Wafer carrying system

Abstract

The utility model discloses a wafer carrying system, including, workstation, be provided with transfer station, rough grinding station and fine grinding station on the workstation, bearing platform, set up in the workstation for carrying wafer and will wafer transfer between transfer station, rough grinding station and fine grinding station, cleaning unit, be provided with the workstation, with the interval setting of bearing platform, transfer unit, will the wafer after grinding be directly transferred from the bearing platform of transfer station to cleaning unit. Wafer carrying system disclosed in the utility model, after rough grinding and fine grinding to wafer, directly transfer to cleaning unit and clean, simplify the transfer process, in time through the corrosion damage layer, release residual stress, prevent the wafer after thinning from breaking due to damage stress, and optimize wafer surface topography.

Description

Technical Field

[0001] This utility model relates to the field of wafer processing technology, and more specifically, to a wafer transport system. Background Technology

[0002] In the semiconductor manufacturing field, wafer thinning is a key process in the manufacturing of advanced packaging (such as 3D ICs and Chiplet) and specific devices (such as power semiconductors and image sensors). As chip functions become increasingly complex, integration levels continue to rise, and there is an extreme pursuit of miniaturization, thinning, and heat dissipation performance, wafer thinning processes are developing towards thinner (<100μm or even <50μm), higher precision, higher surface quality (nanoscale roughness), and lower damage.

[0003] Patent document CN120244747A discloses a wafer thinning and polishing device, including: a grinding disc, which is set to move up and down;

[0004] A circular chuck is positioned directly below the grinding disc, with a radially extending groove running through its circumference at the top. A lifting plate is movable up and down and is spaced at the end of the groove facing outwards. A first U-shaped plate is positioned at the top of the lifting plate. A temporary storage frame includes a first vertical frame and a pair of arc-shaped baffles matching the shape of the wafer's circumference. Multiple pairs of support bars are arranged vertically within the first vertical frame, which is located within the first U-shaped plate. A first pushing mechanism is located on the side of the first U-shaped plate away from the circular chuck, and the telescopic end of the first pushing mechanism is connected to one end of the strip chuck via a pusher block. The strip chuck faces the groove.

[0005] In the above-mentioned technology, the wafers that have been thinned by grinding need to be transferred to cleaning equipment for cleaning to remove the damaged layer generated during the grinding process and release residual stress. However, when transferring the wafers between the two equipment, there are too many transfer processes, and residual stress may cause edge cracking or overall breakage.

[0006] Therefore, it is necessary to propose a wafer transport system to address the problems existing in the prior art. Utility Model Content

[0007] The summary of this utility model introduces a series of simplified concepts, which will be further explained in detail in the detailed description section. This summary is not intended to limit the key features and essential technical features of the claimed technical solution, nor is it intended to determine the scope of protection of the claimed technical solution.

[0008] To address the aforementioned problems, this utility model provides a wafer transport system, comprising:

[0009] The workbench is equipped with a transfer station, a rough grinding station, and a fine grinding station.

[0010] The support stage, set on the worktable, is used to support the wafer and transfer the wafer between the intermediate station, the rough grinding station and the fine grinding station;

[0011] The cleaning unit is set on the workbench, spaced apart from the support platform;

[0012] The transfer unit directly transfers the ground wafers from the carrier platform of the transfer station to the cleaning unit.

[0013] Preferably, the support platform is fixedly mounted on the turntable, the turntable is rotatably mounted on the worktable, and multiple support platforms are arranged in a circular array with the axis of rotation of the turntable as the axis of rotation;

[0014] The transfer station, rough grinding station, and fine grinding station are set on the trajectory of the moving support platform, and the included angle between adjacent support platforms is the same as the included angle between the rough grinding station and the fine grinding station.

[0015] Preferably, it also includes a loading unit, which includes a loading platform, a first robotic arm, a first alignment mechanism, and a second robotic arm. The first robotic arm transfers the wafer from the loading platform to the first alignment mechanism, and the second robotic arm transfers the wafer from the first alignment mechanism to a carrier platform located at the transfer station.

