Power module and power converter

Abstract

This application relates to the field of power converter technology, specifically to a power module and a power converter. This application aims to solve the technical problem of excessive parasitic inductance introduced into the circuit board, leading to significant power loss in the power converter. Embodiments of this application provide a power module, including a package, a first power chip, and a second power chip. Both the first and second power chips are packaged within the package. The power module also includes connecting lines disposed within the package. The first and second power chips are electrically connected via these connecting lines, facilitating the integration of the power module and improving the power density of the power converter. Because the connecting lines are disposed within the package, and the first and second power chips are electrically connected via these connecting lines, the trace distance on the circuit board can be reduced, lowering the parasitic inductance on the circuit board and thus reducing the power loss of the power converter.

Description

Technical Field

[0001] This application relates to the field of power converter technology, specifically to a power module and a power converter. Background Technology

[0002] Power converters such as inverters and rectifiers generally consist of power modules and circuit boards. The power modules are mounted on the circuit boards and are electrically connected to them. Since there are often many power modules connected to each other via wiring on the circuit boards, the complex routing of the power chips can easily introduce excessive parasitic inductance, leading to significant power losses in the power converter. Utility Model Content

[0003] This application provides a power module and a power converter that can reduce the parasitic inductance of the circuit board and reduce the power loss of the power converter.

[0004] In a first aspect, embodiments of this application provide a power module, including a package, a first power chip, and a second power chip. Both the first power chip and the second power chip are packaged within the package. The power module also includes connecting lines disposed within the package, and the first power chip and the second power chip are electrically connected via the connecting lines.

[0005] Both the first and second power chips are packaged within a single package, facilitating the integration of the power module and increasing the power density of the power converter. Because the connecting lines are housed within the package, the first and second power chips are electrically connected via these lines, reducing trace distances on the circuit board and lowering parasitic inductance, thereby reducing power losses in the power converter.

[0006] In some embodiments that may include the above embodiments, a through hole is provided on the package body, the center line of the through hole is parallel to the thickness direction of the package body, the first power chip and the second power chip are arranged at intervals along the direction perpendicular to the thickness direction of the package body, and the through hole is disposed between the first power chip and the second power chip.

[0007] The package has through-holes that allow the power module to connect to the circuit board and heat sink. The through-holes are positioned between the first and second power chips, resulting in more even stress distribution from the circuit board on both chips and ensuring a tight connection between them. In some embodiments, including those described above, a preset distance is maintained between the first and second power chips and the through-holes, and the distance between the connecting lines and the centerline of the through-holes is greater than or equal to this preset distance.

[0008] The first and second power chips are spaced at a preset distance from the through-hole, which ensures that there is sufficient electrical clearance and creepage distance between the bolt and the first power chip, and between the bolt and the second power chip, to prevent the first and second power chips from short-circuiting or being broken down.

[0009] The distance between the center line of the connecting line and the center line of the through hole is greater than or equal to the preset distance, which can ensure that there is sufficient electrical clearance and creepage distance between the connecting line and the bolt, and prevent the connecting line from short-circuiting and burning out the first power chip and the second power chip.

[0010] In some embodiments that may include the above embodiments, a limiting flange is provided on the package body, the limiting flange is disposed around the through hole, and the limiting flange is used to be embedded in the limiting hole on the circuit board.

[0011] The limiting flange is wrapped around the through hole and is used to embed in the limiting hole on the circuit board. It can realize the positioning between the power module and the circuit board, which facilitates the subsequent connection between the power module and the circuit board. At the same time, the limiting flange can increase the distance between the circuit board and the bolt, so that the bolt and the live components on the circuit board maintain sufficient electrical clearance and creepage distance, preventing high voltage breakdown or leakage.

[0012] In some embodiments that may include the above embodiments, a stop portion is provided on the limiting flange, the stop portion being used to abut against the surface of the circuit board facing the package.

[0013] The abutting part abuts against the surface of the circuit board facing the package, which can support the circuit board, determine the distance between the circuit board and the power module, ensure that the circuit board and the package are parallel, and improve the stability of the connection between the circuit board and the power module.

[0014] In some embodiments that may include the above embodiments, a groove is provided on a first surface of the package that is perpendicular to the thickness direction of the package, and the projections of the first power chip and the second power chip on the first surface are located in the groove.

[0015] A groove is formed on a first surface perpendicular to the thickness direction of the package. The projections of the first power chip and the second power chip on the first surface are located within the groove. The groove exposes the first and second power chips, allowing them to directly contact the heat sink. The heat from the first and second power chips can be directly transferred to the heat sink, improving the heat dissipation effect of the first and second power chips.

