Composite thermistor element

Abstract

An aspect of the disclosure relates to a composite thermistor element (10). The element comprises a sensor material (1) disposed between a pair of electrodes (2a, 2b). The sensor material comprises particles (3) in a dielectric matrix (4). The particles (3) have a core (6) with a temperature dependent resistance and a coating layer (7) of an inorganic material. The particles form an electronic conduction path (5) between the electrodes (2a, 2b) with a temperature dependent resistance and a baseline resistance. Further aspects relate to methods of making thermistors, coated particles, compositions for use in making composite thermistors comprising the particles, and temperature sensors comprising the thermistors disclosed herein.

Description

[Technical Field]

[0001] The present disclosure relates to composite thermistor elements comprising particles dispersed in a matrix, their manufacture, compositions for making sensor materials, and temperature sensors comprising the composite thermistor elements. [Background technology]

[0002] A thermistor is a type of resistor whose resistance has a specific temperature dependence. If the dependence is known, the resistance can be used as an indicator of temperature. Typically, ceramics contain primarily oxides of transition elements such as Mn, Zn, Fe, Co, Ni, and Cu, which are known to have specific temperature coefficients of resistance.

[0003] Two main routes are known for the manufacture of ceramic thermistor elements. The first route involves sintering a mixture of precursor materials into a predetermined shape, such as in a mold. After sintering, the ceramic may be further machined into the final shape, for example, by sawing and / or mechanical milling. The second route involves forming the element by depositing a composition containing heat-resistant particles, such as by sputtering or printing. WO2018164570 discloses a printed temperature sensor containing a sensor material including semiconducting microparticles containing a ceramic NTC material with a negative temperature coefficient. The sensor material is formed by mixing microparticles with strong NTC behavior in a dielectric matrix composition, for example, by including a polymer with a solvent to form the sensor material as an ink or paste. The ink or paste is solidified or cured by evaporating the solvent without crosslinking the dielectric matrix and / or melting or sintering the microparticles.

[0004] Regardless of the known thermistor manufacturing route, the electrical properties of the refractory material, such as its conductivity, are controlled by controlling the composition, such as the doping concentration, of the ceramic sensing material. When doing so, the temperature-dependent resistance of the material cannot be further altered, limiting the applicability of the bulk ceramic of a given ceramic particle to sensing applications within a defined temperature range. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] WO2018164570 [Non-patent literature]

[0006] [Non-Patent Document 1] Nowotny, Janusz (2011) in Oxide Semiconductors for Solar Energy Conversion: Titanium Dioxide. CRC Press. p. 156. ISBN 9781439848395 Summary of the Invention [Problem to be solved by the invention]

[0007] The present invention aims to improve upon the above by providing methods and materials that allow tailoring of the electrical properties of refractory ceramics. [Means for solving the problem]

[0008] Aspects of the present disclosure relate to composite thermistor elements, which may be particularly useful for determining temperature by measuring electrical resistance across the element. The elements include a sensor material disposed between a pair of electrodes. The sensor material includes particles dispersed in a matrix. The particles contact one another to form an electronic conduction path between the electrodes, e.g., along an interconnected network of contacting particles throughout the sensor material.

[0009] The particle has a core comprising a semiconductive ceramic material with a temperature-dependent resistance, e.g., a material-specific temperature-dependent resistance coefficient. The particle has a coating layer of an inorganic material. The coating layer imparts electrical resistance to the particle. Thus, the resistive coating imparts electrical resistance throughout the sensor material along the electron conduction path between electrodes. The thickness and / or electrical properties, e.g., conductance, are in accordance with a predetermined baseline resistance throughout the sensor material. Typically, the thickness of the coating layer is within a range that allows electron tunneling between contacting particle cores.

[0010] The contacting particles, e.g., the interconnected network, act as a conductive path between electrodes with a temperature-dependent conductivity coefficient. It can be understood that particles including a coating act as heat-resistant particles with a temperature-dependent resistance coefficient. Depending on the core composition, the coefficient may be negative (NTC) or positive (PTC). The matrix is ​​non-conductive and acts as a binder for the particles. The matrix is ​​formed of an electrically insulating composition, e.g., a dielectric composition, and typically includes a polymer composition, usually crosslinked. The electrical resistance of the path has been found to have a baseline resistance believed to be dominated by the particle core and a temperature-dependent component. The baseline resistance has been found to be dominated by the coating layer, which acts as a barrier between adjacent contacting particles.

[0011] Advantageously, it has been found that the baseline resistance imparted by the coating layer does not significantly affect the temperature-dependent coefficient of resistance of the particle and / or thermistor. Providing particles with a coating layer of electrically resistive, semi-conductive, or even insulating material advantageously allows for tailoring the conductivity throughout the heat-resistant particle without adversely affecting the temperature-dependent component. It has been found that the baseline resistance can be effectively adjusted by controlling the properties of the coating layer, including its thickness and / or composition (electrical resistivity).

