Chip test sorting machine

Abstract

The utility model discloses a chip testing and sorting machine which comprises a blue film tensioning mechanism and a substrate conveying mechanism, comprising a first driving mechanism, a swing arm, a first material taking mechanism, a test bench, a variable temperature adjusting assembly, a second driving mechanism and a second material taking mechanism. The test board is arranged between the blue film tensioning mechanism and the substrate conveying mechanism, the swing arm is provided with a first material taking mechanism, and the first driving mechanism is used for driving the swing arm to swing between the test board and the blue film tensioning mechanism in a reciprocating mode; the variable temperature adjusting assembly is arranged on the test board; the second driving mechanism is used for driving the second material taking mechanism to reciprocate between the test bench and the substrate transmission mechanism. According to the chip testing and sorting machine, the swing arm is matched with the first material taking mechanism to take and place the chips to the testing table, the temperature of the testing table and the temperatures of the chips are changed through the temperature changing adjusting assembly, then function testing is conducted on the chips, and the chips can be sorted according to the testing result. Wherein the swing arm is high in moving speed and high in working efficiency, and the chip testing efficiency can be improved.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor chip manufacturing, in particular to a chip testing and sorting machine. Background Art

[0002] After the chip is packaged in the packaging factory, it is necessary to undergo high and low temperature tests. High and low temperature testing refers to performing some functional tests on the chip under high or low temperature conditions, analyzing the test results, and then sorting the chips according to the test results. During the high and low temperature testing process, the chip is usually removed from the blue film by a material taking mechanism and then placed on the test bench. The prior art usually uses an XY axis displacement mechanism or a swing arm mechanism to pick up the chip. The use of an XY axis displacement mechanism for loading can ensure a higher position accuracy, but the moving speed is slow and the test efficiency is low. Therefore, it is necessary to provide a high-efficiency chip testing and sorting machine. Utility Model Content

[0003] The technical problem to be solved by the utility model is to provide a high-precision and high-efficiency chip testing and sorting machine.

[0004] In order to solve the above technical problems, the technical solution adopted by the utility model is: a chip testing and sorting machine, including a blue film tensioning mechanism and a substrate transmission mechanism; including a first driving mechanism, a swing arm, a first material picking mechanism, a test bench, a variable temperature adjustment component, a second driving mechanism and a second material picking mechanism; the test bench is arranged between the blue film tensioning mechanism and the substrate transmission mechanism, the swing arm is provided with the first material picking mechanism, the first driving mechanism is used to drive the swing arm to swing back and forth between the test bench and the blue film tensioning mechanism; the variable temperature adjustment component is arranged on the test bench; the second driving mechanism is used to drive the second material picking mechanism to move back and forth between the test bench and the substrate transmission mechanism.

[0005] Furthermore, it also includes a recognition camera, which is arranged above the test bench.

[0006] Furthermore, the test bench includes a carrier, a first X-axis driving mechanism and a first Y-axis driving mechanism, the first Y-axis driving mechanism is drivingly connected to the first X-axis driving mechanism, and the first X-axis driving mechanism is drivingly connected to the carrier.

[0007] Furthermore, the first X-axis driving mechanism or the first Y-axis driving mechanism is a linear slide module.

[0008] Furthermore, the recognition camera is a CCD camera.

[0009] Furthermore, the first material picking mechanism or the second material picking mechanism is a vacuum suction cup.

[0010] Furthermore, it also includes a second Y-axis driving mechanism and a temperature detector, and the second Y-axis driving mechanism is used to drive the temperature detector to approach or move away from the test bench.

[0011] Furthermore, the temperature variable adjustment component is a heating tube or a heating plate.

[0012] Furthermore, the first driving mechanism includes a first Z-axis driving mechanism and a rotation driving mechanism, the first Z-axis driving mechanism is drivingly connected to the rotation driving mechanism, and the rotation driving mechanism is drivingly connected to the swing arm.

