A valuable and / or security product with a protective element for a semiconductor chip

Abstract

A valuable and / or security product (100) comprising at least one unhoused semiconductor chip (200) embedded in the valuable and / or security product (100) and at least one protective element (300, 300') for the unhoused semiconductor chip (200) against electromagnetic radiation incident through at least one outer surface (101) of the valuable and / or security product (100), wherein the at least one protective element (300, 300') is designed for optical refraction and / or optical diffraction of the electromagnetic radiation, characterized in that the at least one protective element (300, 300') prevents the incidence of electromagnetic radiation on the unhoused semiconductor chip (200) at least in a wavelength range of 800 nm to 2000 nm.

Description

[0001] The present invention relates to a valuable and / or security product, for example a passport, identity card, driver's license, or other ID card or a means of payment, in particular a banknote. In the case of an identity card, its front side bears, for example, the photograph and the name of the holder. Such documents are typically produced in standardized formats, for example in ID 1, ID 2, or ID 3 format according to ISO 7810. The documents can generally consist of or contain an organic polymer or a ceramic material, paper, cardboard, or metal. Cards and card-shaped components of book-like documents can preferably be made of laminated polymer films.

[0002] According to the invention, a semiconductor chip is understood to mean, in particular, electronic components suitable for storing and processing data. For example, these are so-called RFID (Radio Frequency Identification Device) chips, which are suitable for contactless communication with a read / write device via an antenna. Furthermore, this also includes semiconductor chips that can be directly connected to an external read / write device via electrical contacts in order to carry out data transmission. For example, such chips can only contain a serial number and transmit this upon activation, or they can be encrypted chips that only exchange data after authentication.

[0003] An example of a valuable or security document is specified in DE 10 2010 019 121 A1. This document comprises an integrated circuit and an antenna connected to the integrated circuit. The integrated circuit is connected to the antenna via connection contacts. The integrated circuit is mounted on the antenna using flip-chip adhesive technology. To optimally protect the integrated circuit against external attacks, the document comprises a shield. The shield is formed by a Faraday cage or by a layer containing soft magnetic ferrites and covering the integrated circuit on both sides, or by a combination of these two shields. DE 10 2010 019 121 A1 further states that metallic structures have reflective properties in the visible light range. The chip can also be protected against light radiation by an additional metallic layer.This protection could be achieved, for example, through metallization.

[0004] DE 10 2004 0 31879 A1 describes a security element with an electronic circuit which is integrated into a flexible film body, wherein an optically variable element is formed on the surface of the film body which covers the electronic circuit at least in part.

[0005] WO 2007 / 057325 A1 describes a method for protecting electronic components that may be exposed to fault injection attacks. The method comprises forming a protective layer from a material that exhibits random characteristics for the transmission of electromagnetic radiation, and embedding the component at least partially in this protective layer. The embedding material of the protective layer exhibits random refractive index variations.

[0006] DE 10 2010 047 250 A1 relates to a security element for a security paper or the like, comprising a carrier having a reflective surface area divided into a plurality of reflective pixels, wherein the area of ​​each pixel is at least one order of magnitude smaller than the area of ​​the reflective surface area, wherein each pixel has at least one reflective facet formed in a surface of the carrier, wherein the at least one reflective facet reflects light incident on the surface area along a predetermined direction in a reflection direction predetermined by its orientation, wherein the orientations of the facets of different pixels have a substantially random variation across the reflective surface area.

[0007] DE 10 2009 056 934 A1 describes a security element for a security paper or the like with a carrier which has a surface area which is divided into a plurality of pixels, each of which comprises at least one optically effective facet, wherein the majority of the pixels each have a plurality of the optically effective facets with the same orientation per pixel and the facets are oriented such that the surface area is perceivable by an observer as a surface which projects forward and / or backwards relative to its actual spatial shape.

[0008] EP 1 748 382 A2 describes a retroreflective integrated circuit product comprising an integrated circuit module with a built-in integrated circuit, a retroreflective element and its carrier layer or layers.

[0009] DE 10 2007 016 777 A1 describes valuable or security documents, such as check cards or security ID cards with a display module, as well as processes for their production. These valuable or security documents are intended to offer improved protection against tampering.