[0012] Controlling the baseline resistance advantageously allows for the selection or adjustment of semiconducting ceramic materials to obtain thermistors with desired electrical properties, including an inherent temperature-dependent resistance coefficient (β) and total resistance, that remain within the practical detection range for a given temperature window. In practice, the lower limit of the detection range is typically defined by the electrical resistance of the electrode material and / or electrical wiring. The upper limit is typically defined by the sensitivity of the readout circuitry. Typically, the sensor material included in the thermistor will vary from about 10 times the resistance of the wiring and / or electrodes to about 10 times the resistance of the wiring and / or electrodes within a given operating temperature range. 11 The resistance is designed to have a resistance in the range of 10 ohms (approximately 10 gigaohms). Typically, the resistance is between 10 and 10 GΩ. Preferably, the resistance is greater than 100 Ω, more preferably greater than 1 kΩ. Preferably, the resistance is less than 1 GΩ, for example, in the range between 100 ohms and 1 gigaohm. Having a resistance close to the resistance of electrical wiring, for example, in the case of NTC materials, reduces the thermistor sensitivity as the temperature increases. If the resistance is too high, for example, in the case of PTC materials, read noise increases as the temperature increases.

[0013] The inorganic coating layer can thus be understood to provide a substantially temperature-independent baseline resistance component in addition to the temperature-dependent component of the particles. The relative contribution of the baseline resistance to the overall resistance of the particles and sensor material as a whole can be adjusted by selecting the thickness and / or resistance of the coating material. In this way, the baseline resistance of the sensing material can be tailored to a desired temperature regime substantially independent of the inherent temperature-dependent coefficient of the varying semiconducting ceramic material. This insulating layer effectively results in the formation of a tunneling barrier between the semiconducting particles, increasing the baseline resistance while leaving the bulk conduction mechanism of the semiconducting particles unchanged.

[0014] It can be appreciated that the inorganic coating layer disclosed herein can advantageously be a conformal layer encapsulating the core forming a substantially defect-free shell. By providing a conformal insulating shell, preferably a substantially defect-free shell, direct electrical contact between the heat-sensitive cores of adjacent particles can be reduced or even avoided.

[0015] A further aspect of the present disclosure relates to a method for making the composite thermistor disclosed herein. The method includes providing a powder of a semiconductive ceramic having a temperature-dependent resistance, typically selected with a known or desired temperature-dependent resistance coefficient (β). The method further includes coating the powder with an inorganic material to form particles having a core comprising the semiconductive ceramic and a resistive or insulating coating layer of inorganic material. The method further includes processing a composition comprising the coated particles and an electrically insulating matrix material or a precursor thereof to form a sensor material between a pair of electrodes, the sensor material comprising particles dispersed in the matrix, the particles contacting each other to form an electronic conduction path between the electrodes. In a preferred embodiment, the thickness of the coating layer is determined according to a predetermined baseline resistance throughout the sensor material.

[0016] In a preferred embodiment, processing the composition includes placing the composition between a pair of electrodes, such as prefabricated electrodes, disposed on a substrate, preferably a flexible substrate such as a polymer film. Alternatively, one or more electrodes can be provided on a processed layer of the composition.

[0017] Another aspect of the present disclosure relates to the particles disclosed herein, i.e., semiconductive cores with inorganic coating layers. Yet another aspect relates to compositions comprising the particles disclosed herein. The particles and compositions can be particularly useful in the manufacture of sensor materials for the composite thermistor elements disclosed herein.

[0018] Yet another aspect relates to a temperature sensor including a thermistor element according to the present invention.

[0019] These and other features, aspects, and advantages of the apparatus, systems, and methods of the present disclosure will become better understood from the following description, appended claims, and accompanying drawings, where: [Brief explanation of the drawings]

[0020] [Figure 1A] 1A and 1B schematically represent a top view of an embodiment of a composite thermistor element. [Figure 1B] 1A and 1B schematically represent a cross-sectional side view of an embodiment of a temperature sensor. [Figure 2A] 1 shows a transmission electron micrograph of a comparative particle. [Figure 2B] 1 shows a transmission electron micrograph of particles according to the present invention. [Figure 3A] 1 illustrates a schematic diagram of a method for manufacturing a thermistor. [Figure 3B] 10 shows experimental results of an embodiment of a fabricated composite thermistor element. [Figure 3C] The thermal sensitivity behavior of thermistors is compared. [Figure 4] 10 shows experimental results for an embodiment of a composite thermistor element. [Figure 5]10 shows experimental results for an embodiment of a composite thermistor element. [Figure 6] 1 illustrates the manner in which a composite thermistor element according to the present invention operates; DETAILED DESCRIPTION OF THE INVENTION

[0021] The terminology used to describe particular embodiments is not intended to limit the invention. As used herein, the singular forms "a," "an," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. The term "and / or" includes any and all combinations of one or more of the associated listed items. It is understood that the terms "comprises" and / or "comprising" specify the presence of the stated features but do not exclude the presence or addition of one or more other features. Furthermore, unless otherwise specified, when a particular step of a method is referred to as following another step, it is understood that the other step may follow directly, or that one or more intermediate steps may be performed prior to the performance of the particular step. Similarly, unless otherwise specified, when a relationship between structures or components is described, it is understood that this relationship may be established directly or through intermediate structures or components.

