Anti-fouling structure, camera and electronic device

Abstract

The utility model discloses a kind of antifouling structure, camera and electronic equipment, the antifouling structure, for reducing PCB on organic volatile material pollution image sensor, comprising: condensing piece, between PCB and image sensor, condensing piece inside is provided with containing chamber, bottom is equipped with drawing port;Refrigeration part, cold end is connected with condensing piece, for cooling condensing piece makes condensing piece temperature lower than image sensor, to make organic volatile material condense on condensing piece;Wherein, image sensor is located in containing chamber and front end is opposite drawing port, so that its non-drawing face is wrapped by condensing piece, to block organic volatile material diffusion to the volatile path of image sensor.The utility model in, by making organic volatile material preferentially condense on the condensing piece of lower temperature, to reduce organic volatile material volatilization to image sensor, optimize the working environment of image sensor, improve image acquisition quality and service life.

Description

Technical Field

[0001] This utility model belongs to the field of industrial cameras, and in particular relates to a dirt-proof structure, camera and electronic equipment. Background Technology

[0002] Cooled industrial cameras typically cool their internal image sensors to below ambient temperature to ensure proper operation and meet imaging cooling requirements. When the image sensor temperature is below ambient, there is a risk of condensation affecting image quality. Therefore, the camera's internal cavity needs to be sealed and the internal gas kept dry to prevent condensation. However, due to the sealed cavity, the use of sealing components and the introduction of volatile organic compounds (VOCs) during the camera's PCB fabrication process can also contaminate the image sensor, leading to imaging problems.

[0003] Because PCBs contain sources of volatile organic compounds (VOCs) such as substrate materials, soldering processes, and protective coatings, VOC molecules can adhere to the surface of image sensors, affecting image acquisition quality or causing device damage. However, existing technologies do not consider the issue of VOCs volatilizing and contaminating image sensors.

[0004] To address this problem, this invention proposes a sealing structure that adjusts the sealing scheme in existing sealing structures. By using a semiconductor cooling chip to cool the structural components near the image sensor, organic volatiles are preferentially condensed onto the structural components, reducing the risk of organic volatiles contaminating the image sensor. Utility Model Content

[0005] The purpose of this utility model is to overcome the above-mentioned problems existing in the prior art, and to provide a dirt-proof structure, camera and electronic device.

[0006] To achieve the above-mentioned technical objectives and effects, this utility model is implemented through the following technical solution:

[0007] An anti-fouling structure for reducing volatile organic compound (VOC) contamination of an image sensor on a PCB, comprising:

[0008] A condenser is located between the PCB and the image sensor. The condenser has an internal receiving chamber and an image acquisition port at the bottom.

[0009] The cooling component, with its cold end connected to the condenser, is used to cool the condenser so that its temperature is lower than that of the image sensor, thereby causing volatile organic compounds to condense on the condenser.

[0010] The image sensor is located in the housing chamber with its front end facing the image acquisition port, so that its non-image acquisition surface is wrapped by a condenser to prevent volatile organic compounds from diffusing into the evaporation path of the image sensor.

[0011] Furthermore, the condenser includes:

[0012] The first condenser plate is connected to the refrigeration component at the top;

[0013] Several second condensing plates are disposed on the side of the first condensing plate, bent and extended to the bottom of the image sensor to cooperate with the first condensing plate to form a receiving chamber.

[0014] Furthermore, the condenser includes:

[0015] Hollow condenser shroud, connected to the refrigeration components at the top and with an opening at the bottom;

[0016] The image sensor is located inside the hollow condenser hood, with its front end facing the bottom opening of the hollow condenser hood for image acquisition.

[0017] Furthermore, the surface of the condenser is provided with an adsorption layer for adsorbing volatile organic compounds.

[0018] Furthermore, the top of the condenser is provided with a groove, which is connected to the cold end of the refrigeration component. The groove is provided with an adsorbent for adsorbing volatile organic compounds.

[0019] Furthermore, the condenser is connected to the non-image sensor surface so that the cooling element synchronously cools both the condenser and the image sensor.

[0020] A camera, comprising:

[0021] Such as the anti-fouling structure described above;

[0022] The housing is used to support the internal components of the camera.