[0010] DE 10 2010 019 121 A1 states that the Faraday cage shielding described therein is very effective for shielding low frequencies, particularly microwaves, radio waves, and electrical discharges. Furthermore, it is stated that the layers containing soft magnetic ferrites, which interact effectively with the magnetic field of the radiation, are also effective against irradiation of light in the visible spectral range, since the ferrites exhibit strong absorption in the visible spectral range. However, it has been found that the known measures for protecting a semiconductor chip in a valuable and / or security product against manipulation and / or reverse engineering are not sufficiently secure.

[0011] The present invention is therefore based on the object of finding more far-reaching protective measures that can also prevent attacks on the chip using other means. In particular, it has been found that the use of unpackaged chips poses the risk of being able to spy on their architecture and redesign it and / or deactivate parts contained therein that serve to encrypt data, allowing protected data stored therein to be read, or of being able to modify these chip parts, for example, during operation by influencing them with the incoming radiation. In the latter case, this would constitute an interference with the chip's security mechanisms, making data exchange possible without any problems even without authentication. Such external access must therefore be prevented.Furthermore, it is desirable to be able to implement these protective measures as easily as possible.

[0012] Where the term "value and / or security product" is used in the description and claims of this application, this refers in particular to a value and / or security document. A value and / or security document can be, for example, a passport, identity card, driver's license or other ID card or access control card, a vehicle registration document, vehicle registration certificate, visa, check, means of payment, in particular a banknote, a check, bank, credit, or cash payment card, customer card, health card, chip card, company ID, proof of authorization, membership card, gift or shopping voucher, waybill or other proof of authorization, tax stamp, postage stamp, ticket, (gaming) token, adhesive label (for example, for product security), or another ID document.

[0013] The valuable and / or security product can be, for example, a smart card. The security and / or valuable document can be in ID 1, ID 2, ID 3, or any other format, for example, in booklet form, similar to a passport-like item. A security and / or valuable product is generally a laminate consisting of several document layers that are bonded together in precise registration using heat and increased pressure. These products must meet standardized requirements, for example, ISO 10373, ISO / IEC 7810, and ISO 14443. The product layers consist, for example, of a carrier material suitable for lamination.

[0014] The above-mentioned objects are achieved with the valuable and / or security product according to the invention, which comprises at least one bare die embedded in the valuable and / or security product. Furthermore, the product contains at least one protective element for the bare die against electromagnetic radiation in the wavelength range from 800 nm to 2000 nm entering through at least one outer side of the valuable and / or security product.

[0015] According to the invention, the at least one protective element is designed for optical refraction and / or diffraction.

[0016] According to the present invention, the protective element deflects and / or filters and / or reflects incoming radiation. This prevents the incoming radiation from being imaged onto the chip, thus preventing the incoming beam from being positioned at a specific location on the chip. Among other things, this makes it possible to achieve effective protection even when the incoming radiation is very intense, something that conventional shielding cannot effectively provide under such conditions. When using conventional shielding, the incoming radiation is merely absorbed, meaning that when high-intensity electromagnetic radiation is used, the shielding itself is damaged and can no longer perform the required protective function.Preferably, the inventive design of the protective element deflects the incident radiation, regardless of its intensity, from a rectilinear radiation path, so that the radiation is deflected in a direction in which it cannot reach the chip, or an intended imaging of the chip structure fails altogether. At least in the implementation of certain embodiments of the present invention (use of microlens and microprism arrays as well as a hologram as protective elements), the protective element can additionally form a security feature for the valuable and / or security product according to the invention. This simplifies the production of the product and reduces its costs.

[0017] The present invention is intended for the protection of an unhoused semiconductor chip, i.e., a chip that is not embedded in an embedding material for integration into the valuable and / or security product, which together with the semiconductor chip would form a chip module. Mounting an unhoused ("bare") chip into the product has the advantage that the chip is mechanically significantly less susceptible to damage than a module, which, due to its thickness, is rigid and therefore sensitive to mechanical stresses, such as bending.