[0022] In the thermistor literature, the term "ceramic" or "high density ceramic" is usually used to refer to a sintered macroscopic product, e.g., an NTC active element of a sensor formed from a sintered precursor material, as opposed to a heat-resistant material formed from particles according to the present invention, which may be understood as not being sintered into a single macroscopic phase. As used herein, the term "ceramic" may be understood to refer to a substantially inorganic material. Ceramics are primarily composed of oxides of transition elements.

[0023] The present invention will now be described in more detail with reference to the accompanying drawings, in which embodiments of the invention are shown. In the drawings, absolute and relative sizes of systems, components, layers, and regions may be exaggerated for clarity. Embodiments may be described with reference to schematic illustrations and / or cross-sectional views of idealized embodiments and intermediate structures of the invention to the greatest extent possible. In this specification and the drawings, like numbers refer to like elements throughout. Related terms and derivatives thereof should be construed as indicating the orientation currently described or shown in the drawings under discussion. These related terms are for convenience of description and do not require that the system be constructed or operated in a particular orientation, unless specifically specified.

[0024] FIG. 1A schematically illustrates a top view of an embodiment of a thermistor element 10 for measuring, for example, temperature.

[0025] 1B schematically depicts a cross-sectional side view of an embodiment of a temperature sensor 50 including readout electronics 40 and a thermistor element 10. Details and particular advantages of the sensor will be explained after a discussion of the details of the thermistor element and its manufacturing method.

[0026] In one embodiment, the thermistor element 10 includes or is formed on a substrate 30. Alternatively, the thermistor may be formed as a freestanding product. The thermistor includes a pair of electrodes 2a, 2b. The electrodes 2a, 2b are separated by an electrode gap G. A sensor material 1 is disposed between the electrodes 2a, 2b to fill the electrode gap G. The sensor material 3 includes particles 3 according to the present disclosure. The particles 3 are dispersed in a non-conductive (electrically insulating) matrix 4. The resistance of the matrix is ​​significantly higher, typically at least 100 times or higher, e.g., at least 1000 times higher, than the resistance along the path of the contacting particles. The electrically insulating matrix 4 may function as a binder. In the illustrated embodiment, the matrix includes a crosslinked network of a polymer composition.

[0027] The particle 3 has a core 6 composed of a semiconducting ceramic with a temperature-dependent resistance. The ceramic is typically selected according to the desired temperature coefficient of resistance (β). As is known, the temperature-dependent resistance can be effectively modeled or determined using the so-called B-factor of the Steinhart equation. Preferably, the temperature-dependent coefficient of resistance (B-factor) is in the range between 3000 and 5000 K.

[0028] Surrounding the core is a coating layer 7 of inorganic material having a thickness 7t.

[0029] As shown, individual particles 3 contact each other to form conductive paths 5 through the matrix 4. The contacting particles electrically connect the electrodes 2a, 2b. Electrons (e - Two distinct modes of transport are believed to contribute to the conductivity along the pathway. The first mode (shown by the dashed line) can be represented by temperature-dependent electrical conduction throughout the semiconductor core 6. Depending on the conductivity of the coating layer, the second mode (shown by the dotted line 5) can be represented by resistive conductance or direct electron tunneling throughout the insulating coating layer bridging the shortest distance between adjacent particle cores, i.e., between adjacent cores.

[0030] For NTC and PTC semiconductor cores, conduction can be described as "polaron hopping." Conductance throughout the matrix was found to be negligible. As described in more detail below, conductance through the core was found to be highly temperature dependent, while tunneling or resistive conductance was not, and the inventors believe this allows for tuning the particle conductivity without changing the temperature-dependent component.

[0031] It has been found that the baseline resistance can be effectively adjusted by controlling the insulating properties of the insulating coating layer.

[0032] While NTCs are believed to follow an exponential function, PTC-type materials are believed to follow an S-like curve with switching temperature governed by the chemical composition of the ceramic (see FIG. 3C). For example, a change in crystal structure at a certain temperature can result in a significant, or even complete, loss of conductivity. The application of a coating layer as disclosed herein can be used to adjust the baseline resistance, e.g., to adjust the switching characteristics of a PTC thermistor for overcurrent protection, similar to NTC materials.

[0033] Without being bound by theory, the inventors find that the current through an insulator (an insulating oxide barrier) increases either through "Fowler-Nordheim" tunneling or through a "direct" tunneling mechanism. For "thicker" oxides (e.g., thicknesses beyond the direct tunneling regime), the Fowler-Nordheim mechanism is believed to dominate. This mechanism is voltage (electric field) dependent. Therefore, the current is believed to increase exponentially with oxide thickness, allowing the baseline resistance to be reliably adjusted by controlling the thickness of the insulating overlayer.

[0034] Of course, while the above illustrations (FIGS. 1A and 1B) are two-dimensional, in reality, three-dimensional networks may be formed. The illustrations show, in a simplified manner, one possible pathway, but many more pathways may exist. It may be appreciated that the present disclosure may provide a network of individual or independent (unfused) particles that may be in close relative distance to one another and / or in contact with one another, without the need to fuse the particles to form a continuous material, i.e., without the need to process the particles at high temperatures to sinter or melt them together.

