High-binding-force polymer-based composite material
By setting pre-fabricated and process pits on the surface of the substrate layer of polymer-based composite materials to form a pore array structure, the problem of small contact area at the joint is solved, and the bond energy and bonding force of the material are improved.
Patent Information
- Application Number
- CN202520491898.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-03-19
- Publication Date
- 2026-02-27
- Estimated Expiration
- 2035-03-19
AI Technical Summary
In existing polymer-based composite materials, the contact area at the interface between the matrix material and the metal layer is small, resulting in low bond energy and weak bonding force.
Pre-formed pits and process pits are set on the surface of the substrate layer, and a hole array structure is formed by laser etching to increase the contact area between the substrate layer and the material layer. PVD coating and other methods are used to improve the bonding force.
It significantly improves the bonding strength of composite materials and enhances the connection strength between the substrate layer and the material layer.
Smart Images
Figure CN223951148U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The application relates to the technical field of composite materials, in particular to a high-bonding-force polymer-based composite material. BACKGROUND
[0002] In the field of material science, traditional single materials often have limitations in certain properties. For example, metal materials have good strength, electrical conductivity and thermal conductivity, etc., but may have problems such as large density and poor corrosion resistance; high polymer materials have advantages such as small density, good processing performance and good insulation, but are relatively weak in strength and heat resistance. Polymer-based composite materials have been widely used in energy storage, aerospace, biomedicine and other fields, but the requirements for such materials in different fields are getting higher and higher, and how to firmly connect the polymer layer and the metal layer or other material layer needs further research and improvement.
[0003] However, at present, the matrix material in most polymer-based composite materials is generally connected in a direct bonding manner with the metal, and the contact area at the bonding site is small, so that the polymer-based composite material as a whole has the disadvantages of low bond energy and weak bonding force. CONTENT OF THE INVENTION
[0004] Therefore, the application provides a high-bonding-force polymer-based composite material to solve the problem that the contact area at the bonding site is small, and the polymer-based composite material as a whole has low bond energy and weak bonding force.
[0005] In order to achieve the above-mentioned purpose, the application provides the following technical scheme:
[0006] A high-bonding-force polymer-based composite material, comprising a substrate layer, a prefabricated pit hole and a process pit hole, the upper and lower sides of the substrate layer are provided with a first material layer, and the side of the first material layer away from the substrate layer is connected with a second material layer;
[0007] The upper and lower surfaces of the substrate layer are provided with prefabricated pit holes on the outer side;
[0008] The surface of the side of the first material layer away from the substrate layer is provided with a process pit hole.
[0009] Further, the prefabricated pit holes are arranged at equal intervals on the surface of the substrate layer, and the prefabricated pit holes are formed by laser etching.
[0010] Further, the diameter size of the prefabricated pit hole is 10-300 mu m, and the depth size of the prefabricated pit hole is 5 nm-50 mu m.
[0011] Further, the process pit hole is arranged in vertical alignment with the prefabricated pit hole, and the longitudinal section of the process pit hole is a circular arc.
[0012] Further, the first material layer extends to the inside of the prefabricated pit hole near the side of the substrate layer.
[0013] Further, the prefabricated pit hole is arrayed on the surface of the substrate layer.
[0014] Further, the cross-sectional shape of the prefabricated pit hole includes a cylindrical shape, a circular truncated cone shape, and an inverted circular truncated cone shape.
[0015] Further, the first material layer and the second material layer are the same material or different materials.
[0016] Compared with the prior art, the present application has at least the following beneficial effects:
[0017] 1. By arraying the prefabricated pit hole on the surface of the substrate layer, the hole array structure of the prefabricated pit hole can significantly increase the contact area of the substrate layer and the first material layer, which is beneficial to improve the bonding force of the composite material.