[0018] The semiconductor chip can be incorporated into the document in a conventional manner, for example, using flip-chip technology, for example, by placing the chip on contact points of an antenna structure formed on a polymer layer of the valuable and / or security product. For this purpose, the semiconductor chip has a front side provided with contact surfaces, for example in the form of contact bumps, and a back side. The back side can be provided with a metallic layer that prevents attack from this side. However, such a continuous metallic layer is not present on the front side, so that the chip structures are exposed there. The semiconductor chip can have some kind of electronic circuit. Therefore, the semiconductor chip can be in the form of an RFID chip, microprocessor, internal or external memory, a chip used exclusively for data encryption, or the like.The semiconductor chip can be in a standard thickness form (as manufactured) or in a thinned form, for example with a thickness of 50 to 200 µm or even more preferably 75 to 100 µm. The semiconductor chip is arranged in the product with outer surfaces parallel to the surfaces of the valuable and / or security product. The semiconductor chip is preferably located internally in the valuable and / or security product, i.e., in a plane spaced from the outer surfaces of the product.

[0019] According to the present invention, the at least one protective element is designed to prevent the irradiation of electromagnetic radiation at least with a wavelength greater than 800 nm. Furthermore, the range in which the at least one protective element effectively prevents the irradiation of electromagnetic radiation lies in a wavelength range below 5000 nm, preferably below 3000 nm, and according to the invention extends to at least 2000 nm.

[0020] It has surprisingly been found that many materials are largely transparent in the infrared spectral range, including common printed layers used to conceal electronic components in valuables and / or security products. For example, the polymer materials used to form such a product, such as polycarbonate or polyethylene terephthalate, are also transparent to infrared radiation. This can even be the case if these materials appear opaque to the human eye, i.e. when illuminated with visible light, due to fillers. Using a thermal camera that is sensitive in the wavelength range of approximately 1000 to 5000 nm, for example a thermal lock-in camera, the chip can be seen even under layers that are opaque to the human eye. Therefore, irradiation with electromagnetic radiation with this kind of energy is typically problem-free.When using a thermal camera, the semiconductor chip itself is opaque in the chip regions where the semiconductor material is doped, which is necessary for electrical conduction. However, the entire remaining area of ​​a silicon chip is transparent. Since the chip structures become visible in this way, it is fundamentally possible to investigate the structure, manipulate the chip, or compromise the processor. This finding supports the further development of the present invention, according to which the protective element is designed, in particular, to prevent infrared radiation from reaching the semiconductor chip.The formation of at least one protective element for preventing the incidence of radiation in the specified infrared wavelength range thus provides effective protection, in particular against attacks by corresponding radiation sources and / or imaging means that operate in this wavelength range, for example with lasers that emit radiation in the infrared spectral range, in particular with an Nd:YAG or erbium-doped lithium niobate laser.

[0021] In a preferred embodiment of the present invention, the at least one protective element is formed by a microlens array or a microprism array. Such devices are characterized in that they are designed for optical refraction, i.e., that radiation incident thereon is subjected to optical refraction. The optical refraction, in turn, leads to an incident beam being deflected from the direction of incidence.

[0022] When using a microprism array, this applies in particular to radiation that strikes one of the microprism sides, which is arranged parallel to the top side of the valuables and / or security product (base surface), at an angle. This prevents an incoming beam from reaching the semiconductor chip. When a beam strikes the base surfaces of the microprisms at a right angle, the radiation is totally reflected in the microprisms if the base surfaces of the microprisms are arranged parallel to the top side of the product and the other prism sides extend into the product. This applies at least if the refractive index of the microprism material is higher at the wavelength of the incoming radiation than that of the underlying product material. In this case, the radiation cannot reach the semiconductor chip.

[0023] In the case of a microlens array with lens axes of the individual microlenses inclined relative to the exterior of the valuables and / or security product into which it is integrated, radiation incident perpendicular to the surface of the product is refracted in the microlenses, so that the incoming beam is deflected from the normal and thus cannot reach the semiconductor chip either. If, on the other hand, the lens axes are perpendicular to the top of the valuables and / or security product, the radiation falls into the product along the axes and can potentially reach the chip. However, not the entire chip surface is easily accessible; only the imaging locations on the chip defined by the lenticular grid, which are formed by the focus of the lenses, can be easily reached.Even rays incident at an angle of < 90° to the top of the valuable and / or security product are refracted in the microlenses and do not reach the semiconductor chip or only at discrete locations. Preferably, the semiconductor chip is not located in the focal plane of the microlenses.

