Temperature Control Device
The temperature control device addresses condensation issues by incorporating an air layer and protrusions to guide condensation away, enhancing reliability and accuracy in genetic testing devices.
Patent Information
- Application Number
- JP2023565731
- Authority / Receiving Office
- JP · JP
- Patent Type
- Patents
- Current Assignee / Owner
- Filing Date
- 2021-12-07
- Publication Date
- 2025-08-18
- Estimated Expiration
- 2041-12-07
AI Technical Summary
Conventional temperature control devices experience condensation on the sample rack surface due to cooling, leading to potential contamination and reduced testing accuracy.
A temperature control device design featuring a heat conduction section, cooling section, and a cover with an air layer between the heat conduction section and the cover, along with protrusions to guide condensation away from the opening, and optional heating or heat transfer mechanisms to maintain the cover above the dew point.
Prevents condensation on the cover surface, reducing contamination risks and maintaining testing accuracy by ensuring the cover remains above the dew point temperature.
Smart Images

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Abstract
Description
[Technical Field]
[0001] The present invention relates to a temperature control device. [Background technology]
[0002] There are genetic testing devices that can fully automate the extraction of samples containing DNA (deoxyribonucleic acid), mixing of reagents, amplification of DNA, and testing. These genetic testing devices generally have a temperature control device that keeps samples and reagents at low temperatures.
[0003] For example, Patent Document 1 discloses a sample thermostat equipped with a sample rack having multiple through holes for loading sample bottles from the top side, and a rack holder having a cooling element such as a Peltier element and a highly thermally conductive material in contact with the element. [Prior art documents] [Patent documents]
[0004] [Patent Document 1] Japanese Patent Application Publication No. 10-192719 Summary of the Invention [Problem to be solved by the invention]
[0005] In conventional temperature control devices, when cooling samples, etc., condensation can occur depending on the ambient temperature and humidity, and the temperature of the cooling unit. For example, Patent Document 1 above proposes a method of providing a discharge pipe to drain condensation water that accumulates on the bottom side of the rack holder. However, in the temperature control device described in Patent Document 1 above, a highly thermally conductive material is also in contact with the underside of the sample rack, so the sample rack itself is easily cooled, and condensation occurs on the top surface of the sample rack. Therefore, with the temperature control device described in Patent Document 1, the sample may be contaminated by condensation water splashing when inserting or removing a sample bottle, which could reduce testing accuracy.
[0006] The present invention has been made to solve such problems, and its object is to provide a temperature control device that suppresses the formation of condensation on the upper surface of the cover portion. [Means for solving the problem]
[0007] A temperature control device comprising a heat conduction section, a cooling section for cooling the heat conduction section, and a cover section that covers the top of the heat conduction section and has an opening through which a container can be inserted and removed, and an air layer is formed between the heat conduction section and the cover section. [Effects of the Invention]
[0008] According to the present invention, it is possible to provide a temperature control device that suppresses the formation of condensation on the upper surface of the cover. Objects, configurations, and effects other than those described above will become clear from the following description of the embodiments. [Brief explanation of the drawings]
[0009] [Figure 1] FIG. 1 is a schematic perspective view showing a temperature control device according to a first embodiment. [Figure 2] A cross-sectional view of A-A' in Figure 1. [Figure 3] FIG. 10 is a schematic perspective view showing a temperature control device according to a second embodiment. [Figure 4] FIG. 10 is a schematic side view showing a temperature control device according to a second embodiment. [Figure 5] Cross-sectional view of B-B' in Figure 3. [Figure 6] FIG. 6 is an enlarged cross-sectional view showing the shape of a convex portion in FIG. 5. [Figure 7] FIG. 10 is a schematic cross-sectional view showing a temperature control device according to a third embodiment. [Figure 8] FIG. 10 is a schematic cross-sectional view showing a temperature control device according to a fourth embodiment. DETAILED DESCRIPTION OF THE INVENTION
[0010] Hereinafter, embodiments of the present invention will be described using Examples 1 to 4. [Example]
[0011] Fig. 1 is a schematic perspective view showing a temperature control device 1 according to a first embodiment, and Fig. 2 is a cross-sectional view taken along the line A-A' in Fig. 1. As shown in Fig. 1 and Fig. 2, the temperature control device 1 of this embodiment includes a temperature control block 7 (thermal conduction unit), a temperature control unit 5 (cooling unit) that cools the temperature control block 7, and a cover unit 3 that covers the temperature control block 7 from above.
