Transfer device, component mounting device, and transfer method

Abstract

To provide a transfer device which assists inclination adjustment between a transfer object with which transfer pins contact and a transfer head, and to provide a component mounting device and a transfer method.SOLUTION: A transfer device includes: a transfer head including a plurality of transfer pins for transferring a liquid to a workpiece; a lifting mechanism which moves up or down the transfer head; a transfer object in which contact marks of the transfer pins are formed through contact with the transfer pins of the transfer head moved down by the lifting mechanism; an imaging unit which images the transfer object having the contact marks; and a control unit which determines whether or not the transfer head inclines based on an imaging result of the imaging unit. The control unit calculates a correction amount for correcting an inclination of the transfer head based on the imaging result of the imaging unit when it is determined that the transfer head inclines.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present disclosure relates to a transfer device that transfers a liquid, a component mounting apparatus including the transfer device, and a transfer method. [Background technology]

[0002] Conventionally, in component mounting devices that mount electronic components such as ICs on a substrate, a liquid flux is applied to remove oxides and dirt from the electrodes on the substrate that will be soldered before the components are soldered to the substrate.

[0003] For example, Patent Document 1 describes that a transfer head has multiple transfer pins, and after flux is attached to the transfer pins, the transfer pins are pressed against the electrodes of a workpiece (substrate) at the transfer position to transfer the flux. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] JP 2001-35873 A Summary of the Invention [Problem to be solved by the invention]

[0005] In recent years, the number of lead frames of components to be joined to the workpiece has been increasing, and there is a demand for transfer devices that can transfer to more than 100 places in one transfer. Therefore, transfer heads may have more than 100 transfer pins. In addition, the area of ​​the electrodes has been reduced due to the thinning of the lead frames, and the amount of flux transferred has also been reduced, resulting in the transfer pins having a smaller diameter.

[0006] If the transfer head and the workpiece to which the flux is to be transferred are not parallel, the flux may not be transferred properly to the workpiece. The operator checks whether the transfer head and the workpiece are tilted relative to each other, but due to the above-mentioned situation, it is becoming more and more difficult to determine whether the flux is being transferred properly to the workpiece.

[0007] Therefore, an object of the present disclosure is to provide a transfer device, a component mounting device, and a transfer method that assist in adjusting the inclination between the transfer head and the transfer target object with which the transfer pin comes into contact. [Means for solving the problem]

[0008] The transfer device of the present disclosure includes a transfer head having a plurality of transfer pins for transferring liquid to a workpiece, a lifting mechanism for lifting the transfer head, a transfer target object on which the transfer pins of the transfer head lowered by the lifting mechanism come into contact with the transfer pins to form contact marks of the transfer pins, an imaging unit for imaging the transfer target object having the contact marks, and a control unit for determining whether the transfer head is tilted based on the imaging result of the imaging unit. If the control unit determines that the transfer head is tilted, it calculates a correction amount for correcting the tilt of the transfer head based on the imaging result of the imaging unit.

[0009] The component mounting apparatus of the present disclosure includes the transfer device described above.

[0010] The transfer method disclosed herein is a transfer method using a transfer head equipped with a plurality of transfer pins for transferring liquid to a workpiece. The transfer method includes a contact step of lowering the transfer head by a lifting mechanism and bringing the transfer pins of the transfer head into contact with a transfer target object to form contact marks of the transfer pins on the transfer target object, an imaging step of imaging the transfer target object having the contact marks by an imaging unit, a determination step of a control unit determining whether or not the transfer head is tilted based on the imaging result, and a calculation step of the control unit calculating a correction amount for correcting the tilt of the transfer head based on the imaging result of the imaging unit if the control unit determines in the determination step that the transfer head is tilted. Effect of the Invention

[0011] According to the present disclosure, it is possible to provide a transfer device, a component mounting device, and a transfer method that assist in adjusting the inclination between a transfer target object with which a transfer pin comes into contact and a transfer head. [Brief description of the drawings]

[0012] [Figure 1] FIG. 1 is a side view showing a schematic configuration of a component mounting apparatus including a flux transfer device according to a first embodiment of the present disclosure. [Diagram 2] FIG. 1 is a side view of the component mounting device with the transfer head located at the retracted position. [Diagram 3] A side view of a component mounting device in which flux is being applied to a transfer pin. [Figure 4] FIG. 1 is a side view of the component mounting device with the transfer head located at the mounting position. [Diagram 5] Schematic side view of the transfer head [Figure 6] Schematic top perspective view of the transfer head [Figure 7] A side view of a component mounting device showing one step of detecting the inclination of a transfer head. [Figure 8] A side view of the component mounting device in a state where the transfer pin is in contact with the pressure-sensitive sheet. [Figure 9] Top view of pressure-sensitive sheet with contact marks [Figure 10] A side view showing the transfer head tilted relative to the stage [Figure 11] Top view of pressure-sensitive sheet with contact marks [Figure 12] Block diagram showing the functional configuration of the control unit [Figure 13] Flowchart of transfer head tilt detection method [Figure 14] FIG. 11 is a side view of a component mounting apparatus showing a step of detecting the inclination of a transfer head in the second embodiment. [Figure 15] Flowchart of a transfer head tilt detection method in embodiment 2 [Figure 16] FIG. 11 is a side view showing a state in which the transfer head in the second embodiment is inclined with respect to the stage. [Figure 17]FIG. 11 is a top view of a stage to which flux is transferred in the second embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0013] The transfer device of the first aspect of the present disclosure includes a transfer head having a plurality of transfer pins for transferring liquid to a workpiece, a lifting mechanism for lifting and lowering the transfer head, a transfer target object on which the transfer pins of the transfer head lowered by the lifting mechanism come into contact with the transfer pins to form contact marks of the transfer pins, an imaging unit for imaging the transfer target object having the contact marks, and a control unit for determining whether the transfer head is tilted based on the imaging result of the imaging unit. If the control unit determines that the transfer head is tilted, it calculates a correction amount for correcting the tilt of the transfer head based on the imaging result of the imaging unit.

[0014] The transfer target object having a contact mark formed by contact with the transfer pin is imaged, and the control unit judges whether the transfer head is tilted or not based on the imaged result. By making a judgment based on the imaged result of the contact mark, it is possible to make a judgment with high accuracy. Furthermore, if it is judged that the transfer head is tilted, the control unit calculates a correction amount for correcting the tilt of the transfer head, and by correcting the tilt of the transfer head by this correction amount, it is possible to easily achieve parallelism between the transfer head and the transfer target object. This makes it possible to reduce transfer leakage of liquid.

