Automatic chamfering machine tool for wafer substrate

Abstract

The utility model relates to the technical field of wafer substrate chamfering, and provides an automatic wafer substrate chamfering machine tool which comprises a machine tool body, a machining jig, a material preparing device, a material basket, a wafer positioning table, a basket inserting mechanical arm, a feeding and discharging mechanical arm and a spin-drying table. The deviation correction sensor is suitable for detecting the circle center position and the deflection angle of the to-be-processed wafer substrate; the basket inserting manipulator is used for transferring the to-be-processed wafer substrate from the material basket to the wafer positioning table and is matched with the wafer positioning table to adjust the circle center position and the deflection angle of the to-be-processed wafer substrate; the loading and unloading manipulator is used for loading the adjusted to-be-processed wafer substrate to the processing jig; and the spin-drying table is used for spin-drying the processed wafer substrate. According to the automatic chamfering device, secondary positioning does not need to be carried out in a machine when the wafer substrate is automatically chamfered, the influence of environment factors in the machine is avoided, the machining efficiency is improved, meanwhile, the machined wafer substrate can be spin-dried, and cutting fluid is prevented from polluting the environment.

Description

TECHNICAL FIELD

[0001] The utility model relates to wafer substrate chamfering technical field especially relates to a wafer substrate automatic chamfering machine tool. BACKGROUND

[0002] Wafer substrate automatic chamfering refers to using special chamfering equipment to carry out automatic grinding treatment to the edge of wafer substrate, so that the edge corner part is ground into chamfer or arc shape.

[0003] In the related technical field, the existing chamfering device generally needs to be positioned outside the machine when automatically chamfering the wafer substrate, and the wafer substrate is placed on the machine tool jig by the feeding and discharging manipulator, and then the wafer substrate is precisely positioned by vision inside the machine tool, the wafer substrate position is easily affected by the internal environment of the machine tool when the vision inside the machine tool recognizes the wafer substrate position, and after the wafer substrate chamfering is completed, the feeding and discharging manipulator directly places the processed wafer substrate in the basket, at this time, the wafer substrate is polluted by the cutting fluid. UTILITY MODEL CONTENTS

[0004] The utility model provides a wafer substrate automatic chamfering machine tool to solve the defects of the wafer substrate chamfering device in the prior art, which needs secondary positioning in the machine, the vision recognition is easily affected by the internal environment of the machine, the stability and reliability are poor, and the cost is high, realizes that the wafer substrate automatic chamfering does not need secondary positioning in the machine, avoids the influence of the internal environment of the machine, improves the processing efficiency, and at the same time, the processed wafer substrate can be spin-dried to avoid the pollution of the cutting fluid to the environment.

[0005] The utility model provides a wafer substrate automatic chamfering machine tool, which comprises:

[0006] The machine tool main body is movably provided with a workbench on the machine tool main body, and the workbench can reciprocate between a processing station and a feeding and discharging station along a first direction;

[0007] The processing jig is installed on the workbench;

[0008] The material preparation device is arranged in the first direction and located on the side of the feeding and discharging station;

[0009] The basket is arranged on the material preparation device, and the basket is used for storing wafer substrates;

[0010] The wafer positioning table is arranged on the material preparation device, and the wafer positioning table is provided with a deviation correction sensor, and the deviation correction sensor is suitable for detecting the center position and the deflection angle of the wafer substrate to be processed;

[0011] The inserting basket manipulator is arranged on the material preparation device, and is used for transferring the wafer substrate to be processed from the material basket to the wafer positioning table and adjusting the center position and the deflection angle of the wafer substrate to be processed in cooperation with the wafer positioning table.

[0012] The feeding and discharging manipulator is arranged on the machine tool body and located on the periphery of the feeding and discharging station, and is used for feeding the adjusted wafer substrate to be processed to the processing fixture.

[0013] The spin-drying table is arranged on the material preparation device, and is used for spin-drying the processed wafer substrate.

[0014] According to the wafer substrate automatic chamfering machine tool, the wafer positioning table comprises a deviation rectifying mounting frame, a sensor fixing plate, a vacuum rotary chuck and a rotating assembly, the deviation rectifying mounting frame is arranged on the material preparation device, the deviation rectifying sensor is arranged on the deviation rectifying mounting frame through the sensor fixing plate, the rotating assembly is arranged on the deviation rectifying mounting frame, the vacuum rotary chuck is arranged on the rotating assembly, the vacuum rotary chuck is used for adsorbing and fixing the wafer substrate to be processed, and the rotating assembly is used for driving the wafer substrate to be processed on the vacuum rotary chuck to rotate.

