Processing method of workpiece
By integrating a dressing member with the first member in the substrate, the method stabilizes spindle current and maintains grinding quality during material transitions, addressing issues in existing grinding apparatuses.
Patent Information
- Authority / Receiving Office
- JP · JP
- Patent Type
- Patents
- Current Assignee / Owner
- DISCO CORP
- Filing Date
- 2022-11-24
- Publication Date
- 2026-06-19
AI Technical Summary
Existing grinding apparatuses face issues with increased spindle current values and potential process halts when grinding materials change from resin to resin + Si post, due to altered grindability.
A method involving sealing a chip-shaped first member with resin and incorporating a dressing member at the same height, where the first member is not disposed, to expose its upper surface during grinding, improving abrasive quality and stabilizing spindle current.
This method suppresses spindle current value increases and prevents process interruptions by maintaining consistent grinding quality and material transition, ensuring smooth operation and accurate thickness control.
Smart Images
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Abstract
Description
Technical Field
[0001] The present invention relates to a method for processing a workpiece.
Background Art
[0002] In the manufacturing process of semiconductor devices, in order to obtain the target thickness of the semiconductor device, at the stage of the workpiece, which is an aggregate of a large number of semiconductor devices, the back surface is ground and polished to be thinned. Further, with the remarkable thinning of semiconductor devices in recent years, the workpiece is being processed to be even thinner.
[0003] Generally, grinding and polishing of the workpiece are carried out while measuring its thickness. Therefore, a grinding apparatus is known that accurately measures the thickness of the workpiece while contacting a measurement probe with the surface to be processed, and grinds it to a desired thickness (for example, see Patent Document 1).
Prior Art Documents
Patent Documents
[0004]
Patent Document 1
Summary of the Invention
Problems to be Solved by the Invention
[0005] However, according to the above grinding apparatus, for example, when a Si post embedded in resin is protruded by grinding the resin, or when a predetermined member is protruded, when the material to be ground changes from "only resin" to "resin + Si post" during the protrusion, the grindability changes and the spindle current value increases. Along with this, there is a problem that the grinding apparatus may issue an alarm and the grinding process may be stopped.
[0006] This invention has been made in view of the above problems, and its purpose is to provide a workpiece machining method that can suppress an increase in the spindle current value when performing head grinding of different materials. [Means for solving the problem]
[0007] To solve the above-mentioned problems and achieve the objective, the present invention provides a method for processing a workpiece in which a chip-shaped first member disposed on a substrate is sealed with resin, and includes: a first disposal step of disposing the first member on the substrate; a second disposal step of disposing a dressing member in an area on the substrate where the first member is not disposed; a workpiece forming step of integrating the first member, the dressing member and the resin on the substrate by sealing both the side and top surfaces of the first member and the dressing member disposed on the substrate with the resin to form the workpiece; and a grinding step of grinding the resin of the workpiece and exposing the top surface of the first member from the resin while grinding the dressing member disposed within the resin.
[0008] The area where the first member is not provided may be the surplus area on the outer periphery of the substrate.
[0009] The dressing member may be formed at the same height as the upper surface of the first member. [Effects of the Invention]
[0010] In this invention, a dressing member is placed in an area of the substrate where the first member to be exposed is not located, forming the workpiece, and the upper surface of the first member is exposed while grinding the dressing member. Therefore, in this invention, the grinding quality of the grinding wheel's abrasive is improved by dressing, and the material being ground is changed by exposing the upper surface of the first member. This suppresses the increase in the spindle current value when the material being ground changes during the head-exposing grinding of the first member, which is made of a material different from resin. [Brief explanation of the drawing]
[0011] [Figure 1]Figure 1 is a flowchart showing the processing procedure of the workpiece processing method according to the embodiment. [Figure 2] Figure 2 is a perspective view illustrating an example of the first and second installation steps in Figure 1. [Figure 3] Figure 3 is a perspective view illustrating another example of the first and second installation steps shown in Figure 1. [Figure 4] Figure 4 is a cross-sectional view illustrating an example of the workpiece formation step shown in Figure 1. [Figure 5] Figure 5 is a perspective view showing an example of a grinding apparatus that performs the grinding step shown in Figure 1. [Figure 6] Figure 6 is a cross-sectional view illustrating the grinding step shown in Figure 1. [Figure 7] Figure 7 is an enlarged cross-sectional view showing the main part of Figure 6. [Modes for carrying out the invention]
[0012] Embodiments for carrying out the present invention will be described in detail with reference to the drawings. The present invention is not limited to the contents described in the following embodiments. Furthermore, the components described below include those that can be easily imagined by those skilled in the art, and those that are substantially the same. In addition, the components described below can be combined as appropriate. Furthermore, various omissions, substitutions, or modifications of the components can be made without departing from the spirit of the present invention.