[0015] According to a second aspect of the present disclosure, the component mounting apparatus of the first aspect further includes a stage for placing a workpiece on which the components are to be mounted, and the transfer target is a pressure-sensitive sheet placed on the stage, or the stage.

[0016] According to a third aspect of the present disclosure, in the component mounting device of the second aspect, when the transfer object is a pressure-sensitive sheet, the control unit calculates a correction amount based on a contact mark of the transfer pin on the pressure-sensitive sheet.

[0017] According to a fourth aspect of the present disclosure, in the component mounting device of the third aspect, the control unit calculates a correction amount based on the brightness distribution of the contact mark in the imaging result of the imaging unit.

[0018] According to a fifth aspect of the present disclosure, in a component mounting device of any of the second to fourth aspects, when the transfer target object is a stage, a droplet attached to the tip of a transfer pin is transferred to the stage as a contact mark when the transfer head is lowered by the lifting mechanism and the droplet attached to the tip of the transfer pin comes into contact with the transfer pin or the stage, and the control unit calculates a correction amount based on the state of the droplet in the imaging result.

[0019] According to a sixth aspect of the present disclosure, in the component mounting device of the fifth aspect, the control unit calculates a correction amount based on the size distribution of droplets in the imaging result of the imaging unit.

[0020] According to a seventh aspect of the present disclosure, in the component mounting apparatus of any one of the second to sixth aspects, a tilt adjustment unit that adjusts a relative tilt between the stage and the transfer head is provided, The tilt adjustment unit reduces the relative tilt between the stage and the transfer head based on the amount of correction.

[0021] According to an eighth aspect of the present disclosure, there is provided a component mounting apparatus comprising the transfer device according to any one of the first to seventh aspects.

[0022] A transfer method of a ninth aspect of the present disclosure is a transfer method using a transfer head having a plurality of transfer pins for transferring liquid to a workpiece, and includes a contact step of lowering the transfer head by a lifting mechanism to bring the transfer pins of the transfer head into contact with the transfer object to form contact marks of the transfer pins on the transfer object, an imaging step of imaging the transfer object having the contact marks by an imaging unit, a determination step of a control unit determining whether or not the transfer head is tilted based on the imaging results, and a calculation step of the control unit calculating a correction amount to correct the tilt of the transfer head based on the imaging results of the imaging unit if the control unit determines in the determination step that the transfer head is tilted.

[0023] According to a tenth aspect of the present disclosure, in the transfer method of the ninth aspect, a stage is further provided for placing a workpiece on which the component is to be mounted, and the transfer object is a pressure-sensitive sheet placed on the stage, or the stage.

[0024] According to an eleventh aspect of the present disclosure, in the transfer method of the tenth aspect, when the transfer object is a pressure-sensitive sheet, in the calculation step, the control unit calculates a correction amount based on a contact mark of the transfer pin on the pressure-sensitive sheet.

[0025] According to a twelfth aspect of the present disclosure, in the transfer method of the eleventh aspect, in the calculation step, the control unit calculates a correction amount based on a brightness distribution of the contact mark in the image pickup result of the imaging unit.

[0026] According to a thirteenth aspect of the present disclosure, in the tenth transfer method, when the transfer object is a stage, a droplet attachment step is provided before the contact step in which droplets are attached to transfer pins of a transfer head, in which in the contact step the transfer head is lowered by a lifting mechanism so that the transfer pins come into contact with the stage and the droplets are transferred to the stage as contact marks, and in the calculation step the control unit calculates a correction amount based on the state of the droplets in the imaging result.

[0027] According to a fourteenth aspect of the present disclosure, in the transfer method of the thirteenth aspect, in the calculation step, the control unit calculates the correction amount based on the size distribution of droplets in the image capture result of the image capture unit.

[0028] According to a fifteenth aspect of the present disclosure, the transfer method according to any one of the tenth to fourteenth aspects further comprises an adjustment step of reducing the relative tilt between the stage and the transfer head by a tilt adjustment unit based on the correction amount.

[0029] Hereinafter, exemplary embodiments of the transfer device, component mounting device, and transfer method according to the present disclosure will be described with reference to the accompanying drawings. The present disclosure is not limited to the specific configurations of the following embodiments, and configurations based on similar technical ideas are included in the present disclosure.

[0030] [Embodiment 1] (Overall composition) Hereinafter, a component mounting apparatus 50 according to the first embodiment of the present disclosure will be described with reference to Fig. 1. Fig. 1 is a side view showing a schematic configuration of the component mounting apparatus 50 including a flux transfer device 101 according to the first embodiment of the present disclosure. The flux transfer device 101 that transfers flux will be described as an example of a transfer device that transfers liquid.

[0031] The component mounting apparatus 50 has a component supply unit 51, a mounting head 52, a stage 53, a control unit 56, and a flux transfer device 101. The component mounting apparatus 50 further has a base 4, a touch panel 5, a component supply unit movement unit 78, a pickup head 83, the stage 53, a stage movement unit 80, and a stage tilt adjustment unit 81. The stage 53 and the stage tilt adjustment unit 81 are also part of the components of the flux transfer device 101.

[0032] The component mounting apparatus 50 mounts components 61, such as semiconductor chips, on a substrate 62 serving as a workpiece. A component supply unit 51 and a stage 53 that holds the substrate 62 are arranged on the base 4 in the Y direction.

[0033] The component supply unit 51 supplies the components 61. The component supply unit 51 is provided on a component supply unit movement unit 78. The component supply unit movement unit 78 is controlled by the control unit 56, and moves the component supply unit 51 in the X direction and the Y direction. A plurality of components 61 are held on the upper part of the component supply unit 51. The components 61 are held on the upper part of the component supply unit 51 in a state in which they are placed on a tray or in a state in which they are attached on an adhesive sheet.

[0034] The stage 53 is provided above the stage moving unit 80. The stage moving unit 80 is controlled by the control unit 56 and moves the stage 53 in the X and Y directions. The stage 53 carries in the substrate 62, for example, by a transport rail, and positions and holds the substrate 62 at a position where the component 61 is to be mounted. The stage 53 also carries out the substrate 62 on which the component 61 is mounted, for example, by a transport rail.

