Multilayer electronic component

Abstract

To provide a multilayer electronic component with improved bending strength characteristics and moisture resistance reliability.SOLUTION: A multilayer electronic component according to an embodiment of the present invention includes a body 110 including dielectric layers and internal electrodes 121, 122, and external electrodes 131, 132 including electrode layers 131a, 132a disposed on the body and connected to the internal electrodes and plating layers 131c, 132c, 131d, 132d disposed on the electrode layers. In the external electrodes, the electrode layers include connection electrode layers 131a-1, 132a-1 including copper (Cu) and glass, band electrode layers 131a-2, 132a-2 including silver (Ag) and glass, and conductive resin layers 131b, 132b including a conductive metal and a resin and disposed between the band electrode layers and the plating layers.SELECTED DRAWING: Figure 2

Description

[Technical field]

[0001] The present invention relates to a multilayer electronic component. [Background technology]

[0002] Multi-layered ceramic capacitors (MLCCs), which are one type of multi-layered electronic component, are chip-type capacitors that are mounted on printed circuit boards of various electronic products such as visual devices such as liquid crystal displays (LCDs) and plasma display panels (PDPs), computers, smartphones, and mobile phones, and serve to charge and discharge electricity.

[0003] Such multilayer ceramic capacitors have the advantages of being small, having high capacitance, and being easy to mount, and can be used as components of various electronic devices. As various electronic devices such as computers and mobile devices become smaller and have higher output, there is an increasing demand for multilayer ceramic capacitors to be smaller and have higher capacitance.

[0004] Recently, multilayer electronic components are used in various environments, and research is being conducted to improve the lifespan characteristics in harsh environments. In particular, there is an increasing need for robust designs that are resistant to external impacts, but even in such robust designs, it is necessary to strengthen the bending strength. To this end, epoxy is added to the external electrodes to improve bending strength characteristics, but epoxy is easily permeated by moisture from the outside, which conflicts with the goal of improving moisture resistance reliability, and it is necessary to apply an appropriate structure and material to solve this problem. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] Korean Patent Publication No. 10-2022-0163610 Summary of the Invention [Problem to be solved by the invention]

[0006] One of the various problems that the present invention aims to solve is to provide a multilayer electronic component having improved bending strength characteristics.

[0007] One of the various problems that the present invention aims to solve is to provide a multilayer electronic component having improved moisture resistance reliability.

[0008] However, the various problems to be solved by the present invention are not limited to the above-mentioned contents, and can be more easily understood in the course of describing specific embodiments of the present invention. [Means for solving the problem]

[0009] A multilayer electronic component according to an embodiment of the present invention includes a main body including dielectric layers and internal electrodes alternately arranged with the dielectric layers in a first direction, the main body including first and second surfaces facing each other in the first direction, third and fourth surfaces connected to the first and second surfaces and facing each other in a second direction, and fifth and sixth surfaces connected to the first to fourth surfaces and facing each other in a third direction, and an external electrode including an electrode layer disposed on the main body and connected to the internal electrodes, and a plating layer disposed on the electrode layer, the electrode layer including a connection electrode layer disposed on the third and fourth surfaces and including copper (Cu) and glass, and a band electrode layer in contact with the connection electrode layer and disposed on a portion of the first and second surfaces and including silver (Ag) and glass, and the external electrode may further include a conductive resin layer disposed between the band electrode layer and the plating layer, and including a conductive metal and a resin.

[0010] According to another embodiment of the present invention, there is provided a multilayer electronic component including: a main body including dielectric layers and internal electrodes alternately arranged with the dielectric layers in a first direction, the main body including first and second surfaces facing each other in the first direction, third and fourth surfaces connected to the first and second surfaces and facing each other in a second direction, and fifth and sixth surfaces connected to the first to fourth surfaces and facing each other in a third direction; and an external electrode including an electrode layer disposed on the main body and connected to the internal electrodes, and a plating layer disposed on the electrode layer, the electrode layer including a connection electrode layer disposed on the third and fourth surfaces and including a first conductive metal and glass, and a band electrode layer in contact with the connection electrode layer and disposed on a portion of the first and second surfaces and including a second conductive metal and glass, and the external electrode may further include a conductive resin layer disposed between the band electrode layer and the plating layer and including a third conductive metal and resin. Effect of the Invention

[0011] One of the various effects of the present invention is to improve the bending strength characteristics of a multilayer electronic component.

[0012] One of the various effects of the present invention is to improve the moisture resistance reliability of a multilayer electronic component.

[0013] However, the various and beneficial advantages and effects of the present invention are not limited to the above, and can be more easily understood in the course of describing specific embodiments of the present invention. [Brief description of the drawings]

[0014] [Figure 1] 1 is a schematic perspective view of a multilayer electronic component according to an embodiment of the present invention; [Diagram 2] 2 is a schematic cross-sectional view taken along line II' of FIG. 1. [Diagram 3] 2 is a schematic cross-sectional view taken along line II-II' of FIG. 1. [Figure 4] 3 is a schematic diagram showing an enlarged view of region M in FIG. 2. [Diagram 5]2 is a schematic cross-sectional view of a multilayer electronic component according to another embodiment of the present invention, taken along the same line as II' in FIG. 1. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0015] Hereinafter, the embodiments of the present invention will be described with reference to specific embodiments and the accompanying drawings. However, the embodiments of the present invention can be modified into various other forms, and the scope of the present invention is not limited to the embodiments described below. Furthermore, the embodiments of the present invention are provided to more completely explain the present invention to ordinary skilled artisans. Therefore, the shapes and sizes of elements in the drawings may be enlarged or reduced (or highlighted or simplified) for clearer explanation, and elements indicated by the same reference numerals in the drawings are the same elements.