[0013] Furthermore, the second driving mechanism includes a second X-axis driving mechanism and a second Z-axis driving mechanism, the second X-axis driving mechanism is drivingly connected to the second Z-axis driving mechanism, and the second Z-axis driving mechanism is drivingly connected to the second material picking mechanism.

[0014] The beneficial effect of the utility model is that the chip test sorting machine adopts a swing arm to cooperate with the first material taking mechanism to take and place the chip from the blue film tensioning mechanism to the test bench, and uses the variable temperature adjustment component on the test bench to change the temperature of the test bench and the chip, and then performs a functional test on the chip to sort the chip according to the test result, and the second driving mechanism cooperates with the second material taking mechanism to take and place the sorted chip to different areas of the substrate on the substrate transmission mechanism. The swing arm has a fast moving speed and high working efficiency, which is conducive to improving the chip testing efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 This is a schematic diagram of the overall structure of a chip testing and sorting machine according to the first embodiment of the present utility model;

[0016] Figure 2 This is a schematic diagram of the structure of a test bench in a chip test sorting machine according to the first embodiment of the utility model.

[0017] Description of labels:

[0018] 1. Blue film tensioning mechanism;

[0019] 2. Substrate transmission mechanism;

[0020] 3. First drive mechanism; 31. First Z-axis drive mechanism; 32. Rotation drive mechanism;

[0021] 4. Swing arm; 41. First material taking mechanism;

[0022] 5. Test bench; 51. Material carrier; 511. Temperature-variable adjustment component; 52. First X-axis driving mechanism; 53. First Y-axis driving mechanism;

[0023] 6. Second drive mechanism; 61. Second X-axis drive mechanism; 62. Second Z-axis drive mechanism;

[0024] 7. Second material taking mechanism;

[0025] 8. Identify the camera;

[0026] 91. A second Y-axis driving mechanism; 92. A temperature detector. DETAILED DESCRIPTION

[0027] In order to explain the technical content, achieved objectives and effects of the present invention in detail, the following is an explanation in conjunction with the implementation modes and the accompanying drawings.

[0028] Please refer to Figure 1 and Figure 2 , a chip testing and sorting machine includes a blue film tensioning mechanism 1 and a substrate transmission mechanism 2; including a first driving mechanism 3, a swing arm 4, a first material picking mechanism 41, a test table 5, a variable temperature adjustment component 511, a second driving mechanism 6 and a second material picking mechanism 7; the test table 5 is arranged between the blue film tensioning mechanism 1 and the substrate transmission mechanism 2, the swing arm 4 is provided with the first material picking mechanism 41, the first driving mechanism 3 is used to drive the swing arm 4 to swing back and forth between the test table 5 and the blue film tensioning mechanism 1; the variable temperature adjustment component 511 is arranged on the test table 5; the second driving mechanism 6 is used to drive the second material picking mechanism 7 to move back and forth between the test table 5 and the substrate transmission mechanism 2.

[0029] From the above description, it can be seen that the beneficial effects of the utility model are: the chip test sorting machine adopts the swing arm 4 to cooperate with the first material picking mechanism 41 to pick up and place the chip from the blue film tensioning mechanism 1 to the test table 5, and uses the variable temperature adjustment component 511 on the test table 5 to change the temperature of the test table 5 and the chip, and then performs a functional test on the chip to sort the chip according to the test results, and the second driving mechanism 6 cooperates with the second material picking mechanism 7 to pick up and place the sorted chips to different areas of the substrate on the substrate transmission mechanism 2. The swing arm 4 has a fast moving speed and high working efficiency, which is conducive to improving the chip testing efficiency.

[0030] Furthermore, it also includes a recognition camera 8, which is arranged above the test bench 5.

[0031] It can be seen from the above description that the recognition camera 8 can be used to recognize whether the chip is placed on the test bench 5 and whether it is placed accurately, so that the test bench 5 can perform functional testing on the chip.

[0032] Furthermore, the test bench 5 includes a carrier 51 , a first X-axis driving mechanism 52 and a first Y-axis driving mechanism 53 , wherein the first Y-axis driving mechanism 53 is drivingly connected to the first X-axis driving mechanism 52 , and the first X-axis driving mechanism 52 is drivingly connected to the carrier 51 .