[0023] Furthermore, at least one end of the condenser is in contact with the housing, thereby lowering the housing temperature to condense volatile organic compounds.

[0024] Furthermore, the camera also includes:

[0025] The electrical interface connects to the PCB, and the connection point is coated with sealant.

[0026] An electronic device, including a camera as described above.

[0027] The beneficial effects of this utility model are:

[0028] 1. In this invention, a condenser is disposed between the PCB and the image sensor to block the evaporation path of volatile organic compounds (VOCs) and their diffusion onto the image sensor, thereby reducing the amount of VOCs volatilizing from the PCB onto the image sensor. The condenser also includes a receiving chamber to accommodate the image sensor and an image acquisition port for the sensor's own operation. This ensures normal image acquisition while improving the condenser's encapsulation of the sensor, maximizing the blocking of VOC diffusion paths. Furthermore, a cooling component connected to the condenser at its cold end is incorporated to cool the condenser, ensuring its temperature is lower than that of the image sensor. This causes VOCs to preferentially condense on the cooler condenser, further reducing the probability of VOCs evaporating and condensing onto the image sensor. This optimizes the image sensor's operating environment, improves image acquisition quality, and extends its lifespan.

[0029] 2. In this utility model, by adding an adsorption layer to the surface of the condenser and adding a groove to the surface of the condenser for accommodating the adsorbent, on the one hand, the adsorption of organic volatiles by the condenser can be enhanced by the adsorption layer or the adsorbent, reducing the volatilization of organic volatiles and their diffusion to the image sensor. On the other hand, it can also reduce the condensation and accumulation of organic volatiles on the condenser itself, so as to maintain a good condensation effect of the condenser.

[0030] 3. In this utility model, by connecting the condenser to the non-image-taking surface of the image sensor, the cooling element synchronously cools both the condenser and the image sensor. This satisfies the need for cooling the image sensor and saves cost and space by sharing the cooling element. Furthermore, by utilizing the heat generation characteristics of the image sensor itself, the temperature of the image sensor is higher than that of the condenser, ensuring the condensation effect of the low-temperature region of the condenser on volatile organic compounds.

[0031] 4. In this utility model, one end of the condenser extends to the housing so as to simultaneously cool the camera housing through the condenser. This lowers the housing temperature, which is beneficial for condensing volatile organic compounds through the low-temperature housing. This increases the condensation range of the condenser to a certain extent, improves the condensation effect of the condenser, and further reduces the amount of volatile organic compounds volatilized onto the image sensor, thus reducing pollution.

[0032] 5. In this utility model, by adding sealant at the PCB and electrical interface, the airtightness of the camera is enhanced, preventing external contaminants from entering the camera. Furthermore, the sealant is applied to the side of the PCB away from the image sensor, limiting the entry of volatile organic compounds (VOCs) from the sealant into the camera and further reducing VOC contamination of the image sensor. Attached Figure Description

[0033] The accompanying drawings, which are included to provide a further understanding of the present invention and form part of this application, illustrate exemplary embodiments of the present invention and, together with the description thereof, serve to explain the present invention and do not constitute an undue limitation thereof. In the drawings:

[0034] Figure 1 This is a three-dimensional structural view of the camera in this utility model;

[0035] Figure 2 This is a three-dimensional view of the camera structure from another perspective in this utility model;

[0036] Figure 3 This is a structural cross-sectional view of the camera in this utility model;

[0037] Figure 4 This is a utility model Figure 3 Enlarged view of the structure at point A in the middle.

[0038] In the diagram: 1. Housing; 2. Condenser; 21. First condenser plate; 22. Second condenser plate; 3. Refrigeration component; 4. PCB; 5. Image sensor; 6. Electrical interface; 7. Sealing structure; 71. Sealing component; 72. Seal; 73. Fastener. Detailed Implementation

[0039] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0040] Because PCBs contain sources of volatile organic compounds (VOCs) such as substrate materials, soldering processes, and protective coatings, VOC molecules can adhere to the surface of image sensors, affecting image acquisition quality or contaminating devices and causing damage. However, existing technologies do not consider the issue of VOCs volatilizing and contaminating image sensors.