[0016] In some embodiments that may include the above embodiments, the groove includes a first groove and a second groove, the first groove and the second groove are spaced apart, the projection of the first power chip on the first surface is located in the first groove, and the projection of the second power chip on the first surface is located in the second groove.

[0017] The first groove and the second groove are spaced apart, and the projection of the first power chip on the first surface is located in the first groove, while the projection of the second power chip on the first surface is located in the second groove. In other words, the first groove corresponds to the position of the first power chip, and the second groove corresponds to the position of the second power chip.

[0018] The first and second recesses ensure the exposure area of ​​the first and second power chips. At the same time, they prevent the recesses from exposing other circuitry within the package to the outside, thus reducing the reliability of the power module.

[0019] In some embodiments that may include the above embodiments, the power chip further includes a housing, and a protrusion is provided on the side of the housing near the groove, the protrusion being disposed within the groove.

[0020] The power module and the heat sink are connected by a protrusion, which can improve the heat dissipation rate of the power module and ensure the heat dissipation effect of the power module.

[0021] In some embodiments that may include the above embodiments, the power module further includes a first pin and a second pin, which are disposed at one end of the package along a direction perpendicular to the thickness of the package. The first pin is electrically connected to the first power chip, and the second pin is electrically connected to the second power chip.

[0022] The first pin and the second pin are located at one end of the package body along the direction perpendicular to the thickness of the package body. The first pin is electrically connected to the first power chip, and the second pin is electrically connected to the second power chip. This can shorten the connection distance between the first pin and the second pin and the circuit board, reduce the trace distance on the circuit board, reduce the area of ​​the circuit board, and reduce the parasitic inductance on the circuit board.

[0023] In some embodiments that may include the above embodiments, the first pin includes a first sub-pin and a second sub-pin, there is a voltage difference between the first sub-pin and the second sub-pin, and a first isolation groove is provided on the package between the first sub-pin and the second sub-pin; the second pin includes a third sub-pin and a fourth sub-pin, there is a voltage difference between the third sub-pin and the fourth sub-pin, and a second isolation groove is provided on the package between the third sub-pin and the fourth sub-pin.

[0024] Because of the voltage difference between the first and second sub-pins, either the first or second sub-pin is under high voltage during operation, which can easily lead to arcing or corona discharge, increasing the risk of electrical faults. Adding a first isolation groove between the first and second sub-pins increases the creepage distance and clearance between them, preventing arcing or leakage current from occurring between the two pins.

[0025] In addition, high heat is generated when the first or second sub-pin carries a large current. The first isolation groove can increase the distance between the first and second sub-pins, reduce the conduction of heat to adjacent pins (second or first sub-pins), and avoid local temperature rise affecting the reliability of the power module.

[0026] Similarly, due to the voltage difference between the third and fourth sub-pins, either the third or fourth sub-pin is under high voltage during operation, which can easily generate arcing or corona, increasing the risk of electrical faults. Adding a second isolation groove between the third and fourth sub-pins can increase the creepage distance and clearance between them, preventing arcing or leakage current from occurring between them.

[0027] In addition, the third or fourth sub-pin will generate high heat when carrying a large current. The second isolation slot can increase the distance between the third and fourth sub-pins, reduce the conduction of heat to adjacent pins (fourth or third sub-pins), and avoid local temperature rise affecting the reliability of the power module.

[0028] In some embodiments that may include the above embodiments, the first sub-pin is a power pin, the second sub-pin is a signal pin, the first sub-pin is located away from the edge of the package, and the second sub-pin is located close to the edge of the package. The third sub-pin is a power pin, and the fourth sub-pin is a signal pin, the third sub-pin is located away from the edge of the package, and the fourth sub-pin is located close to the edge of the package.

[0029] Since the first and third sub-pins are power pins, the voltages of the first and third sub-pins are higher, while the voltages of the second and fourth sub-pins are lower. The first and third sub-pins are positioned away from the edge of the package, while the second and fourth sub-pins are positioned close to the edge of the package. In other words, the first and third sub-pins are located in the middle of the package, while the second and fourth sub-pins are located on either side.

[0030] The first and third sub-pins are located in the middle, which can reduce the trace distance between the first and third sub-pins and facilitate the miniaturization of the package.

[0031] In some embodiments that may include the above embodiments, the spacing between the first sub-pin and the third sub-pin is greater than the spacing between the first sub-pin and the second sub-pin. The spacing between the first sub-pin and the third sub-pin is greater than the spacing between the third sub-pin and the fourth sub-pin.

