Electronic device

Abstract

The present application provides an electronic device, comprising a first structural member and a second structural member. The first structural member comprises a first metal substrate; the second structural member comprises a second metal substrate and a decorative layer arranged on one side of the second metal substrate; the first metal substrate is electrically connected to the second metal substrate, and the corrosion potential of the first metal substrate is lower than that of the second metal substrate; and the side of the decorative layer facing away from the second metal substrate is further provided with an insulating layer, the insulating layer is a transparent or translucent layer, and the impedance of the insulating layer is greater than or equal to 2000 Ω. The insulating layer is arranged on the decorative layer on the second metal substrate having a high corrosion potential, so as to prevent the formation of a closed circuit between metal substrates having different chemical activities in a sweat environment or a salt spray environment and the generation of a potential difference, thereby reducing the probability of electrical corrosion in the first metal substrate having a low corrosion potential, and better meeting the long-term use requirements of the electronic device.

Description

Electronic device

[0001] The present application claims priority to the Chinese patent application No. 202422068560.2, filed on August 23, 2024, entitled "Electronic device", the content of which is incorporated herein by reference in its entirety. TECHNICAL FIELD

[0002] The present application relates to the technical field of electronic products, in particular to an electronic device. BACKGROUND

[0003] At present, electronic devices such as mobile phones usually have metal structural parts of different materials, for example, there are anodized aluminum alloy middle frames and titanium alloy back covers with decorative layers on the surface in a mobile phone, and the two are electrically connected. Because the chemical activities of the two metal structural parts are different, an electric potential difference is generated between them in a sweat environment or a salt spray environment, and the metal structural part with high activity (such as an aluminum alloy middle frame) is prone to electric corrosion, which will fail after long-term use.

[0004] Utility model content

[0005] In view of this, the present application provides an electronic device to solve the problem that the metal structural part with high activity is prone to electric corrosion in an electronic device with metal structural parts of different activities.

[0006] Specifically, the first aspect of the present application provides an electronic device, which includes a first structural part and a second structural part, the first structural part includes a first metal base, the second structural part includes a second metal base and a decorative layer arranged on one side of the second metal base, the first metal base is electrically connected to the second metal base, and the corrosion potential of the first metal base is lower than that of the second metal base; the side of the decorative layer away from the second metal base is further provided with an insulating layer, the insulating layer is a transparent or semi-transparent layer, and the impedance of the insulating layer is greater than or equal to 2000Ω.

[0007] In the electronic device, there are two structural parts with different base chemical activities and electrical connection, and the present application provides a good transparent and high impedance insulating layer on the decorative layer of the metal base with low chemical activity, so as to prevent the formation of a closed loop between the metal bases with different chemical activities in a sweat environment containing chloride ions or a salt spray environment to generate an electric potential difference, thereby reducing the probability of electric corrosion of the first structural part with high metal base activity, and better meeting the long-term use requirements of the electronic device.

[0008] In some embodiments of the present application, the insulating layer comprises first and second inorganic insulating material layers which are alternately stacked, and the first inorganic insulating material layer has a refractive index greater than that of the second inorganic insulating material layer. In this way, the insulating layer with good optical transparency can be obtained, and the wear resistance of the insulating layer formed by alternately stacking the two inorganic insulating material layers with different refractive indexes is excellent.

[0009] In some possible embodiments of the present application, the thickness of the insulating layer is 500 nm-2000 nm. This is advantageous to ensure that the insulating layer can provide a high enough impedance and wear resistance.

[0010] In some possible embodiments of the present application, the first inorganic insulating material layer comprises a silicon nitride layer, an aluminum nitride layer, a niobium oxide layer, a silicon oxynitride layer, an aluminum oxynitride layer, a silicon aluminum nitride layer, a silicon niobium nitride layer, a silicon aluminum oxynitride layer, or a silicon niobium oxynitride layer; and the second inorganic insulating material layer comprises a silicon oxide layer, an aluminum oxide layer, a silicon aluminum oxide layer, or a silicon niobium oxide layer.

[0011] In some embodiments of the present application, the second structure further comprises an intermediate layer disposed between the decorative layer and the insulating layer; and the intermediate layer comprises one or more of a titanium layer, a chromium layer, a tungsten layer, and a niobium layer. With the intermediate layer, the film bonding force between the insulating layer and the decorative layer formed by alternately stacking the two inorganic insulating material layers can be ensured to be strong, and the risk of the insulating layer falling off the decorative layer can be greatly reduced.

[0012] In some possible embodiments of the present application, the thickness of the intermediate layer is 1 nm-50 nm. The intermediate layer with a suitable thickness can ensure that the bonding force between the insulating layer and the decorative layer is strong.

[0013] In some embodiments of the present application, the side of the insulating layer away from the second metal substrate is further provided with a superhard layer. The hardness of the superhard layer is greater than that of the insulating layer, and the superhard layer can improve the scratch resistance of the insulating layer formed by alternately stacking the two inorganic insulating material layers.

[0014] In some other embodiments of the present application, the insulating layer is an organic insulating layer. The impedance of the organic insulating layer is very low, and the organic insulating layer can be easily formed on the decorative layer without damaging the appearance of the decorative layer.

[0015] In some possible embodiments of the present application, the thickness of the organic insulating layer is 1 μm-10 μm. The organic insulating layer with a suitable thickness can ensure that it has a good surface insulating effect on the decorative layer and also has a certain wear resistance.

[0016] In some possible embodiments of the present application, the organic insulating layer comprises a spray epoxy resin layer, an electrophoretic epoxy resin layer, or an acrylic resin cured layer.

[0017] In some embodiments of the present application, the second structural member further comprises an anti-fingerprint layer, which is located on the side of the insulating layer away from the second metal substrate. The anti-fingerprint layer can make the surface of the second structural member easy to clean and have excellent anti-fingerprint performance.

[0018] In embodiments of the present application, the surface water drop angle of the anti-fingerprint layer is above 80°. This reflects that the surface of the anti-fingerprint layer has very low surface energy and excellent anti-fouling performance.

[0019] In embodiments of the present application, the decorative layer comprises a carbide layer containing a metal element, a nitride layer containing a metal element, or a carbonitride layer containing a metal element. By adjusting the material composition of the decorative layer, different appearance colors can be given.

[0020] In some embodiments of the present application, the second structural member further comprises a primer layer, which is located between the second metal substrate and the decorative layer. The primer layer can increase the bonding force between the decorative layer and the second metal substrate.

[0021] In some possible embodiments of the present application, the primer layer comprises one or more of Ti, Cr, W, Nb, Ni, Mo layers or alloy layers thereof.

[0022] In some embodiments of the present application, the first metal substrate comprises an aluminum alloy substrate, and the second metal substrate comprises a stainless steel substrate, a titanium alloy substrate, or a zirconium alloy substrate. The corrosion potential of aluminum alloy is low, the chemical activity is high, and the electric corrosion is easy to occur. By providing the above insulating layer on the second metal substrate with low chemical activity electrically connected to the aluminum alloy, the problem of easy electric corrosion of the aluminum alloy can be solved.