[0024] The microlens array is preferably formed from a plurality of microlenses arranged in a grid-like manner. The lens axes are preferably aligned parallel to one another. The microlenses can be one-dimensional, i.e. elongated, optical elements, for example cylindrical lenses, so that the respective focus of a microlens lies on a line. In this case, the microlenses do not form rotationally symmetrical but rather mirror-symmetrical surfaces. Several such one-dimensional optical elements can be arranged parallel to one another and cover a surface of the upper side of the valuable and / or security product, preferably without gaps. This results in focus lines running parallel to one another below the microlens array. Alternatively, the microlenses can also be zero-dimensional, i.e. spatially limited, optical elements (dome-shaped, in particular spherical lenses).These elements can be arranged, for example, in a regular grid, for example in parallel rows with offset microlenses, and thus preferably also completely fill an area of ​​the top side of the valuable and / or security product. In the latter case, the microlenses focus in a point-like manner, resulting in a corresponding grid of focus points. The optical axes of the microlenses preferably extend perpendicular to the top side of the valuable and / or security product. The microlenses can, for example, each have at least one convex side. These convex sides are directed either towards the outside of the valuable and / or security product or towards the semiconductor chip.

[0025] As with the microlenses, corresponding shapes and arrangements can also be selected for the microprisms: The microprism array is also preferably formed from a plurality of microprisms arranged in a grid-like manner. Preferably, one of the microprism sides (base surface) is arranged parallel to the top of the valuable and / or security product, while the other microprism sides extend into the interior of the product (directed away from the incident beam). In particular, the angle bisector between the other two sides can be perpendicular to the surface of the valuable and / or security product.

[0026] The microprism and microlens arrays can additionally be designed as security features for the valuable and / or security document. For example, a microlens array can have the additional components required for a tilted image (CLI, MLI), for example, blackened portions within the polymer material of the valuable and / or security product formed with a laser in a plane below the microlens array, particularly in the focal plane, which are introduced into the product material at different angles so that they are subsequently perceivable at these angles. These blackened portions can represent different images (information). Alternatively, multiple images can be formed in a plane below the microlens array using a printing process.The microprism array represents a security feature in itself, as the total internal reflection at the two prism surfaces adjacent to the respective base surface and extending into the product makes the microprism array reflective relative to the product's surface at certain angles of incident light and transparent at other angles. The microprism array can also contain additional elements in a plane below the array that display information.

[0027] The microlens and microprism arrays can be formed from a polymer material, for example, using an embossing process, wherein the polymer material has a refractive index that differs from, and more preferably is greater than, the refractive index of the material located above and below them. Examples of such arrays and in particular their production are given in DE 10 2007 007 914 A1 and US 2008 / 0231976 A1. The latter document, in addition to a single prism array, also specifies a plurality of arrangements of multiple prism arrays integrated side by side and / or one above the other into a security element. The disclosure content of the aforementioned documents is hereby incorporated in its entirety into the present application. The microlens or microprism arrays can initially be produced separately and subsequently applied to and bonded to the valuable and / or security product body.The arrays can also be created on or in the body.

[0028] In a further preferred alternative embodiment of the present invention, the at least one protective element is formed by an interference filter for the incident electromagnetic radiation. An interference filter is characterized in that radiation incident at a predetermined angle of incidence, which has a predetermined wavelength (frequency, energy), is extinguished by interference with rays partially reflected in the filter. It is preferably a band-stop filter, i.e. the interference filter has a low transmission for radiation of a specific wavelength range, while radiation of longer and shorter wavelengths is allowed to pass through. For this purpose, an interference filter is formed from several partially reflecting layers or partially reflecting interfaces that are spaced apart from one another.For this purpose, the at least one protective element is formed by a sequence of multiple layers in which, for example, partially reflective layers alternate with dielectric layers or in which, for example, dielectric layers with different refractive indices or with different optical densities alternate. Typically, an interference filter is formed from two partially reflective layers and a dielectric layer arranged between them. Partially reflective interfaces can also be formed by adjacent dielectric layers that have different refractive indices. However, the use of partially reflective layers made of metal is preferred. Due to partial reflection at the partially reflective layers, the coupling of incident rays into the interference filter creates interfering rays that cancel each other out under certain conditions.The space between two partially reflective layers, which is formed by the dielectric layer, forms an optical resonator. If the rays are coupled into the filter at a direction deviating from the surface normal of the interference filter, they are refracted as they enter and exit the filter. Partial reflection causes interference between the partially reflected rays, which cancel each other out under certain conditions. For this purpose, the distance between the partially reflective layers must be adjusted depending on the energy of the incident radiation. Their distance should correspond to approximately half the wavelength of the incident radiation, i.e. for infrared radiation with a wavelength of 1000 to 5000 nm, approximately 0.5 to 3 µm. Due to the canceling interference, the incident radiation does not reach the semiconductor chip.The partially reflective layers or interfaces are preferably arranged parallel to the surface of the valuable and / or security product.