[0035] It will be understood that the particle shapes depicted in Figure 1A should not be construed as limiting, and that the effect of tailoring conductivity throughout the particle by application of an insulating coating also applies to particles having alternative shapes and / or dimensions, and particularly to particles having irregular shapes, such as particles or powders formed by crushing, grinding, or crushing high density ceramics.

[0036] The electrodes are typically made of metal and can be deposited via sputtering of metals such as Al, Mo, Ag, Au, and Cu. Preferably, however, the electrodes are also printed, e.g., made of silver paste or ink, or copper. For example, the electrodes can have a layer thickness ranging from 0.1 to 10 μm. By forming interdigitated finger electrodes (drivers), the electrode gap can be relatively long laterally relative to the gap distance, e.g., at least 10 times the minimum gap distance. This can reduce the overall resistance of the thermistor.

[0037] In a preferred embodiment, the semiconductive ceramic comprises or is substantially made of a material having a negative temperature coefficient (NTC). NTC thermistors can be particularly useful for temperature sensing applications. Advantageous NTC is found in semiconductive ceramics (metal oxides) with a spinel oxide structure, particularly NiMn2O4, CuFe2O4, CoMn2O4, and Fe2O3. Particles with manganese spinel oxide may be particularly suitable. Optionally, additional oxides of other elements, such as Cu, Fe, Co, Ni, and Zn, may also be included. For example, manganese spinel oxide can be produced by uniformly dispersing a metal oxide precursor powder in a pellet, which is pressed and calcined, preferably at temperatures above 1000°C, e.g., 1100°C.

[0038] In another or another preferred embodiment, the semiconducting ceramic has a positive temperature coefficient (PTC). Devices with PTC materials exhibit self-limiting current flow as temperatures increase, minimizing the risk of overheating.

[0039] Providing a coating layer on the core advantageously allows for the selection of a semiconducting ceramic material that has a specific desired β value in a first practical operating temperature range and for shifting the practical operating range to another higher temperature range.

[0040] In principle, the operable range can be shifted by any desired amount by appropriate selection of the properties of the insulator layer. For example, the operable range can be shifted by about 50°C or 100°C or more, e.g., 150°C or 200°C, by, for example, controlling the thickness of the insulator layer. For example, it has been found that the application of an insulator layer makes it possible to use ceramic particles with a desired β value within the operable range of 0 to 100°C, such as Mn-Zn-oxide-based ceramics with specific doping concentrations, and to use these particles to form a sensor with an operable temperature range between 150 and 250°C. In practice, the upper operating temperature of the sensor can be limited by the stability of the sensing material, e.g., the thermal decomposition temperature of the matrix material.

[0041] In a preferred embodiment, the particles have an average maximum cross-sectional dimension in the range between 100 nanometers and 50 micrometers. Typically, the average maximum cross-sectional dimension is in the range between 1 and 45 micrometers, e.g., between 5 and 40 micrometers. Particle compositions with average values ​​outside the above ranges may be more difficult to handle, e.g., due to dustiness and / or practical limitations during deposition, e.g., screen printing, of the sensor material. Preferably, the sensor material does not include particles with dimensions greater than 45 micrometers.

[0042] It can be appreciated that the thickness of the coating layer can be set according to an intended purpose, such as a target baseline resistance, with increasingly thicker layers found to increase the baseline resistance. An excessively thick layer can cause the resistance along the path 5 to approach that of the matrix 4. Typically, the coating layer 7 has a thickness 7t in the range of up to 10 nanometers or more, such as about 12 nm or even more, e.g., 15 nm. Typically, the thickness of the insulator layer is at least 1.0 nm, preferably greater than 2.0 nanometers. In some embodiments, the thickness is in the range of 1 to 15 nm, preferably in the range of 2 to 15 nm, typically between 2 and 12 nm or between 3 and 10 nm.

[0043] Alternatively, or in addition, the baseline resistance can be set by selecting the properties of the coating layer: a lower resistance requires a thicker layer to achieve the same resistance, and vice versa.

[0044] It is understood that the coating layer is typically formed of a composition different from that forming the core. In particular, the insulating coating layer of the core is not to be construed as consisting of an oxide, e.g., a native oxide. Instead, the coating layer is an intentionally added inorganic layer.

[0045] In one embodiment, the cover layer is formed of an electrically insulating composition. In another or another embodiment, the cover layer is formed of a semiconductive material. In another or another embodiment, the cover layer is formed of an electrically insulating material.

[0046] In some embodiments, the coating layer comprises or consists essentially of a metal or metalloid oxide or nitride, such as aluminum oxide, aluminum nitride, zirconium oxide, silicon oxide, titanium oxide, or mixtures thereof. Aluminum oxide, aluminum nitride, zirconium oxide, silicon oxide, titanium oxide, or mixtures thereof have been found to be particularly useful materials for coating the semiconducting core in terms of layer stability, layer durability, and / or processability, as described in more detail below.

[0047] Preferably, the inorganic material is an oxide layer. In some embodiments, the inorganic material is a dielectric material. Preferably, the dielectric material has a relative dielectric constant (εr) of at least 3. Preferably, the coating layer is a high-κ dielectric layer. The term "high-κ dielectric" refers to a material that has a high dielectric constant (κ, kappa) compared to silicon dioxide.

