Polymerase chain reaction heating device and polymerase chain reaction temperature control system

Abstract

To provide a polymerase chain reaction heating device that reduces the thickness of the overall structure and prevents an electronic component from being damaged due to high temperature and a related polymerase chain reaction temperature control system.SOLUTION: A polymerase chain reaction heating device and a related system can include a circuit board, a heater, a first thermal conductive component and a second thermal conductive component. The circuit board has an opening structure. The heater is disposed inside the opening structure and partly exposed via the opening structure. The first thermal conductive component is disposed on the circuit board and includes a first reagent storage portion and a first heat conduction portion. The second thermal conductive component is disposed on the circuit board and includes a second reagent storage portion and a second heat conduction portion. The first reagent storage portion and the second reagent storage portion can be used to form a reagent holder. The first heat conduction portion and the second heat conduction portion respectively abut against two opposite surfaces of the heater for transmitting the heat generated by the heater towards the reagent holder.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present invention relates to a polymerase chain reaction heating device and a polymerase chain reaction temperature control system, and particularly to a polymerase chain reaction heating device having a rapid temperature adjustment function and a related polymerase chain reaction temperature control system.

Background Art

[0002] Polymerase chain reaction (PCR) is a technique for rapidly amplifying DNA. Its principle and main operation steps are as follows: (a) Denaturation: Double-stranded DNA is dissociated into single-stranded DNA by incubation at 90°C to 95°C, and then the single-stranded DNA is used as a template for replication; (b) Primer annealing: When the temperature is lowered to an appropriate temperature, the primer binds to the correct target gene position; (c) Primer extension: The reaction temperature is corrected to 72°C, and DNA polymerase continuously binds deoxyribonucleotide triphosphate (dNTP) to the primer to synthesize another strand of a new DNA fragment.

[0003] Nucleic acid amplification is continuously repeated through three steps: denaturation, primer annealing, and primer extension. The number of target genes can be doubled with each operation of the three steps. When the operation of the three steps is set to be performed periodically 40 times, the number of target genes can be amplified nearly 109-fold, and a large number of target gene fragments can be obtained by PCR in vitro. Therefore, as one of the molecular diagnostic techniques widely used in current clinical diagnosis, PCR can be applied to items including the diagnosis of genetic diseases, the diagnosis of pathogenic bacteria, the diagnosis and prognosis evaluation of tumors and cancers, and basic research, etc. Thus, PCR is also used as a technique widely used in current clinical diagnosis.

[0004] Conventional polymerase chain reaction heating devices include a circuit board, a heater, and a thermally conductive component. The heater is welded to the side surface of the circuit board. The thermally conductive component is attached to the side surface of the circuit board, contacts the heater, and covers the heater. The thermally conductive component has a reagent container. Conventional polymerase chain reaction heating devices use a temperature-controlled metal as the heater, and the temperature-controlled metal has a rapid temperature adjustment function and repeatedly performs heating and cooling operations to achieve the reaction temperatures of the denaturation, primer annealing, and primer extension steps. To amplify the target gene and detect the fluorescence signal, a plastic reagent container is heated so that the temperature of the reagent and the reactants (containing the target gene fragment) in the reagent container is adjusted.

[0005] When the heater switch is turned on, the heat generated by the heater is conducted to the reagent container through the thermally conductive component, and the reagent and reactants in the reagent container are processed by the steps of denaturation, primer annealing, and primer extension. The heater rapidly heats and cools the reagent and reactants in the reagent container within the range of 55 to 98 °C in a short time. Therefore, the energy provided by the heater is much greater than 98 °C for the rapid heating function. However, the thickness of the conventional polymerase chain reaction heating device is the sum of the thicknesses of the circuit board, the heater, and the thermally conductive component, and this device is large in size; the heater needs to generate more energy to rapidly increase the temperature of the reagent and reactants in the reagent container and avoid heat dissipation or a decrease in heat conduction efficiency. Furthermore, the thermally conductive component directly covers the contact point between the heater and the circuit board, and due to the heat generated by the heater and accumulated in the thermally conductive component, the contact point is easily melted and damaged, resulting in the separation of the heater. Therefore, the design of a polymerase chain reaction heating device that reduces the overall thickness of the structure and prevents damage to electronic components due to high temperatures is an important issue in the related medical device industry.

