Transfer device, component mounting device, and transfer method

Abstract

To provide a transfer device which assists inclination adjustment between a stage and a transfer head, and to provide a component mounting device and a transfer method.SOLUTION: A transfer device includes: a transfer head including a plurality of transfer pins for transferring a liquid to a workpiece on which components are mounted; a lifting mechanism which moves up or down the transfer head; a stage disposed in a direction in which the transfer head is moved down by the lifting mechanism; and a detection part which detects contact or non-contact between divided areas of the stage or a plurality of electrodes included in a substrate placed on the stage and transfer pins or detects distances between the divided areas of the stage divided into multiple areas and the transfer pins.SELECTED DRAWING: Figure 8

Description

[Technical field]

[0001] The present disclosure relates to a transfer device that transfers a transfer object, a component mounting device including the transfer device, and a transfer method. [Background technology]

[0002] Conventionally, in component mounting devices that mount electronic components such as ICs on a substrate, a liquid flux is applied to remove oxides and dirt from the electrodes on the substrate where the soldering will be performed before the components are soldered to the substrate.

[0003] For example, Patent Document 1 describes that a transfer head has multiple transfer pins, and after flux is attached to the transfer pins, the transfer pins are pressed against the electrodes of a workpiece (substrate) at the transfer position to transfer the flux. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] JP 2001-35873 A Summary of the Invention [Problem to be solved by the invention]

[0005] In recent years, the number of lead frames of components to be joined to the workpiece has been increasing, and there is a demand for transfer devices that can transfer to more than 100 places in one transfer. Therefore, transfer heads may have more than 100 transfer pins. In addition, the area of ​​the electrodes has been reduced due to the thinning of the lead frames, and the amount of flux transferred has also been reduced, resulting in the transfer pins having a smaller diameter.

[0006] If the transfer head and the workpiece to which the flux is to be transferred are not parallel, the flux may not be transferred properly to the workpiece. The operator checks whether the transfer head and the workpiece are tilted relative to each other, but due to the above-mentioned situation, it is becoming more and more difficult to determine whether the flux is being transferred properly to the workpiece.

[0007] Therefore, an object of the present disclosure is to provide a transfer apparatus, a component mounting apparatus, and a transfer method that assist in adjusting the inclination between a stage and a transfer head. [Means for solving the problem]

[0008] The transfer device of the present disclosure comprises a transfer head having a plurality of transfer pins for transferring liquid to a workpiece on which a component is to be mounted, a lifting mechanism for raising and lowering the transfer head, a stage arranged in the direction in which the transfer head is lowered by the lifting mechanism, and a detection unit that detects contact or non-contact between the transfer pins and each divided area of ​​the stage or multiple electrodes of a substrate placed on the stage, or detects the distance between each divided area of ​​the stage divided into multiple areas and the transfer pins.

[0009] A transfer device according to another aspect of the present disclosure includes a transfer head having a plurality of transfer pins for transferring liquid to a workpiece on which a component is to be mounted, a lifting mechanism for raising and lowering the transfer head, and a detection unit that is arranged in the direction in which the transfer head is lowered by the lifting mechanism and is movable in a plane perpendicular to the direction of descent, and detects the distance between the plurality of transfer pins of the transfer head lowered to a predetermined height, or detects the height of the tip of each of the transfer pins when a rod that is arranged in the direction in which the transfer head is lowered by the lifting mechanism and is movable in a plane perpendicular to the direction of descent is brought into contact with each of the plurality of transfer pins.

[0010] The component mounting apparatus of the present disclosure includes the transfer device described above.

[0011] The transfer method disclosed herein is a transfer method using a transfer head equipped with a plurality of transfer pins for transferring liquid to a workpiece on which a component is to be mounted, and includes a lowering step in which a lifting mechanism lowers the transfer head toward a stage, and a detection step in which a detection unit detects contact or non-contact between the transfer pins and each region of the stage divided into a plurality of regions, or between each region of a substrate placed on the stage and a plurality of electrodes, or detects the distance between each divided region of the stage divided into a plurality of regions and the transfer pins.

[0012] A transfer method according to another aspect of the present disclosure is a transfer method using a transfer head having a plurality of transfer pins for transferring liquid to a workpiece on which a component is to be mounted, and includes a lowering step in which a lifting mechanism lowers the transfer head toward a stage, and a detection step in which a detection unit detects the height of the tip of each of the transfer pins when a rod, which is arranged in the direction in which the transfer head is lowered by the lifting mechanism and capable of moving in a plane perpendicular to the lowering direction, and a rod is brought into contact with each of the plurality of transfer pins, or a detection step in which a detection unit detects the distance between the transfer head and the plurality of transfer pins, which is arranged in the direction in which the transfer head is lowered by the lifting mechanism and capable of moving in a plane perpendicular to the lowering direction, and which has been lowered to a predetermined height. Effect of the Invention

[0013] According to the present disclosure, it is possible to provide a transfer device, a component mounting device, and a transfer method that assist in adjusting the inclination between a transfer target object with which a transfer pin comes into contact and a transfer head. [Brief description of the drawings]

[0014] [Figure 1] FIG. 1 is a side view showing a schematic configuration of a component mounting apparatus including a flux transfer device according to a first embodiment of the present disclosure. [Diagram 2] FIG. 1 is a side view of the component mounting device with the transfer head located at the retracted position. [Diagram 3] A side view of a component mounting device in which flux is being applied to a transfer pin. [Figure 4] FIG. 1 is a side view of the component mounting device with the transfer head located at the mounting position. [Diagram 5] Schematic side view of the transfer head [Figure 6] Schematic top perspective view of the transfer head [Figure 7] A side view of a component mounting device showing one step of detecting the inclination of a transfer head. [Figure 8] A side view of the component mounting device in a state where the transfer pin is in contact with the stage. [Figure 9] Cross-sectional view showing the contact state when the transfer head is parallel to the stage [Figure 10] Top view of the stage showing the split area in contact with the transfer pin [Figure 11] Cross-sectional view showing the transfer head tilted relative to the stage [Figure 12] FIG. 1 is a top view of a stage showing an example of a pattern of divided regions in contact with a transfer pin. [Figure 13] Block diagram showing the functional configuration of the control unit [Figure 14] Flowchart of transfer head tilt detection method [Figure 15] FIG. 11 is a cross-sectional view showing a state in which a transfer head is inclined with respect to a stage in a first modified example of the first embodiment. [Figure 16] FIG. 11 is a top view of a stage showing an example of a pattern of pressure sensors on a divided area contacted by a transfer pin in a first modified example of the first embodiment; [Figure 17] FIG. 11 is a side view showing a state in which the transfer head is inclined with respect to the stage in the second modified example of the first embodiment. [Figure 18] FIG. 11 is a top view of a stage showing an example of a pattern of electrodes that are in contact with transfer pins in a second modified example of the first embodiment; [Figure 19] FIG. 11 is an explanatory diagram for explaining detection of the inclination of a transfer pin of a flux transfer device according to a second embodiment. [Figure 20] FIG. 11 is an explanatory diagram for explaining detection of the inclination of a transfer pin of a flux transfer device according to a second embodiment. [Figure 21] FIG. 13 is an explanatory diagram for explaining detection of the inclination of a transfer pin of a flux transfer device according to a modified example of the second embodiment. [Figure 22]FIG. 13 is an explanatory diagram for explaining detection of the inclination of a transfer pin of a flux transfer device according to a modified example of the second embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0015] The transfer device of the first aspect of the present disclosure comprises a transfer head having a plurality of transfer pins for transferring liquid to a workpiece on which a component is to be mounted, a lifting mechanism for raising and lowering the transfer head, a stage arranged in the direction in which the transfer head is lowered by the lifting mechanism, and a detection unit that detects contact or non-contact between the transfer pins and each divided area of ​​the stage or multiple electrodes of a substrate placed on the stage, or detects the distance between each divided area of ​​the stage divided into multiple areas and the transfer pins.

