Image capture module

Abstract

The image capturing module includes a housing, a shockproof brake, a photosensitive circuit board and a conductive layer. The shockproof brake is accommodated in the housing. The photosensitive circuit board is accommodated in the housing and coupled to the shockproof brake. The photosensitive circuit board includes a substrate, a photosensitive element and a first electrode pattern. The photosensitive element and the first electrode pattern are respectively located on opposite surfaces of the substrate. The conductive layer is located on an inner surface of the housing and has a second electrode pattern. The first electrode pattern and the second electrode pattern face each other separately. The shockproof brake is driven to displace the photosensitive circuit board in response to an actuating signal of a control circuit. The control circuit outputs the actuating signal according to a capacitance measurement signal output by a capacitance measurement circuit coupled to the first electrode pattern and the second electrode pattern.

Description

Technical Field

[0001] This case concerns optical imaging, and more particularly an image capturing module. Background Technology

[0002] Images captured by the image acquisition module within an electronic device may become out of focus or fail to align with the target object due to external forces such as vibration or shaking (e.g., hand tremors). This issue can currently be addressed using Sensor Shift Optical Image Stabilization (Sensor Shift OIS) technology. Specifically, a gyroscope within the electronic device measures a small angle of rotation caused by external forces, generating a measurement signal. The processor within the device uses this measurement signal to determine the optical compensation position of the photosensitive element. A Hall effect sensor is incorporated within the image acquisition module, utilizing magnetic field effects to detect the real-time position of the photosensitive element. The processor determines whether the photosensitive element has reached the optical compensation position based on this real-time position. If the photosensitive element has not reached the optical compensation position, the processor sends a compensation signal to a actuator to move the photosensitive element to the optical compensation position, thereby correcting the image captured by the image acquisition module to avoid distortion.

[0003] However, the Hall effect sensor occupies a certain volume, reducing the space available to accommodate other components in the image capturing module. Furthermore, maintaining the same amount of space for other components could increase the overall size of the image capturing module. Additionally, the addition of components to the image capturing module also increases its manufacturing cost. Utility Model Content

[0004] In view of the above, this application provides an image capturing module. The image capturing module includes a housing, a vibration damping brake, a photosensitive circuit board, and a conductive layer. The vibration damping brake is housed in the housing, and the photosensitive circuit board is housed in the housing and coupled to the vibration damping brake. The photosensitive circuit board includes a substrate, a photosensitive element, and a first electrode pattern. The substrate includes a first surface and a second surface facing each other. The photosensitive element is located on the first surface, and the first electrode pattern is located on the second surface. The conductive layer is located on the inner surface of the housing and has a second electrode pattern. The first electrode pattern and the second electrode pattern are separately grounded facing each other. The vibration damping brake responds to an actuation signal from a control circuit, causing the photosensitive circuit board to move. The control circuit outputs an actuation signal based on a capacitance measurement signal output by a capacitance measurement circuit coupled to the first electrode pattern and the second electrode pattern.

[0005] In one embodiment of the image capturing module described above, at least one spacer is also included, located between the photosensitive circuit board and the conductive layer.

[0006] In one embodiment of the image capturing module described above, the conductive layer has at least one protrusion to serve as the at least one spacer, abutting against the second surface of the substrate of the photosensitive circuit board.

[0007] In one embodiment of the image capturing module described above, the second electrode pattern is a single, integral conductive region.

[0008] In one embodiment of the image capturing module described above, the first electrode pattern includes a plurality of conductive islands, each of which at least partially overlaps with the conductive region of the second electrode pattern.

[0009] In one embodiment of the above image capturing module, each conductive island has an overlapping region and a residual region in its vertical projection onto the conductive layer. The overlapping region is located within the conductive region, and the residual region is located outside the conductive region.

[0010] In one embodiment of the image capturing module described above, the plurality of conductive islands includes four first conductive islands, wherein the vertical projections of two of the first conductive islands onto the conductive layer are located on a first axis passing through the center of the conductive region, and the vertical projections of the other two first conductive islands onto the conductive layer are located on a second axis passing through the center of the conductive region, the first axis and the second axis being orthogonal to each other.

