Stage apparatus and semiconductor process device

Abstract

The present application discloses a stage apparatus and a semiconductor process device. The disclosed stage apparatus is used for bearing a front opening unified pod and driving same to move in a first direction outside a loading and unloading chamber of the semiconductor process device. The stage apparatus comprises a stage support, a bearing portion, a driving mechanism, and a buffering mechanism. The driving mechanism is arranged on the stage support, and the bearing portion is movably arranged on the stage support in the first direction. The driving mechanism is connected to the bearing portion via the buffering mechanism, and is used for driving, via the buffering mechanism, the bearing portion to move in the first direction. When the driving mechanism drives, via the buffering mechanism, the bearing portion to move in the first direction to a connection position, the bearing portion can, under the buffering action of the buffering mechanism, continue to move in the first direction by a preset buffering distance. The above solution can solve the problem in the related art of insufficient sealing between an opening of a front opening unified pod and a transfer port of a loading and unloading chamber when a stage apparatus drives the opening of the front opening unified pod to connect to the transfer port of the loading and unloading chamber.

Description

Stage device and semiconductor process equipment TECHNICAL FIELD

[0001] The present application relates to the technical field of semiconductor equipment, and in particular to a stage device and semiconductor process equipment. BACKGROUND

[0002] In the process of preparing a semiconductor by a semiconductor process equipment, especially a vertical heat treatment equipment, a FOUP (front opening unified pod) is usually used as a container for storing wafers, and in order to enable the wafers to be taken out from the FOUP to a load / unload chamber or put into the FOUP from the load / unload chamber, the FOUP usually needs to be moved by a stage device to enable the opening of the FOUP to be sealingly fitted with a transmission port of the load / unload chamber.

[0003] There are two processes for enabling the opening of the FOUP to be sealingly fitted with the transmission port of the load / unload chamber. First, the FOUP is transferred to the stage device, and the FOUP is moved by the stage device to enable the opening of the FOUP to be connected with the transmission port of the load / unload chamber, and then the FOUP is finally clamped to the transmission port of the load / unload chamber by a sealing clamping mechanism.

[0004] However, after the FOUP is moved by the stage device to enable the opening of the FOUP to be connected with the transmission port of the load / unload chamber, the stage device no longer moves. Since the FOUP is fixedly connected with the stage device, after the final clamping by the sealing clamping mechanism, the FOUP cannot further approach the load / unload chamber under the restriction of the stage device, and thus there is a problem of insufficient clamping between the FOUP and the transmission port of the load / unload chamber, which further easily leads to clamping and sealing failure between the FOUP and the transmission port, and thus particles are diffused into the FOUP to cause damage to the wafers. SUMMARY

[0005] The present application discloses a stage device and semiconductor process equipment to solve the problem of insufficient sealing between the opening of a wafer carrier box and a transmission port of a load / unload chamber when the opening of the wafer carrier box is connected with the transmission port of the load / unload chamber by a stage device in the related art.

[0006] To solve the above technical problems, the present application is implemented as follows:

[0007] In a first aspect, the present application discloses a stage device for carrying and driving a wafer carrier box to move in a first direction outside a load / unload chamber of a semiconductor process equipment to enable an opening of the wafer carrier box to be connected with a transmission port of the load / unload chamber, the stage device comprising: a stage support, a carrying part, a driving mechanism and a buffer mechanism.

[0008] The driving mechanism is arranged on the carrier support, and the carrier is movably arranged on the carrier support along a first direction to support the wafer carrier box;

[0009] The driving mechanism is connected with the carrier through the buffer mechanism, and is configured to drive the carrier to move along the first direction through the buffer mechanism.

[0010] When the driving mechanism drives the carrier to move along the first direction to the docking position through the buffer mechanism, the carrier can continue to move along the first direction by a preset buffer distance under the buffering action of the buffer mechanism.

[0011] In a second aspect, the application further discloses a semiconductor process equipment, which comprises a loading and unloading chamber and the carrier device of the first aspect, and the carrier device is configured to support and drive the wafer carrier box to move along a first direction outside the loading and unloading chamber, so that the opening of the wafer carrier box is docked with the transmission port of the loading and unloading chamber.