[0033] From the above description, it can be known that the first X-axis driving mechanism 52 and the first Y-axis driving mechanism 53 can cooperate with the recognition camera 8 to adjust the position of the test bench 5 so that the chip can be accurately placed on the preset test position of the test bench 5.

[0034] Furthermore, the first X-axis driving mechanism 52 or the first Y-axis driving mechanism 53 is a linear slide module.

[0035] It can be seen from the above description that the first X-axis driving mechanism 52 or the first Y-axis driving mechanism 53 is easy to obtain and use, and has a high movement accuracy.

[0036] Furthermore, the recognition camera 8 is a CCD camera.

[0037] It can be seen from the above description that the recognition result of the recognition camera 8 is accurate and efficient.

[0038] Furthermore, the first material picking mechanism 41 or the second material picking mechanism 7 is a vacuum suction cup.

[0039] It can be seen from the above description that the first material taking mechanism 41 or the second material taking mechanism 7 is easy to obtain and use.

[0040] Furthermore, it also includes a second Y-axis driving mechanism 91 and a temperature detector 92 , and the second Y-axis driving mechanism 91 is used to drive the temperature detector 92 to approach or move away from the test bench 5 .

[0041] As can be seen from the above description, the temperature detector 92 is used to detect the temperature of the test bench 5 so that the temperature-variable adjustment component 511 can accurately adjust the temperature of the test position of the test bench 5 to a preset value.

[0042] Furthermore, the temperature variable adjustment component 511 is a heating tube or a heating plate.

[0043] It can be seen from the above description that the temperature variable adjustment component 511 has a simple structure and is easy to use.

[0044] Furthermore, the first driving mechanism 3 includes a first Z-axis driving mechanism 31 and a rotation driving mechanism 32 , the first Z-axis driving mechanism 31 is drivingly connected to the rotation driving mechanism 32 , and the rotation driving mechanism 32 is drivingly connected to the swing arm 4 .

[0045] It can be known from the above description that the first Z-axis driving mechanism 31 is used to drive the swing arm 4 to move downward so as to enable the first picking mechanism 41 to pick up the chip on the blue film tensioning mechanism 1 or place the chip on the test bench 5 .

[0046] Furthermore, the second driving mechanism 6 includes a second X-axis driving mechanism 61 and a second Z-axis driving mechanism 62 , the second X-axis driving mechanism 61 is drivingly connected to the second Z-axis driving mechanism 62 , and the second Z-axis driving mechanism 62 is drivingly connected to the second material picking mechanism 7 .

[0047] From the above description, it can be seen that the second X-axis driving mechanism 61 is used to drive the second material picking mechanism 7 to reciprocate between the test table 5 and the substrate transmission mechanism 2, and the second Z-axis driving mechanism 62 is used to drive the second material picking mechanism 7 to approach or move away from the test table 5 and the substrate transmission mechanism 2.

[0048] Please refer to Figure 1 and Figure 2 , Embodiment 1 of the utility model is: a chip testing and sorting machine, comprising a blue film tensioning mechanism 1 and a substrate transmission mechanism 2; comprising a first driving mechanism 3, a swing arm 4, a first material picking mechanism 41, a test bench 5, a variable temperature adjustment component 511, a second driving mechanism 6 and a second material picking mechanism 7; the test bench 5 is arranged between the blue film tensioning mechanism 1 and the substrate transmission mechanism 2, the swing arm 4 is provided with a first material picking mechanism 41, the first driving mechanism 3 is used to drive the swing arm 4 to swing back and forth between the test bench 5 and the blue film tensioning mechanism 1; the variable temperature adjustment component 511 is arranged on the test bench 5; the second driving mechanism 6 is used to drive the second material picking mechanism 7 to move back and forth between the test bench 5 and the substrate transmission mechanism 2.