[0023] In some embodiments of the present application, one of the first structural member and the second structural member is a middle frame of the electronic device, and the other is a camera decoration piece or a hinge back cover of the electronic device. The hinge back cover generally only exists in foldable electronic devices. For example, in some embodiments, the electronic device comprises a middle frame and a camera decoration piece; one of the first structural member and the second structural member is the middle frame, and the other is the camera decoration piece. For another example, in another embodiment, the electronic device is a foldable electronic device, the foldable electronic device comprises a hinge and at least two middle frames, the hinge comprises a hinge back cover; one of the first structural member and the second structural member is the middle frame, and the other is the hinge back cover. BRIEF DESCRIPTION OF DRAWINGS

[0024] FIG. 1 is a common structural schematic diagram of an electronic device 1000 provided by the related art.

[0025] Fig. 2 is a structural schematic diagram of an electronic device 1000 according to some embodiments of the present application.

[0026] Fig. 3A is a structural schematic diagram of an electronic device 1000 according to some embodiments of the present application.

[0027] Fig. 3B is a structural schematic diagram of an electronic device 1000 according to some embodiments of the present application.

[0028] Fig. 4A is a structural schematic diagram of an electronic device 1000 according to some embodiments of the present application.

[0029] Fig. 4B is a structural schematic diagram of an electronic device 1000 according to some embodiments of the present application.

[0030] Fig. 4C is a structural schematic diagram of an electronic device 1000 according to some embodiments of the present application.

[0031] Fig. 5A is a structural schematic diagram of a foldable electronic device in a first state according to some embodiments of the present application.

[0032] Fig. 5B is a structural schematic diagram of a foldable electronic device in a second state according to some embodiments of the present application.

[0033] Fig. 6 is a structural schematic diagram of the back side of an electronic device 1000 according to some embodiments of the present application.

[0034] Fig. 7 is a partial cross-sectional structural schematic diagram of the electronic device 1000 of Fig. 6 along A-A.

[0035] Main figure mark explanation: 1000-electronic device, 10-first structural member, 11-first metal base, 12-surface treatment layer; 20-second structural member, 21-second metal base, 22-decorative layer, 23-insulating layer, 231-first inorganic insulating material layer, 232-second inorganic insulating material layer, 24-anti-fingerprint layer, 25-primer layer, 26-intermediate layer, 27-ultra-hard layer. DETAILED DESCRIPTION

[0036] The embodiments of the present application will be described below with reference to the accompanying drawings.

[0037] Currently, electronic devices such as mobile phones are developing towards thin and light. In order to improve the reliability of electronic devices under thin and light, and / or rich appearance effect, electronic devices usually have two structural members of different materials. Referring to FIG. 1, FIG. 1 is a common structural schematic diagram of an electronic device 1000 provided by the related art. The electronic device 1000 can be a mobile phone, a tablet computer, a notebook computer, an e-book reader, a wearable device (such as a watch, a bracelet, etc.), or a virtual reality electronic device. In the embodiments of the present application, the electronic device 1000 is taken as an example of a mobile phone.

[0038] As shown in FIG. 1, the electronic device 1000 includes a first structural member 10 and a second structural member 20, the first structural member 10 includes a first metal base 11, the second structural member 20 includes a second metal base 21 and a decorative layer 22 arranged on one side of the second metal base 21, the first metal base 11 is electrically connected with the second metal base 21, and the corrosion potential of the first metal base 11 is lower than the corrosion potential of the second metal base 21 (that is, the metal activity of the first metal base 11 is higher than that of the second metal base 21). Exemplarily, the first metal base 11 can be an aluminum alloy, and the second metal base 21 can be stainless steel, titanium alloy or zirconium alloy, etc. The decorative layer 22 can be a metal nitride, a metal carbide or a metal carbonitride plated by physical vapor deposition (PVD). The first metal base 11 can also have a surface treatment layer 12, for example, an anodic oxidation layer, or a decorative layer plated by PVD, etc.

[0039] Exemplarily, when the electronic device 1000 is a foldable mobile phone, the first structural member 10 electrically connected between the metal bases can be an anodized aluminum alloy middle frame, and the second structural member 20 can be a stainless steel or titanium alloy rotating shaft back cover with a decorative layer on the surface; or the first structural member 10 can be a titanium alloy middle frame with a decorative layer on the surface, and the second structural member 20 can be an anodized aluminum alloy camera decoration piece, etc.

[0040] As shown in FIG. 1, the metal bases of the two structural members are electrically connected, but their metal activities are different, and there will be a potential difference between them in a sweat environment or a salt spray environment. For example, after a user touches the first structural member 10 and the second structural member 20 with sweat, a closed loop is formed between the first structural member 10 and the second structural member 20, a potential difference is generated between them, and a galvanic cell reaction occurs. Chloride ions (Cl -) will accelerate the attack on the first structural member 10 with high activity, causing the surface treatment layer 12 to crack, and over time, the first metal matrix 11 to undergo electrochemical corrosion, and the first structural member 10 to fail. In addition, although the surface of the second structural member 20 with low activity has a decorative layer 22 formed by PVD, the decorative layer is usually a carbide, nitride or carbonitride containing metal elements, has certain metalloid properties, and has a low film layer resistance, so in a sweat environment or salt spray environment containing chloride ions, the second structural member 20 is basically conductive in the thickness direction, and there is still a potential difference between the second structural member 20 with the decorative layer 22 on the surface and the first structural member 10 with high activity, and the first structural member 10 with high activity will still be attacked by chloride ions and electrochemically corroded or even fail. Therefore, the embodiments of the present application provide a technical solution to the problem of easy electrochemical corrosion of the metal structural member with high activity in an electronic device that can have two metal structural members with different activities.

[0041] Please refer to FIG. 2, which is a structural schematic diagram of an electronic device 1000 provided by the embodiments of the present application. As shown in FIG. 2, the electronic device 1000 includes a first structural member 10 and a second structural member 20, the first structural member 10 includes a first metal matrix 11, the second structural member 20 includes a second metal matrix 21 and a decorative layer 22 disposed on one side of the second metal matrix 21, the first metal matrix 11 is electrically connected to the second metal matrix 21, and the corrosion potential of the first metal matrix 11 is lower than that of the second metal matrix 21. Among them, in the second structural member 20, the side of the decorative layer 22 away from the second metal matrix 21 is further provided with an insulating layer 23, the insulating layer 23 is a transparent or semi-transparent layer, and the impedance of the insulating layer 23 is greater than or equal to 2000Ω.

