High-throughput thin film deposition apparatus and thin film mass production method

Abstract

The application discloses a high-capacity thin film deposition device and a batch production method of thin film in the technical field of industrial coating, which comprises at least one deposition cavity with a deposition source, a raw tape reel cavity with a raw base tape reel connected with a tape running system and connected with the deposition cavity through a first base tape vacuum lock, and a product tape reel cavity with a product base tape reel connected with the tape running system and connected with the deposition cavity through a second base tape vacuum lock; the raw tape reel cavity, the deposition cavity and the product tape reel cavity are connected with vacuum pumping devices and vacuum releasing devices; and the first and second base tape vacuum locks seal the raw tape reel cavity, the deposition cavity and the product tape reel cavity under the condition that the tape passes through and is in a static state. The application separates the working environment of unwinding, coating and winding, reduces the time required for preparation work before deposition, improves product quality and capacity, and reduces energy consumption and production cost.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of industrial film coating, and particularly relates to a high-capacity film deposition device and a film batch production method. BACKGROUND

[0002] Ion sources are increasingly used in the film deposition industry because the use of ion sources can greatly improve product quality and performance. For example, the functional layer silver film of Low-E film has poor environmental corrosion resistance, and can only be used in double-layer glass. However, there is an increasing demand for single-layer glass Low-E film on the market. In such products, the Low-E film is directly exposed to the external environment, and has high requirements for environmental corrosion resistance. In addition, the single-layer glass Low-E film directly faces various operations in production and use, and has high requirements for mechanical damage resistance of the film. The use of ion sputtering or ion beam assisted deposition methods can allow the film to have high density and solve the above problems.

[0003] At present, the surface of the strip-shaped substrate is deposited by using a roll-to-roll process. The winding device and the film coating device are placed in the same vacuum environment, and the standby product is obtained by unwinding, coating and winding. Since the winding device and the film coating device are in the same vacuum chamber, the vacuum needs to be broken every time the workpiece to be coated is replaced, which greatly increases the time required for device preparation. Device preparation includes 1) cleaning of the deposition chamber, 2) obtaining a high vacuum degree, 3) reducing various impurity gases to the minimum allowable threshold, and pre-sputtering to obtain the set value of each deposition parameter and reduce the drift rate of each parameter of the device to the allowable value. The quality of the device preparation before deposition is the key to product quality control and directly affects the long strip uniformity of the strip-shaped substrate and the repeatability of each deposition operation. Therefore, the current equipment and process not only increase the vacuum time and the amount of vacuum, increase the energy consumption, but also reduce the production efficiency, increase the difficulty of product quality control, and greatly increase the cost. SUMMARY

[0004] The present application proposes a high-capacity film deposition device and a film batch production method to separate the unwinding, coating and winding operation environment, reduce the time required for device preparation before deposition, improve product quality and capacity, and reduce energy consumption and production cost.

[0005] The present application is achieved by the following technical solutions:

[0006] The present application relates to a high-capacity film deposition device, comprising:

[0007] The deposition chamber is not less than 1 in number, and at least one of the deposition chambers is provided with a deposition source.

[0008] A raw tape reel cavity, which is provided with a raw base tape reel connected with the tape running system and connected with the deposition cavity through a first base tape vacuum lock;

[0009] and a product tape reel cavity, which is provided with a product base tape reel connected with the tape running system and connected with the deposition cavity through a second base tape vacuum lock;

[0010] The raw tape reel cavity, the deposition cavity and the product tape reel cavity are connected with vacuum pumping devices and vacuum releasing devices, and the first and second base tape vacuum locks seal the raw tape reel cavity, the deposition cavity and the product tape reel cavity in high vacuum state when the tape passes through and is in static state.

[0011] The first and second base tape vacuum locks are both composed of a valve body and a piston, the valve body is provided with a piston cavity, the piston is movably arranged in the piston cavity and fixed with a vacuum sealing sleeve at the bottom, a base tape channel is arranged between the bottom of the vacuum sealing sleeve and the valve body, and the vacuum sealing sleeve seals the tape in high vacuum state by being pressed on the tape by the piston.