[0032] Both the first and third sub-pins are power pins, and the voltage on the first and third sub-pins is relatively high, making it easier for arcing to occur between them. Therefore, it is necessary to further increase the spacing between them to increase the creepage distance between the first and third sub-pins, thereby avoiding arcing between the first and third sub-pins and reducing the risk of electrical faults.

[0033] Similarly, the spacing between the first sub-pin and the third sub-pin is greater than the spacing between the third sub-pin and the fourth sub-pin, which further increases the creepage distance between the first sub-pin and the third sub-pin, preventing arcing between the first sub-pin and the third sub-pin and reducing the risk of electrical faults.

[0034] In some embodiments that may include the above embodiments, the power module further includes a support member, which is disposed on one side of the package where the first pin and the second pin protrude, and the support member is used to abut against the circuit board.

[0035] A support component is located on one side of the first and second pins that protrude from the package and abuts against the circuit board. This increases the contact area between the power module and the circuit board, preventing only the first and second pins from being connected to the circuit board. The support component can also distribute the stress from the circuit board on the first and second pins, preventing them from bending under stress and ensuring the normal operation of the power module.

[0036] Secondly, embodiments of this application also provide a power converter, including a circuit board, a heat sink, and the aforementioned power module. Along the thickness direction of the power module, the power module is disposed between the circuit board and the heat sink, and the power module is connected to the circuit board through pins.

[0037] The power converter provided in this application includes the power module in any of the above embodiments, so both can solve the same technical problem and achieve the same technical effect. Attached Figure Description

[0038] Figure 1 This is a schematic diagram of the power converter provided in the embodiments of this application;

[0039] Figure 2 This is a schematic diagram of the power module provided in the embodiments of this application;

[0040] Figure 3This is a schematic diagram of the structure of the first power chip and the second power chip provided in the embodiments of this application;

[0041] Figure 4 for Figure 2 Sectional view along axis AA;

[0042] Figure 5 Rear view of the power module provided in an embodiment of this application;

[0043] Figure 6 A side view of a first power chip or a second power chip provided in an embodiment of this application.

[0044] Explanation of reference numerals in the attached figures:

[0045] 10: Power converter; 11: Circuit board; 12: Heat sink; 121: Receiving groove; 122: Threaded hole; 13: Ceramic plate; 20: Power module; 21: Pin; 22: Package; 221: Through hole; 222: First surface; 23: Connection line; 24: Limiting flange; 241: Abutment part; 25: Groove; 251: First groove; 252: Second groove; 26: Support; 31: First power chip; 32: Second power chip; 41: Housing; 42: Protrusion; 51: First pin; 511: First sub-pin; 512: Second sub-pin; 52: Second pin; 521: Third sub-pin; 522: Fourth sub-pin; 61: First isolation groove; 62: Second isolation groove. Detailed Implementation

[0046] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0047] Hereinafter, the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first," "second," etc., may explicitly or implicitly include one or more of that feature.

[0048] Furthermore, in the embodiments of this application, directional terms such as "up," "down," "left," "right," "horizontal," and "vertical" are defined relative to the orientation of the components shown in the accompanying drawings. It should be understood that these directional terms are relative concepts, used for relative description and clarification, and can change accordingly depending on the orientation of the components in the accompanying drawings.

[0049] In the embodiments of this application, unless otherwise explicitly specified and limited, the term "connection" should be interpreted broadly. For example, "connection" can be a fixed connection, a detachable connection, or an integral part; it can be a direct connection or an indirect connection through an intermediate medium.

[0050] It should be noted that, in the description of the embodiments of this application, unless otherwise explicitly specified and limited, the terms "connected" and "linked" should be interpreted broadly. For example, they can refer to a fixed connection or an integral connection; they can also refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; or they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in the embodiments of this application according to the specific circumstances.

[0051] Please refer to Figure 1 This application provides a power converter 10, including a circuit board 11, a heat sink 12, and a power module 20. Along the thickness direction of the power module 20, the power module 20 is disposed between the circuit board 11 and the heat sink 12, and the power module 20 is connected to the circuit board 11 through pins 21.

[0052] One end of the power converter 10 can be connected to the power grid, and the other end can be connected to devices such as batteries to process the current from the power grid to meet charging and discharging needs.

[0053] This application does not limit the power converter 10. For example, the power converter 10 may include an inverter, a rectifier, a power conversion system (PCS), a switching power supply, a server power supply, etc.

[0054] In embodiments where the power converter 10 includes an inverter, the power converter 10 can convert the direct current (DC) from the battery into alternating current (AC) and transmit it to the power grid. In embodiments where the power converter 10 includes a rectifier, the power converter 10 can convert the AC from the power grid into DC and store it in the battery.

