Ultrasonic transducer assemblies, single-element ultrasonic transducers, and ultrasonic testing equipment

Abstract

This disclosure provides an ultrasonic transducer assembly, a single-element ultrasonic transducer, and an ultrasonic testing device. The ultrasonic transducer assembly includes a first matching layer, a second matching layer, a piezoelectric material layer, and a conductive backing layer stacked sequentially from top to bottom. The first matching layer is made of a non-conductive material, and the second matching layer is made of a conductive material. The upper surface of the first matching layer is the ultrasonic signal emitting surface, and signal electrodes are disposed on the side of the second matching layer. This disclosure directly leads out the signal electrodes from the side of the second matching layer. Compared with the traditional method of leading electrodes from the front of the emitting surface, the side electrode method avoids occupying the emitting surface, effectively expands the sound wave emitting area, and improves the transducer performance. At the same time, since the side operating space is relatively large, it avoids the problem of low product yield caused by limited operating space, and the side electrode method makes the upper surface of the product flatter and the dimensions more accurate.

Description

Technical Field

[0001] This disclosure relates to the field of ultrasonic testing technology, and in particular to an ultrasonic transducer assembly, a single-element ultrasonic transducer, and an ultrasonic testing device. Background Technology

[0002] Traditional single-element transducers consist of a matching layer, piezoelectric material, conductive backing, and coaxial cable. After the conductive backing is bonded to the piezoelectric material, a matching layer or a coating is deposited on the emitting surface of the piezoelectric material as a matching layer to improve the acoustic impedance matching between the transducer and the external medium, reduce sound wave reflection, and improve energy transmission efficiency.

[0003] The signal electrodes of existing single-element transducers are typically brought out by drilling holes along the edge of the matching layer or coating on the piezoelectric material surface and then applying conductive material or solder. However, this traditional method of bringing out signal electrodes has problems such as occupying part of the emitting surface, affecting the transducer's size and performance, and being difficult to operate.

[0004] Therefore, there is an urgent need to improve the electrode lead-out method of the existing single-element transducer. Utility Model Content

[0005] The technical problem to be solved by this disclosure is to overcome the shortcomings of the existing single-element transducer signal electrode lead-out method, which occupies part of the emission surface, affects the size and performance of the transducer, and is difficult to operate. The disclosure provides an ultrasonic transducer assembly, a single-element ultrasonic transducer, and an ultrasonic testing device.

[0006] This disclosure solves the above-mentioned technical problems through the following technical solution:

[0007] In a first aspect, an ultrasonic transducer assembly is provided for use in a single-element ultrasonic transducer. The ultrasonic transducer assembly includes a first matching layer, a second matching layer, a piezoelectric material layer, and a conductive backing layer stacked sequentially from top to bottom.

[0008] The first matching layer is made of a non-conductive material, and the second matching layer is made of a conductive material;

[0009] The upper surface of the first matching layer is an ultrasonic signal emitting surface;

[0010] Signal electrodes are provided on the side of the second matching layer.

[0011] Optionally, a grounding electrode is provided on the side of the conductive backing layer.

[0012] Optionally, the acoustic impedance of the first matching layer is lower than that of the second matching layer;

[0013] The gradient acoustic impedance formed by the first matching layer and the second matching layer is matched with the acoustic impedance of the target tissue, which includes human and / or animal bodies.

[0014] Optionally, the first matching layer, the second matching layer, the piezoelectric material layer, and the conductive backing layer are bonded together in sequence.

[0015] Optionally, the signal electrode is in contact with the second matching layer via silver paste.

[0016] Optionally, the grounding electrode is in contact with the conductive backing layer via silver paste;

[0017] Alternatively, the grounding electrode may be in contact with the conductive backing layer via solder;

[0018] And / or, the signal electrode and the ground electrode are located on the same side facade.

[0019] Secondly, a single-element ultrasonic transducer is provided, the single-element ultrasonic transducer comprising the ultrasonic transducer assembly described above.