[0029] The interference filter is preferably formed from a first partially reflective layer facing the incident beam, an underlying dielectric layer, and a second partially reflective layer below this. For example, the interference filter is produced by applying two partially reflective layers to the two surfaces of a layer of a dielectric layer. This layer can be integrated into the valuable and / or security product. For this purpose, the interference filter is connected to the other components of the valuable and / or security product in the usual way. The dielectric layers are transparent or at least partially transparent to the incident radiation. They are preferably formed from the same material from which the valuable and / or security product is formed. For example, the dielectric material is formed from a polymer material, such as polycarbonate or polyethylene terephthalate.The partially reflective layers are preferably made of metal, such as silver or aluminum. Alternatively, several polymer layers with different refractive indices can be bonded together, resulting in partial reflection at the inner interfaces.

[0030] In a further preferred alternative embodiment of the present invention, the at least one protective element is formed by a hologram. In this case, radiation incident on the valuable and / or security product is subjected to optical diffraction by the at least one protective element. By suitably designing the hologram, the radiation incident on the product can be extinguished by interference in the underlying region in which the semiconductor chip is arranged, so that the incident radiation does not reach the chip in this case either. The hologram can be a volume hologram or a surface hologram. It is preferably a volume hologram. An example of a hologram and its production is given, for example, in EP 0 896 260 A2, the disclosure content of which is hereby incorporated in its entirety into the present application.

[0031] In a further preferred development of the present invention, the at least one protective element is arranged in a position covering the at least one semiconductor chip on one side, i.e. it is arranged relative to the semiconductor chip such that it extends completely over a projection of the semiconductor chip onto the plane in which the protective element is located. This does not preclude the protective element being even larger and therefore extending over a larger area than the area occupied by the semiconductor chip. For this purpose, the protective element is preferably arranged above the semiconductor chip. The protective element therefore extends at least over the entire side of the semiconductor chip in order to cover it. For example, the protective element can be arranged in a plane in the valuable and / or security product that is spaced from the side of the semiconductor chip to be protected.Alternatively, the protective element can be arranged so that it rests on the side of the semiconductor chip. This protects the semiconductor chip from that side of the chip. This side is preferably the front side of the semiconductor chip (substrate side), where the chip's contact surfaces are also located.

[0032] In a further preferred embodiment of the present invention, the valuable and / or security product has at least two protective elements, of which at least one is arranged in a position covering the semiconductor chip on its front side and at least one in a position covering the semiconductor chip on its back side. Just as in the case of a one-sided covering position, the at least two protective elements in this embodiment of the present invention are arranged in positions covering both sides relative to the semiconductor chip such that they extend completely over a projection of the semiconductor chip onto the two planes in which the at least two protective elements are located. This, in turn, does not preclude the at least two protective elements from being larger than the semiconductor chip.In this case too, the at least two protective elements can be arranged at a distance from the two sides of the semiconductor chip or adjacent to them, or one is spaced apart and the other is adjacent to the semiconductor chip.

[0033] In principle, at least one protective element can be provided that protects the semiconductor chip on all sides.

[0034] In a further preferred embodiment of the present invention, the at least one protective element is arranged in a plane internal to the valuable and / or security product. This makes it extremely difficult for a person attempting to counterfeit or falsify the product, or to read or manipulate the data in the semiconductor chip, or to determine the internal structure of the semiconductor chip for redesign, or to deactivate or manipulate certain chip components through incident radiation, to circumvent the protective mechanism created by the at least one protective element. To do so, this person would have to manipulate the protective element itself, for example, remove or destroy it. Such a measure would require exposing the protective element, which is practically impossible due to its internal position, at least if the manipulation is to remain unnoticed.For this purpose, it is first applied to the surface of a layer of the valuable and / or security product, for example, which is then combined with one or more other layers so that the surface provided with the at least one protective element is located on the inside. The product layers are then permanently bonded to one another, for example by lamination. Alternatively, the protective element is initially applied to the surface of a body forming the valuable and / or security product and is then coated with a protective varnish. This protects the protective element against the aforementioned tampering and also provides abrasion and scratch resistance to the product's surface.The protective coating can be so thin that the profile of the optical elements formed by microlens or microprism arrays is replicated on the outside, so that the refractive effect using these elements depends on the difference in refractive index compared to air.