[0055] In addition to the power converter 10 mentioned above, the power module 20 can also be installed on the power conversion circuit of the new energy vehicle to convert the DC power of the battery into AC power to power the motor; it can also convert the DC power of the battery into DC power with a lower voltage to power low-voltage equipment such as vehicle lights and instruments.

[0056] Since the power module 20 generates a lot of heat during operation, the temperature of the power module 20 is relatively high. The heat sink 12 is located on the side of the power module 20 away from the circuit board 11, which can accelerate the cooling speed of the power module 20, improve the heat dissipation capacity of the power module 20, and ensure the normal use of the power module 20.

[0057] Continue to refer to Figure 1 In some embodiments, a receiving groove 121 is typically provided on the surface of the heat sink 12 near the power module 20, and a ceramic plate 13 is disposed within the receiving groove 121. The side of the power module 20 near the heat sink 12 is connected (e.g., in contact) to the ceramic plate 13. The heat of the power module 20 can be transferred to the heat sink 12 through the ceramic plate 13, thereby achieving heat dissipation of the power module 20.

[0058] This application does not limit the heat sink 12. For example, the heat sink 12 can be an air-cooled heat sink or a liquid-cooled heat sink. In embodiments where the heat sink 12 includes an air-cooled heat sink, the heat sink 12 may include a fan and heat sink fins disposed inside the power converter 10. The heat sink fins can contact the power module 20, and the fan is used to drive airflow through the heat sink fins to cool the heat sink fins, thereby achieving cooling of the power module 20.

[0059] In embodiments where the radiator 12 includes a liquid-cooled radiator, the radiator 12 may include a liquid-cooled plate, one side of which contacts the power module 20. The liquid-cooled plate forms a cavity in which coolant is disposed. The radiator 12 also includes a cooling pump, cooling pipes, and a fan. The cooling pipes are disposed within the cavity, and coolant flows within the cooling pipes. The cooling pump is disposed inside the liquid-cooled plate and connected to the cooling pipes, ensuring that the coolant flows in a predetermined direction within the cavity. The fan is disposed on the side of the cooling pipes away from the power module 20, which can reduce the temperature of the coolant and ensure the cooling effect of the coolant on the power module 20.

[0060] When the coolant flows to the part where the liquid cooling plate contacts the power module 20, it absorbs heat from the power module 20, thus cooling the power module 20. The coolant temperature rises after absorbing heat and continues to flow along the cooling pipes away from the power module 20. When the coolant flows near the fan, the fan can lower the coolant temperature, and the cooled coolant continues to be used to cool the power module 20.

[0061] The power module 20 is mounted on the circuit board 11 and electrically connected to the circuit board 11. There are a large number of power modules 20, and multiple power modules 20 are connected to each other through the lines on the circuit board 11. The wiring is complex and can easily introduce too much parasitic inductance, resulting in a large power loss of the power converter 10.

[0062] Please refer to Figure 2 and Figure 3 The power module 20 provided in this application embodiment includes a package 22, a first power chip 31, and a second power chip 32. Both the first power chip 31 and the second power chip 32 are packaged within the package 22.

[0063] Here, power module 20 refers to an integrated power electronic device that can package multiple power chips, drive circuits, protection circuits, etc. together to achieve efficient and reliable power conversion (such as AC-DC conversion, voltage boosting and scaling, frequency conversion control, etc.).

[0064] This application does not limit the power chip. For example, the power chip can be a diode, silicon carbide (SiC) transistor, metal-oxide-semiconductor field-effect transistor (MOSFET), gallium nitride (GaN) transistor, thyristor, or insulated-gate bipolar transistor (IGBT).

[0065] Here, package 22 refers to a protective shell formed by injection molding, which can be used to enclose internal structures such as power chips and leads. This application embodiment does not limit the material of package 22; for example, the material of package 22 can be epoxy resin, polyimide, etc.

[0066] The power module 20 also includes a connection line 23, which is disposed within the package 22. The first power chip 31 and the second power chip 32 are electrically connected through the connection line 23.

[0067] Both the first power chip 31 and the second power chip 32 are packaged within the package 22, facilitating the integration of the power module 20 and increasing the power density of the power converter 10. Since the connecting line 23 is located within the package 22, the first power chip 31 and the second power chip 32 are electrically connected via the connecting line 23, which reduces the trace distance on the circuit board 11, lowers the parasitic inductance on the circuit board 11, and thus reduces the power loss of the power converter 10.