[0020] Optionally, the single-element ultrasonic transducer further includes a first wire and a second wire;

[0021] The first wire is connected to the signal electrode;

[0022] The second conductor is connected to the ground electrode.

[0023] Thirdly, an ultrasonic testing device is provided, the ultrasonic testing device including the single-element ultrasonic transducer described above.

[0024] Optionally, the ultrasound detection device is an intravascular ultrasound detection device;

[0025] Alternatively, the ultrasonic testing device may be an ultrasonic endoscopic testing device.

[0026] Based on common knowledge in the field, the above-mentioned preferred conditions can be combined arbitrarily to obtain various preferred embodiments of this disclosure.

[0027] The positive and progressive effects of this disclosure are as follows:

[0028] The ultrasonic transducer assembly, single-element ultrasonic transducer, and ultrasonic testing equipment disclosed herein feature a second matching layer in the ultrasonic transducer assembly made of a conductive material. The entire surface of this layer is conductive to the signal electrodes of the piezoelectric material. Therefore, signal electrodes can be directly led out from the side of the second matching layer. Compared to the traditional method of leading electrodes from the front of the emitting surface, this side-leading electrode method avoids occupying the emitting surface, effectively expanding the sound wave emitting area and improving the transducer's performance. Simultaneously, the relatively large side operating space simplifies the side-leading electrode operation, avoiding the problem of low product yield due to limited operating space. Furthermore, the side-leading electrode method results in a flatter product surface and more precise dimensions. Attached Figure Description

[0029] Figure 1 This is a schematic diagram of the front view structure of the ultrasonic transducer assembly provided in Embodiment 1 of this disclosure;

[0030] Figure 2 This is a schematic diagram of the front view structure of an ultrasonic transducer assembly in the prior art.

[0031] Figure 3 This is a top view of an ultrasonic transducer assembly in the prior art.

[0032] Figure 4 This is a top view of the ultrasonic transducer assembly provided in Embodiment 1 of this disclosure;

[0033] Figure 5 This is a schematic diagram of the structure of the single-element ultrasonic transducer provided in Embodiment 2 of this disclosure;

[0034] Figure 6 This is a schematic diagram of the ultrasonic testing device provided in Embodiment 3 of this disclosure. Detailed Implementation

[0035] The present disclosure is further illustrated below by way of embodiments, but the present disclosure is not limited to the scope of the embodiments described herein.

[0036] The prefixes such as "first" and "second" used in this disclosure are merely for distinguishing different descriptive objects and do not limit the position, order, priority, quantity, or content of the described objects. The use of ordinal numbers and other prefixes used to distinguish descriptive objects in this disclosure does not constitute a limitation on the described objects. The description of the described objects is given in the claims or the context of the embodiments, and should not be construed as an unnecessary limitation. Furthermore, in the description of this embodiment, unless otherwise stated, "multiple" means two or more.

[0037] Example 1

[0038] This embodiment provides an ultrasonic transducer assembly applied to a single-element ultrasonic transducer, such as... Figure 1 As shown, the ultrasonic transducer assembly includes a first matching layer 1, a second matching layer 2, a piezoelectric material layer 3, and a conductive backing layer 4, which are stacked sequentially from top to bottom.

[0039] The first matching layer 1 is made of a non-conductive material, and the second matching layer 2 is made of a conductive material;

[0040] The upper surface of the first matching layer 1 is the ultrasonic signal emitting surface 11;

[0041] Signal electrodes 5 are provided on the side of the second matching layer 2.

[0042] The first matching layer is made of a non-conductive material, i.e., a non-conductive acoustic matching layer. The second matching layer is made of a conductive material, i.e., a conductive acoustic matching layer. The piezoelectric material layer can also be called a piezoelectric sheet or piezoelectric body.

