Direct liquid cooling method for light emitting didoes and light emitting diode package utilizing method

Abstract

The invention relates to a direct liquid cooling method for light emitting diodes and a light emitting diode package utilizing the method. The direct liquid cooling method includes: enabling non-conductive light-emitting liquid to be contacted with a light emitting diode and dissipating heat produced after the light emitting diode is powered on by means of liquid heat convection. In one embodiment, radiating fins are used in the method and the light emitting diode package for further heat conduction. The light emitting diode package utilizing the direct liquid cooling method has excellent heat radiation function, and decomposition, ageing, light attenuation and color shading due to the fact that the fluorescent powder is heated are weakened or eliminated.

Description

technical field

[0001] In general, the present invention relates to cooling and heat dissipation of light emitting diodes. In particular, the present invention relates to a method for cooling LEDs by directly encapsulating one or more non-conductive and light-transmitting liquids on LED wafers, and LED packages using the method. Background technique

[0002] Light-emitting diode (LED) is a light-emitting display device made of semiconductor materials that can directly convert electrical energy into light energy. It has the advantages of low power consumption and high brightness, so it is widely used in various electronic circuits, home appliances, Instruments and other equipment as indicators and display panels. Moreover, compared with ordinary incandescent lamps, light-emitting diodes have the advantages of small size, low calorific value, low power consumption, long life, fast response, environmental protection, etc., so they can also be widely used for lighting. [0003...

Examples

Embodiment Construction

[0027] figure 1 A cross-section of existing heat dissipation techniques for light-emitting diodes is illustrated. Such as figure 1 As shown in , the reference numeral 1 denotes the aluminum substrate; the reference numeral 2 denotes the heat sink; the reference numerals 3 and 4 denote the silver paste; the reference numeral 5 denotes the LED chip; the reference numeral 6 denotes the wire; the reference numeral 7 denotes the silica gel phosphor.

[0028] As mentioned in the background technology, the heat dissipation technology of the light-emitting diodes in the prior art cannot ensure sufficient heat dissipation of the light-emitting diodes, which will lead to the accumulation of heat in the light-emitting diode chip, the current will continue to rise, and the light decay will continue to occur, and the phosphor powder will Long-term thermal decomposition results in light attenuation and color temperature differences.

[0029] figure 2 The heat conduction relationship of ...

technical field

[0001] In general, the present invention relates to cooling and heat dissipation of light emitting diodes. In particular, the present invention relates to a method for cooling LEDs by directly encapsulating one or more non-conductive and light-transmitting liquids on LED wafers, and LED packages using the method. Background technique

[0002] Light-emitting diode (LED) is a light-emitting display device made of semiconductor materials that can directly convert electrical energy into light energy. It has the advantages of low power consumption and high brightness, so it is widely used in various electronic circuits, home appliances, Instruments and other equipment as indicators and display panels. Moreover, compared with ordinary incandescent lamps, light-emitting diodes have the advantages of small size, low calorific value, low power consumption, long life, fast response, environmental protection, etc., so they can also be widely used for lighting. [0003...

Examples

Embodiment Construction

[0027] figure 1 A cross-section of existing heat dissipation techniques for light-emitting diodes is illustrated. Such as figure 1 As shown in , the reference numeral 1 denotes the aluminum substrate; the reference numeral 2 denotes the heat sink; the reference numerals 3 and 4 denote the silver paste; the reference numeral 5 denotes the LED chip; the reference numeral 6 denotes the wire; the reference numeral 7 denotes the silica gel phosphor.

[0028] As mentioned in the background technology, the heat dissipation technology of the light-emitting diodes in the prior art cannot ensure sufficient heat dissipation of the light-emitting diodes, which will lead to the accumulation of heat in the light-emitting diode chip, the current will continue to rise, and the light decay will continue to occur, and the phosphor powder will Long-term thermal decomposition results in light attenuation and color temperature differences.

[0029] figure 2 The heat conduction relationship of ...

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