[0035] If the at least one protective element is located in an internal layer of the valuable and / or security product, it can be arranged beneath an overlying layer or layer of the product, as seen from a viewer's side. This overlying layer or layer can be opaque when viewed in the visible spectral range, i.e., with the human eye, so that the protective element is hidden from the viewer.

[0036] In a further preferred embodiment of the present invention, the semiconductor chip is an RFID chip. In this case, the valuable and / or security product can be a smart card. So that the RFID chip can exchange data with an external reading and / or writing device, the chip is electrically connected to an antenna for contactless data exchange. For this purpose, the contact surfaces of the chip are electrically connected to contact points of the antenna. For example, the antenna is formed in the form of a spiral having several turns, which is preferably arranged on a surface of a layer of the valuable and / or security product. The spiral turns preferably run parallel to the product edges. The ends of the spiral-shaped conductor track can, for example, represent the contact points. The chip can preferably be mounted on the antenna using flip-chip technology.For this purpose, it is preferably bonded to the antenna's contact points using an anisotropic conductive adhesive. The chip's contact surfaces are precisely mounted on the antenna's contact points. The antenna's windings can be routed between the chip's contact surfaces. An example of such an arrangement is shown in DE 10 2010 019 121 A1.

[0037] The carrier material on which the at least one semiconductor chip is applied is a component of the valuable and / or security product. For example, it is a layer of carrier material that is stacked with other layers of carrier material and then bonded to these additional layers, for example, in a lamination process, to form the valuable and / or security document. A conventional hot / cold lamination process can be used for lamination.

[0038] The valuable and / or security product can be formed from a polymer selected from a group comprising polycarbonate (PC), in particular bisphenol A polycarbonate, polyethylene terephthalate (PET), and their derivatives, such as glycol-modified PET (PETG), polyethylene naphthalate (PEN), polyvinyl chloride (PVC), polyvinyl butyral (PVB), polymethyl methacrylate (PMMA), polyimide (PI), polyvinyl alcohol (PVA), polystyrene (PS), polyvinylphenol (PVP), polypropylene (PP), polyethylene (PE), thermoplastic elastomers (TPE), in particular thermoplastic polyurethane (TPU), acrylonitrile-butadiene-styrene copolymer (ABS), and their derivatives, and / or paper. Furthermore, the product can also be made from several of these materials. It is preferably made of PC or PC / TPU / PC. The polymers can be either unfilled or filled. In the latter case, they are preferably transparent or translucent. If the polymers are filled, they are, for example, opaque.The above information applies both to films to be bonded together and to liquid formulations applied to a precursor, such as a protective varnish. The product is preferably produced from 3 to 12, preferably 4 to 10 films. A laminate formed in this way can then be coated on one or both sides with a protective varnish. Overlay layers formed in this way protect a security feature arranged underneath and / or provide the document with the required abrasion resistance. The security feature is preferably formed on one of the inner layers.

[0039] In addition to the protective elements that may be configured as security features, such as a microlens array, a microprism array, or a hologram, the valuable and / or security document may have further security features, such as mottled fibers, guilloches, micro-lettering, patterns in luminescent colors, and the like. Furthermore, the document may also have other electrical components besides the at least one semiconductor chip, namely electronic display elements, LEDs, touch-sensitive sensors, and the like. The electrical components may, for example, be concealed between two layers of the document that are opaque to the human eye.