[0016] By the detection unit detecting contact or non-contact between the transfer pins and each divided area of ​​the stage or multiple electrodes of the substrate placed on the stage, or detecting the distance between each divided area of ​​the stage and the transfer pins, it is possible to know the distribution of contact or non-contact between the transfer pins and the electrodes of the stage or substrate, or the distribution of distance between the transfer pins and the stage, and to assist in adjusting the inclination between the transfer head and the transfer object with which the transfer pins come into contact.

[0017] According to a second aspect of the present disclosure, the component mounting device of the first aspect further includes an inclination determination unit that determines whether or not the transfer pin is inclined based on a result of the detection unit.

[0018] According to a third aspect of the present disclosure, the apparatus further includes an inclination calculation unit that calculates a correction amount for correcting the inclination of the transfer pin based on the result of the detection unit.

[0019] According to a fourth aspect of the present disclosure, the tilt calculation unit calculates the tilt direction and tilt amount of the transfer pin, and calculates the tilt correction amount for correcting the tilt of the transfer pin based on the tilt direction and tilt amount of the transfer pin.

[0020] According to a fifth aspect of the present disclosure, when the lifting mechanism lowers the transfer head a predetermined distance, if the detection unit detects that a predetermined percentage or more of the divided areas have come into contact with the transfer pins, the inclination determination unit determines that the transfer pins are not inclined.

[0021] According to a sixth aspect of the present disclosure, the transfer pin is conductive, and the detection unit detects whether the transfer pin has come into contact with any region of the stage or any electrode of the substrate due to electrical conductivity obtained by contact between the transfer pin and any region of the conductive stage or any electrode of the substrate.

[0022] A transfer device of a seventh aspect of the present disclosure comprises a transfer head having a plurality of transfer pins for transferring liquid to a workpiece on which a component is to be mounted, a lifting mechanism for raising and lowering the transfer head, and a detection unit that is arranged in the direction in which the transfer head is lowered by the lifting mechanism and is movable in a plane perpendicular to the direction of descent, and detects the distance between the plurality of transfer pins of the transfer head lowered to a predetermined height, or detects the height of the tip of each of the transfer pins when a rod that is arranged in the direction in which the transfer head is lowered by the lifting mechanism and is movable in a plane perpendicular to the direction of descent is brought into contact with each of the plurality of transfer pins.

[0023] According to an eighth aspect of the present disclosure, there is provided a component mounting apparatus comprising the transfer device according to any one of the first to seventh aspects.

[0024] A transfer method of a ninth aspect of the present disclosure is a transfer method using a transfer head having a plurality of transfer pins for transferring liquid to a workpiece on which a component is to be mounted, and includes a lowering step in which a lifting mechanism lowers the transfer head toward a stage, and a detection step in which a detection unit detects contact or non-contact between the transfer pins and each region of the stage divided into a plurality of regions, or between each region of a substrate placed on the stage and a plurality of electrodes, or detects the distance between each divided region of the stage divided into a plurality of regions and the transfer pins.

[0025] According to a tenth aspect of the present disclosure, the transfer method of the ninth aspect further includes a determination step of determining whether or not the transfer pin is tilted based on a result from the detection unit.

[0026] According to an eleventh aspect of the present disclosure, in the transfer method of the tenth aspect, a calculation step of calculating a correction amount for correcting the inclination of the transfer pin based on the result of the detection unit is further included.

[0027] According to a twelfth aspect of the present disclosure, in the transfer method of the eleventh aspect, the calculation step calculates the tilt direction and tilt amount of the transfer head, and calculates a tilt correction amount for correcting the tilt of the transfer pin based on the tilt direction and tilt amount of the transfer head.

[0028] According to a thirteenth aspect of the present disclosure, in the transfer method of any of the ninth to tenth aspects, if contact between the transfer pin and the divided area of ​​a predetermined proportion or more is detected in the detection process when the transfer head is lowered a predetermined distance by the lifting mechanism, it is determined in the judgment process that the transfer pin is not tilted.

[0029] According to a 14th aspect of the present disclosure, in the transfer method of any of the 9th to 13th aspects, the transfer pin is conductive, and the detection process detects whether the transfer pin has come into contact with any area of ​​the stage or any electrode of the substrate by electrical conductivity obtained by contact between the transfer pin and any area of ​​the conductive stage or any electrode of the substrate.

[0030] A transfer method of a fifteenth aspect of the present disclosure is a transfer method using a transfer head having a plurality of transfer pins for transferring liquid to a workpiece on which a component is to be mounted, and includes a lowering step in which a lifting mechanism lowers the transfer head toward a stage, and a detection step in which a detection unit detects the height of the tip of each of the transfer pins when a rod, which is arranged in the direction in which the transfer head is lowered by the lifting mechanism and capable of moving in a plane perpendicular to the lowering direction, and a rod is brought into contact with each of the plurality of transfer pins, or a detection step in which a detection unit detects the distance between the transfer head and the plurality of transfer pins, which is arranged in the direction in which the transfer head is lowered by the lifting mechanism and capable of moving in a plane perpendicular to the lowering direction, and which has been lowered to a predetermined height.

[0031] Hereinafter, exemplary embodiments of a transfer device, a component mounting device, and a transfer method according to the present disclosure will be described with reference to the accompanying drawings. The present disclosure is not limited to the specific configurations of the following embodiments, and configurations based on similar technical ideas are included in the present disclosure.

[0032] [Embodiment 1] (Overall composition) Hereinafter, a component mounting apparatus 50 according to the first embodiment of the present disclosure will be described with reference to Fig. 1. Fig. 1 is a side view showing a schematic configuration of the component mounting apparatus 50 including a flux transfer device 101 according to the first embodiment of the present disclosure. The flux transfer device 101 that transfers flux will be described as an example of a transfer device that transfers liquid.

[0033] The component mounting apparatus 50 has a component supply unit 51, a mounting head 52, a stage 53, a control unit 56, and a flux transfer device 101. The component mounting apparatus 50 further has a base 4, a touch panel 5, a component supply unit movement unit 78, a pickup head 83, the stage 53, a stage movement unit 80, and a stage inclination adjustment unit 81. The stage 53, the stage inclination adjustment unit 81, and the control unit 56 are also components of the flux transfer device 101.

[0034] The component mounting apparatus 50 mounts components 61, such as semiconductor chips, on a substrate 62 serving as a workpiece. A component supply unit 51 and a stage 53 that holds the substrate 62 are arranged on the base 4 in the Y direction.

[0035] The component supply unit 51 supplies the components 61. The component supply unit 51 is provided on a component supply unit movement unit 78. The component supply unit movement unit 78 is controlled by the control unit 56, and moves the component supply unit 51 in the X direction and the Y direction. A plurality of components 61 are held on the upper part of the component supply unit 51. The components 61 are held on the upper part of the component supply unit 51 in a state in which they are placed on a tray or in a state in which they are attached on an adhesive sheet.