[0013] [Embodiment] A method for processing a workpiece according to an embodiment of the present invention will be described based on the drawings. Figure 1 is a flowchart showing the processing procedure of the workpiece processing method according to the embodiment. As shown in Figure 1, the workpiece processing method according to the embodiment comprises a first arrangement step 1001, a second arrangement step 1002, a workpiece formation step 1003, and a grinding step 1004. The workpiece processing method according to the embodiment is a method of processing a workpiece 150 (see Figure 4, etc.), which is obtained by the first arrangement step 1001, the second arrangement step 1002, and the workpiece formation step 1003, by sealing a chip-shaped first member 110 (see Figure 2, etc.) arranged on a substrate 100 (see Figure 2, etc.) with resin 130 (see Figure 4, etc.) with resin 130 (see Figure 4, etc.) with resin 130 (see Figure 4, etc.) with resin 130 (see Figure 4, etc.) with resin 130 (see Figure 4, etc.).
[0014] In the workpiece processing method according to the embodiment, the substrate 100 on which the first member 110 is disposed is, as shown in Figure 1, a wafer such as a disc-shaped semiconductor wafer or optical device wafer made of silicon, sapphire, silicon carbide (SiC), gallium arsenide, glass, etc. as the base material. On the flat surface 101 of the substrate 100, chip-shaped devices are formed in regions demarcated by a plurality of intersecting (orthogonal in this embodiment) division lines. The substrate 100 is divided into individual chip-shaped devices (device chips) by being divided along the division lines. The surface 101 of the substrate 100 is demarcated into a device region 106 on which devices are formed and an outer peripheral surplus region 107 surrounding the device region 106 on which no devices are formed. The substrate 100 has terminals (electrodes) (not shown) embedded in the devices, and one end of the terminals (electrodes) is exposed on the surface 101. In the workpiece processing method according to the embodiment, the first member 110 is disposed on the surface 101 side of the substrate 100 where one end of the terminal (electrode) is exposed.
[0015] In the workpiece processing method according to the embodiment, the first member 110 disposed on the substrate 100 is, as shown in Figure 1, a chip-shaped device (device chip) formed in a plate shape using the same material as the substrate 100, for example, silicon, sapphire, silicon carbide (SiC), gallium arsenide, glass, etc. as the base material, and its shape and size in plan view are the same as the chip-shaped device formed on the substrate 100. All first members 110 are formed to the same thickness. The first member 110 has terminals (electrodes) (not shown) embedded in the device, and one end of the terminals (electrodes) is exposed on one surface (bottom surface 112). In the workpiece processing method according to the embodiment, the first member 110 is disposed on the substrate 100 such that the bottom surface 112 side, where one end of the terminals (electrodes) is exposed, faces the surface 101 side of the substrate 100, and the terminals (electrodes) embedded in the first member 110 are directly joined to the terminals (electrodes) embedded in the substrate 100.
[0016] In this embodiment, the substrate 100 and the first member 110 are joined by so-called hybrid bonding, where terminals (electrodes) embedded in each other in the device are directly joined. However, the present invention is not limited to this. For example, the substrate 100 does not need to have terminals (electrodes) embedded in it, and does not need to have a device formed on it. Similarly, the first member 110 does not need to have terminals (electrodes) embedded in it, and does not need to be a device.