[0011] In one embodiment of the image capturing module described above, the plurality of first conductive islands have the same shape and size.

[0012] In one embodiment of the image capturing module described above, the plurality of conductive islands further includes two second conductive islands located on either side of one of the plurality of first conductive islands.

[0013] In one embodiment of the image capturing module described above, the plurality of second conductive islands have the same shape and size.

[0014] In one embodiment of the image capturing module described above, the conductive region is a fourfold rotational symmetry pattern, and the plurality of conductive islands include four first conductive islands, which are respectively set through four symmetric points of the fourfold rotational symmetry pattern.

[0015] In one embodiment of the image capturing module described above, the four-fold rotationally symmetric shape is a square, and the four symmetric points are the four corners of the square.

[0016] In one embodiment of the image capturing module described above, the four-fold rotationally symmetric graphic is a square, and the four symmetric points are located on the four sides of the square.

[0017] In one embodiment of the image capturing module described above, the plurality of conductive islands further includes two second conductive islands located at the asymmetric points of the quadruple rotationally symmetric pattern.

[0018] In summary, according to some embodiments, this invention detects the real-time position of the photosensitive circuit board (specifically, its photosensitive element) by utilizing the capacitance between the first electrode pattern and the second electrode pattern, and uses an anti-vibration brake to displace the photosensitive circuit board (specifically, its photosensitive element) to correct the imaging of the image capturing module, thereby preventing image distortion caused by external forces such as vibration or shaking (e.g., hand shaking). Thus, this invention achieves photosensitive displacement optical anti-vibration technology without requiring additional components within the image capturing module, thereby avoiding a reduction in the space available for accommodating other components in the image capturing module, an increase in the size of the image capturing module, and an increase in the manufacturing cost of the image capturing module. Attached Figure Description

[0019] Figure 1 This is a three-dimensional schematic diagram of an image capturing module according to some embodiments of this case.

[0020] Figure 2 This is a cross-sectional schematic diagram of an image capturing module according to some embodiments of this case.

[0021] Figure 3 This is an exploded view of the image capturing module in some embodiments of this case.

[0022] Figure 4 This is a partial block diagram of the image capturing module in some embodiments of this case.

[0023] Figure 5 This is a top view schematic diagram of a photosensitive circuit board according to some embodiments of this case.

[0024] Figure 6 This is a bottom view of a photosensitive circuit board according to some embodiments of this case.

[0025] Figure 7 This is a schematic diagram of a photosensitive circuit board, conductive layer, and spacer in some embodiments of this case.

[0026] Figure 8 This is a schematic diagram of the conductive layer in some embodiments of this case.

[0027] Figure 9 This is a bottom view of a photosensitive circuit board according to some embodiments of this case.

[0028] Figure 10 This is a bottom view of a photosensitive circuit board according to some embodiments of this case.

[0029] The attached diagram is described as follows:

[0030] 10: Image Capture Module

[0031] 20: Shell

[0032] 21: Cover

[0033] 211: Cover plate

[0034] 213: Framework

[0035] 215: Perforation

[0036] 23: Base Plate

[0037] SF1: Surface

[0038] 30: Vibration damping brake

[0039] 31: Actuator bracket

[0040] 40: Photosensitive circuit board

[0041] 41:Substrate

[0042] 411: First Surface

[0043] 413: Second Surface

[0044] 43: Photosensitive element

[0045] 45: First electrode pattern

[0046] 451A~451D: First Conductive Island

[0047] 452A~452B: Second conductive island

[0048] OA: Overlapping Area

[0049] RA: Remaining Area

[0050] A1: First Axis

[0051] A2: Second Axis

[0052] C: Center

[0053] 50: Conductive layer

[0054] 55: Second electrode pattern

[0055] CA: Conductive region

[0056] 60: Capacitance Measurement Circuit

[0057] 70: Control Circuit

[0058] 80: Spacer

[0059] 81:First convex part

[0060] 100: Lens

[0061] 101: Lens Actuator

[0062] 102: Flexible Circuit Board

[0063] 103: Filter

[0064] 104: Substrate support Detailed Implementation

[0065] Reference Figures 1 to 4 . Figure 1 This is a three-dimensional schematic diagram of the image capturing module 10 in some embodiments of this case. Figure 2 This is a cross-sectional schematic diagram of the image capturing module 10 in some embodiments of this case. Figure 3 This is an exploded view of the image capturing module 10 in some embodiments of this case. Figure 4 This is a partial block diagram of an image capturing module 10 according to some embodiments of this invention. The image capturing module 10 is adapted to be installed in an electronic device (not shown). The electronic device is, for example, but not limited to, a smartphone, tablet computer, laptop computer, stand-alone camera, or drone, or other device with image capturing function.

[0066] The image capturing module 10 includes a housing 20, a vibration damping brake 30, a photosensitive circuit board 40, and a conductive layer 50. The housing 20 is hollow and has an accommodating space. The vibration damping brake 30 and the photosensitive circuit board 40 are housed in the accommodating space of the housing 20. In some embodiments, the housing 20 includes a cover 21 and a base plate 23. The cover 21 includes a cover plate 211 and a frame 213. The frame 213 is located between the cover plate 211 and the base plate 23 and surrounds the cover plate 211 and the base plate 23.

[0067] A photosensitive circuit board 40 is coupled to a vibration damping brake 30. The vibration damping brake 30 is, for example, a shape memory alloy (SMA) actuator or a motor actuator. The motor actuator can be implemented by a stepper motor or a voice coil motor. In some embodiments, an actuator bracket 31 is provided between the photosensitive circuit board 40 and the vibration damping brake 30, which stands on the photosensitive circuit board 40. The vibration damping brake 30 is mounted on the actuator bracket 31. Thus, the vibration damping brake 30 is fixed to the photosensitive circuit board 40 via the actuator bracket 31 and is capable of displacing the photosensitive circuit board 40.

[0068] Reference Figure 5 and Figure 6 . Figure 5 This is a top view of the photosensitive circuit board 40 in some embodiments of this case. Figure 6 This is a bottom view schematic diagram of a photosensitive circuit board 40 according to some embodiments of this invention. The photosensitive circuit board 40 includes a substrate 41, a photosensitive element 43, and a first electrode pattern 45. The substrate 41 includes a first surface 411 and a second surface 413 facing each other. The photosensitive element 43 is located on the first surface 411. The first electrode pattern 45 is located on the second surface 413. In some embodiments, such as Figure 2 and Figure 3 As shown, the first surface 411 faces the cover 21 of the housing 20, and the second surface 413 faces the bottom plate 23 of the housing 20.

[0069] like Figures 1 to 4 As shown, the conductive layer 50 is located on the inner surface of the housing 20. Specifically, the conductive layer 50 is located on the surface SF1 of the bottom plate 23 of the housing 20 facing the cover plate 211. The conductive layer 50 has a second electrode pattern 55. The first electrode pattern 45 and the second electrode pattern 55 face each other separately. That is, the first electrode pattern 45 and the second electrode pattern 55 are adjacent to each other but do not contact each other.

[0070] like Figure 4 As shown, the capacitance measurement circuit 60 is coupled to the first electrode pattern 45 and the second electrode pattern 55. The capacitance measurement circuit 60 measures the capacitance change between the first electrode pattern 45 and the second electrode pattern 55 to generate and output a capacitance measurement signal. The capacitance measurement circuit 60 can be implemented by a circuit consisting of at least one of passive components (resistors, inductors, and capacitors) and active components (transistors). In some embodiments, the capacitance measurement circuit 60 is disposed in an electronic device. In other embodiments, the capacitance measurement circuit 60 is disposed in the image capturing module 10, for example, the capacitance measurement circuit 60 is housed in the receiving space of the housing 20 of the image capturing module 10.