[0016] Preferably, the cleaning unit includes a first cleaning module and a second cleaning module, which are spaced apart within the cleaning chamber, which is located on the worktable.

[0017] Preferably, the transfer unit includes a third robotic arm, a second alignment mechanism, and a flipping robotic arm. The third robotic arm transfers the thinned wafer from the carrier platform located at the transfer station to the second alignment mechanism, and the flipping robotic arm transfers the wafer between the second alignment mechanism, the first cleaning module, and the second cleaning module.

[0018] Preferably, the flipping robot includes a rotary drive component, a first robotic arm is fixedly mounted on the power output end of the rotary drive component, a second robotic arm is rotatably connected to the upper part of the end of the first robotic arm away from the rotary drive component, a motor is fixedly mounted on the upper part of the other end of the second robotic arm, a flipping motor is fixedly mounted on the power output end of the motor, and the power output shaft of the flipping motor drives the chuck to flip.

[0019] Preferably, the chuck is annular, with an opening on the side of the chuck away from the flipping motor.

[0020] Preferably, the first cleaning module includes a first cleaning support platform, and the second cleaning module includes a second cleaning support platform, wherein the diameter of the second cleaning support platform is smaller than the width of the opening.

[0021] Preferably, the rotary drive is mounted on the worktable, and a lifting drive is mounted between the rotary drive and the worktable, with the lifting drive fixedly mounted on the worktable.

[0022] Preferably, it also includes a discharge table, where the first robotic arm transfers the ground and cleaned wafers from the second alignment mechanism to the discharge table.

[0023] Compared with the prior art, the present invention has at least the following beneficial effects:

[0024] The wafer transport system described in this invention directly transfers the wafer to the cleaning unit for cleaning after rough grinding and fine grinding, simplifying the transfer process, timely passing through the etched damage layer, releasing residual stress, preventing the thinned wafer from cracking due to damage stress, and optimizing the wafer surface morphology.

[0025] The wafer transport system described in this invention, along with other advantages, objectives, and features of this invention, will be partly apparent from the following description and partly understood by those skilled in the art through study and practice of this invention. Attached Figure Description

[0026] The accompanying drawings are provided to further illustrate the present invention and form part of the specification. They are used together with the embodiments of the present invention to explain the present invention, but do not constitute a limitation thereof. In the drawings:

[0027] Figure 1 This is a schematic diagram of the wafer transport system disclosed in this utility model;

[0028] Figure 2 This is a schematic diagram of the structure of the turntable disclosed in this utility model;

[0029] Figure 3 This is a schematic diagram of the structure of the flipping manipulator disclosed in this utility model;

[0030] Figure 4 This is a schematic diagram of the chuck structure disclosed in this utility model. Detailed Implementation

[0031] The present invention will now be described in further detail with reference to the accompanying drawings and embodiments, so that those skilled in the art can implement it based on the description.

[0032] It should be understood that terms such as “having,” “comprising,” and “including” as used herein do not exclude the presence or addition of one or more other elements or combinations thereof.

[0033] like Figures 1-4 As shown, this utility model provides a wafer transport system, including:

[0034] Workbench 1, with intermediate station 2, rough grinding station 3 and fine grinding station 4 set on workbench 1;

[0035] The support stage 5 is set on the worktable 1 and is used to support the wafer and transfer the wafer between the transfer station 2, the rough grinding station and the fine grinding station 4.

[0036] The cleaning unit 6 is set on the workbench 1, spaced apart from the support platform 5;

[0037] The transfer unit directly transfers the ground wafers from the carrier platform 5 of the transfer station 2 to the cleaning unit 6.

[0038] Furthermore, the support platform 5 is fixedly mounted on the turntable 7, and the turntable 7 is rotatably mounted on the worktable 1. Multiple support platforms 5 are arranged in a circular array with the axis of rotation of the turntable 7 as the axis of rotation.