[0017] FIG. 2 is a perspective view illustrating an example of the first disposing step 1001 and the second disposing step 1002 of FIG. 1. FIG. 3 is a perspective view illustrating another example of the first disposing step 1001 and the second disposing step 1002 of FIG. 1. As shown in FIGS. 2 and 3, the first disposing step 1001 is a step of disposing the first member 110 on the substrate 100. In the first disposing step 1001, specifically, as shown in FIGS. 2 and 3, the first member 110, which is a device, is stacked and disposed directly above each of a plurality of devices formed on the surface 101 of the substrate 100, and the terminals (electrodes) embedded in the substrate 100 and the first member 110 are directly joined to form a laminated device. That is, in the first disposing step 1001, the first member 110 is disposed in the device region 106 on the substrate 100 and not in the outer peripheral surplus region 107 on the substrate 100.
[0018] As shown in FIGS. 2 and 3, the second disposing step 1002 is a step of disposing the dress member 120 in a region on the substrate 100 where the first member 110 is not disposed. In the present embodiment, the dress member 120 disposed in the second disposing step 1002 is formed in a block shape by hardening abrasive grains such as white random (WA) and green carbon (GC) with a bonding material (binder) such as a metal bond, a resin bond, or a vitrified bond. The dress member 120 can be used for dressing to improve the grinding quality and enhance the visibility by removing the bonding material covering the abrasive grains of the grinding wheel 222 (see FIGS. 5 and the like) of the grinding unit 220 (see FIGS. 5 and the like) described later and protruding the abrasive grains.
[0019] All dress members 120 installed in the second installation step 1002 are formed to the same thickness. In this embodiment, the dress members 120 installed in the second installation step 1002 are formed to have a thickness along the thickness direction of the substrate 100 that is equal to or greater than the thickness of the first member 110 (in the example shown in Figure 4, the same thickness as the first member 110). Therefore, the height position of the upper surface 121 of the dress member 120 installed on the substrate 100 in the second installation step 1002 is equal to or greater than the height position of the upper surface 111 of the first member 110 installed on the substrate 100 in the first installation step 1001 (in the example shown in Figure 4, the same height position as the upper surface 111 of the first member 110). In other words, the dress members 120 installed on the substrate 100 in the second installation step 1002 are installed so as to include at least the same height position as the upper surface 111 of the first member 110 installed on the substrate 100 in the first installation step 1001. Furthermore, the upper surfaces 111 and 121 of both the first member 110 and the dressing member 120 are the surfaces opposite to the lower surfaces 112 and 122 of the first member 110 and the dressing member 120 that face the surface 101 of the substrate 100 when they are placed on the surface 101 of the substrate 100, and refer to the surfaces that face upward when they are placed on the surface 101 of the substrate 100.
[0020] In this embodiment, in the first arrangement step 1001, the first member 110 is arranged in the device region 106 on the substrate 100 and is not arranged in the outer peripheral surplus region 107 on the substrate 100. Thus, in the second arrangement step 1002, the dress member 120 is arranged in the outer peripheral surplus region 107 on the substrate 100. In the second arrangement step 1002, further, as shown in FIGS. 2 and 3, among the plurality of devices formed on the substrate 100 and arranged in a planar manner along the direction of the intersecting planned division lines in the outer peripheral surplus region 107, the dress member 120 is arranged in the region on the substrate 100 adjacent to the outer periphery of the device formed at the outermost periphery. In the second arrangement step 1002, in the example shown in FIG. 2, among these plurality of devices arranged in a planar manner on the substrate 100, the dress member 120 is arranged in the region on the substrate 100 further on the outer peripheral side of the devices formed at the outermost four side portions. In the example shown in FIG. 3, among these plurality of devices arranged in a planar manner on the substrate 100, the dress member 120 is arranged in the region on the substrate 100 further on the outer peripheral side of the devices formed near the outermost four corner portions. However, the present invention is not limited thereto.