[0041] To solve the above problems, firstly, as Figures 3-4 As shown, this utility model provides an anti-fouling structure for reducing the contamination of the image sensor 5 by volatile organic compounds on the PCB4, comprising:

[0042] The condenser 2 is disposed between the PCB4 and the image sensor 5. The condenser 2 has a receiving chamber inside and an image acquisition port at the bottom.

[0043] The cooling component 3 has its cold end connected to the condenser 2, and is used to cool the condenser 2 so that the temperature of the condenser 2 is lower than that of the image sensor 5, so that volatile organic compounds condense on the condenser 2.

[0044] The image sensor 5 is located in the housing chamber with its front end facing the image acquisition port, so that its non-image acquisition surface is wrapped by the condenser 2 to block the diffusion of volatile organic compounds into the evaporation path of the image sensor 5.

[0045] In this embodiment, the anti-fouling structure is used to reduce the pollution of the image sensor 5 by volatile organic compounds, so that the image sensor 5 can acquire images with higher image quality and operating status.

[0046] In this embodiment, since the image sensor 5 is limited by electrical connections and image acquisition paths, it is impossible to completely eliminate the pollution of volatile organic compounds. However, by setting the condenser 2 between the PCB4 and the image sensor 5, the evaporation path of volatile organic compounds on the PCB4 to the image sensor 5 is blocked, thereby minimizing the probability of volatile organic compounds polluting the image sensor 5 and thus protecting the image sensor 5.

[0047] In this embodiment, the condenser 2 has an internal cavity for housing the image sensor 5. The condenser 2 can also be adapted to have an interface or line channel for electrical connection of the image sensor 5. The image acquisition port at the bottom of the condenser 2 is used for image acquisition of the photosensitive surface of the image sensor 5. This is to ensure that the image sensor 5 is completely enclosed as much as possible without affecting its working state, so as to block the diffusion path of volatile organic compounds to the image sensor 5 to the greatest extent and ensure the effectiveness of the image sensor 5.

[0048] In this embodiment, the cooling component 3 includes, but is not limited to, TEC, compressor refrigeration, magnetic refrigeration and heat pipe refrigeration. In this embodiment, TEC is used as the cooling component 3, and the cold end of TEC is connected to the condenser 2 so that the condenser 2 is cooled down and the temperature is lower than that of the image sensor 5, so that the organic volatiles are preferentially condensed on the condenser 2 with a lower temperature, thereby reducing the contamination of the image sensor 5 by the organic volatiles.

[0049] In this embodiment, the image sensor 5 generates heat when it is in operation. For working environments with high image quality requirements, the image sensor 5 also needs to be cooled. However, since the image sensor 5 itself will accumulate heat, the temperature of the image sensor 5 is often higher than that of the condenser 2. This is to ensure that the condenser 2 maintains a better condensation and anti-fouling effect. Alternatively, the cooling effect of the cooling component 3 can be improved so that the temperature of the condenser 2 is always lower than that of the image sensor 5, thereby ensuring the condensation effect of the condenser 2 on volatile organic compounds and reducing the contamination of the image sensor 5.

[0050] In this invention, a condenser 2, positioned between the PCB4 and the image sensor 5, blocks the evaporation path of volatile organic compounds (VOCs) onto the image sensor 5, thereby reducing the amount of VOCs volatilizing from the PCB4 onto the image sensor 5. The condenser 2 also includes a receiving chamber for the image sensor 5 and an image acquisition port for its own operation. This ensures normal image acquisition while enhancing the encapsulation of the image sensor 5 by the condenser 2, maximizing the blocking of VOCs from diffusing to the image sensor 5. Furthermore, a cooling component 3, with its cold end connected to the condenser 2, cools the condenser 2, making its temperature lower than that of the image sensor 5. This causes VOCs to preferentially condense on the cooler condenser 2, further reducing the probability of VOCs evaporating and condensing on the image sensor 5. This optimizes the working environment of the image sensor 5, improving image acquisition quality and lifespan.