[0039] Transfer station 2, rough grinding station 3 and fine grinding station 4 are set on the trajectory of the moving support platform 5, and the included angle between adjacent support platforms 5 is the same as the included angle between rough grinding station 3 and fine grinding station 4.

[0040] Furthermore, it also includes a loading unit, which includes a loading platform 8, a first robotic arm 9, a first alignment mechanism 10, and a second robotic arm 11. The first robotic arm 9 transfers the wafer from the loading platform 8 to the first alignment mechanism 10, and the second robotic arm 11 transfers the wafer from the first alignment mechanism 10 to the carrier platform 5 located at the transfer station 2.

[0041] Furthermore, the cleaning unit 6 includes a first cleaning module 12 and a second cleaning module 13, which are spaced apart within the cleaning chamber 14, which is located on the workbench 1.

[0042] Furthermore, the transfer unit includes a third robot arm 15, a second alignment mechanism 16, and a flipping robot arm 17. The third robot arm 15 transfers the thinned wafer from the carrier platform 5 located at the transfer station 2 to the second alignment mechanism 16, and the flipping robot arm 17 transfers the wafer between the second alignment mechanism 16, the first cleaning module 12, and the second cleaning module 13.

[0043] Furthermore, the flipping manipulator 17 includes a rotary drive 18, a first manipulator 19 is fixedly mounted on the power output end of the rotary drive 18, a second manipulator 20 is rotatably connected to the upper part of the end of the first manipulator 19 away from the rotary drive 18, a motor 21 is fixedly mounted on the upper part of the other end of the second manipulator 20, a flipping motor 22 is fixedly mounted on the power output end of the motor 21, and the power output shaft of the flipping motor 22 drives the chuck 23 to flip.

[0044] Furthermore, the chuck 23 is annular, and an opening 24 is provided on the side of the chuck 23 away from the flip motor 22.

[0045] Furthermore, the first cleaning module 12 includes a first cleaning support platform 25, and the second cleaning module 13 includes a second cleaning support platform 26, the diameter of which is smaller than the width of the opening 24.

[0046] Furthermore, a rotary drive 18 is disposed on the worktable 1, and a lifting drive is disposed between the rotary drive 18 and the worktable 1, with the lifting drive fixedly disposed on the worktable 1.

[0047] Furthermore, it also includes a discharge table 27, where the first robotic arm 9 transfers the ground and cleaned wafers from the second alignment mechanism 16 to the discharge table 27.

[0048] The working principle of the above technical solution:

[0049] The wafer transport system includes:

[0050] Workbench 1, with intermediate station 2, rough grinding station 3 and fine grinding station 4 set on workbench 1;

[0051] The support stage 5 is set on the worktable 1 and is used to support the wafer and transfer the wafer between the transfer station 2, the rough grinding station 3 and the fine grinding station 4.

[0052] The cleaning unit 6 is mounted on the workbench 1 and is spaced apart from the support platform 5.

[0053] The transfer unit directly transfers the ground wafers from the carrier platform 5 of the transfer station 2 to the cleaning unit 6.

[0054] The ground wafers are directly transferred to the cleaning unit 6, which simplifies the transfer process. The wafers are cleaned in time, and residual stress is released by eroding the damaged layer.

[0055] The support platform 5 is fixedly mounted on the turntable 7, and the turntable 7 is rotatably mounted on the worktable 1. Multiple support platforms 5 are arranged in a circular array with the axis of rotation of the turntable 7 as the axis of rotation.

[0056] Transfer station 2, rough grinding station 3 and fine grinding station 4 are set on the trajectory of the moving support platform 5, and the included angle between adjacent support platforms 5 is the same as the included angle between rough grinding station 3 and fine grinding station 4.