[0016] In order to clearly explain the present invention in the drawings, parts that are not relevant to the explanation are omitted, and the size and thickness of each component shown in the drawings are arbitrarily shown for convenience of explanation, so the present invention is not necessarily limited to those shown in the drawings. Also, components having the same function within the same concept will be described using the same reference numerals. Furthermore, throughout the specification, when a part "includes" a certain component, this does not mean that other components are excluded, but that the part may further include other components, unless otherwise specified to the contrary.

[0017] In the drawings, the first direction may be defined as a stacking direction or a thickness T direction, the second direction may be defined as a length L direction, and the third direction may be defined as a width W direction.

[0018] Multilayer Electronic Components FIG. 1 is a schematic perspective view of a multilayer electronic component according to one embodiment of the present invention, FIG. 2 is a schematic cross-sectional view taken along line I-I' in FIG. 1, FIG. 3 is a schematic cross-sectional view taken along line II-II' in FIG. 1, FIG. 4 is a schematic enlarged view of region M in FIG. 2, and FIG. 5 is a schematic cross-sectional view of the same cross section as I-I' in FIG. 1 in a multilayer electronic component according to another embodiment of the present invention.

[0019] Hereinafter, a multilayer electronic component according to an embodiment of the present invention will be described in detail with reference to Figures 1 to 5. Although a multilayer ceramic capacitor will be described as an example of a multilayer electronic component, the present invention can also be applied to various electronic products using a dielectric composition, such as an inductor, a piezoelectric element, a varistor, or a thermistor.

[0020] The multilayer electronic component 100 according to an embodiment of the present invention includes a body 110 including a dielectric layer 111 and internal electrodes 121, 122 alternately arranged with the dielectric layer 111 in a first direction, the body 110 including first and second surfaces 1, 2 facing each other in the first direction, third and fourth surfaces 3, 4 connected to the first and second surfaces 1, 2 and facing each other in the second direction, and fifth and sixth surfaces 5, 6 connected to the first to fourth surfaces 1, 2, 3, 4 and facing each other in the third direction, electrode layers 131a, 132a arranged on the body 110 and connected to the internal electrodes 121, 122, and a metal layer 131b, 132c arranged on the electrode layers 131a, 132a. and external electrodes 131, 132 including plating layers, the electrode layers 131a, 132a including connection electrode layers 131a-1, 132a-1 arranged on the third and fourth surfaces 3, 4 and including copper (Cu) and glass, and band electrode layers 131a-2, 132a-2 in contact with the connection electrode layers 131a-1, 132a-1 and arranged on parts of the first and second surfaces 1, 2 and including silver (Ag) and glass, and the external electrodes 131, 132 may further include conductive resin layers 131b, 132b arranged between the band electrode layers 131a-2, 132a-2 and the plating layers and including a conductive metal and a resin.

[0021] The body 110 may have dielectric layers 111 and internal electrodes 121 and 122 stacked alternately.

[0022] More specifically, the body 110 may include a capacitance forming portion Ac that is disposed inside the body 110 and includes first internal electrodes 121 and second internal electrodes 122 that are alternately arranged facing each other across the dielectric layer 111 to form a capacitance.

[0023] Although there is no particular limitation on the specific shape of the body 110, as shown in the drawing, the body 110 may have a hexahedral shape or a shape similar thereto. Due to shrinkage of ceramic particles contained in the body 110 during the firing process, the body 110 may have a substantially hexahedral shape, although not a hexahedral shape with perfectly straight lines.

[0024] The main body 110 may have first and second surfaces 1, 2 facing each other in a first direction, third and fourth surfaces 3, 4 connected to the first and second surfaces 1, 2 and facing each other in the second direction, and fifth and sixth surfaces 5, 6 connected to the first to fourth surfaces 1, 2, 3, 4 and facing each other in the third direction.

[0025] The multiple dielectric layers 111 forming the body 110 are in a fired state, and the boundaries between adjacent dielectric layers 111 may be integrated to an extent that is difficult to see without using a scanning electron microscope (SEM).

[0026] The raw material for forming the dielectric layer 111 is not limited as long as a sufficient capacitance can be obtained. In general, a perovskite (ABO3)-based material can be used, such as a barium titanate-based material, a lead complex perovskite-based material, or a strontium titanate-based material. The barium titanate-based material can include BaTiO3-based ceramic particles, and examples of the ceramic particles include BaTiO3, BaTiO3 partially solid-dissolved with Ca (calcium), Zr (zirconium), etc. 1-x Ca x )TiO3(0 <x<1)、Ba(Ti1-y Ca y )O3 (0 < y < 1), (Ba 1-x Ca x )(Ti 1-y Zr y )O3 (0 < x < 1, 0 < y < 1) or Ba(Ti 1-y Zr y )O3 (0 < y < 1), etc. can be mentioned.

[0027] Also, various ceramic additives, organic solvents, binders, dispersants, etc. can be added to particles such as barium titanate (BaTiO3) as raw materials for forming the dielectric layer 111 according to the object of the present invention.

[0028] The thickness td of the dielectric layer 111 does not need to be particularly limited. However, in order to achieve high capacitance of the multilayer electronic component, the thickness of the dielectric layer 111 can be 3.0 μm or less. In order to more easily achieve miniaturization and high capacitance of the multilayer electronic component, the thickness of the dielectric layer 111 can be 1.0 μm or less, preferably 0.6 μm or less, and more preferably 0.4 μm or less.

[0029] Here, the thickness td of the dielectric layer 111 can mean the thickness td of the dielectric layer 111 disposed between the first and second internal electrodes 121 and 122.

