A precision chip mounter with a closed-loop dynamic pressure control system

Abstract

The utility model discloses a kind of precise chip mounter with closed-loop dynamic pressure control system, the chip mounter includes rack, rack top is provided with marble shock-absorbing pedestal, shock-absorbing pedestal is installed overhead vision system, the lower seat surface of shock-absorbing pedestal is equipped with XYZ three-axis drive mechanism;Core component is pickup dispensing combination mechanism, pressure control device, follow-up camera device and glue needle module are installed on the side plate of pickup dispensing combination mechanism along Z axis.The pressure control device contains rotary power part and closed-loop pressure control part, the latter realizes real-time detection and dynamic adjustment of pressure by magnetic shaft, closed-loop pressure sensor and gravity balance spring;Follow-up camera device identifies chip position to guide three-axis mechanism, glue needle module controls glue output;Rack is also provided with mounting platform with shock-absorbing support, table top contains material placement part and vacuum adsorption area.The utility model can accurately control mounting pressure, reduce chip pressure loss rate, improve mounting consistency and positioning accuracy.

Description

Technical Field

[0001] This utility model relates to a chip mounter, specifically a precision chip mounter with a closed-loop dynamic pressure control system. Background Technology

[0002] In the current electronics manufacturing and precision machining industry, pick-and-place machines are core production equipment, and their placement accuracy and pressure directly affect product quality and performance. However, existing pick-and-place machines generally suffer from the following shortcomings: 1. Pressure loss after placement: Traditional pick-and-place machines often use flexible nozzles or simple spring structures for pressure control, which cannot be precisely controlled. Excessive pressure during the dispensing and placement process can damage the chip.

[0003] 2. Insufficient placement consistency: Some pick-and-place machines only control the amount of adhesive dispensed, but not the pressure, resulting in inconsistent adhesive surface height after placement. This affects placement consistency when placing a large number of units.

[0004] In response to the problems existing in the above-mentioned technologies, there is an urgent need to develop an intelligent dispensing and placement machine with high-precision positioning, closed-loop dynamic pressure control, and high operating efficiency, so as to solve the technical bottlenecks currently faced by the placement machine industry. Summary of the Invention

[0005] The purpose of this invention is to overcome the defects of the prior art and provide a precision placement machine with a closed-loop dynamic pressure control system, which realizes real-time closed-loop control of placement pressure, high-precision positioning of components, and improves placement consistency and work efficiency.

[0006] To solve the above-mentioned technical problems, this utility model achieves the following solution: A precision placement machine with a closed-loop dynamic pressure control system, comprising a frame, the top of which is a shock-absorbing base. The precision placement machine further includes a top-view vision system mounted on the shock-absorbing base, an XYZ three-axis drive mechanism mounted on the lower surface of the shock-absorbing base, and a pick-and-place dispensing assembly mechanism, which includes: Vertically mounted on the side plate of the frame; A pressure control device mounted on the side plate along the Z-axis for controlling pressure; A follow-up camera device mounted on the side plate along the Z-axis, which guides the operation of the XYZ three-axis drive mechanism by identifying the position of each chip; A glue needle module is mounted on the side plate along the Z-axis for detachably installing the dispensing tube and controlling the amount of glue dispensed from the dispensing tube.

[0007] Furthermore, the shock-absorbing base is a marble base.

[0008] Furthermore, the pressure control device includes: Rotary power unit; A closed-loop pressure control unit is driven and connected to the rotary power unit. After being driven, the closed-loop pressure control unit performs a horizontal rotation. The lower end of the closed-loop pressure control unit is provided with a suction nozzle.

[0009] Furthermore, the power source for the rotating power unit is an electric motor.

[0010] Furthermore, the rotating power unit is also provided with a vacuum passage, which is connected to the suction nozzle.

[0011] Furthermore, the closed-loop pressure control unit includes: The shell portion is driven to rotate by the rotary power unit. A magnetic shaft has a shaft coil and a magnetic shaft, wherein the shaft coil is fixed inside the housing, and the magnetic shaft can be driven by the shaft coil to perform lifting and lowering movements; The nozzle fixing component has a nozzle connected to its lower end, the magnetic shaft connected to its middle part, a through hole at its upper eccentric position, and a hook hole on its side. A closed-loop pressure sensor has one end connected to the housing and the other end extending into the through hole via a shaft, with a first spring sleeved on the shaft. A gravity balance spring, one end of which is connected to a spring connector, and the other end is hooked into the hook hole, with the spring connector fixed to the shell.