[0012] Preferably, the first and second base tape vacuum locks have an air leakage rate less than 10 - 5 Torr.l / s.

[0013] The deposition cavity is connected with a first high vacuum pump, the first high vacuum pump is connected with a first rough vacuum pump through a pipeline, and a first rough pumping valve is arranged between the first high vacuum pump and the first rough vacuum pump.

[0014] Preferably, the raw tape reel cavity and the product tape reel cavity share the first rough vacuum pump with the deposition cavity;

[0015] The raw tape reel cavity and the product tape reel cavity are respectively connected with the first rough vacuum pump through a pipeline, a first vacuum releasing valve and a second rough pumping valve are arranged between the raw tape reel cavity and the first rough vacuum pump, a second vacuum releasing valve and a third rough pumping valve are arranged between the product tape reel cavity and the first rough vacuum pump, the raw tape reel cavity is connected with the deposition cavity through a pipeline and provided with a first gradual pumping valve on the pipeline, and the product tape reel cavity is connected with the deposition cavity through a pipeline and provided with a second gradual pumping valve on the pipeline.

[0016] In addition, the raw tape reel cavity and the product tape reel cavity can also use independent vacuum pumping devices;

[0017] The raw tape reel cavity is connected with a second high vacuum pump through a first high vacuum valve, the second high vacuum pump is connected with a second rough vacuum pump through a pipeline, a first support valve is arranged between the second high vacuum pump and the second rough vacuum pump, and the second rough vacuum pump is connected with the raw tape reel cavity through a pipeline and provided with a fourth rough pumping valve on the pipeline.

[0018] The product tape reel cavity is connected to a third high vacuum pump through a second high vacuum valve, the third high vacuum pump is connected to a third rough vacuum pump through a pipeline, and a second support valve is arranged between the third high vacuum pump and the third rough vacuum pump, and the third rough vacuum pump is connected to the product tape reel cavity through a pipeline and is provided with a fifth rough pumping valve on the pipeline.

[0019] A third vacuum release valve is arranged on the cavity wall of the original tape reel cavity, and a fourth vacuum release valve is arranged on the cavity wall of the product tape reel cavity.

[0020] The deposition source can adopt, but is not limited to, an ion beam sputtering deposition source, an electron beam evaporation deposition source, a heated evaporation deposition source, a pulsed laser deposition source and a magnetron sputtering deposition source.

[0021] The present application relates to a method for batch production using the above device, after the initial deposition operation is completed and before the next deposition operation starts, the first and second base band vacuum locks are closed, the first and second base band vacuum locks are sealed on the lead tape connected to the base band; the original tape reel cavity and the product tape reel cavity are vacuumed, the lead tape is cut off, the original base band reel and the product base band reel wound with the product base band are removed, and new tape reels are replaced; the new base band and the lead tape left outside the base band vacuum lock are welded, the original tape reel cavity and the product tape reel cavity are re-evacuated, the first and second base band vacuum locks are opened, a short pre-sputtering is performed to obtain the set value of each deposition parameter and the allowed drift rate of each parameter, and a new deposition operation is restarted; the above operation is repeated to complete the batch production of the film.

[0022] The initial deposition operation includes the following steps:

[0023] S1, the original base band to be deposited is wound around the original base band reel, the original base band reel is loaded into the original tape reel cavity, the original base band enters the deposition cavity through the opened first base band vacuum lock, and then enters the product tape reel cavity through the second base band vacuum lock and is wound on the empty product base band reel;

[0024] S2, the entire device is evacuated to the required background vacuum degree;

[0025] S3, pre-sputtering before starting the deposition operation is performed to obtain the set value of each deposition parameter and the allowed drift rate of each parameter;

[0026] S4, after the pre-sputtering is completed, the original base band continuously and dynamically enters the deposition cavity under the control of the tape running system through the opened first base band vacuum lock, after the deposition is completed, the original base band enters the product tape reel cavity through the second base band vacuum lock and is wound on the product base band reel, and the film is continuously and dynamically deposited on the base band, the film deposition of all base bands is completed, and the initial deposition operation is completed.