Summary of the Invention

[0006] The present invention provides a polymerase chain reaction heating device having a rapid temperature adjustment function and a related polymerase chain reaction temperature control system for solving the above-mentioned drawbacks.

[0007] According to the invention described in the claims, the polymerase chain reaction heating device includes at least one circuit board, a heater, a first heat-conductive component, and a second heat-conductive component. The at least one circuit board has an opening structure and a first surface and a second surface facing each other. The heater is disposed inside the opening structure and is exposed through the first surface and the second surface. The first heat-conductive component is disposed on the first surface. The first heat-conductive component includes a first reagent storage portion and at least one first heat-conductive portion. The second heat-conductive component is disposed on the second surface. The second heat-conductive component includes a second reagent storage portion and at least one second heat-conductive portion. The second reagent storage portion is assembled with the first reagent storage portion to form a reagent holder. The at least one first heat-conductive portion and the at least one second heat-conductive portion are respectively in contact with two opposing positions of the heater to transfer the heat generated by the heater towards the reagent holder.

[0008] According to the invention described in the claims, the at least one circuit board is divided into a shielded region and an unshielded region connected to each other, the opening structure is formed on the shielded region, and the at least one first heat-conductive portion and the at least one second heat-conductive portion are disposed on the shielded region to clamp the at least one circuit board. The heater is electrically connected to a conductive contact point of the at least one circuit board, and the conductive contact point is disposed on the unshielded region.

[0009] According to the invention described in the claims, the polymerase chain reaction heating device further includes two circuit boards spaced apart from each other. The first heat-conductive component includes a storage region and a positioning region connected to each other. The first reagent storage portion is disposed on the storage region together with the gap between the two circuit boards. At least one first heat-conductive portion is disposed on the positioning region. At least one of the circuit boards further has a through-hole structure formed on the shield region. The first heat-conductive component has a locking hole structure formed on the positioning region so as to align with the through-hole structure for the locking operation. The first heat-conductive component has at least one heat dissipation hole structure formed on the storage region and disposed adjacent to the first reagent storage portion.

[0010] According to the invention described in the claims, a polymerase chain reaction temperature control system includes a polymerase chain reaction heating device, a heat dissipation device, a light source, and a spectroscope. The polymerase chain reaction heating device includes at least one circuit board, a heater, a first heat conductive component, and a second heat conductive component. The at least one circuit board has an opening structure and a first surface and a second surface that face each other. The heater is disposed inside the opening structure and is exposed through the first surface and the second surface. The first heat conductive component is disposed on the first surface. The first heat conductive component includes a first reagent storage portion and at least one first heat conduction portion. The second heat conductive component is disposed on the second surface. The second heat conductive component includes a second reagent storage portion and at least one second heat conduction portion. The second reagent storage portion is assembled with the first reagent storage portion to form a reagent holder. The at least one first heat conduction portion and the at least one second heat conduction portion are respectively in contact with two opposing positions of the heater to transfer the heat generated by the heater toward the reagent holder. The heat dissipation device is disposed adjacent to the polymerase chain reaction heating device to dissipate heat from the reagent holder. The light source is disposed adjacent to the reagent holder, and an illumination beam emitted by the light source is projected onto the reagent holder. The spectroscope is disposed adjacent to the reagent holder and is adapted to receive a detection signal generated by the illumination beam projected onto the reagent holder for signal analysis.

[0011] The polymerase chain reaction temperature control system and polymerase chain reaction heating device of the present invention can form an opening structure on a circuit board in order to reduce the thickness of the entire structure, and the heater can be engaged inside the opening structure so as to be exposed through the opposing surfaces of the circuit board. In addition, each of the first heat conductive component and the second heat conductive component may include a cover portion used to cover the heater and the temperature sensor; the conductive contact of the lead connected between the heater and the circuit board can extend and be located inside the non-shielded area of the circuit board, and is not covered by the first heat conductive component and the second heat conductive component so as to prevent damage to the conductive contact due to high temperature during the heating process.

[0012] These and other objects of the present invention will surely become clear to those skilled in the art after reading the following detailed description of the preferred embodiments illustrated in various figures and drawings.

