Heat-conducting silica gel patch with high tensile property
By using a multi-layered structure and copper pillar design, the thermally conductive silicone pads have solved the problem of easy breakage under stress, achieving high tensile strength and excellent heat dissipation.
Patent Information
- Application Number
- CN202422850822.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-21
- Publication Date
- 2026-01-02
- Estimated Expiration
- 2034-11-21
AI Technical Summary
Existing thermally conductive silicone pads are prone to breakage or deformation when subjected to tension and tensile stress, resulting in reduced or failed heat dissipation performance, and cannot meet the requirements for use in applications that need to withstand tension or vibration.
It adopts a multi-layer structure design, including tensile layer one and tensile layer two, thermal conductive layer one, thermal conductive layer two, thermal conductive layer three, substrate layer and copper pillars. Carbon fiber and metal mesh are used to enhance tensile strength, and micro-holes are set on the surface of the patch to eliminate air bubbles and improve the bonding effect.
It significantly enhances the tensile strength and durability of the thermally conductive silicone patch, preventing cracking or detachment, improving heat conduction efficiency and heat dissipation capacity, and ensuring normal operation under stress conditions.
Smart Images
Figure CN223758582U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model belongs to silica gel patch equipment field, especially relates to a high tensile property's heat conduction silica gel patch. BACKGROUND
[0002] The heat conduction silica gel patch is a kind of silica gel product with heat conduction and insulation performance, but the existing heat conduction silica gel patch has the problem of easy fracture or deformation when being subjected to tension and tensile stress in actual use, because of lacking tensile component, and lacking tensile component not only leads to the above-mentioned problems, but also there can be fracture or deformation of heat conduction silica gel patch, resulting in the problem of reduced heat dissipation performance or even complete failure, and poor tensile property is a significant weakness of heat conduction silica gel patch, because silica gel is a soft and strong plastic material, when being subjected to tensile stress, heat conduction silica gel patch is easy to fracture or deform, thereby leading to the rupture or failure of patch, this deficiency makes heat conduction silica gel patch unsuitable in applications requiring to bear tension or be subjected to greater tension, such as connection and fixing components of mobile devices, automotive electronics, etc., in addition, poor tensile property can also have some negative effects, when heat conduction silica gel patch needs to bear certain mechanical tension or vibrate in application, heat conduction silica gel patch can fracture or deform, resulting in reduced heat dissipation performance or even complete failure, which can cause electronic components to overheat, thereby damaging components or reducing their performance and service life, so a new structure needs to be proposed to solve the above technical problems. SUMMARY
[0003] In view of the deficiencies in the prior art, the utility model aims at providing a heat conduction silica gel patch with high tensile property to solve the problems raised in the background art.
[0004] The utility model discloses a heat conduction silica gel patch with high tensile property, which comprises a heat conduction silica gel patch body and a copper column, the heat conduction silica gel patch body comprises a tensile layer one, a tensile layer two, a heat conduction layer one, a heat conduction layer two, a heat conduction layer three, a substrate layer and a patch body, a plurality of micro-holes are uniformly penetrated on the surface of the heat conduction silica gel patch body, a plurality of copper columns are uniformly installed in the heat conduction silica gel patch body, the copper columns are of the same structure, the tensile layer one and the tensile layer two are of the same specification, the heat conduction layer one, the heat conduction layer two and the heat conduction layer three are of the same specification, the substrate layer is located below the heat conduction layer three, the lower end of the copper column is arranged in the substrate layer, one end of the copper column away from the substrate layer penetrates through the upper surface of the tensile layer one, and the four corners of the heat conduction silica gel patch body are designed as round corners.
[0005] As a preferred embodiment, the anti-tension layer one is installed below the anti-tension layer two, the heat-conducting layer one is installed below the anti-tension layer two, the heat-conducting layer two is installed below the heat-conducting layer one, the heat-conducting layer three is installed below the heat-conducting layer two, the substrate layer is installed below the heat-conducting layer three, and the patch body is arranged below the substrate layer.
[0006] As a preferred embodiment, the heat-conducting silicone patch body is sequentially provided with the anti-tension layer one, the anti-tension layer two, the heat-conducting layer one, the heat-conducting layer two, the heat-conducting layer three, the substrate layer, and the patch body from top to bottom, and the anti-tension layer one, the anti-tension layer two, the heat-conducting layer one, the heat-conducting layer two, the heat-conducting layer three, and the substrate layer have the same specifications.