[0042] In the two different structural members electrically connected, the decorative layer and the transparent and high-impedance insulating layer 23 are stacked on the surface of the metal matrix with low chemical activity (specifically the second metal matrix 21), in a sweat environment or salt spray environment containing chloride ions, the flow of electrons along the thickness direction of the second structural member 20 can be blocked by the insulating layer 23, thereby preventing the formation of a closed loop between the first metal matrix 11 of the first structural member 10 and the second metal matrix 21 of the second structural member 20 to generate a potential difference, and further preventing the electrochemical corrosion phenomenon caused by the attack of chloride ions on the first structural member 10 with high activity of the metal matrix, thereby improving the service life of the first structural member 10 with high activity in the electronic device 1000. In addition, because the insulating layer 23 is transparent, it is disposed on the decorative layer 22 and does not significantly affect the appearance of the second structural member 20.

[0043] It should be noted that one first structural member 10 and one second structural member 20 are shown in the electronic device 1000 in FIG. 2, but it can be understood that the number of the first structural member 10 or the second structural member 20 in the electronic device 1000 can be more than one. For example, for a two-fold foldable electronic device, the number of the middle frame can be two.

[0044] In the embodiments of the present application, the first metal substrate 11 includes an aluminum alloy substrate, and the second metal substrate 21 includes a stainless steel substrate, a titanium alloy substrate, or a zirconium alloy substrate, etc. Among them, the corrosion potential of the aluminum alloy is lower than that of the stainless steel, the titanium alloy, or the zirconium alloy. The corrosion potential here refers to the potential value with a negative sign. For example, the corrosion potential of the aluminum alloy in an acidic environment is generally -2V, the corrosion potential of the stainless steel in an acidic environment is generally greater than -2V, for example, -0.5mV to -0.3mV, and the corrosion potential of the titanium alloy in an acidic environment is -0.1mV to +0.1mV.

[0045] Specifically, the impedance of the above-mentioned insulating layer 23 is ≥3000Ω, ≥5000Ω, ≥10 4 Ω, ≥2×10 4 Ω, ≥5×10 4 Ω, ≥10 5 Ω, ≥5×10 5 Ω, etc. In some embodiments, the impedance of the insulating layer 23 is greater than or equal to 10 6 Ω (i.e., 1 megaohm). In this case, the impedance of the insulating layer 23 is very low, and the insulating barrier effect on the surface of the decorative layer 22 is very good, so that the loop formed by the first metal substrate 11 and the second metal substrate 21 in the sweat or salt spray environment can be effectively cut off, and the corrosion of the first structural member 10 can be prevented.

[0046] FIGS. 3A and 3B are two structural schematic diagrams of the electronic device 1000 provided by some embodiments of the present application. Among them, FIG. 3A is more than the AF layer 24 described below in FIG. 2. FIG. 3B is more than the AF layer 24 and the primer layer 25 described below in FIG. 2.

[0047] In some embodiments of the present application, as shown in FIG. 3A, the second structural member 20 further includes an anti-fingerprint layer (Anti-fingerprint film, abbreviated as AF layer) 24, and the AF layer 24 is located on the side of the insulating layer 23 away from the second metal substrate 21 (also the side of the insulating layer 23 away from the decorative layer 22). Among them, the material of the AF layer 24 includes fluorine-containing compounds and / or silicon-containing compounds. These two types of compounds have hydrophobic and oleophobic properties, making the surface of the second structural member 20 easy to clean and having better anti-fingerprint performance. Exemplarily, the fluorine-containing compound can include polytetrafluoroethylene, chlorofluorobenzene, etc. The surface energy of the fluorine-containing compound is very low, and the anti-fingerprint residual ability of the AF layer 24 containing the fluorine-containing compound is stronger.

[0048] In some embodiments, the AF layer 24 has a surface water contact angle of 80° or more. A higher surface water contact angle of the AF layer 24 can reflect that the surface of the AF layer has excellent anti-fouling properties. The water contact angle is specifically a water contact angle of a surface of the AF layer 24 facing away from the second metal substrate 21. In some embodiments, the surface water contact angle of the AF layer 24 can be 90° or more, further 100° or more, or 110° or more.

[0049] In some embodiments, the second structure 20 further includes a primer layer 25 between the second metal substrate 21 and the decorative layer 22, as shown in FIG. 3B. The primer layer 25 is configured to increase the adhesion between the decorative layer 22 and the second metal substrate 21.

[0050] The primer layer 25 is commonly made of a metal material. For example, the primer layer 25 can include one or more of titanium (Ti), chromium (Cr), tungsten (W), niobium (Nb), nickel (Ni), molybdenum (Mo), or alloys thereof. The primer layer 25 can be a single layer of a metal element, a stack of two or more layers of metal elements, a layer of a metal alloy, a stack of a layer of a metal element and a layer of a metal alloy, or the like. In some embodiments, the primer layer 25 includes a layer of Ti, a layer of Cr, a layer of W, a layer of Nb, a layer of Ni, a layer of Mo, or a layer of an alloy thereof (e.g., a layer of TiAl alloy). Optionally, the primer layer 25 can have a thickness of 5 nm to 200 nm, such as 10 nm, 20 nm, 30 nm, 50 nm, 80 nm, 100 nm, 120 nm, or 150 nm, or the like.

[0051] In some embodiments, the decorative layer 22 includes a metal element-containing carbide, a metal element-containing nitride, or a metal element-containing carbonitride. These carbides, nitrides, or carbonitrides can impart a certain color to the decorative layer 22, so that the second structure 20 has a certain appearance effect. In some embodiments, the decorative layer 22 includes a layer of a metal element-containing carbide, a layer of a metal element-containing nitride, or a layer of a metal element-containing carbonitride. These decorative layers 22 have a relatively low impedance (typically 10 Ω or less), so that the insulating layer 23 provided thereon can block the potential difference between the second metal substrate 21 with the decorative layer 22 and the first metal substrate under certain conditions.

[0052] The metal element contained in the decorative layer 22 can include one or more of Ti, Cr, W, Al, and Nb, but is not limited thereto. For example, the decorative layer 22 can include a TiAlC layer, a CrWC layer, or a TiCrCN layer, etc. In addition, in some cases, the decorative layer 22 can also include a Si element. In the embodiments of the present application, the thickness of the decorative layer 22 can be 300 nm-5 μm, for example, specifically 400 nm, 500 nm, 1 μm, 2 μm, 3 μm, 4 μm, etc.

[0053] In the present application, the above-mentioned decorative layer 22 and the primer layer 25 can be formed by a PVD process. Specifically, the PVD process can include, but is not limited to, magnetron sputtering, vacuum evaporation, or ion plating (such as arc ion plating, radio frequency ion plating), etc.

[0054] In the present application, the above-mentioned insulating layer 23 shown in FIGS. 2, 3A, and 3B can be an organic insulating layer or an inorganic insulating layer. The following will be introduced in different cases.