[0049] Specifically, the first material picking mechanism 41 and the second material picking mechanism 7 are vacuum suction cups. The first driving mechanism 3 includes a first Z-axis driving mechanism 31 and a rotating driving mechanism 32, the first Z-axis driving mechanism 31 is drivingly connected to the rotating driving mechanism 32, and the rotating driving mechanism 32 is drivingly connected to the swing arm 4. The first Z-axis driving mechanism 31 is used to drive the swing arm 4 to move downward so that the first material picking mechanism 41 picks up the chip on the blue film tensioning mechanism 1 or places the chip on the test bench 5. Optionally, the variable temperature adjustment component 511 is a heating tube or a heating plate.

[0050] The chip test sorting machine also includes an identification camera 8, which is arranged above the test bench 5. The test bench 5 includes a carrier 51, a first X-axis drive mechanism 52 and a first Y-axis drive mechanism 53, the first Y-axis drive mechanism 53 is drivingly connected to the first X-axis drive mechanism 52, and the first X-axis drive mechanism 52 is drivingly connected to the carrier 51. The variable temperature adjustment component 511 is arranged on the carrier 51 of the test bench 5. The identification camera 8 is used to obtain image information of the chip on the first material picking mechanism 41, and the first X-axis drive mechanism 52 and the first Y-axis drive mechanism 53 can adjust the position of the test bench 5 according to the image information obtained by the identification camera 8, so that the chip can be accurately placed on the preset test position of the test bench 5. The identification camera 8 is preferably a CCD camera.

[0051] The second drive mechanism 6 includes a second X-axis drive mechanism 61 and a second Z-axis drive mechanism 62, the second X-axis drive mechanism 61 is drivingly connected to the second Z-axis drive mechanism 62, and the second Z-axis drive mechanism 62 is drivingly connected to the second material taking mechanism 7. The first X-axis drive mechanism 52 and the first Y-axis drive mechanism 53 are preferably linear slide modules.

[0052] The chip test sorting machine also includes a second Y-axis driving mechanism 91 and a temperature detector 92. The second Y-axis driving mechanism 91 is used to drive the temperature detector 92 to approach or move away from the test bench 5. The temperature detector 92 is used to detect the temperature of the test bench 5, so that the temperature-variable adjustment component 511 accurately adjusts the temperature of the test position of the test bench 5 to a preset value. The second Y-axis driving mechanism 91 is used to move the temperature detector 92 away from the test bench 5 after measuring the temperature to avoid hindering the movement of other mechanisms.

[0053] The working principle of the first embodiment of the utility model is as follows: the variable temperature adjustment component 511 heats the test bench 5 to a preset temperature, the second Y-axis driving mechanism 91 drives the temperature detector 92 to move above the test bench 5 to detect the temperature of the test bench 5, and after the temperature of the test bench 5 reaches the preset value, the second Y-axis driving mechanism 91 drives the temperature detector 92 away from the test bench 5, and the variable temperature adjustment component 511 keeps the test bench 5 at the current temperature; the rotary driving mechanism 32 drives the swing arm 4 and the first material picking mechanism 41 to rotate above the blue film tensioning mechanism 1, the first Z-axis driving mechanism 31 drives the swing arm 4 and the first material picking mechanism 41 to descend so that the first material picking mechanism 41 picks up the chip to be tested, the first Z-axis driving mechanism 31 drives the swing arm 4 and the first material picking mechanism 41 to rise, and the rotary driving mechanism 32 drives the swing arm 4 and the first material picking mechanism 41 to rotate above the test bench 5; the recognition camera 8 takes a photo to identify the position of the chip, the first X-axis driving mechanism 52 and the first Y-axis driving mechanism 53 adjust the loading seat 51 The first Z-axis driving mechanism 31 drives the swing arm 4 and the first material picking mechanism 41 to descend so that the first material picking mechanism 41 can accurately place the chip to be tested on the test table 5; the first Z-axis driving mechanism 31 drives the swing arm 4 and the first material picking mechanism 41 back to the top of the blue film tensioning mechanism 1 to wait for the next chip to be picked up; the test table 5 performs functional tests on the chips and sorts the chips according to the test results, the second X-axis driving mechanism 61 drives the second Z-axis driving mechanism 62 and the second material picking mechanism 7 to move above the test table 5, the second Z-axis driving mechanism 62 drives the second material picking mechanism 7 to move downward to pick up the chip, the second Z-axis driving mechanism 62 drives the second material picking mechanism 7 and the chip to rise, the second X-axis driving mechanism 61 drives the second Z-axis driving mechanism 62 and the second material picking mechanism 7 to move above the corresponding area of ​​the substrate transmission mechanism 2, and the second Z-axis driving mechanism 62 drives the second material picking mechanism 7 and the chip to descend to place the chip on the corresponding area of ​​the substrate.