[0036] The stage 53 is provided above the stage moving unit 80. The stage moving unit 80 is controlled by the control unit 56 and moves the stage 53 in the X and Y directions. The stage 53 carries in the substrate 62, for example, by a transport rail, and positions and holds the substrate 62 at a position where the component 61 is to be mounted. The stage 53 also carries out the substrate 62 on which the component 61 is mounted, for example, by a transport rail.

[0037] The stage tilt adjustment unit 81 is provided inside the stage movement unit 80, and can adjust the tilt with respect to the transfer head 1 by rotating the stage 53 around two axes (X-axis and Y-axis) that are perpendicular to the surface of the stage 53.

[0038] Inside stage 53, there are provided a stage heating unit (not shown) that heats held substrate 62, and a thermometer (not shown) that measures the temperature of heated stage 53. The stage heating unit is controlled by control unit 56, and heats stage 53 to a specified temperature. The temperature measured by the thermometer inside stage 53 is transmitted to control unit 56.

[0039] The component 61 is held on the component supply unit 51 with the bumps formed on the back surface of the component 61 facing upward. A pick-up head 83 is disposed above the component supply unit 51. The pick-up head 83 picks up and removes the component 61 from the component supply unit 51. The pick-up head 83 rotates about the X-axis as the rotation axis by a pick-up head drive unit (not shown) controlled by the control unit 56, and further moves to a transfer position Pc, which will be described later. That is, the pick-up head 83 holds the component 61 at the transfer position Pc with the bumps facing downward.

[0040] The mounting head 52 is disposed above the pickup head 83 and the component supply unit 51. The mounting head 52 holds the supplied component 61 and mounts it on the board 62 supported by the stage 53. The mounting head 52 moves in the Y direction by a mounting head drive mechanism 86 controlled by the control unit 56. A tool 87 that adsorbs and holds the component 61 is provided at the lower end of the mounting head 52. The mounting head 52 receives the component 61 by adsorbing it from the pickup head 83 at the transfer position Pc, moves the component 61 to a mounting position on the board 62 held by the stage 53, and mounts the component 61 on the board 62.

[0041] The mounting head 52 is provided with a component heating unit 88 that heats the components 61 picked up by the tool 87, and a tool thermometer 88a that measures the temperature of the tool 87 heated by the component heating unit 88. The component heating unit 88 is controlled by the control unit 56, and heats the tool 87 to a specified temperature. The temperature of the tool 87 measured by the tool thermometer 88a is transmitted to the control unit 56.

[0042] The mounting head 52 is provided with a tool lifting mechanism 89 that raises and lowers the tool 87. The mounting head 52 is also provided with a pressure sensor 89a that measures the load with which the tool lifting mechanism 89 presses the tool 87, which holds the component 61, against the board 62. The tool lifting mechanism 89 is controlled by the control unit 56, and lowers the tool 87 so that the tool 87 mounts the component 61 on the board 62 with a specified load. The load measured by the pressure sensor 89a is transmitted to the control unit 56.

[0043] The mounting head 52 is provided with an ultrasonic oscillator 90 that ultrasonically vibrates the tool 87. The ultrasonic oscillator 90 is controlled by the control unit 56, and when mounting the component 61 on the board 62 by ultrasonic bonding, the ultrasonic oscillator 90 ultrasonically vibrates the tool 87 at designated ultrasonic power, amplitude, and frequency. The touch panel 5 that is communicably connected to the control unit 56 displays an operation menu and information on the operating status of the component mounting device 50 on its display unit, and data can be input to the control unit 56 and the component mounting device 50 can be operated using operation buttons displayed on the display unit. The touch panel 5 may be a portable terminal or may be a stationary terminal.

[0044] (Configuration of flux transfer device) The flux transfer device 101 transfers flux to an electrode on which a component 61 is mounted on a substrate 62 held on a stage 53. The electrode is a conductor, for example, a land or a pad. The flux transfer device 101 includes a transfer head 1 to which one ends of a plurality of transfer pins 12 are fixed, a head moving unit 54, a head lifting mechanism 58, a head tilt adjustment unit 59 that adjusts the tilt of the transfer head 1, and a flux supply unit 55.

[0045] The transfer head 1 is a member that holds flux on the tips of transfer pins 12 (described later) and transfers the flux onto the surface of a substrate 62. In this specification, the term "flux" may include not only flux alone, but also solder paste containing flux.

[0046] The head moving unit 54 moves the transfer head 1 in the horizontal direction to the mounting position Pa and the retracted position Pb.

[0047] The head lifting mechanism 58 raises and lowers the transfer head 1 relative to the stage 53 and the flux supply unit 55. Therefore, the head lifting mechanism 58 raises and lowers the transfer head 1 in the vertical direction at the mounting position Pa and the retreat position Pb. The head lifting mechanism 58 has a motor that raises and lowers the transfer head 1.

[0048] The head tilt adjustment unit 59 can adjust the tilt of the transfer head 1 independently in the two axial directions by rotating the transfer head 1 about two orthogonal axes. The head tilt adjustment unit 59 has adjustment screws for adjusting the angles about the two axes, and is manually adjusted by the operator.

[0049] The flux supplying unit 55 supplies flux to the transfer head 1. The flux supplying unit 55 may be a container that contains the flux 57.

[0050] The control unit 56 is configured to control the component mounting device 50. The control unit 56 includes a general-purpose processor such as a CPU, MPU, FPGA, DSP, or ASIC that executes a program to realize a predetermined function. The control unit 56 executes a program stored in a storage unit 60 such as a memory or SSD to realize the function. The control unit 56 may be provided as a dedicated unit for the flux transfer device 101, may be used together with the control unit of the component mounting device 50 as in the first embodiment, or may be included in a management device connected by a network. Therefore, the flux transfer device 101 also includes a unit configured as a flux transfer system using the control unit 56 included in another device.

[0051] Next, the movement of the transfer head 1 will be described with reference to Fig. 2 to Fig. 4. Fig. 2 is a side view of the component mounting apparatus in a state where the transfer head 1 is located at the retracted position Pb. Fig. 3 is a side view of the component mounting apparatus in a state where flux is being applied to the transfer pins 12. Fig. 4 is a side view of the component mounting apparatus in a state where the transfer head 1 is located at the mounting position Pa.

[0052] 2, the mounting head 52 is located at the mounting position Pa directly above the board 62 on the stage 53, and therefore the transfer head 1 is located at the retreat position Pb away from the mounting position Pa. Also, as shown in Fig. 3, even if the mounting head 52 is located at a position away from the mounting position Pa, before the component 61 is mounted on the board 62, the transfer head 1 is located at the retreat position Pb and an operation of applying flux to the transfer pins 12 of the transfer head 1 is performed.

[0053] 2 and 3, when the transfer head 1 is located at the retracted position Pb, the head lifting mechanism 58 lowers the transfer head 1 toward the flux supply unit 55. When the tip of the transfer pin 12 comes into contact with the flux 57 supplied by the flux supply unit 55, the flux adheres to the tip of the transfer pin 12.

[0054] 4, the head lifting mechanism 58 lifts the transfer head 1 holding the flux, and the head moving unit 54 moves it above the stage 53 at the mounting position Pa. At the mounting position Pa, the head lifting mechanism 58 lowers the transfer head 1 toward the substrate 62. When the transfer head 1 comes into contact with the substrate 62, the flux is transferred to the substrate 62.

[0055] (Transfer head configuration) The configuration of the transfer head 1 will be described with reference to Figures 5 and 6. Figure 5 is a schematic side view of the transfer head 1, and Figure 6 is a schematic top view of the transfer head 1. In each figure, the transfer pins 12 are shown enlarged and exaggerated for easy understanding.

