Integrated circuit chip welding device

By designing a guiding and adjusting mechanism, the problem of inaccurate chip positioning during transmission was solved, enabling automatic positioning and adaptation to chips of different sizes, thereby improving production efficiency and ease of operation.

CN224196228UActive Publication Date: 2026-05-05SICHUAN XINXIAN TECHNOLOGY DEVELOPMENT CO LTD
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Patent Information

Application Number
CN202521109051.8
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-06-03
Publication Date
2026-05-05
Estimated Expiration
2035-06-03

AI Technical Summary

Technical Problem

The existing integrated circuit chip welding equipment has an imperfect guiding function, making it difficult to adapt to chips of different sizes. This results in inaccurate chip positioning during transmission, requiring manual adjustment, increasing the labor intensity of workers and reducing production efficiency.

Method used

An integrated circuit chip welding device was designed, which includes a guiding mechanism and an adjusting mechanism. The chip is positioned in the middle of the conveyor belt by adjusting the angle and spacing of the guide baffles. The device uses a dual-axis motor to control the flipping and spacing adjustment of the guide baffles to adapt to chips of different sizes.

Benefits of technology

It enables the chip to automatically maintain its intermediate position during transmission without manual adjustment, reducing workload, improving production efficiency, and has a wide range of applications and simple operation.

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Abstract

The utility model relates to the technical field of chip welding devices, and discloses an integrated circuit chip welding device which comprises a conveying belt, a base fixedly connected to the bottom of the conveying belt, welding equipment fixedly connected to the top of the conveying belt, a guide mechanism arranged on the left side of the top of the conveying belt, and an adjusting mechanism arranged on the top of the guide mechanism. The guiding mechanism comprises a supporting assembly and a position adjusting assembly, the supporting assembly is arranged at the top of the conveying belt, and the position adjusting assembly is arranged at the bottom of the supporting assembly. According to the integrated circuit chip welding device, through the arranged guide mechanism, a worker can adjust the angles of the guide baffles on the front side and the rear side according to the sizes of different chips, so that when the chips are conveyed rightwards from the top of the conveying belt, the chips can be kept in the middle of the conveying belt all the time; and subsequent welding equipment can conveniently weld the chip at the top of the conveying belt, workers do not need to manually adjust the position of the chip, the working intensity of the workers is reduced, and the device is convenient to use by the workers.
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