Cleaning roller manufacturing device and method, and cleaning roller

Abstract

The present application relates to the technical field of wafer cleaning equipment, and specifically relates to a cleaning roller manufacturing device and method, and a cleaning roller. The cleaning roller manufacturing method comprises the following steps: applying a cured sponge onto a central rod; coaxially sleeving and mounting an inner mold on the central rod, wherein the inner mold is provided with a plurality of sponge growth through-holes; sleeving and mounting an outer mold outside the inner mold; injecting foaming liquid between the central rod and the inner mold to make the cured sponge foam and grow into a foamed sponge until the foamed sponge passes through the sponge growth through-holes; and inserting a cutting tool between the inner mold and the outer mold to completely cut off the foamed sponge between the sponge growth through-holes and the outer mold, and then removing the cutting tool, the outer mold and the inner mold to obtain a molded sponge cleaning roller. The cleaning sponge with a dense layer removed has a good water absorption performance, does not block the flow of water molecules from the inside of the sponge, and can effectively eliminate contaminants adhering to the surface of the sponge.

Description

A cleaning roller manufacturing device, method and cleaning roller

[0001] Cross-reference to related applications

[0002] The present application claims priority to the Chinese patent application No. 202411151960.8, filed on August 21, 2024, and entitled "A cleaning roller manufacturing device, method and cleaning roller", the content of which is incorporated herein by reference in its entirety. TECHNICAL FIELD

[0003] The present application relates to the technical field of wafer cleaning equipment, in particular to a cleaning roller manufacturing device, method and cleaning roller. BACKGROUND

[0004] After polishing, the wafer needs to be cleaned of impurities on the surface to avoid contamination of the semiconductor device by dirt particles, etc. The wafer is generally cleaned by using a roller brush, which includes a hollow shaft and a sponge outside the hollow shaft. The roller brush is installed on a rotatable roller brush fixing structure. During rotation of the roller brush, cleaning liquid enters the sponge through the hollow shaft and seeps out from the surface of the sponge, thereby completing the cleaning of the wafer.

[0005] The sponge roller used for wafer cleaning is mainly made by a method of a center rod sleeve sponge. The center rod can be solid or hollow according to the use requirement. Currently, the sponge roller is mainly used in semiconductor manufacturing, especially in cleaning after chemical mechanical polishing (CMP). The hollow part of the sponge roller provides water to the sponge, so that the sponge remains wet.

[0006] In the prior art, the sponge roller for wafer cleaning is mainly made by a method of foaming the sponge with a mold. The polyvinyl alcohol (PVA) sponge made by this method usually has a dense layer of tens to hundreds of microns on its surface. This dense layer blocks the flow of water molecules from the inside of the sponge to the outside, thereby causing dirt to adhere to the surface of the sponge and forming defects on the surface of the wafer during cleaning. SUMMARY

[0007] Therefore, the technical problem to be solved by the present application is to overcome the defects of poor water molecule outflow performance on the surface of the sponge roller for wafer cleaning and easy adhesion of dirt, thereby providing a cleaning roller manufacturing device, method and cleaning roller.

[0008] To solve the above technical problems, the present application provides a cleaning roller manufacturing device, comprising:

[0009] The inner mold is a hollow structure, and sponge growth through holes are arranged on the inner mold. A center rod for mounting a cleaning roller is arranged in the inner cavity of the inner mold.

[0010] The outer mold is coaxially sleeved on the inner mold.

[0011] The cutting tool is arranged between the inner mold and the outer mold, and the cutting tool is adapted to move towards or away from the inner mold to cut the foamed sponge between the sponge growth through hole and the outer mold.

[0012] Optionally, the cutting tool is a ring-shaped blade, and the ring-shaped blade is adapted to be coaxially inserted between the inner mold and the outer mold.

[0013] Optionally, the inner diameter of the outer mold is greater than the outer diameter of the inner mold, so that a cutting gap is reserved between the inner mold and the outer mold, and the cutting tool is adapted to move along the axial direction of the inner mold in the cutting gap.

[0014] Optionally, sponge growth grooves are arranged on the outer mold, and the sponge growth grooves are arranged one-to-one corresponding to the sponge growth through holes.