[0015] According to the wafer substrate automatic chamfering machine tool, the wafer positioning table further comprises a sensor moving module, the sensor moving module is connected between the sensor fixing plate and the deviation rectifying mounting frame, and the sensor moving module is used for adjusting the distance between the deviation rectifying sensor and the vacuum rotary chuck.

[0016] According to the wafer substrate automatic chamfering machine tool, the deviation rectifying sensor comprises a receiving end and a transmitting end, and detection positions are formed between the receiving end and the transmitting end.

[0017] According to the wafer substrate automatic chamfering machine tool, the inserting basket manipulator comprises a mounting table, a horizontal moving module, a height moving module, a rotating motor, a rotating shaft and an end suction disc, the height moving module is arranged on the material preparation device, the rotating motor is connected with the lifting end of the height moving module through the mounting table, the horizontal moving module is arranged on the rotating shaft, the rotating shaft is arranged on the rotating end of the rotating motor, and the end suction disc is arranged on the moving end of the horizontal moving module.

[0018] The utility model provides a kind of wafer substrate automatic chamfering machine tool, the terminal suction disc includes upper dental fork suction disc, middle dental fork suction disc and lower dental fork suction disc, a plurality of suction ports are opened on the upper dental fork suction disc, a plurality of the suction port is used to adsorb wafer substrate, suction groove is opened on the middle dental fork suction disc, air inlet is opened on the lower dental fork suction disc, the air inlet is communicated with gas source assembly, the air inlet is communicated with the suction port by the suction groove.

[0019] The utility model provides a kind of wafer substrate automatic chamfering machine tool, the feeding and discharging manipulator includes bottom plate, swing arm, lifting assembly and vacuum chuck, the bottom plate is installed on the workbench, the connecting end of the swing arm is rotatably connected with the bottom plate, the vacuum chuck is connected on the free end of the swing arm by the lifting assembly, the lifting assembly is used to drive the vacuum chuck to move along height direction.

[0020] The utility model provides a kind of wafer substrate automatic chamfering machine tool, the spin-drying table includes mounting seat, protective shell, first air cylinder, spin-drying suction disc assembly and spin-drying rotating component, the mounting seat is located on the standby device, the first air cylinder is fixed on the mounting seat, the first air cylinder stem of the first air cylinder is fixedly connected with the protective shell, the spin-drying rotating component is located on the standby device, the center position of the protective shell is equipped with through-hole, the spin-drying rotating component is connected with the protective shell by the through-hole, and one end of the spin-drying rotating component is worn out by the through-hole, the spin-drying suction disc assembly is located on the worn end of the spin-drying rotating component.

[0021] The utility model provides a kind of wafer substrate automatic chamfering machine tool, the rotary center of the feeding and discharging manipulator is on the vertical bisector of the center line of the vacuum rotating suction disc and the spin-drying suction disc assembly.

[0022] The wafer substrate automatic chamfering machine tool provided by the utility model sets wafer positioning table on standby device, detects the center position of wafer substrate to be processed and the deflection angle of processing groove through deviation rectifying sensor on wafer positioning table, then according to the center position of wafer substrate to be processed and the deflection angle obtained by detection, adjusts the center position and deflection angle of wafer substrate to be processed by the cooperation between basket inserting manipulator and wafer positioning table, improves positioning precision, without secondary positioning in machine, avoids the influence of internal environmental factors, improves processing efficiency;Meanwhile, spin-drying table is also set to spin-dry wafer substrate after processing, to avoid cutting fluid pollution environment. BRIEF DESCRIPTION OF DRAWINGS

[0023] In order to more clearly illustrate the technical solutions of the present application or the prior art, the following will briefly introduce the drawings needed to be used in the embodiments or prior art description. Obviously, the drawings in the following description are some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative labor.

[0024] Figure 1 It is the assembly schematic view of the wafer substrate automatic chamfering machine tool provided by the present application.

[0025] Figure 2 It is Figure 1 The structure schematic view of the feeding and discharging mechanical arm in the present application.

[0026] Figure 3 It is Figure 1 The structure schematic view of the basket inserting mechanical arm in the present application.