[0056] 4, the transfer head 1 has a head block 2 and a plurality of transfer pins 12. The head block 2 is a metal block, and is rotatable around the X-axis and the Y-axis by a head tilt adjustment unit 59, and is adjusted so as to be parallel to the stage 53. The plurality of transfer pins 12 each protrude downward from the lower surface 2a of the head block 2 at the same predetermined angle, for example, protruding vertically.

[0057] The transfer pins 12 have a columnar structure. The multiple transfer pins 12 are arranged in a predetermined pattern corresponding to the pattern of each electrode on which the component 61 is mounted on the substrate 62. In Fig. 5 and Fig. 6, the transfer pins 12 are arranged in a matrix of 3 rows and 5 columns as an example, and the transfer head 1 has 15 transfer pins 12, but it may have, for example, 100 transfer pins 12 in 10 rows and 10 columns.

[0058] The shape of the bottom surface 12a of the transfer pin 12 is not limited to a circle, but may be an ellipse or a rectangle. The transfer pin 12 has a diameter and height of, for example, an order of 100 μm. The multiple transfer pins 12 may have the same or different structures. Specifically, the multiple transfer pins 12 may have the same diameter or different diameters. Furthermore, the intervals between the multiple transfer pins 12 may be equal or different. The transfer pins 12 are made of resin or metal, and are made of metal in the above-mentioned diameter.

[0059] (Transfer head tilt detection) Next, a method for detecting the inclination of the transfer head 1 with respect to the stage 53 will be described with reference to Fig. 7 to Fig. 11. Fig. 7 is a side view of the component mounting device 50 showing one step of detecting the inclination of the transfer head 1, and Fig. 8 is a side view of the component mounting device 50 in a state where the transfer pins 12 are in contact with the stage 53. Fig. 9 is a cross-sectional view showing a state where the transfer head 1 is parallel to the stage 53. Fig. 10 is a top view of the stage 53 showing the contact division area 53aa in contact with the transfer pins 12.

[0060] In order to detect the relative inclination between the transfer head 1 and the stage 53, when the operator instructs the control unit 56 via the touch panel 5 to activate a tilt detection mode for the transfer head 1, the control unit 56 retreats the mounting head 52 from the mounting position Pa to the transfer position Pc.

[0061] When the mounting head 52 retreats to the delivery position Pc, the control unit 56 drives and controls the head moving unit 54 to move the transfer head 1 to the mounting position Pa. When the transfer head 1 has finished moving to the mounting position Pa, the head lifting mechanism 58 lowers the transfer head 1 toward the stage 53, as shown in FIG.

[0062] When the transfer head 1 descends to a predetermined flux transfer height, the bottom surface 12a of each transfer pin 12 comes into contact with the stage 53 and presses downward the stage 53. The transfer head 1 and the transfer pins 12 are each electrically conductive.

[0063] 9 and 10, the stage 53 has divided regions 53a. Each divided region 53a has conductivity and is electrically connected to the transfer head 1 and the transfer pin 12 via a conductivity detector 91. An insulator 53b is disposed between adjacent divided regions 53a, and the divided regions 53a are not electrically connected to each other. The insulator 53b may be a gap that serves as an air layer.

[0064] The flux transfer device 101 includes a continuity detection unit 91 that detects whether or not each divided area 53a of the stage 53 is conductive with the transfer pin 12. The continuity detection unit 91 and each divided area 53a are electrically connected to the continuity detection unit 91 through an independent path by, for example, a two-dimensional matrix switching circuit. The continuity detection unit 91 applies a voltage to the transfer head 1 and the divided area 53a and detects whether or not a current flows. The continuity detection unit 91 transmits the detection result of whether or not each divided area 53a is conductive with the transfer pin 12 to the control unit 56.

[0065] In the example shown in FIG. 9, the parallelism between the transfer head 1 and the stage 53 is maintained, and the transfer pin 12 is in contact with the stage 53 perpendicularly. This state is a state in which the transfer head 1 and the transfer pin 12 are not tilted with respect to the stage 53. When the area of ​​the stage 53 is large compared to the area of ​​the transfer head 1, it is sufficient that the parallelism is maintained within the area where the transfer head 1 transfers. Even if the transfer head 1 is slightly tilted, when the tilt of the transfer head 1 with respect to the stage 53 is equal to or less than a predetermined angle, all the divided areas 53a are in a conductive state with the transfer pin 12, as shown in FIG. 10, and become the contact divided areas 53aa. The conduction detection unit 91 transmits this result to the control unit 56, and the tilt determination unit 71 determines that the transfer head 1 is not tilted with respect to the stage 53, including the case where the tilt of the transfer head 1 is equal to or less than a predetermined angle.

[0066] 11, when the transfer head 1 is tilted with respect to the stage 53 at an angle greater than a predetermined angle, it is pressed against the stage 53 in a tilted state, so that, for example, as shown in FIG 12, some divided regions 53a come into contact with the transfer pins 12 and become conductive, becoming contact divided regions 53aa, while other divided regions 53a cannot come into contact with the transfer pins 12 and become non-contact divided regions 53ab in a non-conductive state. A non-contact region 64 containing multiple non-contact divided regions 53ab that cannot become conductive is generated.

[0067] 11 shows the inclination θy of the transfer head 1 and the transfer pin 12 along the Y axis. The angle θy of the transfer pin 12 with respect to the perpendicular line from the stage 53 is the same as the angle θy of the transfer head 1 in the Y axis direction with respect to the stage 53. The inclinations of the transfer head 1 and the transfer pin 12 along the X axis are also of the same magnitude. Therefore, making the transfer head 1 parallel to the stage 53 is the same as correcting the inclination of the transfer pin 12 with respect to the stage 53, and calculating and correcting the inclination of the transfer head 1 is the same as calculating and correcting the inclination of the transfer pin 12.

[0068] When the tilt determination unit 71 of the control unit 56 determines that the calculated tilt of the transfer head 1 with respect to the stage 53 is greater than a predetermined threshold, it displays information that the transfer head 1 is tilted on the touch panel 5. The tilt calculation unit 72 may first calculate the relative tilt angle between the transfer head 1 and the stage 53 based on the detection result of the conduction detection unit 91, and the tilt determination unit 71 may compare this calculation result with a predetermined threshold. Alternatively, the tilt determination unit 71 may compare the number of the contact division regions 53aa or the non-contact division regions 53ab with a predetermined threshold to determine whether the transfer head 1 is tilted with respect to the stage 53. The tilt determination unit 71 can determine that the transfer head 1 is tilted when the number of the contact division regions 53aa is smaller than a predetermined threshold, or when the number of the non-contact division regions ab is greater than a predetermined threshold. The tilt determination unit 71 may also determine whether the transfer head 1 is tilted by matching the distribution pattern of the contact division regions 53aa or the non-contact division regions 53ab with a distribution pattern for a case where the transfer head 1 is not tilted that is prepared in advance.

[0069] Furthermore, the tilt calculation unit 72 calculates the relative tilt state between the transfer head 1 and the stage 53 and the amount of correction for correcting the tilt based on the detection result of the continuity detection unit 91. This amount of correction is an amount that offsets the relative tilt angle between the transfer head 1 and the stage 53. Based on the calculation result, the operator may manually adjust the head tilt adjustment unit 59, or the control unit 56 may drive the stage tilt adjustment unit 81 to automatically adjust the tilt.