[0030] On the other hand, the thickness td of the dielectric layer 111 can mean the size of the dielectric layer 111 in the first direction. Also, the thickness td of the dielectric layer 111 can mean the average thickness td of the dielectric layer 111, and can mean the average size of the dielectric layer 111 in the first direction.

[0031] The average size in the first direction of the dielectric layer 111 may be measured by scanning an image of a cross-section of the body 110 in the first and second directions using a scanning electron microscope (SEM) with a magnification of 10,000. More specifically, the average size in the first direction of one dielectric layer 111 may mean an average value calculated by measuring the size in the first direction at 30 equally spaced points in the second direction of one dielectric layer 111 in the scanned image. The 30 equally spaced points may be designated as the capacitance forming portion Ac. Furthermore, if the measurement of the average value is extended to 10 dielectric layers 111, the average size in the first direction of the dielectric layer 111 can be further generalized.

[0032] The internal electrodes 121, 122 may be laminated alternately with the dielectric layer 111. The internal electrodes 121, 122 may include a first internal electrode 121 and a second internal electrode 122, and the first and second internal electrodes 121, 122 may be alternately arranged to face each other with the dielectric layer 111 constituting the main body 110 therebetween, and may be exposed to third and fourth surfaces 3, 4 of the main body 110, respectively.

[0033] More specifically, the first internal electrode 121 may be spaced apart from the fourth surface 4 and exposed through the third surface 3, and the second internal electrode 122 may be spaced apart from the third surface 3 and exposed through the fourth surface 4. A first external electrode 131 may be disposed on the third surface 3 of the body 110 and connected to the first internal electrode 121, and a second external electrode 132 may be disposed on the fourth surface 4 of the body 110 and connected to the second internal electrode 122.

[0034] That is, the first internal electrode 121 may be connected to the first external electrode 131 without being connected to the second external electrode 132, and the second internal electrode 122 may be connected to the second external electrode 132 without being connected to the first external electrode 131. At this time, the first and second internal electrodes 121 and 122 may be electrically isolated from each other by the dielectric layer 111 disposed therebetween.

[0035] Meanwhile, the body 110 may be formed by alternately stacking ceramic green sheets on which the first internal electrodes 121 are printed and ceramic green sheets on which the second internal electrodes 122 are printed, and then firing the stacked ceramic green sheets.

[0036] There is no particular limitation on the material forming the internal electrodes 121 and 122, and any material having excellent electrical conductivity can be used. For example, the internal electrodes 121 and 122 can include one or more of nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti), and alloys thereof.

[0037] The internal electrodes 121 and 122 may be formed by printing a conductive paste for internal electrodes, which includes at least one of nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti), and alloys thereof, on the ceramic green sheet. The method for printing the conductive paste for internal electrodes may be a screen printing method or a gravure printing method, but the present invention is not limited thereto.

[0038] On the other hand, the thickness te of the internal electrodes 121, 122 does not need to be particularly limited. However, in order to achieve a high capacity of the multilayer electronic component, the thickness of the internal electrodes 121, 122 can be 1.0 μm or less, and in order to more easily achieve a small size and high capacity of the multilayer electronic component, the thickness of the internal electrodes 121, 122 can be 0.6 μm or less, and more preferably 0.4 μm or less.

[0039] Here, the thickness te of the internal electrodes 121, 122 may refer to the size of the internal electrodes 121, 122 in the first direction. In addition, the thickness te of the internal electrodes 121, 122 may refer to the average thickness te of the internal electrodes 121, 122, or may refer to the average size of the internal electrodes 121, 122 in the first direction.

[0040] The first-direction average size of the internal electrodes 121 and 122 can be measured by scanning the cross-sections of the main body 110 in the first and second directions with a scanning electron microscope (SEM) at a magnification of 10,000 times. More specifically, the first-direction average size of one internal electrode can be the average value calculated by measuring the first-direction size at 30 equally spaced points in the second direction for one internal electrode in the scanned image. The 30 equally spaced points can be specified in the capacitance forming portion Ac. Also, when the measurement of such an average value is extended to 10 internal electrodes, the first-direction average size of the internal electrodes can be further generalized.

[0041] On the other hand, in one embodiment of the present invention, the average thickness td of at least one of the plurality of dielectric layers 111 and the average thickness te of at least one of the plurality of internal electrodes 121 and 122 can satisfy 2×te < td.

[0042] In other words, the average thickness td of one dielectric layer 111 can be even greater than twice the average thickness te of one internal electrode 121 or 122. Preferably, the average thickness td of the plurality of dielectric layers 111 can be even greater than twice the average thickness te of the plurality of internal electrodes 121 and 122.

[0043] Generally, for high-voltage electrical equipment electronic components, the main issue is the reliability problem due to the decrease in the breakdown voltage (BDV) in a high-voltage environment.

[0044] Therefore, in order to prevent the decrease in the breakdown voltage in a high-voltage environment, by making the average thickness td of the dielectric layer 111 even greater than twice the average thickness te of the internal electrodes 121 and 122, the thickness of the dielectric layer, which is the distance between the internal electrodes, can be increased, and the breakdown voltage characteristics can be improved.

[0045] If the average thickness td of the dielectric layer 111 is less than twice the average thickness te of the internal electrodes 121, 122, the average thickness of the dielectric layer, which is the distance between the internal electrodes, will be small, and the breakdown voltage may decrease, possibly causing a short circuit between the internal electrodes.

[0046] In high-voltage electronic components, the average thickness te of the internal electrodes can be 1 μm or less, and the average thickness td of the dielectric layers can be 3.0 μm or less, but are not necessarily limited thereto.