[0027] Figure 4 It is Figure 1 The structure schematic view of the wafer positioning table in the present application.

[0028] Figure 5 It is Figure 4 The sectional view of the wafer positioning table in the present application.

[0029] Figure 6 It is Figure 1 The structure schematic view of the spin-drying table in the present application.

[0030] Figure 7 It is Figure 6 The sectional view of the spin-drying table in the present application.

[0031] Figure 8 It is the structure schematic view of the wafer substrate provided by the present application.

[0032] Figure 9 It is Figure 3 The structure schematic view of the end suction disc in the present application.

[0033] Figure 10 It is Figure 9 The exploded view of the end suction disc in the present application.

[0034] Reference signs:

[0035] 1, machine tool main body; 11, bed; 12, X-axis beam; 13, column; 14, X-axis moving mechanism; 15, Y-axis moving mechanism; 16, Z-axis moving mechanism; 17, workbench;

[0036] 2, processing fixture;

[0037] 3, loading and unloading mechanical arm; 31, bottom plate; 32, third direct drive motor; 321, sixth output flange; 33, swing arm; 34, second air cylinder; 35, suction cup connecting plate; 36, vacuum suction cup; 37, guide rail; 38, sliding block;

[0038] 4, material preparation device; 41, base frame; 42, basket;

[0039] 43, basket inserting mechanical arm; 431, horizontal movement module; 4311, third output flange; 432, suction cup mounting plate; 4321, air supply hole; 433, end suction cup; 4331, upper fork suction cup; 43311, air suction port; 4332, middle fork suction cup; 43321, air suction groove; 4333, lower fork suction cup; 43331, air inlet; 4334, sealing glue; 436, mounting table; 435, rotary motor; 4351, second output flange; 434, rotating shaft; 437, height movement module; 4371, first output flange;

[0040] 44, wafer positioning table; 441, deviation correction mounting frame; 442, deviation correction sensor; 4421, transmitting end; 4422, receiving end; 443, sensor fixing plate; 444, sensor movement module; 445, vacuum rotary suction cup; 4451, first annular air groove; 4452, first air hole; 446, first direct drive motor; 4461, fourth output flange; 4462, first hollow hole; 447, first rotary joint; 4471, first air inlet; 4472, first rotary end;

[0041] 45, spin-drying table; 451, mounting seat; 4511, T-shaped groove; 452, protective shell; 4521, drain port; 4522, through hole; 453, spin-drying suction cup; 4531, second annular air groove; 4532, second air hole; 4533, annular groove; 454, second direct drive motor; 4541, fifth output flange; 4542, second hollow hole; 455, second rotary joint; 4551, second air inlet; 4552, second rotary end; 456, first air cylinder; 457, sealing ring;

[0042] 5, wafer substrate; 51, groove. DETAILED DESCRIPTION

[0043] The embodiments of the present application will be further described in conjunction with the drawings and examples. The following examples are used to illustrate the present application, but cannot be used to limit the scope of the present application.

[0044] In the description of the embodiments of the utility model, it needs to be explained that, the terms "center", "longitudinal", "transverse", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer" and the like indicate the orientation or positional relationship shown in the drawings, which is only for the convenience of describing the embodiments of the utility model and simplifying the description, and does not indicate or imply that the devices or elements indicated must have a particular orientation, be constructed and operated in a particular orientation, therefore, it cannot be understood as a limitation on the embodiments of the utility model. In addition, the terms "first", "second", "third" are only for the purpose of description, and cannot be understood as indicating or implying relative importance.

[0045] In the description of the embodiments of the utility model, it needs to be explained that, unless otherwise explicitly specified and limited, the terms "connected", "connected" should be understood broadly, for example, it can be fixedly connected, or it can be detachably connected, or integrally connected, it can be mechanically connected, or it can be electrically connected, it can be directly connected, or it can be indirectly connected through an intermediate medium. For ordinary skilled in the art, the specific meaning of the above terms in the embodiments of the utility model can be understood according to the specific circumstances.

[0046] In the embodiments of the utility model, unless otherwise explicitly specified and limited, the first feature is "on" or "under" the second feature, which can be that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, the first feature "above", "above" and "above" of the second feature can be that the first feature is directly above or obliquely above the second feature, or only indicates that the horizontal height of the first feature is higher than that of the second feature. The first feature "below", "below" and "below" of the second feature can be that the first feature is directly below or obliquely below the second feature, or only indicates that the horizontal height of the first feature is less than that of the second feature.