[0035] The stage tilt adjustment unit 81 is provided inside the stage movement unit 80, and can adjust the tilt with respect to the transfer head 1 by rotating the stage 53 by a motor around two axes (X-axis and Y-axis) that are perpendicular to the surface of the stage 53. The amount of rotation by the motor is controlled by the control unit 56.

[0036] Provided inside stage 53 are a stage heating unit 82 that heats substrate 62 held therein, and a thermometer (not shown) that measures the temperature of stage 53 heated by stage heating unit 82. Stage heating unit 82 is controlled by control unit 56, and heats stage 53 to a specified temperature. The temperature measured by the thermometer inside stage 53 is transmitted to control unit 56.

[0037] The component 61 is held on the component supply unit 51 with the bumps formed on the back surface of the component 61 facing upward. A pick-up head 83 is disposed above the component supply unit 51. The pick-up head 83 picks up and removes the component 61 from the component supply unit 51. The pick-up head 83 rotates about the X-axis as the rotation axis by a pick-up head drive unit (not shown) controlled by the control unit 56, and further moves to a transfer position Pc, which will be described later. That is, the pick-up head 83 holds the component 61 at the transfer position Pc with the bumps facing downward.

[0038] The mounting head 52 is disposed above the pickup head 83 and the component supply unit 51. The mounting head 52 holds the supplied component 61 and mounts it on the board 62 supported by the stage 53. The mounting head 52 moves in the Y direction by a mounting head drive mechanism 86 controlled by the control unit 56. A tool 87 that adsorbs and holds the component 61 is provided at the lower end of the mounting head 52. The mounting head 52 receives the component 61 by adsorbing it from the pickup head 83 at the transfer position Pc, moves the component 61 to a mounting position on the board 62 held by the stage 53, and mounts the component 61 on the board 62.

[0039] The mounting head 52 is provided with a component heating unit 88 that heats the components 61 picked up by the tool 87, and a tool thermometer 88a that measures the temperature of the tool 87 heated by the component heating unit 88. The component heating unit 88 is controlled by the control unit 56, and heats the tool 87 to a specified temperature. The temperature of the tool 87 measured by the tool thermometer 88a is transmitted to the control unit 56.

[0040] The mounting head 52 is provided with a tool lifting mechanism 89 that raises and lowers the tool 87. The mounting head 52 is also provided with a pressure sensor 89a that measures the load with which the tool lifting mechanism 89 presses the tool 87, which holds the component 61, against the board 62. The tool lifting mechanism 89 is controlled by the control unit 56, and lowers the tool 87 so that the tool 87 mounts the component 61 on the board 62 with a specified load. The load measured by the pressure sensor 89a is transmitted to the control unit 56.

[0041] The mounting head 52 is provided with an ultrasonic oscillator 90 that ultrasonically vibrates the tool 87. The ultrasonic oscillator 90 is controlled by the control unit 56, and when mounting the component 61 on the board 62 by ultrasonic bonding, the ultrasonic oscillator 90 ultrasonically vibrates the tool 87 at designated ultrasonic power, amplitude, and frequency. The touch panel 5 that is communicably connected to the control unit 56 displays an operation menu and information on the operating status of the component mounting device 50 on its display unit, and data can be input to the control unit 56 and the component mounting device 50 can be operated using operation buttons displayed on the display unit. The touch panel 5 may be a portable terminal or may be a stationary terminal.

[0042] A substrate camera 91 is provided above the stage 53. The substrate camera 91 captures an image of the stage 53 and the substrate 62 held by the stage 53. The captured image of the substrate camera 91 is transmitted to the control unit 56. The substrate camera 91 converts the received light into an electrical signal according to its intensity, and includes, for example, a CCD image sensor or a CMOS image sensor. The substrate camera 91 may be either a monochrome camera or a color camera.

[0043] (Configuration of flux transfer device) The flux transfer device 101 transfers flux to an electrode on which a component 61 is mounted on a substrate 62 held on a stage 53. The electrode is a conductor, for example, a land or a pad. The flux transfer device 101 includes a transfer head 1 to which one ends of a plurality of transfer pins 12 are fixed, a head moving unit 54, a head lifting mechanism 58, a head tilt adjustment unit 59 that adjusts the tilt of the transfer head 1, and a flux supply unit 55.

[0044] The transfer head 1 is a member that holds flux on the tips of transfer pins 12 (described later) and transfers the flux onto the surface of a substrate 62. In this specification, the term "flux" may include not only flux alone, but also solder paste containing flux.

[0045] The head moving unit 54 moves the transfer head 1 in the horizontal direction to the mounting position Pa and the retracted position Pb.

[0046] The head lifting mechanism 58 raises and lowers the transfer head 1 relative to the stage 53 and the flux supply unit 55. Therefore, the head lifting mechanism 58 raises and lowers the transfer head 1 in the vertical direction at the mounting position Pa and the evacuation position Pb, respectively.

[0047] The head tilt adjustment unit 59 can adjust the tilt of the transfer head 1 independently in the two axial directions by rotating the transfer head 1 about two orthogonal axes. The head tilt adjustment unit 59 has adjustment screws for adjusting the angles about the two axes, and is manually adjusted by the operator.

[0048] The flux supplying unit 55 supplies flux to the transfer head 1. The flux supplying unit 55 may be a container that contains the flux 57.

[0049] The control unit 56 is a component that controls the component mounting apparatus 50. The control unit 56 includes a general-purpose processor such as a CPU, MPU, FPGA, DSP, or ASIC that executes a program to realize a predetermined function. The control unit 56 executes a program stored in a storage unit 60 such as a memory or SSD to realize the function.

[0050] Next, the movement of the transfer head 1 will be described with reference to Fig. 2 to Fig. 4. Fig. 2 is a side view of the component mounting apparatus in a state where the transfer head 1 is located at the retracted position Pb. Fig. 3 is a side view of the component mounting apparatus in a state where flux is being applied to the transfer pins 12. Fig. 4 is a side view of the component mounting apparatus in a state where the transfer head 1 is located at the mounting position Pa.

[0051] 2, the mounting head 52 is located at the mounting position Pa directly above the board 62 on the stage 53, and therefore the transfer head 1 is located at the retreat position Pb away from the mounting position Pa. Also, as shown in Fig. 3, even if the mounting head 52 is located at a position away from the mounting position Pa, before the component 61 is mounted on the board 62, the transfer head 1 is located at the retreat position Pb and an operation of applying flux to the transfer pins 12 of the transfer head 1 is performed.