[0047] Meanwhile, the body 110 may include cover parts 112 and 113 disposed on both end surfaces in the first direction of the capacitance forming part Ac.

[0048] Specifically, it may include a first cover part 112 arranged on one side of the capacitance forming part Ac in the first direction and a second cover part 113 arranged on the other side of the capacitance forming part Ac in the first direction, and more specifically, it may include an upper cover part 112 arranged on the upper part of the capacitance forming part Ac in the first direction and a lower cover part 113 arranged on the lower part of the capacitance forming part Ac in the first direction.

[0049] The upper cover part 112 and the lower cover part 113 may be formed by stacking a single dielectric layer 111 or two or more dielectric layers 111 in a first direction on the upper and lower surfaces of the capacitance forming part Ac, respectively, and may basically serve to prevent damage to the internal electrodes 121, 122 due to physical or chemical stress.

[0050] The upper cover part 112 and the lower cover part 113 do not include the internal electrodes 121, 122, and may include the same material as the dielectric layer 111. That is, the upper cover part 112 and the lower cover part 113 may include a ceramic material, for example, a barium titanate (BaTiO3)-based ceramic material.

[0051] On the other hand, the thickness tc of the covers 112 and 113 does not need to be particularly limited. However, in order to more easily achieve miniaturization and high capacity of the laminated electronic component, the thickness tc of the cover parts 112, 113 can be 100 μm or less, preferably 30 μm or less, and more preferably 20 μm or less for ultra-small products.

[0052] Here, the thickness tc of the covers 112, 113 may refer to the size of the covers 112, 113 in the first direction. In addition, the thickness tc of the covers 112, 113 may refer to the average thickness tc of the covers 112, 113, or may refer to the average size of the covers 112, 113 in the first direction.

[0053] The average size in the first direction of the covers 112 and 113 may be measured by scanning an image of a cross-section in the first and second directions of the body 110 with a scanning electron microscope (SEM) at a magnification of 10,000. More specifically, it may mean an average value calculated by measuring the size in the first direction at 30 points equally spaced in the second direction in an image obtained by scanning one cover.

[0054] In addition, the average size in the first direction of the cover portion measured by the above-mentioned method may be substantially the same as the average size in the first direction of the cover portion in the first and third direction cross-sections of the body 110.

[0055] Meanwhile, the multilayer electronic component 100 may include side margin portions 114 and 115 disposed on both end surfaces of the body 110 in the third direction.

[0056] Specifically, the side margin portions 114, 115 may include a first side margin portion 114 arranged on one side of the main body 110 in the third direction and a second side margin portion 115 arranged on the other side of the main body 110 in the third direction, and more specifically, may include a first side margin portion 114 arranged on the fifth surface 5 of the main body 110 and a second side margin portion 115 arranged on the sixth surface 6 of the main body 110.

[0057] As shown in the figure, the side margin portions 114, 115 may refer to the areas between the end surfaces in the third direction of the first and second internal electrodes 121, 122 and the boundary surface of the body 110, based on the first and third direction cross-sections of the body 110.

[0058] The side margin portions 114, 115 can be formed by applying a conductive paste to form internal electrodes 121, 122, except for the areas where the side margin portions 114, 115 are formed on the ceramic green sheet applied to the capacitance forming portion Ac, and then cutting the laminated internal electrodes 121, 122 so that they are exposed on the fifth and sixth surfaces 5, 6 of the body 110 in order to suppress steps caused by the internal electrodes 121, 122, and then stacking a single dielectric layer 111 or two or more dielectric layers 111 in the third direction on both end surfaces in the third direction of the capacitance forming portion Ac.

[0059] The side margins 114 and 115 essentially serve to prevent damage to the internal electrodes 121 and 122 due to physical or chemical stress.

[0060] The first side margin portion 114 and the second side margin portion 115 do not include the internal electrodes 121, 122, and may include the same material as the dielectric layer 111. That is, the first side margin portion 114 and the second side margin portion 115 may include a ceramic material, for example, a barium titanate (BaTiO3)-based ceramic material.

[0061] On the other hand, the width wm of the first and second side margin portions 114, 115 does not need to be particularly limited.

[0062] However, in order to more easily achieve miniaturization and high capacity of the multilayer electronic component 100, the width wm of the side margin portions 114, 115 can be 100 μm or less, preferably 30 μm or less, and more preferably 20 μm or less for ultra-small products.

[0063] Here, the width wm of the side margin portions 114, 115 may refer to the size of the side margin portions 114, 115 in the third direction. In addition, the width wm of the side margin portions 114, 115 may refer to the average width wm of the side margin portions 114, 115, or may refer to the average size of the side margin portions 114, 115 in the third direction.

[0064] The average size in the third direction of the side margins 114, 115 may be measured by scanning an image of a cross-section in the first and third directions of the body 110 with a scanning electron microscope (SEM) at a magnification of 10,000. More specifically, it may mean an average value calculated by measuring the size in the third direction at 10 points equally spaced in the first direction in an image obtained by scanning one side margin.

[0065] In one embodiment of the present invention, a structure in which the ceramic electronic component 100 has two external electrodes 131, 132 is described, however, the number and shapes of the external electrodes 131, 132 may vary depending on the shape of the internal electrodes 121, 122 and other purposes.

[0066] The outer electrodes 131 , 132 may be disposed on the body 110 and connected to the inner electrodes 121 , 122 .

[0067] More specifically, the external electrodes 131, 132 may include first and second external electrodes 131, 132 disposed on the third and fourth surfaces 3, 4 of the body 110, respectively, and connected to the first and second internal electrodes 121, 122, respectively. That is, the first external electrode 131 may be disposed on the third surface 3 of the body and connected to the first internal electrode 121, and the second external electrode 132 may be disposed on the fourth surface 4 of the body and connected to the second internal electrode 122.