[0047] In the description of the present application, the description of the terms "one embodiment", "some embodiments", "example", "specific example" or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the utility model. In the present application, the illustrative description of the above terms is not necessarily for the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art can combine and combine the different embodiments or examples described in the present application and the features of different embodiments or examples without contradiction.

[0048] The following will be combined Figures 1 to 10The wafer substrate automatic chamfering machine provided by the utility model is described below with reference to

[0049] The wafer substrate automatic chamfering machine provided by the utility model is described below with reference to Figures 1 to 7 The wafer substrate automatic chamfering machine comprises a machine tool main body 1, a machining jig 2, a material preparation device 4, a material basket 42, a wafer positioning table 44, a basket inserting manipulator 43, a feeding and discharging manipulator 3 and a spin-drying table 45, the machine tool main body 1 is movably provided with a workbench 17, the workbench 17 can reciprocate along a first direction between a machining station and a feeding and discharging station; the machining jig 2 is installed on the workbench 17; the material preparation device 4 is arranged along the first direction and located on the periphery of the feeding and discharging station; the material basket 42 is arranged on the material preparation device 4, and the material basket 42 is used for storing wafer substrates 5; the wafer positioning table 44 is arranged on the material preparation device 4, and the wafer positioning table 44 is provided with a deviation rectifying sensor 442, the deviation rectifying sensor 442 is suitable for detecting the center position and the deflection angle of the wafer substrate 5 to be machined; the basket inserting manipulator 43 is arranged on the material preparation device 4, and the basket inserting manipulator 43 is used for transferring the wafer substrate 5 to be machined from the material basket 42 to the wafer positioning table 44 and adjusting the center position and the deflection angle of the wafer substrate 5 to be machined in cooperation with the wafer positioning table 44; the feeding and discharging manipulator 3 is arranged on the machine tool main body 1 and located on the periphery of the feeding and discharging station, and the feeding and discharging manipulator 3 is used for feeding the adjusted wafer substrate 5 to be machined to the machining jig 2; the spin-drying table 45 is arranged on the material preparation device 4, and the spin-drying table 45 is used for spin-drying the machined wafer substrate 5.

[0050] The machine tool main body 1 comprises a machine bed 11, an X-axis beam 12, a column 13, an X-axis moving mechanism 14, a Y-axis moving mechanism 15, a Z-axis moving mechanism 16 and a workbench 17, the X-axis beam 12 and the column 13 form a gantry structure and are installed on the machine bed 11; the X-axis moving mechanism 14 is installed on the X-axis beam 12 and can reciprocate along the X-axis direction; the Z-axis moving mechanism 16, on which a cutter can be installed, is installed on the X-axis moving mechanism 14, and can reciprocate along the Z-axis direction and reciprocate along the X-axis direction together with the X-axis moving mechanism 14; the Y-axis moving mechanism 15 is installed on the machine bed 11 and can reciprocate along the Y-axis direction; the workbench 17 is installed on the Y-axis moving mechanism 15, and the machining jig 2 is installed on the workbench 17.

[0051] The wafer positioning table 44 is arranged on the preparation device 4, the center position of the wafer substrate 5 to be processed and the deflection angle of the processing groove 51 are detected through the deviation correction sensor 442 on the wafer positioning table 44, then the center position of the wafer substrate 5 to be processed and the deflection angle are adjusted by the cooperation between the basket mechanical arm 43 and the wafer positioning table 44 according to the detected center position of the wafer substrate 5 to be processed and the deflection angle, the positioning accuracy is improved, the secondary positioning in the machine is not needed, the influence of the environmental factors in the machine is avoided, and the processing efficiency is improved; meanwhile, the spin-drying table 45 is arranged to spin-dry the processed wafer substrate 5, so that the cutting fluid pollution to the environment is avoided.

[0052] With reference to Figure 4 and Figure 5 In some embodiments, the wafer positioning table 44 comprises a deviation correction mounting frame 441, a sensor fixing plate 443, a vacuum rotary chuck 445 and a rotating assembly, the deviation correction mounting frame 441 is mounted on the preparation device 4, the deviation correction sensor 442 is mounted on the deviation correction mounting frame 441 through the sensor fixing plate 443, the rotating assembly is mounted on the deviation correction mounting frame 441, the vacuum rotary chuck 445 is arranged on the rotating assembly, the vacuum rotary chuck 445 is used for adsorbing and fixing the wafer substrate to be processed, and the rotating assembly is used for driving the wafer substrate to be processed on the vacuum rotary chuck 445 to rotate.