[0012] Furthermore, the power source for all three axes of the XYZ three-axis drive mechanism is a linear motor.

[0013] Furthermore, the precision placement machine also includes a placement platform, which includes a table and a shock-absorbing bracket for supporting the table, the shock-absorbing bracket being fixed to the frame.

[0014] Furthermore, the mounting platform is provided with a material placement area and a vacuum adsorption area on its surface; The material placement section is used to fix the material placement fixture; The vacuum adsorption zone is used to fix the chip packaging box.

[0015] Compared with the prior art, the beneficial effects of this utility model are: 1. This invention enables precise control of mounting pressure, significantly reducing chip pressure loss: The pressure control device, through a combination of a closed-loop pressure sensor, a magnetic shaft, and a gravity balance spring, can detect pressure data in real time during the mounting process and dynamically adjust the pressure through the lifting and lowering motion of the magnetic shaft. Compared to traditional flexible nozzles or simple spring structures, this system can control mounting pressure errors within a smaller range, avoiding chip damage caused by excessive pressure.

[0016] 2. This utility model improves mounting consistency and ensures stability in large-scale production: the equipment simultaneously achieves precise management of both "adhesive dispensing volume control" and "dynamic pressure regulation": the adhesive needle module can stably control the adhesive dispensing volume, avoiding fluctuations; the closed-loop pressure system ensures consistent mounting pressure for each chip. The combination of these two systems effectively solves the problem of large differences in adhesive surface height in traditional equipment. In batch mounting operations, it ensures uniform mounting parameters for all products, providing a stable foundation for subsequent processes and meeting the requirements of large-scale precision manufacturing.

[0017] 3. This utility model features high-precision positioning guidance, further improving placement accuracy: The servo camera device can identify the chip position in real time and guide the XYZ three-axis drive mechanism. Combined with the linear motor-driven XYZ three-axis system, the positioning response speed is faster and the error is smaller. Simultaneously, the marble-material shock-absorbing base effectively absorbs vibrations during equipment operation, reducing the impact of external interference on positioning accuracy. The dual positioning cooperation between the top-view vision system and the servo camera makes the overall placement accuracy far exceed that of traditional equipment, meeting higher-standard component placement requirements.

[0018] 4. This utility model features highly integrated and user-friendly design, improving operational efficiency and compatibility: The pick-and-dispense assembly integrates pressure control, dispensing, and positioning guidance functions on the same side panel, reducing interference between mechanisms, shortening the pick-and-dispense-placement process time, and improving operational efficiency per unit time; the glue needle module adopts a detachable design, facilitating quick replacement of dispensing tubing and reducing equipment debugging and maintenance time. Furthermore, the material placement section and vacuum adsorption area of ​​the placement platform are designed for different specifications of material fixtures and chip packaging boxes, enhancing the equipment's compatibility with various product types.

[0019] 5. This utility model equipment boasts strong operational stability and extended service life: The mounting platform is supported by a shock-absorbing bracket, forming a "double shock absorption" structure with the marble shock-absorbing base, which minimizes the wear and tear on core components caused by equipment vibration during operation; the gravity balance spring in the pressure control device balances the weight of the suction cup fixing component, reducing the load on the magnetic shaft and closed-loop pressure sensor, and lowering the wear rate of components. The overall structural stability design not only ensures mounting accuracy but also extends the service life of the equipment's core components, reducing the company's equipment maintenance costs. Attached Figure Description

[0020] Figure 1 This is a complete machine drawing of the precision chip mounter of this utility model.

[0021] Figure 2 This is a structural diagram of the adhesive pickup and dispensing assembly mechanism of this utility model.

[0022] Figure 3This is a structural diagram of the pressure control device of this utility model.

[0023] Figure 4 This is a structural diagram of the closed-loop pressure control unit of this utility model.

[0024] Figure 5 This is a structural diagram of the mounting platform of this utility model.

[0025] The attached diagram is labeled as follows: Top-view vision system 1, shock-absorbing base 2, XYZ three-axis drive mechanism 3, pick-up and dispensing assembly mechanism 4, mounting platform 5, pressure control device 41, glue needle module 42, follow-up camera device 43, material placement part 51, vacuum adsorption area 52, shock-absorbing bracket 53, rotational power unit 411, closed-loop pressure control unit 412, magnetic shaft 4121, closed-loop pressure sensor 4122, gravity balance spring 4123, nozzle fixing part 4124. Detailed Implementation

[0026] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments, so that the advantages and features of the present utility model can be more easily understood by those skilled in the art, thereby making a clearer and more definite definition of the protection scope of the present utility model. Obviously, the embodiments described in this utility model are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of the present utility model.