[0027] Preferably, the original base band tail end is connected with a lead-in tape with surface roughness meeting the first and second base band vacuum lock sealing requirements, and the lead-in tape is an inner lead-in tape; preferably, the length of the inner lead-in tape is greater than the distance between the first and second base band vacuum locks; after the deposition operation is completed, the inner lead-in tape stays in the first and second base band vacuum locks, and then the first and second base band vacuum locks are closed to achieve vacuum sealing.

[0028] Preferably, the roughness of the original base band is less than 10 nanometers.

[0029] Further preferably, the roughness of the original base band is less than 2 nanometers.

[0030] Technical effects

[0031] Compared with the prior art, the original tape reel cavity, the deposition cavity and the product tape reel cavity are connected by the base band vacuum lock, which realizes independent vacuumization of the original tape reel cavity, the deposition cavity and the product tape reel cavity, and independent de-vacuumization of the original tape reel cavity and the product tape reel cavity. Therefore, except for the initial deposition operation, the subsequent deposition operation basically eliminates the device preparation time, and the overall production capacity can be improved by more than one time in batch continuous production. Moreover, the drift rate of the entire device becomes smaller and smaller as the deposition time is prolonged, which improves the length uniformity of the product and improves the product quality while improving the production capacity. BRIEF DESCRIPTION OF DRAWINGS

[0032] Figure 1 It is a structural schematic diagram of Example 1;

[0033] Figure 2 It is a structural schematic diagram of Example 2;

[0034] Figure 3a It is a structural schematic diagram of the first and second base band vacuum locks in Example 1;

[0035] Figure 3b It is a sectional view of the first and second base band vacuum locks in Example 1;

[0036] In the figure: 101 raw baseband, 102 product baseband, 103 raw baseband reel, 104 product baseband reel, 105 raw tape reel cavity, 106 product tape reel cavity, 107 deposition cavity, 108 deposition source, 109 first baseband vacuum lock, 110 second baseband vacuum lock, 111 first vacuum release valve, 112 second vacuum release valve, 113 second roughing valve, 114 third roughing valve, 115 first roughing vacuum pump, 116 first roughing valve, 117 first high vacuum pump, 118 first gradual extraction valve. 18. Second gradual extraction valve 119. Second roughing vacuum pump 201. Third roughing vacuum pump 202. Fourth roughing valve 203. Fifth roughing valve 204. First support valve 205. Second support valve 206. Second high vacuum pump 207. Third high vacuum pump 208. First high vacuum valve 209. Second high vacuum valve 210. Third vacuum release valve 211. Fourth vacuum release valve 212. Valve body 301. Piston 302. Vacuum sealing sleeve 303. O-ring seal 304. Baseband channel 305. Detailed Implementation

[0037] The present invention will now be described in detail with reference to the accompanying drawings and specific embodiments. Example 1

[0038] like Figure 1 As shown, this embodiment relates to a high-capacity thin film deposition apparatus, including: a raw tape reel cavity 105, a product tape reel cavity 106, and at least one deposition cavity 107 having a deposition source 108.

[0039] Original baseband reel 103 and product baseband reel 104 are provided in the original reel cavity 105 and the product reel cavity 106, respectively. The original baseband reel 103 and the product baseband reel 104 are connected to the tape carrying system. In this example, there is a deposition cavity 107. In actual use, multiple deposition cavities can be set, and one of the deposition cavities has a deposition source while the other deposition cavities do not need to be set with a deposition source. The original reel cavity 105 is connected to the deposition cavity 107 through the first baseband vacuum lock 109, and the deposition cavity 107 is connected to the product reel cavity 106 through the second baseband vacuum lock 110.

[0040] The original tape reel cavity 105, the product tape reel cavity 106, and the deposition cavity 107 are connected to a vacuum pumping device and a vacuum de-vacuuming device. The first baseband vacuum lock 109 and the second baseband vacuum lock 110 are used to perform high-vacuum sealing at both ends of the deposition cavity 107 when the reel needs to be replaced after a deposition operation, with a vacuum leakage rate of less than 10%. -6 Torr.l / s.