[0052] 2 and 3, when the transfer head 1 is located at the retracted position Pb, the head lifting mechanism 58 lowers the transfer head 1 toward the flux supply unit 55. When the tip of the transfer pin 12 comes into contact with the flux 57 supplied by the flux supply unit 55, the flux adheres to the tip of the transfer pin 12.

[0053] 4, the head lifting mechanism 58 lifts the transfer head 1 holding the flux, and the head moving unit 54 moves it above the stage 53 at the mounting position Pa. At the mounting position Pa, the head lifting mechanism 58 lowers the transfer head 1 toward the substrate 62. When the transfer head 1 comes into contact with the substrate 62, the flux is transferred to the substrate 62.

[0054] (Transfer head configuration) The configuration of the transfer head 1 will be described with reference to Figures 5 and 6. Figure 5 is a schematic side view of the transfer head 1, and Figure 6 is a schematic top view of the transfer head 1. In each figure, the transfer pins 12 are shown enlarged and exaggerated for easy understanding.

[0055] 4, the transfer head 1 has a head block 2 and a plurality of transfer pins 12. The head block 2 is a metal block, and is rotatable around the X-axis and the Y-axis by a head tilt adjustment unit 59, and is adjusted so as to be parallel to the stage 53. The plurality of transfer pins 12 each protrude vertically downward from the lower surface 2a of the head block 2.

[0056] The transfer pins 12 have a columnar structure. The multiple transfer pins 12 are arranged in a predetermined pattern corresponding to the pattern of each electrode on which the component 61 is mounted on the substrate 62. In Fig. 5 and Fig. 6, the transfer pins 12 are arranged in a matrix of 3 rows and 6 columns as an example, and the transfer head 1 has 18 transfer pins 12, but it may have 100 transfer pins 12 in 10 rows and 10 columns.

[0057] The shape of the bottom surface 12a of the transfer pin 12 is not limited to a circle, but may be an ellipse or a rectangle. The transfer pin 12 has a diameter and height of, for example, an order of 100 μm. The multiple transfer pins 12 may have the same or different structures. Specifically, the multiple transfer pins 12 may have the same diameter or different diameters. Furthermore, the intervals between the multiple transfer pins 12 may be equal or different. The transfer pins 12 are made of resin or metal, and are made of metal in the above-mentioned diameter.

[0058] (Transfer head tilt detection) Next, a method for detecting the inclination of the transfer head 1 with respect to the stage 53 will be described with reference to Fig. 7 to Fig. 11. Fig. 7 is a side view of the component mounting device 50 showing one step of detecting the inclination of the transfer head 1, and Fig. 8 is a side view of the component mounting device 50 in a state where the transfer pins 12 are in contact with the pressure-sensitive sheet 63. Fig. 9 is a top view of the pressure-sensitive sheet 63 on which a contact mark 64 has been formed, and Fig. 10 is a side view showing a state where the transfer head 1 is inclined with respect to the stage 53. Fig. 11 is a top view of the pressure-sensitive sheet 63 on which a contact mark 64 has been formed.

[0059] In order to detect the relative inclination between the transfer head 1 and the stage 53, when the operator instructs the control unit 56 to activate the inclination detection mode of the transfer head 1, the control unit 56 retreats the mounting head 52 from the mounting position Pa to the delivery position Pc. At this time, the operator places the pressure-sensitive sheet 63 on the stage 53.

[0060] The pressure-sensitive sheet 63 has a property that the color of the part that is contacted changes, and the greater the pressure of contact, the darker the color that changes. The pressure-sensitive sheet 63 is, for example, a prescale made by Fuji Film.

[0061] When the mounting head 52 retreats to the delivery position Pc, the control unit 56 drives and controls the head moving unit 54 to move the transfer head 1 to the mounting position Pa. When the transfer head 1 has finished moving to the mounting position Pa, the head lifting mechanism 58 lowers the transfer head 1 toward the stage 53, as shown in FIG.

[0062] When the transfer head 1 is lowered to a predetermined flux transfer height, the bottom surface 12a of each transfer pin 12 comes into contact with the pressure-sensitive sheet 63 and presses the pressure-sensitive sheet 63 downward. As a result, as shown in Fig. 9, a contact mark 64 of each transfer pin 12 that has come into contact with the pressure-sensitive sheet 63 is generated on the pressure-sensitive sheet 63. After that, when the transfer head 1 is raised by the head lifting mechanism 58, the board camera 91 captures an image of the pressure-sensitive sheet 63 including the contact mark 64, and the captured image is sent to the control unit 56.

[0063] When the parallelism between the transfer head 1 and the stage 53 is maintained and the inclination of the transfer head 1 relative to the stage 53 is less than a predetermined angle, as shown in Figure 9, contact marks 64 of all the transfer pins 12 are left on the pressure-sensitive sheet 63, and the color intensity of each contact mark 64 on the pressure-sensitive sheet 63 is uniform.

[0064] 10, if the transfer head 1 is tilted at a greater angle than a predetermined angle with respect to the stage 53, it is pressed against the pressure-sensitive sheet in a tilted state, so that, for example, as shown in Fig. 11, contact marks 64a at points where proper contact with the transfer pin 12 was made will be colored correctly, but contact marks 64b, 64c at points where the contact pressure with the transfer pin 12 was weak will be lightly colored. If the transfer pin 12 is floating, an area 64d will be created where no contact marks are formed.

[0065] The tilt detection unit 71 of the control unit 56 extracts the contact mark 64 from the captured image of the pressure-sensitive sheet 63 by image processing, and detects the relative tilt state between the transfer head 1 and the stage 53 based on the brightness of the contact mark 64. When the tilt detection unit 71 determines that the tilt of the transfer head 1 with respect to the stage 53 is greater than a predetermined threshold, it displays information that the transfer head 1 is tilted on the touch panel 5. This allows the operator to manually adjust the head tilt adjustment unit 59, or the control unit 56 may drive the stage tilt adjustment unit 81 to perform automatic adjustment.