[0070] When the control unit 56 automatically adjusts the inclination, the inclination determination unit 71 performs a matching process between a contact pattern, which has a plurality of patterns of the contact division region 53aa prepared in advance, and the pattern of the contact division region 53aa detected by the continuity detection unit 91, and determines which pattern the detected pattern is similar to. The criteria for determining whether or not the detected pattern is similar include, but are not limited to, the presence or absence of the contact division region 53aa. Each contact pattern is associated with the correction angle amount around the X-axis and the Y-axis for correcting the inclination. Therefore, the inclination determination unit 71 may instruct the stage inclination adjustment unit 81 on the correction angle amount for the two axes associated with the most similar pattern.

[0071] Also, instead of the inclination determination unit 71 performing a matching process with a contact pattern prepared in advance, the inclination calculation unit 72 may calculate the inclination angle of the transfer head 1 relative to the stage 53 from the pattern of the contact division regions 53aa detected by the continuity detection unit 91, and instruct the stage inclination adjustment unit 81 on the amount of correction angle to offset this inclination angle. For example, in the case of the pattern of the contact division regions 53aa shown in Fig. 12, with the origin placed at the lower left, the inclination calculation unit 72 can detect that the transfer head 1 is rising in the negative Y-axis direction and the positive X-axis direction by detecting that the contact division regions 53aa no longer exist in the negative Y-axis direction and the positive X-axis direction.

[0072] Furthermore, the inclination calculation unit 72 estimates the gradient of the inclination angle from the pattern of the contact division area 53aa in each axial direction. Therefore, the inclination calculation unit 72 can make the transfer head 1 and the stage 53 parallel by adjusting the angle correction amount according to the pattern of the contact division area 53aa so that the negative direction of the Y axis and the positive direction of the X axis of the stage 53 are brought closer to the transfer head 1. Note that the detection of the inclination of the transfer head 1 by the inclination calculation unit 72 is not limited to the above-mentioned method, and the inclination may be calculated from the divided areas 53a at the four corners based on the pattern of the contact division area 53aa. Also, the inclination calculation unit 72 may detect the inclination of the transfer head 1 based on the pattern of the non-contact division area 53ab instead of detecting the inclination of the transfer head 1 based on the pattern of the contact division area 53aa.

[0073] After the tilt is adjusted manually or automatically, the transfer head 1 is brought into contact with the stage 53 again to detect the tilt state of the transfer head 1 relative to the stage 53, thereby checking whether the tilt has been appropriately corrected and parallelism has been maintained.

[0074] The control unit 56 will be described with reference to Fig. 13. The control unit 56 is communicatively connected to the touch panel 5, the component supply unit movement unit 78, the stage movement unit 80, the stage tilt adjustment unit 81, the mounting head drive mechanism 86, the component heating unit 88, the tool thermometer 88a, the tool lifting mechanism 89, the pressure sensor 89a, the ultrasonic oscillator 90, and the continuity detection unit 91.

[0075] The control unit 56 includes a storage unit 60, a mounting control unit 70, a tilt determination unit 71, and a tilt calculation unit 72. The storage unit 60 stores a contact pattern 66 and a production program 67.

[0076] The mounting control unit 70 controls the operations of the component supply unit movement unit 78 , stage movement unit 80 , stage tilt adjustment unit 81 , mounting head drive mechanism 86 , and tool lift mechanism 89 based on the production program 67 in the storage unit 60 .

[0077] The tilt determination unit 71 determines whether the transfer head 1 is tilted with respect to the stage 53 based on the multiple contact patterns 66 stored in the storage unit 60 and the detection result sent from the continuity detection unit 91 .

[0078] When the tilt determination unit 71 determines that the transfer head 1 is tilted, the tilt calculation unit 72 calculates the amount of tilt and the amount of correction therefor based on the detection result sent from the continuity detection unit 91.

[0079] (Transfer head tilt detection method) Next, a method of determining whether or not the transfer head 1 is inclined with respect to the stage 53 will be described with reference to Figures 7 to 10 and 14. Figure 14 is a flowchart of a method of detecting the inclination of the transfer head.

[0080] When the operator instructs the control unit 56 to activate the inclination detection mode for the transfer head 1, the control unit 56 moves the mounting head 52 to the delivery position Pc, as shown in FIG.

[0081] In step S1, the control unit 56 drives and controls the head moving unit 54 to move the transfer head 1 to the mounting position Pa, and drives and controls the head lifting mechanism 58 to lower the transfer head 1 toward the stage 53. As a result, the transfer pins 12 come into contact with the divided regions 53a of the stage 53.

[0082] In step S2, the continuity detection unit 91 applies a voltage to each divided area 53a of the transfer head 1 and the stage 53 to detect whether or not a current flows. The results of the continuity check for each divided area 53a are sent to the control unit 56. This allows the tilt calculation unit 72 of the control unit 56 to detect the contact divided area 53aa in which continuity is detected as an area in contact with the transfer pin 12, and detect the non-contact divided area 53ab in which continuity is not detected as an area not in contact with the transfer pin 12.

[0083] In step S3, the tilt calculation unit 72 of the control unit 56 calculates the amount of tilt of the transfer head 1 with respect to the stage 53 based on the distribution pattern of the contact divided regions 53aa in which conduction is detected on the stage 53. The tilt calculation unit 72 calculates the amount of tilt of the transfer head 1 in each of the X-axis and Y-axis directions of the stage 53.

[0084] In step S4, the tilt determination unit 71 compares the calculated tilt amount of the transfer head 1 with the threshold values ​​for the tilt amount in the X-axis direction and the Y-axis direction pre-stored in the memory unit 60, and if it determines that the tilt amount in both the X-axis direction and the Y-axis direction is below the threshold value, it determines that the transfer head 1 is not tilted (No in step S4), and the control unit 56 displays on the touch panel 5 that the transfer head 1 and the stage 53 are parallel to notify the operator, and ends the tilt detection mode of the transfer head 1.

[0085] In step S5, if the tilt determination unit 71 determines that the calculated tilt amount is greater than a threshold value in at least either the X-axis direction or the Y-axis direction, it determines that the transfer head 1 is tilted (Yes in step S4), and in step S5, the tilt calculation unit 72 calculates the correction amount for the tilt of the transfer head 1.

[0086] In step S6, the stage tilt adjustment unit 81 adjusts the tilt of the transfer head 1 according to the tilt correction amount instructed by the tilt calculation unit 72, thereby correcting the tilt of the transfer head 1 and making the transfer head 1 parallel to the stage 53. After this, the tilt detection mode of the transfer head 1 is terminated. Note that the tilt correction amount instructed by the tilt calculation unit 72 is a predetermined amount, and the tilt of the transfer head 1 may be corrected stepwise by performing tilt detection again from step S1.

[0087] Next, a first modified example of the flux transfer device 101 of the first embodiment will be described with reference to Figs. 15 and 16. Fig. 15 is a cross-sectional view showing a state in which the transfer head 1 in the first modified example of the first embodiment is tilted with respect to the stage 53. Fig. 16 is a top view of the stage showing an example of a pattern of the pressure sensors 92 on the divided areas with which the transfer pins 12 contact in the first modified example of the first embodiment. In the first modified example of the first embodiment, instead of detecting whether the divided areas 53a of the stage 53 are electrically connected to the transfer pins 12, the pressure sensors 92 are arranged on the divided areas 53a into which the stage 53 is divided. Therefore, the control unit 56 can obtain a distribution pattern of the pressure sensors 92a that contact the transfer pins 12 and detect pressure, and a distribution pattern of the pressure sensors 92b that cannot contact the transfer pins 12 and cannot detect pressure. A non-contact area 64 is generated that includes a plurality of pressure sensors 92b that cannot detect pressure.

