Cold air heat dissipation cook machine

Abstract

The utility model provides a cold air heat dissipation chef machine, and belongs to the technical field of chef machines, the cold air heat dissipation chef machine comprises a machine body, a stirring basin and a stirring rod, the machine body is detachably connected with the stirring basin, the stirring rod is arranged in the stirring basin, the cold air heat dissipation chef machine further comprises a cooling part and an air guide assembly, and the cooling part and the air guide assembly are both arranged in the machine body. The air guide assembly is provided with an air outlet, and the air outlet is located above the stirring basin. The cooling component is controlled by the control component to cool air, and then the low-temperature air is conveyed into the stirring basin by the air guide component, so that on one hand, dough is directly and uniformly cooled, on the other hand, the stirring basin is cooled by the low-temperature air, and the dough is indirectly cooled through contact between the stirring basin and the dough; the problem of dough acidification caused by advanced activation of yeast is effectively avoided, and dough quality is guaranteed.

Description

Technical Field

[0001] The utility model belongs to the technical field of food processors, and in particular relates to a cold air heat dissipation food processor. Background Art

[0002] A food processor is a multifunctional kitchen appliance belonging to the field of Chinese and Western pastry, which is mainly used for stirring, beating eggs, and kneading dough. During the kneading process of the food processor, the dough needs to be kneaded for a long time in order to make the dough form a film and ensure the taste. However, during the long kneading process, the dough is easily heated when it is beaten in the container, and when the surrounding environment is high, it is also easy to affect the dough, causing it to ferment prematurely, resulting in a sour taste and affecting the quality of the final dough. Therefore, it is very important to control the temperature of the dough during the kneading process. In existing food processors, the mixing bowl is usually cooled to control the temperature rise of the dough during the kneading process. For example, the Chinese utility model with publication number CN210114001 U realizes the cooling of the mixing bowl during the kneading process of the food processor by providing a semiconductor cooling plate at the connection between the control base and the mixing bowl, thereby reducing the temperature of the dough. However, this cooling method has the defect that the container is cooled unevenly and the heat cannot be evenly distributed to different parts of the dough. There is still room for improvement. Utility Model Content

[0003] The utility model aims to solve the deficiencies in the prior art and provides a cold air heat dissipation food processor, which can solve the problem that the food processor cannot evenly dissipate heat to the dough when kneading dough, causing the dough to ferment prematurely.

[0004] The specific technical solutions of the present invention are provided below:

[0005] The present application provides a cold air heat dissipation food processor, comprising a body, a mixing bowl, and a stirring rod, wherein the body is detachably connected to the mixing bowl, and the stirring rod is arranged in the mixing bowl. The application also comprises a cooling component and an air guide assembly, and both the cooling component and the air guide assembly are arranged in the body. The air guide assembly has an air outlet, and the air outlet is located above the mixing bowl. The cooling component is used to generate low-temperature air, and the air guide assembly sends the low-temperature air into the mixing bowl. Specifically, the cooling component utilizes the principle of heat conduction to transfer the heat of the cooled air to the cooling component, thereby reducing its temperature, and then the air guide assembly transports the low-temperature air from the air outlet into the mixing bowl. The low-temperature air provided during the dough kneading process of this food processor can reduce the temperature of the dough and prevent the dough from fermenting prematurely. The implementation method is simple and the cooling effect is good.

[0006] In a preferred technical solution of the present invention, the cooling component includes a semiconductor refrigeration plate, which has a heating end and a cooling end, wherein the heating end is located on one side of the cooling end; a cooling cavity is provided on the cooling end, an air inlet is provided in the cooling cavity, and the cooling cavity is connected to the air guide component. The cooling end exchanges heat with the air entering the cooling cavity, lowering the temperature of the cooled air, and then conducts the absorbed heat to the heating end; the heating end conducts its own heat to the air by contacting with the outside air, and cooperates with the cooling end to complete the refrigeration cycle. The cooled air enters the air guide component from the cooling cavity, and the next batch of air subsequently enters the cooling cavity, thereby achieving continuous cooling of the air.

