Optical transceiving device, method and chip

Abstract

An optical transceiving device (10), method and chip. The optical transceiving device (10) comprises: a silicon optical engine (110), which is used for receiving an external input optical signal by means of an optical receiving end, converting the input optical signal into a first electrical signal, converting a received second electrical signal into an output optical signal, and outputting the output optical signal by means of an optical output end; a transimpedance amplifier (120), which is used for acquiring the first electrical signal and amplifying the first electrical signal into the second electrical signal; and a substrate (130), which is used for carrying the silicon optical engine (110) and the transimpedance amplifier (120).

Description

Transmitting and receiving optical device, method and chip TECHNICAL FIELD

[0001] The present application relates to the field of communication, in particular to a transmitting and receiving optical device, method and chip. BACKGROUND

[0002] With the popularity of data centers and telecommunication equipment and the progress of the Internet of Things, the demand for high capacity optical transmission technology is increasing. The core component of optical communication products is an optical transceiver. At present, for data center service scenarios, optical transceivers are divided into different transmission rates such as 100 Gbit / s, 200 Gbit / s and 400 Gbit / s. Although the existing technology increases the capacity of optical transmission through the technical scheme of wavelength division multiplexing (WDM), it also increases the size of the transmitting and receiving optical device in the optical communication system. SUMMARY

[0003] Embodiments of the present application provide a transmitting and receiving optical device, method and chip to solve the problem that the size of the transmitting and receiving optical device increases with the increase of optical transmission capacity in the prior art.

[0004] To solve the above technical problems, the first technical solution adopted by the embodiments of the present application is to provide a transmitting and receiving optical device, comprising: a silicon optical engine configured to receive an external input optical signal through an optical receiving end, convert the input optical signal into a first electrical signal, convert a received second electrical signal into an output optical signal, and output the output optical signal through an optical output end; a transimpedance amplifier configured to obtain the first electrical signal and amplify the first electrical signal into the second electrical signal; and a substrate configured to carry the silicon optical engine and the transimpedance amplifier.

[0005] Optionally, the optical receiving end comprises an optical receiving unit configured to receive a first optical signal through a waveguide, convert the first optical signal into the first electrical signal, and output the first electrical signal to the transimpedance amplifier through a first circuit on the substrate.

[0006] Optionally, the optical output end comprises an optical emitting unit configured to receive the second electrical signal through a second circuit on the substrate, convert the second electrical signal into a second optical signal, and output the second optical signal through a waveguide.

[0007] Optionally, the light receiving unit comprises at least one light receiving chip flip-chip coupling structure, the light receiving chip flip-chip coupling structure comprises a light receiving chip, the contact of the light receiving chip is connected to the contact of the first circuit on the substrate through a flip-chip process, the first optical signal is transmitted to the light receiving chip in a reflective manner after passing through a waveguide, and the light receiving chip converts the first optical signal into the first electrical signal.

[0008] Optionally, the light transmitting unit comprises at least one light transmitting chip flip-chip coupling or normal coupling structure, the light transmitting chip flip-chip coupling structure comprises a light transmitting chip, the contact of the light transmitting chip is connected to the contact of the second circuit on the substrate through a flip-chip process, the light transmitting chip normal coupling structure comprises a light transmitting chip connected to the contact of the second circuit on the substrate through a eutectic soldering process, the second electrical signal is transmitted to the light transmitting chip through the contact, and the light transmitting chip converts the second electrical signal into the second optical signal.

[0009] Optionally, the light receiving unit further comprises an optical splitter, the optical splitter receives the input optical signal of the single optical signal through the first optical free access unit, and converts the input optical signal into the first optical signal comprising at least one optical signal.

[0010] Optionally, the light transmitting unit further comprises an optical combiner, the optical combiner receives the second optical signal comprising at least one optical signal, converts the second optical signal into the output optical signal of the single optical signal, and outputs the output optical signal to the outside through the second optical free access unit.

[0011] Optionally, the light transmitting unit further comprises a monitoring optical detector, the monitoring optical detector is used for monitoring the optical communication parameter of the output optical signal.