[0015] The application also provides a cleaning roller manufacturing method, which applies the cleaning roller manufacturing device described in the application and includes the following steps:

[0016] The solidified sponge is coated on the center rod, the inner mold is coaxially sleeved on the center rod, a plurality of sponge growth through holes are arranged on the inner mold, and the outer mold is sleeved on the inner mold.

[0017] The foaming liquid is injected between the center rod and the inner mold to make the solidified sponge grow into foamed sponge, and the foamed sponge penetrates through the sponge growth through hole.

[0018] The cutting tool is inserted between the inner mold and the outer mold to completely cut the foamed sponge between the sponge growth through hole and the outer mold. The cutting tool, the outer mold and the inner mold are removed to obtain the formed sponge cleaning roller.

[0019] Optionally, sponge growth grooves are arranged on the outer mold, and the foamed sponge continues to grow to extend into the sponge growth grooves after penetrating through the sponge growth through hole.

[0020] Optionally, the sponge growth grooves are arranged one-to-one corresponding to the sponge growth through holes when the outer mold is installed.

[0021] Optionally, the cutting tool is a ring-shaped blade, and the ring-shaped blade is coaxially inserted between the inner mold and the outer mold.

[0022] Optionally, the inner diameter of the outer mold is greater than the outer diameter of the inner mold, so that a cutting gap is reserved between the inner mold and the outer mold when the outer mold is sleeved on the inner mold.

[0023] The step of inserting the cutting tool between the inner mold and the outer mold is: the annular cutting tool is inserted into the cutting gap.

[0024] Optionally, the step of removing the cutting tool, the outer mold and the inner mold comprises: first removing the cutting tool and the outer mold, trimming the edge of the foamed sponge, and then removing the inner mold.

[0025] Optionally, the center rod is a hollow rod, and the through hole is arranged on the side wall of the hollow rod.

[0026] Optionally, one end of the hollow rod is open, and the other end is closed.

[0027] Optionally, the foamed sponge completely fills the sponge growth through hole.

[0028] The application also provides a cleaning roller prepared by the cleaning roller manufacturing method.

[0029] The technical scheme of the application has the following advantages:

[0030] 1. The cleaning roller manufacturing method provided by the application comprises the following steps: applying solidified sponge on a center rod, coaxially sleeving an inner mold on the center rod, the inner mold being provided with a plurality of sponge growth through holes, and sleeving an outer mold on the inner mold; injecting foaming liquid between the center rod and the inner mold to make the solidified sponge grow into foamed sponge, until the foamed sponge penetrates the sponge growth through holes; inserting a cutting tool between the inner mold and the outer mold, completely cutting off the foamed sponge between the sponge growth through holes and the outer mold, removing the cutting tool, the outer mold and the inner mold, and obtaining a formed sponge cleaning roller.

[0031] By using the cutting tool to enter the annular cutting space formed between the outer mold and the inner mold, the foamed sponge is divided into two parts, one part is located in the sponge growth through hole of the inner mold, and the other part is cut off and located between the inner mold and the outer mold. After the outer mold is demolded from the inner mold, a cleaning sponge with a removed dense layer is obtained, the cleaning sponge with the removed dense layer has good water absorption effect, does not block the flow of water molecules from the inside of the sponge to the outside, and can effectively remove dirt attached to the surface of the sponge.

[0032] 2. The cleaning roller manufacturing method provided by the application is provided with a sponge growth groove on the outer mold, and after the foamed sponge penetrates the sponge growth through hole, the foamed sponge continues to grow to extend into the sponge growth groove. When cutting, the foamed sponge is divided into two parts from the sponge growth groove and the sponge growth through hole, so that the surface of the foamed sponge can be completely cut off.

[0033] 3. The cleaning roller manufacturing method provided by the application, the cutting tool is a ring-shaped blade, the ring-shaped blade is coaxially inserted between the inner mold and the outer mold. The ring-shaped blade is inserted between the inner mold and the outer mold, so that the cutting of the foamed sponge can be completed at one time, and the processing efficiency is high. BRIEF DESCRIPTION OF DRAWINGS

[0034] In order to more clearly illustrate the technical solutions in the specific embodiments or prior art of the application, the drawings needed to be used in the specific embodiments or prior art description will be briefly introduced as follows. Obviously, the drawings described below are some embodiments of the application, and all other embodiments obtained by those skilled in the art without creative labor based on these drawings also belong to the protection scope of the application.