[0051] The condenser 2 can take many forms. Specifically, as long as it can accommodate the image sensor 5 without obstructing the image acquisition path and has the function of condensing volatile organic compounds, it falls within the protection scope of this utility model. In some embodiments, the condenser 2 includes:

[0052] The first condenser plate 21 is connected to the refrigeration component 3 at its top;

[0053] Several second condensing plates 22 are disposed on the side of the first condensing plate 21, bent and extended to the bottom of the image sensor 5 to cooperate with the first condensing plate 21 to form a receiving chamber.

[0054] In this embodiment, both the first condensing plate 21 and the second condensing plate 22 are made of materials with high thermal conductivity, including but not limited to thermally conductive metals and alloy materials. In this embodiment, both the first condensing plate 21 and the second condensing plate 22 are made of copper as the preparation material. Copper with high thermal conductivity is used as the preparation material of the condensing component 2 so that the cooling component 3 can quickly and comprehensively cool the condensing component 2, ensuring that the condensing component 2 has a good condensation effect.

[0055] In this embodiment, the top of the first condensing plate 21 is connected to the cold end of the cooling component 3 so that the cooling component 3 can quickly cool down the first condensing plate 21.

[0056] In this embodiment, a plurality of second condensing plates 22 are fixedly disposed on the side of the first condensing plate 21. The cross-section of the second condensing plate 22 is U-shaped, and it bends toward the side close to the image sensor 5 and extends to the non-image acquisition path at the bottom of the image sensor 5 to wrap the image sensor 5 to form a receiving chamber, and by extending to the non-image acquisition path at the bottom of the image sensor 5, an image acquisition port is opened for image acquisition by the image sensor 5.

[0057] In this embodiment, the number of second condensing plates 22 and their positions on the first condensing plate 21 are adaptively set based on the wiring requirements of the image sensor 5, so as to facilitate normal image acquisition by the image sensor 5.

[0058] In some embodiments, the condenser 2 includes:

[0059] A hollow condenser shroud is connected to the refrigeration component 3 at the top and has an opening at the bottom.

[0060] The image sensor 5 is located inside the hollow condenser shroud, with its front end facing the bottom opening of the hollow condenser shroud for image acquisition.

[0061] In this embodiment, another form of the condenser 2 is a hollow condenser cover with a hollow structure. The hollow area of ​​the hollow condenser cover serves as a cavity for accommodating the image sensor 5, so that the image sensor 5 is better enclosed and the evaporation path of volatile organic compounds is blocked. Furthermore, an opening is provided at the bottom of the hollow condenser cover as an image acquisition port for the image sensor 5.

[0062] In this embodiment, the hollow condenser cover may also be adapted to provide openings for electrical connection or cooling of the image sensor 5, so as to ensure the normal use of the image sensor 5.

[0063] To further reduce the contamination caused by the volatilization of volatile organic compounds onto the image sensor 5, in some embodiments, the surface of the condenser 2 is provided with an adsorption layer for adsorbing volatile organic compounds.

[0064] In this embodiment, the adsorption layer may be made of materials that can absorb volatile organic compounds, including but not limited to activated carbon and adsorbents, and is used to absorb volatile organic compounds. The adsorption layer is set at locations including but not limited to the outer or inner surface of the condenser 2. Preferably, the adsorption layer is set on the outer surface of the condenser 2 to cover the evaporation path of the volatile organic compounds as much as possible.

[0065] To further enhance the adsorption effect of volatile organic compounds, in some embodiments, the top of the condenser 2 is provided with a groove, which is connected to the cold end of the refrigeration component 3, and an adsorbent is provided inside the groove for adsorbing volatile organic compounds.

[0066] In this embodiment, the groove is connected to the cooling component 3 so that the groove forms a low-temperature area relative to the condenser 2, which better condenses the volatile organic compounds. The groove also works with the adsorbent in the groove to absorb the volatile organic compounds, thereby preventing the accumulation of volatile organic compounds on the condenser 2 and maintaining the condensation effect of the condenser 2.

[0067] In this invention, by adding an adsorption layer to the surface of the condenser 2 and adding a groove to the surface of the condenser 2 for accommodating the adsorbent, on the one hand, the adsorption of organic volatiles by the condenser 2 can be enhanced by the adsorption layer or the adsorbent, reducing the volatilization of organic volatiles and their diffusion to the image sensor 5. On the other hand, it can also reduce the condensation and accumulation of organic volatiles on the condenser 2 itself, so that the condenser 2 can maintain a good condensation effect.