[0012] Here, the temperature control block 7 is made of aluminum and has multiple recesses 7a for holding the sample containers 4. However, the material of the temperature control block 7 is not limited to aluminum, and any metal with high thermal conductivity, such as copper or magnesium alloy, can also be used. The depth of the recesses 7a formed in the temperature control block 7 is preferably deeper than the liquid level of the solution 4a contained in the sample container 4 in order to maintain good cooling performance for the solution 4a. Furthermore, although not shown in the figure, a temperature sensor is disposed in the temperature control block 7.
[0013] The temperature control unit 5 is a Peltier element that is provided so as to be in contact with the underside of the temperature control block 7. The Peltier element has the function of adjusting the temperature of the solution 4a in the sample container 4 to a predetermined temperature by cooling the temperature control block 7, and specifically, adjusts the output so that the temperature measured by the temperature sensor in the temperature control block 7 becomes the predetermined temperature. However, since the Peltier element generates heat by cooling the temperature control block 7, a heat dissipation unit 6 is required to dissipate the heat. Although not shown, the heat dissipation unit 6 is structured to dissipate heat into the outside air using fins or a fan. Note that the temperature control unit 5 is not limited to a Peltier element, and may also introduce cold or hot water from a heat pump or chiller, or may have a structure that combines two or more of these.
[0014] The cover part 3 has an opening 3a for inserting and removing the sample container 4 so that its horizontal position coincides with the recess 7a provided in the temperature control block 7. The sample container 4 inserted through the opening 3a of the cover part 3 is supported by the recess 7a of the temperature control block 7. It is desirable that the cover part 3 be made of a material with a lower thermal conductivity than the temperature control block 7, such as resin or rubber. Furthermore, the cover part 3 does not have to be made of only one type of material, and may be made of a combination of two or more types of materials.
[0015] Furthermore, the temperature control device 1 of this embodiment has a heat insulating material 2 that covers the side of the temperature adjustment block 7. The heat insulating material 2 is, for example, a foam heat insulating material, and has higher heat insulating performance than the cover part 3. Therefore, unlike the upper end surface of the temperature adjustment block 7, the upper end surface of the heat insulating material 2 is in contact with the cover part 3.
[0016] Next, the air layer 10 formed between the temperature control block 7 and the cover part 3 will be described. As shown in FIG. 2, the upper end surface of the temperature control block 7 and the lower surface of the cover part 3 are spaced apart, and a space is defined by the temperature control block 7, the heat insulating material 2, and the cover part 3 (and the sample container 4). The air layer 10 present in this space serves as an insulating layer, and suppresses the transfer of heat from the cover part 3 to the temperature control block 7. Therefore, even when the temperature control device 1 cools the temperature control block 7 to a temperature lower than the outside air temperature, the surface temperature of the cover part 3 exposed to the outside air is maintained higher than the temperature of the temperature control block 7. In other words, even when the temperature of the temperature control block 7 becomes lower than the dew point of the outside air, the surface temperature of the cover part 3 is maintained at a temperature higher than the dew point of the outside air, making it difficult for condensation to form on the upper surface of the cover part 3.
[0017] Here, we consider the desirable thickness of the air layer 10. As a premise, we use a general resin material for the cover portion 3, with a thickness of 5 mm and a thermal conductivity of 0.2 W / m·K, i.e., a thermal resistance of 2.5 K / W. Furthermore, we assume that the conditions under which condensation is likely to occur are an outside air temperature of 30°C and an outside humidity of 80%, i.e., an outside dew point temperature of 26.2°C. Furthermore, we assume that the thermal conductivity of the air layer 10 is 0.026 W / m·K, the heat transfer coefficient due to natural convection from the surface of the temperature control block 7 to the air is simply 15 W / m2·K, and the surface area of the temperature control block 7 is 0.01 m2. We also assume that the set temperature of the temperature control block 7 is 15°C.
[0018] Under these assumptions, if the thickness of the air layer 10 is 5 mm, the thermal resistance of the air layer 10 is 19.2 K / W, and the equivalent thermal resistance to air due to natural convection is 6.67 K / W. Calculating the surface temperature of the cover part 3 based on these thermal resistance values gives an estimated value of 26.5°C. In other words, since the surface temperature of the cover part 3 is higher than the dew point temperature of the outside air, which is 26.2°C, it is possible to suppress condensation on the top surface of the cover part 3.