[0071] like Figure 4As shown, the control circuit 70 is coupled to the anti-vibration brake 30 and the capacitance measurement circuit 60. The control circuit 70 is, for example, a processing circuit such as a microprocessor or a specific integrated circuit. In some embodiments, the control circuit 70 is disposed in an electronic device. In other embodiments, the control circuit 70 is disposed in the image capturing module 10, for example, the control circuit 70 is housed in the receiving space of the housing 20 of the image capturing module 10. The control circuit 70 outputs an actuation signal to the anti-vibration brake 30 according to the capacitance measurement signal to drive the anti-vibration brake 30 to move the photosensitive circuit board 40. Specifically, the anti-vibration brake 30 responds to the actuation signal of the control circuit 70 to move the photosensitive circuit board 40 (specifically its photosensitive element 43). During the displacement of the photosensitive circuit board 40, the capacitance between the first electrode pattern 45 and the second electrode pattern 55 changes. The control circuit 70 obtains the capacitance change from the capacitance measurement signal and obtains the displacement of the photosensitive circuit board 40 according to the capacitance change and Gauss's law. Thus, the control circuit 70 can detect positional changes of the photosensitive circuit board 40, that is, it can detect the real-time position of the photosensitive circuit board 40. Based on the detected real-time position of the photosensitive circuit board 40 and its optical compensation position (e.g., based on the vector difference between the real-time position and the optical compensation position), the control circuit 70 generates an actuation signal, thereby driving the anti-vibration brake 30 to move the photosensitive circuit board 40 precisely to the optical compensation position, thereby correcting the imaging of the image capturing module 10 to avoid distortion.

[0072] Thus, this invention can achieve sensor displacement optical anti-shake technology without setting additional position detection components (such as Hall effect components) in the image capturing module 10, thereby avoiding the reduction of space in the image capturing module 10 that can accommodate other components, the increase in the size of the image capturing module 10, and the increase in the manufacturing cost of the image capturing module 10.

[0073] Reference Figure 7 This is a schematic diagram of a photosensitive circuit board 40, a conductive layer 50, and a spacer 80 according to some embodiments of this invention. In some embodiments, the image capturing module 10 further includes at least one spacer 80. The spacer 80 is located between the photosensitive circuit board 40 and the conductive layer 50 to maintain the spacing between the first electrode pattern 45 of the photosensitive circuit board 40 and the second electrode pattern 55 of the conductive layer 50. This ensures that the first electrode pattern 45 and the second electrode pattern 55 do not contact each other and are spaced at a specific distance, thereby ensuring that the first electrode pattern 45 and the second electrode pattern 55 can form a capacitive effect to generate capacitance. In some embodiments, the spacer 80 does not contact at least one of the first electrode pattern 45 and the second electrode pattern 55.

[0074] Reference Figure 7 and Figure 8 . Figure 8This is a schematic diagram of the conductive layer 50 in some embodiments of this invention. In some embodiments, the conductive layer 50 has at least one protrusion (hereinafter referred to as the first protrusion 81). Figure 8 Four first protrusions 81 are illustrated, but this invention is not limited to this; the number of first protrusions 81 can be adjusted according to the user's needs. The first protrusions 81 act as spacers 80 and abut against the second surface 413 of the substrate 41 of the photosensitive circuit board 40 to maintain the spacing between the first electrode pattern 45 of the photosensitive circuit board 40 and the second electrode pattern 55 of the conductive layer 50, thereby ensuring that the first electrode pattern 45 and the second electrode pattern 55 can form a capacitive effect to generate capacitance. In some embodiments, the first protrusions 81 are distributed around the conductive layer 50, for example, the first protrusions 81 are distributed around a single surface of the conductive layer 50. In some embodiments, the first protrusions 81 and the second electrode pattern 55 are located on the same surface of the conductive layer 50. In other embodiments, the first protrusions 81 and the second electrode pattern 55 are located on two opposing surfaces of the conductive layer 50. The surface of the conductive layer 50 where the first protrusions 81 are located faces the photosensitive circuit board 40, and the surface of the conductive layer 50 where the second electrode pattern 55 is located faces the bottom plate 23 of the housing 20.