[0068] In addition, the external electrodes 131, 132 may be disposed extending to a portion of the first and second surfaces 1, 2 of the body 110, or may be disposed extending to a portion of the fifth and sixth surfaces 5, 6 of the body 110. That is, the first external electrode 131 may be disposed on a portion of the first, second, fifth and sixth surfaces 1, 2, 5 and 6 of the body 110 and on the third surface 3 of the body 110, and the second external electrode 132 may be disposed on a portion of the first, second, fifth and sixth surfaces 1, 2, 5 and 6 of the body 110 and on the third surface 3 of the body 110. In this case, the first and second external electrodes 131, 132 may be spaced apart from each other.

[0069] Meanwhile, the external electrodes 131 and 132 may be formed using any material having electrical conductivity, such as a metal, and the specific material may be determined in consideration of electrical characteristics, structural stability, etc., and may further have a multi-layer structure.

[0070] In one embodiment of the present invention, the external electrodes 131, 132 include electrode layers 131a, 132a connected to the internal electrodes 121, 122 and disposed on the main body 110, and plating layers 131c, 132c, 131d, 132d disposed on the electrode layers 131a, 132a, and the electrode layers 131a, 132a may include connection electrode layers 131a-1, 132a-1 disposed on the third and fourth surfaces 3, 4 and including a first conductive metal and a first glass, and band electrode layers 131a-2, 132a-2 in contact with the connection electrode layers 131a-1, 132a-1, disposed on parts of the first and second surfaces 1, 2, and including a second conductive metal and a second glass.

[0071] In this case, the external electrodes 131 and 132 may further include conductive resin layers 131b and 132b that are disposed between the band electrode layers 131a-2 and 132a-2 and the plating layers 131c and 132c and contain a third conductive metal and resin.

[0072] By including the structure of the external electrodes 131 and 132 in the multilayer electronic component 100, the bending strength characteristics and moisture resistance reliability can be improved at the same time.

[0073] The external electrodes 131, 132 may include electrode layers 131a, 132a connected to the internal electrodes 121, 122 and disposed on the body 110. In this case, the electrode layers 131a, 132a may include connection electrode layers 131a-1, 132a-1 disposed on connection portions on the third and fourth surfaces 3, 4, and band electrode layers 131a-2, 132a-2 disposed on band portions of the first and second surfaces 1, 2.

[0074] More specifically, the first external electrode 131 may include an electrode layer 131a connected to the first internal electrode 121 and disposed on the body 110. In this case, the electrode layer 131a may include a connection electrode layer 131a-1 disposed on the third surface 3, and a band electrode layer 131a-2 in contact with the connection electrode layer 131a-1 and disposed on parts of the first and second surfaces 1 and 2. Here, the band electrode layer 131a-2 may include a first band electrode layer 131a-2a disposed on a part of the first surface 1 of the body, and a second band electrode layer 131a-2b disposed on a part of the second surface 2 of the body.

[0075] The second external electrode 132 may include an electrode layer 132a connected to the second internal electrode 122 and disposed on the body 110. In this case, the electrode layer 132a may include a connection electrode layer 132a-1 disposed on the fourth surface 4, and a band electrode layer 132a-2 in contact with the connection electrode layer 132a-1 and disposed on parts of the first and second surfaces 1 and 2. Here, the band electrode layer 132a-2 may include a first band electrode layer 132a-2a disposed on a part of the first surface 1 of the body, and a second band electrode layer 132a-2b disposed on a part of the second surface 2 of the body.

[0076] The connecting electrode layers 131a-1, 132a-1 may include a first conductive metal and a first glass.

[0077] The first conductive metal may include, but is not limited to, copper (Cu) as long as it is a material that can be electrically connected to the internal electrodes 121 and 122. The material of the first conductive metal may include at least one selected from the group consisting of copper (Cu), nickel (Ni), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti), and alloys thereof, and any material having excellent electrical conductivity may be used.

[0078] The first glass plays a role of improving the bonding property with the main body 110, and the connection electrode layers 131a-1 and 132a-1 include the first glass, so that the bonding property with the main body 110 can be excellent. Here, the first glass can be a concept including glass frit.

[0079] The connection electrode layers 131a-1 and 132a-1 can be formed by applying a conductive paste in which a first glass is added to a first conductive metal, and then firing the paste.

[0080] The band electrode layers 131a-2, 132b-2 may include a second conductive metal and a second glass.

[0081] The second conductive metal may include, for example, silver (Ag), but is not particularly limited thereto, as long as it is a material that can be electrically connected to the connection electrode layers 131a-1, 132-a and the internal electrodes 121, 122. The material of the second conductive metal may include one or more selected from the group consisting of copper (Cu), nickel (Ni), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti), and alloys thereof, and any material having excellent electrical conductivity may be used.

[0082] The band electrode layers 131a-2, 132a-2 contain a conductive metal, such as silver (Ag), which is more ductile than the conductive metal contained in the connection electrode layers 131a-1, 132a-1, and can absorb the bending stress applied to the laminated electronic component 100 to suppress the generation of cracks.

[0083] The second glass plays a role of improving the bonding property with the body 110, and since the band electrode layers 131a-2 and 132a-2 include the second glass, the bonding property with the body 110 can be excellent. Here, the second glass can be a concept including glass frit.

[0084] The band electrode layers 131a-2 and 132a-2 can be formed by applying a conductive paste in which a second glass is added to a second conductive metal, and then firing the paste.