[0048] Alternatively, or in addition, the inorganic material may be characterized by an electron tunneling or bandgap barrier height. The bandgap and its arrangement of the bulk material layers can govern the efficiency of their electrical contacts. Furthermore, the bandgap also governs whether outer layers are conductive or not. Typically, the bandgap is at least about 2.0 eV, e.g., >2.5 eV, and preferably at least 3 eV. For rutile titanium oxide, a bandgap of 3.05 has been reported (Nowotny, Janusz (2011) in Oxide Semiconductors for Solar Energy Conversion: Titanium Dioxide. CRC Press. p. 156. ISBN 9781439848395). In some embodiments, the bandgap is at least 5 eV, preferably at least 6 eV. Materials with higher bandgaps are typically more resistive and can therefore provide a desired baseline resistance with a relatively thin coating layer compared to more conductive materials. Silicon oxide, aluminum oxide, and aluminum nitride have been found to constitute materials that offer high bandgaps exceeding 6 eV. Generally, the classification of materials as metals, semiconductors, and insulators is based on bandgap theory. In metals, the valence and conduction bands overlap, making them good conductors of heat and electricity. For semiconductors and insulators, a finite gap exists between the valence and conduction bands. The bandgap energy (ΔE) is the energy difference between the valence and conduction bands of a material (in its solid state). Generally, if ΔE≦3.2 eV (at T=0 K), the material is called a semiconductor. If ΔE>3.2 eV, the material is usually called an insulator.

[0049] Preferably, the coating layer surrounding the core has a uniform thickness. A uniform thickness can be understood as a layer having a thickness with a deviation of 50% or less from the average layer thickness. Preferably, the deviation is low, for example, less than 20%. In absolute terms, the thickness variance around the core is preferably 3.0 nm or less, preferably less than 2.0 nm, and most preferably less than 1.0 nm. Alternatively, or in addition, the coating layer is substantially gap-free. More preferably, the coating layer is a conformal layer. Providing a layer with a uniform thickness and / or a gap-free coating layer reduces the spread of baseline conductance throughout the sensing material, particularly thermistors, and ensures that the gap between electrodes and the average maximum cross-sectional dimension of the particles are of the same order of magnitude or similar, i.e., the conductive path between opposing electrodes is formed by a limited number of contacting particles (N<about 20), e.g., the minimum distance of the electrode gap is in the range of 1 to 10 times the average particle diameter.

[0050] As will be explained in more detail below with reference to FIG. 3, the coating layer may be suitably provided by atomic layer deposition.

[0051] FIG. 2B shows a transmission electron micrograph of a particle according to the invention, having a Mn-Ni ceramic oxide core 6 coated with a conformal insulating layer 7 of aluminum oxide. The coating layer is applied by atomic layer deposition. The core is provided by a granular high-density ceramic, e.g., a high-density ceramic crushed to a fine powder. As shown, the thickness of the coating layer is 6 nm. The spread was found to be much lower than 1 nm. FIG. 2A shows a comparative uncoated powder, i.e., a ceramic core without a coating layer. The scale bars in each of the micrographs in FIGS. 2A and 2B represent 30 nm.

[0052] 3A illustrates a schematic diagram of a method 100 for manufacturing a thermistor according to the present invention. Step 101, providing a powder of semiconductive ceramic having a temperature dependent resistance; a step 102 of coating the powder with an inorganic material to form particles 3 having a core 6 comprising a semiconductive ceramic and a coating layer 7 of inorganic material; and a step 103 of processing the composition comprising the coated particles 3 and the electrically insulating matrix material 4 or a precursor thereof to form a sensor material between the electrode pair; Including, The sensor material comprises particles dispersed in a matrix, the particles contacting each other to form an electronically conductive path 5 between the electrodes 2a, 2b.

[0053] In a preferred embodiment, the thickness of the coating layer is provided according to a predetermined baseline resistance across the sensor material. Advantageously, separating the steps of providing the core and providing the coating allows the thickness to be provided according to a predetermined baseline resistance across the sensor material. Separating the steps of providing the core and the coating further allows the semiconducting core to be selected according to desired properties, such as an intrinsic temperature-dependent conductivity coefficient, without limiting the selection according to requirements regarding the baseline resistance of the sensing material.

[0054] The powder can be prepared starting from a bulk ceramic. The ceramic can be manufactured in a previous step, for example, as a bulk ceramic, or can be commercially available, for example, according to the desired temperature-dependent coefficient of resistance. The ceramic can be suitably processed into a powder, for example, by crushing and / or grinding. The size or particle size distribution of the granular ceramic forming the powder can be set by known processing steps, including sieving, filtering, and centrifugation. Depending on the requirements for subsequent processing steps, the coated powder, i.e., the method, can include filtering or sieving the coated powder (i.e., the particles) to a size and / or particle size distribution within a specific range. Thus, in some embodiments, the method includes one or more separation steps to limit the maximum cross-sectional dimension of the powder, for example, to a range between 100 nanometers and 45 micrometers. Alternatively, or in addition, the method includes one or more separation steps to limit the maximum cross-sectional dimension of the coated powder (i.e., the particles), for example, to a range between 100 nanometers and 45 micrometers.