[0043] In this embodiment of the ultrasonic transducer assembly, the second matching layer is made of conductive material, and its entire surface is connected to the signal electrode of the piezoelectric material. Therefore, the signal electrode can be directly led out from the side of the second matching layer. Compared with the traditional method of leading the signal electrode from the front of the emitting surface, the side-leading signal electrode method avoids occupying the emitting surface, effectively expands the sound wave emitting area, and improves the performance of the transducer. At the same time, since the side operation space is relatively large, the operation process of leading the signal electrode from the side is relatively simple, avoiding the problem of low product yield caused by limited operation space. Moreover, the side-leading signal electrode method makes the upper surface of the product flatter and the dimensions more accurate.

[0044] In an alternative implementation, such as Figure 1 As shown, a grounding electrode 6 is provided on the side of the conductive backing layer 4.

[0045] Compared to the traditional method of grounding electrodes on the lower surface of the conductive backing layer, the ultrasonic transducer assembly of this embodiment has a side-mounted grounding electrode method, which makes the lower surface of the product flatter and the dimensions more precise.

[0046] The side-leading method disclosed herein abandons the traditional approach of leading signal electrodes out from the edge of the piezoelectric material surface, avoiding the occupation of the emitting surface of the piezoelectric ceramic (piezoelectric material layer) by conductive material, and effectively expanding the sound wave emission area. Tests show that compared with the traditional method, the ultrasonic energy emission efficiency is increased by more than 25%, the beam directivity deviation is reduced by 40%, and the sensitivity and imaging clarity of the ultrasonic transducer are significantly improved. At the same time, this side-leading method makes the top and bottom surfaces of the ultrasonic transducer assembly flatter and the dimensions more precise.

[0047] In one alternative implementation, the acoustic impedance of the first matching layer is lower than that of the second matching layer;

[0048] The gradient acoustic impedance formed by the first matching layer and the second matching layer is matched with the acoustic impedance of the target tissue, including human and / or animal bodies.

[0049] In existing single-element ultrasonic transducer processes, due to the size of piezoelectric materials, the uneven surface after electrode lead-out, and the difficulty in controlling the thickness of casting or coating materials, the material matching layer used for deposition or coating is generally a single layer, such as... Figure 2 As shown, the existing single-element ultrasonic transducer consists of a matching layer 10, a piezoelectric material layer 3, and a conductive backing layer 4 stacked sequentially from top to bottom. The process limits the selection of the matching layer 10, making it difficult to manufacture transducers with multiple matching layers. That is, in the existing single-element ultrasonic transducer, the ultrasonic transducer components are all single-layer matching layer 10. The upper surface of the matching layer 10 is the ultrasonic signal emitting surface 11, and the emitting surface 11 is provided with a signal electrode 5. The lower surface of the conductive backing layer 4 is provided with a grounding electrode 6, and the signal electrode 5 occupies the emitting surface 11.

[0050] In this disclosure, the first matching layer uses a low-density, low-impedance material, and the second matching layer uses a high-density, high-impedance material. This dual-matching layer, combining a high-density, high-impedance conductive material with a low-density, low-impedance material, enables a gradient acoustic impedance transition from piezoelectric ceramics (high acoustic impedance) to human and / or animal tissues (low acoustic impedance), effectively reducing sound wave reflection loss at the interface. Compared to a traditional single-layer matching layer, this increases ultrasonic energy transmission efficiency by more than 30%, expands the -20dB bandwidth to 120%, and significantly enhances the sensitivity and resolution of the ultrasonic transducer.

[0051] Among them, the acoustic impedance of high-density, high-impedance materials can be 8-12 MRayl (megalay, a unit of acoustic impedance), while the acoustic impedance of low-density, low-impedance materials can be 2-4 MRayl.

[0052] In an alternative embodiment, the first matching layer, the second matching layer, the piezoelectric material layer, and the conductive backing layer are bonded together in sequence.

[0053] In an alternative embodiment, the signal electrode is in contact with the second matching layer via silver paste.