Brief Description of the Drawings

[0013]

Figure 1

Figure 2

Figure 3

Figure 4

Modes for Carrying Out the Invention

[0014] Please refer to FIG. 1. FIG. 1 is a diagram of a polymerase chain reaction temperature control system 10 according to an embodiment of the present invention. The polymerase chain reaction (PCR) is a method widely used to rapidly create copies of DNA samples ranging from millions to billions. The polymerase chain reaction temperature control system 10 may include at least a polymerase chain reaction heating device 12, a heat dissipation device 14, a light source 16, a spectroscope 18, a power source 20, and an operation processor 22. When the polymerase chain reaction temperature control system 10 is operated, a reagent container (not shown in the figure) containing reagents and reactants can be placed inside the polymerase chain reaction heating device 12, and to increase the temperature, the switch of the power source 20 can be turned on to provide energy to the polymerase chain reaction heating device 12; when the polymerase chain reaction heating device 12 is heated to a preset maximum temperature, to cool it to a preset minimum temperature, the switch of the heat dissipation device 14 can be turned on to dissipate heat from the polymerase chain reaction heating device 12.

[0015] The reagent container in the polymerase chain reaction heating device 12 can be rapidly and repeatedly heated and cooled to perform the steps of denaturation, primer annealing, and primer extension on the reagents and reactants contained in the reagent container. The operation processor 22 can turn on the switch of the light source 16 to emit an illumination beam. The illumination beam may be an excitation beam; the illumination beam can be projected onto the reagent container from the bottom of the polymerase chain reaction heating device 12 through the lens assembly 24 so as to excite a fluorescent substance in the reagent container to emit fluorescence, and the fluorescence can pass through the lens assembly 24 and be received by the spectroscope 18 as a detection signal. Finally, the spectroscope 18 can send the received detection signal to the operation processor 22 for signal analysis to perform qualitative or quantitative analysis of the target in the reagent container.

[0016] In the present invention, the polymerase chain reaction heating device 12 can be heated from 94 to 98 °C in the denaturation step, and the high temperature can dissociate double-stranded DNA into single-stranded DNA and break the hydrogen bonds between bases. In the primer annealing step, the polymerase chain reaction heating device 12 can be cooled from 55 to 75 °C to bind the primer and the gene fragment of the target DNA. The polymerase chain reaction heating device 12 can be further heated from 68 to 72 °C in the primer extension step to copy the gene fragment of the target DNA. The above three steps can belong to a set of thermal cycles capable of amplifying the target DNA for detection.

[0017] For temperature adjustment, the polymerase chain reaction temperature control system 10 of the present invention can provide a new type of polymerase chain reaction heating device 12 with a thin structure feature. The specific design of the polymerase chain reaction heating device 12 prevents the solder of the internal circuit from melting due to rapid temperature rise, thereby improving the durability of the product. In addition, the heat dissipation device 14 may be a blower or a thermoelectric cooler, and the present invention can utilize one or more heat dissipation devices 14 to achieve a rapid cooling effect. The light source 16 may be a light-emitting diode or a laser, or any light source using a wavelength that matches the fluorescent dye. The illumination beam of the light source 16 can excite the fluorescent dye to generate fluorescence. The lens assembly 24 may be a combination of various types of lenses. The operation processor 22 may be an external processor adapted to control other electronic components.

[0018] The arrangement of the polymerase chain reaction heating device 12, heat dissipation device 14, light source 16, spectroscope 18, power source 20, and operation processor 22 of the present invention is not limited to the embodiments shown in the figures. Positioning the light source 16 and the related light radiation path laterally to the polymerase chain reaction heating device 12, in order to excite the fluorescent dye in the reagent container, the illumination beam of the light source 16 passes through the lens assembly 24 and travels towards the polymerase chain reaction heating device 12, and any system in which the fluorescent signal generated by the reagent container passes through the lens assembly 24 and is received as a detection signal by the spectroscope 18 can conform to the design scope of the present invention. In this embodiment, the light source 16 and the lens assembly 24 are arranged below the reagent container of the polymerase chain reaction heating device 12, and its actual application is not limited to the above embodiment.