[0085] The first glass and the second glass may be the same or different from each other. When a plurality of glass types are included, at least one of the plurality of glass types may be made of the same material, but is not particularly limited thereto.

[0086] The method of forming the connection electrode layers 131a-1, 132a-1 and the band electrode layers 131a-2, 132a-2 is not particularly limited. For example, the connection electrode layers 131a-1, 132a-1 may be applied first, and the band electrode layers 131a-2, 132a-2 may be applied later, and then fired to form the electrode layers 131a, 132a, or the band electrode layers 131a-2, 132a-2 may be applied first, and the connection electrode layers 131a-1, 132a-1 may be applied later, and then fired to form the electrode layers 131a, 132a, or the connection or band electrode layers may be applied first, and then the connection or band electrode layers may be removed through a polishing process such as sandblasting in the area where the band or connection electrode layers are to be applied, and then the band or connection electrode layers may be applied.

[0087] In one embodiment of the present invention, the band electrode layers 131a-2, 132a-2 may not be disposed between the extension line EL1 of the first surface and the extension line EL2 of the second surface.

[0088] 2, the first band electrode layer 131a-2a of the first external electrode may be disposed only on the lower side with respect to EL1, and may not be disposed on the upper side of EL1, and the second band electrode layer 131a-2b of the first external electrode may be disposed only on the upper side with respect to EL2, and may not be disposed on the lower side of EL2. That is, the band electrode layers 131a-2a, 131a-2b of the first external electrode may not be disposed between EL1 and EL2 in the first direction, or may not be disposed on the third surface 3.

[0089] The first band electrode layer 132a-2a of the second external electrode may be disposed only at the lower part with respect to EL1, and may not be disposed above EL1, and the second band electrode layer 132a-2b of the first external electrode may be disposed only at the upper part with respect to EL2, and may not be disposed below EL2. That is, the band electrode layers 132a-2a, 132a-2b of the second external electrode may not be disposed between EL1 and EL2 in the first direction, or may not be disposed on the fourth surface 4.

[0090] Thereby, the band electrode layers 131a-2, 132a-2 do not need to be disposed between EL1 and EL2, and do not need to be disposed on the third and fourth faces 3, 4.

[0091] Alternatively, in another embodiment of the present invention, the band electrode layers 231a-2 and 232a-2 may be disposed between the extension line EL3 of the third surface and the extension line EL4 of the fourth surface.

[0092] 5, the first band electrode layer 231a-2a of the first external electrode may be disposed only on the right side of EL3 and may not be disposed on the left side of EL3, and the second band electrode layer 231a-2b of the first external electrode may be disposed only on the right side of EL3 and may not be disposed on the left side of EL3. That is, the band electrode layers 231a-2a, 231a-2b of the first external electrode may be disposed on the right side of EL3 or may not be disposed on the third surface 3.

[0093] The first band electrode layer 232a-2a of the second external electrode may be arranged only on the left side of EL4 and may not be arranged on the right side of EL4, and the second band electrode layer 232a-2b of the first external electrode may be arranged only on the left side of EL4 and may not be arranged on the right side of EL4. That is, the band electrode layers 232a-2a, 232a-2b of the second external electrode may be arranged on the left side of EL4 or may not be arranged on the fourth surface 4.

[0094] This allows the band electrode layers 231a-2, 232a-2 to be disposed between EL3 and EL4.

[0095] The plating layers 131c, 132c, 131d, and 132d can serve to improve mounting characteristics.

[0096] The type of the plating layers 131c, 132c, 131d, and 132d is not particularly limited, and may be a single plating layer 131c, 132c containing one or more of nickel (Ni), tin (Sn), palladium (Pd), and alloys thereof, or may be formed of multiple layers 131c, 132c, 131d, and 132d.

[0097] For example, the plating layers 131c, 132c, 131d, and 132d may include first plating layers 131c and 132c disposed on the electrode layers 131a and 132a and second plating layers 131d and 132d disposed on the first plating layers 131c and 132c.

[0098] To give a more specific example of the plating layers 131c, 132c, 131d, and 132d, the drawings show two plating layers, but this is not limited thereto and the plating layers may include one plating layer or two or more plating layers as necessary.

[0099] The plating layers 131c, 132c, 131d, and 132d may be at least one of a nickel (Ni) plating layer or a tin (Sn) plating layer, and may be in a form in which a Ni plating layer and a Sn plating layer are sequentially formed on the electrode layers 131a and 132a, or in a form in which a Sn plating layer, a Ni plating layer, and a Sn plating layer are sequentially formed. Also, the plating layers may include a plurality of Ni plating layers and / or a plurality of Sn plating layers.

[0100] In one embodiment of the present invention, the external electrodes 131, 132 may further include conductive resin layers 131b, 132b disposed between the band electrode layers 131a-1, 132a-1 and the first plating layers 131c, 132c and containing a third conductive metal and resin.

[0101] The third conductive metal may include, but is not limited to, copper (Cu) as long as it is a material that can be electrically connected to the internal electrodes 121, 122 or the electrode layers 131a, 132a. The material of the third conductive metal may include at least one selected from the group consisting of copper (Cu), nickel (Ni), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti), and alloys thereof, and any material having excellent electrical conductivity may be used.

[0102] Here, the third conductive metal may include at least one of spherical particles and flake particles. That is, the third conductive metal may be composed of only flake particles, only spherical particles, or may be a mixture of flake particles and spherical particles. Here, the spherical particles may include a shape that is not completely spherical, for example, a shape in which the length ratio of the major axis to the minor axis (major axis / minor axis) is 1.45 or less. The flake particles refer to particles having a flat and long shape, and are not particularly limited, but for example, the length ratio of the major axis to the minor axis (major axis / minor axis) may be 1.95 or more. The lengths of the major axis and minor axis of the spherical particles and the flake particles may be measured from an image obtained by scanning the first and second direction cross-sections cut at the center of the third direction of the multilayer electronic component with a scanning electron microscope (SEM).