[0012] The technical scheme adopted by the application can achieve the following technical effects:

[0013] The carrier device disclosed in the application embodiment is provided with a buffer mechanism, so that the driving mechanism drives the carrier to move along the first direction through the buffer mechanism, so that the wafer carrier box moves to a position where the opening of the wafer carrier box is docked with the transmission port of the loading and unloading chamber. Since the buffer mechanism has a preset buffer distance along the first direction, the carrier can continue to move along the first direction by the preset buffer distance under the buffering action of the buffer mechanism, so that when the opening of the wafer carrier box is pressed against the transmission port of the loading and unloading chamber by the sealing clamping mechanism or other mechanisms, the opening of the wafer carrier box and the transmission port of the loading and unloading chamber can be further close, so that better sealing is achieved between the opening of the wafer carrier box and the transmission port of the loading and unloading chamber, thereby preventing external particles from diffusing into the wafer carrier box to damage the wafer. BRIEF DESCRIPTION OF DRAWINGS

[0014] FIG. 1 is a structural schematic view of the carrier device disclosed in the application embodiment;

[0015] FIG. 2 is a partial enlarged schematic view of the buffer mechanism disclosed in the application embodiment;

[0016] FIG. 3 is an axial side view of the carrier device disclosed in the application embodiment;

[0017] FIG. 4 is a schematic view of FIG. 3 with the carrier hidden;

[0018] FIG. 5 is a schematic view of FIG. 3 from another perspective;

[0019] Fig. 6 is a schematic view of a wafer carrier box carried by a carrier device sealingly connected to a load / unload chamber.

[0020] Reference signs: 100-carrier support, 110-bar-shaped avoiding hole, 200-carrier part, 300-driving mechanism, 310-driving body, 320-driving rod, 400-buffering mechanism, 410-base, 411-bar-shaped limiting hole, 420-moving piece, 430-anti-dropping pin, 510-first sliding rail, 520-first sliding block, 610-mounting frame, 620-transition rod, 630-flexible connector, 710-second sliding rail, 720-second sliding block, 810-limiting piece, 820-adjustable positioning pin, 830-fixed positioning pin, 840-in-place sensor, 910-wafer carrier box, 920-load / unload chamber, 930-sealing clamping mechanism. DETAILED DESCRIPTION

[0021] To make the objectives, technical solutions and advantages of the present application clearer, the technical solutions will be described below in conjunction with specific embodiments of the present application and corresponding drawings. Obviously, the described embodiments are only some of the embodiments of the present application, but not all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative work fall within the scope of protection of the present application.

[0022] The technical solutions disclosed by the various embodiments of the present application will be described in detail below with reference to the drawings.

[0023] Please refer to Figs. 1-6, the present application discloses a carrier device, the disclosed carrier device is used for carrying and driving a wafer carrier box 910 to move in a first direction outside a load / unload chamber 920 of a semiconductor process equipment, so that the opening of the wafer carrier box 910 is connected to a transmission port of the load / unload chamber 920.

[0024] The disclosed carrier device includes a carrier support 100, a carrier part 200, a driving mechanism 300 and a buffering mechanism 400. The carrier support 100 can be installed on the chamber wall of the load / unload chamber 920, of course, the carrier support 100 can also be installed on other components, the installation position of the carrier support 100 is not specifically limited in the embodiments of the present application.

[0025] The driving mechanism 300 is arranged on the carrier support 100, and the carrier part 200 is movably arranged on the carrier support 100 in the first direction, and is used for supporting the wafer carrier box 910.

[0026] The driving mechanism 300 is connected with the carrier part 200 through the buffering mechanism 400, and is used for driving the carrier part 200 to move in the first direction through the buffering mechanism 400.

[0027] In the case that the driving mechanism 300 drives the bearing part 200 to move along the first direction to the docking position through the buffering mechanism 400, the bearing part 200 can continue to move along the first direction by a preset buffering distance under the buffering action of the buffering mechanism 400.

[0028] In the specific implementation process, first, the wafer carrying box 910 is placed on the bearing part 200, and the driving mechanism 300 drives the bearing part 200 to move along the first direction through the buffering mechanism 400, so that the wafer carrying box moves to a position where the opening of the wafer carrying box 910 is docked with the transfer port of the load / unload chamber 920 (i.e., the docking position in the present disclosure). Then, the opening of the wafer carrying box 910 is pressed against the transfer port of the load / unload chamber 920 through the sealing clamping mechanism 930 or other mechanisms. In this process, since the buffering mechanism 400 has a preset buffering distance along the first direction, the opening of the wafer carrying box 910 can be further pressed against the transfer port of the load / unload chamber 920 by the bearing part 200, so that a better sealing is achieved between the opening of the wafer carrying box 910 and the transfer port of the load / unload chamber 920.