[0054] Specifically, by applying silver paste, a signal electrode is led out from the side of the second matching layer, so that the signal electrode contacts the second matching layer through the silver paste. The signal electrode can also be called the positive electrode.

[0055] like Figure 3As shown, existing single-element ultrasonic transducers, after drilling holes 12 in the matching layer 10 or the emitting surface 11 of the coating, lead out signal electrodes by soldering them to the signal line of the coaxial cable 13. This method is prone to burning the matching layer 10, and when the transducer assembly is small in size, it is difficult to operate and has a low yield.

[0056] The silver paste application method disclosed herein is relatively simple to operate compared to traditional soldering methods, and improves product yield.

[0057] In an alternative embodiment, the grounding electrode is in contact with the conductive backing layer via silver paste.

[0058] Specifically, by applying silver paste, a grounding electrode is led out from the side of the conductive backing layer, so that the grounding electrode contacts the conductive backing layer through the silver paste. The grounding electrode can also be called the negative electrode.

[0059] The traditional method of soldering the grounding electrode to the lower surface can easily burn the conductive backing layer, and it is difficult to operate and has a low yield when the transducer assembly is small.

[0060] The silver paste application method disclosed herein is relatively simple to operate compared to traditional soldering methods, and improves product yield.

[0061] In an alternative embodiment, the ground electrode is in contact with the conductive backing layer via solder.

[0062] The grounding electrode can be soldered out from the side of the conductive backing layer. Since the side space is relatively large, the soldering operation is less difficult.

[0063] In an alternative embodiment, the signal electrode and the ground electrode are located on the same side facade.

[0064] If the signal electrode and the ground electrode are located on the same side elevation, then when viewed from the top view, the signal electrode and the ground electrode appear to be in the same position. Figure 4 As shown, the signal electrode and ground electrode are connected to the signal line and ground line of the coaxial cable 13, respectively. Figure 3 The method of drilling holes 13 in the emitting surface 11 of the matching layer and then soldering out the signal electrodes avoids occupying the emitting surface 11. The signal electrodes and the ground electrodes are located on the same side surface, which facilitates the subsequent connection of the electrodes by wires and prevents the wires from twisting, which would cause unstable signal transmission.

[0065] Example 2

[0066] This embodiment provides a single-element ultrasonic transducer, the ultrasonic transducer assembly in Embodiment 1.

[0067] In an alternative implementation, such as Figure 5 As shown, the single-element ultrasonic transducer also includes a first wire 7 and a second wire 8; the first wire 7 is connected to the signal electrode 5, and the second wire 8 is connected to the ground electrode 6.

[0068] Specifically, the first conductor 7 is the signal line of the coaxial cable 9, and the second conductor 8 is the grounding wire of the coaxial cable 9.

[0069] Specifically, the array-element ultrasonic transducer may also include other components, such as a housing, in which the ultrasonic transducer assembly is located.

[0070] The single-element ultrasonic transducer of this embodiment includes the ultrasonic transducer assembly in Embodiment 1. The ultrasonic transducer assembly adopts a double-matching layer design, which can effectively reduce the reflection loss of sound waves at the interface. Compared with the existing traditional single-layer matching layer, it can improve the ultrasonic energy transmission efficiency by more than 30% and expand the -20dB bandwidth to 120%, significantly enhancing the sensitivity and resolution of the transducer. The side electrode method improves the ultrasonic energy emission efficiency by more than 25% and reduces the beam directivity deviation by 40%, significantly improving the sensitivity and imaging clarity of the transducer. It is especially suitable for high-frequency interventional diagnostic scenarios with extremely high resolution requirements, such as intravascular ultrasound and endoscopic ultrasound.

[0071] Example 3

[0072] This embodiment provides an ultrasonic testing device, such as... Figure 6 As shown, the ultrasonic testing equipment includes the single-element ultrasonic transducer in Example 2.

[0073] Specifically, ultrasonic testing equipment may also include other components, such as imaging devices.