[0055] In a preferred embodiment, the step of coating the powder with an inorganic material is carried out by atomic layer deposition (ALD). ALD is particularly suitable for providing conformal inorganic coatings on a variety of particles, including those with rough or serrated outer surfaces, such as those formed by milling high-density ceramics. The use of organic coatings is less preferred. For example, organic coatings may be less stable (low adhesion), less stable (e.g., at temperatures above 100 or 200°C), and / or less uniform. For example, self-assembled monolayers or organic molecules attached to the outer surfaces of particles are known to be unstable and less uniform, especially at the boundaries or corners between surfaces of irregularly shaped particles. Furthermore, verifying the quality and uniformity of organic coatings can be difficult.

[0056] Alternatively, other forms of layer deposition, such as chemical vapor deposition (CVD), can be used. Atomic layer deposition has the advantage of providing good control over layer thickness and layer composition. ALD typically involves process cycles in which the substrate to be coated, such as a powder, is alternately exposed to precursors of inorganic materials. Optionally, the process may include one or more cleaning steps, such as oxygen plasma exposure steps, before and / or between coating cycles to clean the substrate surface and / or improve adhesion of the agent. The process cycle is repeated, for example, for a number of cycles according to a predetermined calibration, until the thickness of the coating layer reaches a predetermined value.

[0057] The principles behind ALD, including the selection of appropriate precursors for applying a coating to a flat surface such as a wafer, are well known. For loose powder coatings, the general principles remain the same. However, performing cycles in a conventional reactor, such as a conventional vacuum chamber, is less preferred due to the limited accessibility of precursors to individual particles (along the entire perimeter) in an electrostatic powder mass, such as a layer of powder on a support tray. Performing ALD process cycles with static power has been found to produce coating layers with relatively wide layer thicknesses. It has been found that coating uniformity can be improved by using an ALD reactor designed for powder processing. In a preferred embodiment, the particles are fluidized during processing. Examples include rotary and fluidized-bed reactor designs. Fluidizing the powder has been found to allow for greater exposure of the powder to the precursors and improve the uniformity of the deposited coating. The exemplary particles used herein were prepared using a fluidized-bed reactor as described in the publication by VALDESUERIO et al., Materials 2015, 8, 1249-126. For experimental details, see the publication by GUO et al., Nanomaterials, 2018, 8(2), 61 and its experimental section, where crushed high-density Mn-Zr-oxide ceramic was used as the substrate. Both publications by VALDESUERIO and GUO are incorporated herein by reference.

[0058] Step 103 of processing the composition to form the sensor material 1 between the electrode pair 2a, 2b typically involves solidifying the matrix, for example, by cross-linking and / or solvent evaporation. It can be appreciated that the process can be carried out at relatively low temperatures because it does not require melting, sintering, or otherwise fusing the particles, e.g., to form a single metallurgical network. It also does not require any additional metallic (sintering) material as a binder. Preferably, the sensor and substrate (if present) are processed at low temperatures, e.g., below 300°C, to prevent disintegration of the matrix and / or substrate and to prevent the particles from melting, sintering, or otherwise fusing. For example, the solidification process is carried out at high temperatures, e.g., below 250°C. For example, the melting temperature of the particles (e.g., >500°C or >1000°C) may be much higher than the processing temperature (<300°C).

[0059] In one embodiment, the sensor material is applied, for example, by printing, to a dry layer thickness of between 15 and 100 micrometers. For example, the sensor material is applied using stencil printing, for example, with a stencil thickness of between 25 and 300 micrometers, preferably between 100 and 150 micrometers. For example, the sensor material is applied using screen printing, for example, using a screen with a mesh size of less than 200 micrometers.

[0060] In another aspect, the present application relates to a composition for producing a sensor material for a composite thermistor element according to the present invention. The composition comprises particles 3 as disclosed herein. The composition typically further comprises at least a solvent and an electrically insulating matrix material or a precursor thereof. The composition can be produced by mixing the corresponding components. A preferred embodiment involves mixing the particles with a suitable liquid carrier, such as a solvent and a matrix material or a precursor thereof, to form an ink or paste. For example, the viscosity of the paste may be between 10 and 100 Pa·s. -1 The range is between .

[0061] The matrix preferably forms a dense structure after crosslinking. In one embodiment, the electrically insulating matrix comprises a dielectric or otherwise electrically insulating material, such as a polymeric or crosslinkable material. For example, the matrix comprises a crosslinkable polymer precursor, such as a precursor with an acrylate, epoxy, isoprene, or benzocyclobutene moiety. Alternatively, or in addition, the matrix comprises a polymer such as polyurethane ether, polyisoprene, cellulose nitrate, etc.

[0062] In a preferred embodiment, the particles in the composition have a maximum cross-sectional dimension of less than about 45 micrometers. Limiting the maximum cross-sectional dimension of the particles, for example by sieving, can be advantageous for processability of the composition, such as during subsequent processing steps, such as depositing the composition by screen printing.