[0029] The wafer carrying box 910 is placed on the bearing part 200, and the driving mechanism 300 drives the bearing part 200 to move along the first direction through the buffering mechanism 400, so that the wafer carrying box moves to a position where the opening of the wafer carrying box 910 is docked with the transfer port of the load / unload chamber 920. Since the buffering mechanism 400 has a preset buffering distance along the first direction, the bearing part 200 can continue to move along the first direction by the preset buffering distance under the buffering action of the buffering mechanism 400, so that when the opening of the wafer carrying box 910 is pressed against the transfer port of the load / unload chamber 920 through the sealing clamping mechanism 930 or other mechanisms, the opening of the wafer carrying box 910 can be further pressed against the transfer port of the load / unload chamber, so that a better sealing is achieved between the opening of the wafer carrying box 910 and the transfer port of the load / unload chamber, thereby preventing the external particles from diffusing into the wafer carrying box 910 to damage the wafer.

[0030] It should be noted that when the opening of the wafer carrying box 910 is pressed against the transfer port of the load / unload chamber through the sealing clamping mechanism 930, the distance required for the wafer carrying box 910 to move is usually 2 mm, and therefore, the preset buffering distance can be greater than 2 mm, for example, the preset buffering distance can be 3 mm, 3.5 mm, etc.

[0031] Specifically, the buffering mechanism 400 can be an elastic piece. During the process that the driving mechanism 300 drives the carrier 200 to move along the first direction through the buffering mechanism 400, the elastic piece can be in a stretching state. In the case that the driving mechanism 300 drives the carrier 200 to move along the first direction to the docking position through the buffering mechanism 400, the carrier 200 can continue to move along the first direction by a preset buffering distance, because the elastic piece still has a certain elastic stretching deformation amount (i.e., the preset buffering distance).

[0032] The carrier device disclosed by the embodiments of the present application sets the buffering mechanism 400 as an elastic piece, so that the structure of the buffering mechanism 400 is relatively simple.

[0033] In another implementation, the buffering mechanism 400 can include a base 410 and a moving piece 420, the moving piece 420 can be movably arranged in the base 410 along the first direction, the base 410 can be sequentially provided with a first limiting part and a second limiting part in the first direction, the driving mechanism 300 can be connected with the moving piece 420, and the carrier 200 can be connected with the base 410. In the case that the driving mechanism 300 drives the base 410 to move through the limiting contact of the moving piece 420 with the second limiting part, so that the base 410 drives the carrier 200 to move along the first direction to the docking position, the carrier 200 can continue to move along the first direction relative to the moving piece 420 by a preset buffering distance, wherein the moving stroke length of the moving piece 420 between the first limiting part and the second limiting part is the preset buffering distance.

[0034] The carrier device disclosed by the embodiments of the present application sets the buffering mechanism 400 as a structure including the base 410 and the moving piece 420, so that the base 410 drives the carrier 200 to move more stably, and the first limiting part and the second limiting part can better limit the moving range of the moving piece 420, thereby avoiding the problem of falling off caused by unlimited movement of the moving piece 420.

[0035] In the case that the opening of the wafer carrier box 910 is separated from the transmission port of the loading and unloading chamber 920, the carrier 200 can first drive the wafer carrier box 910 to move along the second direction by a preset buffering distance, and then drive the base 410 to drive the wafer carrier box 910 to continue to move along the second direction through the limiting contact of the moving piece 420 with the second limiting part, so that the opening of the wafer carrier box 910 is separated from the transmission port of the loading and unloading chamber 920, wherein the second direction is opposite to the first direction.

[0036] In some embodiments, the base 410 can be provided with a strip-shaped limiting hole 411 extending along the first direction. The moving piece 420 can be arranged in the strip-shaped limiting hole 411 and can slide along the first direction in the strip-shaped limiting hole 411. In the first direction, the opposite two side walls of the strip-shaped limiting hole 411 can be respectively a first limiting part and a second limiting part.