[0053] With reference to Figure 4 and Figure 5 In some embodiments, the wafer positioning table 44 further comprises a sensor moving module 444, the sensor moving module 444 is connected between the sensor fixing plate 443 and the deviation correction mounting frame 441, and the sensor moving module 444 is used for adjusting the distance between the deviation correction sensor 442 and the vacuum rotary chuck 445.

[0054] With reference to Figure 4 and Figure 5 In some embodiments, the deviation correction sensor 442 comprises a receiving end 4422 and a transmitting end 4421, and the receiving end 4422 and the transmitting end 4421 are spaced apart from each other to form a detection position.

[0055] Specifically, the wafer positioning table 44 comprises a deviation rectifying mounting frame 441, a deviation rectifying sensor 442, a sensor fixing plate 443, a sensor moving module 444, a vacuum rotary chuck 445, a first direct drive motor 446 and a first rotary joint 447. The vacuum rotary chuck 445 is installed on a fourth output flange 4461 of the first direct drive motor 446. A first annular air groove 4451 is arranged on an upper end surface of the vacuum rotary chuck 445, and a first air hole 4452 is arranged in the middle of the vacuum rotary chuck 445. A first rotary end 4472 of the first rotary joint 447 is fixedly connected with the first air hole 4452 of the vacuum rotary chuck 445, and the first rotary joint 447 is located in a first hollow hole 4462 of the first direct drive motor 446. The first rotary joint 447 is in communication with the first annular air groove 4451 through the first rotary end 4472 and the first air hole 4452. When the first air inlet end 4471 is connected with the negative pressure air, the first rotary end 4472, the first air hole 4452 and the first annular air groove 4451 are in a negative pressure state, and the wafer substrate 5 is adsorbed. When the first direct drive motor 446 rotates to drive the vacuum rotary chuck 445 to rotate, the first rotary end 4472 of the first rotary joint 447 can rotate with the vacuum rotary chuck 445, and the first air inlet end 4471 of the first rotary joint 447 is fixedly installed, so as to ensure stable air supply. The first direct drive motor 446 is fixed on the side of the deviation rectifying mounting frame 441, the sensor moving module 444 is fixedly installed on the upper end of the deviation rectifying mounting frame 441, the sensor fixing plate 443 is installed on the output flange of the sensor moving module 444, the emitting end 4421 of the deviation rectifying sensor 442 is installed on the upper end of the sensor fixing plate 443, the receiving end 4422 of the deviation rectifying sensor 442 is installed on the lower end of the sensor fixing plate 443, and the wafer substrate 5 is placed between the emitting end 4421 and the receiving end 4422 of the deviation rectifying sensor 442. The sensor moving module 444 can drive the deviation rectifying sensor 442 to move, so as to adapt to wafer substrates 5 of various specifications. The wafer positioning table 44 directly drives the vacuum rotary chuck 445 to rotate by using the first direct drive motor 446, so that the reduction unit is omitted, the stability is high, and the positioning precision is high.

[0056] With reference to Figure 3 In some embodiments, the basket mechanical hand 43 comprises a mounting table 436, a horizontal moving module 431, a height moving module 437, a rotary motor 435 and an end chuck 433. The height moving module 437 is installed on the material preparation device 4, the rotary motor 435 is connected with the lifting end of the height moving module 437 through the mounting table 436, the horizontal moving module 431 is arranged on the rotating end of the rotary motor 435, and the end chuck 433 is arranged on the moving end of the horizontal moving module 431.

[0057] Specifically, the basket inserting robot 43 is a three-degree-of-freedom column coordinate robot, and the basket inserting robot 43 comprises a horizontal movement module 431, a suction disc mounting plate 432, a terminal suction disc 433, a rotating shaft 434, a rotating motor 435, a mounting table 436, and a height movement module 437. The height movement module 437 is vertically installed and can move along the Z direction. The mounting table 436 is fixedly installed on a first output flange 4371 of the height movement module 437, the rotating motor 435 is fixedly installed on the mounting table 436, and the rotating shaft 434 is installed on a second output flange 4351 of the rotating motor 435. The horizontal movement module 431 is fixedly installed on the rotating shaft 434 and can move along the radial direction of the rotating center of the rotating motor 435. The suction disc mounting plate 432 is fixedly installed on a third output flange 4311 of the horizontal movement module 431, and the terminal suction disc 433 is installed on the suction disc mounting plate 432 and used for suction of the wafer substrate 5.