[0019] Please refer to FIGS. 2 to 4. FIG. 2 is an exploded view of the polymerase chain reaction heating device 12 according to an embodiment of the present invention. FIG. 3 is an assembled view of the polymerase chain reaction heating device 12 according to an embodiment of the present invention. FIG. 4 is a partially separated view of the polymerase chain reaction heating device 12 according to an embodiment of the present invention. The polymerase chain reaction heating device 12 may include a circuit board 26, a heater 28, a first thermally conductive component 30, and a second thermally conductive component 32. In a preferred embodiment, the polymerase chain reaction heating device 12 may have two circuit boards 26 spaced apart from each other. Each of the circuit boards 26 may have an opening structure 34 and a first surface 36 and a second surface 38 facing each other. The opening structure 34 can penetrate the first surface 36 and the second surface 38. Further, the circuit board 26 can be divided into a shielded region 40 and an unshielded region 42 connected to each other; the opening structure 34 can be formed on the shielded region 40.

[0020] The heater 28 can be a temperature-controlled metal, ceramic substrate, or any component that generates heat by electricity. The number of heaters 28 can correspond to the number of circuit boards 26. Each heater 28 can be disposed on the opening structure 34 of the corresponding circuit board 26 and can be further partially exposed through the first surface 36 and the second surface 38. The circuit board 26 may further have a lead slot 35 connected to the opening structure 34; when the heater 28 engages the opening structure 34, the lead 281 of the heater 28 can be disposed inside the lead slot 35, and solder or other applicable materials can be used to fix the lead 281 onto the conductive contact 60 of the circuit board 26.

[0021] Instead of disposing the heater 28 on the outer surface of the circuit board 26, the present invention can engage the heater 28 within the opening structure 34 to reduce the overall thickness of the structure. The present invention may not use any extra fixing components, and the first thermally conductive component 30 and the second thermally conductive component 32 can be fixed to two opposing surfaces of the circuit board 26 respectively to clamp the heater 28 for restraint. However, its actual application is not limited to the above-described embodiments. Therefore, the present invention can engage the heater 28 in the opening structure 34 of the circuit board 26 for structural configuration without using extra fixing components so as to effectively reduce the thickness of the polymerase chain reaction heating device 12.

[0022] Furthermore, the first thermally conductive component 30 and the second thermally conductive component 32 can be respectively arranged on the first surface 36 and the second surface 38 of the circuit board 26. The first thermally conductive component 30 may include a first reagent storage portion 44 and a first heat conduction portion 46; the structural design of the second thermally conductive component 32 may be symmetric with the structural design of the first thermally conductive component 30 such that the second thermally conductive component 32 may include a second reagent storage portion 48 and a second heat conduction portion 50. When the first thermally conductive component 30 and the second thermally conductive component 32 are respectively attached to two opposite surfaces of the circuit board 26, the first reagent storage portion 44 and the second reagent storage portion 48 can be assembled together to form a reagent holder 52 for accommodating a reagent container. The bottom of the reagent holder 52 may have an opening 54, and it should be mentioned that the size of this opening 54 may be smaller than the size of the reagent container in order to prevent the reagent container from falling out of the reagent holder 52. The illumination beam of the light source 16 can pass through the opening 54 and be projected onto the fluorescent substance in the reagent container. The first heat conduction portion 46 and the second heat conduction portion 50 can be respectively fixed to the first surface 36 and the second surface 38 of the circuit board 26 through external elements (not shown in the figure). The first heat conduction portion 46 and the second heat conduction portion 50 can cover the opening structure 34 and the heater 28 engaged inside the opening structure 34 in order to limit the movement of the heater 28.

[0023] In a preferred embodiment, the two first heat conduction portions 46 of the first heat conductive component 30 can be respectively arranged on two opposite side surfaces of the first reagent storage portion 44, and the two second heat conduction portions 50 of the second heat conductive component 32 can be respectively arranged on two opposite side surfaces of the second reagent storage portion 48. Each of the first heat conduction portion 46 and the related second heat conduction portion 50 can be respectively in contact with two opposite side surfaces of the corresponding heater 28. The operation processor 22 can drive the power supply 20 to provide electricity to the heater 28, and the heat generated by the heater 28 can be conducted to the reagent holder 52 formed by the first reagent storage portion 44 and the second reagent storage portion 48 through the first heat conduction portion 46 and the second heat conduction portion 50.