[0027] Furthermore, the technical features involved in the different embodiments of this utility model described below can be combined with each other as long as they do not conflict with each other.

[0028] Example 1: The specific structure of this utility model is as follows: Please refer to the appendix. Figure 1-5 This utility model discloses a precision placement machine with a closed-loop dynamic pressure control system, comprising a frame, the top of which is a shock-absorbing base 2. The precision placement machine also includes a top-view vision system 1 mounted on the shock-absorbing base 2, an XYZ three-axis drive mechanism 3 mounted on the lower surface of the shock-absorbing base 2, and a pick-and-place dispensing assembly 4, which includes: Vertically mounted on the side plate of the frame; A pressure control device 41, mounted on the side plate along the Z-axis, is used to control pressure. A follow-up camera device 43 is mounted on the side plate along the Z-axis and guides the operation of the XYZ three-axis drive mechanism 3 by identifying the position of each chip; A glue needle module 42, which is mounted on the side plate along the Z-axis, is used for detachably installing a dispensing tube and controlling the amount of glue dispensed from the dispensing tube.

[0029] The shock-absorbing base 2 is a marble base.

[0030] The pressure control device 41 includes: Rotary power unit 411; A closed-loop pressure control unit 412 is driven and connected to the rotary power unit 411. After being driven, the closed-loop pressure control unit 412 performs a horizontal rotation action. The lower end of the closed-loop pressure control unit 412 is provided with a suction nozzle.

[0031] The power source for the rotating power unit 411 is an electric motor.

[0032] The rotating power unit 411 is also provided with a vacuum passage, which is connected to the suction nozzle.

[0033] The closed-loop pressure control unit 412 includes: The shell portion is driven to rotate by the rotary power unit 411; The magnetic shaft 4121 has a shaft coil and a magnetic shaft. The shaft coil is fixed inside the housing, and the magnetic shaft can be driven by the shaft coil to perform lifting and lowering movements. The suction nozzle fixing part 4124 has a suction nozzle connected to its lower end, the magnetic shaft is connected to the middle part of the suction nozzle fixing part 4124, a through hole is provided at the eccentric position of its upper end, and a hook hole is provided on its side. The closed-loop pressure sensor 4122 has one end connected to the housing and the other end extending into the through hole via a shaft, with a first spring sleeved on the shaft. The gravity balance spring 4123 has one end connected to a spring connector and the other end hooked into the hook hole, with the spring connector fixed to the shell.

[0034] The power source for all three axes of the XYZ three-axis drive mechanism 3 is a linear motor.

[0035] The precision placement machine also includes a placement platform 5, which includes a table and a shock-absorbing bracket 53 for supporting the table. The shock-absorbing bracket 53 is fixed to the frame.

[0036] The mounting platform is provided with a material placement area 51 and a vacuum adsorption area 52 on its surface. The material placement section 51 is used to fix the material placement fixture; The vacuum adsorption zone 52 is used to fix the chip packaging box. Example 2

[0037] The specific workflow and implementation details of this utility model are described below with reference to Figures 1-5: Equipment initialization: Fix the material to be mounted to the material placement section 51 of the mounting platform 5, and fix the chip packaging box to the vacuum adsorption area 52. The chip packaging box adopts a chip waffle box, the glue needle module 42 is equipped with glue dispensing tube, and the mounting pressure, glue dispensing volume and other parameters are set through the control system.

[0038] Positioning guidance: The top-view vision system 1 performs global positioning of the mounting area, and the follow-up camera device 43 identifies the position of each chip in the chip packaging box in real time and transmits the position signal to the control system. The control system drives the XYZ three-axis drive mechanism 3 to adjust the position of the pick-up and dispensing assembly mechanism 4.

[0039] Chip pickup: The vacuum circuit of the rotating power unit 411 is activated, and the suction cup at the lower end of the closed-loop pressure control unit 412 picks up the chip; at the same time, the gravity balance spring 4123 balances the gravity of the suction cup fixing part 4124 to ensure the stability of the adsorption process.