[0019] The desirable thickness of the air layer 10 varies depending on the material and thickness of the cover part 3, the set temperature of the temperature control block 7, etc., but the upper limit should be 10 mm. The reason for this is that if the air layer 10 is thicker than 10 mm, heat transfer due to natural convection within the air layer 10 increases, causing the cover part 3 to cool too much.
[0020] Furthermore, in the above study, only natural convection in the air layer 10 was considered, but in reality, the effects of heat transfer due to radiation must also be considered. Therefore, by forming the lower surface of the cover part 3 (the surface facing the temperature control block 7) and the upper end surface of the temperature control block 7 (the surface facing the cover part 3) from a material with low emissivity, it is possible to suppress the effects of heat transfer due to radiation between the cover part 3 and the temperature control block 7. For example, it is conceivable to metal-plate the lower surface of the cover part 3 or to laminate a thin metal plate or film thereon.
[0021] As described above, according to this embodiment, the air layer 10 exists between the temperature control block 7 and the cover part 3, which prevents a decrease in the surface temperature of the cover part 3 and prevents condensation from occurring on the upper surface of the cover part 3. Furthermore, since outside air containing water vapor other than air that is already present as the air layer 10 is not supplied to the upper end surface of the temperature control block 7, it is also possible to reduce the amount of condensation that occurs on the upper end surface of the temperature control block 7.
[0022] The cover part 3 and the heat insulating material 2 do not have to be constructed separately, but may be constructed integrally using a common foam or the like. Even if the cover part 3 is made of a material with high heat insulating properties such as foam, it is difficult to make the top surface thicker than the sides, and the presence of condensation is likely to affect the insertion and removal of the sample container 4, so an air layer 10 is necessary to separate the upper end surface of the temperature control block 7 from the lower surface of the cover part 3. Furthermore, the air layer 10 is not limited to a single layer, and may have a structure in which multiple layers are stacked in the vertical direction. Furthermore, in order to improve the sealing performance of the air layer 10, an elastic member such as a packing may be provided on the inner surface of the opening 3a of the cover part 3 to reduce the gap with the sample container 4. [Example]
[0023] Fig. 3 is a schematic perspective view showing a temperature control device 1 according to a second embodiment, and Fig. 4 is a schematic side view showing the temperature control device 1 according to the second embodiment. As shown in Figs. 3 and 4, the temperature control device 1 of this embodiment has a plurality of protrusions 3b extending in the left-right direction (x direction) and arranged in the front-rear direction (y direction) on the underside of the cover part 3. These protrusions 3b may extend in the front-rear direction as long as they are arranged between adjacent openings 3a. Furthermore, the protrusions 3b may be formed so that they protrude by recessing the surrounding area.
[0024] FIG. 5 is a cross-sectional view taken along the line B-B' in FIG. 3, and FIG. 6 is an enlarged cross-sectional view of the protrusion 3b in FIG. 5. As shown in FIGS. 5 and 6, the height h2 of the protrusion 3b near the left-right edge is higher than the height h1 of the protrusion 3b near the center in the left-right direction. In other words, the protrusion 3b protruding downward from the cover portion 3 becomes lower from the center toward the edge. By providing the protrusion 3b with such a shape on the underside of the cover portion 3, condensation water generated by the water vapor contained in the air layer 10 is guided by capillary action toward the edge where the gap with the temperature control block 7 is small. Here, the discharge of condensation water by capillary action may be further promoted by subjecting the protrusion 3b of the cover portion 3 to a hydrophilic treatment.
[0025] The condensed water guided toward the edge by the convex portion 3b may be guided to a separately provided storage portion or discharge portion, but even if it simply collects on the edge, it is located away from the opening 3a, and therefore scattering of the condensed water when the sample container 4 is inserted or removed can be prevented. In other words, even if condensed water occurs on the upper end surface of the temperature control block 7, contamination of the sample due to scattering of the condensed water can be prevented, and a decrease in testing accuracy can be suppressed. Note that, although a convex portion may be provided on the upper end surface of the temperature control block 7 to discharge the condensed water, it is desirable to provide the convex portion on the underside of the cover portion 3, since condensed water may accumulate between the convex portions. [Example]
[0026] FIG. 7 is a schematic cross-sectional view showing a temperature control device 1 according to a third embodiment, and corresponds to FIG. 2 of the first embodiment. As shown in FIG. 7, the temperature control device 1 of this embodiment includes a heating unit 11 that heats the cover unit 3. Examples of the heating unit 11 include a ceramic heater, a film heater, and a Peltier element. The cover unit 3 is also provided with a temperature sensor (not shown). Therefore, the heating unit 11 controls the temperature of the top surface of the cover unit 3 based on the temperature measured by the temperature sensor so that the temperature does not fall below the dew point temperature, thereby preventing condensation from occurring on the top surface of the cover unit 3.