[0088] When the tilt determination unit 71 of the control unit 56 determines that the tilt of the transfer head 1 with respect to the stage 53 is greater than a predetermined threshold, it displays information that the transfer head 1 is tilted on the touch panel 5. Furthermore, the tilt calculation unit 72 calculates the relative tilt state between the transfer head 1 and the stage 53 and the amount of correction for correcting the tilt based on the detection results of each pressure sensor 92. Based on this calculation result, the operator may manually adjust the head tilt adjustment unit 59, or the control unit 56 may drive the stage tilt adjustment unit 81 to automatically adjust the tilt.

[0089] When the control unit 56 automatically adjusts the inclination, the inclination determination unit 71 performs a matching process between a contact pattern, of which a plurality of contact patterns are prepared in advance, and the pattern of the pressure sensor 92a from which the pressure was detected, and determines which pattern the pressure was detected from. The inclination determination unit 71 may instruct the stage inclination adjustment unit 81 on the amount of correction angle for the two axes associated with the most similar pattern. Note that the amount of correction for the inclination between the transfer head 1 and the stage 53 may be calculated using other methods.

[0090] Next, a second modified example of the flux transfer device 101 of the first embodiment will be described with reference to Figs. 17 and 18. Fig. 17 is a cross-sectional view showing a state in which the transfer head 1 in the second modified example of the first embodiment is tilted with respect to the stage 53. Fig. 18 is a top view of the stage 53 showing an example of a pattern of the electrodes 94 with which the transfer pins 12 contact in the second modified example of the first embodiment. In the flux transfer device 101 of the first embodiment, the tilt calculation unit 72 detects the tilt of the transfer head 1 based on the distribution pattern of the contact divided area 53aa that is in conduction with the divided area 53a of the stage 53 that is in contact with the transfer pins 12. In the second modified example of the second embodiment, instead of detecting the conduction between the transfer pins 12 and the divided area 53a of the stage 53, the conduction between the transfer pins 12 and the electrodes 94 arranged on the substrate 93 arranged on the stage 53 may be detected to detect the tilt of the transfer pins 12.

[0091] Each electrode 94 printed on the substrate 93 is electrically connected to the continuity detection unit 91 via an individual independent path by, for example, a two-dimensional matrix switching circuit, and detects contact or non-contact between the transfer pin 12 and the electrode 94 based on whether or not each electrode 94 is conductive with the transfer head 1 and the transfer pin 12. The tilt determination unit 71 identifies, from among the electrodes 94, a contact electrode 94a where continuity is detected and which is in contact with the transfer pin 12, and a non-contact electrode 94b where continuity is not detected and which is not in contact with the transfer pin 12.

[0092] The tilt calculation unit 72 calculates the tilt direction and tilt amount of the transfer head 1 based on the distribution pattern of the contact electrodes 94a or the non-contact electrodes 94b. The tilt determination unit 71 determines whether or not the transfer pin 12 is tilted based on the tilt amount calculated by the tilt calculation unit 72. If the tilt determination unit 71 determines that the transfer pin 12 is tilted, the tilt calculation unit 72 calculates the correction amount for correcting the tilt of the transfer pin 12. The correction of the tilt of the transfer pin 12 is performed in the same manner as described above.

[0093] Next, a third modified example of the flux transfer device 101 of the first embodiment will be described. In the flux transfer device 101 of the first modified example of the first embodiment, the inclination of the transfer head 1 is detected based on the detection value of the pressure sensor 92 arranged in the divided area 53a of the stage 53 that contacts the transfer pin 12, but this is not limited to this. Instead of detecting the contact between the transfer pin 12 and the pressure sensor 92 arranged on the stage 53, the inclination of the transfer pin 12 may be detected by detecting the distance between the transfer pin 12 and each divided area 53a of the stage 53.

[0094] For example, a proximity sensor 95 may be disposed on each divided area 53a of the stage 53 instead of the pressure sensor 92. The proximity sensor 95 is, for example, a capacitance sensor that detects distance by electrostatic capacitance. This allows the distance between each transfer pin 12 that has descended directly above each divided area 53a and each divided area 53a to be detected. The tilt calculation unit 72 calculates the tilt direction and tilt amount of the transfer head 1 based on the detected distance from each divided area 53a to the transfer pin 12. The tilt determination unit 71 determines whether the transfer pin 12 is tilted or not based on the tilt amount calculated by the tilt calculation unit 72. When the tilt determination unit 71 determines that the transfer pin 12 is tilted, the tilt calculation unit 72 calculates the correction amount for correcting the tilt of the transfer pin 12 (transfer head 1). The tilt of the transfer pin 12 is corrected in the same manner as described above. The proximity sensor 95 may have a coil, and may generate a high-frequency magnetic field from the coil to detect the transfer pin 12 approaching the stage 53 and the proximity sensor 95. In this case, the transfer pin 12 is made of metal.

[0095] (effect) As described above, the flux transfer device 101 of the first embodiment includes the transfer head 1 having a plurality of transfer pins 12 for transferring the flux 57 to the substrate 62 on which the component 61 is to be mounted, the head lifting mechanism 58 for lifting and lowering the transfer head 1, the stage 53 arranged in a direction in which the transfer head 1 is lowered by the head lifting mechanism 58, and a detection unit for detecting contact or non-contact between each divided area 53a of the stage 53 or a plurality of electrodes of the substrate placed on the stage 53 and the transfer pins 12, or detecting the distance between each divided area of ​​the stage 53 divided into a plurality of areas and the transfer pins. The detection unit may include, for example, a continuity detection unit 91, or a pressure sensor 92 and an inclination determination unit 71, or may include a proximity sensor 95. Note that the flux transfer device 101 may transfer other liquids such as water, solder cream, molten solder, silver paste, mold, molten plastic, or adhesive, in addition to the flux 57 as the liquid to be transferred to the substrate 62 on the stage 53.

[0096] Moreover, the flux transfer method of the first embodiment is a flux transfer method using a transfer head 1 having a plurality of transfer pins 12 for transferring flux 57 to a substrate 62 on which a component 61 is to be mounted. The flux transfer method includes a lowering step in which a head elevating mechanism 58 lowers the transfer head 1 toward a stage 53, and a detection step in which a detection unit detects contact or non-contact between each divided region 53a of the stage 53 divided into a plurality of regions, or between each of a plurality of electrodes 94 of a substrate 93 placed on the stage 53, and the transfer pins 12, or detects a distance between each divided region 53a of the stage 53 divided into a plurality of regions and the transfer pins 12.

[0097] By the detection unit detecting contact or non-contact between the transfer pins 12 and each divided area 53a of the stage 53 or multiple electrodes 94 of the substrate 93 placed on the stage 53, or detecting the distance between each divided area 53a of the stage 53 and the transfer pins 12, it is possible to know the distribution of contact or non-contact between the transfer pins 12 and the electrodes 94 of the stage 53 or the substrate 93, or the distribution of distance between the transfer pins 12 and the stage 53, and it is possible to assist in adjusting the inclination between the transfer object with which the transfer pins 12 come into contact and the transfer head 1.

[0098] In addition, the pressure sensor 92 and the inclination determination unit 71 may detect contact or non-contact between each divided area 53a of the stage 53 and the transfer pin 12, and the proximity sensor and the inclination determination unit 71 may detect the distance between each divided area 53a of the stage 53, which is divided into multiple areas, and the transfer pin 12.