[0035] Fig. 1 is a structure schematic diagram of the foamed sponge, the hollow rod and the double-layer mold cooperation provided by the embodiment of the application.

[0036] Fig. 2 is a side view of the foamed sponge, the hollow rod and the double-layer mold cooperation structure provided by the embodiment of the application.

[0037] Fig. 3 is a cutting position schematic diagram of the foamed sponge provided by the embodiment of the application, wherein the dotted line is the cutting position.

[0038] Fig. 4 is a structure schematic diagram of the cleaning roller manufacturing device provided by the embodiment of the application.

[0039] Fig. 5 is a structure schematic diagram of the outer mold provided by the embodiment of the application.

[0040] Fig. 6 is a structure schematic diagram of the inner mold provided by the embodiment of the application.

[0041] Fig. 7 is a structure schematic diagram of the cleaning roller provided by the embodiment of the application.

[0042] Fig. 8 is a structure schematic diagram of the hollow rod provided by the embodiment of the application.

[0043] Explanation of reference signs: 1, hollow rod; 2, through hole; 3, inner mold; 4, outer mold; 5, sponge growth through hole; 6, sponge growth groove; 7, foamed sponge; 8, cutting tool. DETAILED DESCRIPTION

[0044] The technical solutions of the application will be described in detail below with reference to the drawings. Obviously, the described embodiments are some embodiments of the application, not all embodiments. Based on the embodiments in the application, all other embodiments obtained by those skilled in the art without creative labor also belong to the protection scope of the application.

[0045] In the description of the present application, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer" and the like indicate the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application. In addition, the terms "first", "second", "third" are only for descriptive purposes and cannot be understood as indicating or implying relative importance.

[0046] In the description of the present application, it should be noted that unless otherwise explicitly specified and limited, the terms "mounting", "connecting", "connecting" should be understood in a broad sense, for example, it can be fixedly connected, or it can be detachably connected, or integrally connected; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium; it can be the communication inside two elements. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0047] In addition, the technical features involved in the different embodiments of the present application described below can be combined with each other as long as there is no conflict between them.

[0048] Embodiment 1

[0049] The present embodiment provides a cleaning roller manufacturing device, comprising an inner mold 3, an outer mold 4 and a cutting tool 8.

[0050] The inner mold 3 is a hollow structure, and the inner mold 3 is provided with a sponge growth through hole 5, and the inner cavity of the inner mold 3 is suitable for mounting a central rod of the cleaning roller. The outer mold 4 is coaxially sleeved and mounted on the inner mold 3. The cutting tool 8 is arranged between the inner mold 3 and the outer mold 4, and the cutting tool 8 is suitable for moving towards or away from the inner mold 3 to cut the foamed sponge 7 between the sponge growth through hole 5 and the outer mold 4. The cutting tool 8 is an annular blade, which is suitable for coaxially inserted between the inner mold 3 and the outer mold 4. The inner diameter of the outer mold 4 is greater than the outer diameter of the inner mold 3, so that a cutting gap is reserved between the inner mold 3 and the outer mold 4, and the cutting tool 8 is suitable for moving along the axial direction of the inner mold 3 in the cutting gap. The outer mold 4 is provided with a sponge growth groove 6, and the sponge growth groove 6 is arranged one by one with the sponge growth through hole 5.

[0051] The present embodiment also provides a cleaning roller manufacturing method, which applies the cleaning roller manufacturing device provided by the present embodiment, comprising the following steps:

[0052] As shown in FIG. 1 and FIG. 2, the solidified sponge is coated on the center rod, the inner mold 3 is coaxially sleeved on the center rod, the inner mold 3 is provided with a plurality of sponge growth through holes 5, and the outer mold 4 is sleeved on the outer side of the inner mold 3. The foaming liquid is injected between the center rod and the inner mold 3 to make the solidified sponge foam and grow into foamed sponge 7, and the foamed sponge 7 penetrates through the sponge growth through holes 5. As shown in FIG. 3 and FIG. 4, the cutting tool 8 is inserted between the inner mold 3 and the outer mold 4, the foamed sponge 7 between the sponge growth through holes 5 and the outer mold 4 is completely cut off, and the cutting tool 8, the outer mold 4 and the inner mold 3 are taken off to obtain the formed sponge cleaning roller.