[0058] With reference to Figure 9 and Figure 10 In some embodiments, the terminal suction disc 433 comprises an upper jaw suction disc 4331, a middle jaw suction disc 4332, and a lower jaw suction disc 4333. The upper jaw suction disc 4331 is provided with a plurality of suction air ports 43311 for suction of the wafer substrate 5. The middle jaw suction disc 4332 is provided with a suction air groove 43321. The lower jaw suction disc 4333 is provided with an air inlet 43331 which is in communication with the air source assembly and communicates with the suction air ports 43311 through the suction air groove 43321.

[0059] Specifically, the terminal suction disc 433 comprises an upper jaw suction disc 4331, a middle jaw suction disc 4332, and a lower jaw suction disc 4333. The upper jaw suction disc 4331 is provided with a suction air port 43311 for suction of the wafer substrate 5. The middle jaw suction disc 4332 is provided with a suction air groove 43321. The lower jaw suction disc 4333 is provided with an air inlet 43331. The lower jaw suction disc 4333 and the middle jaw suction disc 4332 are coated with sealing glue 4334, and the middle jaw suction disc 4332 and the upper jaw suction disc 4331 are also coated with sealing glue 4334 to prevent air leakage. The air inlet 43331 is in communication with an air source hole 4321 of the suction disc mounting plate 432, and the air inlet 43331 communicates with the suction air port 43311 through the suction air groove 43321. After the air source hole 4321 is connected to the negative pressure air, a negative pressure state is formed between the air inlet 43331, the suction air groove 43321, and the suction air port 43311, so that the wafer substrate 5 is suctioned.

[0060] With reference to Figure 2In some embodiments, the feeding and discharging manipulator 3 comprises a base plate 31, a swing arm 33, a lifting assembly, and a vacuum chuck 36. The base plate 31 is installed on the workbench 17. The swing arm 33 is rotationally connected to the base plate 31 at a connecting end. The vacuum chuck 36 is connected to a free end of the swing arm 33 through the lifting assembly. The lifting assembly is used to drive the vacuum chuck 36 to move in the height direction.

[0061] Specifically, the feeding and discharging manipulator 3 comprises a base plate 31, a third direct drive motor 32, a swing arm 33, a second air cylinder 34, a chuck connecting plate 35, a vacuum chuck 36, a guide rail 37, and a sliding block 38. The third direct drive motor 32 is installed on the base plate 31. The swing arm 33 is installed on a sixth output flange 321 of the third direct drive motor 32. The second air cylinder 34 is fixedly installed at the end of the swing arm 33. The guide rail 37 is fixed at the end of the swing arm 33. The sliding block 38 is slidably connected to the guide rail 37. The chuck connecting plate 35 is installed on the sliding block 38. The second air cylinder rod of the second air cylinder 34 is fixedly connected to the chuck connecting plate 35. The vacuum chuck 36 is installed on the chuck connecting plate 35. The second air cylinder 34 can drive the vacuum chuck 36 to move up and down. The use of the third direct drive motor 32 ensures the rotation accuracy during the feeding and discharging process. The use of the guide rail 37 ensures the accuracy of the up-and-down movement of the vacuum chuck 36. The use of the third direct drive motor 32 on the feeding and discharging manipulator 3 ensures the rotation accuracy during the feeding and discharging process. The use of the guide rail 37 ensures the accuracy of the up-and-down movement of the vacuum chuck 36, thereby improving the feeding and discharging accuracy of the feeding and discharging manipulator 3.

[0062] Referring to Figure 6 and Figure 7 In some embodiments, the spin-drying table 45 comprises a mounting seat 451, a protective shell 452, a first air cylinder 456, a spin-drying chuck 453 assembly, and a spin-drying rotating assembly. The mounting seat 451 is provided on the material preparation device 4. The first air cylinder 456 is fixed on the mounting seat 451. The first air cylinder rod of the first air cylinder 456 is fixedly connected to the protective shell 452. The spin-drying rotating assembly is provided on the material preparation device 4. A through hole 4522 is provided at the center position of the protective shell 452. The spin-drying rotating assembly is connected to the protective shell 452 through the through hole 4522. One end of the spin-drying rotating assembly protrudes out of the through hole 4522. The spin-drying chuck 453 assembly is provided on the protruding end of the spin-drying rotating assembly.