[0021] FIG. 4 is a cross-sectional view for explaining an example of the workpiece forming step 1003 in FIG. 1. As shown in FIG. 4, the workpiece forming step 1003 is a step of integrating the first member 110, the dress member 120, and the resin 130 on the substrate 100 to form the workpiece 150 by sealing both the side surfaces and the upper surfaces 111 and 121 of the first member 110 and the dress member 120 arranged on the substrate 100 with the resin 130. Here, both side surfaces of the first member 110 and the dress member 120 refer to the surfaces that intersect the upper surfaces 111 and 121 and the lower surfaces 112 and 122 of the first member 110 and the dress member 120 and stand upright from the surface 101 of the substrate 100 when arranged on the surface 101 of the substrate 100.
[0022] In the workpiece formation step 1003, liquid resin 130 is supplied to both sides of the first member 110 and the dressing member 120, including the gap between the first member 110 and the dressing member 120, and to both upper surfaces 111 and 121 of the first member 110 and the dressing member 120, thereby filling the first member 110 and the dressing member 120 with the liquid resin 130. The liquid resin 130 is then cured to seal both sides and upper surfaces 111 and 121 of the first member 110 and the dressing member 120, which are arranged on the substrate 100, with the resin 130. In this embodiment, the resin 130 used in the workpiece formation step 1003 is a so-called molding resin composed of, for example, epoxy resin, silicone resin, urethane resin, unsaturated polyester resin, acrylic urethane resin, or polyimide resin.
[0023] Figure 5 is a perspective view showing an example of a grinding apparatus 200 that performs the grinding step 1004 of Figure 1. Figure 6 is a cross-sectional view illustrating the grinding step 1004 of Figure 1. Figure 7 is an enlarged cross-sectional view showing the main part of Figure 6. Figure 7 is an enlarged view of VII of Figure 6. The grinding apparatus 200 that performs the grinding step 1004 includes a holding table 210, a grinding unit 220, a thickness measuring instrument 230, a notification unit 240, and a control unit 250, as shown in Figure 5.
[0024] The holding table 210 holds the workpiece 150 from the substrate 100 side. In this embodiment, the holding table 210 is a so-called chuck table having, for example, a disc-shaped frame with a recess formed therein and a disc-shaped suction part fitted into the recess. The upper surface of the suction part of the holding table 210 is formed parallel to the horizontal plane and is a holding surface 211 that holds the workpiece 150, which is placed with the substrate 100 side facing downward, by suction from the substrate 100 side when negative pressure is introduced from a suction source (not shown) connected to the suction part. The holding table 210 is rotatable around an axis perpendicular to the holding surface 211 and parallel to the vertical direction by a rotation drive source (not shown).
[0025] As shown in Figure 5, the grinding unit 220 is positioned above the holding table 210 and grinds the workpiece 150 held on the holding table 210 from the side opposite to the substrate 100, i.e., the side where the first member 110 and the dressing member 120 are positioned and sealed with resin 130. In this embodiment, the grinding unit 220 includes a spindle 221, a grinding wheel 223 with grinding wheels 222 arranged in an annular shape, a grinding feed unit 224, and a current value measuring sensor 225. In this embodiment, the grinding wheel 222 is formed by fixing abrasive grains such as diamond or cBN (cubic boron nitride) with a bonding material (binder) such as metal bond, resin bond, or vitrified bond. In the grinding unit 220, the grinding wheel 223 mounted on the lower end of the spindle 221 is subjected to rotational motion around an axis parallel to the vertical direction by the rotational motion of the spindle 221. The grinding feed unit 224 moves the spindle 221 and the grinding wheel 223 mounted on the spindle 221 along the grinding feed direction parallel to the vertical direction.