[0066] When the control unit 56 performs automatic adjustment, the tilt detection unit 71 performs a matching process between the captured image and a contact pattern of contact marks 64 on the pressure-sensitive sheet 63, which are prepared in advance, and determines which pattern the captured image resembles. Criteria for determining similarity include, but are not limited to, the presence or absence of contact marks 64 and brightness. Each contact pattern is linked to the amount of correction angle around the X-axis and Y-axis for which the tilt should be corrected. Therefore, the tilt detection unit 71 may instruct the stage tilt adjustment unit 81 to the amount of correction angle for the two axes linked to the most similar pattern.

[0067] Also, instead of performing matching processing with a prepared contact pattern, the tilt detection unit 71 may calculate a tilt angle from the pattern of an area in the captured image where there is no contact mark 64 and the distribution state of the low-luminance contact marks 64b, 64c, and instruct the stage tilt adjustment unit 81 on a correction angle amount for offsetting this tilt angle. For example, in the case of an image of the contact mark 64 shown in Fig. 11, the origin is placed at the lower left, and the tilt detection unit 71 can detect that the transfer head 1 is rising in the negative Y-axis direction and the positive X-axis direction by detecting at least one of the following: the brightness of the contact mark 64 gradually decreases in the negative Y-axis direction and the positive X-axis direction, and the contact mark 64 disappears.

[0068] Furthermore, the tilt detection unit 71 may estimate the relative tilt angle from the change in brightness in each axial direction and calculate the correction angle amount. The tilt detection unit 71 can make the transfer head 1 and the stage 53 parallel by adjusting the correction angle amount according to the brightness distribution of the contact marks 64 so as to bring the negative direction of the Y axis and the positive direction of the X axis of the stage 53 closer to the transfer head 1. Note that the detection of the tilt of the transfer head 1 by the tilt detection unit 71 is not limited to the above-mentioned method, and the tilt may be calculated from the contact marks 64 of each of the three transfer pins 12 that are not aligned in a row based on the captured image, or the tilt may be calculated from the contact marks 64 at the four corners of the captured image.

[0069] After the tilt is adjusted manually or automatically, the operator places the pressure-sensitive sheet 63 on the stage 53 again and detects the tilt state between the transfer head 1 and the stage 53 again to check whether the tilt has been properly corrected and parallelism is maintained.

[0070] The control unit 56 will be described with reference to Fig. 12. The control unit 56 is communicatively connected to the touch panel 5, the component supply unit movement unit 78, the stage movement unit 80, the stage tilt adjustment unit 81, the stage heating unit 82, the mounting head driving mechanism 86, the component heating unit 88, the tool thermometer 88a, the tool lifting mechanism 89, the pressure sensor 89a, the ultrasonic oscillator 90, and the board camera 91.

[0071] The control unit 56 includes a storage unit 60, a mounting control unit 70, and a tilt detection unit 71. The storage unit 60 stores a contact pattern 66 and a production program 67.

[0072] The mounting control unit 70 controls the operation of the component supply unit movement unit 78, stage movement unit 80, stage tilt adjustment unit 81, mounting head drive mechanism 86, tool lifting mechanism 89, and board camera 91 based on the production program 67 in the memory unit 60.

[0073] The tilt detection unit 71 determines whether or not the transfer head 1 is tilted with respect to the stage 53, based on the image captured by the board camera 91 and the multiple contact patterns 66 stored in the storage unit 60. When the tilt detection unit 71 determines that the transfer head 1 is tilted, it calculates the amount of tilt and the amount of correction therefor.

[0074] (Transfer head tilt detection method) Next, a method of determining whether or not the transfer head 1 is inclined with respect to the stage 53 will be described with reference to Figures 7 to 9 and 13. Figure 13 is a flowchart of the transfer head inclination detection method.

[0075] When the worker instructs the control unit 56 to activate the tilt detection mode for the transfer head 1, in step S1, as shown in Figure 7, the control unit 56 moves the mounting head 52 to the transfer position Pc, and the worker places the pressure-sensitive sheet 63 on the stage 53.

[0076] In step S2, the control unit 56 drives and controls the head moving unit 54 to move the transfer head 1 to the mounting position Pa, and drives and controls the head lifting mechanism 58 to lower the transfer head 1 and bring the transfer pins 12 into contact with the pressure-sensitive sheet 63. This leaves contact marks 64 of the transfer pins 12 on the pressure-sensitive sheet 63. After bringing the transfer pins 12 into contact with the pressure-sensitive sheet 63, the control unit 56 drives and controls the head lifting mechanism 58 to lift the transfer head 1.

[0077] In step S3, the control unit 56 raises the transfer head 1, and then issues an instruction to the board camera 91 to capture an image. The board camera 91 captures an image of the pressure-sensitive sheet 63 on which the contact mark 64 remains, and transmits the captured image to the control unit 56.

[0078] In step S4, the tilt detection unit 71 of the control unit 56 calculates the amount of tilt of the transfer head 1 with respect to the stage 53 based on the captured image. The tilt detection unit 71 calculates the amount of tilt of the transfer head 1 in each of the X-axis and Y-axis directions of the stage 53.

[0079] In step S5, the tilt detection unit 71 compares the calculated tilt amount of the transfer head 1 with the threshold values ​​for the tilt amounts in the X-axis and Y-axis directions pre-stored in the memory unit 60, and if it determines that the tilt amounts in both the X-axis and Y-axis directions are below the threshold values, it determines that the transfer head 1 is not tilted (No in step S5) and terminates the tilt detection mode of the transfer head 1.

[0080] In step S5, if the tilt detection unit 71 determines that the calculated tilt amount is greater than the threshold value in both the X-axis and Y-axis directions, it determines that the transfer head 1 is tilted (Yes in step S5), and in step S6, the tilt detection unit 71 calculates the correction amount for the tilt of the transfer head 1.

[0081] In step S7, the stage tilt adjustment unit 81 adjusts the tilt of the transfer head 1 according to the amount of tilt correction instructed by the tilt detection unit 71, thereby correcting the tilt of the transfer head 1 and making the transfer head 1 parallel to the stage 53. After this, the tilt detection mode for the transfer head 1 is terminated.

[0082] (effect) As described above, the flux transfer device 101 of the first embodiment includes a transfer head 1 having a plurality of transfer pins 12 for transferring flux 57 to a substrate 62, which is a workpiece; a head lifting mechanism 58 for raising and lowering the transfer head 1; a pressure-sensitive sheet 63 that comes into contact with the transfer pins 12 of the transfer head 1 lowered by the head lifting mechanism 58 to form contact marks 64 of the transfer pins 12; a substrate camera 91 that images the pressure-sensitive sheet 63 having the contact marks 64; and a control unit 56 that determines whether the transfer head 1 is tilted based on the imaging results of the substrate camera 91. If the control unit 56 determines that the transfer head 1 is tilted, it calculates a correction amount for correcting the tilt of the transfer pins 12 based on the imaging results of the substrate camera 91.