[0068] Continue to refer to Figure 2 and Figure 3 In some embodiments, the package 22 is provided with a through hole 221, and the center line of the through hole 221 ( Figure 2 The dashed line in the middle, Figure 3The black solid circle in the package 22 is parallel to the thickness direction z of the package 22 (the thickness direction z of the power module 20). The first power chip 31 and the second power chip 32 are spaced apart along the direction perpendicular to the thickness direction z of the package 22. The through hole 221 is disposed between the first power chip 31 and the second power chip 32.

[0069] In some embodiments, the via 221 is collinear with the first power chip 31 and the second power chip 32, that is, the centers of the three are on a straight line.

[0070] In some embodiments, the via 221 is located on one side of the line connecting the first power chip 31 and the second power chip 32, that is, the via 221 is not collinear with the first power chip 31 and the second power chip 32.

[0071] Please refer to Figure 4 The heat sink 12 has a threaded hole 122 on the side near the power module 20, and the package 22 has a through hole 221. The bottom of the bolt 14 has an external thread, and the bolt 14 can pass through the through hole 221 and mate with the threaded hole 122 on the heat sink 12. Tightening the bolt 14 with the threaded hole 122 on the heat sink 12 connects the heat sink 12 to the power module 20, allowing the heat sink 12 to cool the power module 20.

[0072] In other embodiments, the heat sink 12 may also have a blind hole on the side near the power module 20, and a locating pin may be used to connect the heat sink 12 and the power module 20.

[0073] In the above embodiment, a gasket 15 is provided between the bolt 14 and the power module 20. The gasket 15 can further improve the insulation performance between the circuit board 11 and the power module 20.

[0074] The package 22 has a through-hole 221, which allows the power module 20 to connect to the circuit board 11 and the heat sink 12. The through-hole 221 is located between the first power chip 31 and the second power chip 32, ensuring a more uniform stress distribution on the first and second power chips 31 from the circuit board 11, and guaranteeing a tight connection between the first and second power chips 31 and the circuit board 11. (Continue referring to...) Figure 3 In some embodiments, the first power chip 31 and the second power chip 32 are separated from the through hole 221 by a preset distance L, and the distance D between the connection line 23 and the center line of the through hole 221 is greater than or equal to the preset distance L.

[0075] The first power chip 31 and the second power chip 32 are separated from the through hole 221 by a preset distance L, which allows the bolt 14 to maintain sufficient electrical clearance and creepage distance with respect to the first power chip 31 and the second power chip 32, preventing the first power chip 31 and the second power chip 32 from short-circuiting or being broken down.

[0076] The distance D between the center line of the connecting line 23 and the center line of the through hole 221 is greater than or equal to the preset distance L, which can ensure that the connecting line 23 and the bolt 14 maintain sufficient electrical clearance and creepage distance, and prevent the connecting line 23 from short-circuiting and burning out the first power chip 31 and the second power chip 32.

[0077] In the above embodiments, the preset distance L is greater than or equal to 5mm. For example, the preset distance L can be 5mm, 6mm, or 10mm.

[0078] Continue to refer to Figure 2 and Figure 4 In some embodiments, the package 22 is provided with a limiting flange 24, which is arranged around the through hole 221 and is used to be embedded in the limiting hole 111 on the circuit board 11.

[0079] The limiting flange 24 is wrapped around the through hole 221. The limiting flange 24 can be embedded in the limiting hole 111 on the circuit board 11 to realize the positioning between the power module 20 and the circuit board 11, which facilitates the subsequent connection of the pin 21 of the power module 20 to the circuit board 11.

[0080] Meanwhile, the limiting flange 24 can increase the distance between the circuit board 11 and the bolt 14, so that the bolt 14 and the live components on the circuit board 11 maintain sufficient electrical clearance and creepage distance, prevent high voltage breakdown or leakage, and avoid the bolt 14 from contacting the conductive layer on the circuit board 11, causing short circuit or arc discharge.

[0081] Continue to refer to Figure 2 In the above embodiment, the limiting flange 24 is provided with an abutment portion 241, which is used to abut against the circuit board 11. Figure 1 (As shown) on the surface facing the package 22.

[0082] The limiting flange 24 is provided with an abutting part 241, which abuts against the surface of the circuit board 11 facing the package 22. The abutting part 241 can support the circuit board 11, determine the distance between the circuit board 11 and the power module 20, ensure that the circuit board 11 and the package 22 are parallel, and improve the stability of the connection between the circuit board 11 and the power module 20.

[0083] Continue to refer to Figure 2In some embodiments, the power module 20 further includes a support 26 disposed on the package 22 facing the circuit board 11. Figure 1 On the surface shown, the support member 26 is used to abut against the circuit board 11.