[0063] Specifically, the spin-drying table 45 comprises a mounting seat 451, a protective shell 452, a spin-drying chuck 453, a second direct-drive motor 454, a second rotary joint 455, a first air cylinder 456, and a sealing ring 457. The spin-drying rotary assembly comprises the second driving motor and the second rotary joint 455. The spin-drying chuck 453 is mounted on a fifth output flange 4541 of the second direct-drive motor 454, and an upper end surface of the spin-drying chuck 453 is provided with a second annular air groove 4531, and a middle portion of the spin-drying chuck 453 is provided with a second air hole 4532. A second rotary end 4552 of the second rotary joint 455 is fixedly connected with the second air hole 4532 of the spin-drying chuck 453, and the second rotary joint 455 is located in a second hollow hole 4542 of the second direct-drive motor 454. The second rotary joint 455 is in communication with the second annular air groove 4531 through the second rotary end 4552 and the second air hole 4532, and when the second air inlet end 4551 is connected to the negative pressure air, the second rotary end 4552, the second air hole 4532 and the second annular air groove 4531 are in a negative pressure state, and the wafer substrate 5 is adsorbed. When the second direct-drive motor 454 rotates to drive the spin-drying chuck 453 to rotate, the second rotary end 4552 of the second rotary joint 455 can rotate with the spin-drying chuck 453, and the second air inlet end 4551 of the second rotary joint 455 is fixedly immobile, thereby ensuring stable air supply. The second direct-drive motor 454 is fixedly mounted on the mounting seat 451, the protective shell 452 is provided with a drain port 4521 and a through hole 4522, the through hole 4522 is matched with a shaft hole of the spin-drying chuck 453, the protective shell 452 is slidingly mounted in a T-shaped groove 4511 of the mounting seat 451, the first air cylinder 456 is fixedly mounted on the mounting seat 451, a first air cylinder rod of the first air cylinder 456 is fixedly connected with the protective shell 452, and the first air cylinder 456 can drive the protective shell 452 to move up and down along the T-shaped groove 4511, the spin-drying chuck 453 is further provided with an annular groove 4533, and the sealing ring 457 is mounted in the annular groove 4533 and located between the spin-drying chuck 453 and the protective shell 452, thereby preventing cutting fluid from flowing out of the through hole 4522, the protective shell 452 prevents cutting fluid from splashing during the spin-drying process of the wafer and collects the cutting fluid, and the drain port 4521 of the protective shell 452 drains the collected cutting fluid into a container.

[0064] In some embodiments, the rotation center of the feeding and discharging manipulator 3 is on a vertical bisector of a line connecting centers of the vacuum rotary chuck 445 and the spin-drying chuck 453 assembly.

[0065] Specifically, the basket mechanical arm 43 is fixed on the base frame 41, two material baskets 42, wafer positioning tables 44 and spin-drying tables 45 are arranged along the circumference with the rotation center of the rotation motor 435 on the basket mechanical arm 43 as the center, and are fixedly installed on the base frame 41, the material preparation device 4 is fixedly connected with the machine tool main machine 1, the machining jig 2 is installed on the machine tool workbench 17, and the feeding and discharging mechanical arm 3 is installed on the rear side of the machine tool body 11, and the rotation center of the feeding and discharging mechanical arm 3 is on the vertical bisector of the line connecting the center of the vacuum rotary chuck 445 of the wafer positioning table 44 and the center of the spin-drying chuck 453 of the spin-drying table 45.

[0066] Finally, it should be noted that: the above examples are only used to illustrate the technical solutions of the present application, and not to limit them; although the present application has been described in detail with reference to the foregoing examples, those skilled in the art should understand that: it can still modify the technical solutions recorded in the foregoing examples, or make equivalent replacement for part of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present application.