[0037] The stage device disclosed by the embodiments of the present application can make the moving piece 420 arranged in the strip-shaped limiting hole 411 and can slide along the first direction in the strip-shaped limiting hole 411 by providing the base 410 with a strip-shaped limiting hole 411 extending along the first direction, so that the movement of the moving piece 420 is more stable under the limiting action of the strip-shaped limiting hole 411, and the strip-shaped limiting hole 411 can also guide the movement of the moving piece 420, so that the movement of the moving piece 420 is more accurate.

[0038] In order to prevent the moving piece 420 from moving out of the strip-shaped limiting hole 411 during movement, in some embodiments, the buffer mechanism 400 can further include a anti-disengagement pin 430, and the two ends of the moving piece 420 can respectively extend out of the strip-shaped limiting hole 411 and are respectively connected with the anti-disengagement pin 430, and the anti-disengagement pin 430 is used for limiting cooperation with the hole opening of the strip-shaped limiting hole 411, so as to prevent the moving piece 420 from moving out of the strip-shaped limiting hole 411 during movement.

[0039] In order to design the stage device to be light, in some embodiments, the base 410 can have an inner cavity, the strip-shaped limiting hole 411 penetrates the inner cavity, the driving mechanism 300 can include a driving body 310 and a driving rod 320, the driving body 310 can be arranged on the stage support 100, the first end of the driving rod 320 can be connected with the driving body 310, and the second end of the driving rod 320 can extend into the inner cavity and be connected with the moving piece 420.

[0040] The stage device disclosed by the embodiments of the present application can make the base 410 have a hollow structure, so as to facilitate reducing the weight of the base 410, and further facilitate the light design of the stage device.

[0041] In order to make the driving mechanism 300 drive the base 410 to move more stably through the moving piece 420, in some embodiments, the stage device can further include a first sliding rail 510 and a first sliding block 520, the first sliding rail 510 can be arranged on the stage support 100 and extend along the first direction, the first sliding block 520 can be slidingly arranged on the first sliding rail 510, and the base 410 is connected with the first sliding block 520.

[0042] The carrier device disclosed by the embodiment of the application is provided with the first sliding rail 510 and the first sliding block 520, so that the base 410 is connected with the first sliding block 520, thereby making the driving mechanism 300 more stable in moving the base 410 through the moving piece 420, and further making the base more stable in moving the carrier 200 and the wafer carrier box 910.

[0043] Specifically, the carrier 200 can be located above the carrier support 100, the buffer mechanism 400 and the driving mechanism 300 can be located below the carrier support 100, and the carrier device can further include a mounting frame 610, and the base 410 is connected with the carrier 200 through the mounting frame 610.

[0044] The carrier device disclosed by the embodiment of the application sets the carrier 200 above the carrier support 100 and sets the buffer mechanism 400 and the driving mechanism 300 below the carrier support 100, thereby avoiding excessive occupation of the space on the same side of the carrier support 100.

[0045] In some embodiments, the carrier support 100 can be provided with a strip-shaped avoiding hole 110, the strip-shaped avoiding hole 110 can extend along the first direction, one end of the mounting frame 610 can be connected with the base 410, the other end of the mounting frame 610 can pass through the strip-shaped avoiding hole 110 and be connected with the carrier 200, and the mounting frame 610 can move along the first direction in the strip-shaped avoiding hole 110. By providing the strip-shaped avoiding hole 110 in the carrier support 100, not only can the strip-shaped avoiding hole 110 have a guiding effect on the mounting frame 610, but also can avoid the problem of large space occupation caused by parallel arrangement of the mounting frame 610 and the carrier support 100.

[0046] In order to avoid the situation that the carrier 200 and the base 410 are stuck when moving, in some embodiments, the carrier device can further include a transition rod 620 and a flexible connector 630, the transition rod 620 is connected with the base 410, and the flexible connector 630 can be connected between the transition rod 620 and the mounting frame 610. It should be noted that the base 410 is indirectly connected with the mounting frame 610 through the transition rod 620 and the flexible connector 630.

[0047] The carrier device disclosed by the embodiment of the application is provided with the flexible connector 630, so that the flexible connector 630 is connected between the transition rod 620 and the mounting frame 610, and through the flexible property of the flexible connector 630, the situation that the carrier 200 and the base 410 are stuck when the moving tracks are not parallel can be buffered.