[0012] To solve the above technical problems, a second technical solution adopted by the embodiments of the present application is to provide a light receiving and transmitting method based on the above light receiving and transmitting device, comprising: receiving the input optical signal from the outside through the silicon optical engine, converting the input optical signal into the first electrical signal, and sending the first electrical signal to the transimpedance amplifier through the substrate; amplifying the first electrical signal through the transimpedance amplifier to obtain the amplified second electrical signal, and sending the second electrical signal to the silicon optical engine through the substrate; converting the second electrical signal into the output optical signal through the silicon optical engine, and outputting the output optical signal through the optical output end.

[0013] To solve the above technical problems, a second technical solution adopted by the embodiments of the present application is to provide a light receiving and transmitting chip comprising the above light receiving and transmitting device.

[0014] The transceiver optical device, method and chip provided by the embodiment of the present application comprise a silicon light engine, which is used to receive an external input optical signal through an optical receiving end, convert the input optical signal into a first electrical signal, convert a received second electrical signal into an output optical signal, and output the output optical signal through an optical output end; a transimpedance amplifier, which is used to obtain the first electrical signal and amplify the first electrical signal into the second electrical signal; and a substrate, which is used to carry the silicon light engine and the transimpedance amplifier. The transceiver optical device, method and chip provided by the present application do not depend on an external spherical solder light source, further reduce the size of the transceiver optical device, and further improve the integration of the transceiver optical device, thereby reducing the complexity and cost of an optical communication system. BRIEF DESCRIPTION OF DRAWINGS

[0015] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings needed to be used in the description of the embodiments of the present application will be briefly introduced. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative labor.

[0016] FIG. 1 is a structural schematic diagram of a transceiver optical device in an embodiment of the present application;

[0017] FIG. 2 is a hardware architecture schematic diagram of a transceiver optical device in an embodiment of the present application;

[0018] FIG. 3 is a hardware architecture schematic diagram of a transceiver optical device in another embodiment of the present application;

[0019] FIG. 4 is a flip-chip coupling structure schematic diagram of an optical receiving chip in an embodiment of the present application;

[0020] FIG. 5 is a flip-chip coupling structure schematic diagram of an optical transmitting chip in an embodiment of the present application;

[0021] FIG. 6 is a flow schematic diagram of a transceiver optical method in an embodiment of the present application. DETAILED DESCRIPTION

[0022] The embodiments of the present application will be described in detail below, and examples of the embodiments are shown in the drawings, wherein the same or similar reference signs represent the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the drawings are exemplary and are only used to explain the present application, and cannot be understood as a limitation of the present application.

[0023] In the description of the present embodiments, the terms "example" or "exemplary" are used to mean that an instance, or implementation, is an example or illustration of the present embodiments. The terms "example" or "exemplary" should not be construed as a preference or advantage of one embodiment over another embodiment. The terms "example" or "exemplary" are used as clear as possible to convey the meaning of the present embodiments.

[0024] In addition, the terms "comprising" and "comprise", or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but can also include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising a" does not exclude the existence of additional identical elements in the process, method, article, or apparatus that includes the element.

[0025] In the description of the present embodiments, the terms "example" or "exemplary" are used to mean that an instance, or implementation, is an example or illustration of the present embodiments. The terms "example" or "exemplary" should not be construed as a preference or advantage of one embodiment over another embodiment. The terms "example" or "exemplary" are used as clear as possible to convey the meaning of the present embodiments.

[0026] Fig. 1 is a structural schematic diagram of a transceiver optical device 10 according to an embodiment of the present application. It should be noted that the transceiver optical device 10 provided by the present application is not limited to the structure shown in Fig. 1 if there is substantially the same result. The transceiver optical device 10 includes a silicon light engine 110, configured to receive an external input optical signal through an optical receiving end, convert the input optical signal into a first electrical signal, convert a received second electrical signal into an output optical signal, and output the output optical signal through an optical output end; a transimpedance amplifier 120, configured to obtain the first electrical signal and amplify the first electrical signal into the second electrical signal; and a substrate 130, configured to carry the silicon light engine and the transimpedance amplifier. The transceiver optical device provided by the present embodiments reduces the size of the transceiver optical device through the silicon light engine, thereby improving the integration of the transceiver optical device, and further reducing the complexity and comprehensive cost of the optical communication system.