[0018] 2. By providing the process pit hole on the side surface of the first material layer away from the substrate layer, the longitudinal section of the process pit hole is a circular arc, and the process pit hole makes the outer surface of the first material layer undulate, which is convenient for increasing the contact area when different materials are prepared, and is beneficial to the subsequent coating and preparation of the second material layer on the first material layer. BRIEF DESCRIPTION OF DRAWINGS
[0019] In order to more intuitively illustrate the prior art and the present application, the following exemplary drawings are given. It should be understood that the specific shapes, structures shown in the drawings should not be regarded as limiting conditions in the implementation of the present application; for example, based on the technical concept disclosed in the present application and the exemplary drawings, those skilled in the art can easily make routine adjustments or further optimization to some units (components) such as increase / decrease / attribute division, specific shape, positional relationship, connection mode, size ratio relationship, etc.
[0020] Fig. 1 A front view cross-sectional structure schematic diagram of a high-bonding-force polymer-based composite material provided for an embodiment of the present application;
[0021] Fig. 2 A top view structure schematic diagram of a high-bonding-force polymer-based composite material provided for an embodiment of the present application.
[0022] EXPLANATION OF REFERENCE NUMERALS:
[0023] 1. Substrate layer; 2. First material layer; 3. Second material layer; 4. Prefabricated pit hole; 5. Process pit hole. DETAILED DESCRIPTION
[0024] The present application will be further described in detail below with reference to the accompanying drawings.
[0025] As Figs. 1-2 shown in the embodiment of the application, a high bonding force polymer-based composite material comprises a substrate layer 1, a pre-pit 4 and a process pit 5. The upper and lower sides of the substrate layer 1 are provided with a first material layer 2, and the side of the first material layer 2 away from the substrate layer 1 is connected with a second material layer 3.
[0026] The substrate layer 1 is a polymer material such as PP, PET, PI, PE, etc. The first material layer 2 and the second material layer 3 are metal materials such as copper, aluminum, silver, gold, or nanoscale ceramic oxides and nitrides of related metal materials.
[0027] The first material layer 2 and the second material layer 3 can be the same material or different materials.
[0028] The upper and lower surfaces of the substrate layer 1 are provided with pre-pits 4, which are arranged at equal intervals on the surface of the substrate layer 1. The cross-sectional shape of the pre-pit 4 includes a cylindrical shape, a circular truncated cone shape, and an inverted circular truncated cone shape, or other cross-sectional shapes that can be prepared using laser DOE technology. The laser DOE technology is used to control the phase distribution of the laser beam to achieve high-precision and complex cross-sectional shape processing, which is suitable for efficient preparation of pre-pits.
[0029] The pre-pit 4 is formed by laser etching, and the pre-pit 4 is arranged in an array on the surface of the substrate layer 1. The size and distribution of the pre-pit 4 can be accurately controlled by adjusting laser parameters such as power and scanning speed. The pre-pit 4 in the form of a hole array structure can significantly increase the contact area between the substrate layer 1 and the first material layer 2, which is beneficial to improve the bonding force of the composite material.
[0030] Meanwhile, the diameter of the pre-pit 4 is 10-300 μm, and the depth of the pre-pit 4 is 5 nm-50 μm. The parameters of the pre-pit 4 can be selected according to different requirements and application scenarios, so that the overall preparation flexibility and application matching are high.
[0031] The surface of the side of the first material layer 2 away from the substrate layer 1 is provided with a process pit 5, which is arranged in vertical alignment with the pre-pit 4. The longitudinal cross-section of the process pit 5 is a circular arc shape, which is the process morphology formed during the preparation of the first material layer 2. The diameter and depth of the process pit 5 are generally one order of magnitude smaller than those of the pre-pit 4.
[0032] The first material layer 2 extends to the inside of the pre-prepared pit 4 on the side close to the base material layer 1, and the bonding method of the first material layer 2 and the base material layer 1 generally adopts PVD coating, chemical plating, electroplating and the like, and for specific requirements, sol-gel method, melt blending method and the like can also be adopted. The process pit 5 makes the outer surface of the first material layer 2 undulate, which facilitates the increase of the contact area when different materials are prepared, and is beneficial to the subsequent coating preparation of the second material layer 3 on the first material layer 2.