[0055] In some embodiments of the present application, the above-mentioned insulating layer 23 shown in FIGS. 2, 3A, and 3B can be an organic insulating layer. The organic insulating layer has a very low impedance and is relatively easy to form on the above-mentioned decorative layer without damaging the structure of the decorative layer 22. The organic insulating layer is usually a transparent layer so as not to affect the appearance effect of the decorative layer 22. In some possible embodiments, the organic insulating layer can include an epoxy resin layer, an acrylic resin layer, or a polyamide layer, etc. The formation method of the organic insulating layer can include, but is not limited to, brushing, spraying, or electrophoresis, etc.

[0056] In some embodiments, the insulating layer 23 is an epoxy resin layer, for example, specifically a sprayed epoxy resin layer or an electrophoretic epoxy resin layer. The epoxy resin layer has good insulation, good wear resistance, and strong bonding force between the epoxy resin layer and the decorative layer 22, and good water resistance and chemical corrosion resistance. When the raw material containing the epoxy resin and the optional curing agent is sprayed on the decorative layer 22, a heating treatment can be performed after the spraying to cure the raw material to form an organic insulating layer with high bonding force to the decorative layer 22. In another embodiment, the insulating layer 23 is an acrylic resin layer. It can be obtained by curing a liquid coating material containing an acrylic resin and a photoinitiator by ultraviolet irradiation.

[0057] In some possible embodiments, the thickness of the above-mentioned organic insulating layer can be 1 μm-10 μm. For example, the thickness of the organic insulating layer can be specifically 2 μm, 3 μm, 4 μm, 5 μm, 6 μm, 7 μm, 8 μm, or 9 μm, etc. The organic insulating layer with a suitable thickness can ensure that it has a good surface insulation effect on the decorative layer 22 and does not reduce the wear resistance of the decorative layer 22.

[0058] In some other embodiments of the present application, the insulating layer 23 shown in FIG. 2, FIG. 3A, and FIG. 3B comprises an alternating layer stack of two inorganic insulating material layers along the thickness direction of the insulating layer 23. FIG. 4A, FIG. 4B, and FIG. 4C show several specific structural schematic diagrams of the electronic device 1000 in this case.

[0059] As shown in FIG. 4A, FIG. 4B, and FIG. 4C, the insulating layer 23 specifically comprises at least one first inorganic insulating material layer 231 and at least one second inorganic insulating material layer 232, which are arranged in an alternating layer stack along the thickness direction of the insulating layer 23 (for example, the direction shown by the arrow in FIG. 4A, FIG. 4B, and FIG. 4C). The refractive index of the first inorganic insulating material layer 231 is different from that of the second inorganic insulating material layer 232, for example, the refractive index of the first inorganic insulating material layer 231 is greater than that of the second inorganic insulating material layer 232. By arranging the two inorganic insulating material layers with different refractive indexes in an alternating layer stack, the insulating layer 23 with good optical transparency can be obtained, and the optical reflectivity of the insulating layer 23 can be adjusted to be in a lower range. In addition, the wear resistance of the insulating layer 23 formed by arranging the two inorganic insulating material layers in an alternating layer stack is relatively excellent. In some common embodiments, the number of film layers of the insulating layer 23 is greater than or equal to 3. That is, the number of layers of the first inorganic insulating material layer 231 and / or the second inorganic insulating material layer 232 is greater than or equal to 2.

[0060] In the embodiments of the present application, the above-mentioned insulating layer 23 formed by arranging the two inorganic insulating material layers in an alternating layer stack can meet the following wear resistance requirement: after 1000 reciprocating friction tests under the load of 1000 g of steel wool, the appearance of the insulating layer 23 is not scratched, and the insulating resistance of the insulating layer 23 is still ≥2000 Ω.

[0061] If the first inorganic insulating material layer 231 is denoted as layer A, and the second inorganic insulating material layer 232 is denoted as layer B, then in the insulating layer 23, the total number of layers A can be equal to or different from the total number of layers B. It should be noted that in FIG. 4A, FIG. 4B, and FIG. 4C, the actual positions and actual structures of the first inorganic insulating material layer 231 and the second inorganic insulating material layer 232 are not limited by these drawings. For example, from the decorative layer 22 to the insulating layer 23, the film layer arrangement form of the insulating layer 23 can be (A-B) n (as shown in FIG. 4A), or (A-B) n -A, or (B-A) n , or (B-A) n -B; wherein n is an integer greater than or equal to 1. The thickness of each A layer can be the same or different. The thickness of each B layer can be the same or different.

[0062] In the embodiments of the present application, the thickness of the alternating layer structure (i.e., the insulating layer 23) is 500 nm-2000 nm. For example, the thickness of the insulating layer 23 can be specifically 600 nm, 800 nm, 900 nm, 1000 nm, 1200 nm, 1500 nm, 1800 nm, or 2000 nm, etc. In this case, the insulating layer has an appropriate thickness, which is conducive to ensuring that the insulating layer can provide a high enough impedance and good wear resistance, and will not be easily separated from the decorative layer 22 due to excessive thickness, etc.

[0063] In the embodiments of the present application, the first inorganic insulating material layer 231 can include one of a silicon nitride layer, an aluminum nitride layer, a niobium oxide layer, a silicon oxynitride layer, an aluminum oxynitride layer, a silicon aluminum nitride layer, a silicon niobium nitride layer, a silicon aluminum oxynitride layer, and a silicon niobium oxynitride layer. The second inorganic insulating material layer 232 includes one of a silicon oxide layer, an aluminum oxide layer, a silicon aluminum oxide layer, and a silicon niobium oxide layer.

[0064] For example, when forming the silicon oxynitride layer by the magnetron sputtering process, the target material used can be a Si target, and inert gas (such as argon), nitrogen (N2), and oxygen (O2) are introduced to deposit the silicon oxynitride layer. When forming the silicon aluminum nitride layer by the magnetron sputtering process, the target material used includes a Si target and an Al target, and argon and N2 are introduced to deposit the target coating. When forming the silicon aluminum oxynitride layer by the magnetron sputtering process, the target material used includes a Si target and an Al target, and argon, N2, and O2 are introduced to deposit the target coating.

[0065] In some embodiments of the present application, the first inorganic insulating material layer 231 includes one of a silicon aluminum nitride layer, a silicon niobium nitride layer, a silicon aluminum oxynitride layer, and a silicon niobium oxynitride layer. The second inorganic insulating material layer 232 includes a silicon aluminum oxide layer or a silicon niobium oxide layer. In this case, the insulating layer 23 formed by the alternating layering of the first inorganic insulating material layer 231 and the second inorganic insulating material layer 232 not only has good optical transparency, but also has higher hardness and more excellent wear resistance.

