embodiment, the radial adjustment assembly 20 includes a radial driving member 200 and a radial adjusting member 201. The radial driving member 200 is fixedly mounted on the rotating member 41. The driving end of the radial driving member 200 is connected to the radial adjusting member 201. The radial driving member 200 drives the radial adjusting member 201 to move radially along the rotating member 41 to adjust the film cutting radius of the film cutting knife 21.

[0031] As an embodiment, the angle adjustment assembly includes an angle driving member 5, a fixed end of the angle driving member 5 is installed on the radial adjustment member 201, a driving end of the angle driving member 5 is connected to the film cutting knife 21, and the angle driving member 5 is configured to drive the film cutting knife 21 to rotate to a preset angle and cooperate with the conveying unit 3 to cut off the film at the straight edge 11 of the wafer.

[0032] When the above-mentioned wafer film cutting mechanism is in operation: the transport units 3 cooperate with each other to transport the film cutting knife 21 to above the film sheet of the wafer to be cut, the radial driving member 200 drives the radial adjusting member 201 to move radially, and moves the film cutting knife 21 to the circular edge 10 of the wafer, the rotary driving member 40 drives the rotating member 41 to rotate, cuts off the film sheet at the circular edge 10 of the wafer and then rotates to one end of the straight edge 11 of the wafer, the angle driving member 5 drives the film cutting knife 21 to rotate to a preset angle, the Y-axis driving member 320 drives the Y-axis moving seat 33 to move, and drives the adjustment film cutting device 2 to move as a whole, and cuts off the film sheet at the straight edge 11 of the wafer.

[0033] The above embodiments are only to illustrate the basic principles and characteristics of the present invention. The present invention is not limited by the above embodiments. Without departing from the spirit and scope of the present invention, the present invention may be subject to various changes and modifications, which are within the scope of the present invention. The scope of protection of the present invention is defined by the attached claims and their equivalents.

Claims

1. A wafer film cutting mechanism, characterized in that: The wafer film cutting mechanism comprises a three-axis transport mechanism and an adjustment film cutting device, wherein the driving end of the three-axis transport mechanism is connected to the adjustment film cutting device, wherein: The three-axis transport mechanism includes a transport unit and a rotation unit, the transport unit includes an X-axis drive component, a Y-axis drive component and a Z-axis drive component, the X-axis drive component includes an X-axis drive module and an X-axis movable seat, the X-axis movable seat can be assembled on the X-axis drive module for reciprocating movement along the X-axis, the Y-axis drive component is installed on the X-axis movable seat, the Y-axis drive component includes a Y-axis drive module and a Y-axis movable seat, the Y-axis movable seat can be assembled on the Y-axis drive module for reciprocating movement along the Y-axis, the Z-axis drive component is installed on the Y-axis movable seat, the Z-axis drive component includes a Z-axis drive module and a Z-axis movable seat, the Z-axis movable seat can be assembled on the Z-axis drive module for reciprocating movement along the Z-axis, the rotation unit is fixedly installed on the Z-axis movable seat, the driving end of the rotation unit is connected to the adjustment film cutting device, and the rotation unit is configured to drive the adjustment film cutting device to rotate, The adjustable film cutting device includes a radial adjustment component, an angle adjustment component and a film cutting knife. The fixed end of the angle adjustment component is installed on the radial adjustment component, and the driving end of the angle adjustment component is connected to the film cutting knife. The radial adjustment component is configured to adjust the film cutting radius of the film cutting knife before film cutting, and the angle adjustment component is configured to adjust the film cutting knife to a preset film cutting angle.

2. The wafer film cutting mechanism according to claim 1, characterized in that: The X-axis driving module includes an X-axis driving member, an X-axis guide rail and a fixed frame. The X-axis guide rail is laid on the fixed frame and extends along the X direction. The driving end of the X-axis driving member is connected to the X-axis moving seat. The X-axis driving member drives the X-axis moving seat to reciprocate along the X-axis guide rail.

3. The wafer film cutting mechanism according to claim 1, characterized in that: The Y-axis driving module includes a Y-axis driving member and a Y-axis guide track. The Y-axis guide track is laid on the X-axis moving seat and extends along the Y direction. The driving end of the Y-axis driving member is connected to the Y-axis moving seat. The Y-axis driving member drives the Y-axis moving seat to reciprocate along the Y-axis guide track.

4. The wafer film cutting mechanism according to claim 1, characterized in that: The Z-axis driving module includes a Z-axis driving member and a Z-axis guide track. The Z-axis guide track is laid on the Y-axis moving seat along the height direction. The driving end of the Z-axis driving member is connected to the Z-axis moving seat. The Z-axis driving member drives the Z-axis moving seat to reciprocate along the Z-axis guide track.

5. The wafer film cutting mechanism according to claim 4, characterized in that: The rotating unit includes a rotating drive member and a rotating member. The fixed end of the rotating drive member is installed on the Z-axis movable seat, and the driving end of the rotating drive member is connected to the rotating member. The rotating drive member drives the rotating member to rotate to drive the radial adjustment assembly to rotate, and cooperates with the film cutting knife to cut off the film at the circular edge of the wafer.

6. The wafer film cutting mechanism according to claim 5, characterized in that: The radial adjustment assembly includes a radial driving member and a radial adjusting member. The radial driving member is fixedly mounted on the rotating member. The driving end of the radial driving member is connected to the radial adjusting member. The radial driving member drives the radial adjusting member to move radially along the rotating member to adjust the film cutting radius of the film cutting knife.

7. The wafer film cutting mechanism according to claim 6, characterized in that: The angle adjustment assembly includes an angle driving member, a fixed end of which is mounted on the radial adjustment member, a driving end of which is connected to the film cutting knife, and the angle driving member is configured to drive the film cutting knife to rotate to a preset angle and cooperate with the transport unit to cut off the film at the straight edge of the wafer.

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