[0068] In order to save costs and optimize space, in some embodiments, the condenser 2 is connected to the non-image sensor 5 so that the cooling element 3 can simultaneously cool the condenser 2 and the image sensor 5.

[0069] In this embodiment, by sharing a single cooling unit 3 with the image sensor 5 and the condenser 2, not only are some of the cooling requirements of the image sensor 5 met, but the cooling device for cooling the image sensor 5 is also saved, thus optimizing the usable space.

[0070] In this embodiment, the connection between the condenser 2 and the image sensor 5 can be a direct connection via contact heat conduction. In this case, the cooling component 3 cools the condenser 2 and directly cools the image sensor 5 through the condenser 2. Alternatively, it can be an indirect connection via a heat-conducting component. In this case, the cooling component 3 cools the condenser 2, and the condenser 2 indirectly cools the image sensor 5 through the heat-conducting component. Since the image sensor 5 generates its own heat, the temperature of the condenser 2 is always lower than that of the image sensor 5, thus maintaining a good condensation effect for the condenser 2.

[0071] In this invention, the condenser 2 is connected to the non-image-taking surface of the image sensor 5, so that the cooling element 3 can simultaneously cool the condenser 2 and the image sensor 5. This satisfies the need to cool the image sensor 5, saves cost and space by sharing the cooling element 3, and utilizes the heat generation characteristics of the image sensor 5 to make the temperature of the image sensor 5 higher than that of the condenser 2, thus ensuring the condensation effect of the low-temperature region of the condenser 2 on the volatile organic compounds.

[0072] In addition, such as Figures 1-4 As shown, this utility model also provides a camera, including:

[0073] Such as the anti-fouling structure described above;

[0074] Housing 1, used to support the internal components of the camera.

[0075] In this embodiment, the housing 1 is used to support the image sensor 5, the condenser 2, the cooling component 3 and other components. The anti-fouling structure is applied to the camera to reduce the contamination of the image sensor 5 by volatile organic compounds on the PCB 4 inside the camera, thereby reducing the obstruction of the image sensor 5's image acquisition surface or the damage to the image sensor 5, thus improving the camera's image acquisition quality and reducing camera maintenance costs.

[0076] In order to expand the condensation range of the condenser 2, in some embodiments, at least one end of the condenser 2 is in contact with the housing 1, so as to lower the temperature of the housing 1 to condense the organic volatiles.

[0077] In this embodiment, one end of the condenser 2 extends to the housing 1 so as to simultaneously cool the camera housing 1 through the condenser 2. This lowers the temperature of the housing 1, which is beneficial for the condensation of volatile organic compounds through the low-temperature housing 1. This increases the condensation range of the condenser 2 to a certain extent, improves the condensation effect of the condenser 2, and further reduces the amount of volatile organic compounds volatilized onto the image sensor 5, causing pollution.

[0078] To improve the camera's sealing performance, in some embodiments, the camera further includes:

[0079] Electrical interface 6 is connected to PCB4 and the connection is coated with sealant.

[0080] In this embodiment, the electrical interface 6 passes through the housing 1, with one end connected to the PCB4 inside the camera and the other end connected to the electrical equipment outside the camera. By adding sealant at the PCB4 and the electrical interface 6, and the sealant being applied to the side of the PCB4 away from the image sensor 5, the volatile organic compounds in the sealant are prevented from entering the camera and contaminating the image sensor 5.

[0081] In this invention, by adding sealant at the PCB4 and electrical interface 6, the airtightness of the camera is enhanced, preventing external contaminants from entering the camera. Furthermore, the sealant is applied to the side of the PCB4 away from the image sensor 5, limiting the entry of volatile organic compounds from the sealant into the camera and further reducing the contamination of the image sensor 5 by volatile organic compounds.