[0027] The transimpedance amplifier 120 is an electronic amplifier commonly used as a preamplifier in the optical signal receiving end, which is used to amplify the weak current signal sent by the photodiode to improve the detection sensitivity and signal-to-noise ratio of the optical signal. In the optical communication system, after the optical signal is transmitted to the optical signal receiving end through the optical fiber, it needs to be converted into an electrical signal by an optical-electric conversion device, and then the electrical signal is amplified by a transimpedance amplifier to further improve the detection sensitivity and signal-to-noise ratio of the signal for subsequent signal processing and demodulation. The transimpedance amplifier is one of the important components in the optical communication system.

[0028] The substrate 130 refers to a flat panel material used to support circuit components or chips during the manufacturing process of electronic devices, which is usually made of silicon, glass, ceramic and other materials. It not only provides support and fixation for circuit components, but also provides electrical and thermal performance support, and can also affect the performance and stability of the circuit. In the embodiments of the present application, the substrate is made of silicon material. In the semiconductor industry, the substrate usually refers to a silicon substrate, which is an important material for manufacturing integrated circuits (IC) and microelectronic devices. Compared with other materials such as glass substrate and ceramic substrate, the silicon substrate has the advantages of high purity, high flatness, good thermal performance, good repeatability, etc.

[0029] In some embodiments, the light receiving end of the silicon optical engine 110 includes a light receiving unit that receives the first optical signal through a waveguide, then converts the first optical signal into the first electrical signal, and finally outputs the first electrical signal to the transimpedance amplifier through the first circuit on the substrate, realizing the function of receiving optical signals of the transceiver device.

[0030] Waveguide technology is a technology that uses total internal reflection in a medium to confine and transmit electromagnetic waves. Waveguides are usually made of materials with high dielectric constant and electrical conductivity, such as metals, semiconductors, and optical glasses. Waveguide technology is widely used in fields such as microwave, millimeter wave, infrared, optical fiber communication, and has also been widely applied in chip-level integrated circuits. Waveguides usually have different cross-sectional shapes such as rectangular, circular, trapezoidal, etc., among which rectangular waveguides are the most commonly used form. Rectangular waveguides can be divided into single-mode waveguides and multi-mode waveguides. Single-mode waveguides can only transmit one mode of electromagnetic waves, with lower transmission loss and higher bandwidth; multi-mode waveguides can transmit multiple modes of electromagnetic waves, with higher transmission loss and lower bandwidth.

[0031] In some embodiments, the light output end of the silicon optical engine 110 includes a light emitting unit, which receives the second electrical signal through the second circuit on the substrate 130, then converts the second electrical signal into a second optical signal, and finally outputs the second optical signal through a waveguide, realizing the function of transmitting an optical signal of a transceiver optical device.

[0032] As an example, FIG. 2 is a more specific schematic diagram of a hardware architecture of a transceiver optical device provided by embodiments of the present application. The light receiving unit further includes an optical splitter (not shown in FIG. 2). The optical splitter is an optical device widely used in fiber-optic communication systems, mainly used for splitting and distributing one optical signal into multiple optical signals. There are mainly two types of optical splitters: one is a coupling type optical splitter based on interference principle, and the other is a splitting type optical splitter based on waveguide technology. The optical splitter receives the input optical signal of a single optical signal through a first optical free access unit (FAU, Optical Engine), and converts the input optical signal into the first optical signal containing at least one optical signal. The first optical signal is transmitted to the light receiving unit PD through a waveguide, and the light receiving unit converts the first optical signal into the first electrical signal, and then transmits the first electrical signal to a transimpedance amplifier (TIA, Transimpedance Amplifier), which converts the first electrical signal into the second optical signal and sends the second optical signal to the light emitting unit LD. The light emitting unit further includes an optical cross-connect (not shown in FIG. 2). The optical cross-connect is an optical fiber communication device based on optical switch technology, mainly used for optical signal exchange, routing and management in optical networks to realize high-speed, efficient and flexible data transmission of optical networks. The optical cross-connect mainly includes two parts: an optical crosspoint and a control circuit. The optical crosspoint is composed of optical switches and can realize the exchange and routing of optical signals. The control circuit is used to control the state of the optical switch to realize the management and control of the optical signal. The optical cross-connect receives the second optical signal containing at least one optical signal, converts the second optical signal into the output optical signal of a single optical signal, and outputs the output optical signal through a second optical free access unit.

