Plasma equipment for vapor phase etching and cleaning

A plasma and gas phase etching technology, used in electrical components, semiconductor/solid-state device manufacturing, discharge tubes, etc., can solve problems such as difficult processing, reduced productivity, increased maintenance costs, etc., to increase the amount of etching, increase the validity period, Choose a higher effect

CN106098548BActive Publication Date: 2021-11-23俣愿技术 +1
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Publication Date
2021-11-23

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Abstract

The present invention relates to a plasma device for gas phase etching and cleaning, comprising: a reactor body for processing a target substrate; a region for directly generating plasma, which is a region for directly generating plasma in the reactor body, and a process a gas flows into the reactor main body to directly induce plasma; a plasma induction component induces plasma to the direct plasma generation area; a substrate processing area is provided in the reactor main body and is The plasma flowing into the direct plasma generating region and the vaporized gas flowing in from the outside of the reactor main body form reactive species, and process the target substrate through the reactive species; and double gas distribution baffles, It is disposed between the directly generating plasma region and the substrate processing region, distributes plasma to the substrate processing region, and distributes boil-off gas to a central region and a peripheral region of the substrate processing region.
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Description

technical field

[0001] The present invention relates to a plasma device for gas-phase etching and cleaning, and in more detail, relates to a device for selectively cleaning by directly using highly reactive atoms or molecules to directly react with a thin film on the surface of a target substrate Plasma units for vapor phase etching and cleaning. Background technique

[0002] Semiconductors are active electronic components with functions such as storage, amplification, and switching of electronic signals, and have high integration, high performance, and low power consumption. They are high value-added and leading digital informatization in the traction system industry and service industry Core components of the era.

[0003] The semiconductor manufacturing process can be roughly divided into the front process (wafer processing process) and the back process (assembly process and inspection process), and the front process equipment accounts for about 75% of the market share. ...

Examples

Embodiment Construction

[0090] In order to fully understand the present invention, preferred embodiments of the present invention will be described below with reference to the accompanying drawings. The embodiments of the present invention can be changed in various forms, and the protection scope of the present invention is not limited to the embodiments described in detail below. This embodiment is provided to more fully describe the content of the present invention to those skilled in the art to which the present invention belongs. Therefore, in order to emphasize clearer description, the shapes of constituent members and the like in the drawings may be enlarged and shown. It should be noted that the same constituent members in the drawings are denoted by the same reference numerals. For well-known functions and constructions that are considered to obscure the gist of the present invention, detailed description thereof will be omitted.

[0091] figure 1 It is a figure showing the plasma processi...