[0083] The flux transfer method of the first embodiment, which uses a transfer head 1 having a plurality of transfer pins 12 for transferring flux to a substrate 62 that is a workpiece, includes a contact step, an imaging step, a determination step, and a calculation step. In the contact step, the head lift mechanism 58 lowers the transfer head 1, and the transfer pins 12 of the transfer head 1 contact the pressure-sensitive sheet 63 to form contact marks 64 of the transfer pins 12 on the pressure-sensitive sheet 63. In the imaging step, the pressure-sensitive sheet 63 having the contact marks 64 is imaged. In the determination step, the control unit 56 determines whether the transfer head 1 is tilted based on the captured image. If the control unit 56 determines that the transfer head 1 is tilted in the determination step, the control unit 56 calculates a correction amount for correcting the tilt of the transfer pins 12 based on the image captured by the substrate camera 91 in the calculation step.

[0084] The pressure-sensitive sheet 63 having the contact marks 64 formed by contacting the transfer pins 12 is imaged, and the control unit 56 judges whether the transfer head 1 is tilted or not based on the imaged result. By judging based on the imaged result, it is possible to judge with high accuracy even if there are, for example, 100 or more contact marks 64, or even if the diameters of the transfer pins 12 are different. Furthermore, when it is judged that the transfer head 1 is tilted, the control unit 56 calculates a correction amount for correcting the tilt of the transfer head 1, so that the control unit 56 or the operator can easily achieve parallelism between the transfer head 1 and the pressure-sensitive sheet 63 by correcting the tilt of the transfer head 1 by this correction amount. This can reduce the transfer leakage of the flux. Note that the flux transfer device 101 is not limited to the flux 57 as the liquid to be transferred to the substrate 62 on the stage 53, and may transfer other liquids such as water, solder cream, molten solder, silver paste, mold, molten plastic, or adhesive.

[0085] The apparatus further includes a stage 53 on which a substrate 62 on which components 61 are to be mounted is placed, and the pressure-sensitive sheet 63 is placed on the stage 53. If the transfer head 1 and the pressure-sensitive sheet 63 are parallel, the transfer head 1, the stage 53, and the substrate 62 are also parallel.

[0086] Furthermore, the control unit 56 calculates a correction amount based on a contact mark 64 where the transfer pin 12 contacts the pressure-sensitive sheet 63. The control unit 56 can calculate a correction amount for correcting the inclination of the transfer head 1 based on a captured image of the pressure-sensitive sheet 63 having the contact mark 64.

[0087] Furthermore, the control unit 56 calculates the amount of correction based on the brightness distribution of the contact mark 64 in the image captured by the board camera 91. As a result, by calculating the amount of correction based on the brightness, either a monochrome camera or a color camera can be used as the board camera 91.

[0088] The flux transfer device 101 also includes a head tilt adjustment unit 59 or a stage tilt adjustment unit 81 that adjusts the relative tilt between the stage 53 and the transfer head 1, and the head tilt adjustment unit 59 or the stage tilt adjustment unit 81 reduces the relative tilt between the stage 53 and the transfer head 1 based on the correction amount. This allows the stage 53 and the transfer head 1 to be appropriately parallel. Also, the operator can manually correct the tilt using the head tilt adjustment unit 59, or the control unit 56 can drive the stage tilt adjustment unit 81 to automatically correct the tilt.

[0089] Furthermore, by including the flux transfer device 101, the component mounting apparatus 50 can check whether the flux transfer is being performed appropriately while mounting of the components 61 onto the board 62 is stopped.

[0090] [Embodiment 2] Next, a flux transfer device 101 and a component mounting device 50 according to the second embodiment will be described. In the flux transfer device 101 according to the first embodiment, the inclination of the transfer head 1 is detected based on the contact marks 64 left on the pressure-sensitive sheet 63, but in the second embodiment, instead of using the pressure-sensitive sheet 63, the flux 57 is actually transferred to the stage 53, and the inclination of the transfer head 1 is detected based on the distribution of the flux 57. This point and the configurations other than those described below are common to the first and second embodiments, so the description thereof will be omitted.

[0091] A method for adjusting the inclination of the transfer head 1 by the flux transfer device 101 of the second embodiment will be described with reference to Figs. 3, 14 and 15. Fig. 14 is a side view of the component mounting device showing one step of detecting the inclination of the transfer head in the second embodiment. Fig. 15 is a flowchart of the method for detecting the inclination of the transfer head in the second embodiment.

[0092] When an operator operates the touch panel 5 to instruct the control unit 56 to start the tilt detection mode of the transfer head 1, the control unit 56 moves the mounting head 52 to the delivery position Pc, places the flux transfer device 101 at the retreat position Pb, and drives and controls the head lifting mechanism 58 to lower the transfer head 1 and immerse the lower end of the transfer pin 12 in the flux 57 in the flux supply unit 55, as shown in Fig. 3. As a result, droplets 65 of the flux 57 adhere to the lower end of the transfer pin 12 (step S11).

[0093] Next, when the control unit 56 raises the transfer head 1 as shown in FIG. 14, a droplet 65 is attached to the lower end of the transfer pin 12 as shown in FIG. 16. In this state, the control unit 56 drives and controls the head moving unit 54 to move the transfer head 1 to the mounting position Pa as shown in FIG. 14. When the transfer head 1 finishes moving to the mounting position Pa, the control unit 56 lowers the transfer head 1 toward the stage 53 by the head lifting mechanism 58, and brings the lower end of the transfer pin 12 into contact with the stage 53 (step S12). As a result, as shown in FIG. 17, the droplet 65 remains on the stage 53 as a contact mark of the transfer pin 12. The droplet 65 remains on the stage 53 as a contact mark not only when the transfer pin 12 itself contacts the stage 53, but also when the droplet 65 attached to the lower end of the transfer pin 12 contacts the stage 53 even if the transfer pin 12 does not contact the stage 53. After the transfer pins 12 are brought into contact with the stage 53, the control unit 56 controls the drive of the head lifting mechanism 58 to lift the transfer head 1.