[0033] As another example, FIG. 3 is a schematic diagram of another more specific hardware architecture of a transceiver optical device according to embodiments of the present application. The silicon optical engine 10 includes a planar lightwave circuit (PLC) 1107, an arrayed waveguide grating (AWG) 1102, an optical receiving unit 1104, an optical transmitting unit 1105, a monitoring optical detector 1106, and an optical chip substrate 1103, wherein the optical receiving unit 1104 and the optical transmitting unit 1105 are in a flip-chip structure (including a normal flip-chip structure and / or an inverted flip-chip structure). The silicon optical engine 10 outputs optical input signals to the outside and receives optical input signals from the outside. Further, the monitoring optical detector 1106 is used to monitor optical communication parameters of the output optical signals, such as optical wavelength, optical polarization, optical loss, optical attenuation, optical power (ensuring the intensity and stability of the optical signals), and the like.

[0034] As an implementation, FIG. 4 is a schematic diagram of a flip-chip coupling structure of an optical receiving chip according to embodiments of the present application. The optical receiving unit 1104 includes at least one flip-chip coupling structure of an optical receiving chip, as shown in FIG. 4, the flip-chip coupling structure of the optical receiving chip includes an optical receiving chip, and the chip pads of the optical receiving chip are connected to the electronic traces of the first circuit on the chip substrate 1103 by a flip-chip process, so that the optical receiving chip is connected to the first circuit, and further the first electrical signals generated by the optical receiving chip can be transmitted to the transimpedance amplifier 120 through the first circuit. The first optical signals are transmitted to the detector surface of the optical receiving chip in a reflection manner after passing through the waveguide, and the optical receiving chip converts the first optical signals into the first electrical signals.

[0035] The flip-chip bonding process is a microelectronic chip packaging technology mainly used for connecting and packaging chips and substrates. This technology usually uses high-precision automated equipment to perform the connection. In the first aspect, the electrical connection between the flip-chip and the substrate is direct, which can achieve higher density and smaller pitch compared to traditional cable connections, thereby improving the integration and performance of the chip. In the second aspect, since the electrical connection between the flip-chip and the substrate is direct, the signal transmission path is shorter, thereby reducing signal transmission delay and loss and improving signal transmission speed and accuracy. In the third aspect, since the electrical connection between the flip-chip and the substrate is direct, the contact area of the connection is larger and the connection is more reliable, which is not easily affected by mechanical vibration and temperature changes, thereby improving the reliability and stability of the entire optical transceiver device. In the fourth aspect, since the electrical connection between the flip-chip and the substrate is direct, no additional cable connection is needed, thereby achieving a smaller chip packaging volume and being suitable for various miniaturized devices and systems. In summary, the optical receiving chip flip-chip coupling structure obtained by applying the flip-chip bonding process has the advantages of high efficiency, high precision, high density, and low cost.

[0036] As another embodiment, FIG. 5 is a schematic diagram of an optical transmitting chip flip-chip coupling structure provided by the embodiment of the present application. The optical transmitting chip is similar to the flip-chip coupling structure, and will not be described here. It needs to be specially pointed out that the optical transmitting chip flip-chip coupling structure contains an optical transmitting chip connected to the second circuit contact on the substrate by using the eutectic bonding process. The optical transmitting unit 1105 contains at least one optical transmitting chip flip-chip coupling structure, as shown in FIG. 5, the optical transmitting chip flip-chip coupling structure contains an optical transmitting chip, the chip contact (LD Pad) of the optical transmitting chip is connected to the electrical contact (Electronic Pad) of the second circuit on the chip substrate 1103 by using the flip-chip bonding process, the second electrical signal output by the transimpedance amplifier 120 is transmitted to the optical transmitting chip through the contact, the optical transmitting chip converts the second electrical signal into the second optical signal, and finally outputs the second optical signal through the waveguide.