[0007] In a preferred technical solution of the present invention, an S-shaped air duct is provided in the cooling chamber, one end of the S-shaped air duct is connected to the air inlet, and the other end is connected to the air guide assembly. The S-shaped air duct extends the travel distance of the cooled air and increases the cooling time.

[0008] In a preferred embodiment of the present invention, the air guide assembly includes an air guide tube and an air guide pump, wherein the air guide pump is disposed on the air guide tube; the air guide tube is provided with an air inlet and an air outlet, wherein the air inlet is connected to the cooling chamber. Specifically, the air guide pump provides driving force for the air, and since the air guide tube inlet is connected to the cooling chamber, the air guide tube can be used to transport low-temperature air.

[0009] In a preferred embodiment of the present invention, a control component is further included. The control component includes a control mainboard and a control switch. The control mainboard is disposed within the housing, and the control switch is disposed on the housing. The control mainboard is electrically connected to the control switch, the air pump, and the semiconductor cooling sheet. Specifically, the control switch activates and deactivates the cooling function, and the control mainboard is connected to the control switch and receives signals from the control switch to control the operation of the air pump and the semiconductor cooling sheet.

[0010] In a preferred embodiment of the present invention, the control board is located above and connected to the cooling chamber. When the food processor is operating, the semiconductor cooling element simultaneously cools the control board and the air in the cooling chamber, allowing the heat generated by the control board to be absorbed by the cooling element, thereby reducing the operating temperature of the control components.

[0011] In a preferred embodiment of the present invention, the bottom of the housing is provided with a plurality of heat dissipation holes, located below the heating end. As will be appreciated, since the heating end is located within the housing, the heat released tends to accumulate within the housing, causing the internal temperature to rise, thereby affecting the cooling rate of the air at the cooling end and the heat release rate at the heating end. The provision of heat dissipation holes facilitates heat dissipation, and the heating end is exposed to more external air through the air flow through the heat dissipation holes.

[0012] In a preferred embodiment of the present invention, the air guide assembly is provided with two air outlets, both of which are located above the mixing bowl and are symmetrical about the axis of the mixing bowl. Specifically, the two air outlets are located above the mixing bowl and on either side of the stirring rod, allowing low-temperature air to be blown simultaneously to both sides of the dough in the mixing bowl, thereby achieving a uniform heat dissipation effect.

[0013] In a preferred technical solution of the present invention, a mounting plate is provided in the body, and the air pump is fixed to the mounting plate. It is understood that the mounting plate can fix the air pump to prevent the air pump from falling off and being damaged during movement of the body, and to keep the air pump stable during operation.

[0014] The specific implementation process is as follows: when the food processor is working, the semiconductor refrigeration chip operates to lower the temperature of the cooling end, and the air inlet on the cooling chamber is used to allow the outside air to flow in and contact with the cooling end with a lower temperature, thereby lowering the temperature of the cooled air. Subsequently, the air pump is used to drive the low-temperature air through the air inlet into the air duct, and finally sent into the mixing bowl to blow on the dough to dissipate heat.

[0015] The beneficial effects of the present invention include at least:

[0016] The present invention provides a cold air heat dissipation food processor, comprising a body, a mixing bowl, and a stirring rod. The body is detachably connected to the mixing bowl, and the stirring rod is disposed in the mixing bowl. The present invention also includes a cooling component and an air guide assembly, both of which are disposed in the body. The air guide assembly has an air outlet, and the air outlet is located above the mixing bowl. When kneading dough, the cooling component can be controlled by a control component to cool the air, and the air guide assembly then delivers the low-temperature air to the mixing bowl. Through this method, the food processor can directly and evenly cool the dough. Furthermore, heat conduction between the low-temperature air and the mixing bowl lowers the temperature of the mixing bowl. Secondarily, the mixing bowl and the dough are in full contact for secondary heat conduction, which indirectly dissipates heat from the dough. The present invention can continuously generate low-temperature air and blow it into the mixing bowl, evenly dissipating heat from the dough during mixing, thereby achieving the purpose of controlling the dough temperature when the temperature is high. This effectively solves the problem of premature yeast activation, which causes large-scale gas production and premature gasification and acidification of the dough, thereby ensuring dough quality. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 This is an overall schematic diagram of a cold air cooling food processor provided by the present application;