[0053] As shown in FIG. 5, the outer mold 4 provided in the embodiment is provided with a sponge growth groove 6. As shown in FIG. 6, the inner mold 3 is provided with a sponge growth through hole 5. After the foamed sponge 7 penetrates through the sponge growth through hole 5, the foamed sponge 7 continues to grow to extend into the sponge growth groove 6. The foamed sponge 7 completely fills the sponge growth through hole 5. When the outer mold 4 is installed, the sponge growth groove 6 is correspondingly arranged with the sponge growth through hole 5.

[0054] The cutting tool 8 in the embodiment is a ring-shaped blade, which is coaxially inserted between the inner mold 3 and the outer mold 4. The inner diameter of the outer mold 4 is larger than the outer diameter of the inner mold 3, so that a cutting gap is reserved between the inner mold 3 and the outer mold 4 when the outer mold 4 is sleeved on the outer side of the inner mold 3; when the cutting tool 8 is inserted between the inner mold 3 and the outer mold 4, the ring-shaped cutter is inserted into the cutting gap.

[0055] In order to ensure the completeness of cutting the dense layer and the aesthetic degree of the foamed sponge 7 after cutting, the cutting tool 8 and the outer mold 4 are taken off first when the cutting tool 8, the outer mold 4 and the inner mold 3 are taken off, and the edges of the foamed sponge 7 are trimmed, and then the inner mold 3 is taken off.

[0056] The center rod in the embodiment is a hollow rod 1, and the through hole 2 is arranged on the side wall of the hollow rod 1. One end of the hollow rod 1 is open, and the other end is closed. The open end of the hollow rod 1 is used to dock with the external cleaning liquid supply device. When the wafer is cleaned by using the cleaning roller, the cleaning liquid enters the inner cavity of the hollow rod 1 through the open end of the hollow rod 1, then flows out through the through hole 2 and is immersed into the foamed sponge 7, so as to wet the foamed sponge 7, and then the wafer is cleaned by using the foamed sponge 7.

[0057] The cleaning roller manufacturing method provided by the embodiment is used for processing the dense layer on the surface of the foamed sponge 7, so as to increase the broken holes on the surface of the foamed sponge 7, reduce the situation that dirt is re-stained on the surface of the foamed sponge 7 when the wafer is cleaned, and further reduce the situation that the dirt forms defects on the surface of the wafer. By using the double-layer mold, the manufacturing size of the cleaning protrusion on the outer side of the foamed sponge 7 is extended, the cutting gap between the inner mold 3 and the outer mold 4 of 0.1 mm to several mm is formed by cooperation of the inner mold 3 and the outer mold 4, and the cutting tool 8 is used to cut the cleaning protrusion of the foamed sponge 7 outwardly extended through the cutting gap, so that the porous sponge brush surface required is formed.

[0058] The double-layer mold is a tubular structure corresponding to the length, including the inner mold 3 and the outer mold 4, both of which are sleeved outside the hollow rod 1. The outer mold 4 is sleeved on the outer periphery of the inner mold 3. The inner diameter of the outer mold 4 is greater than the outer diameter of the inner mold 3, so that the outer mold 4 and the inner mold 3 are adaptively sleeved. The inner diameter of the outer mold 4 and the inner mold 3 forms a ring-shaped cutting gap for the socket circular cutter; the width of the ring-shaped cutting gap is the difference between the inner diameter of the outer mold 4 and the outer diameter of the inner mold 3, which can be understood as the fitting distance between the inner and outer molds 4. The cutting tool 8 is a tubular structure, one end of which has a ring-shaped blade for cutting the sponge, and the other end is a holding end for a mechanical arm or a human hand. The wall thickness of the ring-shaped blade is the difference between the outer diameter and the inner diameter of the ring-shaped blade. The inner diameter of the ring-shaped blade should be greater than or equal to the outer diameter of the inner mold 3, and the outer diameter of the circular cutter should be less than or equal to the inner diameter of the outer mold 4, so that the ring-shaped blade can be inserted into the ring-shaped cutting gap to cut the sponge. When the outer mold 4 is sleeved outside the inner mold 3, the sponge growth grooves 6 provided on the outer mold 4 and the sponge growth through holes 5 of the inner mold 3 have a one-to-one correspondence relationship, and the sponge growth grooves 6 provided on the outer mold 4 and the sponge growth through holes 5 of the inner mold 3 form a complete sponge growth channel. In use, the operator needs to apply PVA foam to the outer periphery of the hollow rod 1, then concentrically sleeve the inner mold 3 outside the hollow rod 1, and then sleeve the outer mold 4 outside the inner mold 3. After the foamed PVA sponge fills the annular space between the hollow rod 1 and the inner mold 3, the sponge growth through holes 5 of the inner mold 3, and the sponge growth grooves 6 provided on the outer mold 4 in a one-to-one correspondence, the sponge growth channel is filled.