[0041] like Figure 3a and 3bAs shown, the first base band vacuum lock 109 and the second base band vacuum lock 110 are both composed of a valve body 301 and a piston 302, the valve body 301 is provided with a piston cavity, the piston 302 is movably arranged in the piston cavity and is fixed with a vacuum sealing sleeve 303 at the bottom, a base band passage 305 is arranged between the bottom of the vacuum sealing sleeve 303 and the valve body 301, and the vacuum sealing sleeve 303 is pressed on the strip by the piston 302 to perform high vacuum sealing; preferably, the piston is provided with a plurality of O-shaped sealing rings 304 along the moving direction thereof.

[0042] In the example, the original strip reel cavity 105, the product strip reel cavity 106 and the deposition cavity 107 share a set of vacuum pumping devices;

[0043] Specifically, the deposition cavity 107 is connected with a first high vacuum pump 117, the first high vacuum pump 117 is connected to the first rough vacuum pump 115 through a pipeline, and a first rough pumping valve 116 is arranged between the first high vacuum pump 117 and the first rough vacuum pump 115; the original strip reel cavity 105 and the product strip reel cavity 106 are respectively connected to the first rough vacuum pump 115 through a pipeline, a first vacuum release valve 111 and a second rough pumping valve 113 are arranged between the original strip reel cavity 105 and the first rough vacuum pump 115, a second vacuum release valve 112 and a third rough pumping valve 114 are arranged between the product strip reel cavity 106 and the first rough vacuum pump 115, the original strip reel cavity 105 and the deposition cavity 107 are connected through a pipeline and are provided with a first gradual pumping valve 118, and the product strip reel cavity 106 and the deposition cavity 107 are connected through a pipeline and are provided with a second gradual pumping valve 119.

[0044] The embodiment relates to a method for batch production of a film by using the above device, and the method comprises the following steps:

[0045] 1) connecting the original base band 101 and the inner lead band, winding the original base band 101 on the original base band reel 103, and connecting a length of outer lead band at the outer end of the original base band 101, wherein the outer lead band is used for pre-sputtering and initial installation of the base band;

[0046] 2) after the cavity cleaning preparation work of the deposition cavity 107 is completed, the original strip reel cavity 105 is loaded with the original base band reel 103, the first base band vacuum lock 109 and the second base band vacuum lock 110 are both in an open state, the drive strip system is driven, the outer lead band passes through the first base band vacuum lock 109, enters the deposition cavity 107, passes through the second base band vacuum lock 110, enters the product strip reel cavity 106, is wound on the empty product base band reel 104, and the base band tension is added;

[0047] 3) The system starts to pump down, closes all the chamber doors, closes the first and second pump down valves 111, 112, the second roughing valve 113 and the third roughing valve 114, opens the first roughing vacuum pump 115, the first roughing valve 116, the first and second backing valves 118, 119, starts to rough pump the whole system to less than 0.1 torr, then starts the first high vacuum pump 117, and waits until the whole system is less than the process set point, for example 2 x 10 -7 torr, which usually takes a long time, for example several days;

[0048] 4) When the system reaches the required vacuum, the pre-sputter is started, and the system parameters are gradually increased to the required values for the deposition process, and the system is allowed to drift to less than the set point, and the inner lead is run at a slow speed during the pre-sputter;

[0049] 5) After the pre-sputter is completed, the inner lead is run at the set speed, and the first deposition process is started;

[0050] 6) After the first deposition process is completed, the high finish inner lead is run to the first and second base vacuum locks 109, 110, the run is stopped, and the base tension is removed;

[0051] 7) The first and second base vacuum locks 109, 110 are closed, and the first and second backing valves 118, 119 are closed;

[0052] 8) The first and second pump down valves 111, 112 are opened, and the original and product base reels chambers 105, 106 are pumped down;

[0053] 9) After the pump down is completed, the first and second pump down valves 111, 112 are closed, the original and product base reel chamber doors 105, 106 are opened, the original base reel 103 and the product base reel 104 are removed, new original and product base reels 103, 104 are installed, the new base is connected to the inner lead in the first and second base vacuum locks 109, 110, the base tension is applied, and the original and product base reel chamber doors 105, 106 are closed, and the whole process is done as quickly as possible;