[0026] The grinding unit 220 rotates the grinding wheel 223 with the spindle 221 and presses the workpiece 150, which is held on the rotating holding table 210, against the surface opposite to the substrate 100 with the grinding feed unit 224, thereby grinding the surface of the workpiece 150 opposite to the substrate 100 with the grinding wheel 222 of the grinding wheel 223, and forming the ground surface of the workpiece 150 opposite to the substrate 100 parallel to the horizontal direction.
[0027] The current value measuring sensor 225 measures the current value (hereinafter referred to as the spindle current value) of the current flowing to the motor that rotates the spindle 221 when the spindle 221 rotates around its axis, and outputs the measurement result to the control unit 250. The spindle current value increases when the grinding load of the grinding unit 220 (referring to the load that hinders the rotation of the grinding wheel 223) increases, and decreases when the grinding load decreases.
[0028] In this embodiment, as shown in Figure 6, the grinding device 200 has the rotation axis of the holding table 210 and the rotation axis of the spindle 221 and grinding wheel 223 of the grinding unit 220 arranged to be horizontally offset from each other. When the grinding unit 220 grinds the surface of the workpiece 150 held on the holding table 210, a portion of the surface of the workpiece 150 held on the holding table 210 is exposed upwards.
[0029] As shown in Figure 5, the thickness measuring device 230 is positioned near the holding table 210 and measures the thickness of the workpiece 150 held on the holding table 210. In this embodiment, the thickness measuring device 230 includes a first contact terminal 231, a second contact terminal 232, and a measuring unit 233. The tip of the first contact terminal 231 contacts the holding surface 211 of the holding table 210, and based on the vertical height position of the first contact terminal 231 at that time, it detects the vertical height position of the holding surface 211 of the holding table 210. The tip of the second contact terminal 232 contacts the area of the workpiece 150 held on the holding table 210 that is exposed toward the upper side of the grinding surface, and based on the vertical height position of the second contact terminal 232 at that time, it detects the vertical height position of the grinding surface of the workpiece 150 held on the holding table 210. The measuring unit 233 measures the thickness of the workpiece 150 held on the holding table 210 based on the vertical height position of the holding surface 211 of the holding table 210 detected by the first contact terminal 231 and the vertical height position of the grinding surface of the workpiece 150 held on the holding table 210 detected by the second contact terminal 232, and outputs the measurement result to the control unit 250.
[0030] The thickness measuring device 230 is not limited to this in the present invention. For example, it may include an irradiation unit that emits light and a light receiving unit that receives reflected light. The light emitted by the irradiation unit is reflected by the workpiece 150's grinding surface and the holding surface 211 of the holding table 210, and the reflected light is received by the light receiving unit. The vertical height position of the workpiece 150's grinding surface and the holding surface 211 of the holding table 210 is detected by the time difference between irradiation by the irradiation unit and reception by the light receiving unit.
[0031] In this embodiment, the notification unit 240 is, for example, a display unit, a light-emitting unit, or an audio unit. The display unit is provided on a cover (not shown) of the grinding device 200, with the display surface facing outwards. The display unit displays, for the operator's viewing convenience, screens for setting various conditions related to various processes of the grinding device 200, such as grinding by the grinding unit 220, acquired data, measurement results, judgment results, errors that occurred during various processes by the grinding device 200, and alarms that are notified when the spindle current value rises above a predetermined threshold within a predetermined time during grinding by the grinding device 200. The display unit is composed of a liquid crystal display device or the like. The display unit is provided with an input unit used by the operator to input information related to the various conditions of the grinding device 200 and information related to the display of screens, etc. The input unit provided on the display unit is composed of at least one of a touch panel provided on the display unit and a keyboard or the like.