[0059] After the cutting tool 8 enters the annular cutting space between the outer mold 4 and the inner mold 3, the foamed sponge 7 is cut into two parts, one part is located in the sponge growth through hole 5 of the inner mold 3, and the other part is cut off and located between the inner mold 3 and the outer mold 4. After the outer mold 4 is demolded from the inner mold 3, the cleaning sponge with the dense layer removed is obtained after trimming the edge. The cleaning sponge with the dense layer removed has good water absorption effect, does not block the flow of water molecules from the inside to the outside of the sponge, and can effectively remove the dirt adhered to the surface of the sponge.

[0060] As an alternative embodiment, the outer mold 4 is not provided with the sponge growth groove 6, and the foamed sponge 7 is grown to abut against the inner wall of the outer mold 4, and then the cutting tool 8 is inserted between the inner mold 3 and the outer mold 4 to cut the surface dense layer of the foamed sponge 7.

[0061] Embodiment 2

[0062] Fig. 7 shows a cleaning roller provided by the cleaning roller manufacturing method of embodiment 1. The center is a hollow rod 1, and the hollow rod 1 is externally provided with a foamed sponge 7. As shown in Fig. 8, one end of the hollow rod 1 is open, and the other end is closed. The open end of the hollow rod 1 is used to dock with an external cleaning liquid supply device. When the wafer is cleaned by the cleaning roller, the cleaning liquid enters the inner cavity of the hollow rod 1 through the open end of the hollow rod 1, and then flows out through the through hole 2 and is immersed into the foamed sponge 7, so as to wet the foamed sponge 7, and then clean the wafer by the foamed sponge 7. The outer surface of the foamed sponge 7 is provided with a plurality of cleaning protrusions with porous structure exposed after the dense layer is cut off. The cleaning sponge with the removed dense layer has good water absorption effect, does not block the water molecules from flowing out of the sponge, and can effectively remove the dirt adhered to the surface of the sponge.

[0063] Obviously, the above embodiments are only examples for clearly illustrating the present application, and are not intended to limit the present application. Based on the above description, other different forms of changes or variations can be made by those skilled in the art. Here, it is not necessary and impossible to enumerate all the embodiments. The obvious changes or variations derived therefrom are still within the protection scope of the present application.

Claims

1. A cleaning roller making apparatus characterized by comprising: The application relates to a cleaning roller manufacturing device. An inner mold (3) is a hollow structure, sponge growth through holes (5) are arranged on the inner mold (3), and a center rod for mounting a cleaning roller is arranged in the inner cavity of the inner mold (3); An outer mold (4) is coaxially sleeved and mounted on the inner mold (3); A cutting tool (8) is arranged between the inner mold (3) and the outer mold (4), and the cutting tool (8) is adapted to move towards or away from the inner mold (3) to cut off the foamed sponge (7) between the sponge growth through holes (5) and the outer mold (4).

2. The cleaning roller making apparatus according to claim 1, wherein The cutting tool (8) is a ring-shaped blade which is adapted to be coaxially inserted between the inner mold (3) and the outer mold (4).

3. The cleaning roller making apparatus according to claim 2, wherein The inner diameter of the outer mold (4) is larger than the outer diameter of the inner mold (3), so that a cutting gap is reserved between the inner mold (3) and the outer mold (4), and the cutting tool (8) is adapted to move along the axial direction of the inner mold (3) in the cutting gap.

4. The cleaning roller making apparatus according to any one of claims 1 to 3, characterized by Sponge growth grooves (6) are arranged on the outer mold (4), and the sponge growth grooves (6) are arranged one by one corresponding to the sponge growth through holes (5).