[0094] After raising the transfer head 1, the control unit 56 issues an instruction to the substrate camera 91 to capture an image, and the substrate camera 91 captures an image of the stage 53 on which the droplets 65 remain (step S13), and transmits the captured image to the control unit 56. Thereafter, similarly to the first embodiment, steps S5 to S7 are performed to determine whether the transfer head 1 is tilted, and if it is determined that the transfer head 1 is tilted, the amount of correction for the transfer head 1 is calculated to adjust the tilt.

[0095] Below, the correction amount for the inclination of the transfer head 1 will be described using as an example the case where in step S12 of embodiment 2, the transfer head 1 is lowered to the stage 53 in a tilted state as shown in FIG. 16, and a droplet 65 as shown in FIG. 17 is transferred to the stage 53.

[0096] 17, droplets 65a transferred at locations where proper contact with transfer pin 12 was made have an area larger than a threshold value set corresponding to the diameter of transfer pin 12, but droplets 65b transferred at locations where the contact pressure with transfer pin 12 was weak have an area smaller than the set threshold value. If transfer pin 12 and droplets 65 adhering to the tips of transfer pins 12 are floating without contacting stage 53, areas 65d where droplets 65 do not remain are generated.

[0097] The tilt detection unit 71 of the control unit 56 extracts droplets 65 from the captured image of the stage 53 by image processing, and detects the relative tilt state between the transfer head 1 and the stage 53 based on the captured droplets 65. When the tilt detection unit 71 determines that the tilt of the transfer head 1 with respect to the stage 53 is greater than a predetermined threshold, it displays information that the transfer head 1 is tilted on the touch panel 5. This allows the operator to manually adjust the head tilt adjustment unit 59, or the control unit 56 may drive the stage tilt adjustment unit 81 to perform automatic adjustment.

[0098] When the control unit 56 performs automatic adjustment, the tilt detection unit 71 performs a matching process between the captured image and a contact pattern of droplets 65 on the stage 53, which are prepared in advance, and determines which pattern the captured image resembles. Criteria for determining similarity include, but are not limited to, the presence or absence of droplets 65 and their area. Each contact pattern is associated with a correction angle amount around the X-axis and Y-axis for correcting the tilt. Therefore, the tilt detection unit 71 may instruct the stage tilt adjustment unit 81 on the correction angle amount for the two axes associated with the most similar pattern.

[0099] Also, instead of matching with a previously prepared contact pattern, the tilt detection unit 71 may calculate the tilt angle from the pattern of the area without the droplets 65 in the captured image and the distribution state of the droplets 65b whose area is smaller than a predetermined threshold corresponding to the shape and diameter of the bottom surface 12a of each transfer pin 12, and instruct the stage tilt adjustment unit 81 on the amount of correction angle to offset this tilt angle. For example, in the case of an image of the droplets 65 shown in Fig. 17, the origin is placed at the lower left, and the tilt detection unit 71 can detect that the transfer head 1 is rising in the negative Y-axis direction and the positive X-axis direction by detecting at least one of the following: the area of ​​the droplets 65 is gradually decreasing in the negative Y-axis direction and the positive X-axis direction, and the droplets 65 are disappearing.

[0100] Furthermore, the tilt detection unit 71 may estimate the relative tilt angle from the change in area in each axial direction and calculate the correction angle amount. The tilt detection unit 71 can make the transfer head 1 and the stage 53 parallel by adjusting the correction angle amount according to the area distribution of the droplets 65 so that the negative direction of the Y axis and the positive direction of the X axis of the stage 53 are brought closer to the transfer head 1. Note that the detection of the tilt of the transfer head 1 by the tilt detection unit 71 is not limited to the above-mentioned method, and the tilt may be calculated from each of the droplets 65 of three transfer pins 12 that are not aligned in a row based on the captured image, or the tilt may be calculated from the droplets 65 at the four corners of the captured image.

[0101] The droplets 65 transferred to the stage 53 are not limited to the flux 57, and may be other liquids such as water or colored liquids. The stage 53 may not carry the substrate 62 and may be dedicated to checking whether the transfer head 1 is tilted or not.

[0102] (effect) As described above, the flux transfer device 101 of the second embodiment includes the transfer head 1 having a plurality of transfer pins 12 for transferring flux 57 to the workpiece substrate 62, the head lifting mechanism 58 for raising and lowering the transfer head 1, the stage 53 that comes into contact with the transfer pins 12 of the transfer head 1 lowered by the head lifting mechanism 58 to form droplets 65 as contact marks 64 of the transfer pins 12, the substrate camera 91 for capturing an image of the stage 53 having the droplets 65, and a control unit 56 for determining whether or not the transfer head 1 is tilted based on the image capturing result of the substrate camera 91. If the control unit 56 determines that the transfer head 1 is tilted, it calculates a correction amount for correcting the tilt of the transfer pins 12 based on the image capturing result of the substrate camera 91.

[0103] The flux transfer method of the second embodiment uses a transfer head 1 having a plurality of transfer pins 12 for transferring flux to a substrate 62, which is a workpiece. The flux transfer method includes a contact step, an imaging step, a determination step, and a calculation step. In the contact step, the head lift mechanism 58 lowers the transfer head 1, and the transfer pins 12 of the transfer head 1 contact the stage 53, causing droplets 65 to adhere to the stage 53 as contact marks of the transfer pins 12. In the imaging step, an image of the stage 53 having the droplets 65 is captured. In the determination step, the control unit 56 determines whether the transfer head 1 is tilted based on the captured image. If the control unit 56 determines that the transfer head 1 is tilted in the determination step, the control unit 56 calculates a correction amount for correcting the tilt of the transfer head 1 based on the captured image of the substrate camera 91 in the calculation step.

[0104] The stage 53 having the droplets 65 formed by contact with the transfer pins 12 is imaged, and the control unit 56 judges whether the transfer head 1 is tilted or not based on the image. By making a judgment based on the image result, it is possible to make an accurate judgment even if there are, for example, 100 or more droplets 65, or even if the diameters of the transfer pins 12 are different. Furthermore, if it is judged that the transfer head 1 is tilted, the control unit 56 calculates a correction amount for correcting the tilt of the transfer head 1, so that the control unit 56 or the operator can easily achieve parallelism between the transfer head 1 and the stage 53 by correcting the tilt of the transfer head 1 by this correction amount. This makes it possible to reduce the transfer leakage of the flux.