[0024] Generally, at least one heat conduction layer (not shown in the figure) can be optionally arranged between the heater 28 and the first heat conduction portion 46, and further between the heater 28 and the second heat conduction portion 50. The heat conduction layer can be a thermal paste with a high thermal conductivity. The heat conduction layer may be beneficial for heat dissipation, and further ensure that the heater 28 can be closely adhered to the first heat conduction portion 46 and the second heat conduction portion 50 without gaps so as to effectively increase the thermal conductivity of the first heat conductive component 30 and the second heat conductive component 32 and the heating rate of the polymerase chain reaction heating device 12.

[0025] Please refer to FIGS. 2 to 4. Each of the first heat-conductive component 30 and the second heat-conductive component 32 can be divided into several regions according to functional requirements, such as a shield region 40 and a non-shield region 42 separated from the circuit board 26. Taking the first heat-conductive component 30 as an example, the first heat-conductive component 30 can be further divided into a housing region 56 and a positioning region 58 connected to each other. The first reagent storage portion 44 can be arranged inside the housing region 56 together with the gap between the two circuit boards 26. The first heat-conductive portion 46 can be arranged inside the positioning region 58. The second heat-conductive component 32 may have a structural design similar to that of the first heat-conductive component 30. Here, for the sake of brevity, a detailed description is omitted. When the first heat-conductive component 30 and the second heat-conductive component 32 are attached to the circuit board 26, the positioning regions 58 of the first heat-conductive component 30 and the second heat-conductive component 32 can face towards the shield region 40 of the circuit board 26, and the first heat-conductive portion 46 and the second heat-conductive portion 50 can cover the shield region 40 and clamp the circuit board 26. The non-shield region 42 of the circuit board 26 cannot be covered by the first heat-conductive component 30 and the second heat-conductive component 32.

[0026] The first heat-conductive component 30 and / or the second heat-conductive component 32 may preferably include a cover portion 47. The cover portion 47 is located inside the positioning region 58 and is arranged on the first heat-conductive portion 46 and / or the second heat-conductive portion 50. The cover portion 47 can cover a part of the heater 28 that is exposed through the first surface 36 and the second surface 38 and protrudes therefrom. Generally, the cover portion 47 can be integrally integrated with the positioning region 58 in a stamping style or any available style, but its actual application is not limited to the above-described embodiments.

[0027] Furthermore, although the heater 28 engages an opening structure 34 of the circuit board 26 located inside the shield region 40, the conductive contact 60 of the heater 28 that is electrically connected to the circuit board 26 can extend outwardly so as to be located inside the non-shield region 42. As described above, since the non-shield region 42 is not covered by the first thermally conductive component 30 and the second thermally conductive component 32, the solder of the conductive contact 60 will not be melted by the heat conducted from the first thermally conductive component 30 and the second thermally conductive component 32. Further, the circuit board 26 may further have at least one through-hole structure 62 formed on the shield region 40; each of the first thermally conductive component 30 and the second thermally conductive component 32 may have at least one locking hole structure 64. The locking hole structure 64 can be formed on the positioning region 58 so as to be aligned with the through-hole structure 62. The present invention can be inserted into the locking hole structure 64 and the through-hole structure 62 by using an external element such as a screw or a bolt for a fixing operation.

[0028] Each of the first heat-conductive component 30 and the second heat-conductive component 32 may have at least one heat dissipation hole structure 66, which is formed on the accommodation area 56 and is disposed adjacent to a reagent holder 52 formed by the first reagent storage portion 44 and the second reagent storage portion 48. The shield area 40 of the circuit board 26 can be attached to the positioning area 58 of the first heat-conductive component 30 and / or the second heat-conductive component 32. The accommodation areas 56 of the first heat-conductive component 30 and the second heat-conductive component 32 can be located inside the gap between the two circuit boards 26, and the heat dissipation hole structure 66 of the accommodation area 56 can provide a preferable heat dissipation efficiency through an air flow. That is, the heater 28 located inside the shield area 40 can heat the positioning area 58 of the first heat-conductive component 30 and the second heat-conductive component 32, and conduct heat to a reagent container installed in the reagent holder 52 through the accommodation area 56 from the positioning area 58; when the switch of the heat dissipation device 14 is turned on, the air flow can quickly pass through the heat dissipation hole structure 66 to dissipate the heat accumulated in the accommodation area 56 so as to quickly reduce the temperature of the reagent holder 52 and the related reagent container.