[0066] In some embodiments of the present application, as shown in FIGS. 4B and 4C, the second structural member 20 further includes an intermediate layer 26 disposed between the decorative layer 22 and the insulating layer 23. The intermediate layer 26 can include one or more of a Ti layer, a Cr layer, a W layer, and a Nb layer. The present inventors have found through a series of researches that when the intermediate layer 26 disposed between the decorative layer 22 and the insulating layer 23 is selected from these metal layers, the film layer bonding force between the above-mentioned insulating layer 23 formed by the alternating layering of the two inorganic insulating material layers and the decorative layer 22 including a metal nitride, a metal carbide, or a metal carbonitride can be strong, which can greatly reduce the risk of the insulating layer 23 falling off from the decorative layer 22.

[0067] In the embodiments of the present application, the thickness of the intermediate layer 26 can be 1 nm-50 nm. For example, the thickness of the intermediate layer 26 can be 2 nm, 3 nm, 5 nm, 8 nm, 10 nm, 15 nm, 20 nm, 25 nm, 30 nm, 35 nm, 40 nm or 45 nm, etc. The intermediate layer 26 with a suitable thickness can ensure that the bonding force between the insulating layer 23 and the decorative layer 22 is strong, and meanwhile, the color of the decorative layer 22 is not affected by the thickness of the intermediate layer 26.

[0068] In some cases, as shown in FIGS. 4A, 4B and 4C, the second structural member 20 further comprises an AF layer 24 located on the side of the insulating layer 23 away from the second metal substrate 21. The AF layer 24 can improve the anti-fingerprint pollution capability of the exposed surface (i.e., the surface that can be contacted by the user's fingers) of the second structural member 20. In some cases, as shown in FIGS. 4B and 4C, the second structural member 20 further comprises a primer layer 25 located between the second metal substrate 21 and the decorative layer 22. The primer layer 25 is used to increase the bonding force between the decorative layer 22 and the second metal substrate 21. For the primer layer 25 and the AF layer 24, refer to the foregoing description of the present application. In addition, it should be noted that in FIG. 4A, the primer layer 25 can also be arranged between the second metal substrate 21 and the decorative layer 22.

[0069] In some embodiments of the present application, as shown in FIG. 4C, the side of the insulating layer 23 away from the second metal substrate 21 is further provided with a superhard layer 27. In FIG. 4C, the superhard layer 27 is located between the insulating layer 23 and the anti-fingerprint layer 24. The superhard layer 27 can improve the scratch resistance of the above-mentioned insulating layer 23 formed by alternately stacking two layers of inorganic insulating materials. The hardness of the superhard layer 27 is greater than that of the insulating layer 23. In order to avoid affecting the appearance effect presented by the decorative layer 22, the superhard layer 27 is preferably a transparent layer. For example, the superhard layer 27 can be a diamond-like carbon (DLC) layer.

[0070] It should be noted that the features in the embodiments of the present application can be combined with each other without conflict, and any combination of the features in different embodiments is within the protection scope of the present application, that is, the above-described multiple embodiments can also be combined as needed. For example, in FIG. 4A, the primer layer 25 can also be arranged between the second metal substrate 21 and the decorative layer 22. For another example, in FIG. 4A, the intermediate layer 26 can also be arranged between the decorative layer 22 and the insulating layer 23. For another example, in FIG. 4A, the superhard layer 27 can also be arranged between the insulating layer 23 and the anti-fingerprint layer 24. For another example, in FIG. 4B, the primer layer 25 can also be absent.

[0071] As described above, the first metal base 11 can be an aluminum alloy base, and the second metal base 21 can be a stainless steel base, a titanium alloy base, a zirconium alloy base, or the like. The first metal base 11 of the first structural member 10 and the second metal base 21 of the second structural member 20 are electrically connected. The present application does not limit the first structural member 10 and the second structural member 20 electrically connected by the metal base in the electronic device 1000.

[0072] In some embodiments of the present application, the electronic device 1000 includes a middle frame and a camera decoration piece. One of the first structural member 10 and the second structural member 20 is the middle frame of the electronic device, and the other is the camera decoration piece of the electronic device. The electronic device can be a foldable or non-foldable electronic device. In some other embodiments of the present application, the electronic device 1000 is a foldable electronic device, which includes a hinge and at least two middle frames. The hinge includes a hinge back cover. One of the first structural member 10 and the second structural member 20 is the middle frame, and the other is the hinge back cover.

[0073] In the present application, the electrical connection between the first metal base 11 and the second metal base 21 can be understood as physical contact and electrical conduction between the two, or indirect electrical connection between the two through an intermediate medium, such as through a conductive connecting piece (such as a screw, a spring, a conductive cloth, a solder pad, or the like) to achieve connection, or through a printed circuit board (PCB) for indirect conductive connection. The electrical connection between them will be introduced below.

[0074] Please refer to FIGS. 5A and 5B. FIG. 5A is a structural schematic diagram of a foldable electronic device 1000 in a first state according to some embodiments of the present application, and FIG. 5B is a structural schematic diagram of a foldable electronic device 1000 in a second state according to some embodiments of the present application. The electronic device 1000 shown in FIG. 5A is in a folded state, and the electronic device 1000 shown in FIG. 5B is in an unfolded state. The unfolding angle in FIG. 5B is 180°.

[0075] As shown in FIGS. 5A and 5B, the electronic device 1000 includes a first housing 110, a second housing 120, and a hinge 200. The hinge 200 is arranged between the first housing 110 and the second housing 120 and is fixedly connected with them, so that the first housing 110 and the second housing 120 can be relatively rotated through the hinge 200, and the electronic device 1000 can be switched between the folded state and the unfolded state. The first housing 110 and the second housing 120 can be middle frames. The middle frame usually includes a middle plate and a frame (not shown in the figure), and the frame is arranged along the outer periphery of the middle plate.

[0076] As shown in FIG. 5B, the rotating shaft 200 includes a rotating shaft cover 210, a plurality of swing arms 220 and a plurality of mounting pieces 230. Some of the mounting pieces 230 are close to the first shell 110, and the other mounting pieces 230 are close to the second shell 120. Among them, a swing arm 220 is arranged between the rotating shaft cover 210 and a mounting piece 230, one side of the swing arm 220 is rotationally connected with the rotating shaft cover 210, and the other side of the swing arm 220 is rotationally connected with the mounting piece 230. The exemplary mounting piece 230 can be a wedge-shaped block. Under the action of driving force, the rotating shaft 200 rotates, and the relative rotation of the first shell 110 and the second shell 120 can be realized by means of the swing arm 220. Among them, when the electronic device 1000 is in a folded state, the back of the rotating shaft cover 210 can be exposed outside the electronic device 1000 and can be directly observed or touched by the user, while the swing arm 220, the mounting piece 230 and the like cannot be observed or touched by the user, which can be called as the built-in part of the rotating shaft 200.