[0103] In addition, the third conductive metal may include an intermetallic compound. By including the intermetallic compound, electrical connectivity with the electrode layers 131a and 132a may be further improved. The intermetallic compound may function to connect a plurality of metal particles to improve electrical connectivity, and may function to surround a plurality of metal particles to connect them to each other.

[0104] In this case, the intermetallic compound may include a metal having a melting point lower than the curing temperature of the resin, that is, the metal having a melting point lower than the curing temperature of the resin may be melted during the drying and curing process to form an intermetallic compound with a part of the metal particles to surround the metal particles.

[0105] The intermetallic compound preferably includes a low melting point metal of 300°C or less. For example, it may include tin (Sn) having a melting point of 213 to 220°C. During the drying and hardening process, Sn melts, and the molten Sn wets the third conductive metal particles having a high melting point such as Ag, Ni, or Cu by capillary action and reacts with a part of the Ag, Ni, or Cu metal particles to form an intermetallic compound such as Ag3Sn, Ni3Sn4, Cu6Sn5, or Cu3Sn. Ag, Ni, or Cu that does not participate in the reaction may remain in the form of metal particles.

[0106] Thus, the plurality of metal particles may include one or more of Ag, Ni, and Cu, and the intermetallic compound may include one or more of Ag3Sn, Ni3Sn4, Cu6Sn5, and Cu3Sn.

[0107] The resin may include a thermosetting resin having electrical insulation properties, for example, an epoxy resin, but is not limited thereto, and may include, but is not limited to, a bisphenol A resin, a glycol epoxy resin, a novolac epoxy resin, or a resin that has a small molecular weight and is liquid at room temperature among derivatives thereof, but is not limited thereto.

[0108] The conductive resin layers 131b and 132b can improve the bending strength characteristics and moisture resistance reliability of the multilayer electronic component 100.

[0109] More specifically, the conductive resin layers 131b and 132b can prevent cracks from occurring by absorbing tensile stress generated in a mechanical or thermal environment when mounting the multilayer electronic component 100 on a substrate. In addition, the conductive resin layers 131b and 132b contain a plurality of substances that can effectively suppress moisture penetration from the outside, thereby improving moisture resistance reliability.

[0110] In the present invention, the first conductive metal, the second conductive metal, and the third conductive metal may be the same or different from each other, or two of the three conductive metals may be the same material. Also, each conductive metal may include a plurality of materials, and at least one of the plurality of materials may be the same material, but is not particularly limited thereto.

[0111] Meanwhile, the conductive resin layers 131b and 132b may be disposed between the band electrode layers 131a-1 and 132a-1 and the first plating layers 131c and 132c.

[0112] In other words, in one embodiment of the present invention, the conductive resin layers 131b and 132b do not need to be disposed between the extension line EL1 of the first surface and the extension line EL2 of the second surface.

[0113] 2, the first conductive resin layer 131b-1 of the first external electrode may be disposed only on the lower side with respect to EL1, and may not be disposed on the upper side of EL1, and the second conductive resin layer 131b-2 of the first external electrode may be disposed only on the upper side with respect to EL2, and may not be disposed on the lower side of EL2. That is, the conductive resin layers 131b-1, 131b-1 of the first external electrode may not be disposed between EL1 and EL2 in the first direction, or may not be disposed on the third surface 3.

[0114] The first conductive resin layer 132b-1 of the second external electrode may be disposed only on the lower portion with respect to EL1, and may not be disposed above EL1, and the second conductive resin layer 132b-2 of the first external electrode may be disposed only on the upper portion with respect to EL2, and may not be disposed below EL2. That is, the conductive resin layers 132b-1 and 132b-2 of the second external electrode may not be disposed between EL1 and EL2 in the first direction, or may not be disposed on the fourth surface 4.

[0115] As a result, the conductive resin layers 131b and 132b do not need to be disposed between EL1 and EL2, and do not need to be disposed on the third and fourth faces 3 and 4.

[0116] Alternatively, in another embodiment of the present invention, the conductive resin layers 231b and 232b may be disposed between the extension line EL3 of the third surface and the extension line EL4 of the fourth surface.

[0117] 5, the first conductive resin layer 231b-1 of the first external electrode may be disposed only on the right side of EL3 and may not be disposed on the left side of EL3, and the second conductive resin layer 231b-2 of the first external electrode may be disposed only on the right side of EL3 and may not be disposed on the left side of EL3. That is, the band electrode layers 231b-1 and 231b-2 of the first external electrode may be disposed on the right side of EL3 or may not be disposed on the third surface 3.

[0118] The first conductive resin layer 232b-1 of the second external electrode may be disposed only on the left side of EL4 and may not be disposed on the right side of EL4, and the second conductive resin layer 232b-2 of the first external electrode may be disposed only on the left side of EL4 and may not be disposed on the right side of EL4. That is, the conductive resin layers 232b-1 and 232b-2 of the second external electrode may be disposed on the left side of EL4 or may not be disposed on the fourth surface 4.

[0119] This allows the conductive resin layers 231b and 232b to be disposed between EL3 and EL4.

[0120] In one embodiment of the present invention, the conductive resin layers 131b and 132b may not be in contact with the connection electrode layers 131a-1 and 132a-1.