[0037] The transceiving optical device provided in the embodiments of the present application, compared with the conventional transceiving optical device, comprises: a silicon light engine, configured to receive an external input optical signal through an optical receiving end, convert the input optical signal into a first electrical signal, convert a received second electrical signal into an output optical signal, and output the output optical signal through an optical output end; a transimpedance amplifier, configured to obtain the first electrical signal and amplify the first electrical signal into the second electrical signal; and a substrate, configured to carry the silicon light engine and the transimpedance amplifier. The transceiving optical device provided in the present application does not rely on an external spherical solder light source, and further reduces the size of the transceiving optical device, and further improves the integration of the transceiving optical device, thereby reducing the complexity and cost of the optical communication system.

[0038] In another embodiment, as shown in FIG. 6, based on the above transceiving optical device, a transceiving optical method is provided, comprising:

[0039] S10, receiving the external input optical signal through the silicon light engine, and converting the input optical signal into the first electrical signal, and then sending the first electrical signal to the transimpedance amplifier through the substrate.

[0040] Specifically, the optical receiving end of the silicon light engine comprises an optical receiving unit, which receives a first optical signal through a waveguide arranged on the substrate, and then the silicon light engine converts the first optical signal into the first electrical signal and outputs the first electrical signal to the transimpedance amplifier through the first circuit on the substrate.

[0041] Further, the optical splitter included in the silicon optical engine receives the input optical signal of the single optical signal through the first optical free access unit, and when the input optical signal reaches the optical splitter, the input optical signal is divided into different paths, and each path generates an optical signal. Specifically, in the optical splitter, the input optical signal is divided into different output optical signals through optical effects such as reflection, transmission, refraction, etc. of light. The optical splitter is usually composed of one or more optical elements such as optical fibers, optical gratings, optical prisms, etc., and the foregoing optical elements divide the signal into different output paths according to different optical parameters (such as wavelength, polarization, etc.). Then, the optical signal output by the optical splitter is transmitted to the flip-chip coupling structure of the optical receiving chip through the waveguide arranged in the substrate, wherein the data amount of the flip-chip coupling structure of the optical receiving chip is equal to the number of optical signals output by the optical splitter. The flip-chip coupling structure of the optical receiving chip first receives the optical signal forwarded by the waveguide through the preset reflective optical device arranged in the groove on the substrate and located between the optical receiving chip and the substrate, and the reflective optical device can reflect the optical signal output by the waveguide to the photodetector active area (Detector Surface) on the surface of the optical receiving chip. The photodetector active area is usually made of semiconductor materials such as silicon, germanium, indium, gallium, arsenic, etc. When the optical signal irradiates the photodetector active area, the electrons in the photodetector active area are excited, and the electrons in the photodetector active area jump to the conduction band, so that an electric current signal is generated. Therefore, the photodetector active area is a key part of photoelectric conversion, and the design and optimization will directly affect the performance and sensitivity of the optical receiving chip.

[0042] Further, the contact of the optical receiving chip is connected to the first circuit input end, the first circuit is arranged in the substrate, and after the optical receiving chip converts the received input optical signal into the first electrical signal, the first electrical signal is transmitted to the input end of the first circuit through the contact, and then transmitted to the transimpedance amplifier through the output end of the first circuit.

[0043] S20, amplifying the first electrical signal through the transimpedance amplifier to obtain the second electrical signal after amplification, and sending the second electrical signal to the silicon optical engine through the substrate.

[0044] The working principle and function of the transimpedance amplifier are described in the foregoing optical transceiver device and will not be repeated here. It needs to be specially pointed out that the transimpedance amplifier can also be arranged on the substrate by the flip welding process, then the input end of the transimpedance amplifier is connected with the first circuit in the substrate through a contact, the output end of the transimpedance amplifier is connected with the second circuit in the substrate through a contact, and then a link for electrical signal transmission is formed. The electrical signal transmission link formed by the transimpedance amplifier has better anti-interference ability to external electromagnetic interference signals and the like, and the electrical signal output by the transimpedance amplifier is not affected by a load, so the output electrical signal has high stability and strong reliability.