[0099] In addition, the flux transfer device 101 further includes an inclination determination unit 71 that determines whether or not the transfer pin 12 is inclined based on the result of the detection unit, and can therefore notify the operator of the determination result as to whether or not the transfer pin 12 is inclined.

[0100] Moreover, since the flux transfer device 101 further includes an inclination calculation unit 72 that calculates a correction amount for correcting the inclination of the transfer pin 12 based on the result of the detection unit, the correction amount of the transfer pin 12 can be recognized.

[0101] Furthermore, the tilt calculation unit 72 calculates the direction and amount of tilt of the transfer pin 12, and calculates a tilt correction amount for correcting the tilt of the transfer pin 12 based on the direction and amount of tilt of the transfer pin 12. Since the direction and amount of tilt of the transfer pin 12 are calculated and the amount of tilt correction is calculated based on these, the operator can manually correct the tilt of the transfer pin 12 using the head tilt adjustment unit 59, or the control unit 56 can drive the stage tilt adjustment unit 81 to automatically correct it. This allows the stage 53 and the transfer head 1 to be appropriately parallel.

[0102] When the head lift mechanism 58 lowers the transfer head 1 by a predetermined distance, if the detection unit detects that a predetermined percentage or more of the divided areas 53a contact the transfer pins 12, the tilt determination unit 71 determines that the transfer pins 12 are not tilted. The predetermined percentage is, for example, 90%. When the transfer pin 12 and the divided area 53a are in contact with each other at a predetermined rate or more, the parallelism between the transfer head 1 and the stage is maintained with high precision, so even if there is a non-contact divided area 53ab that is not in contact with the transfer pin 12, the gap between this non-contact divided area 53ab and the transfer pin 12 is small. Therefore, during flux transfer, the flux can be transferred to the non-contact divided area 53ab as well due to the thickness of the flux attached to the lower end of the transfer pin 12.

[0103] The transfer pin 12 is conductive, and the detection unit detects whether or not the transfer pin 12 has come into contact with each divided area 53a of the stage 53 or each electrode 94 of the substrate 93 by electrical conduction obtained by contact between the transfer pin 12 and each divided area 53a of the stage 53 or each electrode 94 of the substrate 93. Contact or non-contact between the transfer pin 12 and the stage 53 can be detected with high accuracy by the electrical conduction.

[0104] Furthermore, by being equipped with the flux transfer device 101, the component mounting apparatus 50 can determine whether the transfer head 1 is tilted with respect to the stage 53 while mounting of the component 61 on the substrate 62 is stopped, and can confirm whether the flux transfer is being performed properly.

[0105] [Embodiment 2] Next, a flux transfer device 101 and a component mounting device 50 according to the second embodiment will be described. In the flux transfer device 101 according to the first embodiment, the transfer pin 12 is brought close to the pressure sensor 92 or the proximity sensor 95 arranged directly or on the divided region 53a of the stage 53, but in the second embodiment, the transfer pin 12 is brought close to a rod or a distance sensor instead of the stage 53. Since the configurations other than this and the points described below are common to the first and second embodiments, the description thereof will be omitted.

[0106] A method for adjusting the inclination of the transfer head 1 by the flux transfer device 101 of the second embodiment will be described with reference to Fig. 19 and Fig. 20. Fig. 19 and Fig. 20 are explanatory diagrams for explaining detection of the inclination of the transfer pin of the flux transfer device according to the second embodiment.

[0107] The flux transfer device 101 of the second embodiment includes a rod 96 extending perpendicularly to a horizontal plane, and a stage 97 for moving the rod 96 along the horizontal plane. The stage 97 includes, for example, a rail 97a extending in the Y-axis direction, a rail 97b extending in the X-axis direction and movable along the rail 97a, a table 97c movable along the rail 97b, and a motor for driving the rail 97b and the table 97c. The rod 96 is fixed to the table 97c.

[0108] The control unit 56 controls the head lifting mechanism 58 to lower the transfer head 1 toward the stage 97. When the bottom surface of at least one of the multiple transfer pins 12 of the transfer head 1 comes into contact with the rod 96, the transfer head 1 stops moving downward. The head lifting mechanism 58 includes a pressure sensor similar to the pressure sensor 89a of the tool lifting mechanism 89 of the mounting head 52. When the transfer pin 12 comes into contact with the rod 96, this pressure sensor detects the pressure from the rod 96, and it is possible to detect that the transfer pin 12 has come into contact with the rod 96. The control unit 56 can calculate the amount of descent of the transfer head 1 from a predetermined height based on the amount of drive of the motor of the head lifting mechanism 58 from a predetermined height of the transfer head 1. Therefore, the height of the transfer head 1 can be detected.

[0109] In this way, by bringing each transfer pin 12 into contact with the rod 96 and detecting the height at which each transfer pin 12 comes into contact with the rod 96, the tilt direction and amount of tilt of the transfer head 1 and transfer pin 12 can be detected.

[0110] Next, a modified example of the flux transfer device 101 according to the second embodiment will be described with reference to Fig. 21 and Fig. 22. Fig. 21 and Fig. 22 are explanatory diagrams for explaining detection of the inclination of the transfer pin 12 in the modified example of the flux transfer device 101 according to the second embodiment.

[0111] In a modification of the second embodiment, a laser range finder 98 is moved in the horizontal plane instead of the rod 96 to detect the distance to each transfer pin 12.

[0112] The flux transfer device 101 in the modified example of the second embodiment includes a laser distance meter 98 that measures a distance in a direction perpendicular to a horizontal plane, and a stage 97 that moves the laser distance meter 98 along the horizontal plane. The laser distance meter 98 is fixed to a table 97c. The laser distance meter 98 is, for example, a multi-color laser coaxial displacement meter.

[0113] The control unit 56 controls the head lifting mechanism 58 to lower the transfer head 1 toward the stage 97 and stop it at a predetermined height. Since the stage 97 is installed at a predetermined height, the height of the bottom surface of each transfer pin 12 can be detected by the laser range finder 98 measuring the distance to the bottom surface of each transfer pin 12. In this way, by detecting the height of each transfer pin 12, the tilt direction and tilt amount of the transfer head 1 and transfer pin 12 can be detected.

[0114] (effect) As described above, the flux transfer device 101 of the second embodiment includes the transfer head 1 having a plurality of transfer pins 12 for transferring the flux 57 to the substrate 62 on which the component 61 is to be mounted, and the head lifting mechanism 58 for lifting the transfer head 1. The flux transfer device 101 further includes the head lifting mechanism 58 and the control unit 56 for detecting the height of the tip of each of the transfer pins 12 when the plurality of transfer pins 12 are brought into contact with a rod that is disposed in the direction in which the transfer head 1 is lowered by the head lifting mechanism 58 and is movable in a horizontal plane perpendicular to the lowering direction, or a laser distance meter 98 for detecting the distance between the plurality of transfer pins 12 of the transfer head 1 that is lowered to a predetermined height and the transfer pins 12 that are disposed in the direction in which the transfer head 1 is lowered by the head lifting mechanism 58 and is movable in a horizontal plane perpendicular to the lowering direction.