Claims

1. A wafer substrate automatic chamfering machine, characterized in that: include: A machine tool body, wherein a workbench is movably provided on the machine tool body, and the workbench can reciprocate between a processing station and a loading and unloading station along a first direction; A processing jig, the processing jig being installed on the workbench; A material preparation device, the material preparation device is arranged in a first direction and is located around the loading and unloading station; A material basket, the material basket being provided on the material preparation device and being used for storing wafer substrates; A wafer positioning platform, the wafer positioning platform is arranged on the material preparation device, and a correction sensor is provided on the wafer positioning platform, and the correction sensor is suitable for detecting the center position and deflection angle of the wafer substrate to be processed; A basket manipulator is provided on the material preparation device, and is used to transfer the wafer substrate to be processed from the material basket to the wafer positioning table, and cooperate with the wafer positioning table to adjust the center position and deflection angle of the wafer substrate to be processed; A loading and unloading robot, which is provided on the machine tool body and located on the peripheral side of the loading and unloading station, and is used to load the adjusted wafer substrate to be processed onto the processing jig; A drying table is provided on the material preparation device and is used to dry the processed wafer substrate.

2. The automatic chamfering machine for wafer substrates according to claim 1, characterized in that: The wafer positioning table includes a correction mounting frame, a sensor fixing plate, a vacuum rotating suction cup and a rotating assembly. The correction mounting frame is installed on the material preparation device. The correction sensor is installed on the correction mounting frame through the sensor fixing plate. The rotating assembly is installed on the correction mounting frame. The vacuum rotating suction cup is arranged on the rotating assembly. The vacuum rotating suction cup is used to adsorb and fix the wafer substrate to be processed. The rotating assembly is used to drive the wafer substrate to be processed on the vacuum rotating suction cup to rotate.

3. The automatic chamfering machine for wafer substrates according to claim 2, characterized in that: The wafer positioning platform further includes a sensor moving module, which is connected between the sensor fixing plate and the deflection correction mounting frame, and is used to adjust the distance between the deflection correction sensor and the vacuum rotary suction cup.

4. The automatic chamfering machine for wafer substrates according to claim 3, characterized in that: The correction sensor includes a receiving end and a transmitting end, and the receiving end and the transmitting end are spaced apart from each other to form a detection position.

5. The automatic chamfering machine for wafer substrates according to any one of claims 1 to 4, characterized in that: The basket manipulator includes a mounting platform, a horizontally movable module, a height movable module, a rotating motor, a rotating shaft and an end suction cup. The height movable module is mounted on the material preparation device. The rotating motor is connected to the lifting end of the height movable module through the mounting platform. The horizontally movable module is mounted on the rotating shaft, which is provided at the rotating end of the rotating motor. The end suction cup is provided on the moving end of the horizontally movable module.

6. The automatic chamfering machine for wafer substrates according to claim 5, characterized in that: The end suction cup includes an upper fork suction cup, a middle fork suction cup and a lower fork suction cup. The upper fork suction cup is provided with multiple suction ports, which are used to adsorb wafer substrates. The middle fork suction cup is provided with a suction groove, and the lower fork suction cup is provided with an air inlet, which is connected to the air source component, and the air inlet is connected to the suction port through the suction groove.

7. The automatic chamfering machine for wafer substrates according to any one of claims 1 to 4, characterized in that: The loading and unloading robot includes a base plate, a swing arm, a lifting assembly and a vacuum suction cup. The base plate is installed on the workbench. The connecting end of the swing arm is rotatably connected to the base plate. The vacuum suction cup is connected to the free end of the swing arm through the lifting assembly. The lifting assembly is used to drive the vacuum suction cup to move in the height direction.

8. The automatic chamfering machine for wafer substrates according to claim 2, characterized in that: The spin-drying table includes a mounting seat, a protective shell, a first cylinder, a spin-drying suction cup assembly and a spin-drying rotating assembly. The mounting seat is provided on the material preparation device, the first cylinder is fixed on the mounting seat, the first cylinder rod of the first cylinder is fixedly connected to the protective shell, the spin-drying rotating assembly is provided on the material preparation device, a through hole is provided at the center position of the protective shell, the spin-drying rotating assembly is connected to the protective shell through the through hole, and one end of the spin-drying rotating assembly passes through the through hole, and the spin-drying suction cup assembly is provided on the passing end of the spin-drying rotating assembly.

9. The automatic chamfering machine for wafer substrates according to claim 8, characterized in that: The rotation center of the loading and unloading robot is on the perpendicular bisector of the line connecting the centers of the vacuum rotating suction cup and the drying suction cup assembly.

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