[0063] FIG. 1B schematically illustrates a cross-sectional side view of an embodiment of a temperature sensor 50 including a composite thermistor element according to the present invention. Typically, the sensor 50 includes readout electronics 40 connected via wires to electrodes 2a, 2b for measuring the resistance across the thermistor 10. Alternatively, the readout may be remote or reversibly connectable to the electrodes. In a preferred embodiment, the thermistor element is provided as a thin film, e.g., less than 1 mm in total thickness, preferably less than 500 μm. The minimum thickness of the thermistor is limited by the size of the coated particles. In some embodiments, the film may be even thinner, e.g., less than 100 μm or less than 50 μm (near the largest particle dimension). In some embodiments, the composite thermistor element 10 including electrodes 2a, 2b is integrally formed on a flexible substrate 30, such as a polymer film. As described herein, the particles and matrix may be applied to the substrate using various methods, including screen printing. Providing the thermistor as a thin film, preferably a flexible film, advantageously allows for measurement of temperature in enclosed spaces, for example in hard to access areas of the apparatus, such as between parts of a conveyor.

[0064] Advantageously, thermistors according to the present invention can be relatively easily manufactured with tailored shapes and dimensions. Contrary to high density ceramic thermistor elements, which require separate molds for each specific shape, thermistors according to the present invention can be manufactured to a convenient shape, for example, by printing.

[0065] 3B, 4, and 5 show experimental results for thermistors according to the invention (s1 to s3) and comparative thermistors not according to the invention (s4, s5).

[0066] Figure 3B illustrates the electrical resistance of five thermistors (s1 to s5) as a function of time when the thermistors are exposed to temperatures in the trajectory between room temperature (approximately 25°C) and 150°C. Thermistor s1 corresponds to a thermistor formed from an NTC ceramic powder coated with a 3.0 nm layer of aluminum oxide. Thermistors s2 and s3 are based on the same ceramic powder, but with 4.5 and 6.0 nm of AlO, respectively. x The samples are similar in that they have a coating (see Figure 2B). Sample s4 is a comparative sample formed using pure (uncoated) powder. Sample s5 is a comparative commercially available high-density ceramic NTC thermistor.

[0067] As can be seen from FIG. 3B, providing a coating makes it possible to adjust the overall resistance across the thermistor. At t=0 (room temperature), the resistance at s4 (uncoated particle) is about 10 6ohms. Applying a 3 nm coating increases the resistance by more than 10 times; a 4.5 nm coating by more than 100 times; and a 6 nm coating by more than 10,000 times. The effect remains as the temperature increases to approximately 150°C at t=60 minutes. As can be observed, applying a coating does not significantly affect the slope of the curve, suggesting that the temperature-dependent resistance of the thermistor remains comparable. That the dependent resistance (β) remains the same can be observed from the plot in Figure 4, which shows the natural logarithm of resistance as a function of temperature for samples s1 through s4. The dotted line represents a linear fit. As can be seen, the slope remains constant for the entire set of samples; only the onset shifts with increasing coating thickness.

[0068] The core is typically formed from a semiconducting ceramic composition doped with a resistivity in the range between 1 kΩ.m and 10 MΩ.m (at 20°C). To shift the operable temperature range, the coating layer is typically configured to increase the base resistance by a factor >5, typically >10. The higher the shift, the higher the operable temperature range can be shifted to higher temperatures. The upper limit is typically less than 1000 times (<1000). In this way, the operable temperature range can be extended without affecting the increase in conductivity of the semiconducting particles with temperature.

[0069] Thus, in some embodiments, the contribution of the coating layer to the total electrical resistance of the particle can be understood to be at least 10 times the temperature dependent component imparted by the core of the particle, for example at a given temperature at the beginning of a given temperature range for an NTC material, and conversely at the upper end of the operable temperature range for a PTC type thermistor.

[0070] That the coating can be used to adjust the overall resistance of the composite without significantly adversely affecting its dependent resistance (β) is in line with the proposed conduction mechanism through the sensor, which is believed to be a superposition of electron tunneling throughout the insulator layer (see Equation 1) and hopping through the semiconducting core (see Equation 2).

[0071]

number

[0072] (where I represents the current, V represents the potential, d represents the insulator layer thickness, h represents Planck's constant divided by 2π, m represents the carrier mass, φ represents the energy barrier, k represents the Boltzmann constant, and T represents the temperature (in degrees Kelvin).

[0073] The exponential increase in the baseline resistance of the composite with oxide thickness is evidenced by the linear fit in the plot shown in Figure 4, which represents the natural logarithm of the resistance over one across the thermistor at a temperature of 50°C as a function of coating thickness. Note that the proposed conduction mechanism does not apply where d is 0.

[0074] Figure 6 (top) shows the AlO film between silver electrodes with indicative energy levels relative to vacuum. x Figure 6 (bottom) shows the energy diagram of a semiconducting oxide particle coated with AlO x The corresponding conductance upon application of a potential (V) due to electron tunneling across the barrier 7 and hopping across the semiconducting core 6 is shown.

[0075] For clarity and conciseness, features are described herein as part of the same or separate embodiments; however, it should be appreciated that the scope of the present invention may include embodiments having combinations of all or some of the described features. For example, while embodiments are illustrated with Mn-Zn oxide-based NTC particles, alternative methods for achieving similar functions and results may be envisioned by those skilled in the art having the benefit of this disclosure. Various elements of the embodiments discussed and illustrated provide certain advantages, such as adjusting the overall resistance of the temperature sensor. Of course, it should be understood that any one of the above embodiments or steps can be combined with one or more other embodiments or steps to provide further improvements in design and finding and matching advantages.