[0084] Support member 26 is disposed on package 22 facing circuit board 11. Figure 1 The support 26 is placed on the surface of the circuit board 11 and abuts against it, which can increase the contact area between the power module 20 and the circuit board 11 and prevent only the pins from being connected to the circuit board 11. The support 26 can distribute the stress from the circuit board 11 on the pins, avoid the pins from bending under force, and ensure the normal use of the power module 20.

[0085] Continue to refer to Figure 2 and Figure 3 In some embodiments, the power module 20 further includes a first pin 51 and a second pin 52, which are disposed at one end of the package 22 along the thickness direction z perpendicular to the package 22. The first pin 51 is electrically connected to the first power chip 31, and the second pin 52 is electrically connected to the second power chip 32.

[0086] The first pin 51 and the second pin 52 are disposed at one end of the package 22 along the thickness direction z perpendicular to the package 22. The first pin 51 is electrically connected to the first power chip 31, and the second pin 52 is electrically connected to the second power chip 32. This can shorten the distance between the first pin 51 and the second pin 52 and the circuit board 11. Figure 1 The connection distance between (as shown) reduces the trace distance on the circuit board 11, reduces the area of ​​the circuit board 11, and reduces the parasitic inductance on the circuit board 11.

[0087] Continue to refer to Figure 3 In the above embodiments, the first power chip 31 and the second power chip 32 are arranged at intervals. The arrangement of the first power chip 31 and the second power chip 32 at intervals can reduce electromagnetic interference between the first power chip 31 and the second power chip 32, and can also reduce thermal field overlap between the first power chip 31 and the second power chip 32, preventing local overheating.

[0088] In the above embodiments, ceramic sheet 13 ( Figure 1 (As shown) may include a first ceramic sheet and a second ceramic sheet, the first ceramic sheet being in contact with the first power chip 31 and the second ceramic sheet being in contact with the second power chip 32.

[0089] The first ceramic plate and the second ceramic plate can improve the electrical isolation between the first power chip 31 and the second power chip 32, and reduce the mutual interference between the first power chip 31 and the second power chip 32.

[0090] At the same time, the first ceramic plate is in contact with the first power chip 31, and the second ceramic plate is in contact with the second power chip 32, so that the first power chip 31 and the second power chip 32 have independent heat dissipation paths, which can avoid heat concentration and improve heat dissipation efficiency.

[0091] Continue to refer to Figure 3 In the above embodiment, the first pin 51 includes a first sub-pin 511 and a second sub-pin 512, and there is a voltage difference between the first sub-pin 511 and the second sub-pin 512. A first isolation groove 61 is provided on the package 22 between the first sub-pin 511 and the second sub-pin 512. The second pin 52 includes a third sub-pin 521 and a fourth sub-pin 522, and there is a voltage difference between the third sub-pin 521 and the fourth sub-pin 522. A second isolation groove 62 is provided on the package 22 between the third sub-pin 521 and the fourth sub-pin 522.

[0092] This application embodiment does not limit the voltage of the first sub-pin 511 and the second sub-pin 512. For example, the voltage of the first sub-pin 511 may be greater than the voltage of the second sub-pin 512, or the voltage of the first sub-pin 511 may be less than the voltage of the second sub-pin 512. This application embodiment also does not limit the voltage of the third sub-pin 521 and the fourth sub-pin 522. For example, the voltage of the third sub-pin 521 may be greater than the voltage of the fourth sub-pin 522, or the voltage of the third sub-pin 521 may be less than the voltage of the fourth sub-pin 522.

[0093] Because there is a voltage difference between the first sub-pin 511 and the second sub-pin 512, either the first sub-pin 511 or the second sub-pin 512 is under high voltage during operation, which can easily generate arcing or corona discharge, increasing the risk of electrical faults. Providing a first isolation groove 61 between the first sub-pin 511 and the second sub-pin 512 can increase the creepage distance and clearance between them, preventing arcing or leakage current from occurring between the first sub-pin 511 and the second sub-pin 512.

[0094] In addition, when the first sub-pin 511 or the second sub-pin 512 carries a large current, it will generate high heat. The first isolation groove 61 can increase the distance between the first sub-pin 511 and the second sub-pin 512, reduce the conduction of heat to adjacent pins (second sub-pin 512 or first sub-pin 511), and avoid local temperature rise from affecting the reliability of the power module 20.

[0095] Similarly, due to the voltage difference between the third sub-pin 521 and the fourth sub-pin 522, either the third sub-pin 521 or the fourth sub-pin 522 is under high voltage during operation, which can easily generate arcing or corona discharge, increasing the risk of electrical faults. Providing a second isolation groove 62 between the third sub-pin 521 and the fourth sub-pin 522 can increase the creepage distance and clearance between them, preventing arcing or leakage current from occurring between them.