[0115] The flux transfer method of the second embodiment is a flux transfer method using a transfer head 1 having a plurality of transfer pins 12 for transferring flux 57 to a substrate 62 on which a component 61 is to be mounted. The flux transfer method includes a lowering step in which a head lifting mechanism 58 lowers the transfer head 1 toward a stage 97, and a detection step in which a detector detects the height of a tip of each of the transfer pins 12 when the detector brings the plurality of transfer pins 12 into contact with a rod 96 arranged in a direction in which the transfer head 1 is lowered by the head lifting mechanism 58 and movable within a horizontal plane perpendicular to the lowering direction, or detects the distance between the transfer head 1 arranged in a direction in which the transfer head 1 is lowered by the head lifting mechanism 58, movable within a horizontal plane perpendicular to the lowering direction, and the plurality of transfer pins 12 lowered to a predetermined height.

[0116] By the detection unit detecting the height of the tip of the transfer pin 12 or the distance to the transfer pin 12, the height distribution of the transfer pins 12 can be known, and the inclination adjustment of the transfer pins 12 and the transfer head 1 can be assisted.

[0117] Although the present disclosure has been fully described in connection with the preferred embodiments with reference to the accompanying drawings, various modifications and alterations will be apparent to those skilled in the art. Such modifications and alterations should be understood to be included within the scope of the present disclosure as defined by the appended claims, unless they deviate from the scope of the present disclosure. In addition, changes in the combination and order of elements in each embodiment may be made without departing from the scope and spirit of the present disclosure.

[0118] Any of the various embodiments and modifications described above may be appropriately combined to achieve the effects of each of them. [Industrial Applicability]

[0119] The transfer apparatus, component mounting apparatus, and transfer method according to the present disclosure are applicable to a transfer apparatus and component mounting apparatus that transfer a liquid such as flux onto a substrate. [Explanation of symbols]

[0120] 1 Transfer head 2 Head Block 2a Bottom side 4 Foundation 5. Touch Panel 12 Transfer pin 12a Bottom 50 Component mounting equipment 51 Parts Supply Department 52 Mounting head 53 Stages 53a Split area 53aa contact split area 53ab Non-contact split area 53b Insulators 54 Head movement part 55 Flux Supply Unit 56 Control section 57 Flux 58 Head lift mechanism 59 Head tilt adjustment unit 60 Storage section 61 parts 62 Substrate 64, 64A non-contact area 65 droplets 65a, 65b droplet 65d area 66 Contact Patterns 67 Production Program 70 Mounting control section 71 Inclination determination section 72 Slope calculation section 73 Transfer head lift amount calculation unit 78 Parts Supply Section Moving Section 80 Stage movement part 81 Stage tilt adjustment part 83 Pickup Head 86 Mounting head drive mechanism 87 Tools 88 Parts heating section 88a Tool Thermometer 89 Tool lifting mechanism 89a Pressure Sensor 90 Ultrasonic Oscillator 91 Continuity detection unit 92 Pressure Sensor 92a Pressure sensor detecting pressure 92b Pressure sensor not detecting pressure 93 Substrate 94 electrode 95 Proximity Sensor 96 Rod 97 Stage 97a, 97b rails 97c Table 98 Laser rangefinder 101 Flux transfer device Pa Mounting position Pb evacuation position PC delivery position

Claims

1. A transfer head including a plurality of transfer pins for transferring liquid to a workpiece on which a component is to be mounted; a lifting mechanism for lifting and lowering the transfer head; a stage disposed in a direction in which the transfer head is lowered by the lifting mechanism; Detecting contact or non-contact between the transfer pins and each divided region of the stage or a plurality of electrodes of a substrate placed on the stage; or a detection unit that detects a distance between each of the divided areas of the stage, the divided areas being separated into a plurality of areas, and the transfer pin; Transcription device.

2. The present invention further includes an inclination determination unit that determines whether the transfer pin is inclined or not based on the result of the detection unit. The transfer device according to claim 1 .

3. The tilt calculation unit further includes a tilt calculation unit that calculates a correction amount for correcting the tilt of the transfer pin based on the result of the detection unit. The transfer device according to claim 2 .

4. the tilt calculation unit calculates a tilt direction and a tilt amount of the transfer head, and calculates a tilt correction amount for correcting the tilt of the transfer pin based on the tilt direction and the tilt amount of the transfer head; The transfer device according to claim 3 .

5. When the lifting mechanism lowers the transfer head by a predetermined distance, if the detection unit detects that a predetermined ratio or more of the divided areas are in contact with the transfer pins, the tilt determination unit determines that the transfer pins are not tilted. The transfer device according to claim 2 .

6. The transfer pin is conductive, the detection unit detects whether or not the transfer pin has come into contact with each divided region of the stage or each electrode of the substrate based on electrical conduction obtained by contact between the transfer pin and each conductive divided region of the stage or each electrode of the substrate. The transfer device according to claim 1 .

7. A transfer head including a plurality of transfer pins for transferring liquid to a workpiece on which a component is to be mounted; a lifting mechanism for lifting and lowering the transfer head; The transfer head is disposed in a direction in which the lifting mechanism moves downward, and a rod movable within a plane perpendicular to the direction of descent is brought into contact with each of the transfer pins to detect the height of the tip of each of the transfer pins; or a detection unit that is disposed in a direction in which the transfer head is lowered by the lifting mechanism, is movable within a plane perpendicular to the direction of the lowering, and detects distances between the transfer head lowered to a predetermined height and the multiple transfer pins; Transcription device.

8. A component mounting apparatus comprising the transfer device according to any one of claims 1 to 7.

9. A transfer method using a transfer head having a plurality of transfer pins for transferring liquid to a workpiece on which a component is to be mounted, comprising: a lowering step in which an elevation mechanism lowers the transfer head toward a stage; The detection unit is Detecting contact or non-contact between the transfer pin and each of a plurality of regions of the stage, or a plurality of electrodes of a substrate placed on the stage; or a detection step of detecting a distance between each divided area of ​​the stage, the area being divided into a plurality of areas, and the transfer pin; Transfer method.

10. and determining whether the transfer pin is tilted based on a result of the detection unit. The transfer method according to claim 9 .

11. and calculating a correction amount for correcting the inclination of the transfer pin based on the result of the detection by the detection unit. The transfer method according to claim 10.

12. the calculation step includes calculating a tilt direction and a tilt amount of the transfer head, and calculating a tilt correction amount for correcting the tilt of the transfer pin based on the tilt direction and the tilt amount of the transfer head; The transfer method according to claim 11.

13. When the transfer head is lowered a predetermined distance by the lifting mechanism, if the detection step detects contact between the divided areas and the transfer pins at a predetermined rate or more, the determination step determines that the transfer pins are not tilted. The transfer method according to claim 10.

14. The transfer pin is conductive, the detection step detects whether the transfer pin has come into contact with any region of the stage or any electrode of the substrate based on electrical conduction obtained by contact of the transfer pin with any region of the stage having electrical conductivity or any electrode of the substrate; The transfer method according to claim 9 .

15. A flux transfer method using a transfer head having a plurality of transfer pins for transferring flux to a workpiece on which components are to be mounted, comprising: a lowering step in which an elevation mechanism lowers the transfer head toward a stage; The detection unit is The transfer head is disposed in a direction in which the lifting mechanism moves downward, and a rod movable within a plane perpendicular to the direction of descent is brought into contact with each of the transfer pins to detect the height of the tip of each of the transfer pins; or a detection step of detecting a distance between the transfer head lowered to a predetermined height and the plurality of transfer pins, the transfer head being disposed in a direction in which the transfer head is lowered by the lifting mechanism and movable within a plane perpendicular to the direction of the lowering, Transfer method.

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