[0048] To make the movement of the bearing part 200 more stable, in some embodiments, the table device can further include a second sliding rail 710 and a second sliding block 720, the second sliding rail 710 can extend along a first direction, the second sliding block 720 can be slidingly arranged on the second sliding rail 710, and the bearing part 200 can be connected with the second sliding block 720.

[0049] The table device disclosed by the embodiments of the present application makes the second sliding block 720 slidingly arranged on the second sliding rail 710, and the bearing part 200 connected with the second sliding block 720, so that the movement of the bearing part 200 is more stable.

[0050] Further, the table device can include at least two second sliding rails 710 and at least two second sliding blocks 720, the at least two second sliding rails 710 can be arranged in a direction perpendicular to the first direction, the at least two second sliding blocks 720 correspondingly arranged on the at least two second sliding rails 710, and the two ends of the bearing part 200 can be respectively connected with the at least two second sliding blocks 720, so that the stability of the movement of the bearing part 200 can be further improved.

[0051] In the process that the table device drives the wafer carrying box 910 to separate from the transmission port of the loading and unloading chamber 920, to avoid the unlimited movement of the bearing part 200, in some embodiments, the table device can further include a limiting piece 810, the limiting piece 810 can be arranged on the table support 100, and the limiting piece 810 can be used to stop the bearing part 200 at a preset stop position when the bearing part 200 drives the wafer carrying box 910 to move in a direction (i.e. a second direction) in which the opening of the wafer carrying box 910 separates from the transmission port of the loading and unloading chamber 920, so that the wafer carrying box 910 can separate from the transmission port of the loading and unloading chamber 920 when the bearing part 200 moves to the preset stop position, and the unlimited movement of the bearing part 200 when driving the wafer carrying box 910 to separate from the opening of the wafer carrying box 910 can be avoided.

[0052] Specifically, the limiting piece 810 can directly contact with the bearing part 200 to stop the bearing part 200 at the preset stop position. Of course, in the embodiment in which the table support 100 is provided with a strip-shaped avoiding hole 110 and the base 410 is connected with the bearing part 200 through the mounting frame 610, the limiting piece 810 can limitingly contact with the mounting frame 610 to indirectly stop the bearing part 200 at the preset stop position through the mounting frame 610.

[0053] When the carrier part 200 carries the wafer carrier box 910, the wafer carrier box 910 is connected with the carrier part through the positioning pin. In order to adjust the parallelism between the opening of the wafer carrier box 910 and the transmission port of the load / unload chamber 920 in the case that the opening of the wafer carrier box 910 is docked with the transmission port of the load / unload chamber 920, in some embodiments, the table device can further include an adjustable positioning pin 820. When the carrier part 200 carries the wafer carrier box 910, the wafer carrier box 910 can be connected with the carrier part 200 through the adjustable positioning pin 820. The adjustable positioning pin 820 is used to adjust the levelness of the wafer carrier box 910, so as to adjust the parallelism between the opening of the wafer carrier box 910 and the transmission port of the load / unload chamber 920 in the case that the opening of the wafer carrier box 910 is docked with the transmission port of the load / unload chamber 920, thereby facilitating better sealing docking between the opening of the wafer carrier box 910 and the transmission port of the load / unload chamber 920.

[0054] Further, the table device can further include a fixed positioning pin 830. When the carrier part 200 carries the wafer carrier box 910, the wafer carrier box 910 can be connected with the carrier part 200 through the fixed positioning pin 830 and the adjustable positioning pin 820, so as to connect the wafer carrier box 910 with the carrier part through the cooperation of the fixed positioning pin 830 and the adjustable positioning pin 820.

[0055] In some embodiments, the table device can further include a presence sensor 840. The presence sensor 840 can be used to detect whether the wafer carrier box 910 is located on the carrier part 200, so as to drive the carrier part 200 to move the wafer carrier box 910 through the driving mechanism 300 after confirming that the wafer carrier box 910 is placed on the carrier part 200, thereby facilitating the intelligent design of the table device.