[0029] The first heat-conductive component 30 and the second heat-conductive component 32 may each have a plurality of heat dissipation hole structures 66 disposed on the sides of the first reagent storage portion 44 and the second reagent storage portion 48. The plurality of heat dissipation hole structures 66 may have the same size or different sizes. The size and arrangement of the heat dissipation hole structure 66 may depend on the remaining space of the first heat-conductive component 30 or the second heat-conductive component 32 for a preferable structural configuration. The heat dissipation hole structure 66 may be used to fix the heat-conductive component. For example, the polymerase chain reaction heating device 12 can fix both the first heat-conductive component 30 and the second heat-conductive component 32 through an external element to the central heat dissipation hole structure 66 (not shown in the figure); its actual application is not limited to the above-described embodiments.

[0030] Please refer to FIGS. 2 to 4. The polymerase chain reaction heating device 12 may further include a temperature sensor 68. The temperature sensor 68 is disposed at a position of the circuit board 26 adjacent to the reagent holder 52 and is electrically connected to the operation processor 22 via the circuit board 26. The operation processor 22 determines whether to turn on or off the switches of the heater 28 and the heat dissipation device 14, and determines whether the reagent holder 52 has reached the temperature required for each step of denaturation, primer annealing, and primer extension. In order to do so, the temperature parameter of the reagent holder 52 can be obtained according to the sensing result of the temperature sensor 68. The temperature sensor 68 can be covered by a cover portion 47 for protection.

[0031] In conclusion, the polymerase chain reaction temperature control system and the polymerase chain reaction heating device of the present invention can form an opening structure on the circuit board. In order to reduce the thickness of the entire structure, the heater can be engaged inside the opening structure and exposed through the opposite surface of the circuit board. In addition, each of the first heat conductive component and the second heat conductive component may include a cover portion used to cover the heater and the temperature sensor; in order to prevent damage to the conductive contact of the lead connected between the heater and the circuit board due to high temperature during the heating process, the conductive contact of the lead can be extended and disposed inside the non-shielded area of the circuit board and will not be covered by the first heat conductive component and the second heat conductive component. Compared with the prior art, the present invention can effectively reduce the structural size of the polymerase chain reaction temperature control system, and the polymerase chain reaction temperature control system can be stably applied to the high-temperature heating process of the heater without causing failures in the temperature adjustment function and the reagent detection function.

[0032] Those skilled in the art will readily understand that many modifications and changes can be made to the apparatus and method while maintaining the teachings of the present invention. Therefore, the above disclosure should be construed as being limited only by the appended claims.

Claims

1. A polymerase chain reaction heating device, comprising: at least one circuit board having an opening structure and a first surface and a second surface facing each other; a heater disposed inside the opening structure and exposed through the first surface and the second surface; a first heat conductive component disposed on the first surface, a first reagent storage portion, and at least one first heat conduction portion, wherein the first heat conductive component includes the above; a second heat conductive component disposed on the second surface, a second reagent storage portion assembled with the first reagent storage portion to form a reagent holder, and at least one second heat conduction portion, wherein the second heat conductive component includes the above; including wherein the at least one first heat conduction portion and the at least one second heat conduction portion are respectively in contact with two opposing positions of the heater to transfer heat generated by the heater toward the reagent holder. A polymerase chain reaction heating device.

2. The at least one circuit board is divided into a shielded region and a non-shielded region connected to each other. The opening structure is formed on the shielded region. The at least one first heat conduction portion and the at least one second heat conduction portion are disposed on the shielded region to clamp the at least one circuit board. The polymerase chain reaction heating device according to Claim 1.

3. The heater is electrically connected to a conductive contact point of the at least one circuit board, and the conductive contact point is disposed on the non-shielded region. The polymerase chain reaction heating device according to Claim 2.

4. The polymerase chain reaction heating device further includes two circuit boards separated from each other. The first heat conductive component includes a housing region and a positioning region connected to each other. The first reagent storage portion is disposed on the housing region together with a gap between the two circuit boards. The at least one first heat conduction portion is disposed on the positioning region. The polymerase chain reaction heating device according to Claim 2.