[0054] 10) The sputter in the deposition chamber 107 is stopped;

[0055] 11) Close the first roughing valve 116, open the second roughing valve 113 and the third roughing valve 114 to perform roughing vacuuming on the original tape reel cavity 105 and the product tape reel cavity 106 until the vacuum degree is less than 0.1 torr. Then close the second roughing valve 113 and the third roughing valve 114, open the first roughing valve 116, and gradually open the first gradual evacuation valve 118 and the second gradual evacuation valve 119 to further evacuate the original tape reel cavity 105 and the product tape reel cavity 106 to the set value. This process should be as fast as possible, usually completed in less than 5 minutes.

[0056] 12) Open the first baseband vacuum lock 109 and the second baseband vacuum lock 110 to begin pre-sputtering;

[0057] 13) Waiting for the drift rate of each parameter of the device to be less than the set value, since the deposition chamber 107 basically retains its original state, the pre-sputtering time is very short.

[0058] 14) Begin a new sedimentation operation. Example 2

[0059] like Figure 2 As shown, this embodiment relates to a high-capacity thin film deposition apparatus. The difference from embodiment 1 is that in embodiment 2, the original tape reel cavity 105 and the product tape reel cavity 106 have independent vacuum devices, so there is no need to stop sputtering between two deposition operations, which can minimize the time between the two deposition operations and further improve production efficiency.

[0060] Specifically, the original tape reel cavity 105 is connected to the second high vacuum pump 207 via the first high vacuum valve 209, the second high vacuum pump 207 is connected to the second roughing vacuum pump 201 via a pipeline, a first support valve 205 is provided between the second high vacuum pump 207 and the second roughing vacuum pump 201, and the second roughing vacuum pump 201 is connected to the original tape reel cavity 105 via a pipeline and a fourth roughing valve 203 is provided on the pipeline.

[0061] The product tape reel cavity 106 is connected to the third high vacuum pump 208 via the second high vacuum valve 210. The third high vacuum pump 208 is connected to the third roughing vacuum pump 202 via a pipeline. A second support valve 206 is provided between the third high vacuum pump 208 and the third roughing vacuum pump 202. The third roughing vacuum pump 202 is connected to the product tape reel cavity 106 via a pipeline and a fifth roughing valve 204 is provided on the pipeline. The original tape reel cavity 105 and the product tape reel cavity 106 are respectively provided with a third vacuum release valve 211 and a fourth vacuum release valve 212.

[0062] This embodiment relates to a method for mass production of thin films using the above-mentioned apparatus, including the following steps:

[0063] 1) Attach the original base tape 101 and the inner leader tape, wind it around the original base tape reel 103, and attach a length of the outer leader tape to the outer end of the original base tape 101, which is used for pre-sputtering and initial installation of the base tape;

[0064] 2) After the cleaning of the deposition chamber 107 is completed, the original base tape reel 103 is loaded into the original base tape reel chamber 105, the first base tape vacuum lock 109 and the second base tape vacuum lock 110 are opened, the drive system is activated, the outer leader tape is passed through the first base tape vacuum lock 109, enters the deposition chamber 107, and then passes through the second base tape vacuum lock 110, enters the product base tape reel chamber 106, and is wound around the empty product base tape reel 104, and the base tape tension is applied;

[0065] 3) The system starts to be pumped down, all the chamber doors are closed, the first base tape vacuum lock 109 and the second base tape vacuum lock 110 are closed, the third roughing valve 211, the fourth roughing valve 212, the first backing valve 205, and the second backing valve 206 are closed, the fourth roughing valve 203 and the fifth roughing valve 204 are opened to start to pump down the original base tape reel chamber 105 and the product base tape reel chamber 106, the first roughing valve 116 is opened to start to pump down the deposition chamber 107, and after the pressure in each chamber and the deposition chamber 107 is less than 0.1 torr, the first high vacuum pump 117 is activated, the fourth roughing valve 203 and the fifth roughing valve 204 are closed, the first backing valve 205 and the second backing valve 206 are opened, the first high vacuum valve 209 and the second high vacuum valve 210 are opened, the first base tape vacuum lock 109 and the second base tape vacuum lock 110 are opened, and the system is pumped down to a pressure of less than 2 x 10 -7 torr, which usually takes a long time, such as several days;