[0082] To further improve the airtightness between the camera's internal cavity and the external environment, in some embodiments, the camera further includes:

[0083] Sealing structure 7, used to seal at least one through groove on housing 1 to isolate the inner cavity of housing 1 from the outside, includes:

[0084] The sealing component 71 is installed on the outside of the housing 1 and is used to seal the through groove;

[0085] Seal 72 is used to seal the plug 71 and the housing 1 so as to isolate the inner cavity of the housing 1 from the outside;

[0086] The sealing member 71 forms a blocking part between the housing 1 and the housing 1. The blocking part is located between the inner cavity of the housing 1 and the sealing member 72 to prevent the organic volatiles on the surface of the sealing member 72 from entering the inner cavity of the housing 1.

[0087] In this embodiment, by blocking and sealing the through groove on the housing 1, two non-interfering spaces are formed between the inner cavity of the housing 1 and the outside, so that external contaminants cannot enter the housing 1 and contaminate the inner cavity components.

[0088] In this embodiment, the function of the through slot is to connect the inner cavity of the housing 1 with the outside, so as to realize data interaction or transmission between the inner cavity of the housing 1 and the outside through the through slot. The number of through slots is not less than one, and each through slot needs to prevent the organic volatiles on the sealing member 71 from volatilizing into the inner cavity of the housing 1.

[0089] In this embodiment, the surface area of ​​the sealing member 71 in contact with the through groove is larger than the area of ​​the through groove, so that the sealing member 71 completely covers the through groove and plays the role of sealing the through groove.

[0090] In this embodiment, the sealing element 71 is in close contact with the housing 1 so that the sealing element 71 can achieve a better sealing effect.

[0091] In this embodiment, the type of sealing element 72 includes, but is not limited to, sealing rings, sealing adhesives, sealing strips, sealing gaskets, etc. Its material can be flexible materials such as rubber and silicone, or rigid materials such as metal and graphite. Preferably, in this embodiment, the sealing element 72 is a sealing ring made of rubber, so as to effectively seal the contact surface between the sealing element 71 and the housing 1 through the sealing element 72.

[0092] In this embodiment, a blocking part is provided between the sealing member 71 and the housing 1. The blocking part is located between the sealing member 72 and the inner cavity of the housing 1, so that the sealing member 72 is located outside the housing 1, so that the organic volatiles on the surface of the sealing member 72 are blocked outside the housing 1. At the same time, it can further improve the sealing effect of the sealing structure 7 and prevent pollutants outside the housing 1 from entering the inner cavity of the housing 1.

[0093] In this invention, the through groove is sealed by the sealing member 71 installed on the outside of the housing 1 to achieve a preliminary seal between the inner cavity of the housing 1 and the outside. The sealing member 72 is further provided to enhance the sealing effect of the sealing member 71, so as to isolate the inner cavity of the housing 1 from the outside and obtain a better sealed space in the inner cavity of the housing 1, so as to avoid the inner cavity components of the housing 1 from being contaminated by the outside. Furthermore, the blocking part formed between the sealing member 71 and the housing 1, and the blocking part is located between the inner cavity of the housing 1 and the sealing member 72, prevents the organic volatiles on the surface of the sealing member 72 from entering the inner cavity of the housing 1, and blocks the organic volatiles on the sealing member 72 from the outside of the housing 1. At the same time, the blocking part can also further serve as a sealing unit to provide protection for the housing 1, improve the sealing effect of the sealing structure 7, and further prevent external pollutants from entering the inner cavity of the housing 1.

[0094] In order to simplify the sealing structure 7 and save manufacturing or production costs, and taking into account the limitations of installation space, in some embodiments, the blocking part is formed by the abutment between the sealing member 71 and the housing 1.

[0095] In this embodiment, the blocking part is the contact surface between the sealing member 71 and the housing 1. The contact surface formed by the tight fit between the sealing member 71 and the housing 1 serves as the blocking part, isolating the sealing member 72 outside the housing 1 to prevent the volatile organic compounds on the surface of the sealing member 72 from evaporating into the inner cavity of the housing 1 and causing pollution.

[0096] In this embodiment, the blocking effect of the blocking part on volatile organic compounds can be improved by increasing the area of ​​the contact surface between the sealing member 71 and the housing 1. Preferably, the evaporation path of volatile organic compounds can be increased by increasing the path length from the sealing member 72 to the inner cavity of the housing 1, thereby further improving the blocking effect on volatile organic compounds.