[0076] In interpreting the appended claims, the word "comprising" does not exclude the presence of elements or acts other than those listed in a given claim, and the word "a" or "an" preceding an element does not exclude the presence of a plurality of such elements. Any reference signs in a claim do not limit its scope. Multiple "means" may be represented by the same or different items or by implemented structures or functions, and it should be understood that the disclosed apparatus or parts thereof may be combined together or separated into further parts unless specifically stated otherwise. Where a claim refers to another claim, this may indicate synergistic advantages achieved by a combination of the respective features. However, the mere fact that certain measures are recited in mutually different claims does not indicate that a combination of these measures cannot also be advantageously used. Accordingly, the present embodiments include all possible combinations of claims, where each claim may in principle refer to the preceding claim, unless clearly excluded by the context. [Explanation of symbols]

[0077] 1. Sensor materials 2a electrode 2b electrode 3 particles 4. Matrix / Matrix Material 5 Conductive Path / Pathway 6 cores 7 Covering layer 7t thickness 10 Thermistor / Thermistor Element 30 Base material 40 Readout Electronics 50 Temperature Sensor 100 ways 101 Providing a powder of semiconductive ceramic having temperature dependent resistance 102 coating the powder with inorganic material to form particles 3 having a core 6 comprising a semiconductive ceramic and a coating layer 7 of inorganic material 103 A step of processing the composition forming the sensor material 1 between the electrode pair 2a, 2b

Claims

1. A composite thermistor element (10) comprising a sensor material (1) disposed between a pair of electrodes (2a, 2b), The sensor material (1) comprises particles (3) dispersed in a matrix (4), The particles contact each other to form an electronic conduction path (5) between the electrodes (2a, 2b), The particle (3) has a core (6) comprising a semiconductive ceramic material having a temperature-dependent resistance with an intrinsic temperature coefficient of resistance of the material, and an insulating coating layer (7) of an inorganic material having a resistance according to a predetermined baseline resistance component of the total electrical resistance throughout the sensor material along a thickness (7t) and a path (5) between the electrodes, the total resistance further including a temperature-dependent component imparted by the core of the particle, to form a composite thermistor element (10).

2. The composite thermistor element (10) of claim 1, wherein the inorganic material has a bandgap greater than 3.2 eV.

3. 3. The composite thermistor element (10) of claim 1 or 2, wherein the coating layer has a thickness within a range that allows electron tunneling between the cores of contacting particles (3).

4. 4. The composite thermistor element (10) according to any one of claims 1 to 3, wherein the coating layer has a thickness in the range of 1 to 10 nanometers.

5. 5. The composite thermistor element (10) according to any one of claims 1 to 4, wherein the coating layer (7) comprises aluminum oxide, aluminum nitride, zirconium oxide, silicon oxide, or a mixture thereof.

6. 6. The composite thermistor element (10) according to any one of claims 1 to 5, wherein the coating layer surrounding the core has a uniform thickness.

7. 7. The composite thermistor element (10) of any one of claims 1 to 6, wherein the particles (3) have a maximum cross-sectional dimension in the range between 100 nanometers and 45 micrometers.

8. providing a powder of a semiconductive ceramic having a temperature dependent resistance; coating the powder with an inorganic material to form particles (3) having a core (6) comprising a semiconductive ceramic material and an insulating coating layer (7) of an inorganic material; processing the composition to form a sensor material (1) between a pair of electrodes (2a, 2b), the sensor material comprising particles (3) dispersed in a matrix, the particles contacting each other to form an electronic conduction pathway (5) between the electrodes (2a, 2b); A method for manufacturing a composite thermistor element (10) comprising: The thickness (7t) and resistance of the coating layer are provided according to a predetermined baseline resistance component of the total electrical resistance across the sensor material, said total resistance further including a temperature dependent component imparted by the core of the particle.

9. The method of claim 8 , wherein coating the powder with an inorganic material comprises an atomic layer deposition process.

10. 10. The method of claim 9, wherein the atomic layer deposition process includes fluidizing the powder in a process flow.

11. 11. The method of any one of claims 8 to 10, wherein the processing is carried out at a temperature of less than 300°C.

12. A composition for producing a sensor material of the composite thermistor element according to any one of claims 1 to 7, comprising: a matrix material (4) or a precursor thereof, and The particle (3) has a core (6) comprising a semiconductive ceramic material having a temperature-dependent resistance and an insulating coating layer (7) of an inorganic material, The coating layer has a thickness (7t) and a resistivity within a range that allows electron tunneling between the core of the particle (3) and the core in contact with it.

13. 13. The composition of claim 12, wherein the particles (3) have a maximum cross-sectional dimension in the range between 100 nanometers and 45 micrometers when mixed with a suitable liquid carrier.

14. A temperature sensor (50) comprising readout electronics (40) and a thermistor element (10) according to any one of claims 1 to 7.

15. 15. The temperature sensor (50) of claim 14, wherein the thermistor element (10) is integrally provided on a flexible polymer film.

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