[0018] Figure 2 This is a schematic diagram of the internal structure of a cold air cooling food processor provided by the present application;

[0019] Figure 3 This is another schematic diagram of the internal structure of a cold air cooling food processor provided by the present application;

[0020] Figure 4 This is a diagram showing the internal structure of the lower portion of a cold air cooling food processor provided by the present application;

[0021] Figure 5 This is a schematic diagram of the heat dissipation holes of a cold air heat dissipation food processor provided by the present application;

[0022] Figure 6 It is a schematic diagram of the S-shaped air duct of Example 2 of the present application.

[0023] Reference numerals:

[0024] 1. Machine body; 2. Mixing bowl; 3. Mixing rod; 4. Cooling component; 401. Semiconductor refrigeration chip; 4011. Heating end; 4012. Cooling end; 5. Air guide assembly; 501. Air guide tube; 5011. Air outlet; 5012. Air inlet; 502. Air pump; 6. Control component; 601. Control main board; 602. Control switch; 7. Cooling chamber; 701. S-shaped air duct; 702. Air inlet; 8. Heat dissipation hole; 9. Mounting plate. DETAILED DESCRIPTION

[0025] The following describes preferred embodiments of the present invention in more detail with reference to the accompanying drawings. Although preferred embodiments of the present invention are shown in the accompanying drawings, it should be understood that the present invention can be implemented in various forms and should not be limited by the embodiments described herein. Rather, these embodiments are provided to make the present invention more thorough and complete, and to fully convey the scope of the present invention to those skilled in the art.

[0026] In the description of the present invention, the directions or positional relationships indicated by the terms "up", "down", "left" and "right" are based on the directions or positional relationships shown in the accompanying drawings. They are only for the convenience of describing the present invention and do not require that the present invention must be constructed and operated in a specific direction. Therefore, they should not be understood as limitations on the present invention.

[0027] Example 1

[0028] See also Figures 1 to 5As shown, the present application provides a cold air heat dissipation food processor, comprising a body 1, a mixing bowl 2, and a stirring rod 3. The body 1 and mixing bowl 2 are detachably connected. The base of the body 1 is provided with a mounting position, and the bottom of the mixing bowl 2 is adapted to engage with the mounting position. The stirring rod 3 is disposed within the mixing bowl 2, with one end connected to the output port of the body 1 and the other end suspended within the mixing bowl 2. The processor also includes a cooling unit 4 and an air guide assembly 5, both disposed within the body 1, with the cooling unit 4 disposed within the base of the body 1. The air guide assembly 5 has an air outlet 5011, which is located above the mixing bowl 2 and on a side of the body 1. The cooling unit 4 is used to generate low-temperature air, which is then delivered by the air guide assembly 5 into the mixing bowl 2. Specifically, the outside air first absorbs heat from the cooling unit 4, cooling it to low-temperature air. The air then enters the air guide assembly 5, where it is conveyed through the air outlet 5011 above the mixing bowl 2 and into the mixing bowl 2. It is understandable that the air guide assembly 5 is fully sealed to ensure air guide performance. Further, the mixing bowl 2 can be other containers such as a mixing pot, a mixing cup, etc.