[0056] In order to facilitate the transfer device (such as a robot) to transfer the wafer carrier box 910, in some embodiments, the table support 100 can surround a first hollow region having an opening, the carrier part 200 can surround a second hollow region having an opening, the carrier part 200 can be stacked above the table support 100, the first hollow region can be opposite to the second hollow region, and the opening of the first hollow region and the opening of the second hollow region are oriented in the same direction, and the carrier part 200 can be used to support the edge of the wafer carrier box 910.

[0057] The table device disclosed in the present application embodiment is provided with the table support 100 and the carrier part 200, both of which are provided with hollow regions and openings communicating with the hollow regions, so that the carrier part 200 supports the edge of the wafer carrier box, thereby facilitating the transfer device to enter from the opening and lift the wafer carrier box 910 from the bottom of the wafer carrier box 910 to transfer the wafer carrier box 910.

[0058] The application also discloses a semiconductor process equipment, which comprises a loading and unloading chamber 920 and the loading and unloading device disclosed in the above embodiment, and the loading and unloading device is used for carrying and driving the wafer carrying box 910 to move along the first direction outside the loading and unloading chamber 920, so that the opening of the wafer carrying box 910 is docked with the transmission port of the loading and unloading chamber 920.

[0059] The semiconductor process chamber disclosed in the embodiment of the application is provided with the loading and unloading device disclosed in the above embodiment, so that when the loading and unloading device drives the wafer carrying box 910 to dock the wafer carrying box 910 with the transmission port of the loading and unloading chamber 920, the opening of the wafer carrying box 910 and the transmission port of the loading and unloading chamber 920 are well sealed, thereby preventing external particles from diffusing into the wafer carrying box and damaging the wafer.

[0060] In some embodiments, the semiconductor process equipment can further comprise a sealing clamping mechanism 930, which can be arranged in the loading and unloading chamber 920 and used for pressing the opening of the wafer carrying box 910 against the transmission port.

[0061] Specifically, in the specific implementation process, first, the wafer carrying box 910 is placed on the carrying part 200, the driving mechanism 300 drives the carrying part 200 to move along the first direction through the buffering mechanism 400, so that the wafer carrying box moves to a position where the opening of the wafer carrying box 910 is docked with the transmission port of the loading and unloading chamber 920. Then, the opening of the wafer carrying box 910 is pressed against the transmission port of the loading and unloading chamber 920 by the sealing clamping mechanism 930, and because the buffering mechanism 400 has a preset buffering distance along the first direction, the opening of the wafer carrying box 910 driven by the carrying part 200 can be further tightly attached to the transmission port of the loading and unloading chamber 920, so that the opening of the wafer carrying box 910 and the transmission port of the loading and unloading chamber 920 are well sealed.

[0062] In the above embodiments, the focus is on the differences between the various embodiments, and the optimization features different between the various embodiments can be combined to form a better embodiment without contradiction. In view of the brevity of the writing, the details are not repeated here.

[0063] The embodiments of the application are described above in combination with the drawings, but the application is not limited to the above specific implementation, and the above specific implementation is only illustrative but not restrictive. Those skilled in the art can make many forms under the inspiration of the application without departing from the scope of the application and the protection scope of the claims.

Claims

1. A stage device for carrying and driving a wafer carrier to move along a first direction outside a loading and unloading chamber of a semiconductor process equipment so that an opening of the wafer carrier docks with a transfer port of the loading and unloading chamber, characterized in that: The stage device includes: a stage bracket, a bearing part, a driving mechanism and a buffer mechanism; The driving mechanism is provided on the stage support, and the carrying portion is provided on the stage support so as to be movable along the first direction, and is used to support the wafer carrying box; The driving mechanism is connected to the carrying portion through the buffer mechanism, and is used to drive the carrying portion to move along the first direction through the buffer mechanism; When the driving mechanism drives the carrying portion to move to the docking position along the first direction through the buffer mechanism, the carrying portion may continue to move a preset buffer distance along the first direction under the buffering action of the buffer mechanism.

2. The stage device according to claim 1, wherein: The buffer mechanism includes a base and a moving member, the moving member is arranged on the base so as to be movable along the first direction, the base is provided with a first limiting portion and a second limiting portion in sequence in the first direction, the driving mechanism is connected to the moving member, and the bearing portion is connected to the base; When the driving mechanism drives the base to move through the limiting contact between the moving part and the second limiting part, so that the base drives the bearing part to move along the first direction to the docking position, the bearing part can continue to move along the first direction relative to the moving part by the preset buffer distance along with the base, wherein the moving stroke length of the moving part between the first limiting part and the second limiting part is the preset buffer distance.