5. A method of cleaning a roller, comprising the steps of: The application further discloses a cleaning roller manufacturing method. The application further discloses a cleaning roller manufacturing method. The application further discloses a cleaning roller manufacturing method. The application further discloses a cleaning roller manufacturing method.

6. The method of claim 5, wherein the cleaning roller is formed by a process comprising: The application further discloses a cleaning roller manufacturing method.

7. The method of claim 6, wherein the cleaning roller is formed by extrusion. The application further discloses a cleaning roller manufacturing method.

8. The method for manufacturing a cleaning roller according to any one of claims 5 to 7, characterized in that, The application further discloses a cleaning roller manufacturing method.

9. The method of claim 8, wherein the cleaning roller is formed by a process comprising: The application further discloses a cleaning roller manufacturing method. The application further discloses a cleaning roller manufacturing method.

10. A cleaning roller characterized by The application further discloses a cleaning roller manufacturing method. The application further discloses a cleaning roller manufacturing method. The application further discloses a cleaning roller manufacturing method. The application further discloses a cleaning roller manufacturing method. The application further discloses a cleaning roller manufacturing method. The application further discloses a cleaning roller manufacturing method. The application further discloses a cleaning roller manufacturing method. The application further discloses a cleaning roller manufacturing method. The application further discloses a cleaning roller manufacturing method. The application further discloses a cleaning roller manufacturing method. The application further discloses a cleaning roller manufacturing method. The application further discloses a cleaning roller manufacturing method. The application further discloses a cleaning roller manufacturing method. The application further discloses a cleaning roller manufacturing method. The application further discloses a cleaning roller manufacturing method. The application further discloses a cleaning roller manufacturing method. The application further discloses a cleaning roller manufacturing method. The application further discloses a cleaning roller manufacturing method. The application further discloses a cleaning roller manufacturing method. The application further discloses a cleaning roller manufacturing method. The application further discloses a cleaning roller manufacturing method. The application further discloses a cleaning roller manufacturing method. The application further discloses a cleaning roller manufacturing method. The application further discloses a cleaning roller manufacturing method. The application further discloses a cleaning roller manufacturing method. The application further discloses a cleaning roller manufacturing method. The application further discloses a cleaning roller manufacturing method. The application further discloses a cleaning roller manufacturing method. The application further discloses a cleaning roller manufacturing method. The application further discloses a cleaning roller manufacturing method. The application further discloses a cleaning roller manufacturing method. The application further discloses a cleaning roller manufacturing method. The application further discloses a cleaning roller manufacturing method. The application further discloses a cleaning roller manufacturing method. The application further discloses a cleaning roller manufacturing method. The application further discloses a cleaning roller manufacturing method. The application further discloses a cleaning roller manufacturing method. The application further discloses a cleaning roller manufacturing method. The application further discloses a cleaning roller manufacturing method. The application further discloses a cleaning roller manufacturing method. The application further discloses a cleaning roller manufacturing method. The application further discloses a cleaning roller manufacturing method. The application further discloses a cleaning roller manufacturing method. The application further discloses a cleaning roller manufacturing method. The application further discloses a cleaning roller manufacturing method. The application further discloses a cleaning roller manufacturing method. The application further discloses a cleaning roller manufacturing method. The application further discloses a cleaning roller manufacturing method. The application further discloses a cleaning roller manufacturing method. The application further discloses a cleaning roller manufacturing method. The application further discloses a cleaning roller manufacturing method. The application further discloses a cleaning roller manufacturing method. The application further discloses a cleaning roller manufacturing method. The application further discloses a cleaning roller manufacturing method. The application further discloses a cleaning roller manufacturing method. The application further discloses a cleaning roller manufacturing method. The application further discloses a cleaning roller manufacturing method. The application further discloses a cleaning roller manufacturing method. The application further discloses a cleaning roller manufacturing method. The application further discloses a cleaning roller manufacturing method. The application further discloses a cleaning roller manufacturing method. The application further discloses a cleaning roller manufacturing method. The application further discloses a cleaning roller manufacturing method. The application further discloses a cleaning roller manufacturing method. The application further discloses a cleaning roller manufacturing method. The application further discloses a cleaning roller manufacturing method. The application further discloses a cleaning roller manufacturing method. The application further discloses a cleaning