[0066] 4) After the system is pumped down to the required pressure, the first high vacuum valve 209 and the second high vacuum valve 210 are closed, pre-sputtering is started, the deposition parameters of the system are gradually increased to the required values according to the set steps, and the drift rate of each parameter of the system is less than the set value; during the pre-sputtering, the outer leader tape is driven at a slow speed;

[0067] 5) After the pre-sputtering is completed, the driving speed of the tape is increased to the set value, and the initial deposition operation is started;

[0068] 6) After the initial deposition operation is completed, the inner leader tape with high smoothness is driven to the first base tape vacuum lock 109 and the second base tape vacuum lock 110, the driving of the tape is stopped, and the base tape tension is removed;

[0069] 7) The first base tape vacuum lock 109 and the second base tape vacuum lock 110 are closed;

[0070] 8) open the third and fourth vent valves 211 and 212 to vent the original tape reel chamber 105 and the product tape reel chamber 106;

[0071] 9) after the venting is completed, close the third and fourth vent valves 211 and 212, open the chamber doors of the original tape reel chamber 105 and the product tape reel chamber 106, take out the original tape reel 103 and the product tape reel 104, replace them with a new original tape reel 103 and an empty product tape reel 104, connect the new tape with the inner lead tape left outside the first and second tape vacuum locks 109 and 110, apply the tape tension, close the chamber doors of the original tape reel chamber 105 and the product tape reel chamber 106, and the whole process should be as fast as possible;

[0072] 10) close the first and second backing valves 205 and 206, open the fourth and fifth roughing valves 203 and 204 to start the vacuum pumping of the original tape reel chamber 105 and the product tape reel chamber 106, wait until the pressure in the original tape reel chamber 105 and the product tape reel chamber 106 is less than 0.1 torr, then close the fourth and fifth roughing valves 203 and 204, open the first and second backing valves 205 and 206, and then open the first and second high vacuum valves 209 and 210 to further pump the original tape reel chamber 105 and the product tape reel chamber 106 to the set value;

[0073] 11) close the first and second high vacuum valves 209 and 210, open the first and second tape vacuum locks 109 and 110;

[0074] 12) wait until the drift of the parameters of the device is less than the set value, since the deposition chamber 107 remains in the original state, the drift of the parameters of the device should be basically unchanged;

[0075] 13) start a new deposition operation.

[0076] It should be emphasized that the above is only the preferred embodiment of the present application, and does not limit the present application in any form, any simple modification, equivalent change and modification of the above embodiment according to the technical essence of the present application still belongs to the scope of the technical solution of the present application.