[0096] In addition, the third sub-pin 521 or the fourth sub-pin 522 will generate high heat when carrying a large current. The second isolation groove 62 can increase the distance between the third sub-pin 521 and the fourth sub-pin 522, reduce the conduction of heat to adjacent pins (the fourth sub-pin 522 or the third sub-pin 521), and avoid local temperature rise from affecting the reliability of the power module 20.

[0097] Continue to refer to Figure 3 In the above embodiment, the first sub-pin 511 is a power pin, and the second sub-pin 512 is a signal pin. The first sub-pin 511 is located away from the edge of the package 22, and the second sub-pin 512 is located close to the edge of the package 22. The third sub-pin 521 is a power pin, and the fourth sub-pin 522 is a signal pin. The third sub-pin 521 is located away from the edge of the package 22, and the fourth sub-pin 522 is located close to the edge of the package 22.

[0098] Since the first sub-pin 511 and the third sub-pin 521 are power pins, the voltages of the first sub-pin 511 and the third sub-pin 521 are relatively high, while the voltages of the second sub-pin 512 and the fourth sub-pin 522 are relatively low. The first sub-pin 511 and the third sub-pin 521 are located away from the edge of the package 22, while the second sub-pin 512 and the fourth sub-pin 522 are located close to the edge of the package 22. In other words, the first sub-pin 511 and the third sub-pin 521 are located in the middle of the package 22, while the second sub-pin 512 and the fourth sub-pin 522 are located on both sides.

[0099] The first sub-pin 511 and the third sub-pin 521 are located in the middle position, which can reduce the trace distance between the first sub-pin 511 and the third sub-pin 521, making it easier to achieve miniaturization of the package 22.

[0100] Continue to refer to Figure 3 In the above embodiment, the distance L1 between the first sub-pin 511 and the third sub-pin 521 is greater than the distance L2 between the first sub-pin 511 and the second sub-pin 512. The distance L1 between the first sub-pin 511 and the third sub-pin 521 is greater than the distance L3 between the third sub-pin 521 and the fourth sub-pin 522.

[0101] Here, the distance L2 between the first sub-pin 511 and the second sub-pin 512 is the width of the first isolation groove 61. The distance L3 between the third sub-pin 521 and the fourth sub-pin 522 is the width of the second isolation groove 62.

[0102] The embodiments of this application do not limit the size of L1, L2, and L3. Optionally, L1 can be 3mm, L2 can be 1mm, and L3 can be 0.8mm.

[0103] Since both the first sub-pin 511 and the third sub-pin 521 are power pins, the voltage on the first sub-pin 511 and the third sub-pin 521 is relatively large, and arcing is more likely to occur between them. Therefore, it is necessary to further increase the distance between them to increase the creepage distance between the first sub-pin 511 and the third sub-pin 521, so as to avoid arcing between the first sub-pin 511 and the third sub-pin 521 and reduce the risk of electrical faults.

[0104] Similarly, the distance L1 between the first sub-pin 511 and the third sub-pin 521 is greater than the distance L3 between the third sub-pin 521 and the fourth sub-pin 522, further increasing the creepage distance between the first sub-pin 511 and the third sub-pin 521. This prevents arcing between the first sub-pin 511 and the third sub-pin 521, reducing the risk of electrical faults. Please refer to... Figure 5 In some embodiments, a groove 25 is provided on a first surface 222 of the package 22 that is perpendicular to the thickness direction z of the package 22, and the projections of the first power chip 31 and the second power chip 32 on the first surface 222 are located in the groove 25.

[0105] A groove 25 is provided on a first surface 222 perpendicular to the thickness direction z of the package 22. The projections of the first power chip 31 and the second power chip 32 on the first surface 222 are located within the groove 25. The groove 25 exposes the first power chip 31 and the second power chip 32, allowing them to contact the heat sink 12. Figure 4 As shown, the heat from the first power chip 31 and the second power chip 32 can be directly transferred to the heat sink 12 through direct contact, thereby improving the heat dissipation effect of the first power chip 31 and the second power chip 32.

[0106] Continue to refer to Figure 5 In the above embodiment, the groove 25 includes a first groove 251 and a second groove 252, which are spaced apart. The projection of the first power chip 31 on the first surface 222 is located in the first groove 251, and the projection of the second power chip 32 on the first surface 222 is located in the second groove 252.

[0107] The first groove 251 and the second groove 252 are spaced apart, and the projection of the first power chip 31 on the first surface 222 is located in the first groove 251, and the projection of the second power chip 32 on the first surface 222 is located in the second groove 252. That is to say, the first groove 251 corresponds to the position of the first power chip 31, and the second groove 252 corresponds to the position of the second power chip 32.