roller manufacturing method. The application further discloses a cleaning roller manufacturing method. The application further discloses a cleaning roller manufacturing method. The application further discloses a cleaning roller manufacturing method. The application further discloses a cleaning roller manufacturing method. The application further discloses a cleaning roller manufacturing method. The application further discloses a cleaning roller manufacturing method. The application further discloses a cleaning roller manufacturing method. The application further discloses a cleaning roller manufacturing method. The application further discloses a cleaning roller manufacturing method. The application further discloses a cleaning roller manufacturing method. The application further discloses a cleaning roller manufacturing method. The application further discloses a cleaning roller manufacturing method. The application further discloses a cleaning roller manufacturing method. The application further discloses a cleaning roller manufacturing method. The application further discloses a cleaning roller manufacturing method. The application further discloses a cleaning roller manufacturing method. The application further discloses a cleaning roller manufacturing method. The application further discloses a cleaning roller manufacturing method. The application further discloses a cleaning roller manufacturing method. The application further discloses a cleaning roller manufacturing method. The application further discloses a cleaning roller manufacturing method. The application further discloses a cleaning roller manufacturing method. The application further discloses a cleaning roller manufacturing method. The application further discloses a cleaning roller manufacturing method. The application further discloses a cleaning roller manufacturing method. The application further discloses a cleaning roller manufacturing method. The application further discloses a cleaning roller manufacturing method. The application further discloses a cleaning roller manufacturing method. The application further discloses a cleaning roller manufacturing method. The application further discloses a cleaning roller manufacturing method. The application further discloses a cleaning roller manufacturing method. The application further discloses a cleaning roller manufacturing method. The application further discloses a cleaning roller manufacturing method. The application further discloses a cleaning roller manufacturing method. The application further discloses a cleaning roller manufacturing method. The application further discloses a cleaning roller manufacturing method. The application further discloses a cleaning roller manufacturing method. The application further discloses a cleaning roller manufacturing method. The application further discloses a cleaning roller manufacturing method. The application further discloses a cleaning roller manufacturing method. The application further discloses a cleaning roller manufacturing method. The application further discloses a cleaning roller manufacturing method. The application further discloses a cleaning roller manufacturing method. The application further discloses a cleaning roller manufacturing method. The application further discloses a cleaning roller manufacturing method. The application further discloses a cleaning roller manufacturing method. The application further discloses a cleaning roller manufacturing method. The application further discloses a cleaning roller manufacturing method. The application further discloses a cleaning roller manufacturing method. The application further discloses a cleaning roller manufacturing method. The application further discloses a cleaning roller manufacturing method. The application further discloses a cleaning roller manufacturing method. The application further discloses a cleaning roller manufacturing method. The application further discloses a cleaning roller manufacturing method. The application further discloses a cleaning roller manufacturing method. The application further discloses a cleaning roller manufacturing method. The application further discloses a cleaning roller manufacturing method. The application further discloses a cleaning roller manufacturing method. The application further discloses a cleaning roller manufacturing method. The application further discloses a cleaning roller manufacturing method. The application further discloses a cleaning roller manufacturing method. The application further discloses a cleaning roller manufacturing method. The application further discloses a cleaning roller manufacturing method. The application further discloses a cleaning roller manufacturing method. The application further discloses a cleaning roller manufacturing method. The application further discloses a cleaning roller manufacturing method. The application further discloses a cleaning roller manufacturing method. The application further discloses a cleaning roller manufacturing method. The application further discloses a cleaning roller manufacturing method. The application further discloses a cleaning roller manufacturing method. The application further discloses a cleaning roller manufacturing method. The application further discloses a cleaning roller manufacturing method. The application further discloses a cleaning roller manufacturing method. The application further discloses a cleaning roller manufacturing method. The application further discloses a cleaning roller manufacturing method. The application further discloses a cleaning roller manufacturing method. The application further discloses a cleaning roller manufacturing method. The application further discloses a cleaning roller manufacturing method. The application further discloses a cleaning roller manufacturing method. The application further discloses a cleaning roller manufacturing method. The application further discloses a cleaning roller manufacturing method. The application further discloses a cleaning roller manufacturing method. The application further discloses a

Images