[0045] S30, converting the second electrical signal into the output optical signal by the silicon light engine, and outputting the output optical signal through the optical output end.

[0046] Specifically, the optical output end of the silicon light engine includes a light emitting unit, the light emitting unit receives the second electrical signal through the second circuit on the substrate, converts the second electrical signal into a second optical signal, and outputs the second optical signal through a waveguide.

[0047] Further, the silicon optical engine includes a light emitting chip disposed on the substrate by a flip-chip process, a chip contact of the light emitting chip connected to an electronic pad disposed on the substrate at the same time, one end of the electronic pad connected to the light emitting chip, and the other end of the electronic pad connected to the second circuit. An input end of the second circuit receives the second electrical signal output by the transduced current, and then an output end of the second circuit transmits the second electrical signal to the light emitting chip through the electronic pad. The light emitting chip is a semiconductor device for converting an electrical signal into an optical signal. On the basis of a PN junction, a dopant is added to the semiconductor to form a PN junction with positive and negative charges, so that the electrons and holes in the semiconductor material can be recombined to release energy and generate photons, thereby generating an optical signal. After the light emitting chip converts the second electrical signal into an optical signal, the converted optical signal is transmitted to a waveguide disposed in the substrate through an optical output end of the light emitting chip. Then, the optical signal output by the light emitting chip is transmitted to the optical combiner through the waveguide disposed in the substrate. The optical combiner is an optical device for coupling multiple optical signals into a single optical signal. The optical combiner generally consists of optical fibers, couplers, and support structures. The basic working principle of the optical combiner is to utilize the transmission characteristics of optical signals in optical fibers for coupling. When two optical fibers intersect and are very close, optical signals are transmitted from one optical fiber to another optical fiber, thereby realizing coupling of optical signals. The optical combiner uses beam splitters, coupling rods, gratings, and T-shaped devices to achieve efficient optical coupling and low-loss optical transmission. The multiple optical signals output by the light emitting chip through the waveguide are coupled into the output optical signal by the optical combiner. Finally, the output optical signal is output to the outside by the second optical free access unit.

[0048] Further, the optical communication parameters of the output optical signal, such as optical wavelength, optical polarization, optical loss, optical attenuation, optical power (ensuring the intensity and stability of the optical signal), etc., are monitored by the monitoring optical detector, and then the monitoring results obtained by the monitoring optical detector are transmitted to the optical combiner and the light emitting chip. The light emitting chip adjusts and optimizes the process of converting the second electrical signal into the output optical signal according to the monitoring results, and the optical combiner adjusts and optimizes the process of coupling the multiple optical signals output by the light emitting chip into the single output optical signal according to the monitoring results.

[0049] It should be understood that the size of the serial number of each step in the above embodiments does not mean the order of execution. The execution order of each process should be determined by its function and inherent logic, and should not constitute any limitation on the implementation process of the embodiments of the present application.

[0050] It should be noted that the "connection" in the embodiments of the present application can be understood as an electrical connection, and the connection between two electrical elements can be direct or indirect connection between the two electrical elements. For example, A and B are connected, which can be direct connection between A and B, or indirect connection between A and B through one or more other electrical elements.

[0051] The "first" and "second" in the above modules / units are only used to distinguish different modules / units, and are not used to limit the priority of which module / unit is higher or other limiting meanings. In addition, the terms "include" and "have" and any variations thereof are intended to cover non-exclusive inclusion, for example, a process, method, system, product or device including a series of steps or modules does not have to be limited to those steps or modules clearly listed, but can include other steps or modules not clearly listed or inherent to these processes, methods, products or devices. The division of modules in the present application is only a logical division, and other division methods can be used in actual application.

[0052] The embodiments of the present application also provide a transceiver chip, which comprises the transceiver device. It should be specially noted that the transceiver chip in the embodiments of the present application can not only be applied to optical communication, but also can be applied to technical fields such as laser radar, artificial intelligence, etc.