[0054] In summary, the chip test sorting machine provided by the utility model adopts a swing arm in cooperation with the first material taking mechanism to take and place the chip from the blue film tensioning mechanism to the test bench, and uses the variable temperature adjustment component on the test bench to change the temperature of the test bench and the chip, and then performs a functional test on the chip to sort the chip according to the test results, and the second driving mechanism cooperates with the second material taking mechanism to take and place the sorted chip to different areas of the substrate on the substrate transmission mechanism. The swing arm has a fast moving speed and high working efficiency, which is conducive to improving the chip testing efficiency.

[0055] The above description is only an embodiment of the present invention, and does not limit the patent scope of the present invention. Any equivalent transformations made using the contents of the specification and drawings of the present invention, or directly or indirectly applied in the relevant technical field, are also included in the patent protection scope of the present invention.

Claims

1. A chip testing and sorting machine, comprising a blue film tensioning mechanism and a substrate transmission mechanism; characterized in that: It includes a first driving mechanism, a swing arm, a first material picking mechanism, a test bench, a variable temperature adjustment component, a second driving mechanism and a second material picking mechanism; the test bench is arranged between the blue film tensioning mechanism and the substrate transmission mechanism, the swing arm is provided with the first material picking mechanism, the first driving mechanism is used to drive the swing arm to swing back and forth between the test bench and the blue film tensioning mechanism; the variable temperature adjustment component is arranged on the test bench; the second driving mechanism is used to drive the second material picking mechanism to move back and forth between the test bench and the substrate transmission mechanism.

2. The chip testing and sorting machine according to claim 1, characterized in that: It also includes a recognition camera, which is arranged above the test bench.

3. The chip testing and sorting machine according to claim 2, characterized in that: The test bench includes a material carrier, a first X-axis driving mechanism and a first Y-axis driving mechanism. The first Y-axis driving mechanism is drivingly connected to the first X-axis driving mechanism, and the first X-axis driving mechanism is drivingly connected to the material carrier.

4. The chip testing and sorting machine according to claim 3, characterized in that: The first X-axis driving mechanism or the first Y-axis driving mechanism is a linear slide module.

5. The chip testing and sorting machine according to claim 2, characterized in that: The recognition camera is a CCD camera.

6. The chip testing and sorting machine according to claim 1, characterized in that: The first material picking mechanism or the second material picking mechanism is a vacuum suction cup.

7. The chip testing and sorting machine according to claim 1, characterized in that: It also includes a second Y-axis driving mechanism and a temperature detector, wherein the second Y-axis driving mechanism is used to drive the temperature detector to approach or move away from the test bench.

8. The chip testing and sorting machine according to claim 1, characterized in that: The temperature-variable regulating component is a heating tube or a heating plate.

9. The chip testing and sorting machine according to claim 1, characterized in that: The first driving mechanism comprises a first Z-axis driving mechanism and a rotation driving mechanism. The first Z-axis driving mechanism is drivingly connected to the rotation driving mechanism, and the rotation driving mechanism is drivingly connected to the swing arm.

10. The chip testing and sorting machine according to claim 1, characterized in that: The second driving mechanism includes a second X-axis driving mechanism and a second Z-axis driving mechanism, the second X-axis driving mechanism is drivingly connected to the second Z-axis driving mechanism, and the second Z-axis driving mechanism is drivingly connected to the second material picking mechanism.

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