[0097] In order to improve the blocking effect of the blocking part on volatile organic compounds, in some embodiments, an adsorption layer is provided on the contact surface between the sealing member 71 and the housing 1 for adsorbing volatile organic compounds.

[0098] In this embodiment, the adsorption layer can be disposed on the contact surface of the sealing member 71 and / or the shell 1. The adsorption layer can be made of materials that can absorb volatile organic compounds, including but not limited to activated carbon and adsorbents, and is used to effectively block the volatile organic compounds from entering the inner cavity of the shell 1.

[0099] In order to further improve the blocking effect of the blocking part on volatile organic compounds, in some embodiments, the sealing member 71 and the shell 1 are respectively provided with matching bosses and grooves on their contact surfaces.

[0100] In this embodiment, a boss can be provided on the surface of the sealing member 71, and a groove adapted to the boss can be provided on the surface of the corresponding housing 1. Alternatively, a groove can be provided on the surface of the sealing member 71, and a boss adapted to the groove can be provided on the surface of the corresponding housing 1. The length of the evaporation path of the organic volatiles can be increased by providing the boss and groove, and the obstacles on the evaporation path can be increased by providing the boss and groove, so as to make the blocking effect significant.

[0101] In this embodiment, the shapes of the boss and the groove include, but are not limited to, common types such as rectangle, triangle, arc, and circle. They can also be irregular shapes. The boss and the groove do not need to be completely fitted together, or they can be partially fitted together. However, a complete and tight fit provides a better blocking effect.

[0102] In this invention, by providing mutually cooperating bosses and grooves on the contact surface between the sealing member 71 and the housing 1, the evaporation path length of volatile organic compounds entering the inner cavity of the housing 1 is increased, thereby increasing the difficulty for volatile organic compounds to evaporate into the inner cavity of the housing 1. The setting of bosses and grooves increases the obstacles on the evaporation path, thereby significantly improving the blocking effect of the blocking part. Furthermore, an adsorption layer for absorbing volatile organic compounds is provided to reduce the risk of volatile organic compounds entering the inner cavity of the housing 1. In addition, the blocking part serves as another sealing unit of the sealing structure 7, adding another layer of defense to prevent external pollutants from entering the inner cavity of the housing 1, thus improving the sealing effect.

[0103] In some embodiments, the blocking portion includes a blocking element located between the sealing element 71 and the housing 1.

[0104] In this embodiment, the blocking part can also be a blocking member disposed between the sealing member 71 and the housing 1. In this case, the sealing member 71 and the housing 1 do not necessarily need to be in contact, but the blocking member effectively blocks the volatilization path of the organic volatiles.

[0105] In this embodiment, the connection between the blocking component and the sealing component 71 / housing 1 can be a fixed connection, a detachable connection, or a movable connection.

[0106] To further enhance the blocking effect of the blocking part on volatile organic compounds, in some embodiments, the blocking element is provided with an adsorption layer for adsorbing volatile organic compounds.

[0107] In this embodiment, the adsorption layer is disposed on the blocking member, and the position of the adsorption layer on the blocking member can be arbitrarily distributed. Preferably, the adsorption layer is disposed on the side of the blocking member close to the sealing member 72, so as to fully absorb the volatile organic compounds.

[0108] To better install the sealing element 71 and the sealing element 72, and to make the sealing element 71 and the sealing element 72 fit more tightly against the housing 1, in some embodiments, the sealing structure 7 further includes:

[0109] Fastener 73 is used to fasten the plug 71 and the seal 72.

[0110] In this embodiment, the fastener 73 compresses the sealing member 71 to fit tightly against the outside of the housing 1 to block the corresponding through groove, and the sealing member 72 fits tightly against the sealing member 71 or the housing 1 to achieve a seal on the inner cavity of the housing 1.

[0111] In this embodiment, the fastener 73 is fixed to the housing 1 by means including but not limited to bolts, rivets, pins, etc.

[0112] In order to better fix the seal 72 and prevent slippage, the fastener 73 is also provided with a positioning groove for positioning the seal 72. The volume of the positioning groove is adapted to the seal 72. At the same time, in order to better fix the plug 71 and the fastener 73, the housing 1 is also provided with a fixing groove for positioning the plug 71 and the fastener 73.