[0057] like Figure 2As shown, the intermediate station 2, rough grinding station 3, and fine grinding station 4 are arranged on the trajectory of the moving platform 5. Three platforms 5 are arranged in a circular array along the axis of rotation of the turntable 7. The included angle between adjacent platforms 5 is the same as the included angle between rough grinding station 3 and fine grinding station 4. First, the wafer is placed onto the platform located at the intermediate station 2 by the second robotic arm 11. Then, the turntable 7 rotates, rotating the platform 5 to the rough grinding station 3. A rough grinding unit is set above the rough grinding station 3, and a fine grinding unit is set above the fine grinding station 4. After the carrier platform 5 carrying the wafer moves to the rough grinding station 3, it stops. The rough grinding unit moves down onto the wafer to grind it. After the rough grinding is completed, the rough grinding unit rises, the turntable 7 rotates, and the carrier platform 5 carrying the rough-ground wafer rotates to the fine grinding station 4. The fine grinding unit performs fine grinding on the wafer. At the same time, the next carrier platform 5 carrying the wafer is located at the rough grinding station 3 and performs rough grinding on the wafer. The fine-ground wafer is transferred to the transfer station 2 and then sent to the cleaning unit 6 for cleaning. The wafer grinding is performed continuously in this way.

[0058] The coarse grinding unit and the fine grinding unit can be selected from the coarse grinding wheel and fine grinding wheel disclosed in patent document CN109848814A, which will not be described in detail here.

[0059] The cleaning unit 6 includes a first cleaning module 12 and a second cleaning module 13. The first cleaning module 12 and the second cleaning module 13 are spaced apart in the cleaning chamber 14, which is opened on the workbench 1. The first cleaning module 12 includes a first cleaning support platform 25, and the second cleaning module 13 includes a second cleaning support platform 26. The diameter of the second cleaning support platform 26 is smaller than the width of the opening 24.

[0060] The chuck 23 can be the robotic end effector disclosed in the patent document CN120356862A, which uses vacuum to adsorb the wafer. Using vacuum adsorption to pick up the wafer is existing technology and will not be described in detail here.

[0061] The diameter of the second cleaning stage 26 is smaller than the width of the opening 24. When cleaning the first side of the wafer, the flipping robot 17 picks up the wafer through the chuck 23 and places it onto the first cleaning stage 25 to remove the thinning residue on the back side, etch the damaged layer, release residual stress, and optimize the surface morphology. After cleaning the first side, the chuck 23 picks up the wafer again, the power output shaft of the flipping motor 22 rotates 180 degrees so that the second side of the wafer faces upward, and then the chuck 23 places the wafer onto the second cleaning stage 26. The chuck 23 then moves backward and withdraws from the second cleaning stage 26.

[0062] The support platform 5, the first cleaning support platform 25, and the second cleaning support platform 26 can all use vacuum adsorption to stabilize the wafer on the support platform and prevent the wafer from moving during processing.

[0063] The structure and cleaning methods of the first cleaning module 12 and the second cleaning module 13, excluding the cleaning support platform, are existing technologies and will not be described in detail here. For example, the wafer cleaning fluid disclosed in CN119314868A, and the cleaning devices disclosed in CN223092827U and CN222813558U.

[0064] Motor 21 can be selected from general models to suit the size and power of the robotic arm. The power output shaft of the flip motor 22 can rotate within a range of 180 degrees, driving the chuck 23 to rotate, so that the wafers adsorbed on the chuck 23 can be flipped. The flip motor is existing technology, such as the flip motor disclosed in CN211648941U.

[0065] The loading platform 8 and the unloading platform 27 can be equipped with crystal boats, and the wafers are placed inside the crystal boats.

[0066] A wafer alignment mechanism is used to align a wafer. Alignment mechanisms are existing technologies, such as a wafer alignment device disclosed in CN120033136B, a wafer alignment method and related apparatus disclosed in CN119170548B, and a wafer alignment mark, fabrication method, wafer alignment device and wafer alignment method disclosed in CN115172331B.

[0067] The beneficial effects of the above technical solution are as follows:

[0068] The wafer transport system described in this invention directly transfers the wafer to the cleaning unit for cleaning after rough grinding and fine grinding, simplifying the transfer process, timely passing through the etched damage layer, releasing residual stress, preventing the thinned wafer from cracking due to damage stress, and optimizing the wafer surface morphology.