[0077] Among them, the rotating shaft cover 210, the swing arm 220 and the mounting piece 230 can all be metal materials. In some possible embodiments, as shown in FIG. 5B, the mounting piece 230 and the first shell 110, or the mounting piece 230 and the second shell 120 can be locked by screws, specifically, the mounting piece 230 and the middle plate of the first shell 110 or the middle plate of the second shell 120 can be locked by screws. Thus, the electrical connection between the first shell 110 or the second shell 120 and the rotating shaft cover 210 can be realized. In other possible embodiments, the electrical connection between the mounting piece 230 and the middle plate of the first shell 110 or the middle plate of the second shell 120 can be realized by spot welding, or can be realized by conductive cloth, conductive glue or metal spring sheet, etc. In this way, the electrical connection between the first shell 110 or the second shell 120 and the rotating shaft cover 210 can also be realized.

[0078] In some embodiments, the first shell 110 or the second shell 120 is the above-mentioned first structural piece 10 of the embodiments of the present application, for example, an anodized aluminum alloy middle frame, and the rotating shaft cover 210 is the above-mentioned second structural piece 20 of the embodiments of the present application, and the metal base thereof can be stainless steel, titanium alloy or zirconium alloy, etc. Of course, in other embodiments, the first shell 110 or the second shell 120 can be the above-mentioned second structural piece 20 of the embodiments of the present application, and the metal base thereof can be stainless steel, titanium alloy or zirconium alloy, etc., and the rotating shaft cover 210 can be the above-mentioned first structural piece 10 of the embodiments of the present application, for example, an anodized aluminum alloy rotating shaft cover.

[0079] The electronic device provided by the embodiments of the present application has at least two structural members with different metal substrate activities and electrical connection. By arranging the insulating layer with good transparency and high impedance on the surface of the decorative layer of the structural member with low chemical activity, the insulating layer can prevent the formation of a closed loop between the metal substrates with different activities in a sweat environment containing chloride ions or a salt spray environment, thereby reducing the probability of electrocorrosion of the structural member with high metal substrate activity, and better meeting the long-term use requirements of the electronic device.

[0080] The electrical connection between the middle frame and the camera decoration piece of the following example electronic device is shown. It can be understood that in the foldable electronic device described above, some middle frames are also electrically connected to the camera decoration piece.

[0081] Referring to FIG. 6, FIG. 6 is a schematic diagram of the rear side structure of an electronic device 1000 provided by some other embodiments of the present application. FIG. 7 is a schematic diagram of the partial cross-sectional structure of the electronic device 1000 along A-A in FIG. 6.

[0082] Referring to FIGS. 6 and 7, the electronic device 1000 includes a display screen 300, a middle frame 100, a back cover 400, a camera module 500, and a camera decoration piece 600. The camera module 500 can be a rear camera module or a front camera module. The embodiments of the present application take the rear camera module 500 as an example for introduction.

[0083] The back cover 400 is fixedly connected to the middle frame 100. The middle frame 100 is located between the display screen 300 and the back cover 400. The middle frame 100 mainly plays a supporting role for the whole machine. The middle frame 100 can include a frame 101 and a middle plate 102, and the frame 101 is arranged around the outer periphery of the middle plate 102. The display screen 300, the frame 101, and the back cover 400 jointly enclose the interior of the electronic device 1000. The interior of the electronic device can be used to place electronic components (not shown in the figure) such as a battery, a camera module, and a loudspeaker. Among them, the frame 101 is located at the periphery of the electronic device 1000 and can be directly observed or touched by the user. The frame 101 and the middle plate 102 can be made of a metal material, for example, an aluminum alloy subjected to anodic oxidation, or a titanium alloy with a decorative layer, etc. Among them, the connection mode of the frame 101 and the middle plate 102 includes but is not limited to welding, or clamping, etc.; or the two can be integrally formed.

[0084] The electronic device 1000 further includes a main board 700, for example, a PCB board. The main board 700 is accommodated in the accommodation space formed by the middle frame 100 and the back cover 400. In some embodiments, the main board 700 is disposed on the surface of the middle plate 102 of the middle frame 100 facing the back cover 400. The main board 700 can be fixed on the middle plate 102 by screw locking, and can also be electrically connected to the middle plate 102 by conductive glue, conductive cloth, spring sheet, welding, etc.

[0085] The camera module 500 can be located inside the electronic device 1000, for example, can be disposed on the surface facing the back cover 400. In some embodiments, the camera module 500 can include a module circuit board 51, a bracket 52, a lens 53, and an image sensor 54. The bracket 52 is fixed to the module circuit board 51, and a motor (not shown) can be installed on the bracket 52. The lens 53 is installed on the motor, and the motor can drive the lens 53 to move. The image sensor 54 is fixed to the module circuit board 51 and electrically connected thereto, and can transmit signals to each other. The image sensor 54 and the bracket 52 are located on the same side of the module circuit board 51. The bracket 52 can be a metal bracket. The module circuit board 51 can be electrically connected to the main board 700, for example, can be electrically connected by welding or conductive glue, etc. In some embodiments, the module circuit board 51 can be disposed on the main board 700, or both can be disposed on the middle plate 102.

[0086] The camera decoration piece 600 can be installed on the back cover 400 to decorate the lens 53 of the camera module 500. The back cover 400 and the camera decoration piece 600 can be provided with light transmission holes (as shown by the arrows), so that light outside the electronic device 1000 can enter the inside of the electronic device 1000 through the light transmission holes.

[0087] In some embodiments, the camera decoration piece 600 can be spring-connected to the module circuit board 51 by a first conductive spring sheet 61. One end of the first conductive spring sheet 61 can be fixed to the module circuit board 51 by welding or conductive glue, etc. The first conductive spring sheet 61 can be deformed under stress, and the other end thereof can be in contact with the camera decoration piece 600, so as to spring-connect the camera decoration piece 600 to the module circuit board 51. The material of the first conductive spring sheet 61 can be phosphor bronze, tin bronze, etc.

[0088] Since the module circuit board 51 is electrically connected with the main board 700, the main board 700 can be electrically connected with the middle plate of the middle frame 100, so that the camera decoration piece 600 is indirectly electrically connected with the middle frame 100. In addition, in other embodiments, the camera decoration piece 600 can also be electrically connected with the support 52 of the camera module 500 through another conductive spring piece, and since the support 52 is electrically connected with the main board 700 through the module circuit board 51, the camera decoration piece 600 can also be indirectly electrically connected with the middle frame 100.

[0089] In some possible embodiments, the camera decoration piece 600 is an anodized aluminum alloy camera decoration piece, and the middle frame 100 has a metal base with a corrosion potential higher than that of the aluminum alloy, such as a titanium alloy. In this case, the camera decoration piece 600 is the first structural piece 10 described above, and the middle frame 100 is the second structural piece 20 described above. The decorative layer on the metal base of the middle frame 100 can be provided with the insulating layer described above.

[0090] The application sets the insulating layer with good transparency and high impedance on the decorative layer of the middle frame base with high corrosion potential. By means of the insulating layer, a closed loop can be prevented from being formed between the middle frame base and the base of the camera decoration piece 600 electrically connected therewith in a sweat environment containing chloride ions or a salt spray environment, so as to reduce the probability of electrocorrosion of the camera decoration piece 600 with a high active metal base, and better meet the long-term use requirements of electronic devices.