[0121] Since the conductive resin layers 131b and 132b are not in contact with the connection electrode layers 131a-1 and 132a-1, the bending strength characteristics of the multilayer electronic component 100 can be improved, and the structure can be easily designed in the manufacturing process.

[0122] Furthermore, in one embodiment of the present invention, the first plating layers 131c, 132c may not be in contact with the band electrode layers 131a-2, 132a-2.

[0123] Since the first plating layers 131c, 132c are not in contact with the band electrode layers 131a-2, 132a-2, it is possible to prevent the plating solution from penetrating into the main body during the plating process, thereby improving the moisture resistance reliability and suppressing deterioration of the internal electrodes.

[0124] The size of the multilayer electronic component 100 does not need to be particularly limited. However, in order to simultaneously achieve miniaturization and high capacity, it is necessary to reduce the thickness of the dielectric layers and internal electrodes and increase the number of layers, so the effects of the present invention can be more pronounced in a multilayer electronic component 100 having a size of 1005 (length x width: 1.0 mm x 0.5 mm) or less.

[0125] Although the embodiments of the present invention have been described in detail above, the present invention is not limited to the above-described embodiments and the accompanying drawings, but is limited by the scope of the accompanying claims. Therefore, various substitutions, modifications and changes can be made by a person having ordinary skill in the art within the scope of the technical ideas of the present invention described in the claims, and these also belong to the scope of the present invention.

[0126] In addition, the expression "one embodiment" used in the present invention does not mean the same embodiment, but is provided to emphasize and describe unique features that are different from each other. However, the above-mentioned one embodiment does not exclude being realized in combination with features of another embodiment. For example, even if a matter described in a particular embodiment is not described in another embodiment, it can be understood as a description related to the other embodiment, unless there is a description that is opposite or contradictory to the matter in the other embodiment.

[0127] The terms used in the present invention are merely used to describe one embodiment and are not intended to limit the present invention. In this case, a singular expression includes a plural expression unless the context clearly indicates otherwise. [Explanation of symbols]

[0128] 100: Multilayer electronic components 110: Main unit 111: Dielectric layer 112, 113: Cover part 114, 115: Side margin 121, 122: Internal electrode 131, 132: External electrode

Claims

1. a body including dielectric layers and internal electrodes alternately disposed with the dielectric layers in a first direction, the body including first and second surfaces facing each other in the first direction, third and fourth surfaces connected to the first and second surfaces and facing each other in the second direction, and fifth and sixth surfaces connected to the first to fourth surfaces and facing each other in the third direction; an external electrode including an electrode layer disposed on the body and connected to the internal electrode, and a plating layer disposed on the electrode layer; the electrode layer includes a connection electrode layer disposed on the third and fourth surfaces and including copper (Cu) and glass, and a band electrode layer in contact with the connection electrode layer, disposed on a portion of the first and second surfaces, including silver (Ag) and glass; the external electrode further includes a conductive resin layer disposed between the band electrode layer and the plating layer and including a conductive metal and a resin; Multilayer electronic components.

2. The conductive metal includes copper (Cu). The multilayer electronic component according to claim 1 .

3. The conductive metal includes an intermetallic compound. The multilayer electronic component according to claim 1 .

4. The band electrode layer is not disposed between the extension line EL1 of the first surface and the extension line EL2 of the second surface. The multilayer electronic component according to claim 1 .

5. The conductive resin layer is not disposed between an extension line EL1 of the first surface and an extension line EL2 of the second surface. The multilayer electronic component according to claim 1 .

6. The band electrode layer is disposed between an extension line EL3 of the third surface and an extension line EL4 of the fourth surface. The multilayer electronic component according to claim 1 .

7. The conductive resin layer is disposed between an extension line EL3 of the third surface and an extension line EL4 of the fourth surface. The multilayer electronic component according to claim 1 .

8. the conductive resin layer is not in contact with the connection electrode layer; The multilayer electronic component according to claim 1 .

9. The plating layer is not in contact with the band electrode layer. The multilayer electronic component according to claim 1 .

10. the plating layer includes a first plating layer disposed on the connection electrode layer and the conductive resin layer, and a second plating layer disposed on the first plating layer; The multilayer electronic component according to claim 1 .

11. a body including dielectric layers and internal electrodes alternately disposed with the dielectric layers in a first direction, the body including first and second surfaces facing each other in the first direction, third and fourth surfaces connected to the first and second surfaces and facing each other in the second direction, and fifth and sixth surfaces connected to the first to fourth surfaces and facing each other in the third direction; an external electrode including an electrode layer disposed on the body and connected to the internal electrode, and a plating layer disposed on the electrode layer; the electrode layer includes a connection electrode layer disposed on the third and fourth surfaces and including a first conductive metal and glass, and a band electrode layer in contact with the connection electrode layer and disposed on a portion of the first and second surfaces and including a second conductive metal and glass; the external electrode further includes a conductive resin layer disposed between the band electrode layer and the plating layer and including a third conductive metal and a resin. Multilayer electronic components.

12. The band electrode layer is not disposed between the extension line EL1 of the first surface and the extension line EL2 of the second surface. The multilayer electronic component according to claim 11.

13. The conductive resin layer is not disposed between an extension line EL1 of the first surface and an extension line EL2 of the second surface. The multilayer electronic component according to claim 11.

14. The band electrode layer is disposed between an extension line EL3 of the third surface and an extension line EL4 of the fourth surface. The multilayer electronic component according to claim 11.

15. The conductive resin layer is disposed between an extension line EL3 of the third surface and an extension line EL4 of the fourth surface. The multilayer electronic component according to claim 11.

16. the second conductive metal being more ductile than the first conductive metal; The multilayer electronic component according to any one of claims 11 to 15.

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