[0029] Furthermore, the cooling component 4 includes a semiconductor refrigeration plate 401, which has a heating end 4011 and a cooling end 4012. The heating end 4011 is located on one side of the cooling end 4012. The cooling end 4012 is provided with a cooling chamber 7, which has an air inlet 702 and is connected to the air guide component 5. The cooling end 4012 exchanges heat with the air entering the cooling chamber 7. The cooling end 4012, which has a lower temperature, absorbs the heat of the cooled air, lowering the temperature of the cooled air, and then transfers the absorbed heat to the heating end 4011. The heating end 4011 transfers its own heat to the outside air through contact with the lower temperature outside air, and cooperates with the cooling end 4012 to complete the refrigeration cycle. The cooled air enters the air guide component 5 from the cooling chamber 7, and the next batch of air subsequently enters the cooling chamber 7, thereby achieving continuous cooling of the air. It can be understood that a heat exchange area is left below the heating end 4011, which is beneficial to the heat dissipation of the heating end 4011 and improves work efficiency.

[0030] Furthermore, the air guide assembly 5 includes an air guide tube 501 and an air guide pump 502. The air guide pump 502 is disposed on the air guide tube 501. The air guide tube 501 is provided with an air inlet 5012 and an air outlet 5011. The air inlet 5012 is connected to the cooling chamber 7. Specifically, the air guide pump 502 connects two sections of the air guide tube 501, one of which has an air outlet 5011 and the other has an air inlet 5012. The air guide pump 502 provides a gas driving force for the air, allowing the air to flow through the air guide tube 501. The air guide tube 501 section with the air outlet 5011 is located at the top of the body 1 and is arranged around the top edge.

[0031] Furthermore, the device further includes a control component 6, which includes a control mainboard 601 and a control switch 602. The control mainboard 601 is disposed in the housing 1, and the control switch 602 is disposed on the outer shell of the housing 1. The control mainboard 601 is electrically connected to the control switch 602, the air pump 502, and the semiconductor cooling plate 401. Specifically, the control switch 602 controls the start and stop of the cooling function. The control mainboard 601 is connected to the control switch 602 and receives signals from the control switch 602 to control the operation of the air pump 502 and the semiconductor cooling plate 401. Furthermore, the function of controlling the speed of the air pump 502 can be added. By replacing the air pump 502 with a higher power and regulating the power of the air pump 502 by the control mainboard 601, the blowing speed of the cold air can be changed within a certain range. It is understood that the cooling component 4 with a faster cooling rate can be replaced accordingly.

[0032] Furthermore, the control mainboard 601 is located above the cooling chamber 7 and is connected to the cooling chamber 7. Specifically, when the food processor is in operation, the semiconductor cooling plate 401 can simultaneously cool the control mainboard 601 and the air in the cooling chamber 7, so that the heat generated by the control mainboard 601 is first absorbed by the cooled air and then absorbed by the cooling end 4012, thereby reducing the temperature of the control mainboard 601 during operation, so that the control mainboard 601 is maintained in a lower temperature range, thereby increasing the service life of the control mainboard 601.

[0033] Furthermore, a plurality of heat dissipation holes 8 are provided at the bottom end of the body 1, and the heat dissipation holes 8 are located below the heating end 4011. It is understandable that after the cooling component 4 absorbs the heat of the cooled air, it needs to release this part of the heat. Since the body 1 is relatively sealed, the released heat is difficult to be discharged outside the body 1. At this time, the internal temperature of the body 1 will gradually increase due to the accumulation of this part of heat, causing the cooling end 4012 to absorb more heat when cooling the air with a higher temperature, resulting in a decrease in heat absorption efficiency; at the same time, the heating end 4011 cannot release more heat due to the high internal temperature, which affects the heat exchange and causes a decrease in heat release efficiency, thereby affecting the overall cooling efficiency. Therefore, the opening of the heat dissipation holes 8 on the body 1 is conducive to the discharge of heat from the internal body 1, and prevents the temperature rise from affecting the cooling. Furthermore, an exhaust fan can be provided on the outer shell of the body 1 to assist the heat dissipation holes 8 in discharging heat and improving the heat dissipation efficiency.

[0034] Furthermore, a mounting plate 9 is provided in the housing 1, and the air pump 502 is fixed on the mounting plate 9. Specifically, the mounting plate 9 is fixedly connected to the bottom of the air pump 502. The mounting plate 9 can fix the air pump 502, preventing the air pump 502 from falling off and being damaged during the movement of the housing 1, while also reducing vibration and noise generated by the operation of the air pump 502 and ensuring stability during operation.