[0091] In other embodiments, the middle frame 100 can also be an anodized aluminum alloy middle frame, and the camera decoration piece 600 has a metal base with a corrosion potential higher than that of the aluminum alloy, such as a titanium alloy, stainless steel, etc. In this case, the middle frame 100 is the first structural piece 10 described above, and the camera decoration piece 600 is the second structural piece 20 described above. The decorative layer on the metal base of the camera decoration piece 600 can be provided with the insulating layer described above.

[0092] The application will be further described in the following embodiments.

[0093] Embodiment 1

[0094] A foldable mobile phone comprises a hinge back cover and a middle frame, the middle frame is an anodized aluminum alloy, the hinge back cover comprises a SUS316L stainless steel base body, and a primer layer (specifically a TiAl layer), a gold decorative layer (specifically a TiAlC layer), an insulating layer and an anti-fingerprint layer are sequentially stacked on the base body, and the base body of the hinge back cover is electrically connected with the middle frame. The insulating layer is formed by alternately depositing silicon aluminum oxide layers and silicon aluminum nitride layers on the gold decorative layer, that is, the insulating layer comprises alternately stacked silicon aluminum oxide layers and silicon aluminum nitride layers, and the total number of the two layers is 20, and each of the two layers has 10 layers. The insulating layer is a transparent layer, and the thickness is 1300 nm. The impedance of the insulating layer is greater than or equal to 1 megaohm.

[0095] Under visual observation, the appearance effect of the hinge back cover is still gold after the insulating layer is arranged on the gold decorative layer. It is proved that the insulating layer does not affect the appearance effect.

[0096] The foldable mobile phone sample of Example 1 is subjected to electrocorrosion test, specifically including: using a dust-free cloth to absorb acidic or alkaline sweat to fully wrap the appearance surface of the foldable mobile phone, and placing it in a high temperature and high humidity oven with a temperature of 55 DEG C and a relative humidity of 95% for 48 hours, and then checking whether the structure of the whole machine is corroded. The results show that the aluminum alloy middle frame electrically connected with the hinge back cover base body of Example 1 does not have electrocorrosion phenomenon.

[0097] The hinge back cover used in Example 1 is subjected to coating reliability test, specifically including water boiling hundred grid test, high temperature and high humidity test, alternating wet heat test, acid / alkali sweat test, salt spray test, vibration and friction test, steel wool test, etc. The results show that all the above coating reliability tests can be passed, which shows that the insulating layer in the hinge back cover used in Example 1 is not easy to separate from the decorative layer, and has high reliability. Among them, the steel wool test is carried out under a load of 1000g, and after 1000 times of reciprocating friction, the appearance of the insulating layer is not abraded, and the impedance is still greater than or equal to 2000Ω.

[0098] Example 2

[0099] A foldable mobile phone, which is different from Example 1, is that an intermediate layer is further arranged between the gold decorative layer and the insulating layer in the hinge back cover, and the intermediate layer is specifically a Ti layer with a thickness of 20 nm.

[0100] According to the method described in Example 1, the foldable mobile phone sample of Example 2 is subjected to electrocorrosion test, and the results show that the foldable mobile phone sample of Example 2 can pass the electrocorrosion test, and the aluminum alloy middle frame electrically connected with the hinge back cover base body does not have electrocorrosion phenomenon.

[0101] In addition, the hinge back cover used in Example 2 can also pass the coating reliability tests such as the water boiling hundred grid test, high temperature and high humidity test, alternating damp heat test, acid / alkali sweat test, salt spray test, vibration and friction test, steel wool test, etc. Moreover, after the water boiling hundred grid test, the surface film layer of the hinge back cover of Example 2 can reach the 4B level of the hundred grid test, which is higher than that of Example 1 (the level of the water boiling hundred grid test of Example 1 is 3B level). This shows that the adhesion between the insulating layer and the gold decorative layer of Example 2 is higher than that of Example 1, and the insulating layer is less likely to fall off from the gold decorative layer.

[0102] Example 3

[0103] A foldable mobile phone includes a hinge back cover and a middle frame. The middle frame is an anodized aluminum alloy, and the hinge back cover includes a SUS316L stainless steel base body, and a primer layer (specifically, a W layer), a black decorative layer (specifically, a CrWC layer), an insulating layer, and an anti-fingerprint layer which are sequentially stacked on the base body. The base body of the hinge back cover is electrically connected with the middle frame. The insulating layer is a transparent electrophoretic epoxy resin layer with a thickness of 5 μm. The surface resistance of the insulating layer is ≥2000 Ω.

[0104] According to the method described in Example 1, the foldable mobile phone sample of Example 3 is subjected to the electrocorrosion test, and it is found that the aluminum alloy middle frame electrically connected with the base body of the hinge back cover of Example 3 does not have the electrocorrosion phenomenon. Moreover, the adhesion between the insulating layer and the black decorative layer in the hinge back cover of Example 3 is relatively high, and the hinge back cover can pass various coating reliability tests.

[0105] Example 4

[0106] A mobile phone includes a middle frame and a camera decoration piece. The camera decoration piece is an anodized aluminum alloy, and the middle frame includes a titanium alloy middle frame base body, and a primer layer (specifically, a Cr layer), a gold decorative layer (specifically, a TiCrCN layer), an insulating layer, and an anti-fingerprint layer which are sequentially stacked on the base body. The base body of the hinge back cover is electrically connected with the middle frame. The insulating layer is formed by alternately depositing silicon niobium oxide layers and silicon niobium nitride layers on the gold decorative layer, i.e., the insulating layer includes alternately stacked silicon niobium oxide layers and silicon niobium nitride layers, and the total number of the two layers is 16. The insulating layer is a transparent layer with a thickness of 1100 nm. The impedance of the insulating layer is ≥1 megaohm.

[0107] The gold decorative layer on the titanium alloy middle frame base body of the middle frame of Example 4 is provided with the insulating layer, and the appearance effect of the middle frame is not affected. In addition, according to the method described in Example 1, the mobile phone sample of Example 4 is subjected to the electrocorrosion test, and it is found that the camera decoration piece in the mobile phone of Example 4 does not have the electrocorrosion phenomenon.

[0108] Comparative Example 1

[0109] The foldable mobile phone of Comparative Example 1 differs from that of Example 1 in that there is no insulating layer between the gold decorative layer and the anti-fingerprint layer.

[0110] According to the method described in Example 1, the foldable mobile phone sample of Comparative Example 1 was subjected to electrocorrosion test under acidic sweat environment and alkaline sweat environment respectively, and it was found that the aluminum alloy middle frame electrically connected to the back cover substrate of the foldable mobile phone of Comparative Example 1 had very serious electrocorrosion phenomenon after 24 hours of electrocorrosion test under high temperature and high humidity. This shows that the application can well solve the electrocorrosion problem of another metal part electrically connected to the metal substrate by setting an insulating layer with high impedance on the decorative layer of the metal substrate with high corrosion potential.