[0027] Here, if the temperature control device 1 has a sensor that measures the temperature and humidity of the outside air, it may specifically calculate the dew point temperature of the outside air and control the heating unit 11 so that the temperature exceeds the calculated dew point temperature. If the dew point temperature of the outside air cannot be specifically calculated, it is also possible to assume a dew point temperature under conditions that make condensation likely, and control the heating unit 11 so that the temperature exceeds the dew point temperature.
[0028] Furthermore, since the heating unit 11 in this embodiment is provided on the upper surface of the cover unit 3, far from the temperature control block 7, a decrease in the performance of cooling the sample container 4 is also suppressed. However, the location where the heating unit 11 is provided is not limited to the upper surface of the cover unit 3, and the heating unit 11 may also be provided on the lower surface of the cover unit 3 or on the outside of the heat insulating material 2.
[0029] Furthermore, the heating unit 11 in this embodiment does not need to be provided on the entire upper surface of the cover unit 3. For example, if at least the upper surface of the cover unit 3 is made of a material with high thermal conductivity (for example, a metal material such as copper, aluminum, or stainless steel, or a graphite sheet), the entire upper surface of the cover unit 3 can be heated uniformly by simply bringing the heating unit 11 into contact with only a part of the cover unit 3. [Example]
[0030] Fig. 8 is a schematic cross-sectional view showing a temperature control device 1 according to Example 4, and corresponds to Fig. 2 of Example 1 and Fig. 7 of Example 3. As shown in Fig. 8, the temperature control device 1 of this example has a heat transfer connection part 12 that transfers heat from the heat dissipation part 6 to the upper surface of the cover part 3. One end of the heat transfer connection part 12 contacts the heat dissipation part 6, and the other end contacts the cover part 3. In this way, by thermally connecting the heat dissipation part 6 and the cover part 3 and using the heat generated in the temperature adjustment part 5 to heat the cover part 3, it is possible to prevent condensation on the upper surface of the cover part 3.
[0031] The heat transfer connection part 12 is preferably made of a material with high thermal conductivity, and is desirably formed of aluminum, copper, graphite, or the like. Here, if the heat transfer connection part 12 has a large cross-sectional area, such as a plate shape, the heat transfer area increases, and it is possible to further promote heating of the cover part 3. A heat pipe may also be used as the heat transfer connection part 12. Furthermore, the heat transfer connection part 12 may be connected not only to the heat dissipation part 6 but also to other heat sources, such as a power source that drives the temperature control device 1 or a semiconductor element provided on the control board of the genetic testing device, so that the heat from that heat source is conducted to the cover part 3.
[0032] The above-mentioned embodiments have been described in detail to clearly explain the present invention, and are not necessarily limited to those having all of the configurations described. Furthermore, it is possible to replace part of the configuration of one embodiment with the configuration of another embodiment, or to add the configuration of another embodiment to the configuration of one embodiment. It is also possible to add, delete, or replace part of the configuration of each embodiment with other configurations. [Explanation of symbols]
[0033] 1...Temperature control device, 2...Insulating material, 3...Cover portion, 3a...Opening, 3b...Convex portion, 4...Sample container, 4a...Solution, 5...Temperature control portion, 6...Heat dissipation portion, 7...Temperature control block, 7a...Concave portion, 10...Air layer, 11...Heating portion, 12...Heat transfer connection portion
Claims
1. A temperature control device comprising: a temperature control block having a plurality of recesses for holding containers; a cooling unit for cooling the temperature control block; and a cover unit covering the temperature control block from above and having an opening through which the containers are inserted and removed, The cover portion is exposed to the outside air, an air layer is formed between the upper end surface of the temperature control block and the lower surface of the cover portion; A temperature control device, wherein the thickness of the air layer is 10 mm or less.
3. 2. The temperature control device according to claim 1, A temperature control device characterized in that a convex portion that becomes lower from the center toward the edge is provided on the underside of the cover portion.
4. 2. The temperature control device according to claim 1, The temperature control device further comprises a heating unit that heats the cover unit.
5. 2. The temperature control device according to claim 1, 10. A temperature control device further comprising: a heat dissipation section that dissipates heat generated in the cooling section; and a heat transfer connection section that transfers heat from the heat dissipation section to the cover section.
Citation Information
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