3. The stage device according to claim 2, wherein: The base is provided with a strip-shaped limiting hole extending along the first direction. The movable member is passed through the strip-shaped limiting hole and can slide in the strip-shaped limiting hole along the first direction. In the first direction, the two opposite side walls of the strip-shaped limiting hole are the first limiting part and the second limiting part respectively.

4. The stage device according to claim 3, wherein: The buffer mechanism also includes an anti-slip pin. The two ends of the movable member extend out of the strip-shaped limiting hole respectively and are connected to the anti-slip pin respectively. The anti-slip pin is used to cooperate with the hole opening of the strip-shaped limiting hole in a limiting manner.

5. The stage device according to claim 3, wherein: The base has an inner cavity, the strip-shaped limiting hole is connected to the inner cavity, the driving mechanism includes a driving body and a driving rod, the driving body is arranged on the carrier bracket, the first end of the driving rod is connected to the driving body, and the second end of the driving rod extends into the inner cavity and is connected to the moving part.

6. The stage device according to claim 2, wherein: The carrier device further includes a first slide rail and a first slider. The first slide rail is provided on the carrier bracket and extends along the first direction. The first slider is slidably provided on the first slide rail. The base is connected to the first slider.

7. The stage device according to claim 2, wherein: The bearing portion is located above the stage bracket, the buffer mechanism and the driving mechanism are located below the stage bracket, and the stage device further includes a mounting frame, and the base is connected to the bearing portion via the mounting frame.

8. The stage device according to claim 7, wherein: The platform device further includes a transition rod and a flexible connector, wherein the transition rod is connected to the base, and the flexible connector is connected between the transition rod and the mounting frame.

9. The stage device according to claim 1, wherein: The stage device further includes a second slide rail and a second slider, the second slide rail extends along the first direction, the second slider is slidably disposed on the second slide rail, and the bearing portion is connected to the second slider.

10. The stage device according to claim 9, wherein: The carrier device includes at least two second slide rails and at least two second sliders, the at least two second slide rails are arranged at intervals in a direction perpendicular to the first direction, the at least two second sliders are matched with the at least two second slide rails in a one-to-one correspondence, and the two ends of the bearing part are respectively connected to the at least two second sliders.

11. The stage device according to claim 1, wherein: The carrier device also includes a limit member, which is provided on the carrier bracket. The limit member and the carrying part are arranged in sequence in the first direction. The limit member is used to stop the carrying part at a preset stop position when the carrying part drives the wafer carrying box to move in the direction of separation of the opening of the wafer carrying box and the transfer port of the loading and unloading chamber. When the carrying part moves to the preset stop position, the opening of the wafer carrying box is separated from the transfer port of the loading and unloading chamber.

12. The stage device according to claim 1, wherein: The stage device further includes an adjustable positioning pin. When the carrying portion carries the wafer carrying box, the wafer carrying box is connected to the carrying portion via the adjustable positioning pin. The adjustable positioning pin is used to adjust the horizontality of the wafer carrying box.

13. The stage device according to claim 12, wherein: The stage device further includes a fixed positioning pin. When the carrying portion carries the wafer carrying box, the wafer carrying box is connected to the carrying portion via the fixed positioning pin and the adjustable positioning pin.

14. The stage device according to claim 1, wherein: The stage device further includes an on-position sensor, and the on-position sensor is used to detect whether the wafer carrier box is located on the carrying portion.

15. The stage device according to claim 1, wherein: The carrier bracket is surrounded by a first hollow area with an opening, and the carrying part is surrounded by a second hollow area with an opening. The carrying part is stacked on top of the carrier bracket, the first hollow area is opposite to the second hollow area, and the opening of the first hollow area and the opening of the second hollow area are in the same direction, and the carrying part is used to support the edge of the wafer carrying box.

16. A semiconductor process equipment, characterized in that: It comprises a loading and unloading chamber and a stage device as described in any one of claims 1 to 15, wherein the stage device is used to carry and drive a wafer carrying box to move along a first direction outside the loading and unloading chamber so that the opening of the wafer carrying box is docked with the transfer port of the loading and unloading chamber.

Images