[0074] In one alternative embodiment, the ultrasound detection device is an intravascular ultrasound detection device.

[0075] Intravascular ultrasound (IVUS) is a medical device used for imaging within blood vessels, primarily for the examination of coronary arteries and other blood vessels and for guiding interventional treatment.

[0076] In one alternative embodiment, the ultrasound testing device is an endoscopic ultrasound testing device.

[0077] Endoscopic ultrasound (EUS) is a medical device that combines endoscopy and ultrasound imaging for high-resolution examination of the digestive system and adjacent organs such as the pancreas, bile ducts, and mediastinum.

[0078] The ultrasound testing device in this embodiment includes the single-element ultrasound transducer of Embodiment 2. The single-element ultrasound transducer adopts a double-matching layer design, which can effectively reduce the reflection loss of sound waves at the interface. Compared with the existing traditional single-layer matching layer, it can improve the ultrasound energy transmission efficiency by more than 30% and expand the -20dB bandwidth to 120%, significantly enhancing the sensitivity and resolution of the transducer. The side electrode method improves the ultrasound energy emission efficiency by more than 25% and reduces the beam directivity deviation by 40%, significantly improving the sensitivity and imaging clarity of the transducer. It is especially suitable for high-frequency interventional diagnostic scenarios with extremely high resolution requirements, such as intravascular ultrasound and endoscopic ultrasound.

[0079] While specific embodiments of this disclosure have been described above, those skilled in the art should understand that these are merely illustrative examples, and the scope of protection of this disclosure is defined by the appended claims. Those skilled in the art can make various changes or modifications to these embodiments without departing from the principles and essence of this disclosure, but all such changes and modifications fall within the scope of protection of this disclosure.

Claims

1. An ultrasonic transducer assembly, characterized in that, Applied to a single-element ultrasonic transducer, the ultrasonic transducer assembly includes a first matching layer, a second matching layer, a piezoelectric material layer and a conductive backing layer stacked from top to bottom; The first matching layer is made of a non-conductive material, and the second matching layer is made of a conductive material; The upper surface of the first matching layer is an ultrasonic signal emitting surface; Signal electrodes are provided on the side of the second matching layer.

2. The ultrasonic transducer assembly according to claim 1, characterized in that, A grounding electrode is provided on the side of the conductive backing layer.

3. The ultrasonic transducer assembly according to claim 1, characterized in that, The acoustic impedance of the first matching layer is lower than that of the second matching layer; The gradient acoustic impedance formed by the first matching layer and the second matching layer is matched with the acoustic impedance of the target tissue, which includes human and / or animal bodies.

4. The ultrasonic transducer assembly according to claim 1, characterized in that, The first matching layer, the second matching layer, the piezoelectric material layer, and the conductive backing layer are bonded together in sequence.

5. The ultrasonic transducer assembly according to claim 1, characterized in that, The signal electrode is in contact with the second matching layer through silver paste.

6. The ultrasonic transducer assembly according to claim 2, characterized in that, The grounding electrode is in contact with the conductive backing layer through silver paste; Alternatively, the grounding electrode may be in contact with the conductive backing layer via solder; And / or, the signal electrode and the ground electrode are located on the same side facade.

7. A single-element ultrasonic transducer, characterized in that, The single-element ultrasonic transducer includes the ultrasonic transducer assembly as described in any one of claims 1-5.

8. The single-element ultrasonic transducer according to claim 7, characterized in that, The single-element ultrasonic transducer also includes a first wire and a second wire. The first wire is connected to the signal electrode; The second conductor is connected to the ground electrode.

9. An ultrasonic testing device, characterized in that, The ultrasonic testing equipment includes a single-element ultrasonic transducer as described in any one of claims 6-8.

10. The ultrasonic testing device according to claim 9, characterized in that, The ultrasound detection device is an intravascular ultrasound detection device; Alternatively, the ultrasonic testing device may be an ultrasonic endoscopic testing device.

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