[0007] As a preferred embodiment, the materials of the anti-tension layer one and the anti-tension layer two are carbon fiber and metal mesh, respectively, the material of the metal mesh is brass, the anti-tension layer one has a honeycomb plate structure, the material of the heat-conducting layer one is hexagonal boron nitride, the material of the anti-tension layer two is aluminum oxide, and the material of the heat-conducting layer three is graphene. Carbon fiber and metal mesh have good strength and rigidity, and adding them as the anti-tension layer one and the anti-tension layer two to the heat-conducting silicone patch body can significantly enhance the overall tensile strength and durability of the entire patch, which helps to prevent the patch from breaking or falling off under tension or external force.
[0008] As a preferred embodiment, the material of the substrate layer is silicone, the material of the silicone is polydimethylsiloxane, and a plurality of micro-holes are uniformly arranged on the upper surface of the heat-conducting silicone patch body. The diameter of the micro-holes is 0.5 mm. When the patch is bonded to the surface of an electronic component, the micro-holes on the surface of the heat-conducting silicone patch body help to remove the air bubbles that may be generated during the bonding process. The presence of air bubbles may affect the heat-conducting effect and the close bonding between the patch and the electronic component. Through the design of the micro-holes, air bubbles can be smoothly removed, reducing the bonding problem between the heat-conducting silicone patch body and the electronic component.
[0009] As a preferred embodiment, the cross section of the copper column is in an inverted T shape structure, and the material of the copper column is brass. Heat is transferred from the electronic component to the copper column, and then to the external environment through the heat-conducting layer one, the heat-conducting layer two, and the heat-conducting layer three inside the heat-conducting silicone patch, thereby minimizing thermal resistance and improving heat dissipation capacity.
[0010] The beneficial effects of the utility model are that: through setting the tensile layer one and the tensile layer two, the tensile layer one and the tensile layer two are of the same specification, the tensile layer two is installed below the tensile layer one, the material of the tensile layer one is carbon fiber, the tensile layer two is composed of metal mesh, the carbon fiber and the metal mesh have good strength and rigidity, adding them to the heat-conducting silica gel patch body as the tensile layer one and the tensile layer two can significantly enhance the overall tensile strength and durability of the patch, which helps to prevent the patch from breaking or falling off under the action of stretching or external force.
[0011] Through setting the copper column, the heat-conducting layer one, the heat-conducting layer two and the heat-conducting layer three, the upper side surface of the heat-conducting silica gel patch body is uniformly provided with a plurality of micro holes, the inside of the heat-conducting silica gel patch body is uniformly provided with a plurality of copper columns, the heat-conducting layer two is installed below the heat-conducting layer one, and the heat-conducting layer three is installed below the heat-conducting layer two, since copper has very high thermal conductivity, the conduction efficiency of heat in the patch can be improved by setting the copper column in the heat-conducting silica gel patch body, heat is transmitted from the electronic components to the copper column, and then transmitted to the external environment through the heat-conducting layer one, the heat-conducting layer two and the heat-conducting layer three inside the heat-conducting silica gel patch, thereby minimizing thermal resistance and improving heat dissipation capacity.
[0012] Meanwhile, when the patch is bonded to the surface of the electronic component, the micro holes on the surface of the heat-conducting silica gel patch body help to remove the bubbles that may be generated during the bonding process, the existence of the bubbles may affect the heat-conducting effect and the close bonding degree between the patch and the component, through the design of the micro holes, the bubbles can be smoothly removed, thereby reducing the bonding problem between the heat-conducting silica gel patch body and the electronic component. BRIEF DESCRIPTION OF DRAWINGS
[0013] In order to more clearly illustrate the technical scheme in the embodiments of the utility model or the prior art, the drawings needed to be used in the following embodiment or prior art description will be briefly introduced, and obviously, the drawings in the following description are only some embodiments of the utility model, and for those skilled in the art, other drawings can be obtained without creative labor.
[0014] Fig. 1 It is the whole structure schematic diagram of the utility model high tensile performance's heat-conducting silica gel patch.
[0015] Fig. 2 It is the layer structure schematic diagram of the utility model high tensile performance's heat-conducting silica gel patch.