[0032] The light-emitting unit is located above a cover (not shown) of the grinding device 200. The light-emitting unit is composed of light-emitting diodes or the like, and notifies the operator of judgment results, errors that occurred during various processes by the grinding device 200, and alarms that are notified when the spindle current value rises above a predetermined threshold within a predetermined time during grinding by the grinding device 200, by lighting up, flashing, or changing the color of the light, etc. The voice unit is located above a cover (not shown) of the grinding device 200. The voice unit is composed of a speaker or the like, and notifies the operator of judgment results, errors that occurred during various processes by the grinding device 200, and alarms that are notified when the spindle current value rises above a predetermined threshold within a predetermined time during grinding by the grinding device 200, etc., by emitting sound, etc. In this invention, the notification unit 240 is not limited to being fixedly installed on the grinding device 200, but may be installed on any communication device, and any communication device may be connected to the grinding device 200 wirelessly or wired.
[0033] The control unit 250 controls the operation of each component of the grinding device 200 to cause the grinding device 200 to perform the grinding step 1004. In addition, while the grinding device 200 is grinding, the control unit 250 measures the spindle current using the current value measuring sensor 225, obtains the spindle current value which is the measurement result of the spindle current from the current value measuring sensor 225, determines whether the spindle current value has risen above a predetermined threshold within a predetermined time, and if it is determined that the spindle current value has risen above a predetermined threshold within a predetermined time, it notifies the notification unit 240 of the determination result along with an alarm. In addition, while the grinding device 200 is grinding, the control unit 250 measures the thickness of the workpiece 150 held on the holding table 210 using the thickness measuring instrument 230, obtains the measurement result of the thickness of the workpiece 150 from the thickness measuring instrument 230, and monitors the thickness of the workpiece 150.
[0034] In this embodiment, the control unit 250 includes a computer system. The computer system included in the control unit 250 is a computer having an arithmetic processing unit with a microprocessor such as a CPU (Central Processing Unit), a storage device with memory such as ROM (Read Only Memory) or RAM (Random Access Memory), and an input / output interface device. The arithmetic processing unit of the control unit 250 performs arithmetic processing according to a computer program stored in the storage device of the control unit 250 and outputs control signals for controlling the grinding device 200 to each component of the grinding device 200 via the input / output interface device of the control unit 250.
[0035] The grinding step 1004 is a step in which the resin 130 of the workpiece 150 is ground, and the dressing member 120 disposed within the resin 130 is ground, while the upper surface 111 of the first member 110 is exposed from the resin 130. As shown in Figures 5 and 6, in this embodiment the grinding step 1004 is carried out by a grinding apparatus 200 having the above configuration.
[0036] In grinding step 1004, first, as shown in Figure 6, the workpiece 150 is held from the substrate 100 side by the holding surface 211 of the holding table 210 of the grinding device 200. Next, in grinding step 1004, as shown in Figure 6, the grinding wheel 223 is rotated by the spindle 221, and the grinding feed unit 224 presses the workpiece 150, which is held on the rotating holding table 210, against the side opposite to the substrate 100, in the grinding feed direction, thereby grinding the workpiece 150 from the side opposite to the substrate 100 with the grinding wheel 222 of the grinding wheel 223. In grinding step 1004, the resin 130 covering the side of the workpiece 150 opposite to the substrate 100 is ground, exposing the upper surfaces 111 and 121 of the first member 110 and dressing member 120, which are sealed by the resin 130, from the resin 130.
[0037] Here, the dressing member 120, which is placed on the substrate 100 in the second placement step 1002, is placed so as to include at least the same height position as the upper surface 111 of the first member 110, which was placed on the substrate 100 earlier in the first placement step 1001. Therefore, as the grinding of the resin 130 covering the side of the workpiece 150 opposite to the substrate 100 is carried out in the grinding step 1004, the upper surface 121 of the dressing member 120 is exposed from the resin 130 before or at the same time as the upper surface 111 of the first member 110, as shown in Figure 7. Therefore, in the grinding step 1004, as shown in Figure 7, at the time when the grinding wheel 222 of the grinding wheel 223 is grinding the dressing member 120, that is, at the time when the grinding wheel 222 of the grinding wheel 223 is dressed by the dressing member 120 and the grinding quality is improved and the sharpening is improved, the upper surface 111 of the first member 110 is exposed and the first member 110 is brought forward. In grinding step 1004, as the first member 110 is brought forward at this time, the object to be ground by the grinding wheel 222 of the grinding wheel 223 changes from the resin 130 and the dressing member 120 to the resin 130, the dressing member 120 and the first member 110. However, since the grinding wheel 222 of the grinding wheel 223 is being dressed and its grinding quality is improving and its sharpening is getting better, the increase in the grinding load of the grinding unit 220 can be suppressed, and thus the increase in the spindle current value can be suppressed.