[0040] The following figures serve to explain the invention in more detail. Fig. 1 shows a valuable and / or security product according to the invention in the form of an identification card in a schematic isometric view; Fig. Figure 2 shows a schematic section through the valuables and / or security product in a first embodiment; (A) with one-sided protection; (B) with two-sided protection; Fig. Figure 3 shows a schematic section through the valuables and / or security product in a second embodiment; (A) with one-sided protection; (B) with two-sided protection; Fig. Figure 4 shows a schematic section through the valuables and / or security product in a third embodiment; (A) with one-sided protection; (B) with two-sided protection; Fig. Figure 5 shows a schematic section through the valuables and / or security product in a fifth embodiment; (A) with one-sided protection; (B) with two-sided protection; Fig. 6 shows a schematic section through two micro-rod prisms of a micro-rod prism array on the top side of a valuable and / or security product with radiation incident from different directions; Fig. 7 shows a schematic section through two micro-rod lenses of a micro-rod lens array on the top side of a valuables and / or security product with radiation incident from above.

[0041] In the figures, like reference symbols denote elements with the same function and / or like elements.

[0042] The value and / or security product 100 according to the invention is, in the present example, an identification card, for example an identity card ( Fig. 1). In principle, however, it can also be a different document. The identification card has a front side 101 and a back side (not shown). The document is made of several polycarbonate layers that are bonded together by lamination to form a monolithic composite. On the front side, the document has personalization data, in this case in a first field 102 a facial image of the person to whom the card is assigned, as well as a further data field 103 in which the person's data is printed in plain text and / or in coded form, for example the person's name and date of birth. The card can have further security features, which are not shown for the sake of clarity.

[0043] Only indicated by dashed lines is a semiconductor chip 200 in the form of an unhoused, thinned RFID chip (thickness, for example, 80 µm) and an antenna 210 connected to it, which is formed by several spiral windings of a conductor, for example, printed using a conductive silver paste. These two elements are located inside the document. The antenna conductor can be created by printing, for example, using a metal-filled conductive ink on an inner layer of the card. One of the chip's contact surfaces is connected to each end of the antenna conductor, which represents the contact points for electrical contact.

[0044] Furthermore, a protective element 300 for the RFID chip 200 is shown. The protective element can be exposed on the top side 101 of the card 100, or it can be located in an internal plane. For example, after lamination, the card can be coated with a protective varnish that also covers the protective element.

[0045] In the following explained Fig. 2 to 5 show several embodiments of the protective element 300 according to the invention for the RFID chip 200 together with the latter and the antenna 210. These figures are each sections through the Fig. 1 shows the map along II. The figures show the chip and the antenna conductor. The cross-section shows a continuous branch of the conductor that runs over the chip without making electrical contact with it.

[0046] Fig. Figure 2A shows a first embodiment of the present invention. The RFID chip 200 and the antenna 210 are initially mounted on a first polycarbonate layer 110, which represents a carrier layer. This carrier layer is then stacked with another polycarbonate layer 120 and laminated to form the monolithic composite. The carrier layer 110 and the polycarbonate layer 120 can each consist of several layers. The composite then forms a valuable and / or security document according to the invention, for example, the Fig. 1 card shown 100.

[0047] In the first embodiment, the protective element 300 is formed from a microprism array that is exposed on the surface 101 of the card 100 ( Fig. 2A) or possibly coated with a protective lacquer layer (not shown). The microprism array is arranged above the RFID chip 200 and extends over the entire surface of the chip and beyond. It is located on the front side 201 of the chip, where the contact surfaces for contacting the antenna 210 are also located.

[0048] The microprism array 300 consists of several rod prisms 301, 302 arranged parallel to one another and touching each other ( Fig. 6; only two adjacent prism rods are shown there; an array consists of a plurality of such rods), whose base surfaces 303 are arranged parallel to the top side 101 of the card 100 and flush with it. The refractive index of the material of the microprisms is greater than the refractive index of the adjacent polymer material of the card. Air is located above the microprism array because the microprism array is located on the top side of the card and thus not inside the card.

[0049] When light, particularly infrared radiation, is irradiated perpendicularly onto the top surface 101 of the card 100 and thus perpendicularly onto the base surfaces 303 of the microprisms 301, 302, the radiation incident on the prisms is totally reflected in the prisms because the refractive index of the microprism material at the wavelength of the incident radiation is greater than the refractive index of the underlying polymer material of the card. At an angle of incidence α of the radiation at an angle < 90° to the base surfaces, the radiation is deflected in a direction lateral to the RFID chip (not shown), so that the radiation cannot reach the chip.