[0016] In the drawing, 100-heat-conducting silica gel patch body, 101-micro hole, 110-copper column;
[0017] 210 - tensile layer one, 220 - tensile layer two, 230 - heat conducting layer two, 240 - heat conducting layer two, 250 - heat conducting layer three, 260 - substrate layer, 270 - patch body. DETAILED DESCRIPTION
[0018] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application.
[0019] Please refer to Figs. 1-2 The present application provides a technical solution: a high-tensile heat-conducting silica gel patch, comprising: a heat-conducting silica gel patch body 100 and a copper column 110, the heat-conducting silica gel patch body 100 comprises a tensile layer one 210, a tensile layer two 220, a heat conducting layer one 230, a heat conducting layer two 240, a heat conducting layer three 250, a substrate layer 260 and a patch body 270, a plurality of micro vias 101 are uniformly penetrated on the surface of the heat-conducting silica gel patch body 100, a plurality of copper columns 110 are uniformly installed inside the heat-conducting silica gel patch body 100, the plurality of copper columns 110 are the same in structure, the tensile layer one 210 and the tensile layer two 220 are the same in specification, the heat conducting layer one 230, the heat conducting layer two 240 and the heat conducting layer three 250 are the same in specification, the substrate layer 260 is located below the heat conducting layer three 250, the lower end of the copper column 110 is arranged inside the substrate layer 260, the end of the copper column 110 away from the substrate layer 260 penetrates out of the upper surface of the tensile layer one 210, and the four corners of the heat-conducting silica gel patch body 100 are designed as round corners.
[0020] Please refer to Fig. 1 , Fig. 2 As an embodiment of the present application: the tensile layer two 220 is installed below the tensile layer one 210, the heat conducting layer one 230 is installed below the tensile layer two 220, the heat conducting layer two 240 is installed below the heat conducting layer one 230, the heat conducting layer three 250 is installed below the heat conducting layer two 240, and the patch body 270 is arranged below the substrate layer 260;
[0021] The heat-conducting silica gel patch body 100 is sequentially provided with the tensile layer one 210, the tensile layer two 220, the heat conducting layer one 230, the heat conducting layer two 240, the heat conducting layer three 250, the substrate layer 260 and the patch body 270 from top to bottom, and the tensile layer one 210, the tensile layer two 220, the heat conducting layer one 230, the heat conducting layer two 240 and the heat conducting layer three 250 are the same in specification;
[0022] The material of the tensile layer one 210 and the tensile layer two 220 is carbon fiber and metal mesh in sequence, the material of the metal mesh is brass, the tensile layer one 210 is in a honeycomb plate structure, the material of the heat conduction layer one 230 is hexagonal boron nitride, the material of the tensile layer two 220 is aluminum oxide, and the material of the heat conduction layer three 250 is graphene;
[0023] In use, the user first aligns the patch body 270 with the electronic component to be installed, and then bonds the heat-conducting silicone patch body 100 to the surface of the electronic component through the patch body 270, and then when the heat-conducting silicone patch body 100 is used, if it is subjected to external force and is subjected to tension, the tensile layer one 210 and the tensile layer two 220 can significantly enhance the overall tensile strength and durability of the patch, which helps to prevent the patch from being broken or falling off under tension or external force, and when the tensile layer one 210 and the tensile layer two 220 are subjected to tension, the carbon fiber and the metal mesh inside them will also be subjected to tension, and since the carbon fiber and the metal mesh have good strength and rigidity, the high tensile strength of the heat-conducting silicone patch body 100 is ensured.