[0075] In some embodiments, the photosensitive circuit board 40 further includes at least one protrusion (hereinafter referred to as a second protrusion) (not shown). The second protrusion serves as a spacer 80 and abuts against the conductive layer 50 (specifically, against the surface of the conductive layer 50 facing the photosensitive circuit board 40) to maintain the spacing between the first electrode pattern 45 of the photosensitive circuit board 40 and the second electrode pattern 55 of the conductive layer 50, thereby ensuring that the first electrode pattern 45 and the second electrode pattern 55 can form a capacitive effect to generate capacitance. In some embodiments, the second protrusion is distributed around the substrate 41 of the photosensitive circuit board 40, for example, the second protrusion is distributed around a single surface of the substrate 41 of the photosensitive circuit board 40. In some embodiments, the second protrusion is located on the second surface 413 of the substrate 41 of the photosensitive circuit board 40.

[0076] In some embodiments, the second electrode pattern 55 is a single, integral conductive region CA. For example... Figure 8 As shown, in one example, the conductive layer 50 can be implemented by a single conductor (e.g., a single metal body), and since the entire conductor is a conductive region CA, the entire conductor can be regarded as the second electrode pattern 55. In another example, the conductive layer 50 can be implemented by a substrate 41, and the second electrode pattern 55 is a uniform conductive region CA on the surface of the substrate 41 of the conductive layer 50.

[0077] Reference Figure 9This is a bottom view schematic diagram of the photosensitive circuit board 40 according to some embodiments of this invention. The first electrode pattern 45 includes a plurality of conductive islands (e.g., first conductive islands 451A-451D and second conductive islands 452A-452B). Each conductive island at least partially overlaps with the conductive region CA of the second electrode pattern 55. The overlap between the conductive island and the conductive region CA of the second electrode pattern 55 creates a capacitance effect to generate capacitance.

[0078] like Figure 9 As shown, in some embodiments, each conductive island has an overlapping region OA and a residual region RA in its vertical projection onto the conductive layer 50. The overlapping region OA is located within the conductive region CA of the second electrode pattern 55, and the residual region RA is located outside the conductive region CA of the second electrode pattern 55. During the displacement of the photosensitive circuit board 40, the area of ​​the overlapping region OA changes. When the area of ​​the overlapping region OA changes, the capacitance between the first electrode pattern 45 and the second electrode pattern 55 also changes accordingly, resulting in a corresponding capacitance change. Thus, by using the capacitance change and Gauss's law, the displacement (i.e., position change) of the photosensitive circuit board 40 can be determined, in other words, the real-time position of the photosensitive circuit board 40 can be determined. In some embodiments, the areas of the overlapping region OA and the residual region RA are negatively correlated; specifically, the areas of the overlapping region OA and the residual region RA are complementary to each other. In some embodiments, the overlapping region OA and the residual region RA of each conductive island are connected to each other.

[0079] like Figure 9 As shown, in some embodiments, the plurality of conductive islands includes four first conductive islands 451A to 451D. The vertical projection of two first conductive islands (such as first conductive islands 451A and 451C) onto the conductive layer 50 lies on the first axis A1 passing through the center C of the conductive region CA of the second electrode pattern 55. The vertical projection of the other two first conductive islands (such as first conductive islands 451B and 451D) onto the conductive layer 50 lies on the second axis A2 passing through the center C of the conductive region CA of the second electrode pattern 55. The first axis A1 and the second axis A2 are orthogonal to each other. Thus, as shown in Table 1, by measuring the area change of the overlapping region OA of the plurality of first conductive islands 451A to 451D, the capacitance change corresponding to the translation (i.e., displacement on the X-axis and / or Y-axis) of the photosensitive circuit board 40 during the displacement process can be measured, and the amount of translation of the photosensitive circuit board 40 can be determined by the capacitance change and Gauss's law. In some embodiments, the plurality of first conductive islands 451A to 451D have the same shape and size, so that the corresponding capacitance change of the photosensitive circuit board 40 can be accurately measured by the area change of the overlapping area OA of the plurality of first conductive islands 451A to 451D.