Claims

1. A high-throughput thin film deposition apparatus, characterized by, It comprises: a deposition chamber, the number of which is not less than 1, at least one of which is provided with a deposition source; a raw tape reel chamber, which is provided with a raw base tape reel connected with a tape running system and connected with the deposition chamber through a first base tape vacuum lock; and a product tape reel chamber, which is provided with a product base tape reel connected with the tape running system and connected with the deposition chamber through a second base tape vacuum lock; the raw tape reel chamber, the deposition chamber and the product tape reel chamber are connected with vacuum pumping devices and vacuum releasing devices, and the first and second base tape vacuum locks seal the raw tape reel chamber, the deposition chamber and the product tape reel chamber in high vacuum state when the tape runs through the locks and is in a static state; The first and second base band vacuum locks are both composed of a valve body and a piston, the valve body is provided with a piston cavity, the piston is movably arranged in the piston cavity and fixed with a vacuum sealing sleeve at the bottom, a base band channel is arranged between the bottom of the vacuum sealing sleeve and the valve body, and the vacuum sealing sleeve is pressed on the strip by the piston to perform high vacuum sealing; when the first and second base band vacuum locks perform high vacuum sealing, the air leakage rate is less than 10 -5 Torr.l / s. the deposition chamber is connected with a first high vacuum pump, the first high vacuum pump is connected with a first rough vacuum pump through a pipeline, and a first rough pumping valve is arranged between the first high vacuum pump and the first rough vacuum pump; the raw tape reel chamber and the product tape reel chamber are respectively connected with the first rough vacuum pump through a pipeline, a first vacuum releasing valve and a second rough pumping valve are arranged between the raw tape reel chamber and the first rough vacuum pump, a second vacuum releasing valve and a third rough pumping valve are arranged between the product tape reel chamber and the first rough vacuum pump, the raw tape reel chamber is connected with the deposition chamber through a pipeline and provided with a first gradual pumping valve on the pipeline, and the product tape reel chamber is connected with the deposition chamber through a pipeline and provided with a second gradual pumping valve on the pipeline; or the raw tape reel chamber is connected with a second high vacuum pump through a first high vacuum valve, the second high vacuum pump is connected with a second rough vacuum pump through a pipeline, a first support valve is arranged between the second high vacuum pump and the second rough vacuum pump, and the second rough vacuum pump is connected with the raw tape reel chamber through a pipeline and provided with a fourth rough pumping valve on the pipeline; the product tape reel chamber is connected with a third high vacuum pump through a second high vacuum valve, the third high vacuum pump is connected with a third rough vacuum pump through a pipeline, a second support valve is arranged between the third high vacuum pump and the third rough vacuum pump, and the third rough vacuum pump is connected with the product tape reel chamber through a pipeline and provided with a fifth rough pumping valve on the pipeline; a third vacuum releasing valve is arranged on the wall of the raw tape reel chamber, and a fourth vacuum releasing valve is arranged on the wall of the product tape reel chamber.

2. A method for mass production of thin films, characterized by, The high-capacity thin film deposition device of claim 1 is used for production; after the initial deposition operation is completed and before the next deposition operation starts, the first and second base tape vacuum locks are closed and sealed on the leading tape connected with the raw base tape; the raw tape reel chamber and the product tape reel chamber are vacuum released, the leading tape is cut off, the raw base tape reel which has been almost emptied and the product base tape reel on which the product base tape is wound are taken out, and new tape reels are put on; the new raw base tape and the leading tape left outside the base tape vacuum lock are welded, the raw tape reel chamber and the product tape reel chamber are re-vacuumed, the first and second base tape vacuum locks are opened, and short pre-sputtering is performed to obtain the set values of various deposition parameters and the allowable drift rate of each parameter, and the new deposition operation is restarted; the above operation is repeated to complete the batch production of thin films; the initial deposition operation comprises the following steps: S1, the original base band to be deposited is wound in the original base band disc, the original base band disc is loaded in the original tape reel cavity, the original base band enters the deposition cavity through the opened first base band vacuum lock, and then enters the product tape reel cavity through the second base band vacuum lock and is wound on the empty product base band disc; S2, the whole device is vacuumized to the required background vacuum degree; S3, pre-sputtering before starting the deposition operation is performed to obtain the set values of various deposition parameters and the allowed drift rates of various parameters; S4, after the pre-sputtering is completed, the original base band continuously and dynamically enters the deposition cavity under the control of the tape running system through the opened first base band vacuum lock, after the deposition is completed, enters the product tape reel cavity through the second base band vacuum lock and is wound on the product base band disc, and thus the thin film is continuously and dynamically deposited on the base band, the thin film deposition of all the base bands is completed, and the initial deposition operation is completed; the tail end of the original base band is connected with a lead tape with a surface roughness meeting the sealing requirements of the first and second base band vacuum locks, and the length of the lead tape is greater than the interval between the first and second base band vacuum locks; after the deposition operation is completed, the lead tape stays in the first and second base band vacuum locks, and the first and second base band vacuum locks are closed to realize vacuum sealing.

3. The method for mass production of thin films according to claim 2, wherein The roughness of the original base band is less than 10 nanometers.

4. The method for mass production of thin films according to claim 3, wherein The roughness of the original base band is less than 2 nanometers.

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