[0113] In this embodiment, regarding the placement of the seal 72, on the one hand, it is necessary to ensure that the seal 72 is located outside the blocking part so as to block the organic volatile molecules on the surface of the seal 72 through the blocking part. On the other hand, it is necessary to ensure that the path of external pollutants entering the inner cavity of the housing 1 is blocked by the seal 72 so as to fully isolate pollutants outside the housing 1 that are smaller in volume than organic volatile molecules.

[0114] Specifically, in this embodiment, the sealing member 72 is disposed in a pre-set positioning groove on the housing 1 and is located between the side of the sealing member 71 and the housing 1, so as to seal the path of external pollutants entering the inner cavity of the housing 1.

[0115] In another embodiment, the sealing element 72 is disposed in a pre-set positioning groove on the fastener 73, and there are two sealing elements 72, which respectively abut against the sealing element 71 and the fastener 73, and between the housing 1 and the fastener 73, so that the contact surfaces of the fastener 73 with the sealing element 71 and the housing 1 are sealed.

[0116] In this invention, a sealing structure 7 is provided in the camera to block the volatile organic compounds on the seal 72 from entering the camera housing, thereby preventing the volatile organic compounds from entering the camera housing and causing contamination of the image sensor 5, affecting the image acquisition quality or causing damage to the image sensor 5, thereby improving the image acquisition quality and stability of the camera. The high sealing performance of the sealing structure 7 also ensures the stable airtightness inside the camera, preventing fogging on the surface of the image sensor 5 from obstructing image acquisition.

[0117] Finally, this invention provides an electronic device, including the camera described above.

[0118] In the description of this specification, references to terms such as "an embodiment," "example," and "specific example" indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0119] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. Those skilled in the art should understand that this utility model is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of this utility model. Various changes and modifications can be made to this utility model without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claimed utility model.

Claims

1. A contamination-resistant structure for reducing volatile organic compound (VOC) contamination of an image sensor on a PCB, characterized in that, include: A condenser is located between the PCB and the image sensor. The condenser has an internal receiving chamber and an image acquisition port at the bottom. The cooling component, with its cold end connected to the condenser, is used to cool the condenser so that its temperature is lower than that of the image sensor, thereby causing volatile organic compounds to condense on the condenser. The image sensor is located in the housing chamber with its front end facing the image acquisition port, so that its non-image acquisition surface is wrapped by a condenser to prevent volatile organic compounds from diffusing into the evaporation path of the image sensor.

2. The anti-fouling structure according to claim 1, characterized in that, The condenser includes: The first condenser plate is connected to the refrigeration component at the top; Several second condensing plates are disposed on the side of the first condensing plate, bent and extended to the bottom of the image sensor to cooperate with the first condensing plate to form a receiving chamber.

3. The anti-fouling structure according to claim 1, characterized in that, The condenser includes: Hollow condenser shroud, connected to the refrigeration components at the top and with an opening at the bottom; The image sensor is located inside the hollow condenser hood, with its front end facing the bottom opening of the hollow condenser hood for image acquisition.

4. A stain-resistant structure according to any one of claims 1-3, characterized in that, The surface of the condenser is provided with an adsorption layer for adsorbing volatile organic compounds.

5. A stain-resistant structure according to any one of claims 1-3, characterized in that, The top of the condenser is provided with a groove, which is connected to the cold end of the refrigeration component. The groove is provided with an adsorbent for adsorbing volatile organic compounds.

6. A stain-resistant structure according to any one of claims 1-3, characterized in that, The condenser is connected to the non-image sensor surface so that the cooling element can simultaneously cool the condenser and the image sensor.

7. A camera, characterized in that, include: The anti-fouling structure as described in any one of claims 1-6; The housing is used to support the internal components of the camera.

8. A camera according to claim 7, characterized in that, The condenser is in contact with the housing at least at one end, thereby lowering the housing temperature to condense volatile organic compounds.

9. A camera according to any one of claims 7-8, characterized in that, The camera also includes: The electrical interface connects to the PCB, and the connection point is coated with sealant.

10. An electronic device, characterized in that, Includes the camera as described in any one of claims 7-9.

Images