Printed circuit board

Abstract

One of the various objectives of the present invention is to provide a printed circuit board that can improve the adhesion between the glass layer and the insulating layer, and can improve issues such as voids and delamination. [Solution] The present invention relates to a printed circuit board comprising: a glass layer; metal vias penetrating at least a portion between the upper and lower surfaces of the glass layer; a first insulating layer disposed on the upper surface of the glass layer; a second insulating layer disposed on the upper surface of the first insulating layer and containing an insulating material different from that of the first insulating layer; a first wiring layer disposed on the upper surface of the second insulating layer; and a first connecting via that penetrates the first and second insulating layers together and connects at least a portion of the first wiring layer to the upper surface of the metal vias.