[0105] Furthermore, since a substrate 62 on which a component 61 is to be mounted is placed on the stage 53, if the transfer head 1 and the stage 53 are parallel, the transfer head 1 and the substrate 62 are also parallel.

[0106] In addition, when the transfer head 1 is lowered by the head lifting mechanism 58, the transfer pin 12 comes into contact with the stage 53, and the droplet 65 attached to the tip of the transfer pin 12 is transferred to the stage 53 as a contact mark, and the control unit 56 calculates the correction amount based on the state of the droplet 65 in the captured image.

[0107] Furthermore, the control unit 56 calculates the amount of correction based on the size distribution of the droplets 65 in the image captured by the board camera 91. This makes it possible to accurately calculate the amount of correction for correcting the tilt.

[0108] Although the present disclosure has been fully described in connection with the preferred embodiments with reference to the accompanying drawings, various modifications and alterations will be apparent to those skilled in the art. Such modifications and alterations should be understood to be included within the scope of the present disclosure as defined by the appended claims, unless they deviate from the scope of the present disclosure. In addition, changes in the combination and order of elements in each embodiment may be made without departing from the scope and spirit of the present disclosure.

[0109] Any of the various embodiments and modifications described above may be appropriately combined to achieve the effects of each of them. [Industrial Applicability]

[0110] The transfer apparatus, component mounting apparatus, and transfer method according to the present disclosure are applicable to a transfer apparatus and component mounting apparatus that transfer a liquid such as flux onto a substrate. [Explanation of symbols]

[0111] 1 Transfer head 2 Head Block 2a Bottom side 4 Foundation 5. Touch Panel 12 Transfer pin 12a Bottom 50 Component mounting equipment 51 Parts Supply Department 52 Mounting head 53 Stage 54 Head movement part 55 Flux Supply Unit 56 Control section 57 Flux 58 Head lift mechanism 59 Head tilt adjustment part 60 Storage section 61 parts 62 Substrate 63 Pressure-sensitive sheet 64 Contact marks 64a, 64b, 64c contact traces 64d area 65 droplets 65a, 65b droplet 65d area 66 Contact Patterns 67 Production Program 70 Mounting control section 71 Tilt detection unit 78 Parts Supply Section Moving Section 80 Stage movement part 81 Stage tilt adjustment part 82 Stage heating section 83 Pickup Head 86 Mounting head drive mechanism 87 Tools 88 Parts heating section 88a Tool Thermometer 89 Tool lifting mechanism 90 Ultrasonic Oscillator 91 Board Camera 101 Flux transfer device Pa Mounting position Pb evacuation position PC delivery position

Claims

1. A transfer head having a plurality of transfer pins for transferring liquid onto a workpiece; a lifting mechanism for lifting and lowering the transfer head; a transfer target object that comes into contact with the transfer pins of the transfer head that are lowered by the lifting mechanism and that forms contact marks of the transfer pins; an imaging unit that images the transfer target having the contact mark; a control unit that determines whether the transfer head is tilted based on an imaging result of the imaging unit, When it is determined that the transfer head is tilted, the control unit calculates a correction amount for correcting the tilt of the transfer head based on an imaging result of the imaging unit. Transcription device.

2. Further, the apparatus includes a stage for placing a workpiece on which the component is to be mounted, The transfer target is a pressure-sensitive sheet placed on the stage or the stage. The transfer device according to claim 1 .

3. When the transfer target object is a pressure-sensitive sheet, the control unit calculates the correction amount based on a contact mark of the transfer pin on the pressure-sensitive sheet. The transfer device according to claim 2 .

4. The control unit calculates the correction amount based on a brightness distribution of the contact mark in an imaging result of the imaging unit. The transfer device according to claim 3 .

5. When the transfer target object is the stage, the transfer head is lowered by the lifting mechanism, and the droplets attached to the tips of the transfer pins come into contact with the transfer pins or the droplets attached to the tips of the transfer pins and the stage, and the droplets are transferred to the stage as the contact marks, and the control unit calculates the correction amount based on the state of the droplets in the imaging result. The transfer device according to claim 2 .

6. The control unit calculates the correction amount based on a size distribution of the droplets in the image capturing result of the image capturing unit. The transfer device according to claim 5 .

7. a tilt adjustment unit that adjusts a relative tilt between the stage and the transfer head, the tilt adjustment unit reduces a relative tilt between the stage and the transfer head based on the correction amount; The transfer device according to claim 2 .

8. A component mounting apparatus comprising the transfer device according to any one of claims 1 to 7.

9. A transfer method using a transfer head having a plurality of transfer pins for transferring liquid onto a workpiece, comprising: a contact step of lowering the transfer head by a lifting mechanism to bring the transfer pins of the transfer head into contact with an object to be transferred, thereby forming contact marks of the transfer pins on the object to be transferred; an imaging step of imaging the transfer target object having the contact mark by an imaging unit; a determination step in which a control unit determines whether or not the transfer head is tilted based on an imaging result; a calculation step in which, when the control unit determines in the determination step that the transfer head is tilted, the control unit calculates a correction amount for correcting the tilt of the transfer head based on an imaging result of the imaging unit; A transfer method comprising:

10. Further, the apparatus includes a stage for placing a workpiece on which the component is to be mounted, The transfer target is a pressure-sensitive sheet placed on the stage or the stage. The transfer method according to claim 9 .

11. When the transfer object is a pressure-sensitive sheet, in the calculation step, the control unit calculates the correction amount based on a contact mark of the transfer pin on the pressure-sensitive sheet. The transfer method according to claim 10.

12. In the calculation step, the control unit calculates the correction amount based on a brightness distribution of the contact mark in an image captured by the imaging unit. The transfer method according to claim 11.

13. When the transfer object is the stage, a droplet attachment step of attaching droplets to the transfer pins of the transfer head before the contact step, In the contact step, the transfer head is lowered by the lifting mechanism, the transfer pin comes into contact with the stage, and the droplet is transferred to the stage as the contact mark, In the calculation step, the control unit calculates the correction amount based on a state of the droplet in the imaging result. The transfer method according to claim 10.

14. In the calculation step, the control unit calculates the correction amount based on a size distribution of the droplets in the image capturing result of the image capturing unit. The transfer method according to claim 13.

15. an adjustment step of reducing a relative tilt between the stage and the transfer head by a tilt adjustment unit based on the correction amount; The transfer method according to claim 10.

Images