[0080] like Figure 9As shown, in some embodiments, the plurality of conductive islands further include two second conductive islands 452A to 452B. The plurality of second conductive islands 452A to 452B are located on either side of one of the plurality of first conductive islands 451A to 451D. For example, second conductive island 452A is located to the left of first conductive island 451A, and second conductive island 452B is located to the right of first conductive island 451A. Thus, as shown in Table 1, by measuring the area change of the overlapping region OA of the plurality of second conductive islands 452A to 452B, the change in capacitance corresponding to the rotation of the photosensitive circuit board 40 during displacement (i.e., displacement along the Z-axis, where the Z-axis is the lens axis or the photosensitive element axis) can be measured, and the amount of rotation of the photosensitive circuit board 40 can be determined by the change in capacitance and Gauss's law. In some embodiments, the plurality of second conductive islands 452A to 452B have the same shape and size, so that the change in capacitance corresponding to the rotation of the photosensitive circuit board 40 can be accurately measured by the change in area of ​​the overlapping region OA of the plurality of second conductive islands 452A to 452B.

[0081] [Table 1]

[0082]

[0083]

[0084] Reference Figure 9 and Figure 10 . Figure 10 This is a bottom view of the photosensitive circuit board 40 in some embodiments of this invention. In some embodiments, the conductive region CA of the second electrode pattern 55 is a fourfold rotational symmetry pattern, such as a square, a windmill pattern composed of four sectors, a cross, a four-petal flower pattern, etc. The plurality of first conductive islands 451A to 451D of the first electrode pattern 45 are respectively set through four symmetry points of the fourfold rotational symmetry pattern. The plurality of symmetry points are points on the same symmetry track of the fourfold rotational symmetry pattern, which belong to the same group of rotational equivalence classes, also called cyclic symmetry points. In an exemplary example, such as Figure 9 As shown, the quadruple rotationally symmetric figure is a square, and the four symmetric points are located on the four sides of the square. In another example, as... Figure 10 As shown, the four-fold rotationally symmetric figure is a square, and the four symmetric points are the four corners of the square. In some embodiments, such as Figure 9 As shown, the plurality of second conductive islands 452A to 452B of the first electrode pattern 45 are located at asymmetric points of a quadruple rotationally symmetric figure. Asymmetric points do not belong to the same set of rotational equivalence classes, nor are they located on the same symmetry orbit.

[0085] In some embodiments, in addition to determining the translation amount of the photosensitive circuit board 40 by the area change of the overlapping region OA of the plurality of first conductive islands 451A to 451D, the rotation amount of the photosensitive circuit board 40 can also be determined by the area change of the overlapping region OA of the plurality of first conductive islands 451A to 451D. Specifically, as Figure 10 As shown in Table 2, by measuring the area change of the overlapping region OA of the plurality of first conductive islands 451A to 451D, the capacitance change corresponding to the translation and rotation of the photosensitive circuit board 40 during the displacement process can be measured, and the translation and rotation of the photosensitive circuit board 40 can be determined by the capacitance change and Gauss's law.

[0086] [Table 2]

[0087]

[0088]

[0089] Reference Figures 1 to 3 In some embodiments, the image capturing module 10 further includes multiple other components, such as a lens 100, a lens actuator 101, a flexible circuit board 102, a filter 103, and a substrate support 104. The cover plate 211 of the housing 20 has a through-hole 215. The lens 100 is located within the through-hole 215 to be embedded in the housing 20. The lens actuator 101 is coupled to the lens 100 to compensate the lens 100 to a corresponding optical compensation position. In some embodiments, the lens actuator 101 and the anti-vibration brake 30 can be integrated into a single actuator. The flexible circuit board 102 is coupled to the photosensitive circuit board 40 and external electronic devices (not shown) of the image capturing module 10 for signal transmission between the photosensitive circuit board 40 and the external electronic devices. The substrate support 104 stands on the photosensitive circuit board 40, and the filter 103 is mounted on the substrate support 104. Thus, the filter 103 is fixed to the photosensitive element 43 of the photosensitive circuit board 40 via the substrate support 104. Specifically, the filter 103 overlaps with and is aligned with the photosensitive element 43 and the lens 100. In some embodiments, the filter 103 and the photosensitive element 43 have approximately the same size.