[0040] Dispensing and mounting: The XYZ three-axis drive mechanism 3 drives the chip-picking pressure control device 41 to the dispensing position, and the glue needle module 42 completes the dispensing according to the set glue amount; then, the mechanism moves to the mounting position, and the axis coil of the magnetic shaft 4121 drives the magnetic shaft to descend, bringing the suction cup and chip closer to the mounting surface; the closed-loop pressure sensor 4122 detects the mounting pressure in real time. If the pressure exceeds the set value, the control system drives the axis coil to adjust the height of the magnetic shaft to achieve closed-loop pressure control until accurate mounting is completed.

[0041] Cyclic operation: After a single placement is completed, the rotary power unit 411 drives the closed-loop pressure control unit 412 to rotate and reset. The follow-up camera device 43 identifies the position of the next chip and repeats the above pick-up, dispensing and placement process to achieve automated batch operation.

[0042] The above description is only a preferred embodiment of the present utility model and does not limit the patent scope of the present utility model. Any equivalent structural or procedural transformations made based on the contents of the present utility model specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of the present utility model.

Claims

1. A precision placement machine with a closed-loop dynamic pressure control system, comprising a frame, the top of which is a shock-absorbing base (2), the precision placement machine further comprising a top-view vision system (1) mounted on the shock-absorbing base (2), and an XYZ three-axis drive mechanism (3) mounted on the lower surface of the shock-absorbing base (2), characterized in that, The precision placement machine further includes a pick-and-dispense assembly (4), which includes: Vertically mounted on the side plate of the frame; A pressure control device (41) is mounted on the side plate in the Z-axis direction for controlling pressure. A follow-up camera device (43) is mounted on the side plate along the Z-axis and guides the operation of the XYZ three-axis drive mechanism (3) by identifying the position of each chip. Z-axis mounted on the side plate, for detachable installation of the dispensing tube and for controlling the amount of adhesive dispensed from the dispensing tube.

2. A precision placement machine with a closed-loop dynamic pressure control system according to claim 1, characterized in that, The shock-absorbing base (2) is a marble base.

3. A precision placement machine with a closed-loop dynamic pressure control system according to claim 1, characterized in that, The pressure control device (41) includes: Rotary power unit (411); A closed-loop pressure control unit (412) is driven and connected to the rotary power unit (411). After being driven, the closed-loop pressure control unit (412) performs a horizontal rotation action. The lower end of the closed-loop pressure control unit (412) is provided with a suction nozzle.

4. A precision placement machine with a closed-loop dynamic pressure control system according to claim 3, characterized in that, The power source for the rotating power unit (411) is an electric motor.

5. A precision placement machine with a closed-loop dynamic pressure control system according to claim 3, characterized in that, The rotary power unit (411) is also provided with a vacuum passage that is connected to the suction nozzle.

6. A precision placement machine with a closed-loop dynamic pressure control system according to claim 3, characterized in that, The closed-loop pressure control unit (412) includes: The shell is driven to rotate by the rotary power unit (411); The magnetic shaft (4121) has a shaft coil and a magnetic shaft. The shaft coil is fixed inside the housing, and the magnetic shaft can be driven by the shaft coil to perform lifting and lowering actions. The nozzle fixing member (4124) has a nozzle connected to its lower end, the magnetic shaft is connected to the middle part of the nozzle fixing member (4124), a through hole is provided at the eccentric position of its upper end, and a hook hole is provided on its side. A closed-loop pressure sensor (4122) has one end connected to the housing and the other end extending into the through hole via a shaft, with a first spring sleeved on the shaft. A gravity balance spring (4123) has one end connected to a spring connector and the other end hooked into the hook hole. The spring connector is fixed to the shell.

7. A precision placement machine with a closed-loop dynamic pressure control system according to claim 1, characterized in that, The power source for the three axes of the XYZ three-axis drive mechanism (3) is a linear motor.

8. A precision placement machine with a closed-loop dynamic pressure control system according to claim 1, characterized in that, The precision placement machine also includes a placement platform (5), which includes a table and a shock-absorbing bracket (53) for supporting the table. The shock-absorbing bracket (53) is fixed to the frame.

9. A precision placement machine with a closed-loop dynamic pressure control system according to claim 8, characterized in that, The mounting platform is provided with a material placement area (51) and a vacuum adsorption area (52) on its surface. The material placement section (51) is used to fix the material placement fixture; The vacuum adsorption zone (52) is used to fix the chip packaging box.

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