[0038] In grinding step 1004, even after the upper surface 111 of the first member 110 is exposed from the resin 130, grinding may be continued until the first member 110 reaches the desired thickness.
[0039] In the workpiece processing method according to the embodiment having the above configuration, a dressing member 120 is placed in an area on the substrate 100 where the first member 110 to be exposed is not placed, thereby forming the workpiece 150. The upper surface 111 of the first member 110 is exposed while grinding the dressing member 120. Therefore, in the workpiece processing method according to the embodiment, the grinding quality of the grinding wheel 222 of the grinding wheel 223 is improved by dressing, and the material being ground is changed by exposing the upper surface 111 of the first member 110. This has the effect of suppressing the increase in the spindle current value when the material being ground changes during the head-out grinding of the first member 110, which is made of a different material from the resin 130. As a result, the workpiece processing method according to the embodiment has the effect of suppressing the risk of an alarm being sounded by the notification unit 240 due to the spindle current value rising above a predetermined threshold within a predetermined time during grinding by the grinding device 200, and further suppressing the risk of the grinding process being stopped as a result.
[0040] Furthermore, in the workpiece processing method according to the embodiment, the area where the first member 110 is not disposed, that is, the area where the dressing member 120 is disposed, is the outer peripheral excess area 107 on the substrate 100. Therefore, in the workpiece processing method according to the embodiment, when the workpiece 150 is subsequently divided along the planned division line and divided into a laminated device chip in which the device chip formed on the substrate 100 and the first member 110, which is a device chip, are stacked in the thickness direction, the dressing member 120 does not get in the way.
[0041] Furthermore, in the workpiece processing method according to the embodiment, since the dressing member 120 is formed at the same height as the upper surface 111 of the first member 110, it is preferable to expose the upper surface 111 of the first member 110 while grinding the dressing member 120. In this embodiment, the thickness of the dressing member 120 is formed to be greater than or equal to the thickness of the first member 110, and both are directly disposed on the surface 101 of the substrate 100 to form the dressing member 120 at the same height as the upper surface 111 of the first member 110. However, the present invention is not limited to this, and for example, the dressing member 120 may be disposed on the surface 101 of the substrate 100 via an arbitrary spacer to form the dressing member 120 at the same height as the upper surface 111 of the first member 110.
[0042] It should be noted that the present invention is not limited to the embodiments described above. That is, it can be implemented with various modifications without departing from the core principles of the present invention. [Explanation of Symbols]
[0043] 100 circuit boards 107 Peripheral surplus area 110 First Member 111,121 Top surface 120 Dressing components 130 resin 150 Workpiece
Claims
1. A method for processing a workpiece in which a chip-shaped first component disposed on a substrate is sealed with resin, A first placement step of arranging the first member on the substrate, A second arrangement step involves arranging a dressing member in an area on the substrate where the first member is not arranged, A workpiece forming step in which the first member, the dressing member, and the resin are integrated on the substrate by sealing both the side and top surfaces of the first member and the dressing member disposed on the substrate with the resin, A method for processing a workpiece, comprising a grinding step of grinding the resin of the workpiece and exposing the upper surface of the first member from the resin while grinding a dressing member disposed within the resin.
2. The method for processing a workpiece according to claim 1, characterized in that the area where the first member is not provided is the outer peripheral surplus area on the substrate.
3. The method for processing a workpiece according to claim 1 or 2, characterized in that the dressing member is formed at the same height as the upper surface of the first member.