[0053] Compared with the prior art, the transceiver chip provided by the present application has the same beneficial effects as the transceiver device described in the above technical solution, which will not be repeated here.

[0054] Those skilled in the art can clearly understand that, for the convenience and brevity of description, only the division of the above functional units and modules is taken as an example for illustration, and in actual application, the above functions can be completed by different functional units and modules according to needs, that is, the internal structure of the device is divided into different functional units or modules to complete all or part of the functions described above.

[0055] The above-described embodiments are only used to illustrate the technical solutions of the present application, but not to limit them; although the present application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that they can modify the technical solutions recorded in the foregoing embodiments, or make equivalent replacement for part of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present application, and should be included in the protection scope of the present application.

Claims

1. A light emitting and receiving device, characterized in that: include: a silicon photonic engine, configured to receive an external input optical signal through an optical receiving end, convert the input optical signal into a first electrical signal, convert the received second electrical signal into an output optical signal, and output the output optical signal through an optical output end; a transimpedance amplifier, configured to obtain the first electrical signal and amplify the first electrical signal into the second electrical signal; A substrate is used to support the silicon photonic engine and the transimpedance amplifier.

2. The light emitting and receiving device according to claim 1, wherein: The optical receiving end includes an optical receiving unit, which receives a first optical signal through a waveguide, converts the first optical signal into the first electrical signal, and outputs the first electrical signal to the transimpedance amplifier through a first circuit on the substrate.

3. The light emitting and receiving device according to claim 1, wherein: The optical output end includes a light emitting unit. The light emitting unit receives the second electrical signal through the second circuit on the substrate, converts the second electrical signal into a second optical signal, and outputs the second optical signal through a waveguide.

4. The optical transceiver device according to claim 2, wherein: The optical receiving unit includes at least one optical receiving chip flip-chip coupling structure, and the optical receiving chip flip-chip coupling structure includes an optical receiving chip. The contacts of the optical receiving chip are connected to the contacts of the first circuit on the substrate through a flip welding process. The first optical signal is transmitted to the optical receiving chip by reflection after passing through the waveguide, and the optical receiving chip converts the first optical signal into the first electrical signal.

5. The light emitting and receiving device according to claim 3, wherein: The light emitting unit includes at least one light emitting chip flip-chip coupling or face-up coupling structure, the contacts of the light emitting chip included in the light emitting chip flip-chip coupling structure are connected to the contacts of the second circuit on the substrate through a flip welding process, and the light emitting chip included in the light emitting chip face-up coupling structure is connected to the second circuit contacts on the substrate through a eutectic welding process, the second electrical signal is transmitted to the light emitting chip through the contacts, and the light emitting chip converts the second electrical signal into the second optical signal.

6. The light emitting and receiving device according to claim 4, characterized in that: The optical receiving unit further includes an optical splitter, which receives the input optical signal of a single optical signal through the first optical free access unit and converts the input optical signal into the first optical signal including at least one optical signal.

7. The light emitting and receiving device according to claim 5, characterized in that: The optical transmission unit further includes an optical combiner, which receives the second optical signal including at least one optical signal, converts the second optical signal into the output optical signal of a single optical signal, and outputs the output optical signal through the second optical free access unit.

8. The light emitting and receiving device according to claim 7, wherein: The optical transmission unit further includes a monitoring optical detector, which is used to monitor the optical communication parameters of the output optical signal.

9. A method for emitting and receiving light, based on the light-emitting and receiving device according to any one of claims 1 to 8, characterized in that: include: receiving the external input optical signal through the silicon photonic engine, converting the input optical signal into the first electrical signal, and then sending the first electrical signal to the transimpedance amplifier through the substrate; amplifying the first electrical signal through the transimpedance amplifier to obtain an amplified second electrical signal, and then sending the second electrical signal to the silicon photonic engine through the substrate; The second electrical signal is converted into the output optical signal by the silicon optical engine, and the output optical signal is output through the optical output end.

10. A light-emitting and light-receiving chip, characterized in that: The device comprises the light emitting and receiving device according to any one of claims 1 to 8.

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