[0050] In an alternative of the first embodiment to that in Fig. In the variant shown in Figure 2A, two protective elements 300, 300' are provided, the first of which is located above the chip 200 and the second below the chip ( Fig. 2B). They also extend over the entire surface of the chip and beyond. In this case, too, the protective elements are formed by microprism arrays. Regarding the protective function of the two protective elements, the same applies to the variant of Fig. 2A said accordingly.

[0051] In Fig. 3A is another embodiment of a protective element 300 covering the front side 201 of the RFID chip 200 on one side, shown in this case in the form of a microlens array. The microlenses 301, 302 are formed by elongated bodies with a lens-shaped surface, which lie with a base surface 303 on the top side 101 of the document 100 and are flush with it ( Fig. 7; there, only two adjacent lens rods are shown; an array consists of a multitude of such rods. Radiation incident into the array is focused into a plane below the array. The grid-like arrangement of the individual microlenses in the form of rod lenses creates focal lines F, F', which are spaced apart from each other in the grid of the rod lenses, while the areas in between are not affected by the incident radiation.

[0052] In Fig. 3B is an alternative to the Fig. 3A, with two such protective elements 300, 300', a microlens array above and a microlens array below the RFID chip 200. The upper microlens array 300 protects the front side 201 of the RFID chip 200, and the lower microlens array 300' protects the back side 202 of the chip.

[0053] In Fig. 4A and Fig. 4B further shows two variants of a third embodiment with an interference filter 300 or two interference filters 300, 300'. These filters are each located inside the polymer body of the document 100. The filter 300, which covers the RFID chip 200 on one side, protects its front side 201 ( Fig. 4A), and the two filters 300, 300` covering the RFID chip on both sides protect its front side 201 and its back side 202 ( Fig. 4B). The filters are formed from a dielectric optical resonator 310, for example, made of polycarbonate, which is transparent to the incident radiation, and two partially transparent metal layers 311, 312, for example, made of aluminum, arranged on its sides. The thickness of the optical resonator determines the frequency band of the filtered-out radiation. In the case of the infrared radiation radiated here, the dielectric layer is approximately 1.5 µm thick.

[0054] In Fig. 5A and Fig. 5B further shows two variants of a fourth embodiment with one volume hologram 300 and two volume holograms 300, 300', respectively. The hologram 300 covering the RFID chip 200 on one side protects its front side 201 ( Fig. 5A), and the two holograms 300, 300' covering the RFID chip on both sides protect its front side 201 and its back side 202 ( Fig. 5B). These holograms are manufactured in the usual way from radiation-sensitive material located on a carrier (not shown separately). This carrier, with the hologram on it, is integrated into the document 100 during lamination.

Claims

[1] Value and / or security product (100), comprising at least one unhoused semiconductor chip (200) embedded in the value and / or security product (100) and at least one protective element (300, 300') for the unhoused semiconductor chip (200) against electromagnetic radiation incident through at least one outer side (101) of the value and / or security product (100), wherein the at least one protective element (300, 300') is designed for optical refraction and / or optical diffraction of the electromagnetic radiation, characterized by that the at least one protective element (300, 300') prevents the irradiation of electromagnetic radiation onto the unhoused semiconductor chip (200) at least in a wavelength range from 800 nm to 2000 nm. [2] Value and / or security product (100) according to claim 1, characterized by that the at least one protective element (300, 300') is formed by a microlens array or a microprism array. [3] Value and / or security product (100) according to claim 1, characterized by that the at least one protective element (300, 300') is formed by an interference filter for the radiated electromagnetic radiation. [4] Value and / or security product (100) according to claim 1, characterized by that the at least one protective element (300, 300') is formed by a hologram. [5] Value and / or security product (100) according to one of claims 1 to 3, characterized by that the at least one protective element (300, 300') is arranged in a position covering the at least one semiconductor chip (200) on one side. [6] Value and / or security product (100) according to one of claims 1 to 3, characterized bythat the value and / or security product (100) contains at least two protective elements (300, 300'), of which at least one (300) is arranged in a position covering the semiconductor chip (200) on its front side (201) and at least one (300') is arranged in a position covering the semiconductor chip (200) on its back side (202). [7] Value and / or security product (100) according to one of the preceding claims, characterized by that the at least one protective element (300, 300') is arranged in a plane lying inside the valuable and / or security product (100).

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