[0069] In the description of this utility model, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this utility model and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model.

[0070] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection, an electrical connection, or a connection that allows communication between them; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0071] Although the embodiments of this utility model have been disclosed above, they are not limited to the applications listed in the specification and embodiments. They can be applied to various fields suitable for this utility model. For those skilled in the art, other modifications can be easily made. Therefore, without departing from the general concept defined by the claims and their equivalents, this utility model is not limited to the specific details and the illustrations shown and described herein.

Claims

1. A wafer transport system, characterized in that, include: Workbench (1), with a transfer station (2), a rough grinding station (3) and a fine grinding station (4) set on the workbench (1); The support platform (5) is set on the workbench (1) to support the wafer and transfer the wafer between the transfer station (2), the rough grinding station and the fine grinding station (4); The cleaning unit (6) is set on the workbench (1) and spaced apart from the support platform (5); The transfer unit directly transfers the ground wafer from the carrier platform (5) of the transfer station (2) to the cleaning unit (6). The cleaning unit (6) includes a first cleaning module (12) and a second cleaning module (13). The first cleaning module (12) and the second cleaning module (13) are spaced apart in the cleaning chamber (14), which is located on the workbench (1). The transfer unit includes a third robot (15), a second alignment mechanism (16), and a flipping robot (17). The third robot (15) transfers the thinned wafer from the carrier (5) located at the transfer station (2) to the second alignment mechanism (16). The flipping robot (17) transfers the wafer between the second alignment mechanism (16), the first cleaning module (12), and the second cleaning module (13).

2. The wafer transport system according to claim 1, characterized in that, The support platform (5) is fixedly set on the turntable (7), the turntable (7) is rotatably set on the worktable (1), and multiple support platforms (5) are arranged in a circular array with the axis of rotation of the turntable (7) as the axis of rotation; The intermediate station (2), the rough grinding station (3) and the fine grinding station (4) are set on the trajectory of the moving platform (5), and the included angle between adjacent platforms (5) is the same as the included angle between the rough grinding station (3) and the fine grinding station (4).

3. The wafer transport system according to claim 1, characterized in that, It also includes a loading unit, which includes a loading platform (8), a first robot (9), a first alignment mechanism (10), and a second robot (11). The first robot (9) transfers the wafer from the loading platform (8) to the first alignment mechanism (10), and the second robot (11) transfers the wafer from the first alignment mechanism (10) to the carrier platform located at the transfer station (2).

4. The wafer transport system according to claim 1, characterized in that, The flipping manipulator (17) includes a rotary drive (18), a first manipulator (19) is fixedly mounted on the power output end of the rotary drive (18), a second manipulator (20) is rotatably connected to the upper part of the end of the first manipulator (19) away from the rotary drive (18), a motor (21) is fixedly mounted on the upper part of the other end of the second manipulator (20), a flipping motor (22) is fixedly mounted on the power output end of the motor (21), and the power output shaft of the flipping motor (22) drives the chuck (23) to flip.

5. The wafer transport system according to claim 4, characterized in that, The chuck (23) is ring-shaped, and an opening (24) is opened on the side of the chuck (23) away from the flip motor (22).

6. The wafer transport system according to claim 5, characterized in that, The first cleaning module (12) includes a first cleaning support platform (25), and the second cleaning module (13) includes a second cleaning support platform (26), the diameter of which is smaller than the width of the opening (24).

7. The wafer transport system according to claim 4, characterized in that, A rotary drive (18) is set on the worktable (1), and a lifting drive is set between the rotary drive (18) and the worktable (1). The lifting drive is fixedly set on the worktable (1).

8. The wafer transport system according to claim 1, characterized in that, It also includes a discharge station (27), where a first robotic arm (9) transfers the ground and cleaned wafers from a second alignment mechanism (16) to the discharge station (27).

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