[0111] The above only expresses the exemplary embodiments of the application, which are described in more detail and in more detail, but cannot be understood as limiting the scope of the patent of the application. It should be noted that for ordinary skilled in the art, without departing from the concept of the application, several modifications and improvements can be made, which are within the scope of protection of the application. Therefore, the protection scope of the patent of the application should be subject to the appended claims.

[0112] In the description of the embodiments of the application, it should be noted that unless otherwise explicitly specified and limited, the terms "mounting", "connecting" should be understood in a broad sense, for example, "connecting" can be detachable connection, or can be non-detachable connection; can be direct connection, or indirect connection through intermediate medium. Among them, "fixed connection" means that the relative position relationship after connection is unchanged. "Rotary connection" means that the relative rotation after connection is connected. The orientation language mentioned in the embodiments of the application, such as "upper", "lower", "inner", "outer", "top", "bottom", "side" and the like, is only the direction of the drawing, therefore, the orientation language used is for better, clearer explanation and understanding of the embodiments of the application, and is not indicative or implied that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, therefore, it cannot be understood as a limitation of the embodiments of the application.

[0113] In addition, in the embodiments of the application, the relative position relationship mentioned, such as parallel, vertical, aligned and the like. These limits are for the current process level, not an absolute strict limit, allowing a small amount of deviation, approximately parallel, approximately vertical, approximately aligned and the like. For example, A is parallel to B, which means that A and B are parallel or approximately parallel, the included angle between A and B can be between 0 degrees and 10 degrees. For example, A is perpendicular to B, which means that A and B are perpendicular or approximately perpendicular, the included angle between A and B can be between 80 degrees and 100 degrees.

[0114] In the present application, "and / or" describes the association relationship of the associated objects, which means that there can be three kinds of relationships, for example, A and / or B can represent the following three cases: A exists alone, A and B exist together, and B exists alone, where A and B can be singular or plural. The character " / " generally represents an "or" relationship between the associated objects before and after it.

[0115] In the description of the present application, unless otherwise specified, "a plurality of" means greater than or equal to two. "At least one" means one or more. "At least one of the following" or the like means any combination of these items, including any combination of single item or multiple items. For example, "at least one of a, b, or c", or "at least one of a, b, and c", can represent a, b, c, a-b (i.e. a and b), a-c, b-c, or a-b-c, where a, b, and c can be single or multiple. The terms "first", "second", "third", "fourth" are only for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features. Therefore, the features defined with "first", "second", "third", "fourth" can explicitly or implicitly include one or more of the features.

[0116] In addition, the numerical range represented by "-" in the present application means a range including the minimum value and the maximum value represented by the numerical values before and after the "-" respectively. In the present application, the expressions related to the range of parameters, such as "greater than or equal to (≥)", "less than or equal to (≤)", "above", "below" all include the present number. The values and value ranges involved in the embodiments of the present application are approximate values, which may have a certain range of error due to the influence of manufacturing processes / testing methods, etc. This part of the error can be considered negligible by those skilled in the art.

Claims

1. An electronic device (1000), characterized by, The electronic device (1000) comprises: A first structural member (10) comprising a first metal base (11); A second structural member (20) comprising a second metal base (21) and a decorative layer (22) and an insulating layer (23) arranged on one side of the second metal base (21), the decorative layer (22) being located between the second metal base (21) and the insulating layer (23); wherein the second metal base (21) is electrically connected with the first metal base (11), and the corrosion potential of the first metal base (11) is lower than that of the second metal base (21); the insulating layer (23) is a transparent or semi-transparent layer, and the impedance of the insulating layer (23) is greater than or equal to 2000Ω.

2. The electronic device of claim 1, wherein, The insulating layer (23) comprises first and second inorganic insulating material layers (231 and 232) arranged alternately, and the refractive index of the first inorganic insulating material layer (231) is greater than that of the second inorganic insulating material layer (232).

3. The electronic device of claim 2, wherein, The thickness of the insulating layer (23) is 500-2000nm.

4. The electronic device of claim 2, wherein, The first inorganic insulating material layer (231) comprises a silicon nitride layer, an aluminum nitride layer, a niobium oxide layer, a silicon oxynitride layer, an aluminum oxynitride layer, a silicon aluminum nitride layer, a silicon niobium nitride layer, a silicon aluminum oxynitride layer, or a silicon niobium oxynitride layer. The second inorganic insulating material layer (232) comprises a silicon oxide layer, an aluminum oxide layer, a silicon aluminum oxide layer, or a silicon niobium oxide layer.

5. The electronic device of claim 2, wherein, The second structural member (20) further comprises an intermediate layer (26) arranged between the decorative layer (22) and the insulating layer (23); wherein the intermediate layer (26) comprises one or more of a titanium layer, a chromium layer, a tungsten layer, and a niobium layer.

6. The electronic device of claim 5, wherein, The thickness of the intermediate layer (26) is 1-50nm.

7. The electronic device of claim 2, wherein, The side of the insulating layer (23) away from the second metal base is further provided with a superhard layer (27).

8. The electronic device of claim 1, wherein, The insulating layer (23) is an organic insulating layer.

9. The electronic device of claim 8, wherein, The thickness of the organic insulating layer is 1-10μm.

10. The electronic device of claim 8, wherein, The organic insulating layer comprises a spray-coated epoxy resin layer, an electrophoretic epoxy resin layer, or an acrylic resin cured layer.

11. The electronic device of any of claims 1-10, wherein, The second structural member (20) further comprises an anti-fingerprint layer (24) located on the side of the insulating layer (23) away from the second metal base (21).

12. The electronic device of claim 11, wherein, The surface water drop angle of the anti-fingerprint layer (24) is above 80°.

13. The electronic device of any one of claims 1-10, wherein, The decorative layer (22) comprises a metal element-containing carbide layer, a metal element-containing nitride layer, or a metal element-containing carbonitride layer.

14. The electronic device of any one of claims 1-10, wherein, The second structural member (20) further comprises a primer layer (25) located between the second metal base (21) and the decorative layer (22).

15. The electronic device of claim 14, wherein, The primer layer (25) comprises one or more of Ti, Cr, W, Nb, Ni, Mo layers or alloy layers thereof.

16. The electronic device of any one of claims 1-10, wherein, The first metal base (11) comprises an aluminum alloy base, and the second metal base (21) comprises a stainless steel base, a titanium alloy base, or a zirconium alloy base.

17. The electronic device of any one of claims 1-10, wherein, One of the first structural member (10) and the second structural member (20) is a middle frame of the electronic device, and the other is a camera decoration piece or a rotating shaft back cover of the electronic device.

Images