Extensible high puncture-resistant recyclable paper-based packaging structures
A paper-based packaging structure with a specific anisotropy ratio and high paper fiber content, combined with polymer coatings, addresses the need for recyclable, puncture-resistant packaging that withstands high-weight products and provides thermal insulation.
Patent Information
- Application Number
- US19/237681
- Authority / Receiving Office
- US · United States
- Patent Type
- Applications(United States)
- Current Assignee / Owner
- Priority Date
- 2024-06-26
- Filing Date
- 2025-06-13
- Publication Date
- 2026-01-01
AI Technical Summary
Existing paper-based packaging structures lack sufficient elongation and puncture resistance while being recyclable, especially for high-weight products, and do not adequately address thermal insulation needs, particularly for frozen goods.
A paper-based packaging structure with a paper substrate layer and a polymer extrusion or coextrusion coating layer, featuring an anisotropy ratio of 0.67 to 1.5 and a paper fiber content of 60% to 99%, providing superior elongation, puncture resistance, and optional moisture and oxygen barrier properties, ensuring recyclability through curbside programs.
The structure achieves enhanced mechanical strength, including puncture resistance greater than 3 lbf, and maintains integrity for high-weight products, while being recyclable and offering thermal insulation, thus reducing waste and meeting robustness requirements.