[0090] In summary, according to some embodiments, this invention detects the real-time position of the photosensitive circuit board (specifically, its photosensitive element) by utilizing the capacitance between the first electrode pattern and the second electrode pattern, and uses an anti-vibration brake to displace the photosensitive circuit board (specifically, its photosensitive element) to correct the imaging of the image capturing module, thereby preventing image distortion caused by external forces such as vibration or shaking (e.g., hand shaking). Thus, this invention achieves photosensitive displacement optical anti-vibration technology without requiring additional components within the image capturing module, thereby avoiding a reduction in the space available for accommodating other components in the image capturing module, an increase in the size of the image capturing module, and an increase in the manufacturing cost of the image capturing module.

Claims

1. An image capturing module, characterized in that, Include: case; The vibration damping brake is housed within this housing; A photosensitive circuit board is housed in the housing, coupled to the vibration damping brake, and includes a substrate, a photosensitive element and a first electrode pattern. The substrate includes opposing first and second surfaces, the photosensitive element is located on the first surface and the first electrode pattern is located on the second surface. and A conductive layer is located on the inner surface of the housing and has a second electrode pattern, wherein the first electrode pattern and the second electrode pattern face each other separately; The vibration damping brake responds to the actuation signal of the control circuit, causing the photosensitive circuit board to move. The control circuit outputs the actuation signal based on the capacitance measurement signal output by the capacitance measurement circuit coupled to the first electrode pattern and the second electrode pattern.

2. The image capturing module as described in claim 1, characterized in that, It also includes at least one spacer between the photosensitive circuit board and the conductive layer.

3. The image capturing module as described in claim 2, characterized in that, The conductive layer has at least one protrusion to serve as the at least one spacer, abutting against the second surface of the substrate of the photosensitive circuit board.

4. The image capturing module as described in claim 1, characterized in that, The second electrode pattern is a single, integral conductive area.

5. The image capturing module as described in claim 4, characterized in that, The first electrode pattern includes multiple conductive islands, each of which at least partially overlaps with the conductive region of the second electrode pattern.

6. The image capturing module as described in claim 5, characterized in that, Each conductive island has an overlapping region and a remaining region in its vertical projection onto the conductive layer. The overlapping region is located within the conductive region, and the remaining region is located outside the conductive region.

7. The image capturing module as described in claim 5, characterized in that, The plurality of conductive islands includes four first conductive islands, wherein the vertical projections of two of the first conductive islands onto the conductive layer are located on a first axis passing through the center of the conductive region, and the vertical projections of the other two of the first conductive islands onto the conductive layer are located on a second axis passing through the center of the conductive region, the first axis and the second axis being orthogonal to each other.

8. The image capturing module as described in claim 7, characterized in that, Multiple of these first conductive islands have the same shape and size.

9. The image capturing module as described in claim 7, characterized in that, The plurality of conductive islands also includes two second conductive islands located on either side of one of the plurality of first conductive islands.

10. The image capturing module as described in claim 9, characterized in that, Multiple of these second conductive islands have the same shape and size.

11. The image capturing module as described in claim 5, characterized in that, The conductive region is a quadruple rotationally symmetric pattern, and the multiple conductive islands include four first conductive islands, which are respectively set through the four symmetric points of the quadruple rotationally symmetric pattern.

12. The image capturing module as described in claim 11, characterized in that, The four-fold rotationally symmetric figure is a square, and the four symmetric points are the four corners of the square.

13. The image capturing module as described in claim 11, characterized in that, The quadruple rotationally symmetric figure is a square, and the four symmetric points are located on the four sides of the square.

14. The image capturing module as described in claim 11, characterized in that, The multiple conductive islands also include two second conductive islands located at the asymmetric points of the quadruple rotationally symmetric figure.

Images