[0024] Please refer to Fig. 1 、 Fig. 2 , as an embodiment of the present application: the material of the base layer 260 is silicone, the material of the silicone is polydimethylsiloxane, a plurality of micro-holes 101 are uniformly arranged on the upper surface of the heat-conducting silicone patch body 100, and the diameter of the micro-holes 101 is 0.5mm, when the patch is bonded to the surface of the electronic component, the micro-holes 101 on the surface of the heat-conducting silicone patch body 100 help to remove the bubbles that may be generated during the bonding process, the existence of the bubbles may affect the heat conduction effect and the close bonding degree between the patch and the component, and through the design of the micro-holes 101, the bubbles can be smoothly removed, reducing the bonding problem of the heat-conducting silicone patch body 100 and the electronic component;
[0025] The cross section of the copper column 110 is in an inverted T shape structure, and the material of the copper column 110 is brass;
[0026] In use, once the heat-conducting silicone patch body 100 is bonded together with the electronic component through the patch body 270, the electronic component will work and generate heat at this time, the heat generated by the electronic component will be transmitted to the inside of the base layer 260, and then the base layer 260 will transmit the heat inside to the surface of the copper column 110 and the heat conduction layer three 250, and then the heat of the heat conduction layer three 250 will be transmitted to the inside of the heat conduction layer two 240 and the heat conduction layer one 230 in sequence, and then the copper column 110 will discharge the heat generated by the electronic component;
[0027] By setting the copper column 110 in the heat-conducting silica gel patch body 100, the heat conduction efficiency in the patch can be improved, the heat is transmitted from the electronic components to the copper column 110, and then transmitted to the external environment through the heat-conducting layer one 230, the heat-conducting layer two 240 and the heat-conducting layer three 250 inside the heat-conducting silica gel patch, the thermal resistance is minimized, and the heat dissipation capacity is improved.
[0028] The above merely describes preferred embodiments of the present application and is not intended to limit the present application, and any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.
Claims
1. A high tensile performance, thermally conductive silicone patch comprising: The application discloses a heat-conducting silica gel patch body (100) and a copper column (110), characterized in that the heat-conducting silica gel patch body (100) comprises a tensile layer one (210), a tensile layer two (220), a heat-conducting layer one (230), a heat-conducting layer two (240), a heat-conducting layer three (250), a substrate layer (260) and a patch body (270), and a plurality of micro holes (101) are uniformly arranged on the surface of the heat-conducting silica gel patch body (100). A plurality of copper columns (110) are uniformly arranged in the heat-conducting silica gel patch body (100), the copper columns (110) are of the same structure, the tensile layer one (210) and the tensile layer two (220) are of the same specification, and the heat-conducting layer one (230), the heat-conducting layer two (240) and the heat-conducting layer three (250) are of the same specification. The substrate layer (260) is arranged below the heat-conducting layer three (250), the lower end of the copper column (110) is arranged in the substrate layer (260), one end of the copper column (110) away from the substrate layer (260) penetrates through the upper surface of the tensile layer one (210), and the four corners of the heat-conducting silica gel patch body (100) are designed in a round corner mode.
2. A high tensile heat conductive silicone patch as claimed in claim 1, wherein: The tensile layer two (220) is arranged below the tensile layer one (210), the heat-conducting layer one (230) is arranged below the tensile layer two (220), the heat-conducting layer two (240) is arranged below the heat-conducting layer one (230), the heat-conducting layer three (250) is arranged below the heat-conducting layer two (240), the substrate layer (260) is arranged below the heat-conducting layer three (250), and the patch body (270) is arranged below the substrate layer (260).
3. A high tensile, heat conductive silicone patch as claimed in claim 2, wherein: The heat-conducting silica gel patch body (100) comprises, from top to bottom, the tensile layer one (210), the tensile layer two (220), the heat-conducting layer one (230), the heat-conducting layer two (240), the heat-conducting layer three (250), the substrate layer (260) and the patch body (270), and the tensile layer one (210), the tensile layer two (220), the heat-conducting layer one (230), the heat-conducting layer two (240) and the heat-conducting layer three (250) are of the same specification.
4. A high tensile heat conductive silicone patch as claimed in claim 3, wherein: The tensile layer one (210) and the tensile layer two (220) are made of carbon fiber and metal mesh, respectively, the metal mesh is made of brass, the tensile layer one (210) is in a honeycomb plate structure, the heat-conducting layer one (230) is made of hexagonal boron nitride, the tensile layer two (220) is made of aluminum oxide, and the heat-conducting layer three (250) is made of graphene.
5. A high tensile heat conductive silicone patch as claimed in claim 4, wherein: The substrate layer (260) is made of silica gel, the silica gel is made of polydimethylsiloxane, the upper surface of the heat-conducting silica gel patch body (100) is provided with a plurality of micro holes (101) arranged uniformly on the front side edge and the rear side edge, respectively, and the diameter of the micro holes (101) is 0.5 mm.
6. A high tensile heat conductive silicone patch as claimed in claim 1, wherein: The copper column (110) is in an inverted T-shaped structure, and the copper column (110) is made of brass.