Wiring board and method for manufacturing a wiring board

The described method enhances adhesion between conductor and insulating layers in wiring boards by exposing and roughening conductor pads, using a coating film to improve bonding, addressing delamination and liquid intrusion issues while maintaining high-frequency transmission.

JP2026096350APending Publication Date: 2026-06-15IBIDEN CO LTD
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Patent Information

Application Number
JP2024210107
Authority / Receiving Office
JP · JP
Patent Type
Applications
Current Assignee / Owner
Filing Date
2024-12-03
Publication Date
2026-06-15

AI Technical Summary

Technical Problem

The existing methods for manufacturing wiring boards face challenges in achieving good adhesion between conductor layers and insulating layers due to strong adhesion of resist to interlayer materials, leading to difficulties in peeling off the resist and potential delamination issues.

Method used

A manufacturing method that includes forming a first conductor layer with conductor pads and wiring patterns, applying a coating film, exposing and roughening the conductor pads, and forming a second insulating layer with a connecting conductor to improve adhesion, using a coating film that enhances bonding between the conductor layer and insulating layer.

Benefits of technology

The method enables the production of wiring boards with improved adhesion between conductor and insulating layers, reducing delamination risks and maintaining high-frequency transmission characteristics while preventing liquid intrusion and connection failures.

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Abstract

Improved quality of wiring boards. [Solution] The method for manufacturing the wiring board 100 of the embodiment includes forming a first conductor layer 11 having a conductor pad 1a and a wiring pattern 1b on a first insulating layer 21; providing a coating film 5 to cover the first conductor layer 11; removing the coating film 5 covering the conductor pad 1a to expose the surface of the conductor pad 1a; roughening the exposed conductor pad 1a; forming a second insulating layer 22 on the first insulating layer 21 to cover the coating film 5 and the conductor pad 1a; forming a second conductor layer 21 on the second insulating layer 22; and forming a connecting conductor 4 that penetrates the second insulating layer 22 and connects the conductor pad 1a and the second conductor layer 21.
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