[0108] The first recess 251 and the second recess 252 ensure the exposure area of ​​the first power chip 31 and the second power chip 32. At the same time, they prevent the recess 25 from exposing other circuits inside the package 22 to the outside, thus reducing the reliability of the power module 20.

[0109] Please refer to Figure 5 and Figure 6 In the above embodiments, the power chip (first power chip 31 or second power chip 32) further includes a housing 41, and a protrusion 42 is provided on the side of the housing 41 near the groove 25, the protrusion 42 being disposed within the groove 25. The power module 20 and the heat sink 12 ( Figure 4 The connection between the two modules (as shown) is achieved through protrusion 42, which can improve the heat dissipation rate of the power module 20 and ensure the heat dissipation effect of the power module 20.

[0110] The housing 41 can absorb the heat from the power chip (first power chip 31 or second power chip 32) and transfer it to the heat sink 12. The housing 41 can increase the heat dissipation area of ​​the power chip and improve the heat dissipation rate of the power chip. Optionally, the housing 41 can be made of copper.

[0111] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the embodiments of this application, and are not intended to limit them; although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the foregoing embodiments, or make equivalent substitutions for some or all of the technical features therein; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application.

Claims

1. A power module, characterized by include: Package; A first power chip and a second power chip, both of which are packaged within the package; A connection line is disposed within the package, and the first power chip and the second power chip are electrically connected through the connection line. The package body is provided with a through hole, the center line of the through hole is parallel to the thickness direction of the package body, the first power chip and the second power chip are arranged at intervals along the direction perpendicular to the thickness direction of the package body, and the through hole is disposed between the first power chip and the second power chip.

2. The power module of claim 1, wherein, The first power chip and the second power chip are at a preset distance from the via, and the distance between the connection line and the center of the via is greater than or equal to the preset distance.

3. The power module of claim 2, wherein, The preset distance is greater than or equal to 5mm.

4. The power module of any one of claims 1-3, wherein, The package body is provided with a limiting flange, which is wrapped around the through hole and is used to be embedded in the limiting hole on the circuit board.

5. The power module of claim 4, wherein, The limiting flange is provided with an abutting part, which is used to abut against the surface of the circuit board facing the package.

6. The power module of any one of claims 1-3, wherein, A groove is provided on a first surface of the package that is perpendicular to the thickness direction of the package, and the projections of the first power chip and the second power chip on the first surface are located in the groove.

7. The power module of claim 6, wherein, The groove includes a first groove and a second groove, which are spaced apart. The projection of the first power chip on the first surface is located in the first groove, and the projection of the second power chip on the first surface is located in the second groove.

8. The power module of claim 6, wherein, The power chip also includes a housing, and a protrusion is provided on the side of the housing near the groove, the protrusion being disposed within the groove.

9. The power module of any one of claims 1-3, wherein, The power module further includes a first pin and a second pin, which are disposed at one end of the package along a direction perpendicular to the thickness of the package. The first pin is electrically connected to the first power chip, and the second pin is electrically connected to the second power chip.

10. The power module of claim 9, wherein, The first pin includes a first sub-pin and a second sub-pin, and there is a voltage difference between the first sub-pin and the second sub-pin. A first isolation groove is provided on the package between the first sub-pin and the second sub-pin. The second pin includes a third sub-pin and a fourth sub-pin, and there is a voltage difference between the third sub-pin and the fourth sub-pin. A second isolation groove is provided on the package between the third sub-pin and the fourth sub-pin.

11. The power module of claim 10, wherein, The first sub-pin is a power pin, and the second sub-pin is a signal pin. The first sub-pin is located away from the edge of the package, and the second sub-pin is located close to the edge of the package. The third sub-pin is a power pin, and the fourth sub-pin is a signal pin. The third sub-pin is located away from the edge of the package, and the fourth sub-pin is located close to the edge of the package.

12. The power module of claim 10 or 11, wherein, The distance between the first sub-pin and the third sub-pin is greater than the distance between the first sub-pin and the second sub-pin; The distance between the first sub-pin and the third sub-pin is greater than the distance between the third sub-pin and the fourth sub-pin.

13. The power module of any one of claims 1-3, wherein, The power module also includes a support member disposed on the surface of the package facing the circuit board, the support member being used to abut against the circuit board.

14. A power converter, characterized by include: The circuit board, the heat sink, and the power module according to any one of claims 1-13, wherein the power module is disposed between the circuit board and the heat sink along the thickness direction of the power module, and the power module is connected to the circuit board via pins.

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