[0033] Embodiment 1
[0034] The material with a surface pit structure prepared on 8um PET by laser etching method is selected as the base material layer 1, the pre-prepared pit 4 is cylindrical, the diameter is about 50um, the depth is about 5-10nm, and the pit row spacing is 150um. The first material layer 2 is prepared by using a PVD coating device, which is mainly AL2O3, and the thickness is 5-10nm; the second material layer 3 is prepared by using a PVD coating device one or more times, which is copper, and the thickness is 900nm.
[0035] Embodiment 2
[0036] The material with a surface pit structure prepared on 6um PP by laser etching method is selected as the base material layer 1, the pre-prepared pit 4 is a circular truncated cone, the diameter is about 50um, the depth is about 5-10nm, and the pit row spacing is 150um. The first material layer 2 is prepared by using a PVD coating device, which is mainly a nickel-chromium-copper alloy, and the thickness is 10-20nm; the second material layer 3 is prepared by using a water electroplating method one time, which is pure copper, and the thickness is 1000nm.
[0037] Embodiment 3
[0038] The material with a surface pit structure prepared on 8um PET by laser etching method is selected as the base material layer 1, the pre-prepared pit 4 is a reverse circular truncated cone, the diameter is about 100um, the depth is about 10-20nm, and the pit row spacing is 300um. The first material layer 2 is prepared by using a PVD coating device, which is mainly aluminum oxide, and the thickness is 5-10nm; the second material layer 3 is prepared by using a PVD coating device one time, which is pure aluminum, and the thickness is 1900nm.
[0039] The technical features of the above embodiments can be combined in any manner (as long as the combination of the technical features does not exist contradictions), in order to make the description simple, not all possible combinations of the technical features in the above embodiments are described; these embodiments which are not explicitly written should also be considered as the scope of the present application.
Claims
1. A high-bonding high-molecular matrix composite material comprising a matrix layer (1), a pre-pit (4) and a process pit (5), characterized in that, The upper and lower sides of the substrate layer (1) are provided with the first material layer (2), and the side of the first material layer (2) away from the substrate layer (1) is connected with the second material layer (3); The upper and lower surfaces of the substrate layer (1) are provided with prefabricated holes (4) on the outer side; The surface of the side of the first material layer (2) away from the substrate layer (1) is provided with process holes (5).
2. The high bonding force polymer matrix composite of claim 1, wherein, The prefabricated holes (4) are arranged at equal intervals on the surface of the substrate layer (1), and the prefabricated holes (4) are formed by laser etching.
3. The high bonding high molecular matrix composite material according to claim 2, characterized in that, The diameter of the prefabricated hole (4) is 10-300 μm, and the depth of the prefabricated hole (4) is 5 nm-50 μm.
4. The high bonding high molecular matrix composite material according to claim 1, characterized in that, The process hole (5) is arranged in alignment with the prefabricated hole (4), and the longitudinal section of the process hole (5) is arc-shaped.
5. The high bonding high molecular matrix composite material according to claim 1, characterized in that, The side of the first material layer (2) close to the substrate layer (1) extends to the inside of the prefabricated hole (4).
6. The high bonding high molecular matrix composite according to claim 5, characterized in that, The prefabricated holes (4) are arranged in an array on the surface of the substrate layer (1).
7. The high bonding high molecular matrix composite according to claim 6, characterized in that, The cross-sectional shape of the prefabricated hole (4) includes a cylindrical shape, a circular truncated cone shape, and an inverted circular truncated cone shape.
8. The high bonding high molecular matrix composite material according to claim 1, characterized in that, The first material layer (2) and the second material layer (3) are the same material or different materials.