5. The at least one circuit board further has a through-hole structure formed on the shield region, and the first thermally conductive component has a locking hole structure formed on the positioning region so as to be aligned with the through-hole structure for a locking operation. The polymerase chain reaction heating device according to claim 4.

6. The first thermally conductive component has at least one heat dissipation hole structure formed on the accommodation region and disposed adjacent to the first reagent storage portion. The polymerase chain reaction heating device according to claim 4.

7. The polymerase chain reaction heating device according to claim 1, further comprising a temperature sensor disposed at a position of the at least one circuit board adjacent to the reagent holder.

8. The first thermally conductive component further includes a cover portion, and the cover portion is disposed on the at least one first thermally conductive portion and is adapted to cover the heater and the temperature sensor. The polymerase chain reaction heating device according to claim 7.

9. The heater is a temperature-controlled metal, ceramic substrate, or any component that generates heat by electricity. The polymerase chain reaction heating device according to claim 1.

10. A thermally conductive layer is disposed between the heater, the at least one first thermally conductive portion, and the at least one second thermally conductive portion. The polymerase chain reaction heating device according to claim 1.

11. A polymerase chain reaction heating device, an opening structure, and at least one circuit board having a first surface and a second surface facing each other, a heater disposed inside the opening structure and exposed through the first surface and the second surface, a first thermally conductive component disposed on the first surface, a first reagent storage portion, and at least one first thermally conductive portion, a first thermally conductive component including, and a second thermally conductive component disposed on the second surface, a second reagent storage portion assembled with the first reagent storage portion to form a reagent holder, and at least one second thermally conductive portion, a second thermally conductive component including, including The at least one first heat conduction part and the at least one second heat conduction part are respectively in contact with two opposing positions of the heater to transfer the heat generated by the heater towards the reagent holder, a polymerase chain reaction heating device, a heat dissipation device disposed adjacent to the polymerase chain reaction heating device to dissipate heat from the reagent holder, a light source disposed adjacent to the reagent holder, and an illumination beam radiated by the light source is projected onto the reagent holder, a spectrometer disposed adjacent to the reagent holder and adapted to receive a detection signal generated by the illumination beam projected onto the reagent holder for signal analysis, A polymerase chain reaction temperature control system comprising.

12. The at least one circuit board is divided into a shielded area and a non-shielded area connected to each other. The opening structure is formed on the shielded area. The at least one first heat conduction part and the at least one second heat conduction part are disposed on the shielded area to clamp the at least one circuit board. The polymerase chain reaction temperature control system according to claim 11.

13. The heater is electrically connected to a conductive contact of the at least one circuit board. The conductive contact is disposed on the non-shielded area. The polymerase chain reaction temperature control system according to claim 12.

14. The polymerase chain reaction heating device further includes two circuit boards spaced apart from each other. The first heat conductive component includes a housing area and a positioning area connected to each other. The first reagent storage part is disposed on the housing area together with the gap between the two circuit boards. The at least one first heat conduction part is disposed on the positioning area. The polymerase chain reaction temperature control system according to claim 12.

15. The at least one circuit board further has a through-hole structure formed on the shielded area. The first heat conductive component has a locking hole structure formed on the positioning area to align with the through-hole structure for a locking operation. The polymerase chain reaction temperature control system according to claim 14.

16. The polymerase chain reaction temperature control system according to claim 14, wherein the first heat conductive component has at least one heat dissipation hole structure formed on the accommodation region and disposed adjacent to the first reagent storage portion.

17. The polymerase chain reaction temperature control system according to claim 11, wherein the polymerase chain reaction heating device further includes a temperature sensor disposed at a position of the at least one circuit board adjacent to the reagent holder.

18. The polymerase chain reaction temperature control system according to claim 17, wherein the first heat conductive component further includes a cover portion, and the cover portion is disposed on the at least one first heat conductive portion and adapted to cover the heater and the temperature sensor.

19. The polymerase chain reaction temperature control system according to claim 11, wherein a heat conductive layer is disposed between the heater, the at least one first heat conductive portion, and the at least one second heat conductive portion.

20. The polymerase chain reaction temperature control system according to claim 11, wherein the heater is a temperature-controlled metal, a ceramic substrate, or any component that generates heat by electricity.

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