[0035] Example 2

[0036] See also Figure 6 As shown, in this embodiment, an S-shaped air duct 701 is further provided in the cooling chamber 7. One end of the S-shaped air duct 701 is connected to the air inlet 702, and the other end is connected to the air guide assembly 5. The S-shaped air duct 701 extends the travel distance of the cooled air and increases its retention time in the cooling chamber 7, allowing the cooled air to have as much contact with the cooling end 4012 as possible, thereby improving cooling efficiency. The remaining parts of this embodiment are the same as those in Example 1 and will not be repeated here.

[0037] The above description is merely a preferred embodiment of the present invention and is not intended to limit the present invention. Those skilled in the art will readily appreciate that the present invention is susceptible to various modifications and variations. Any modifications, equivalent substitutions, or improvements made within the spirit and principles of the present invention shall be included within the scope of protection of the present invention.

Claims

1. A cold air heat dissipation food processor, comprising a machine body (1), a mixing bowl (2), and a stirring rod (3), wherein the machine body (1) and the mixing bowl (2) are detachably connected, and the stirring rod (3) is arranged in the mixing bowl (2), characterized in that: It also includes a cooling component (4) and an air guide component (5), both of which are arranged in the machine body (1); the air guide component (5) has an air outlet (5011), and the air outlet (5011) is located above the mixing basin (2); The cooling component (4) is used to generate low-temperature air, and the air guide component (5) sends the low-temperature air into the mixing basin (2).

2. The cold air heat dissipation food processor according to claim 1, characterized in that: The cooling component (4) comprises a semiconductor refrigeration plate (401), the semiconductor refrigeration plate (401) having a heating end (4011) and a cooling end (4012), the heating end (4011) being located on one side of the cooling end (4012); a cooling cavity (7) is provided on the cooling end (4012), an air inlet (702) is provided in the cooling cavity (7), and the cooling cavity (7) is in communication with the air guide component (5).

3. The cold air heat dissipation food processor according to claim 2, characterized in that: An S-shaped air duct (701) is provided in the cooling cavity (7), one end of the S-shaped air duct (701) is in communication with the air inlet (702), and the other end thereof is in communication with the air guide assembly (5).

4. The cold air heat dissipation food processor according to claim 3, characterized in that: The air guide assembly (5) comprises an air guide pipe (501) and an air guide pump (502), wherein the air guide pump (502) is arranged on the air guide pipe (501); the air guide pipe (501) is provided with an air inlet (5012) and an air outlet (5011), and the air inlet (5012) is in communication with the cooling chamber (7).

5. The cold air heat dissipation food processor according to claim 4, characterized in that: The invention also includes a control component (6), wherein the control component (6) includes a control mainboard (601) and a control switch (602). The control mainboard (601) is arranged in the machine body (1), and the control switch (602) is arranged on the outer shell of the machine body (1). The control mainboard (601) is electrically connected to the control switch (602), the air pump (502) and the semiconductor cooling plate (401).

6. The cold air heat dissipation food processor according to claim 5, characterized in that: The control main board (601) is located above the cooling cavity (7) and is connected to the cooling cavity (7).

7. The cold air heat dissipation food processor according to claim 2, characterized in that: The bottom end of the machine body (1) is provided with a plurality of heat dissipation holes (8), and the heat dissipation holes (8) are located below the heating end (4011).

8. The cold air heat dissipation food processor according to claim 4, characterized in that: The air guide component (5) is provided with two air outlets (5011), both of which are provided above the mixing basin (2), and the two air outlets (5011) are symmetrical about the axis of the mixing basin (2).

9. The cold air heat dissipation food processor according to claim 4, characterized in that: A mounting plate (9) is provided in the machine body (1), and the air guide pump (502) is fixed on the mounting plate (9).

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